CN116207172B - Photovoltaic module and preparation method thereof - Google Patents

Photovoltaic module and preparation method thereof Download PDF

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Publication number
CN116207172B
CN116207172B CN202310111863.5A CN202310111863A CN116207172B CN 116207172 B CN116207172 B CN 116207172B CN 202310111863 A CN202310111863 A CN 202310111863A CN 116207172 B CN116207172 B CN 116207172B
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China
Prior art keywords
layer
packaging layer
encapsulation layer
photovoltaic module
battery
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CN202310111863.5A
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Chinese (zh)
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CN116207172A (en
Inventor
郝国晖
黄世亮
郭志球
刘立勤
张池
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Zhejiang Jinko Solar Co Ltd
Jinko Solar Co Ltd
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Zhejiang Jinko Solar Co Ltd
Jinko Solar Co Ltd
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Application filed by Zhejiang Jinko Solar Co Ltd, Jinko Solar Co Ltd filed Critical Zhejiang Jinko Solar Co Ltd
Priority to CN202310111863.5A priority Critical patent/CN116207172B/en
Priority to CN202410414572.8A priority patent/CN118315456A/en
Priority to US18/309,703 priority patent/US20240243210A1/en
Priority to DE202023102519.6U priority patent/DE202023102519U1/en
Priority to AU2023202896A priority patent/AU2023202896B1/en
Priority to NL2034791A priority patent/NL2034791A/en
Priority to EP23172558.1A priority patent/EP4401151A1/en
Publication of CN116207172A publication Critical patent/CN116207172A/en
Priority to KR1020230093426A priority patent/KR20230116750A/en
Priority to JP2024079320A priority patent/JP2024105554A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022433—Particular geometry of the grid contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The embodiment of the application relates to the technical field of photovoltaics, and provides a photovoltaic module and a preparation method thereof, wherein the photovoltaic module comprises: a plurality of battery pieces, wherein the surface of each battery piece is provided with a plurality of grid lines; the connecting parts are positioned on the surfaces of the battery pieces and are respectively connected with adjacent battery pieces, and the parts positioned on the grid lines are in contact connection with the adjacent parts of the grid lines; the packaging layer covers the surface of the battery piece and the surface of the connecting component, and the packaging layer at least comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially distributed along the direction far away from the battery piece, wherein the fluidity of the third packaging layer, the fluidity of the second packaging layer and the fluidity of the first packaging layer are sequentially reduced. The embodiment of the application is at least beneficial to improving the efficiency and yield of the photovoltaic module.

Description

Photovoltaic module and preparation method thereof
Technical Field
The embodiment of the application relates to the technical field of photovoltaics, in particular to a photovoltaic module and a preparation method thereof.
Background
With the development of photovoltaic technology, in the manufacture of photovoltaic cells or photovoltaic modules, the realization of improvement of the efficiency of photovoltaic cells and the realization of improvement of the yield of photovoltaic cells have become a major problem of concern while saving the manufacturing cost.
The grid line is used as an important component of the solar cell and is used for collecting and leading out electrons generated by a photovoltaic effect, the welding strip is used for connecting the cell in the photovoltaic module, and the arrangement mode of the grid line and the welding strip, the welding quality of the welding strip and the grid line, the selection of the welding strip material and the grid line material, the welding mode of the welding strip and the grid line, the adhesive film above the welding strip and the like have certain influence on the photoelectric conversion efficiency of the cell, the efficiency of the photovoltaic module, the yield of the photovoltaic module and the service life of the photovoltaic module, and currently, the arrangement modes of the grid line, the welding strip and the adhesive film in the photovoltaic module are to be improved.
Disclosure of Invention
The embodiment of the application provides a photovoltaic module and a preparation method thereof, which are at least beneficial to improving the efficiency and yield of the photovoltaic module.
According to some embodiments of the present application, an aspect of an embodiment of the present application provides a photovoltaic module, including: a plurality of battery pieces, each of which has a plurality of gate lines on a surface thereof; the connecting parts are positioned on the surfaces of the battery pieces and are respectively connected with adjacent battery pieces, and part of connecting parts positioned on the grid lines are in contact connection with adjacent part of grid lines; the packaging layer covers the surface of the battery piece and the surface of the connecting component, and the packaging layer at least comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially distributed along the direction far away from the battery piece, wherein the mobility of the third packaging layer, the mobility of the second packaging layer and the mobility of the first packaging layer are sequentially reduced.
In some embodiments, the ratio of the ML value of the first encapsulation layer to the ML value of the second encapsulation layer is 1.1-3.
In some embodiments, the ratio of the ML value of the second encapsulation layer to the ML value of the third encapsulation layer is 1.1-4.
In some embodiments, the first encapsulation layer has an ML value of 0.4 dNm to 0.85 dNm, and/or the second encapsulation layer has an ML value of 0.3 dNm to 0.4 dNm.
In some embodiments, the ML value of the third encapsulation layer is 0.1 dN.m-0.3 dN.m.
In some embodiments, further comprising: and the glue point is positioned between part of the battery pieces and the connecting part, and the glue point is positioned on the surface of the battery piece except the grid line.
In some embodiments, the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer are an integrally formed structure.
In some embodiments, the ratio of the thickness of the first encapsulation layer to the maximum thickness of the connection member in the direction in which the battery sheet is directed toward the encapsulation layer is 0.4 to 1.
In some embodiments, the ratio of the thickness of the first encapsulation layer to the thickness of the second encapsulation layer along the direction of the battery sheet toward the encapsulation layer is 1 to 4.
In some embodiments, the ratio of the thickness of the second encapsulation layer to the thickness of the third encapsulation layer along the direction of the battery sheet toward the encapsulation layer is 0.2 to 0.7.
In some embodiments, the material of the first encapsulation layer, the material of the second encapsulation layer, and the material of the third encapsulation layer are the same.
According to some embodiments of the present application, another aspect of the embodiments of the present application further provides a method for manufacturing a photovoltaic module, including: providing a plurality of battery pieces, wherein the surface of each battery piece is provided with a plurality of grid lines; a connecting component is arranged on the surface of the battery piece; the surface of the battery piece is provided with a packaging layer, the packaging layer is positioned at one side of the connecting part far away from the battery piece, and the packaging layer comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially arranged along the direction far away from the battery piece; laminating the battery piece, the connecting part and the packaging layer at a preset temperature to enable part of the connecting part above the grid line to be in contact connection with the adjacent part of the grid line and enable the battery piece to be fixed with the packaging layer; the mobility of the third packaging layer at the preset temperature, the mobility of the second packaging layer at the preset temperature and the mobility of the first packaging layer at the preset temperature are sequentially reduced.
In some embodiments, providing the connection component further comprises: and forming glue points, wherein the glue points are positioned between part of the battery pieces and the connecting part, and the glue points are positioned on the surfaces of the battery pieces except the grid lines.
