CN116207103A - Array substrate, display panel and display device - Google Patents
Array substrate, display panel and display device Download PDFInfo
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- CN116207103A CN116207103A CN202211384310.9A CN202211384310A CN116207103A CN 116207103 A CN116207103 A CN 116207103A CN 202211384310 A CN202211384310 A CN 202211384310A CN 116207103 A CN116207103 A CN 116207103A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The application provides an array substrate, a display panel and a display device, wherein the array substrate comprises a display area and a bending area connected with the display area, and the array substrate comprises a substrate, a functional device layer, a first insulating layer and a barrier layer. The functional device layer is arranged on one side of the substrate in the thickness direction of the substrate, and comprises a functional piece and a signal wire, wherein the signal wire is electrically connected with the functional piece and extends from the display area to the bending area. The first insulating layer is arranged on one side of the functional device layer, which is away from the substrate in the thickness direction, and covers the functional piece and the signal line. At least part of the barrier layer is arranged in the display area, and the orthographic projection on the substrate covers the part of the signal line located in the bending area. According to the embodiment of the application, electromagnetic wave interference emitted by the bending area can be weakened, so that the overall radio frequency influence is reduced.
Description
Technical Field
The application relates to the technical field of display, in particular to an array substrate, a display panel and a display device.
Background
With the advent of the 5G era, the requirement of the display device on the radio frequency is higher, and each component in the display device is developing in the direction of reducing electromagnetic wave interference, so as to reduce the influence of each component in the display device on the radio frequency.
However, in the conventional components of the display device, such as the array substrate, a plurality of signal traces are generally disposed on the bending region, and electromagnetic wave leakage often occurs when signals are input to the display region through the signal traces, so that the array substrate is often subjected to electromagnetic interference (Electromagnetic Interferencce, EMI), and the display device is subjected to serious electromagnetic wave interference.
Disclosure of Invention
The embodiment of the application provides an array substrate, a display panel and a display device, which can weaken electromagnetic wave interference emitted by a bending area, thereby reducing overall radio frequency influence.
In one aspect, an embodiment of the application provides an array substrate, which includes a display area and a bending area connected with the display area, wherein the array substrate includes a substrate, a functional device layer, a first insulating layer and a barrier layer. A substrate; the functional device layer is arranged on one side of the substrate in the thickness direction of the substrate, and comprises a functional piece and a signal wire, wherein the signal wire is electrically connected with the functional piece and extends from the display area to the bending area; the first insulating layer is arranged on one side of the functional device layer, which is away from the substrate in the thickness direction, and covers the functional piece and the signal line; and the barrier layer is at least partially arranged in the display area, and the orthographic projection on the substrate covers the part of the signal line positioned in the bending area.
On the other hand, the embodiment of the application also provides a display panel, which comprises the array substrate of the first aspect.
On the other hand, the embodiment of the application also provides a display device, which comprises the display panel of the second aspect.
According to the array substrate, the display panel and the display device, the blocking layer is arranged, orthographic projection of the blocking layer on the substrate is arranged to cover the signal line located in the bending area, electromagnetic wave radiation emitted by the signal line in the bending area can be blocked by the blocking layer, electromagnetic wave interference emitted by the bending area is reduced, and accordingly the whole radio frequency influence of the array substrate is reduced. And at least part of the barrier layer is arranged in the display area, so that the situation that the barrier layer cannot completely cover the signal wires in the bending area due to bending and stretching is avoided when the bending process is carried out, the effectiveness of shielding electromagnetic wave interference in the bending area by the barrier layer is ensured, and the reliability of the array substrate is improved.
Drawings
Features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 1 is a top view of an array substrate according to an embodiment of the present disclosure;
FIG. 2 is a partial cross-sectional view of an array substrate according to an embodiment of the present application;
FIG. 3 is a top view of another array substrate according to an embodiment of the present disclosure;
FIG. 4 is a top view of a barrier layer in an array substrate according to an embodiment of the present disclosure;
FIG. 5 is a partial cross-sectional view of another array substrate provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present application.
