CN116197083A - Welding spot encapsulation device, encapsulation product and encapsulation method - Google Patents
Welding spot encapsulation device, encapsulation product and encapsulation method Download PDFInfo
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- CN116197083A CN116197083A CN202310052271.0A CN202310052271A CN116197083A CN 116197083 A CN116197083 A CN 116197083A CN 202310052271 A CN202310052271 A CN 202310052271A CN 116197083 A CN116197083 A CN 116197083A
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- glue
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- welding spot
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- 238000003466 welding Methods 0.000 title claims abstract description 107
- 238000005538 encapsulation Methods 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 90
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 229920006335 epoxy glue Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000010073 coating (rubber) Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000013035 low temperature curing Methods 0.000 description 4
- 239000011780 sodium chloride Substances 0.000 description 4
- 238000003848 UV Light-Curing Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000012267 brine Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention provides a welding spot encapsulation device, an encapsulation product and an encapsulation method, wherein the device comprises: the device comprises a desktop type manipulator, a bottom plate tool and a dispensing tool, wherein the bottom plate tool and the dispensing tool are arranged on the desktop type manipulator; the dispensing tool comprises a glue bracket, at least one glue pipe arranged on the glue bracket, and a dispensing needle positioned below the glue pipe; the product to be encapsulated is placed and fixed on the bottom plate tool, and the desktop type mechanical arm is used for controlling the dispensing to carry out encapsulation operation aiming at the dispensing position of the product to be encapsulated. By utilizing the invention, the glue coating operation can be accurately carried out on the glue dispensing position of the product, and the completeness and accuracy of the glue coating are ensured.
Description
Technical Field
The invention relates to the technical field of product encapsulation, in particular to a welding spot encapsulation device, an encapsulation product and an encapsulation method.
Background
At present, for waterproof/oil-proof ECM products, insulating treatment is not usually carried OUT at welding points of the product, so that the product does not meet the requirement of energizing work in saline water (the saline water is an electrolyte solution, and the energizing of the product in the saline water can cause short circuit of VDD and OUT ends). It is known that, in order to enable the product to work in brine by electrifying, the welding spot of the input end needs to be coated with insulating glue, but the encapsulation operation on the input end is difficult due to the small distance between the welding spot and the LED lamp and the small distance between the welding spot and the shell, the requirement of the product on encapsulation width, and the like.
For example, in order to meet the requirements of the product encapsulation process, the following conditions are required: (1) glue cannot overflow to the LED lamp, (2) glue cannot overflow to the shell, and (3) the encapsulation consistency meets the requirement; however, the existing encapsulation method cannot meet the above requirements at the same time.
Disclosure of Invention
In view of the above problems, the invention aims to provide a welding spot encapsulation device, an encapsulation product and an encapsulation method, so as to solve the problem that the encapsulation of the existing product cannot meet the requirement of high-precision encapsulation operation of the product.
The invention provides a welding spot encapsulation device, which comprises a desktop type manipulator, a bottom plate tool and a dispensing tool, wherein the bottom plate tool and the dispensing tool are arranged on the desktop type manipulator; the dispensing tool comprises a glue bracket, at least one glue pipe arranged on the glue bracket, and a dispensing needle positioned below the glue pipe; the product to be encapsulated is placed and fixed on the bottom plate tool, and the desktop type mechanical arm is used for controlling the dispensing to carry out encapsulation operation aiming at the dispensing position of the product to be encapsulated; the bottom plate tool comprises a bottom plate, a positioning strip arranged on the bottom plate, an X-axis positioning module and a Y-axis positioning module, wherein the X-axis positioning module and the Y-axis positioning module are used for positioning the positioning strip; the product to be encapsulated is positioned on the positioning strip, and the X-axis positioning module and the Y-axis positioning module are used for locking and positioning the positioning strip.
On the other hand, the invention also provides an encapsulated product, which comprises a shell, a circuit board arranged on the shell, an LED lamp positioned on the circuit board, a first welding spot, a second welding spot and ventilation holes; the first welding spots and the second welding spots are respectively positioned at two sides of the LED lamp, and the ventilation holes are positioned above the second welding spots; the first welding spot or the second welding spot is encapsulated by the welding spot encapsulation device.
