CN116200724A - Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment - Google Patents

Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment Download PDF

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Publication number
CN116200724A
CN116200724A CN202111457665.1A CN202111457665A CN116200724A CN 116200724 A CN116200724 A CN 116200724A CN 202111457665 A CN202111457665 A CN 202111457665A CN 116200724 A CN116200724 A CN 116200724A
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China
Prior art keywords
pipeline
liquid
distribution box
control valve
source
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Pending
Application number
CN202111457665.1A
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Chinese (zh)
Inventor
李宰赫
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Chengdu Gaozhen Technology Co ltd
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Chengdu Gaozhen Technology Co ltd
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Priority to CN202111457665.1A priority Critical patent/CN116200724A/en
Publication of CN116200724A publication Critical patent/CN116200724A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/08—Pipe-line systems for liquids or viscous products
    • F17D1/14—Conveying liquids or viscous products by pumping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a device and a method for improving condensation of a liquid source in a semiconductor process and semiconductor equipment. The device comprises a liquid source supply system, a distribution box and a liquid conveying system which are sequentially communicated, wherein a pipeline for liquid circulation and a control valve for controlling the liquid circulation are arranged among the liquid source supply system, the distribution box and the liquid conveying system, a first pipeline is arranged between the distribution box and the liquid conveying system, the first pipeline is connected with a pump system, and a first control valve is arranged on the first pipeline. Through setting up first pipeline between distribution box and liquid conveying system to equipment pump system and first pipeline are connected, thereby can pump residual thick liquid from the pipeline as required, thereby eliminate the condensation, avoid blockking up the pipeline, eliminate the influence to liquid conveying system's life, also ensure follow-up thick liquids and carry smoothly, and also can not take place the thick liquids leakage when maintenance change liquid conveying system, ensure environmental security.