Marking:
100-an array substrate; AA 1-display area; AA 2-fold region; AA 3-peripheral region;
10-a substrate; 20-a functional device layer; 21-signal lines; 30-a first insulating layer; 40-a barrier layer; 41-through holes;
50-grounding wire; 60-a second insulating layer; d-barrier layer 40 exceeds the length of inflection zone AA 2;
x-thickness direction; y-length direction.
In the drawings, like parts are designated with like reference numerals. The figures are not drawn to scale.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative of the application and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.
It is noted that in this application relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
With the advent of the 5G era, the requirement of the display device on the radio frequency is higher, and each component in the display device is developing in the direction of reducing electromagnetic wave interference, so as to reduce the influence of each component in the display device on the radio frequency.
In a display device, for example, an array substrate, a plurality of signal traces are typically disposed on a bending region of the array substrate, and electromagnetic wave leakage often occurs when signals are input to the display region through the signal traces, so that the array substrate is often subjected to electromagnetic interference (Electromagnetic Interferencce, EMI), which results in serious electromagnetic wave interference to the display device.
In order to weaken electromagnetic wave interference and reduce the influence of the radio frequency of the whole machine and improve the user's visual experience, the applicant research finds that the electromagnetic wave generated by the signal wiring on the bending area can be weakened from the angle of improving the structure of the array substrate.
Embodiments of an array substrate, a display panel, and a display device will be described below with reference to fig. 1 to 7.
Referring to fig. 1 and 2, an array substrate 100 is provided, which includes a display area AA1 and a bending area AA2 connected to the display area AA1, and the array substrate 100 includes a substrate 10, a functional device layer 20, a first insulating layer 30 and a barrier layer 40. The functional device layer 20 is disposed on one side of the substrate 10 in the thickness direction X, and the functional device layer 20 includes a functional element and a signal line 21, where the signal line 21 is electrically connected to the functional element and extends from the display area AA1 to the bending area AA2. The first insulating layer 30 is provided on the side of the functional device layer 20 facing away from the substrate 10 in the thickness direction X and covers the functional elements and the signal lines 21. At least a portion of the barrier layer 40 is disposed in the display area AA1, and the orthographic projection on the substrate 10 covers a portion of the signal line 21 located in the inflection area AA2.
According to the array substrate 100 provided by the embodiment of the application, the blocking layer 40 is arranged and the orthographic projection of the blocking layer on the substrate 10 is arranged to cover the signal line 21 in the bending area AA2, so that electromagnetic wave radiation emitted by the signal line 21 in the bending area AA2 can be blocked by the blocking layer 40, electromagnetic wave interference emitted by the bending area AA2 is reduced, and the whole radio frequency influence of the array substrate 100 is reduced. In addition, at least part of the barrier layer 40 is disposed in the display area AA1, so that when the bending process is performed on the array substrate 100, it is beneficial to avoid that the barrier layer 40 cannot completely cover the signal line 21 in the bending area AA2 due to bending and stretching, and ensure that the barrier layer 40 can shield the effectiveness of electromagnetic wave influence of the bending area AA2, thereby ensuring that the signal line 21 in the bending area AA2 cannot interfere with the external electromagnetic wave, and further improving the stability and reliability of the array substrate 100.
It can be understood that, when the array substrate 100 is manufactured by a bending process, the signal lines 20 in the bending area AA2 are easily exposed out of the barrier layer 40 during bending and stretching, that is, the barrier layer 40 is easily unable to completely cover the signal lines 20 in the bending area AA2 during bending and stretching. Therefore, the barrier layer 20 is disposed at least partially on the display area AA1, and when the array substrate 100 is folded or after being folded, at least a portion of the barrier layer 20 is located on the display area AA1, so that the front projection on the substrate 10 of the barrier layer 20 can still cover the portion of the signal line 21 located in the folded area AA2. Or, when the array substrate 100 is in the bending process or after bending, the display area AA1 has no barrier layer 20, i.e. the barrier layer 20 is located in the bending area AA2, so that the orthographic projection on the substrate 10 of the barrier layer 20 can cover the portion of the signal line 21 located in the bending area AA2, so as to ensure the effectiveness of shielding electromagnetic wave influence of the bending area AA2 by the barrier layer 40, and facilitate reducing electromagnetic wave interference emitted by the bending area AA2, thereby reducing the overall radio frequency influence of the array substrate 100.