In still another aspect, the present invention further provides a method for encapsulating an encapsulated product, wherein the encapsulating product is encapsulated by using the solder joint encapsulating device; the method comprises the following steps: fixing a product to be encapsulated on a bottom plate tool of a welding spot encapsulation device; the rubber tube on the rubber tube support is controlled to move through the desktop type mechanical arm, so that a dispensing needle of the rubber tube starts from a first welding point of a product to be encapsulated to one side close to a second welding point of the product to be encapsulated, and moves upwards to a first preset position; the dispensing needle moves from the first preset position to the left upper part to the second preset position, and reverses from the second preset position to the left lower part and moves to the third preset position; the glue dispensing needle moves downwards from a third preset position to the edge of the shell, commutates to the right and upwards and moves to a fourth preset position so as to carry out tail encapsulation on the electric wire connected to the first welding point; and lifting the dispensing needle and moving the dispensing needle upwards to a fifth preset position so as to completely encapsulate the first welding spot.
By using the welding spot encapsulation device, the encapsulation product and the encapsulation method, the bottom plate tool and the glue dispensing tool are arranged on the desktop type mechanical arm, the product to be encapsulated is placed and fixed on the bottom plate tool, the desktop type mechanical arm is used for controlling the glue dispensing needle in the glue dispensing tool to carry out encapsulation operation on the glue dispensing position of the product to be encapsulated according to a preset path, the encapsulation requirement of high precision can be met, other components adjacent to the glue dispensing position cannot be influenced, functions of the product are enriched, for example, the requirement of ECM product working in electrified brine can be realized, and therefore the application market of the product is widened.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Furthermore, the invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and attainments together with a more complete understanding of the invention will become apparent and appreciated by referring to the following description taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a schematic structural diagram of a base plate tool according to an embodiment of the present invention;
FIG. 2 is a schematic view of a positioning strip according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an assembly of a product to be encapsulated and a locator bar according to an embodiment of the present invention;
FIG. 4 is a schematic view of an elbow clip according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a glue bracket according to an embodiment of the invention;
FIG. 6 is a schematic diagram of the structure of a product to be encapsulated according to an embodiment of the present invention;
fig. 7 is a schematic view of a dispensing path of the product of fig. 6.
Wherein reference numerals include: the device comprises a bottom plate 1, a sliding cover plate 2, a sliding block 3, a compression block 4, an elastic piece 5, a fixed plate 6, a fixed frame 71, a movable frame 72, a positioning strip 8, a product 9 to be encapsulated and an elbow clamp 10.
The same reference numerals will be used throughout the drawings to refer to similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In order to solve the problems that the conventional product encapsulation process is difficult to encapsulate due to the fact that the distance between a welding point and an LED lamp, the distance between a welding point and a shell are small, the product has encapsulation width and the like, the invention provides the welding point encapsulation device which is characterized in that a bottom plate tool and a dispensing tool are arranged on a desktop type manipulator, a product to be encapsulated is placed and fixed on the bottom plate tool, and the desktop type manipulator is used for controlling a dispensing needle in the dispensing tool to encapsulate the dispensing position of the product to be encapsulated according to a preset path, so that the encapsulation requirement with high precision can be achieved, for example, EMC welding wire products can meet the requirement of welding point insulation, and then the encapsulation device can be electrified in saline for working.
In order to describe the solder joint encapsulation apparatus and method of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
FIGS. 1 and 2 show schematic structures of a base plate tooling and a glue bracket, respectively, in a solder joint encapsulation apparatus according to an embodiment of the present invention; fig. 3 and 4 show a spacer according to an embodiment of the invention and its assembly with a product to be encapsulated, respectively.
As shown in fig. 1 to 4, the welding spot encapsulation device according to the embodiment of the invention comprises a tabletop mechanical arm (not shown in the figure), a bottom plate tool and a dispensing tool which are arranged on the tabletop mechanical arm; the dispensing tool further comprises a glue bracket, at least one glue pipe arranged on the glue bracket, and a dispensing needle positioned below the glue pipe; the product to be encapsulated is placed and fixed on the bottom plate tool, the glue dispensing needle is controlled by the desktop type mechanical arm to carry out encapsulation operation on the glue dispensing position of the product to be encapsulated according to a preset path, high-precision encapsulation of small-size products can be achieved, and stability and consistency of product encapsulation can be guaranteed.
