CN116190499A - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN116190499A
CN116190499A CN202111423622.1A CN202111423622A CN116190499A CN 116190499 A CN116190499 A CN 116190499A CN 202111423622 A CN202111423622 A CN 202111423622A CN 116190499 A CN116190499 A CN 116190499A
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China
Prior art keywords
substrate
micro
led chips
display panel
packaging
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CN202111423622.1A
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Chinese (zh)
Inventor
盛翠翠
李蒙蒙
高文龙
田文亚
吴跃波
董小彪
葛泳
黄秀颀
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Chengdu Vistar Optoelectronics Co Ltd
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Chengdu Vistar Optoelectronics Co Ltd
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Priority to CN202111423622.1A priority Critical patent/CN116190499A/en
Publication of CN116190499A publication Critical patent/CN116190499A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses a display panel, a preparation method thereof and a display device, wherein the preparation method of the display panel comprises the steps of providing a prefabricated packaging substrate; transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate; and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate. Through the preparation method, the Micro-LED chip can be transferred to the driving substrate without arranging a buffer bonding layer with a conductive effect on the driving substrate, and the Micro-LED chip is electrically connected with the driving substrate.

Description

Display panel, preparation method thereof and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
With the development of the traditional flat panel display and Micro projection display technologies, the Micro-LED inorganic light emitting diode technology which is used as a main stream core in the future can be displayed with remarkable performance, and the advantages of the Micro-LED inorganic light emitting diode technology are attracting more and more attention. Micro-LEDs can be regarded as miniaturized LEDs, can be independently lightened, have the advantages of low power consumption, high brightness, high definition, long service life and the like, and become a novel display technology capable of being simultaneously driven with AMOLED display in the future.
In Micro-LEDs, a laser transfer technology is often adopted to transfer the Micro-LED chip to a driving substrate with a metal circuit, a buffer bonding layer is required to be arranged on the driving substrate to bear the Micro-LED chip, and the material of the buffer bonding layer is still in a development stage and has high development difficulty.
Disclosure of Invention
The display panel, the preparation method thereof and the display device solve the technical problem that in the prior art, the development difficulty of a buffer bonding layer is high in the process of transferring Micro-LED chips by laser.
In order to solve the technical problem, the first technical scheme provided by the application is as follows: provided is a method of manufacturing a display panel, including: providing a prefabricated packaging substrate; transferring the Micro-LED chips on the transfer substrate to the prefabricated packaging substrate; and bonding the prefabricated packaging substrate provided with a plurality of Micro-LED chips with a driving substrate, so that the Micro-LED chips are electrically connected with the driving substrate.
The step of providing the prefabricated packaging substrate specifically comprises the following steps: acquiring a packaging substrate, wherein a plurality of pits are formed on one side of the packaging substrate; filling buffer glue materials in the pits to obtain the prefabricated packaging substrate;
the step of transferring the Micro-LED chips on the transfer substrate to the pre-fabricated package substrate specifically includes: and transferring the Micro-LED chips on the transfer substrate to the buffer adhesive material by adopting a laser transfer method.
Wherein, before the step of bonding the prefabricated packaging substrate provided with a plurality of Micro-LED chips and the driving substrate, the method further comprises:
packaging a plurality of Micro-LED chips to form a packaging layer; the packaging layer is positioned at one side of the Micro-LED chips, which is far away from the prefabricated packaging substrate;
and exposing the electrodes of a plurality of Micro-LED chips.
Wherein, after the step of exposing the electrodes of the Micro-LED chips, the method further comprises:
and preparing electrode extension lines on one side of the packaging layer far away from the prefabricated packaging substrate, wherein the electrode extension lines are electrically connected with the electrodes of the Micro-LED chips.
Wherein, before the step of bonding the prefabricated packaging substrate provided with a plurality of Micro-LED chips and the driving substrate, the method further comprises:
and an adhesive layer is arranged on one side of the encapsulation layer and/or the driving substrate.