Alternatively, the material of the substrate 10 may include glass, quartz, sapphire (sapphire), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (polyethy lene terephthalate, PET), rubber, fiberglass, ceramic, other suitable materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, substrate 10 may comprise a metal-glass fiber composite board, a metal-ceramic composite board or printed circuit board (printed circuit board, PCB), a flexible circuit board (flexible printed circuit, FPC), or the like, and is not limited thereto.
The functional device layer 20 is disposed on one side of the substrate 10 in the thickness direction X, and the functional device layer 20 includes functional components and signal lines 21, alternatively, the functional components may be disposed in the display area AA1 in a patterned distribution structure, and the functional device layer 20 may be made of conductive metal materials such as aluminum, copper, or molybdenum.
Optionally, the number of the functional pieces can be multiple, and the functional pieces are arranged in an insulating manner, so that the problem of electric connection interference is avoided, and the reliability is improved.
Alternatively, the functional element may include a gate line for supplying the scan signal, a data line for supplying the data signal, a common power line for supplying the common voltage signal, and the like.
Optionally, the number of the signal lines 21 is plural, and the plurality of signal lines 21 are electrically connected to the corresponding functional elements and extend to the bending area AA2.
The first insulating layer 30 is disposed on a side of the functional device layer 20 facing away from the substrate 10 in the thickness direction X and covers one side of the functional device and the signal line 21, so as to insulate the functional device and the signal line 21 in the functional device layer 20 and prevent electrical connection interference relationship with other layer structures.
Optionally, the first insulating layer 30 may be a first planarization layer, so that it can not only achieve an insulating effect, but also fill in the gap of the array substrate 100 to planarize the array substrate 100, thereby ensuring the flatness of the array substrate 100 and improving the manufacturing quality of the array substrate 100.
Optionally, the first planarization layer may include: general purpose polymers such as Benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (Hexamethyl Disiloxane, HMDSO), polymethyl methacrylate (polymethyl methacrylate, PMMA) or Polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoro polymers, p-xylene polymers, vinyl alcohol polymers and blends thereof.
Alternatively, the first planarization layer may further include an inorganic material, and may include, for example, silicon oxide (SiO 2), silicon nitride (SiNx), silicon oxynitride (SiON)), aluminum oxide (Al 2O 3), titanium oxide (TiO 2), tantalum oxide (Ta 2O 5), hafnium oxide (HfO 2), or zinc oxide (ZnO 2).
It is to be understood that in the case where the first planarization layer includes an inorganic material, chemical planarization polishing may be performed as the case may be, and the first planarization layer may also include both an organic material and an inorganic material.
Referring to fig. 2 and 3, the array substrate 100 may further include a bonding area AA4, wherein the display area AA1 and the bonding area AA4 are connected by a bending area AA2, wherein the bonding area AA4 belongs to a non-display area, and can be bent under the display area AA1 by the bending area AA2, i.e. the back surface of the display area AA 1. During the manufacturing process, the bending area AA2 of the array substrate 100 is subjected to bending processing, so that the binding area AA4 is located at the back of the display area AA 1.
A flexible circuit board (FPC) and a driving chip (IC) are generally bonded to the bonding area AA4 of the array substrate 100, and circuit components, signal lines 21 extending from the display area AA1 to the bonding area AA4 through the bending area AA2, and the like are disposed on the flexible circuit board.
In some alternative embodiments, at least a portion of the barrier layer 40 is disposed in the bonding area AA4 and the display area AA1, and the front projection of the barrier layer 40 on the substrate 10 covers the signal line 21 in the bending area AA2.
By the arrangement, the situation that the blocking layer 40 cannot completely cover the signal wires 21 in the bending area AA2 due to bending and stretching is avoided, the effectiveness of the blocking layer 40 in shielding electromagnetic wave influence is guaranteed, the effectiveness that the signal wires 21 in the bending area AA2 cannot interfere with the external is guaranteed, and the reliability of the array substrate 100 is improved.
Alternatively, the first insulating layer 30 may be disposed in the display area AA1 and the bending area AA2, and of course, may also be disposed in the binding area AA 4.