The technical scheme provided by the embodiment of the application has at least the following advantages: the grid line can be a thin grid on the surface of the battery piece, the connecting component can be a welding strip which is arranged on the surface of the battery piece instead of the main grid and is used for connecting adjacent battery pieces, and the connecting component is used for replacing the main grid, so that the thicker main grid is avoided, and the cost of the photovoltaic module is reduced; on the other hand, the main grid is prevented from excessively shielding the surface of the battery piece, so that the photoelectric conversion efficiency of the battery piece is improved, and the efficiency of the photovoltaic module is improved. The packaging layer is used for covering the surfaces of the battery piece and the connecting component and is used for protecting the battery piece, the packaging layer at least comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially distributed along the direction far away from the battery piece, and the fluidity of the third packaging layer, the fluidity of the second packaging layer and the fluidity of the first packaging layer are sequentially reduced, wherein the fluidity of the first packaging layer, the fluidity of the second packaging layer and the fluidity of the third packaging layer are all the fluidity at the lamination temperature, namely, the photovoltaic module is the photovoltaic module in the lamination process. The lamination process refers to: and (3) paving a connecting part on the surface of the battery piece, covering an encapsulation layer on the connecting part and the surface of the battery piece exposed by the connecting part, and then laminating the battery piece, the connecting part and the encapsulation layer, wherein the lamination process has a certain lamination temperature, and the connecting part and a grid line positioned below the connecting part form an alloy at the lamination temperature so as to form contact connection. Under normal conditions, when the packaging layer is in a scorching stage at the lamination temperature, the packaging layer is in a state with fluidity, in order to avoid poor contact between the connecting component and the grid line caused by the fact that the packaging layer in the scorching stage flows into the space between the connecting component and the grid line before the connecting component and the grid line form an alloy, the first packaging layer adjacent to the connecting component and the battery piece is set in a state with smaller fluidity, so that the first packaging layer can be prevented from flowing between the connecting component and the grid line, and further poor contact between the connecting component and the grid line is avoided, and the efficiency and the yield of the photovoltaic module are improved. In addition, the second packaging layer and the third packaging layer which are relatively large in mobility are isolated by the aid of the first packaging layer, the second packaging layer is used as a bridge between the first packaging layer and the third packaging layer, the bonding strength of the first packaging layer and the third packaging layer is increased, the third packaging layer with the largest mobility is beneficial to guaranteeing that the packaging layer and the cover plate have strong bonding strength, and further the service life of the photovoltaic module is prolonged.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, which are not to be construed as limiting the embodiments unless specifically indicated otherwise; in order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a photovoltaic module according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a grid line and a connection member on a surface of a battery piece according to an embodiment of the present application;
FIG. 3 is a schematic view of a curing curve according to an embodiment of the present application;
FIG. 4 is a schematic view of a partial cross-sectional structure of a photovoltaic module before lamination according to an embodiment of the present application;
Fig. 5 is a schematic structural diagram corresponding to a step of providing a battery sheet in a method for manufacturing a photovoltaic module according to an embodiment of the present application;
fig. 6 is a schematic structural diagram corresponding to a step of forming a glue dot in a method for manufacturing a photovoltaic module according to an embodiment of the present application;
fig. 7 is a schematic structural diagram corresponding to a step of fixing a connecting component by using glue points in a method for manufacturing a photovoltaic module according to an embodiment of the present application;
Fig. 8 is a schematic structural diagram corresponding to a step of disposing a packaging layer in a method for manufacturing a photovoltaic module according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of a photovoltaic module after lamination treatment in a method for manufacturing a photovoltaic module according to an embodiment of the present application.
Detailed Description
As known from the background art, the arrangement mode of the grid line, the solder strip and the adhesive film in the photovoltaic module needs to be improved.
Analysis shows that sunlight enters the battery from the surface of the battery piece, the grid line on the surface of the battery piece can shade the battery piece, and the light energy irradiated on the metal electrode cannot be converted into electric energy, so that the finer and better the grid line is generally expected from the view of shading the illumination; and the grid line is used for conducting current, and from the aspect of resistivity analysis, the thinner the grid line is, the smaller the conductive cross-sectional area is, and the larger the resistance loss is. Therefore, the core of the gate line design is to balance between light shielding and conductivity. In general, the paste for manufacturing the grid lines has a main component of expensive noble metal silver, and in the process of connecting the battery pieces into a module, the main grid of one battery piece needs to be welded with the main grid of an adjacent battery piece through a welding strip, so that a thicker main grid is usually required to be formed to ensure the connection between the welding strip and the main grid. In summary, the higher material cost and thicker main gate results in higher device fabrication costs. Therefore, if the main grid is replaced by the welding strip with lower material cost, more and finer welding strips are directly connected with the fine grid of the battery, so that the manufacturing cost of the grid line and the welding strip is reduced, and the photoelectric conversion efficiency of the solar battery is improved.
However, the conventional welding strip and the grid line are required to be connected through welding to enable the welding strip and the grid line to be alloyed, in general, the conventional welding strip comprises a tin welding layer, the melting point of the tin welding layer in the welding strip is 183 ℃, and in the actual welding process, the welding temperature is higher than the melting point of the welding flux by more than 20 ℃, so that the welding strip and the grid line are required to be alloyed, the higher welding temperature leads to larger buckling deformation of the battery piece in the welding process, and further leads to larger hidden cracking risk and higher breakage rate of the battery piece after welding, and the assembly repair rate is increased and the yield is reduced. Therefore, in order to reduce welding damage, a low temperature solder strip may be employed. The low temperature solder strip typically forms a connection to the gate line during lamination. However, in the lamination process, the adhesive film above the solder strip is converted into a state with fluidity due to the increase of temperature, and the adhesive film with fluidity easily flows between the solder strip and the grid line before the solder strip and the grid line form an alloy, so that poor contact between the solder strip and the grid line is caused, and the efficiency and the yield of the photovoltaic module are further affected.
In order to solve the problems, the embodiment of the application provides a photovoltaic module and a preparation method thereof, wherein in the photovoltaic module, grid lines can be thin grids on the surfaces of battery pieces, connecting parts can be welding strips which are arranged on the surfaces of the battery pieces instead of main grids and are used for connecting adjacent battery pieces, and the main grids are replaced by the connecting parts, so that the thicker main grids are avoided, and the cost of the photovoltaic module is reduced; on the other hand, the main grid is prevented from excessively shielding the surface of the battery piece, so that the photoelectric conversion efficiency of the battery piece is improved, and the efficiency of the photovoltaic module is improved. The packaging layer is used for covering the surfaces of the battery piece and the connecting component and is used for protecting the battery piece, the packaging layer at least comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially distributed along the direction far away from the battery piece, and the fluidity of the third packaging layer, the fluidity of the second packaging layer and the fluidity of the first packaging layer are sequentially reduced, wherein the fluidity of the first packaging layer, the fluidity of the second packaging layer and the fluidity of the third packaging layer are all the fluidity at the lamination temperature, namely, the photovoltaic module is the photovoltaic module in the lamination process. The first packaging layer adjacent to the connecting component and the battery piece is set to be in a state with smaller fluidity, so that the first packaging layer can be prevented from flowing between the connecting component and the grid line, and poor contact between the connecting component and the grid line is further avoided, and the efficiency and the yield of the photovoltaic module are improved. In addition, the second packaging layer and the third packaging layer which are relatively large in mobility are isolated by the aid of the first packaging layer, the second packaging layer is used as a bridge between the first packaging layer and the third packaging layer, the bonding strength of the first packaging layer and the third packaging layer is increased, the third packaging layer with the largest mobility is beneficial to guaranteeing that the packaging layer and the cover plate have strong bonding strength, and further the service life of the photovoltaic module is prolonged.
Embodiments of the present application will be described in detail below with reference to the attached drawings. However, it will be understood by those of ordinary skill in the art that in various embodiments of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. The claimed application may be practiced without these specific details and with various changes and modifications based on the following embodiments.
Fig. 1 is a schematic cross-sectional structure of a photovoltaic module according to an embodiment of the present application; fig. 2 is a schematic structural diagram of a grid line and a connection member on a surface of a battery piece according to an embodiment of the application.
Referring to fig. 1 and 2, the photovoltaic module includes: a plurality of battery cells 100, each of the battery cells 100 having a surface with a plurality of gate lines 110; and connecting members 120, wherein the connecting members 120 are positioned on the surfaces of the battery cells 100, and the connecting members 120 are respectively connected with adjacent battery cells 100, and a portion of the connecting members 120 positioned on the grid lines 110 are in contact connection with adjacent portions of the grid lines 110.
The cell 100 is configured to absorb photons of incident light and generate electron-hole pairs, which are separated by a built-in electric field in the cell 100, and generate an electric potential across the PN junction, thereby converting light energy into electrical energy. In some embodiments, one surface of the battery sheet 100 serves as a light receiving surface for absorbing incident light. In other embodiments, both surfaces of the battery sheet 100 serve as light receiving surfaces for absorbing incident light. In some embodiments, the cell sheet 100 may be a crystalline silicon solar cell, for example, a monocrystalline silicon solar cell or a polycrystalline silicon solar cell. It is understood that in some embodiments, the number of the battery cells 100 in one photovoltaic module may be one or more, and when the number of the battery cells 100 is plural, the plurality of battery strings may be formed by electrically connecting in the form of a whole sheet or a plurality of sheets (for example, a plurality of sheets such as 1/2 equal sheet, 1/3 equal sheet, and 1/4 equal sheet), and the plurality of battery strings may be electrically connected in series and/or parallel.