Specifically, the bottom plate tooling further comprises a bottom plate 1 which can be placed on a desktop type manipulator, a positioning strip 8 arranged on the bottom plate 1, an X-axis positioning module and a Y-axis positioning module for positioning the positioning strip 8; the product to be encapsulated can be positioned on the positioning strip 8 in advance, then the positioning strip 8 and the product to be encapsulated are placed on the bottom plate 1 together, and the positioning strip 8 is locked and positioned through the X-axis positioning module and the Y-axis positioning module, so that the product to be encapsulated is positioned.
The X-axis positioning module may include a compression block 4 disposed on the base plate 1, a sliding cover plate 2, a sliding block 3 limited between the compression block 4 and the sliding cover plate 2, and an elastic member 5 disposed at one end of the sliding block 3, where the elastic member 5 can drive the sliding block 3 to slide between the compression block 4 and the sliding cover plate 2 under the action of elastic force, so that the X-axis direction of the positioning strip 8 is positioned through the sliding block 3, that is, the left side of the positioning strip 8 is positioned, and the right side of the positioning strip 8 may be positioned through a positioning block disposed on the right side of the base plate 1.
In addition, the Y-axis positioning module may also adopt the same positioning principle as the X-axis positioning module, however, in consideration of the convenience of the product encapsulation operation, the positioning bar 8 is generally configured in a long strip structure, so that the rubber tube above the positioning bar can encapsulate a plurality of products at a time, and therefore, the Y-axis positioning module may include at least one elbow clip fixed on the base plate 1, as shown in fig. 5, the axis clip according to the embodiment of the present invention is configured, a long-strip-shaped limiting block is provided on the base plate 1 to position the upper side of the positioning bar 8 in the Y-axis direction, and then the other side (lower side) of the positioning bar 8 in the Y-axis direction is positioned by at least one elbow clip 10, so that when the elbow clip 10 is provided with one, the force application point of the elbow clip 10 is ensured as much as possible in the middle position of the positioning bar 8.
In one embodiment of the present invention, magnets may be provided on the base plate 1 and the tabletop robot, respectively, and by the attractive force between the magnets and the base plate 1, the positioning accuracy and the positioning in the Z-axis direction may be provided when the base plate 1 is placed.
In addition, the glue bracket of the invention comprises the fixed plate 6 arranged on the desktop manipulator, and at least one fixed frame 71 and/or at least one movable frame 72 arranged on the fixed plate 6, wherein the angle between the movable frame 72 and the fixed plate 6 is adjustable, but the angle of the fixed frame 71 cannot be adjusted, and the movable frame 72 and the fixed frame 71 are arranged to enable two adjacent rubber pipes to be distributed in a staggered way, so that the simultaneous encapsulation operation of a plurality of products can be realized at one time.
Specifically, the movable frame 72 and the fixed plate 6 may be connected by a hinge, a rotating shaft or a universal ball, and after the angle of the movable frame 72 is determined, the position may be locked by a locking bolt or the like. The movable frames 72 and the fixed frames 71 can be distributed in a staggered manner, so that the positions of the adjacent rubber pipes can be reasonably adjusted.
In addition, still be provided with the adapter of fixing on the glue support in the below of rubber tube, the rubber tube passes through the adapter with the point gum needle and is connected, can directly change the rubber tube after the glue in the rubber tube runs out, can not cause the influence to the position of the point gum needle under it, and then simplify the glue and change to ensure the uniformity of product rubber coating. The angle of the rubber tube on the movable frame 72 needs to be adjusted, so that the rubber tube on the movable frame 72 can be connected with the adapter at the corresponding position through a hose, the position adjustment is convenient, the position of the dispensing needle is not adversely affected, and the position of the specific dispensing needle can be adjusted through the adapter.
As a specific example, fig. 6 shows a schematic structure of a product to be encapsulated according to an embodiment of the present invention, and fig. 7 shows a dispensing path for the product in fig. 6.