Alternatively, the signal lines 2 may extend to the bonding area AA4 through the bending area AA2, and the plurality of signal lines 21 are bonded in the bonding area AA4 to form the back surface of the display area AA 1.
As an alternative embodiment, the thickness of the barrier layer 40 is equal to or less than the thickness of the functional device layer 20 in the thickness direction X.
By this arrangement, the shielding effect of the barrier layer 40 against the electromagnetic waves of the signal line 21 in the inflection region AA2 is facilitated to be better improved, and the barrier layer 40 is enabled to be better added on the inflection region AA2.
Alternatively, the thickness of the barrier layer 40 may be smaller than that of the functional device layer 20, and by this arrangement, the effect on the thickness of the entire array substrate 100 is small while shielding electromagnetic interference can be achieved. Of course, the thickness of the barrier layer 40 may also be set equal to the thickness of the functional device layer 20, so as to better shield the electromagnetic interference and reduce the radio frequency influence of the array substrate 100.
As an alternative embodiment, the material of the barrier layer 40 is the same as the material of the functional device layer 20.
In this way, the barrier layer 40 is provided so as to shield electromagnetic waves emitted from the signal line 21 of the functional device layer 20 in the inflection region AA2.
Alternatively, the barrier layer 40 may be made of conductive metal such as aluminum, copper, or molybdenum.
Alternatively, the barrier layer 40 may further include Indium Tin Oxide (ITO), i.e., the barrier layer 40 may be referred to as an ITO thin film.
Specifically, the ITO thin film has low resistivity and good conductivity of a semiconductor. The ITO film is used as the barrier layer 40 to shield electromagnetic interference emitted from the signal line 21 of the bending area AA2 of the array substrate 100. In addition, the ITO film has excellent performance, high mechanical hardness and good chemical stability, and is suitable for being applied to electronic equipment such as the array substrate 100.
Referring to fig. 2 to 4, as an alternative embodiment, the barrier layer 40 is a continuous film layer with a whole structure and has a plurality of hollowed-out areas in the thickness direction X.
Because the volume of the bending area AA2 is limited, the blocking layer 40 is formed by a continuous whole-layer film layer and has a plurality of hollowed-out areas in the thickness direction X, so that the blocking layer 40 can be better added on the bending area AA2 to shield electromagnetic wave interference emitted by the signal line 21 in the bending area AA2.
In the embodiment of the present application, the "continuous whole-layer structure film layer" refers to a layer structure in which the barrier layer 40 is a layer structure connected to each other, and has a plurality of hollowed-out areas in the thickness direction X, that is, the barrier layer 40 may include a plurality of hollowed-out areas that are disposed along the thickness direction X and are beneficial to improving the tensile force.
In the process of manufacturing, a whole surface of the barrier layer 40 can be manufactured first, and then a plurality of hollowed-out areas can be manufactured and processed at corresponding positions. Through the arrangement, the manufacturing process can be simplified, and the manufacturing efficiency can be improved.
Alternatively, the hollowed-out area may be one of a circle, a lumbar circle, a rectangle, or other patterns, which is not limited in this application.
As an alternative embodiment, the hollowed-out area includes a through hole 41 penetrating along the thickness direction X, and the orthographic projection of the barrier layer 40 in the thickness direction X is a diamond grid structure.
The orthographic projection of the barrier layer 40 in the thickness direction X is in a diamond grid shape, that is, the hollowed-out area of the barrier layer 40 may include a plurality of diamond holes formed along the thickness direction X, which is beneficial to improving the tensile force.
Through setting the through holes 41 to be diamond-shaped holes, the stretching force of the barrier layer 40 is improved, and when the array substrate 100 is manufactured by a bending process, the phenomenon of breakage or even failure caused by insufficient stretching force can be avoided, so that the effectiveness of the barrier layer 40 is ensured, and electromagnetic wave interference emitted by the signal line 20 in the bending area AA2 can be shielded.
In the process of manufacturing, a whole surface of the barrier layer 40 may be manufactured first, and then a plurality of diamond holes may be formed at corresponding positions. Through the arrangement, the manufacturing process can be simplified, and the manufacturing efficiency can be improved.