The battery plate 100 may include, but is not limited to, any of PERC cells (PASSIVATED EMITTER AND REAR CELL, passivated emitter and back cells), PERT cells (PASSIVATED EMITTER AND REAR Totally-diffusedcell, passivated emitter back surface full diffusion cells), TOPCon cells (Tunnel Oxide Passivated Contact, tunnel oxide passivation contact cells), HIT/HJT cells (Heterojunction Technology, heterojunction cells).
The battery sheet 100 may include a substrate, which may be a silicon substrate. In some embodiments, the battery sheet 100 has opposite front and back sides 101 and 102, and the front and back sides 101 and 102 may each be printed with a metal paste to form a grid line 110 having a specific pattern.
In some embodiments, the plurality of battery cells 100 in the photovoltaic module are arranged at intervals, and the plurality of battery cells 100 are arranged in parallel, and the connection member 120 forms an electrical connection between two battery cells 100 by respectively connecting opposite surfaces of two adjacent battery cells 100.
In some embodiments, the connection member 120 may be a solder ribbon, and the connection member 120 may have any one of a circular shape, a rectangular shape, a trapezoid shape, and a triangular shape in a cross-section perpendicular to the extension direction of the connection member 120.
In some embodiments, the grid line 110 may be a thin grid on the surface of the battery plate 100, where the thin grid is used to collect and export electrons generated by the photovoltaic effect. The connecting component 120 can replace a main grid to be arranged on the surface of the battery piece 100 and is used for connecting welding strips of adjacent battery pieces 100, and the connecting component 120 is used for replacing the main grid, so that the thicker main grid is avoided, and the cost of the photovoltaic module is reduced; on the other hand, the main grid is prevented from excessively shielding the surface of the battery piece 100, so that the photoelectric conversion efficiency of the battery piece 100 is improved, and the efficiency of the photovoltaic module is improved.
In some embodiments, referring to fig. 2, the gate lines 110 may be thin grids on the surface of the battery cell 100, the connection members 120 may be solder strips disposed on the surface of the battery cell 100 instead of the main grids and used for connecting adjacent battery cells 100, the plurality of gate lines 110 extend along a first direction X on the surface of the battery cell and are arranged at intervals along a second direction Y, and the plurality of connection members 120 extend along the second direction Y on the surface of the battery cell and are arranged at intervals along the first direction X, wherein the first direction X intersects the second direction Y.
In some embodiments, the gate line 110 may also be a main gate and a thin gate. The fine grid is used for guiding current, and the main grid is used for collecting the current on the fine grid so as to conduct confluence. The connection member 120 is a solder strip connected to the main grid.
It should be noted that, in the embodiment of the present application, the connection component 120 is a low-temperature solder strip, and the low-temperature solder strip is connected with the grid line 110 in the lamination process, so that the welding temperature is prevented from being too high due to the adoption of the high-temperature solder strip, and further, the damage to the battery piece 100 caused by the too high welding temperature is avoided, which is beneficial to reducing the repair rate of the photovoltaic module and improving the yield of the photovoltaic module.
In some embodiments, the connecting member 120 is a tin-coated metal solder strip, and the tin layer has a melting temperature of no higher than 150 ℃, typically 130 ℃ to 150 ℃, which is advantageous for adapting to the lamination temperature of the photovoltaic module.
Referring to fig. 1, the photovoltaic module further includes an encapsulation layer 130, the encapsulation layer 130 covers the surface of the battery sheet 100 and the surface of the connection member 120, and the encapsulation layer 130 includes at least a first encapsulation layer 131, a second encapsulation layer 132, and a third encapsulation layer 133 sequentially arranged along a direction away from the battery sheet 100, wherein fluidity of the third encapsulation layer 133, fluidity of the second encapsulation layer 132, and fluidity of the first encapsulation layer 131 sequentially decrease. The packaging layer 130 is used for packaging and protecting the battery piece, and the packaging layer may be an adhesive film.
It should be noted that, the fluidity of the first encapsulation layer 131, the fluidity of the second encapsulation layer 132, and the fluidity of the third encapsulation layer 133 are all the fluidity at the lamination temperature, that is, the photovoltaic module is a photovoltaic module in the lamination process, the lamination process refers to a process of laying the connection member 120 on the surface of the battery sheet 100, and covering the encapsulation layer 130 on the connection member 120 and the surface of the battery sheet 100 exposed by the connection member 120, and then laminating the battery sheet 100, the connection member 120, and the encapsulation layer 130, wherein the lamination process has a certain lamination temperature, and the connection member 120 and the grid line 110 located below the connection member 120 form an alloy at the lamination temperature, so as to form a contact connection. When the encapsulation layer is in the scorching stage at the lamination temperature, the encapsulation layer is in a state with fluidity, and the first encapsulation layer 131 adjacent to the connecting component 120 and the battery piece 100 is set in a state with smaller fluidity, so that poor contact between the connecting component 120 and the grid line 110 caused by the fact that the first encapsulation layer 131 flows between the connecting component 120 and the grid line 110 is avoided, and the efficiency and the yield of the photovoltaic module are improved. In addition, the second packaging layer 132 and the third packaging layer 133 with relatively large mobility are isolated by the first packaging layer 131, the second packaging layer 132 is used as a bridge between the first packaging layer 131 and the third packaging layer 133, so that the bonding strength between the first packaging layer 131 and the third packaging layer 133 is increased, the third packaging layer 133 with the largest mobility is beneficial to ensuring that the packaging layer 130 and the cover plate have strong bonding strength, and further the service life of the photovoltaic module is prolonged.
The fluidity of the first encapsulation layer 131 may be represented by the ML value of the first encapsulation layer 131, the fluidity of the second encapsulation layer 132 may be represented by the ML value of the second encapsulation layer 132, the fluidity of the third encapsulation layer 133 may be represented by the ML value of the third encapsulation layer 133, the ML value is the lowest torque in the vulcanization curve of the adhesive film, the lower the ML value is, the greater the fluidity of the adhesive film before the crosslinking reaction occurs in the lamination process; the higher the ML value, the less fluid the film has before the crosslinking reaction occurs during lamination.
The vulcanization curve is used for representing the vulcanization performance of the adhesive film, wherein the vulcanization performance is the performance of the adhesive film in the vulcanization process, the adhesive film can undergo vulcanization reaction in the vulcanization process, and the vulcanization reaction (crosslinking reaction) is as follows: the molecular chain of the adhesive film generates chemical crosslinking effect under the action of chemical or physical factors, and becomes a space network structure. The linear macromolecules of the unvulcanized adhesive film are curled and in a free movement state, when the linear macromolecules are subjected to the action of external force, the linear macromolecules are easy to displace, namely larger plastic flow exists, and in the vulcanized adhesive film, the soft linear macromolecules are changed into a space reticular structure through crosslinking, so that the relative movement of the linear macromolecules is limited to a certain extent, the linear macromolecules are not easy to displace greatly under the action of external force, higher stress and strength are generated, and the physical and mechanical properties and chemical properties are improved through vulcanization.
Under the normal condition, the change of the vulcanization performance of the adhesive film in the vulcanization process can be measured by adopting a vulcanization tester, and the principle of the vulcanization tester is as follows: and (3) compression molding is carried out on the adhesive film sample positioned in the mold cavity, so that the adhesive film sample continuously bears constant, small-amplitude and low-frequency sinusoidal shear deformation, the shear stress is measured by a force cell of a vulcanization tester, the shear stress is expressed by taking torque as a unit, and a recorded shear stress-time curve is a vulcanization curve.
FIG. 3 is a schematic view of a curing curve according to an embodiment of the present application. Referring to fig. 3, the curing process of the adhesive film can be divided into four stages: a scorch stage, a hot vulcanization stage, a flat vulcanization stage and a oversulfur stage. The scorch phase corresponds to the induction phase in the vulcanization reaction, during which time crosslinking has not yet begun, the film has fluidity and the film sample generates crosslinkable free radicals. The hot vulcanization stage is a vulcanization reaction (crosslinking reaction) stage, the film molecules gradually form a net structure, and the elasticity and strength of the film are rapidly increased. In the flat vulcanization stage, the adhesive film has reached a proper degree of crosslinking, and in this period, each physical and mechanical property of the adhesive film reaches or approaches the optimal point, or the optimal comprehensive balance is obtained. In the stage of the over-sulfur, the crosslinking bonds in the adhesive film are rearranged, the crosslinking bonds in the adhesive film and the molecular chains are subjected to thermal cracking reaction, and the performance of the adhesive film is reduced.