Description

Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment
Technical Field
The invention relates to the technical field of semiconductor preparation, in particular to a device and a method for improving liquid source condensation in a semiconductor process and semiconductor equipment.
Background
In a semiconductor process, such as chemical vapor deposition, a slurry is used, and the slurry is delivered to a liquid delivery system by a liquid distribution box and then is distributed into a chemical deposition chamber by the liquid delivery system for vapor deposition. When the slurry at the rear end of the liquid conveying system flows and enters the chemical deposition chamber to react, the slurry remained at the front end of the liquid conveying system is condensed together due to no flow, so that the pipeline is blocked in time, the service life of the liquid conveying system is influenced, the conveying of the subsequent slurry is influenced, and the slurry is leaked during maintenance and replacement of the liquid conveying system, thereby causing environmental safety problems.
Disclosure of Invention
The invention aims to solve the technical problems that liquid is reserved in a pipeline at the front end of a liquid distribution system in the existing semiconductor preparation process, the pipeline is blocked due to liquid condensation, the service life of the system is influenced, and the environment safety problem caused by system replacement is solved.
The invention is realized by the following technical scheme:
the first object of the invention is to provide a device for improving condensation of a liquid source in a semiconductor process, which comprises a liquid source supply system, a distribution box and a liquid conveying system which are sequentially communicated, wherein a pipeline for liquid circulation and a control valve for controlling the liquid circulation are arranged among the liquid source supply system, the distribution box and the liquid conveying system, a first pipeline is arranged between the distribution box and the liquid conveying system, the first pipeline is connected with a pump system, and a first control valve is arranged on the first pipeline.
Optionally, a second pipeline is further arranged between the distribution box and the liquid conveying system, the tail end of the second pipeline is connected with a first cleaning air source system for injecting air into the second pipeline, a second control valve is arranged on the second pipeline, and the first pipeline is communicated with the second pipeline.
Optionally, a third control valve and a detection valve are arranged on the first pipeline at a position between the first control valve and the pump system.
Optionally, the device further comprises a processing chamber, wherein the processing chamber is connected with the liquid conveying system, the processing chamber is connected with the pump system through a third pipeline, and a high vacuum control valve is arranged on the third pipeline.
Optionally, an end of the first pipeline is connected to the third pipeline.
Optionally, a second purge gas source system and a corresponding control valve are connected to the line between the liquid delivery system and the process chamber.
A second object of the present invention is to provide a method for improving condensation of a liquid source in a semiconductor process by pumping and purging residual liquid in a pipeline between a distribution box and a liquid delivery system out of the pipeline;
a cleaning pipeline for cleaning and an air extraction pipeline for air extraction are connected to a pipeline between the distribution box and the liquid conveying system, the cleaning pipeline is connected with a pump system, and the air extraction pipeline is connected with a first cleaning air source system;
the pump system sucks residual liquid in a pipeline between the distribution box and the liquid conveying system through the air suction pipeline, and the first cleaning air source system injects cleaning air into the cleaning pipeline to drive the residual liquid in the pipeline between the distribution box and the liquid conveying system to flow.
Optionally, the air extraction pipeline is communicated with the cleaning pipeline, and the cleaning gas injected into the cleaning pipeline by the first cleaning gas source system enters the air extraction pipeline and drives the residual liquid to enter the air extraction pipeline.
Optionally, the air extraction pipeline is a first pipeline, the cleaning pipeline is a second pipeline, the distribution box is connected with a liquid source system, the liquid conveying system is connected with a processing chamber, and the processing chamber is connected with a pump system;
the liquid source system, the distribution box, the liquid conveying system, the treatment chamber and the pump system are provided with control valves on pipelines, a first control valve is arranged on a first pipeline, and a second control valve is arranged on a second pipeline.
It is a third object of the present invention to provide a semiconductor device comprising the above-described means for improving condensation of a liquid source in a semiconductor process.
Compared with the prior art, the invention has the following advantages and beneficial effects:
according to the device and the method for improving the condensation of the liquid source in the semiconductor process, the first pipeline is arranged between the distribution box and the liquid conveying system, and the equipment pump system is connected with the first pipeline, so that residual slurry can be pumped out of the pipeline according to requirements, condensation is eliminated, the pipeline is prevented from being blocked, the influence on the service life of the liquid conveying system is eliminated, the smooth conveying of subsequent slurry is ensured, slurry leakage does not occur during maintenance and replacement of the liquid conveying system, and environmental safety is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings that are needed in the examples will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and that other related drawings may be obtained from these drawings without inventive effort for a person skilled in the art. In the drawings:
fig. 1 is a schematic structural diagram of an apparatus for improving condensation of a liquid source in a semiconductor process according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following examples, for the purpose of making the objects, technical solutions and advantages of the present invention more apparent, and the description thereof is merely illustrative of the present invention and not intended to be limiting.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: no such specific details are necessary to practice the invention. In other instances, well-known structures, materials, or methods have not been described in detail in order to avoid obscuring the present invention.
Throughout the specification, references to "one embodiment," "an embodiment," "one example," or "an example" mean: a particular feature, structure, or characteristic described in connection with the embodiment or example is included within at least one embodiment of the invention. Thus, the appearances of the phrases "in one embodiment," "in an example," or "in an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, or characteristics, may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Moreover, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and that the illustrations are not necessarily drawn to scale. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, the terms "front," "back," "upper," "lower," "inner," "outer," and the like are merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the scope of the present invention.
1. Device for improving condensation of liquid source in semiconductor process
In one embodiment, an apparatus for improving condensation of a liquid source in a semiconductor process includes a liquid source supply system, a distribution box, and a liquid delivery system, which are sequentially connected, wherein a pipeline for liquid circulation and a control valve for controlling liquid circulation are arranged among the liquid source supply system, the distribution box, and the liquid delivery system, a first pipeline PA is arranged between the distribution box and the liquid delivery system, the first pipeline PA is connected with a pump system, and a first control valve V6 is arranged on the first pipeline PA.