Referring to fig. 1 to 7, the product to be encapsulated comprises a shell, a circuit board arranged on the shell, an LED lamp arranged on the circuit board, a first welding point, a second welding point and ventilation holes; the first welding spots and the second welding spots are respectively positioned at two sides of the LED lamp, and the ventilation holes are positioned above the second welding spots; the first welding spot or the second welding spot is encapsulated by the welding spot encapsulation device.
As a specific example, when the product 9 to be encapsulated is an ECM product, the distance between the first welding spot and the second welding spot and the LED lamp is 0.88mm, the minimum distance between the first welding spot and/or the second welding spot and the housing is 1.67mm, the encapsulation width of the glue is not less than 2.55mm, and the combination of the product is not resistant to high temperature, when the product is assembled, the stress on the wire diameter of the welding wire and the encapsulation width of the product need to be lifted, and when the product is assembled, an insulating glue resistant to corrosion by brine needs to be selected for the insulation of the welding spots, and when the upper limit of the long-time temperature resistance of the product is 90 ℃, the glue curing mode needs to be selected for low-temperature curing or UV curing. The low-temperature curing glue is generally silica gel, the hardness of the low-temperature curing glue is generally between Shore0-A, and the low-temperature curing glue cannot support and protect welding points, so that the UV-curable glue is selected. Furthermore, there may be differences in the location of the weld points or encapsulation requirements for different encapsulated products, and the invention is not limited to the specific distance dimensions described above.
The UV glue with high hardness is generally divided into two main types of epoxy glue and acrylic acid, wherein the UV curing time of the epoxy glue is generally 30-60S, and the UV curing time of the acrylic acid glue can be less than 5S. In connection with curing UPH, in the specific embodiment of the invention, UV acrylic glue which can resist water, oil and corrosion is selected, and the hardness of the UV acrylic glue can be 80Shore D. In order to ensure that the glue can completely wrap the whole welding spot (the surface of the welding spot and the bottom surface of the welding wire), the glue needs to have certain flowing property, and when the encapsulation width of the product is 2.55mm, the flowing property of the glue needs to be limited.
In addition, in order to ensure good consistency of encapsulation effect and high encapsulation efficiency of the encapsulation process, besides controlling glue, the base plate tool, the needle diameter of the dispensing head and the glue support are required to be guaranteed, and the consistency of encapsulation effect is required to be guaranteed by factors such as the base plate tool, the product placement position, the needle position and the like. Wherein, the tolerance of each direction of the bottom plate tool is controlled to be +/-0.02 mm. In addition, the rubber coating adopts a 21G needle head, when the diameter is smaller than 21G, the glue is limited by the viscosity of the glue, the glue discharging speed is low, the rubber coating efficiency is affected, and the glue can not completely cover the bonding pad; when the diameter of the needle is larger than 21G, the rubber coating width is too wide, so that poor appearance can be caused, and rubber overflow and the like can be caused. In addition, the rubber tube and the needle are connected and fixed on the rubber tube bracket through the conversion head, so that the position of the needle is not moved when only the glue is removed when the glue is changed each time. Because 4 rubber tubes cannot be placed side by side with the same levelness at the same height, the rubber tube support of the novel design is formed by alternately arranging the rubber tubes horizontally and obliquely. Wherein the two inclined glue bottoms are connected with the needle by a hose so as to correct the position of the needle.
In another embodiment of the invention, in order to ensure that the welding spots are completely wrapped by glue, the defect of encapsulation failure of the welding spots is avoided. The encapsulation track also needs to be optimized. As shown in fig. 4, (1): because the length of the bonding wire between the left side of the welding point and the edge of the shell is short, and the quantity of glue at the glue coating starting point is small, the glue coating starting point is selected at the middle position of the red line and the blue line of the product, and the problems of small glue coating of the wire skin or package leakage are avoided. (2) The method comprises the following steps The middle position of the red line and the blue line extends upwards along one side of the red line, and the glue drawing track covers one third of the width of the bonding pad due to the size difference of the welding spots; (3) the method comprises the following steps In order to reduce the influence of glue on the LED lamp, when the glue drawing track reaches two thirds of the length of the bonding pad, the track is left, and the glue drawing track extends downwards along one third of the width of the bonding pad in the same way; (4) the method comprises the following steps When the glue drawing track extends to the edge of the shell, the glue drawing track extends to the right to the half position of the width of the bonding pad, so that the wire tail can be fully encapsulated; (5) in order to avoid the risk of glue leakage above the solder joint, the needle head is raised by 0.2mm in height and extends upwards by one half of the length of the bonding pad.