Referring to fig. 3, the lowest torque ML represents the minimum shear stress value before the crosslinking reaction of the adhesive film starts, i.e., the maximum value of the flowability of the adhesive film before the crosslinking reaction starts during vulcanization.
In some embodiments, the packaging layer may further include a first packaging layer, a second packaging layer, a third packaging layer, and a fourth packaging layer sequentially arranged along a direction away from the battery piece, wherein fluidity of the fourth packaging layer, fluidity of the third packaging layer, fluidity of the second packaging layer, and fluidity of the first packaging layer sequentially decrease. The embodiment of the application does not particularly limit the number of the laminated layers with different mobility in the packaging layer, so long as the mobility of the laminated layers on the surface of the battery piece is ensured to be sequentially increased along the direction away from the battery piece.
In some embodiments, the encapsulation layer 130 is disposed on the front surface 101 and the back surface 102 of the battery sheet 100, and covers the connection member 120 on the surface of the battery sheet 100, for encapsulating the battery sheet 100, and may bond the battery sheet 100 with a cover plate (not shown).
In some embodiments, the first packaging layer 131 before lamination is a pre-crosslinked adhesive film, the second packaging layer 132 before lamination is a pre-crosslinked adhesive film, and the third packaging layer 133 before lamination is a non-pre-crosslinked adhesive film, which is different from the non-pre-crosslinked adhesive film in that: before lamination, whether crosslinking reaction occurs between molecules in the adhesive film material or not. Crosslinking reaction refers to the bonding of 2 or more molecules (typically linear molecules) to each other to crosslink into a more stable molecule (bulk molecule) of network structure. In general, in the lamination process, after a certain lamination time at a certain lamination temperature, the adhesive film is in a state with high fluidity (scorch stage), and the crosslinking agent in the adhesive film is decomposed to generate free radicals. Along with the extension of time, the free radical initiates the combination of long chain molecules in the adhesive film, so that the adhesive film, the battery piece and the cover plate are adhered and fixed together. Before lamination, some molecules inside the pre-crosslinked film have undergone crosslinking reaction, so that the fluidity of the pre-crosslinked film in the scorch stage is smaller than that of the non-pre-crosslinked film, and depends on the proportion of molecules inside the pre-crosslinked film that have undergone crosslinking reaction before lamination.
In some embodiments, the first encapsulation layer 131 may be a POE (ethylene octene copolymer) adhesive film. In some embodiments, the second encapsulation layer 132 may be a POE (ethylene octene copolymer) adhesive film. In some embodiments, the third encapsulation layer 133 may be a POE (ethylene octene copolymer) adhesive film. The POE adhesive film is composed of saturated fatty chains, has good ultraviolet aging resistance, excellent heat resistance and low temperature resistance, and has the characteristics of good light transmittance, excellent electrical insulation performance, high cost performance, easiness in processing and the like, and the use temperature range of the POE adhesive film is wide.
In some embodiments, the first encapsulation layer 131 may be an EVA film. In some embodiments, the second encapsulation layer 132 may be an EVA film. In some embodiments, the third encapsulation layer 133 may be an EVA film. The EVA adhesive film is a common adhesive film, the main component of the EVA adhesive film is ethylene-vinyl acetate copolymer (EVA), and the EVA adhesive film can also comprise a small amount of cross-linking agent, auxiliary cross-linking agent, anti-aging agent and other functional auxiliary agents.
In some embodiments, the material of the first encapsulation layer 131, the material of the second encapsulation layer 132, and the material of the third encapsulation layer 133 are the same. The same material is adopted as the first packaging layer 131, the second packaging layer 132 and the third packaging layer 133, which is favorable for ensuring that the molecules of the first packaging layer 131 and the molecules of the second packaging layer 132 have higher bonding strength, and ensuring that the molecules of the second packaging layer 132 and the molecules of the third packaging layer 133 have higher bonding strength, thereby being favorable for improving the bonding strength between the laminated first packaging layer 131 and the laminated second packaging layer 132 and the laminated third packaging layer 133.
In some embodiments, the first encapsulation layer 131, the second encapsulation layer 132, and the third encapsulation layer 133 are integrally formed. Compared with the lamination of the split first, second and third encapsulation layers 131, 132 and 133, the integrated first, second and third encapsulation layers 131, 132 and 133 are directly adopted as the encapsulation layers 130, which is beneficial to ensuring higher adhesive strength between the first and second encapsulation layers 131 and 132 and higher adhesive strength between the second and third encapsulation layers 132 and 133, thereby improving structural stability of the photovoltaic module.
In some embodiments, the materials of the first encapsulation layer 131, the second encapsulation layer 132, and the third encapsulation layer 133 are the same, and the first encapsulation layer 131, the second encapsulation layer 132, and the third encapsulation layer 133 are an integrally formed structure. In some embodiments, the encapsulation layer 130 may be formed by: the initial packaging layer is obtained, the initial packaging layer may be a non-pre-crosslinked adhesive film, and the initial packaging layer includes a first portion, a second portion and a third portion stacked, the initial packaging layer is pre-crosslinked from one side of the first portion far away from the third portion, so that a cross-linking reaction occurs in a part of molecules in the initial packaging layer of the first portion, and a cross-linking reaction occurs in a part of molecules in the initial packaging layer of the second portion, and a proportion of molecules in the initial packaging layer of the first portion, which is higher than a proportion of molecules in the initial packaging layer of the second portion, so as to form a pre-crosslinked first packaging layer 131 and a pre-crosslinked second packaging layer 132, which have sequentially higher fluidity, the initial packaging layer of the third portion is still a non-pre-crosslinked adhesive film, and the initial packaging layer of the third portion is used as a third packaging layer 133 with the highest fluidity, thereby being beneficial to reduce the obtaining difficulty of the packaging layer 130. Wherein, the pre-crosslinking treatment can be electron beam irradiation or ultraviolet irradiation and other crosslinking treatments.
In some embodiments, the encapsulation layer 130 may be formed by: the method comprises the steps of obtaining a split type initial first packaging layer, an initial second packaging layer and an initial third packaging layer, wherein the initial first packaging layer, the initial second packaging layer and the initial third packaging layer are all non-pre-crosslinked adhesive films, pre-crosslinking treatment is conducted on the initial first packaging layer and the initial second packaging layer to different degrees, so that partial molecules in the initial first packaging layer are subjected to crosslinking reaction, partial molecules in the initial second packaging layer are subjected to crosslinking reaction, the proportion of the molecules subjected to the crosslinking reaction in the initial packaging layer of the first part is higher than the proportion of the molecules subjected to the crosslinking reaction in the initial packaging layer of the second part, and the initial third packaging layer serves as a pre-crosslinked first packaging layer 131 and a pre-crosslinked second packaging layer 132, wherein the fluidity of the pre-crosslinked first packaging layer is sequentially higher, and the initial third packaging layer serves as a non-pre-crosslinked third packaging layer 133. The split first, second and third encapsulation layers 131, 132 and 133 are fixed together to form the encapsulation layer 130. Wherein, the pre-crosslinking treatment can be electron beam irradiation or ultraviolet irradiation and other crosslinking treatments.
In some embodiments, the ratio of the ML value of the first encapsulation layer 131 to the ML value of the second encapsulation layer is 1.1-3. If the ML value of the first encapsulation layer 131 is defined as ML1, and the ML value of the second encapsulation layer 132 is defined as ML2, the ratio of ML1 to ML2 is 1.1-3, for example, it may be: 1.5, 2, 2.5, 2.6 or 2.7. When the ratio of ML1 to ML2 is too small, the first encapsulation layer 131 is in a state of high fluidity, and thus the first encapsulation layer 131 in the scorching stage flows between the gate line 110 and the connection member 120, which are not alloyed, and the gate line 110 and the connection member 120 are in poor contact. Too large ratio of ML1 to ML2 may result in too small fluidity of the first encapsulation layer 131, that is, the molecular proportion of the first encapsulation layer 131 that has undergone the crosslinking reaction is too large before lamination, resulting in poor adhesion fixing ability of the first encapsulation layer 131 in the laminated photovoltaic module, so that the separation risk exists between the cell 100 and the first encapsulation layer 131 in the photovoltaic module. Therefore, the ratio of ML1 to ML2 is set to 1.1-3, which is not only beneficial to avoiding poor contact between the gate line 110 and the connection member 120, but also beneficial to ensuring that the first encapsulation layer 131 has higher adhesive strength.