Specifically, the liquid source supply system includes a liquid source tank in which the slurry is placed and transported via piping to a distribution box (VMB) and then to a liquid delivery system via the distribution box. A control valve V1 is arranged between the liquid source tank and the distribution system tank, two control valves V2 and V3 are arranged between the distribution tank and the liquid conveying system, wherein the control valve V2 is used for controlling the slurry to flow out of the distribution tank, and the control valve V3 is used for controlling the slurry to enter the liquid conveying system, so that the circulation of the slurry between the distribution tank and the liquid conveying system is controlled. The slurry is fed into the liquid feed system and then fed into the process chamber of the corresponding process. Since the slurry in the pipe between the liquid delivery system and the distribution box is at idle when the slurry is acting in the process chamber, this portion of the slurry is temporarily stored in this section of pipe and is liable to be coagulated. A first pipeline PA is arranged on a pipeline between the distribution box and the liquid conveying system, namely a pipeline between the control valve V2 and the control valve V3, one end of the first pipeline PA, which is far away from the control valves V2 and V3, is connected with a pump system, and the pump system can adopt an air pump type. While a first control valve V6 is arranged on the line between the first line PA and the pump system. Thus, when the slurry remained in the pipeline is at leisure time, the pump system can be started, the first control valve V6 is opened, the residual slurry is pumped out of the pipeline, so that condensation is eliminated, the pipeline is prevented from being blocked, the influence on the service life of the liquid conveying system is eliminated, the smooth conveying of the subsequent slurry is ensured, slurry leakage can not occur during maintenance and replacement of the liquid conveying system, and the environmental safety is ensured.
In an embodiment, a second pipeline PB is further arranged between the distribution box and the liquid conveying system, the tail end of the second pipeline PB is connected with a first cleaning air source system for injecting air into the second pipeline PB, a second control valve V8 is arranged on the second pipeline PB, and the first pipeline PA is communicated with the second pipeline PB.
Specifically, in order to better clear away the slurry remained in the pipeline, a cleaning line is provided, the cleaning line is composed of a first cleaning gas source system, a second pipeline PB and a second control valve V8, the second pipeline PB is connected to the pipeline between the distribution box and the liquid conveying system, namely, is connected between the control valves V2 and V3, the tail end of the second pipeline PB is connected with the first cleaning gas source system, high-pressure gas is arranged in the first cleaning gas source system and used for purging, the high-pressure gas enters the pipeline between the control valves V2 and V3 through the second pipeline PB, and because the control valves V2 and V3 are closed at leisure time, the first pipeline PA is communicated with the second pipeline PB, the gas blows residual liquid into the first pipeline PA, and at the same time, the pump system also works simultaneously to pump the slurry remained on the pipe wall of the first pipeline PA, so that the slurry can be completely cleared from the pipeline between the control valves V2 and V3, and the cleaning in the first pipeline PA can be ensured.
In another embodiment, a third control valve V7 and a detection valve VV1 are provided on the first line PA at a position between the first control valve V6 and the pump system. The third control valve V7 is disposed near the first control valve V6 end, and the detection valve VV1 is controlled far from the first control valve V6 end.
In yet another embodiment, the apparatus further comprises a process chamber, the process chamber is connected to the liquid delivery system, and the process chamber is connected to the pump system via a third line PC, on which a high vacuum control valve VV2 is provided. The slurry is delivered from the liquid delivery system to a process chamber, which may be a deposition chamber for chemical vapor deposition or a corresponding process chamber in other semiconductor processes. After the slurry has acted on the treatment chamber, the waste liquid flows out of the treatment chamber and is pumped out by a pump system.
In a further embodiment, the end of the first line PA is connected to a third line PC. The first pipeline PA is communicated with the third pipeline PC, and the pump system can pump residual slurry out of the first pipeline PA while pumping the waste liquid flowing out of the treatment chamber, so that the service efficiency of the device is improved, the arrangement of components in the device is reduced, the cost is saved, and the occupied space of a field is reduced.
In yet another embodiment, a second purge gas source system and corresponding control valve are connected to the line between the liquid delivery system and the process chamber. A control valve V5 is arranged on a pipeline between the liquid conveying system and the processing chamber, and a control valve V4 is arranged between the second cleaning air source system and the control valve V5. The second cleaning air source system can inject high-pressure air into the pipeline between the liquid conveying system and the processing chamber, and blow the pipeline to avoid the slurry remaining in the pipeline between the liquid conveying system and the processing chamber to cause blockage. The first cleaning air source system and the second cleaning air source system can be respectively arranged or can be a shared system.
In addition, it will be appreciated by those skilled in the art that the apparatus further includes a control system that controls the operation of the various systems, distribution boxes, process chambers, etc. and the various valves in the apparatus.
2. Method for improving condensation of liquid source in semiconductor process
The method for improving the condensation of the liquid source in the semiconductor process based on the device provided by the embodiments above is to suck the liquid remained in the pipeline between the distribution box and the liquid conveying system and blow the liquid out of the pipeline.
Specifically, a cleaning pipeline for cleaning and an air extraction pipeline for air extraction are connected on a pipeline between the distribution box and the liquid conveying system, the cleaning pipeline is connected with the pump system, and the air extraction pipeline is connected with the first cleaning air source system;
the pump system sucks residual liquid in a pipeline between the distribution box and the liquid conveying system through the air suction pipeline, and the first cleaning air source system injects cleaning air into the cleaning pipeline to drive the residual liquid in the pipeline between the distribution box and the liquid conveying system to flow.
The air extraction pipeline is communicated with the cleaning pipeline, and the cleaning gas injected into the cleaning pipeline by the first cleaning gas source system enters the air extraction pipeline and drives residual liquid to enter the air extraction pipeline.
When the slurry remained between the distribution box and the liquid conveying system is in a leisure state, the pump system and the first cleaning air source system can be started, the first cleaning air source system injects high-pressure air into the cleaning pipeline, the high-pressure air drives the residual slurry between the distribution box and the liquid conveying system to enter the air suction pipeline, and the pump system pumps the slurry out; or the pump system is started to pump out residual slurry, and then the first cleaning air source system is started to purge and pump out the slurry; specifically, the method can be performed according to circumstances.
3. Semiconductor device
A semiconductor device comprising the apparatus for improving coagulation of a liquid source in a semiconductor process according to any one of the embodiments of (A) and removing residual slurry by the method of (B).
The process in which the semiconductor device is used should require the use of a slurry or other liquid source, the semiconductor device should include a liquid delivery system, and may also include a vaporization device (e.g., deposition chamber), etc.
Processes, methods, and apparatus not mentioned in the various embodiments of the invention are known in the art. Not described in detail herein.
The foregoing detailed description of the invention has been presented for purposes of illustration and description, and it should be understood that the invention is not limited to the particular embodiments disclosed, but is intended to cover all modifications, equivalents, alternatives, and improvements within the spirit and principles of the invention.