Wherein, the packaging substrate is a hard film material or a flexible film material.
In order to solve the technical problem, the second technical scheme provided by the application is as follows: provided is a display panel including: the Micro-LED packaging structure comprises a driving substrate, a prefabricated packaging substrate and a plurality of Micro-LED chips; the prefabricated packaging substrate and the driving substrate are arranged oppositely; a plurality of Micro-LED chips are fixed on one side of the prefabricated packaging substrate facing the driving substrate; and a plurality of Micro-LED chips are electrically connected with the driving substrate.
The prefabricated packaging substrate comprises a packaging substrate and a buffer adhesive material, wherein a plurality of pits are formed in one side of the packaging substrate, and the buffer adhesive material is filled in the pits;
and the Micro-LED chips are fixed on the packaging substrate through the buffer adhesive material.
In order to solve the technical problem, a third technical scheme provided by the application is as follows: a display panel is provided, comprising a driving substrate, a prefabricated packaging substrate and a plurality of Micro-LED chips; the prefabricated packaging substrate and the driving substrate are arranged oppositely; the Micro-LED chips are arranged between the driving substrate and the prefabricated packaging substrate, and no conductive buffer glue layer is arranged between the Micro-LED chips and the driving substrate; and a plurality of Micro-LED chips are electrically connected with the driving substrate.
In order to solve the technical problem, a fourth technical scheme provided by the application is as follows: there is provided a display device including any one of the above display panels.
The display panel and the preparation method thereof and the display device provided by the application, wherein the preparation method of the display panel comprises the steps of providing a prefabricated packaging substrate; transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate; and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate. Through the preparation method, the Micro-LED chip can be transferred to the driving substrate without arranging a buffer bonding layer with a conductive effect on the driving substrate, and the Micro-LED chip is electrically connected with the driving substrate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a prior art laser transfer Micro-LED chip;
fig. 2 is a schematic flow chart of a first embodiment of a method for manufacturing a display panel provided in the present application;
FIG. 3 is a schematic flow chart of step S1 in the method for manufacturing a display panel provided in FIG. 2;
FIG. 4 is a schematic structural diagram of step S11 in the method for manufacturing a display panel of FIG. 2;
FIG. 5 is a schematic structural diagram of step S12 in the method for manufacturing a display panel of FIG. 2;
FIG. 6 is a schematic structural diagram of step S2 in the method for manufacturing a display panel of FIG. 2;
FIG. 7 is a schematic structural diagram of step S3 in the method for manufacturing a display panel of FIG. 2;
fig. 8 is a schematic flow chart of a second embodiment of a method for manufacturing a display panel provided in the present application;
FIG. 9 is a schematic diagram of a step S3A in the method for manufacturing a display panel of FIG. 8;
FIG. 10 is a schematic diagram of a step S4A in the method for manufacturing a display panel of FIG. 8;
FIG. 11 is a schematic structural diagram of step S5A in the method for manufacturing a display panel of FIG. 8;
FIG. 12 is a schematic flow chart of a third embodiment of a method for manufacturing a display panel according to the present application;
FIG. 13 is a schematic diagram of a structure of step S5B in the method for manufacturing a display panel of FIG. 12;
FIG. 14 is a schematic diagram of a structure of step S6B in the method for manufacturing a display panel of FIG. 12;
FIG. 15 is a schematic flow chart of a fourth embodiment of a method for manufacturing a display panel according to the present application;
FIG. 16 is a schematic diagram illustrating a structure of step S6C in the method for manufacturing a display panel of FIG. 15;
FIG. 17 is a schematic diagram of a step S7C in the method for manufacturing a display panel of FIG. 15;
fig. 18 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.
The terms "first," "second," "third," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may include at least one such feature, either explicitly or implicitly. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement conditions, etc. between the components under a certain specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is correspondingly changed. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The present application is described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 1, fig. 1 is a schematic diagram of a laser transfer Micro-LED chip in the prior art.