Alternatively, in the unstretched state of the barrier layer 40, the diamond-shaped holes may be set to have a length dimension in the length direction Y of the substrate 10 smaller than a length dimension in the width direction Z of the substrate 10, so that the diamond-shaped holes of the barrier layer 40 have a larger deformability when stretched, which is beneficial to improving the stretching ability of the barrier layer 40, preventing breakage or even failure thereof, and ensuring that the signal lines 21 are always covered in the bending area AA2. The length direction Y of the substrate 10 is the direction from the display area AA1 to the bending area AA2 or the direction from the bending area AA2 to the display area AA 1.
Optionally, the plurality of diamond holes are distributed in an array on the barrier layer 40, so that each part of the barrier layer 40 can be uniformly stretched in a stretched state, and breakage or failure caused by uneven stress at a certain place is avoided.
With continued reference to fig. 2 and 3, as an alternative embodiment, the array substrate 100 includes a peripheral area AA3 disposed around the display area AA1, the peripheral area AA3 is provided with a ground line 50, and the ground line 50 is connected to the barrier layer 40 through a via 41.
By connecting the blocking layer 40 with the ground line 50, the charges accumulated on the blocking layer 40 are eliminated, so that electromagnetic interference generated by the signal line 21 located on the bending area AA2 is completely shielded, and the radio frequency influence of the whole array substrate 100 is reduced.
Specifically, when the blocking layer 40 shields the electromagnetic wave generated by the signal line 21 on the bending area AA2, a certain amount of charge may be accumulated on itself, if the charge is not eliminated, the blocking layer 40 is easy to fail or cause a safety problem, so that the blocking layer 40 is connected to the ground line 50, which is beneficial to eliminating the accumulated charge on the blocking layer 40, thereby ensuring that the electromagnetic wave interference generated by the bending area is reduced, and further reducing the overall radio frequency influence.
Alternatively, the ground line 50 may be a closed line surrounding the display area AA1 on the peripheral area AA 3. Alternatively, the ground line 50 may be provided in a continuous structure, but may be provided in sections on the peripheral area AA 3.
Alternatively, the ground line 50 may be provided in the same layer as the functional device layer 20. Of course, the ground line 50 may also be provided in a different layer from the functional device layer 20.
Optionally, the ground wire 50 is electrically connected to the barrier layer 40 through the via 41, which is beneficial to simplifying the manufacturing process and improving the manufacturing efficiency.
As an alternative embodiment, the front projection of the barrier layer 40 in the thickness direction X covers the bending area AA2, and the length d of the barrier layer 40 beyond the bending area AA2 along the length direction Y of the substrate 10 satisfies: : d is more than 0 and less than or equal to 1mm.
By this arrangement, the barrier layer 40 of the bending area AA2 still can completely cover the signal line 21 of the bending area AA2 after bending, so as to reduce electromagnetic interference emitted by the bending area AA2.
It will be appreciated that, during the manufacturing process, the barrier layer 40 may be tiled above the functional device layer 20, and when the bending process is performed on the bending area AA2, the barrier layer 40 will be stretched, so that the length d of the barrier layer 40 beyond the bending area AA2 is set between 0 and 1mm, which is beneficial to ensuring that the situation that the barrier layer 40 cannot completely cover the bending area AA2 after stretching is avoided, and therefore, through the above setting, the situation that the barrier layer 40 cannot completely cover the bending area AA2 after stretching can be further avoided, which is beneficial to improving the shielding effect.
If the barrier layer 40 is excessively long in the portion where the barrier layer 40 is disposed on the display area AA1 in the length direction Y, the barrier layer 40 may affect or affect the thickness of the display area AA 1.
Optionally, the length d of the barrier layer 40 beyond the bending area AA2 at one end in the length direction Y may be set to any value between 0 and 1mm, including an end point value of 1mm, which is beneficial to ensuring the shielding effect of the barrier layer 40 on electromagnetic waves, and reducing the use cost of the barrier layer 40. Illustratively, the length d may be selected to be 1mm, 0.8mm, etc.