In some embodiments, the ratio of the ML value of the second encapsulation layer 132 to the ML value of the third encapsulation layer 133 is 1.1-4. If the ML value of the second encapsulation layer 132 is defined as ML2, and the ML value of the third encapsulation layer 133 is defined as ML3, the ratio of ML2 to ML3 is 1.1-4, for example, it may be: 1.5, 2, 2.5, 2.6 or 3.5. If the ratio of ML2 to ML3 is too small, the flowability of the second encapsulation layer 132 is too close to the flowability of the third encapsulation layer 133, so that the second encapsulation layer 132 cannot serve as a good connection bridge between the first encapsulation layer 131 and the third encapsulation layer 133, i.e. the adhesive strength between the first encapsulation layer 131 and the second encapsulation layer 132 is reduced. If the ratio of ML2 to ML3 is too large, the flowability of the second encapsulation layer 132 is too close to that of the first encapsulation layer 131, so that the second encapsulation layer 132 cannot serve as a good connection bridge between the first encapsulation layer 131 and the third encapsulation layer 133, i.e. the adhesive strength between the third encapsulation layer 133 and the second encapsulation layer 132 is reduced. Therefore, setting the ratio of ML2 to ML3 to 1.1-4 is advantageous for ensuring a high adhesive strength between the first encapsulation layer 131 and the second encapsulation layer 132, and for ensuring a high adhesive strength between the second encapsulation layer 132 and the third encapsulation layer 133.
In some embodiments, the ML value of the first encapsulation layer 131 is 0.4 dNm to 0.85 dNm. For example, the amount may be 0.42 dN.m, 0.45 dN.m, 0.5 dN.m, 0.75 dN.m, or 0.8 dN.m. If the ML value of the first encapsulation layer 131 is too small, the mobility of the first encapsulation layer 131 is too large, which may cause the first encapsulation layer 131 in the scorching stage to flow between the gate line 110 and the connection member 120, which are not alloyed, and cause poor contact between the gate line 110 and the connection member 120. If the ML value of the first encapsulation layer 131 is too large, the fluidity of the first encapsulation layer 131 is too small, that is, the molecular proportion of the first encapsulation layer 131, in which the crosslinking reaction has occurred, is too large before lamination, which may result in poor adhesion fixing ability of the first encapsulation layer 131 in the laminated photovoltaic module. Therefore, the fluidity ML value of the first encapsulation layer 131 is set to 0.4dn·m to 0.85dn·m, so that the fluidity of the first encapsulation layer 131 can be ensured to be within a reasonable range, which is beneficial to avoiding poor contact between the gate line 110 and the connection member 120, and also beneficial to ensuring that the first encapsulation layer 131 has higher adhesive strength.
If the ML value of the first package layer is defined as ML1, the ML value of the second package layer is defined as ML2, and the ML value of the third package layer is defined as ML3, the influence of the ML value of the first package layer, the ML value of the second package layer, and the ML value of the third package layer on the connection state of the gate line and the connection member after lamination is referred to in the following table.
The data sources in the above table may be as follows: sampling the connection points of the connecting components and the grid lines, which are positioned in the same area, on the battery pieces of the comparative examples, wherein the total number of samples on each battery piece can be 50, counting the number of samples, which are in contact connection, of the connecting grid lines and the connecting components on the battery pieces, so as to obtain the percentage of the number of the samples, which are in contact connection, of the connecting components and the grid lines of the comparative examples, to obtain the percentage of the number of the samples, which are in contact connection, of the connecting components and the grid lines of the comparative examples.
Referring to the above table, when the value of the ML value (ML 2) of the second encapsulation layer is constant and the value of the ML value (ML 3) of the third encapsulation layer is constant, the larger the ML value (ML 1) of the first encapsulation layer, the higher the percentage of the number of samples of the connection member in contact with the gate line to the total number of samples, that is, the lower the proportion of the connection member in poor contact with the gate line (refer to comparative example 1, example 2 and example 4, or refer to comparative example 3, example 5, example 6 and example 8). When the ML value (ML 1) of the first encapsulation layer is 0.4dn·m or more, the number of samples of the connection member in contact connection with the grid line is more than 95% of the total number of samples, i.e., the photovoltaic module is a good product (reference examples 1 to 8). When the ML value (ML 1) of the first encapsulation layer is less than 0.4dn·m, the number of samples of the connection member in contact connection with the gate line is less than 95% of the total number of samples, and the photovoltaic module is a defective product (refer to comparative examples 1 to 3). Therefore, the ML value of the first packaging layer is set to be more than 0.4 dN.m, which is beneficial to improving the yield and efficiency of the photovoltaic module.
With continued reference to the above table, when the ML value (ML 1) of the first encapsulation layer is greater than or equal to 0.4dn·m, the change of the ML value (ML 2) of the second encapsulation layer cannot affect the connection state of the gate line and the connection member (refer to embodiment 2 and embodiment 3, or embodiment 6 and embodiment 7), i.e., the first encapsulation layer having poor flow realizes effective isolation blocking for the second encapsulation layer. When the ML value (ML 1) of the first encapsulation layer is greater than or equal to 0.4dn·m, the variation of the ML value (ML 3) of the third encapsulation layer cannot affect the connection state of the gate line and the connection member (refer to examples 1 and 5, or examples 2 and 6).
In some embodiments, the ML value of the second encapsulation layer 132 is 0.3 dNm to 0.4 dNm, for example, may be 0.32 dNm, 0.35 dNm, 0.36 dNm, 0.38 dNm, or 0.39 dNm, etc. If the ML value of the second encapsulation layer 132 is too small, the flowability of the second encapsulation layer 132 is too close to the flowability of the third encapsulation layer 133, so that the second encapsulation layer 132 cannot serve as a good connection bridge between the first encapsulation layer 131 and the third encapsulation layer 133, i.e., the adhesive strength between the first encapsulation layer 131 and the second encapsulation layer 132 is reduced. If ML of the second encapsulation layer 132 is too large, the fluidity of the second encapsulation layer 132 is too close to that of the first encapsulation layer 131, so that the second encapsulation layer 132 cannot serve as a good connection bridge between the first encapsulation layer 131 and the third encapsulation layer 133, i.e., the adhesive strength between the third encapsulation layer 133 and the second encapsulation layer 132 is reduced. Therefore, the ML value of the second encapsulation layer 132 is 0.3dn·m to 0.4dn·m, which is beneficial to ensuring a higher adhesion strength between the first encapsulation layer 131 and the second encapsulation layer 132, and a higher adhesion strength between the second encapsulation layer 132 and the third encapsulation layer 133.
In some embodiments, the ML value of the third encapsulation layer 133 is 0.1 dNm to 0.3 dNm, for example, may be 0.12 dNm, 0.15 dNm, 0.2 dNm, 0.25 dNm, or 0.3 dNm, etc. Too little fluidity of the third encapsulant layer may result in too poor adhesive fixing ability of the third encapsulant layer in the laminated photovoltaic module. Therefore, the ML value of the third packaging layer is set to be 0.1 dN.m-0.3 dN.m, which is beneficial to ensuring that the third packaging layer has higher adhesive strength.
Fig. 4 is a schematic partial cross-sectional structure of a photovoltaic module before lamination according to an embodiment of the present application.