The laser transfer technique is a technique in which, after laser irradiation, the chip 1 and the adhesive layer 3 between the donor substrates 2 react, and the chip 1 drops from the donor substrates 2 onto the receiving substrate 4. When Micro-LED chips are transferred onto a driving substrate, a receiving substrate 4 is a driving substrate with metal circuits, a photosensitive adhesive layer is arranged between the chips 1 and a donor substrate 2 to serve as an adhesive layer 3, and a buffer adhesive layer 5 is arranged on one side of the receiving substrate 4. The laser irradiates the donor substrate 2 from the side of the donor substrate 2 away from the chip 1, the adhesive layer between the donor substrate 2 and the chip 1 reacts, the chip 1 falls from the donor substrate 2 to the receiving substrate 4, and is adhered and fixed by the buffer adhesive layer 5 on the side of the receiving substrate 4. The buffer adhesive layer 5 needs to have a certain thickness to buffer, so that the falling chip 1 is prevented from impacting the receiving substrate 4; the buffer glue layer 5 also needs to have a conductive effect to ensure the electrical connection between the electrodes of the chip 1 and the receiving substrate 4 (driving substrate), so that the requirement on the buffer glue layer 5 is high, and the material of the buffer glue layer 5 is in a development stage and has high development difficulty.
Referring to fig. 2, fig. 2 is a schematic flow chart of a first embodiment of a method for manufacturing a display panel according to the present application.
In a first embodiment of the method for manufacturing a display panel, the steps specifically include:
step S1: a pre-fabricated package substrate is provided.
Referring to fig. 3 to 5, fig. 3 is a schematic flow chart of step S1 in the method for manufacturing a display panel provided in fig. 2, fig. 4 is a schematic structural diagram of step S11 in the method for manufacturing a display panel provided in fig. 2, and fig. 5 is a schematic structural diagram of step S12 in the method for manufacturing a display panel provided in fig. 2. In the present embodiment, the specific steps of providing the pre-package substrate 11 include:
step S11: and obtaining the packaging substrate, wherein a plurality of pits are formed on one side of the packaging substrate.
The package substrate 111 may be a hard film or a flexible film. When the package substrate 111 is a hard film, it may be a PCB board, glass, or the like; when the package substrate 111 is a flexible film, it may be PI glue. A plurality of pits 1111 are provided on one side of the package substrate 111, and the interval between adjacent pits 1111 is matched with the Pitch value of the Micro-LED display panel. In the present embodiment, the shape of the pit 1111 is set to be arc-shaped, and the shape of the pit 1111 may be designed as needed. By providing the pit 1111, the Micro-LED chip 12 to be transferred thereto can be restrained, and the light emission type of the Micro-LED chip 12 transferred thereto can be also advantageously controlled.
Step S12: and filling buffer glue materials in the pits to obtain the prefabricated packaging substrate.
Wherein the cushion rubber 112 has cushioning property and adhesiveness; the buffer adhesive 112 may be formed by filling the concave pit 1111, overflowing the concave pit 1111 to the surface of the package substrate 111, or by filling a part of the concave pit 1111, and may be designed to be able to receive the Micro-LED chip 12 and accurately position the Micro-LED chip 12 when it falls onto the package substrate 111, as needed. In this embodiment, the refractive index of the cushion gum 112 satisfies the light-emitting design of the Micro-LED chip 12, which is beneficial to the light-emitting of the Micro-LED chip 12 and improves the light-emitting effect. Specifically, the cushion gum 112 may be an epoxy.
In another embodiment, the pit 1111 may not be provided on the package substrate 111, i.e., the surface of the package substrate 111 is a plane; the buffer adhesive 112 may be disposed on the entire surface of the package substrate 111, or may be disposed at intervals on the surface of the package substrate 111, and may be capable of receiving the Micro-LED chip 12.