Optionally, the length of the barrier layer 40 beyond the bending area AA2 at one end in the length direction Y is set to any value between 0 and 1mm, including one end value of 1mm, i.e., the barrier layer 40 having 1mm or less in the length direction Y is located on the binding area AA 4.
Alternatively, the length of the barrier layer 40 located on the display area AA1 and the length of the barrier layer located on the binding area AA4 may be the same along the length direction Y, which is not limited in this application.
With continued reference to fig. 2, alternatively, the barrier layer 40 may be located in the first insulating layer 30, specifically, during manufacturing, the first insulating layer 30 is disposed on the functional device layer 20, and a certain flatness is ensured between the first insulating layer 30 and the functional device layer 20, that is, a certain flatness is ensured below the first insulating layer 30, then the barrier layer 40 is disposed at a corresponding position on the first insulating layer 30, and finally, a layer of the first insulating layer 30 is disposed above the barrier layer 40 and above the first insulating layer 30 for laying the barrier layer 40, and a certain flatness is ensured below the barrier layer 40, so that the barrier layer 40 may be inlaid inside the first insulating layer 30, thereby preventing the electrical connection interference problem with other layer structures.
Referring to fig. 5, as an alternative embodiment, the array substrate 100 further includes a second insulating layer 60, where the second insulating layer 60 is disposed on a side of the barrier layer 40 away from the functional device layer 20.
By this arrangement, the barrier layer 40 and other layer structures are prevented from being electrically connected and disturbed, and the safety and reliability of the array substrate 100 are ensured.
Optionally, the barrier layer 40 may be located on a side of the first insulating layer 30 facing away from the substrate 10 in the thickness direction X, specifically, during manufacturing, the first insulating layer 30 is disposed on the functional device layer 20, and a certain flatness of the first insulating layer 30 between the functional device layers 20 is ensured, that is, a certain flatness of the lower portion of the first insulating layer 30 is ensured, then the barrier layer 40 is disposed at a corresponding position on the first insulating layer 30, and finally, a second insulating layer 60 is disposed above the barrier layer 40, and a certain flatness of the lower portion of the second insulating layer 60 is ensured, so that the barrier layer 40 may be clamped between the first insulating layer 30 and the second insulating layer 60, so as to prevent the barrier layer 40 from generating electrical connection interference problem with other layer structures.
Alternatively, the length dimension of the second insulating layer 60 may be greater than the length dimension of the barrier layer 40 along the length direction Y, and of course, the length dimension of the second insulating layer 60 may also be set to be the same as the length dimension of the barrier layer 40, that is, the second insulating layer 60 just covers the barrier layer 40.
Optionally, in order to improve the insulation effect and to ensure the flatness requirements, a further first insulation layer 30 may be provided on the side of the second insulation layer 60 facing away from the functional device layer 20.
Alternatively, the materials of the second insulating layer 60 and the first insulating layer 30 may be the same, but may be different, so long as the insulating properties are ensured.
Optionally, the second insulating layer 60 may be a second flat layer, so that it can not only achieve an insulating effect, but also ensure the flatness of the array substrate 100, and improve the manufacturing quality of the array substrate 100.
In a second aspect, referring to fig. 6, a display panel is further provided according to an embodiment of the present application, including any one of the array substrates 100 described above.
Because the array substrate 100 provided in this embodiment of the present application has the characteristics of reducing the electromagnetic interference emitted by the bending area AA2 and reducing the overall radio frequency influence, so that the display panel using this array substrate 100 can reduce the radio frequency influence of its whole to the external environment, thereby improving the stability and reliability of the display panel and improving the visual and feel requirements of the user.
The display panel provided in the embodiment of the application includes an array substrate 100. The display panel further includes a light emitting layer 200 disposed on the array substrate 100 and a cover plate 300, wherein the light emitting layer 200 includes a plurality of light emitting diodes 210, and the driving back plate 100 is used for driving the plurality of light emitting diodes 210 to emit light. The light emitting diode 210 may be used as a light source required for the display panel.
Alternatively, the light emitting diode 210 may include a plurality of light emitting diodes 210 of different colors, such as a red light emitting diode 210a, a green light emitting diode 210b, and a blue light emitting diode 210c, capable of emitting primary color light of red, green, blue, and the like, respectively. Of course, the light emitting diodes 210 provided in the embodiments of the present application may also be all configured as light emitting diodes 210 with the same color to emit light with the same color, for example, all light emitting diodes 210 emit light with white or blue, which is not limited in the present application.