In some embodiments, fig. 4, the ratio of the thickness L2 of the first encapsulation layer 131 to the maximum thickness L1 of the connection member 120 in the direction in which the battery sheet 100 is directed to the encapsulation layer 130, i.e., in the Z-direction shown in fig. 4, is 0.4 to 1. For example, it may be 0.4, 0.5, 0.6, 0.7, 0.9, or the like. If the ratio of the thickness L2 of the first encapsulation layer 131 to the maximum thickness L1 of the connection member 120 is too large, the thickness L2 of the first encapsulation layer 131 may be too large, and the light absorption of the battery chip 100 may be affected by the too large thickness of the first encapsulation layer 131. Too small a ratio of the thickness L2 of the first encapsulation layer 131 to the maximum thickness L1 of the connection member 120 may result in too small a thickness L2 of the first encapsulation layer 131, which may result in the first encapsulation layer 131 failing to perform good blocking on the second encapsulation layer 132 during the scorching stage of the encapsulation layer in the lamination process, so that the second encapsulation layer 132 flows between the gate line 110 and the connection member 120. Therefore, the ratio of the thickness L2 of the first encapsulation layer 131 to the maximum thickness L1 of the connection member 120 is set to 0.4-1, which is beneficial to avoiding the excessively thick first encapsulation layer 131 from shielding the illumination, i.e. to ensuring that the battery chip 100 has a higher utilization rate of the illumination; on the other hand, the first encapsulation layer 131 is beneficial to ensure that the second encapsulation layer 132 is effectively blocked, so that good contact between the gate line 110 and the connection component 120 is beneficial to ensure.
In some embodiments, referring to fig. 4, the ratio of the thickness L2 of the first encapsulation layer 131 to the thickness L3 of the second encapsulation layer 132 in the direction in which the battery sheet 100 is directed toward the encapsulation layer 130, i.e., in the Z-direction shown in fig. 4, is 1 to 4. For example, it may be 1,2, 2.5 or 3. If the ratio of the thickness L2 of the first encapsulation layer 131 to the thickness L3 of the second encapsulation layer 132 is too large, the thickness L3 of the second encapsulation layer 132 is too small, and the second encapsulation layer 132 with too small thickness cannot serve as a good connecting bridge between the first encapsulation layer 131 and the third encapsulation layer 133. Moreover, the second packaging layer 132 with too small a thickness may cause the overall thickness of the packaging layer 130 to be too small, which may cause moisture to enter the battery cell 100 and cause the battery cell 100 to fail. If the ratio of the thickness L2 of the first encapsulation layer 131 to the thickness L3 of the second encapsulation layer 132 is too small, the thickness L3 of the second encapsulation layer 132 may be too large, and the light absorption of the battery sheet 100 may be affected by the second encapsulation layer 132 having too large thickness. In addition, the second encapsulation layer 132 having an excessive thickness may cause an increase in manufacturing cost of the photovoltaic module. Therefore, the ratio of the thickness L2 of the first encapsulation layer 131 to the thickness L3 of the second encapsulation layer 132 is set to 1-4, which is not only beneficial to ensuring good encapsulation protection of the second encapsulation layer 132 on the battery piece 100, but also beneficial to enhancing the utilization rate of the battery piece 100 on illumination, and making the material consumption for preparing the second encapsulation layer 132 reasonable, and beneficial to realizing the light weight of the photovoltaic module and reducing the preparation cost of the photovoltaic module.
In some embodiments, referring to fig. 4, the ratio of the thickness L3 of the second encapsulation layer 132 to the thickness L4 of the third encapsulation layer 133 in the direction in which the battery sheet 100 is directed toward the encapsulation layer 130, i.e., in the Z-direction shown in fig. 4, is 0.2 to 0.7. For example, it may be 0.3, 0.4, 0.5, 0.6, or 0.7. In the case where the thickness L3 of the second encapsulation layer 132 is fixed, if the ratio of the thickness L3 of the second encapsulation layer 132 to the thickness L4 of the third encapsulation layer 133 is too large, the thickness L4 of the third encapsulation layer 133 may be too small, and since the laminated third encapsulation layer 133 has a high adhesive strength, the third encapsulation layer 133 with too small thickness may not perform good encapsulation protection on the battery sheet 100, which may result in separation of the cover plate from the battery sheet 100. Moreover, the third packaging layer 133 with an excessively small thickness may cause the overall thickness of the packaging layer 130 to be excessively small, which may cause moisture to enter the battery cell 100 and cause the battery cell 100 to fail. If the ratio of the thickness L3 of the second encapsulation layer 132 to the thickness L4 of the third encapsulation layer 133 is too small, the thickness L4 of the third encapsulation layer 133 may be too large, and the light absorption of the battery sheet 100 may be affected by the third encapsulation layer 133 having too large thickness. In addition, the third encapsulation layer 133 having an excessively large thickness may cause an increase in manufacturing costs of the photovoltaic module. Therefore, the ratio of the thickness L3 of the second encapsulation layer 132 to the thickness L4 of the third encapsulation layer 133 is set to 0.2-0.7, which is favorable for ensuring good encapsulation protection of the third encapsulation layer 133 on the battery piece 100, enhancing the utilization rate of the battery piece 100 on illumination, ensuring reasonable material consumption for preparing the third encapsulation layer 133, realizing light weight of the photovoltaic module, and reducing the preparation cost of the photovoltaic module.
Note that, in the embodiment of the present application, the maximum thickness L1 of the connection member 120 is the thickness before lamination of the connection member 120, the thickness L2 of the first encapsulation layer 131 is the thickness before lamination of the first encapsulation layer 131, the thickness L3 of the second encapsulation layer 132 is the thickness before lamination of the second encapsulation layer 132, and the thickness L4 of the third encapsulation layer 133 is the thickness before lamination of the third encapsulation layer 133.
In some embodiments, referring to fig. 4, the maximum thickness L1 of the connection member 120 in the direction in which the battery sheet 100 is directed toward the encapsulation layer 130, i.e., in the Z direction shown in fig. 4, is 200 μm to 260 μm, and may be, for example: 200 μm, 210 μm, 230 μm, 235 μm or 250 μm. Excessive thickness L1 of the connecting member 120 may result in excessive use of the connecting member 120, thereby increasing the cost of the photovoltaic module. Too small a maximum thickness L1 of the connection member 120 may result in too small a conductive cross-sectional area of the connection member 120, which may result in too large a resistance loss. Therefore, setting the maximum thickness L1 of the connection member 120 to be 200 μm to 260 μm is beneficial to ensuring that the size of the connection member 120 is within a reasonable range, to avoiding increasing the cost of the photovoltaic module, to reducing the resistance loss, and to improving the efficiency of the photovoltaic module.
In some embodiments, referring to fig. 1 and 4, the thickness L2 of the first encapsulation layer 131 in the direction in which the battery sheet 100 is directed to the encapsulation layer 130, i.e., in the Z direction shown in fig. 4, is 110 μm to 200 μm, and may be, for example: 120 μm, 130 μm, 150 μm, 165 μm or 180 μm. The first encapsulation layer 131 having an excessive thickness may affect light absorption of the battery cell 100. The thickness L2 of the first encapsulation layer 131 is too small, which may cause the first encapsulation layer 131 to fail to perform a good blocking of the second encapsulation layer 132 having a larger mobility during the scorching stage of the encapsulation layer in the lamination process, so that the second encapsulation layer 132 flows between the gate line 110 and the connection part 120. Therefore, the thickness L2 of the first encapsulation layer 131 is set to be 110 μm to 200 μm, which is beneficial to avoiding the excessively thick first encapsulation layer 131 from shielding the illumination, i.e. to ensure that the battery chip 100 has a higher utilization rate of the illumination; on the other hand, the first encapsulation layer 131 is beneficial to ensure that the second encapsulation layer 132 is effectively blocked, so that good contact between the gate line 110 and the connection component 120 is beneficial to ensure.
In some embodiments, referring to fig. 1 and 4, the thickness L2 of the second encapsulation layer 132 in the direction in which the battery sheet 100 is directed toward the encapsulation layer 130, i.e., in the Z direction shown in fig. 4, is 50 μm to 100 μm, and may be, for example: 60 μm, 70 μm, 80 μm or 90 μm. The second encapsulation layer 132 having an excessively small thickness cannot serve as a good connection bridge between the first encapsulation layer 131 and the third encapsulation layer 133. Moreover, the second packaging layer 132 with too small a thickness may cause the overall thickness of the packaging layer 130 to be too small, which may cause moisture to enter the battery cell 100 and cause the battery cell 100 to fail. The second encapsulation layer 132 having an excessive thickness may affect the light absorption of the battery cell 100. In addition, the second encapsulation layer 132 having an excessive thickness may cause an increase in manufacturing cost of the photovoltaic module. Therefore, the thickness L2 of the second packaging layer 132 is set to be 50 μm-100 μm, which is not only beneficial to ensuring good packaging protection of the second packaging layer 132 on the battery piece 100, but also beneficial to enhancing the utilization rate of the battery piece 100 on illumination, ensuring reasonable material consumption for preparing the second packaging layer 132, being beneficial to realizing light weight of the photovoltaic module and reducing the preparation cost of the photovoltaic module.
