CN116193724A - Technological design for prolonging service life of TS (transport stream) of copper-clad ceramic substrate - Google Patents
Technological design for prolonging service life of TS (transport stream) of copper-clad ceramic substrate Download PDFInfo
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- CN116193724A CN116193724A CN202211681845.2A CN202211681845A CN116193724A CN 116193724 A CN116193724 A CN 116193724A CN 202211681845 A CN202211681845 A CN 202211681845A CN 116193724 A CN116193724 A CN 116193724A
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- copper
- ceramic substrate
- clad ceramic
- solder
- etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a process design for prolonging the service life of a copper-clad ceramic substrate TS, which comprises the following specific steps: s1, cleaning the surface of a copper-clad ceramic substrate; s2, simultaneously covering a layer of photosensitive dry film on the front surface and the back surface of the copper-clad ceramic substrate through a film pressing machine; s3, aligning the front film negative film and the back film negative film, ensuring that the front pattern and the back pattern have no deviation, and exposing; s4, removing the photosensitive dry film in the unexposed area through an alkaline developing solution, and reserving the required dry film; s5, horizontally placing the developed copper-clad ceramic substrate in a vacuum etching line body for vacuum etching; s6, performing solder removal on the etched copper-clad ceramic substrate by using the prepared solder removing liquid, so that no solder remains in the groove; s7, carrying out pattern etching again to enable the solder to be partially displayed, and enabling the obtained solder to remain and not be communicated.
Description
Technical Field
The invention relates to the technical field of copper-clad ceramic substrates, in particular to a process design for prolonging the service life of a TS (TS) of a copper-clad ceramic substrate.
Background
The copper-clad ceramic substrate has the characteristics of excellent thermal cycling performance, stable shape, good rigidity, high thermal conductivity and high reliability, the copper-clad surface can be etched into various patterns, the copper-clad ceramic substrate is a pollution-free and pollution-free green product, the use temperature is quite wide, the normal use temperature range is-55-850 ℃, the thermal expansion coefficient is close to that of silicon, and the application field is quite wide: the device can be used for semiconductor refrigerators, electronic heaters, high-power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency switching power supplies and solid-state relays, automobile electronic components, aerospace and military electronic components, solar panel components, telecommunication private exchanges, receiving systems and laser industrial electronic fields.
After the existing copper-clad ceramic substrate etches the pattern circuit according to the product design, a solder removing process is carried out, so that the copper bottom is basically flush with the solder layer, no solder remains in the groove, and after the copper-clad ceramic substrate etches the pattern circuit according to the product design and the solder removing process is carried out, TS performance is poor and the cold and hot impact times are less than the standard times.
Disclosure of Invention
The invention aims to: the invention aims to solve the defects in the prior art and provides a process design for prolonging the service life of a copper-clad ceramic substrate TS.
The technical scheme is as follows: the technological design for prolonging the service life of the TS of the copper-clad ceramic substrate comprises the following specific steps:
s1, slightly etching the surface of a copper-clad ceramic substrate by using a microetching agent, removing oxides on the surface, cleaning the surface of the copper-clad ceramic substrate by acid washing and water washing, and checking whether the surface of a copper layer is clean or not after cleaning and drying so as to avoid influencing the subsequent manufacturing process;
s2, simultaneously covering a layer of photosensitive dry film on the front side and the back side of the copper-clad ceramic substrate by a film pressing machine so as to prepare for the subsequent pattern transfer;
s3, mounting the two front and back film negative films on a glass table of an exposure machine, and aligning the two front and back film negative films by an operator through CCD alignment and visual alignment, so as to ensure that the front and back patterns have no deviation; after alignment is completed, an operator places the copper-clad ceramic substrate between two films, and selects proper exposure energy for exposure according to the thickness of the dry film;
s4, after exposure, the photosensitive dry film covered on the surface of the copper-clad ceramic substrate presents different colors, the photosensitive dry film in the unexposed area is removed through an alkaline developing solution, and finally the required dry film is reserved on the surface of the copper-clad ceramic substrate;
s5, horizontally placing the developed copper-clad ceramic substrate in a vacuum etching line body for vacuum etching, adjusting the line speed to a proper speed according to the thickness of the copper layer of the copper-clad ceramic substrate, and enabling the copper layer without photosensitive dry film protection to undergo oxidation-reduction reaction with etching liquid, so that the copper layer is removed, a required groove is formed, solder in the groove can be displayed, and the solder in the groove protrudes out of the copper layer;
s6, performing solder removal on the etched copper-clad ceramic substrate by using the prepared solder removing liquid, so that no solder remains in the groove;
s7, sequentially repeating the processes of S1 to S5, and carrying out pattern etching again, wherein the etching line speed of the second etching is faster than that of the first etching, so that the solder can be partially developed, and the obtained solder is reserved and is not communicated.