Optionally, the cover 300 may be a transparent cover or a color filter substrate, and of course, the cover 300 may also be a thin film package or a protective layer with protection and support effects, and the protective layer has a planarization layer effect, which can be filled in the gap of the display panel to planarize the surface of the display panel, and can also avoid moisture interference to achieve the protection effect.
In a third aspect, referring to fig. 7, a display device is further provided in an embodiment of the present application, including any one of the display panels described above.
Because the display panel provided by the embodiment of the application can weaken the radio frequency influence of the whole display panel to the external environment, the display quality, the usability and the market competitiveness of a display device using the display panel can be improved.
Alternatively, the display device may include a part of elements of a flexible display device (flexible display), a touch display device (touch display), a curved display device (curved display), or a non-rectangular display device (free shape display), but the application is not limited thereto.
Optionally, the display device provided in the embodiment of the present application may be applied to any product or component having a display function, such as a virtual reality device, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a wearable watch, and an internet of things node. Since the principle of the display device for solving the problem is similar to that of the display panel, the implementation of the display device can be referred to the embodiment of the display panel, and the repetition is omitted.
Although the embodiments disclosed in the present application are described above, the descriptions are merely embodiments adopted for the purpose of facilitating understanding of the present application, and are not intended to limit the present invention. Any person skilled in the art to which this application pertains will be able to make any modifications and variations in form and detail of implementation without departing from the spirit and scope of the disclosure, but the scope of protection of this application shall be subject to the scope of the claims that follow.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, substitution of other connection manners described above may refer to corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, which are intended to be included in the scope of the present application.
Claims (10)
1. An array substrate, including display area and with the bending zone that the display area is connected, its characterized in that, array substrate includes:
a substrate;
the functional device layer is arranged on one side of the substrate in the thickness direction of the substrate, and comprises a functional piece and a signal wire, wherein the signal wire is electrically connected with the functional piece and extends from the display area to the bending area;
the first insulating layer is arranged on one side of the functional device layer, which is away from the substrate in the thickness direction, and covers the functional piece and the signal line;
and the barrier layer is at least partially arranged in the display area, and the orthographic projection on the substrate covers the part of the signal line positioned in the bending area.
2. The array substrate according to claim 1, wherein a thickness of the barrier layer is equal to or less than a thickness of the functional device layer in the thickness direction.
3. The array substrate of claim 1, wherein the material of the barrier layer is the same as the material of the functional device layer.
4. The array substrate according to claim 1, wherein the barrier layer is a continuous whole-layer structure film layer and has a plurality of hollowed-out areas in the thickness direction.
5. The array substrate of claim 4, wherein the hollowed-out area comprises a through hole penetrating along the thickness direction, and the orthographic projection of the barrier layer on the thickness direction is a diamond grid structure.
6. The array substrate according to claim 5, wherein the array substrate includes a peripheral region disposed around the display region, the peripheral region being provided with a ground line, the ground line being connected to the barrier layer through the via hole.
7. The array substrate of claim 1, wherein the orthographic projection of the barrier layer in the thickness direction covers the bending region, and a length d of the barrier layer beyond the bending region along the length direction of the substrate satisfies: d is more than 0 and less than or equal to 1mm.
8. The array substrate of claim 1, further comprising a second insulating layer disposed on a side of the barrier layer facing away from the functional device layer.
9. A display panel comprising an array substrate according to any one of claims 1 to 8.
10. A display device comprising the display panel according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211384310.9A CN116207103A (en) | 2022-11-07 | 2022-11-07 | Array substrate, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211384310.9A CN116207103A (en) | 2022-11-07 | 2022-11-07 | Array substrate, display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116207103A true CN116207103A (en) | 2023-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211384310.9A Pending CN116207103A (en) | 2022-11-07 | 2022-11-07 | Array substrate, display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116207103A (en) |
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2022
- 2022-11-07 CN CN202211384310.9A patent/CN116207103A/en active Pending
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