In some embodiments, referring to fig. 1 and 4, the thickness L4 of the third encapsulation layer 133 along the Z direction is 140 μm to 260 μm, which may be, for example: 150 μm, 165 μm, 170 μm, 200 μm or 250 μm. The third encapsulation layer having too small a thickness may not perform good encapsulation protection for the battery sheet 100, and may cause the cover plate to be separated from the battery sheet 100. Moreover, the third packaging layer 133 with an excessively small thickness may cause the overall thickness of the packaging layer 130 to be excessively small, which may cause moisture to enter the battery cell 100 and cause the battery cell 100 to fail. The third encapsulation layer 133 having an excessive thickness may affect the light absorption of the battery cell 100. In addition, the third encapsulation layer 133 having an excessively large thickness may cause an increase in manufacturing costs of the photovoltaic module. Therefore, the thickness L4 of the third packaging layer 133 is set to 140 μm-260 μm, which is not only beneficial to ensuring good packaging protection of the third packaging layer 133 on the battery piece 100, but also beneficial to enhancing the utilization rate of the battery piece 100 on illumination, and making the material consumption for preparing the third packaging layer 133 reasonable, which is beneficial to realizing the light weight of the photovoltaic module and reducing the preparation cost of the photovoltaic module.
In some embodiments, referring to fig. 1 and 2, the photovoltaic module further comprises: the glue point 140, the glue point 140 is located between a part of the battery plate 100 and the connecting component 120, and the glue point 140 is located on the surface of the battery plate 100 outside the grid line 110. The glue sites 140 are used to fix the connection members 120 before lamination, preventing the connection members 120 from moving on the surface of the battery sheet 100.
In some embodiments, referring to fig. 1, the photovoltaic module further comprises: the cover plate 150, the cover plate 150 is located on the surface of the encapsulation layer 130 away from the battery plate 100, and the cover plate 150 may be a glass cover plate or a plastic cover plate or the like for protecting the battery string.
In the photovoltaic module provided in the foregoing embodiment, the encapsulation layer 130 includes at least the first encapsulation layer 131, the second encapsulation layer 132 and the third encapsulation layer 133 sequentially arranged along the direction far from the battery piece 100, and the fluidity of the third encapsulation layer 133, the fluidity of the second encapsulation layer 132 and the fluidity of the first encapsulation layer 131 are sequentially reduced, where the fluidity of the first encapsulation layer 131, the fluidity of the second encapsulation layer 132 and the fluidity of the third encapsulation layer 133 are all the fluidity at the lamination temperature, that is, the photovoltaic module is the photovoltaic module in the lamination process, and the first encapsulation layer 131 adjacent to the connection component 120 and the battery piece 100 is set to be in a state with smaller fluidity at the lamination temperature, so that the first encapsulation layer 131 can be prevented from flowing between the connection component 120 and the grid line 110, and further poor contact between the connection component 120 and the grid line 110 is avoided, which is beneficial to improving the efficiency and yield of the photovoltaic module. In addition, the second packaging layer 132 and the third packaging layer 133 with relatively large mobility are isolated by the first packaging layer 131, the second packaging layer 132 is used as a bridge between the first packaging layer 131 and the third packaging layer 133, so that the bonding strength between the first packaging layer 131 and the third packaging layer 133 is increased, the third packaging layer 133 with the largest mobility is beneficial to ensuring that the packaging layer 130 and the cover plate have strong bonding strength, and further the service life of the photovoltaic module is prolonged.
According to some embodiments of the present application, a method for manufacturing a photovoltaic module is further provided according to another aspect of the embodiments of the present application, and the method for manufacturing a photovoltaic module may be used to form a photovoltaic module related to the foregoing embodiments, and the method for manufacturing a photovoltaic module provided by the embodiments of the present application will be described with reference to the accompanying drawings.
Fig. 5 is a schematic structural diagram corresponding to a step of providing a battery sheet in a method for manufacturing a photovoltaic module according to an embodiment of the present application; fig. 6 is a schematic structural diagram corresponding to a step of forming a glue dot in a method for manufacturing a photovoltaic module according to an embodiment of the present application; fig. 7 is a schematic structural diagram corresponding to a step of fixing a connecting component by using glue points in a method for manufacturing a photovoltaic module according to an embodiment of the present application; fig. 8 is a schematic structural diagram corresponding to a step of disposing a packaging layer in a method for manufacturing a photovoltaic module according to an embodiment of the present application; fig. 9 is a schematic structural diagram of a photovoltaic module after lamination treatment in a method for manufacturing a photovoltaic module according to an embodiment of the present application. Fig. 5 to 9 illustrate only one cell, with the number of cells omitted.
Referring to fig. 5, the method of manufacturing a photovoltaic module includes: a plurality of battery cells 100 are provided, and each of the battery cells 100 has a surface with a plurality of gate lines 110. In some embodiments, the gate lines 110 may be formed using a screen printing and sintering process.
Referring to fig. 6 to 7, a connection member 120 is provided at the surface of the battery sheet 100.
In some embodiments, providing the connection component 120 further comprises: forming glue sites 140. Referring to fig. 6, uncured glue sites 140 may be formed on a portion of the surface of the battery sheet 100 other than the grid lines 110; referring to fig. 7, the connection member 120 is laid on the surface of the battery sheet 100 with the adhesive dots 140 between a portion of the battery sheet 100 and the connection member 120, and after the connection member 120 is laid, the adhesive dots 140 may be cured by ultraviolet irradiation or other low temperature treatment, and the connection member 120 is fixed by the adhesive dots 140 to prevent the connection member 120 from moving.
Referring to fig. 8, an encapsulation layer 130 is disposed on a surface of the battery sheet 100, and the encapsulation layer 130 is located at a side of the connection member 120 away from the battery sheet 100, and the encapsulation layer 130 includes a first encapsulation layer 131, a second encapsulation layer 132, and a third encapsulation layer 133 sequentially arranged in a direction away from the battery sheet 100.
With continued reference to fig. 8, in some embodiments, the encapsulation layer 130 is provided while a cover plate 150 is also provided on the surface of the encapsulation layer 130 remote from the battery.
Referring to fig. 9, the battery cell 100, the connection member 120, and the encapsulation layer 130 are laminated at a preset temperature such that a portion of the connection member 120 located above the gate line 110 is in contact with an adjacent portion of the gate line 110, and such that the battery cell 100 is fixed to the encapsulation layer 130; wherein, the fluidity of the third encapsulation layer 133 at the preset temperature, the fluidity of the second encapsulation layer 132 at the preset temperature, and the fluidity of the first encapsulation layer 131 at the preset temperature decrease in sequence.
In some embodiments, the lamination process also secures the encapsulation layer 130 to the cover plate 150.
The first encapsulation layer 131 adjacent to the connection member 120 and the battery piece 100 is set to be in a state with smaller fluidity, so that the first encapsulation layer 131 can be prevented from flowing between the connection member 120 and the grid line 110, and poor contact between the connection member 120 and the grid line 110 is avoided, which is beneficial to improving the efficiency and yield of the photovoltaic module. In addition, the second packaging layer 132 and the third packaging layer 133 with relatively large mobility are isolated by the first packaging layer 131, the second packaging layer 132 is used as a bridge between the first packaging layer 131 and the third packaging layer 133, so that the bonding strength between the first packaging layer 131 and the third packaging layer 133 is increased, the third packaging layer 133 with the largest mobility is beneficial to ensuring that the packaging layer 130 and the cover plate have strong bonding strength, and further the service life of the photovoltaic module is prolonged.