Corresponding to the welding spot encapsulation device, the invention also provides a welding spot encapsulation method, and the welding spot encapsulation device is utilized to carry out encapsulation operation on the product to be encapsulated; the method comprises the following steps: fixing a product to be encapsulated on a bottom plate tool of a welding spot encapsulation device; the product to be encapsulated can comprise a shell, a circuit board arranged on the shell, an LED lamp positioned on the circuit board, a first welding spot, a second welding spot and ventilation holes; the first welding spots and the second welding spots are positioned on two sides of the LED, and the ventilation holes are positioned above the second welding spots; the rubber tube on the rubber tube support is controlled to move through the desktop type mechanical arm, so that a dispensing needle of the rubber tube starts from one side of the first welding point, which is close to the second welding point, and moves upwards to a first preset position; the dispensing needle moves from the first preset position to the left upper part to the second preset position, and reverses from the second preset position to the left lower part and moves to the third preset position; the glue dispensing needle moves downwards from a third preset position to the edge of the shell, commutates to the right and upwards and moves to a fourth preset position so as to carry out tail encapsulation on the electric wire connected to the first welding point; and lifting the dispensing needle and moving the dispensing needle upwards to a fifth preset position so as to completely encapsulate the first welding spot.
Wherein the first preset position (fig. 4 (2)) is located on the right side of the vertical center line of the first welding spot and is located at one third of the width of the first welding spot; the second preset position (upper (3) in fig. 4) is located above the horizontal centerline of the first welding spot and is located at two thirds of the length of the first welding spot; the third preset position (lower (3) in fig. 4) is located on the left side of the center line of the first welding spot and is located at one third of the width of the first welding spot; the fourth preset position (fig. 4 (4)) is located at one half of the width of the first pad; the fifth preset position (fig. 4 (5)) is located at one half of the length of the first welding spot.
In addition, before the glue dispensing needle reaches the fifth preset position, the height of the glue dispensing needle raised in advance can be set to be 0.2mm, the first welding point can be an input end welding point, the second welding point can be an output end welding point, and the welding point position needing glue coating can be determined specifically according to the welding point position and distribution of products.
According to the encapsulation track, under the condition that the first welding spot is ensured to be completely encapsulated, glue is prevented from overflowing from the shell or overflowing to the adjacent LED lamp or the air hole, so that the accurate encapsulation operation of the welding spot on the small-size product is realized, the adjacent component is not adversely affected, and the product has the function of electrifying in salt water.
It should be noted that, the embodiments of the solder joint encapsulation method and the encapsulated product described above may refer to the descriptions in the embodiments of the solder joint encapsulation device, and will not be described in detail herein.
According to the welding spot encapsulation device, the encapsulation product and the encapsulation method, the encapsulation operation is carried out on the encapsulation positions of the products to be encapsulated according to the preset paths by controlling the glue dispensing needles in the glue dispensing tool by the tabletop mechanical arm, so that the encapsulation requirement of high precision can be met, adverse effects caused by other structural members adjacent to the glue dispensing positions can be avoided, the optimization of the device and the glue dispensing path is combined, the high-quality encapsulation for small-size products is improved, the device is simple in structure and convenient to operate, the encapsulation operation can be carried out on a plurality of products at the same time, and the encapsulation efficiency is high and the consistency is strong.