The invention is further improved in that in the step S1, the temperature range of the microetching agent is 25-35 ℃.
The invention is further improved in that in the step S1, the etching time of the microetching agent ranges from 0.5 to 2.5 minutes.
The invention is further improved in that in the step S2, the thickness of the photosensitive dry film ranges from 20 mu m to 60 mu m.
In step S3, the characteristic position is photographed and imaged by a special CCD camera, an industrial lens and a light source, image data is collected by an image processor to perform image processing, position operation is performed to judge the actual position, and the actual offset value is calculated by comparing with the previously set reference position for high-precision alignment of the front film and the back film.
A further improvement of the invention is that in step S5, the speed ranges from 1 to 2.5m/min.
Compared with the prior art, the process design for prolonging the service life of the TS of the copper-clad ceramic substrate has the advantages that at least the following beneficial effects are realized:
the invention is suitable for the circuit board manufacturing process of the copper-clad ceramic substrate, and is used for carrying out the etching process twice, and the solder in the groove protrudes out of the copper layer, so that the solder can be partially displayed, the solder is reserved and not communicated, the purpose of improving the cold and hot impact performance of the product is achieved while the function distinction is ensured, the cold and hot impact performance is improved, the reliability of the product is improved, the TS performance is good, the cold and hot impact times can reach 3500 times, and the standard value is exceeded.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of the present invention between lines.
Reference numerals: 1-copper layer, 2-solder, 3-copper-clad ceramic substrate.
Detailed Description
Various exemplary embodiments of the invention will now be described in detail. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
As shown in fig. 1, a process design for improving the service life of a copper-clad ceramic substrate TS includes the following specific steps:
s1, slightly etching the surface of a copper-clad ceramic substrate by using a microetching agent, removing oxides on the surface, cleaning the surface of the copper-clad ceramic substrate by acid washing and water washing, and checking whether the surface of a copper layer is clean or not after cleaning and drying so as to avoid influencing the subsequent manufacturing process;
s2, simultaneously covering a layer of photosensitive dry film on the front side and the back side of the copper-clad ceramic substrate by a film pressing machine so as to prepare for the subsequent pattern transfer;
s3, mounting the two front and back film negative films on a glass table of an exposure machine, and aligning the two front and back film negative films by an operator through CCD alignment and visual alignment, so as to ensure that the front and back patterns have no deviation; after alignment is completed, an operator places the copper-clad ceramic substrate between two films, and selects proper exposure energy for exposure according to the thickness of the dry film;
s4, after exposure, the photosensitive dry film covered on the surface of the copper-clad ceramic substrate presents different colors, the photosensitive dry film in the unexposed area is removed through an alkaline developing solution, and finally the required dry film is reserved on the surface of the copper-clad ceramic substrate;
s5, horizontally placing the developed copper-clad ceramic substrate in a vacuum etching line body for vacuum etching, adjusting the line speed to a proper speed according to the thickness of the copper layer 1 of the copper-clad ceramic substrate 3, wherein the copper layer 1 without photosensitive dry film protection can undergo oxidation-reduction reaction with etching liquid, so that the copper layer 1 is removed, a required groove is formed, the solder 2 in the groove can be displayed, and the solder 2 in the groove protrudes out of the copper layer 1;
s6, performing solder removal on the etched copper-clad ceramic substrate by using the prepared solder removing liquid, so that no solder remains in the groove;
s7, sequentially repeating the processes of S1 to S5, and carrying out pattern etching again, wherein the etching line speed of the second etching is faster than that of the first etching, so that the solder can be partially developed, and the obtained solder is reserved and is not communicated.
The invention is further improved in that in the step S1, the temperature of the microetching agent ranges from 25 ℃ to 35 ℃.
The invention further improves that in the step S1, the etching time of the microetching agent ranges from 0.5 min to 2.5min.
The invention is further improved in that in the step S2, the thickness of the photosensitive dry film ranges from 20 mu m to 60 mu m.
In step S3, the characteristic position is photographed and imaged by a special CCD camera, an industrial lens and a light source, image data is collected by an image processor to perform image processing, position operation is performed to judge the actual position, and the actual offset value is calculated by comparing with the previously set reference position for high-precision alignment of the front film and the back film.
A further development of the invention consists in that in step S5, the speed is in the range of 1 to 2.5m/min.