Claims (10)

1. The device for improving the condensation of the liquid source in the semiconductor process is characterized by comprising a liquid source supply system, a distribution box and a liquid conveying system which are sequentially communicated, wherein a pipeline for liquid circulation and a control valve for controlling the liquid circulation are arranged among the liquid source supply system, the distribution box and the liquid conveying system, a first pipeline is arranged between the distribution box and the liquid conveying system, the first pipeline is connected with a pump system, and a first control valve is arranged on the first pipeline.
2. The apparatus for improving condensation of a liquid source in a semiconductor process according to claim 1, wherein a second pipeline is further provided between the distribution box and the liquid delivery system, a first purge gas source system for injecting gas into the second pipeline is connected to a terminal end of the second pipeline, a second control valve is provided on the second pipeline, and the first pipeline is communicated with the second pipeline.
3. The apparatus of claim 2, wherein a third control valve and a check valve are disposed on the first conduit at a location between the first control valve and the pump system.
4. The apparatus for improving condensation of a liquid source in a semiconductor process according to claim 1, further comprising a process chamber, wherein said process chamber is connected to said liquid delivery system, and wherein said process chamber is connected to said pump system via a third conduit, wherein said third conduit is provided with a high vacuum control valve.
5. The apparatus of claim 4, wherein the end of the first conduit is connected to the third conduit.
6. The apparatus of claim 4, wherein a second purge gas source system and corresponding control valve are coupled to the conduit between the liquid delivery system and the process chamber.
7. A method for improving condensation of liquid source in semiconductor process, which is characterized in that residual liquid in a pipeline between a distribution box and a liquid conveying system is pumped and purged out of the pipeline;
a cleaning pipeline for cleaning and an air extraction pipeline for air extraction are connected to a pipeline between the distribution box and the liquid conveying system, the cleaning pipeline is connected with a pump system, and the air extraction pipeline is connected with a first cleaning air source system;
the pump system sucks residual liquid in a pipeline between the distribution box and the liquid conveying system through the air suction pipeline, and the first cleaning air source system injects cleaning air into the cleaning pipeline to drive the residual liquid in the pipeline between the distribution box and the liquid conveying system to flow.
8. The method of claim 7, wherein the pumping line is in communication with the purge line, and the purge gas from the first purge gas source system is injected into the purge line to enter the pumping line and to drive residual liquid into the pumping line.
9. The method of claim 8, wherein the pumping line is a first line and the purge line is a second line, the distribution box is connected to a liquid source system, the liquid delivery system is connected to a process chamber, and the process chamber is connected to a pump system;
the liquid source system, the distribution box, the liquid conveying system, the treatment chamber and the pump system are provided with control valves on pipelines, a first control valve is arranged on a first pipeline, and a second control valve is arranged on a second pipeline.
10. A semiconductor device comprising an apparatus for improving condensation of a liquid source in a semiconductor process according to any one of claims 1 to 6.
CN202111457665.1A 2021-12-01 2021-12-01 Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment Pending CN116200724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111457665.1A CN116200724A (en) 2021-12-01 2021-12-01 Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111457665.1A CN116200724A (en) 2021-12-01 2021-12-01 Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment

Publications (1)

Publication Number Publication Date
CN116200724A true CN116200724A (en) 2023-06-02

Family

ID=86511801

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111457665.1A Pending CN116200724A (en) 2021-12-01 2021-12-01 Device and method for improving condensation of liquid source in semiconductor process and semiconductor equipment

Country Status (1)

Country Link
CN (1) CN116200724A (en)

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