The spot weld encapsulation apparatus, encapsulated product and encapsulation method according to the present invention are described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications can be made to the solder joint encapsulation apparatus, encapsulated product, and encapsulation method set forth above without departing from the teachings of the present invention. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A solder joint encapsulation apparatus, comprising: the device comprises a desktop type manipulator, a bottom plate tool and a dispensing tool, wherein the bottom plate tool and the dispensing tool are arranged on the desktop type manipulator; wherein,,
the dispensing tool comprises a glue bracket, at least one glue pipe arranged on the glue bracket, and a dispensing needle positioned below the glue pipe;
the product to be encapsulated is placed and fixed on the bottom plate tool, and the desktop type manipulator is used for controlling the dispensing to carry out encapsulation operation aiming at the dispensing position of the product to be encapsulated;
the bottom plate tool comprises a bottom plate, a positioning strip arranged on the bottom plate, an X-axis positioning module and a Y-axis positioning module, wherein the X-axis positioning module and the Y-axis positioning module are used for positioning the positioning strip; wherein,,
the product to be encapsulated is positioned on the positioning strip, and the X-axis positioning module and the Y-axis positioning module are used for locking and positioning the positioning strip.
2. The solder joint encapsulation apparatus of claim 1, wherein,
the glue bracket comprises a fixed plate arranged on the desktop manipulator, and at least one fixed frame and/or at least one movable frame arranged on the fixed plate, wherein the angle between the movable frame and the fixed plate is adjustable;
an adapter fixed on the glue bracket is arranged below the glue tube, and the glue tube is connected with the glue dispensing needle through the adapter;
the rubber tube on the movable frame is connected with the adapter at the corresponding position through a hose.
3. The encapsulated product is characterized by comprising a shell, a circuit board arranged on the shell, an LED lamp positioned on the circuit board, a first welding spot, a second welding spot and ventilation holes; wherein,,
the first welding spot and the second welding spot are respectively positioned at two sides of the LED lamp, and the ventilation holes are positioned above the second welding spot;
the first weld spot or the second weld spot is encapsulated by the weld spot encapsulation apparatus of claim 1 or 2.
4. The encapsulated product of claim 3, wherein,
the distance between the first welding spot and the second welding spot and the LED lamp is 0.88mm;
the minimum distance between the first welding point and/or the second welding point and the shell is 1.67mm;
the encapsulation width of the glue is not less than 2.55mm.
5. The encapsulated product of claim 3, wherein,
the third welding point is arranged between the first welding point and the second welding point;
and the third welding point is connected with an external signal line.
6. The encapsulated product of claim 3, wherein,
the glue comprises UV acrylic glue and UV epoxy glue.
7. The encapsulated product of claim 3, wherein,
the curing time of the glue is not longer than 5s;
the viscosity range of the glue is 35000-40000 mPa.s;
the color of the gum is different from the color of the encapsulation location of the encapsulated product.
8. A method of encapsulating an encapsulated product, characterized in that the encapsulated product of any one of claims 3 to 7 is subjected to an encapsulation operation using the solder joint encapsulation apparatus of claim 1 or 2; wherein the method comprises the following steps:
fixing a product to be encapsulated on a bottom plate tool of the welding spot encapsulation device;
controlling the rubber tube on the rubber tube support to move through the desktop type mechanical arm so that a dispensing needle of the rubber tube starts from a first welding point of the product to be encapsulated to one side close to a second welding point of the product to be encapsulated and moves upwards to a first preset position;
the dispensing needle moves from the first preset position to the second preset position to the left upper side, and reverses from the second preset position to the left lower side and moves to the third preset position;
the dispensing needle moves downwards from the third preset position to the edge of the shell, commutates to the right and upwards and moves to a fourth preset position so as to carry out tail encapsulation on the electric wire connected to the first welding point;
and lifting the dispensing needle, and moving the dispensing needle upwards to a fifth preset position so as to completely encapsulate the first welding spot.
9. The method of encapsulation according to claim 8, wherein,
the first preset position is positioned on the right side of the vertical center line of the first welding spot and is positioned at one third of the width of the first welding spot;
the second preset position is positioned on the upper side of the horizontal central line of the first welding spot and is positioned at two thirds of the length of the first welding spot;
the third preset position is positioned at the left side of the center line of the first welding spot and is positioned at one third of the width of the first welding spot;
the fourth preset position is positioned at one half of the width of the first welding spot;
the fifth preset position is located at one half of the length of the first welding spot.