In summary, the process design for improving the TS service life of the copper-clad ceramic substrate is suitable for the circuit board process of the copper-clad ceramic substrate, the etching process is carried out twice, and the solder in the groove protrudes out of the copper layer, so that the solder can be partially displayed, the solder is kept and is not communicated, the purpose of improving the cold and hot impact performance of the product is achieved while the function distinction is ensured, the cold and hot impact performance is improved, the reliability of the product is improved, the TS performance is good, and the cold and hot impact times can reach 3500 times and exceed the standard value.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The process design for prolonging the service life of the TS of the copper-clad ceramic substrate is characterized by comprising the following specific steps of:
s1, slightly etching the surface of a copper-clad ceramic substrate by using a microetching agent, removing oxides on the surface, cleaning the surface of the copper-clad ceramic substrate by acid washing and water washing, and checking whether the surface of a copper layer is clean or not after cleaning and drying so as to avoid influencing the subsequent manufacturing process;
s2, simultaneously covering a layer of photosensitive dry film on the front side and the back side of the copper-clad ceramic substrate by a film pressing machine so as to prepare for the subsequent pattern transfer;
s3, mounting the two front and back film negative films on a glass table of an exposure machine, and aligning the two front and back film negative films by an operator through CCD alignment and visual alignment, so as to ensure that the front and back patterns have no deviation; after alignment is completed, an operator places the copper-clad ceramic substrate between two films, and selects proper exposure energy for exposure according to the thickness of the dry film;
s4, after exposure, the photosensitive dry film covered on the surface of the copper-clad ceramic substrate presents different colors, the photosensitive dry film in the unexposed area is removed through an alkaline developing solution, and finally the required dry film is reserved on the surface of the copper-clad ceramic substrate;
s5, horizontally placing the developed copper-clad ceramic substrate in a vacuum etching line body for vacuum etching, wherein the line speed is adjusted to a proper speed according to the thickness of a copper layer (1) of the copper-clad ceramic substrate (3), and the copper layer (1) without photosensitive dry film protection can undergo oxidation-reduction reaction with etching liquid, so that the copper layer (1) is removed, a required groove is formed, and solder (2) in the groove can be displayed, and the solder (2) in the groove protrudes out of the copper layer (1);
s6, performing solder removal on the etched copper-clad ceramic substrate by using the prepared solder removing liquid, so that no solder remains in the groove;
s7, sequentially repeating the processes of S1 to S5, and carrying out pattern etching again, wherein the etching line speed of the second etching is faster than that of the first etching, so that the solder can be partially developed, and the obtained solder is reserved and is not communicated.
2. The process design for improving the lifetime of a copper-clad ceramic substrate TS according to claim 1,
in the step S1, the temperature range of the microetching agent is 25-35 ℃.
3. The process design for improving the lifetime of a copper-clad ceramic substrate TS according to claim 1,
in the step S1, the etching time of the microetching agent is in the range of 0.5-2.5 min.
4. The process design for improving the lifetime of a copper-clad ceramic substrate TS according to claim 1,
in the step S2, the thickness range of the photosensitive dry film is 20-60 μm.
5. The process design for improving the lifetime of a copper-clad ceramic substrate TS according to claim 1,
in the step S3, when the CCD is aligned, the characteristic position is photographed and imaged by a dedicated CCD camera, an industrial lens and a light source, image data is collected by an image processor to perform image processing, position calculation is performed to determine the actual position, and the actual offset value is calculated by comparing with the previously set reference position, so as to be used for high-precision alignment of the front film and the back film.
6. The process design for improving the lifetime of a copper-clad ceramic substrate TS according to claim 1,
in the step S5, the speed range is 1-2.5 m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211681845.2A CN116193724A (en) | 2022-12-27 | 2022-12-27 | Technological design for prolonging service life of TS (transport stream) of copper-clad ceramic substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211681845.2A CN116193724A (en) | 2022-12-27 | 2022-12-27 | Technological design for prolonging service life of TS (transport stream) of copper-clad ceramic substrate |
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| CN116193724A true CN116193724A (en) | 2023-05-30 |
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| CN202211681845.2A Pending CN116193724A (en) | 2022-12-27 | 2022-12-27 | Technological design for prolonging service life of TS (transport stream) of copper-clad ceramic substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117255488A (en) * | 2023-10-25 | 2023-12-19 | 苏州博湃半导体技术有限公司 | Method for distinguishing copper thickness of front and back sides of copper-clad ceramic substrate |
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- 2022-12-27 CN CN202211681845.2A patent/CN116193724A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117255488A (en) * | 2023-10-25 | 2023-12-19 | 苏州博湃半导体技术有限公司 | Method for distinguishing copper thickness of front and back sides of copper-clad ceramic substrate |
| CN117255488B (en) * | 2023-10-25 | 2024-07-05 | 苏州博湃半导体技术有限公司 | Method for distinguishing copper thickness of front and back sides of copper-clad ceramic substrate |
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