It should be noted that the preset temperature may be higher than the temperature at which the connection member 120 and the gate line 110 form an alloy and lower than the temperature at which the encapsulation layer 130 performs a cross-linking reaction, so that the connection member 120 and the gate line 110 form an alloy at the preset temperature, and after the connection member 120 and the gate line 110 form an alloy, the encapsulation layer 130 performs a cross-linking reaction.
In the method for manufacturing the photovoltaic module provided in the above embodiment, the first encapsulation layer 131 adjacent to the connection member 120 and the battery piece 100 is set to have a smaller fluidity, so that poor contact between the connection member 120 and the grid line 110 caused by the first encapsulation layer 131 flowing between the connection member 120 and the grid line 110 is avoided, which is beneficial to forming a photovoltaic module with higher yield and efficiency. And, utilize first encapsulation layer 131 to keep apart with respect to second encapsulation layer 132 and third encapsulation layer 133 that the mobility is great, utilize second encapsulation layer 132 as the bridge between first encapsulation layer 131 and the third encapsulation layer 133, be favorable to increasing first encapsulation layer 131 and the adhesion strength of third encapsulation layer 133, the biggest third encapsulation layer 133 of mobility is favorable to guaranteeing encapsulation layer 130 and apron have stronger adhesive strength to be favorable to forming the photovoltaic module that structural stability is higher.
It should be noted that, in the drawings provided in this embodiment, the structure of the photovoltaic module and the shape of the photovoltaic module do not form the limitation of the structure of the photovoltaic module and the shape of the photovoltaic module in this embodiment, and it can be understood that the structure of the photovoltaic module and the shape of the photovoltaic module can be correspondingly designed and modified according to the photovoltaic module matched with the requirements.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the application and that various changes in form and details may be made therein without departing from the spirit and scope of the application. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the application, and the scope of the application is therefore intended to be limited only by the appended claims.

Claims (13)

1. A photovoltaic module, comprising:
A plurality of battery pieces, wherein the surface of each battery piece is provided with a plurality of grid lines;
The connecting parts are positioned on the surfaces of the battery pieces and are respectively connected with adjacent battery pieces, and the parts positioned on the grid lines are in contact connection with the adjacent parts of the grid lines;
The packaging layer covers the surface of the battery piece and the surface of the connecting part, and the packaging layer at least comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially distributed along the direction far away from the battery piece, wherein the fluidity of the third packaging layer, the fluidity of the second packaging layer and the fluidity of the first packaging layer are sequentially reduced, and the fluidity of the first packaging layer is small enough to avoid the first packaging layer from flowing between the connecting part and the grid line.
2. The photovoltaic module of claim 1, wherein the ratio of the ML value of the first encapsulant layer to the ML value of the second encapsulant layer is 1.1-3, the ML value being the lowest torque in the curing curve of the adhesive film.
3. The photovoltaic module according to claim 1 or 2, wherein the ratio of the ML value of the second encapsulation layer to the ML value of the third encapsulation layer is 1.1-4, the ML value being the lowest torque in the film vulcanization curve.
4. The photovoltaic module according to claim 1 or 2, wherein the ML value of the first encapsulation layer is 0.4 dN-m to 0.85 dN-m and/or the ML value of the second encapsulation layer is 0.3 dN-m to 0.4 dN-m, the ML value being the lowest torque in the glue film vulcanization curve.
5. The photovoltaic module of claim 1, wherein the ML value of the third encapsulant layer is 0.1 dN-m to 0.3 dN-m, and ML value is the lowest torque in the curing curve of the adhesive film.
6. The photovoltaic module of claim 1, further comprising: and the glue point is positioned between part of the battery piece and the connecting part, and is positioned on the surface of the battery piece outside the grid line.
7. The photovoltaic assembly of claim 1, wherein the first, second, and third encapsulation layers are an integrally formed structure.
8. The photovoltaic module according to claim 1, wherein a ratio of a thickness of the first encapsulation layer to a maximum thickness of the connection member in a direction in which the battery sheet is directed toward the encapsulation layer is 0.4 to 1.
9. The photovoltaic module of claim 1, wherein a ratio of a thickness of the first encapsulant layer to a thickness of the second encapsulant layer in a direction in which the cell sheet is directed toward the encapsulant layer is 1 to 4.
10. The photovoltaic module according to claim 1 or 9, wherein a ratio of a thickness of the second encapsulation layer to a thickness of the third encapsulation layer in a direction in which the cell sheet is directed toward the encapsulation layer is 0.2 to 0.7.
11. The photovoltaic module of claim 1, wherein the material of the first encapsulant layer, the material of the second encapsulant layer, and the material of the third encapsulant layer are the same.
12. A method of manufacturing a photovoltaic module, comprising:
providing a plurality of battery pieces, wherein the surface of each battery piece is provided with a plurality of grid lines;
a connecting component is arranged on the surface of the battery piece;
Arranging a packaging layer on the surface of the battery piece, wherein the packaging layer is positioned on one side of the connecting part far away from the battery piece, and the packaging layer comprises a first packaging layer, a second packaging layer and a third packaging layer which are sequentially arranged along the direction far away from the battery piece;
Laminating the battery piece, the connecting component and the packaging layer at a preset temperature to enable the connecting component positioned above the grid line to be in contact connection with the adjacent grid line and enable the battery piece to be fixed with the packaging layer;
The mobility of the third packaging layer at the preset temperature, the mobility of the second packaging layer at the preset temperature and the mobility of the first packaging layer at the preset temperature are sequentially reduced, and the mobility of the first packaging layer is small enough to avoid the first packaging layer flowing between the connecting component and the grid line.
13. The method of manufacturing a photovoltaic module according to claim 12, wherein providing the connection member further comprises: and forming glue points, wherein the glue points are positioned between part of the battery pieces and the connecting parts, and the glue points are positioned on the surfaces of the battery pieces outside the grid lines.
CN202310111863.5A 2023-01-16 2023-01-16 Photovoltaic module and preparation method thereof Active CN116207172B (en)

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CN202410414572.8A CN118315456A (en) 2023-01-16 2023-01-16 Photovoltaic module and preparation method thereof
US18/309,703 US20240243210A1 (en) 2023-01-16 2023-04-28 Photovoltaic module and method for manufacturing photovoltaic module
AU2023202896A AU2023202896B1 (en) 2023-01-16 2023-05-09 Photovoltaic module and method for manufacturing photovoltaic module
DE202023102519.6U DE202023102519U1 (en) 2023-01-16 2023-05-09 photovoltaic module
NL2034791A NL2034791A (en) 2023-01-16 2023-05-10 Photovoltaic module and method for manufacturing photovoltaic module
EP23172558.1A EP4401151A1 (en) 2023-01-16 2023-05-10 Photovoltaic module and method for manufacturing photovoltaic module
KR1020230093426A KR20230116750A (en) 2023-01-16 2023-07-18 Photovoltaic module and preparation method thereof
JP2024079320A JP2024105554A (en) 2023-01-16 2024-05-15 Photovoltaic module and method of manufacturing same

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CN108419433A (en) * 2015-11-06 2018-08-17 梅耶博格瑞士股份公司 Polymer conductor plate, solar cell and its production method
CN112289879A (en) * 2020-10-28 2021-01-29 东方日升（常州）新能源有限公司 Photovoltaic packaging adhesive film, photovoltaic module and preparation method thereof
CN114975660A (en) * 2022-06-04 2022-08-30 骥志(江苏)新能源科技有限公司 Light-weight laminated photovoltaic module based on ultrathin toughened glass
WO2022222628A1 (en) * 2021-04-23 2022-10-27 通威太阳能（合肥）有限公司 Single cell, packaging film, solar cell module and manufacturing method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419433A (en) * 2015-11-06 2018-08-17 梅耶博格瑞士股份公司 Polymer conductor plate, solar cell and its production method
CN112289879A (en) * 2020-10-28 2021-01-29 东方日升（常州）新能源有限公司 Photovoltaic packaging adhesive film, photovoltaic module and preparation method thereof
WO2022222628A1 (en) * 2021-04-23 2022-10-27 通威太阳能（合肥）有限公司 Single cell, packaging film, solar cell module and manufacturing method therefor
CN114975660A (en) * 2022-06-04 2022-08-30 骥志(江苏)新能源科技有限公司 Light-weight laminated photovoltaic module based on ultrathin toughened glass

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