10. The method of encapsulation according to claim 8, wherein,
the lifting height of the dispensing needle is 0.2mm.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050217894A1 (en) * | 2004-04-05 | 2005-10-06 | Wistron Corp. | Fabrication method and structure of PCB assembly, and tool for assembly thereof |
| CN204656845U (en) * | 2015-05-15 | 2015-09-23 | 歌尔声学股份有限公司 | A kind of whirligig and a kind of point glue equipment |
| CN105101670A (en) * | 2015-08-14 | 2015-11-25 | 陈炜荣 | Welding jig for laterally welding LED (Light Emitting Diode) lamps |
| CN206653584U (en) * | 2017-01-07 | 2017-11-21 | 东莞市捷晨硅橡胶机械有限公司 | A kind of vertical liquid-state silicon gel feeding projects all-in-one |
| CN208014660U (en) * | 2018-03-21 | 2018-10-26 | 浙江汉亚科技有限公司 | A kind of Special multi-head glue dispensing device for integrated circuit package |
| CN108940729A (en) * | 2018-05-08 | 2018-12-07 | 南昌工控电装有限公司 | The anti-corrosion bonding method of dispensing needle tubing, point glue equipment and pressure sensor chip |
| CN210774530U (en) * | 2019-10-29 | 2020-06-16 | 襄阳航林机械有限公司 | Simple leak detection clamp for aluminum cylinder body |
| CN211118639U (en) * | 2019-12-17 | 2020-07-28 | 广东米沃科技有限公司 | Liquid silica gel rubber coating waterproof support |
| CN212203512U (en) * | 2020-05-26 | 2020-12-22 | 漯河市铁马橡胶制品有限公司 | Rotary rubber hose joint |
| CN112317249A (en) * | 2020-12-02 | 2021-02-05 | 京山亿捷电脑有限公司 | Dispensing device for computer processing and operation method thereof |
| CN214111203U (en) * | 2020-11-06 | 2021-09-03 | 中山市遨博智能科技有限公司 | Full-automatic truckle secondary assembly of moulding plastics |
-
2023
- 2023-02-02 CN CN202310052271.0A patent/CN116197083B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050217894A1 (en) * | 2004-04-05 | 2005-10-06 | Wistron Corp. | Fabrication method and structure of PCB assembly, and tool for assembly thereof |
| CN204656845U (en) * | 2015-05-15 | 2015-09-23 | 歌尔声学股份有限公司 | A kind of whirligig and a kind of point glue equipment |
| CN105101670A (en) * | 2015-08-14 | 2015-11-25 | 陈炜荣 | Welding jig for laterally welding LED (Light Emitting Diode) lamps |
| CN206653584U (en) * | 2017-01-07 | 2017-11-21 | 东莞市捷晨硅橡胶机械有限公司 | A kind of vertical liquid-state silicon gel feeding projects all-in-one |
| CN208014660U (en) * | 2018-03-21 | 2018-10-26 | 浙江汉亚科技有限公司 | A kind of Special multi-head glue dispensing device for integrated circuit package |
| CN108940729A (en) * | 2018-05-08 | 2018-12-07 | 南昌工控电装有限公司 | The anti-corrosion bonding method of dispensing needle tubing, point glue equipment and pressure sensor chip |
| CN210774530U (en) * | 2019-10-29 | 2020-06-16 | 襄阳航林机械有限公司 | Simple leak detection clamp for aluminum cylinder body |
| CN211118639U (en) * | 2019-12-17 | 2020-07-28 | 广东米沃科技有限公司 | Liquid silica gel rubber coating waterproof support |
| CN212203512U (en) * | 2020-05-26 | 2020-12-22 | 漯河市铁马橡胶制品有限公司 | Rotary rubber hose joint |
| CN214111203U (en) * | 2020-11-06 | 2021-09-03 | 中山市遨博智能科技有限公司 | Full-automatic truckle secondary assembly of moulding plastics |
| CN112317249A (en) * | 2020-12-02 | 2021-02-05 | 京山亿捷电脑有限公司 | Dispensing device for computer processing and operation method thereof |
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|---|---|
| CN116197083B (en) | 2024-09-06 |
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