Since the concave pit 1111 is provided on the package substrate 111, it is advantageous to control the light emission type of the Micro-LED chip 12 transferred thereto, and the manufacturing method of the display panel will be described below with the package substrate 111 of such a structure.
Step S2: and transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate. Referring to fig. 6, fig. 6 is a schematic structural diagram of step S2 in the method for manufacturing a display panel provided in fig. 2.
Specifically, the plurality of Micro-LED chips 12 are transferred to the pre-fabricated package substrate 11 by a laser transfer method, that is, the plurality of Micro-LED chips 12 are transferred to the side of the buffer paste 112 away from the package substrate 111 by a laser transfer method. The Micro-LED chip 12 is fixed to the package substrate 111 by a buffer adhesive 112.
Wherein, a plurality of Micro-LED chips 12 are placed on one side of a transfer substrate 13, the surface of the side of the transfer substrate 13 for placing the Micro-LED chips 12 is provided with an adhesive layer 14, and the Micro-LED chips 12 are fixed on the transfer substrate 13 through the adhesive layer 14. The glue layer 14 reacts under the action of the laser so that the Micro-LED chip 12 falls off the transfer substrate 13.
The transfer substrate 13 provided with the Micro-LED chips 12 is arranged opposite to the pre-package substrate 11, and the laser is used to irradiate the side, away from the Micro-LED chips 12, of the transfer substrate 13, so that the Micro-LED chips 12 drop onto the buffer adhesive 112, that is, the RGB three-color chip array is arranged on the pre-package substrate 11. As shown in fig. 6, the non-electrode side of the Micro-LED chip 12 is dropped and adhered to the buffer adhesive 112, that is, the Micro-LED chip 12 is adhered to the buffer adhesive 112 at the plane structure side, and the electrode 121 end of the Micro-LED chip 12 is away from the pre-package substrate 11.
Step S3: and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate. Referring to fig. 7, fig. 7 is a schematic structural diagram of step S3 in the method for manufacturing a display panel provided in fig. 2.
In the present embodiment, the Micro-LED chips 12 are bonded to the driving substrate 16 by solder 15 so that the plurality of Micro-LED chips 12 are electrically connected to the driving substrate 16. The solder 15 may be provided on the drive board 16 side, the pre-package board 11 side, or both the drive board 16 side and the pre-package board 11 side. Specifically, the electrode 121 of the Micro-LED chip 12 is electrically connected to the electrode 161 corresponding to the Micro-LED chip 12 on the driving substrate 16 by the solder 15.
It will be appreciated that, since the driving substrate 16 is hard, when the package substrate 111 is made of a flexible film, it is easier to perform a roll operation, for example, when the pre-fabricated package substrate 11 provided with the Micro-LED chip 12 is attached to the driving substrate 16.
According to the first embodiment of the display panel manufacturing method provided by the application, the horizontal structure side of the Micro-LED chip 12 is adhered to the prefabricated packaging substrate 11 through the laser transfer technology, and then the above structure is bound (bound) to the driving substrate 16 at one time, so that the problem of development of the conductive buffer adhesive layer of the Micro-LED chip 12 for carrying out laser transfer on the driving substrate 16 is solved, and the light emitting type can be controlled and the light emitting effect can be improved. The prefabricated package substrate 11 not only serves as a bearing substrate in the process of transferring the Micro-LED chip 12 by laser, but also can serve as a package structure, and a cover plate in the prior art is not required to be arranged. Compared with the prior art, the Micro-LED chip is transferred to the driving substrate, the buffer adhesive is needed, and the Micro-LED chip 12 is transferred through the alignment and lamination of the pre-fabricated packaging substrate 11 and the driving substrate 16 without setting the buffer adhesive.
Referring to fig. 8, fig. 8 is a schematic flow chart of a second embodiment of a method for manufacturing a display panel according to the present application.
In a second embodiment of the method for manufacturing a display panel, the steps specifically include:
step S1A: a pre-fabricated package substrate is provided.
Step S1A in the second embodiment of the method for manufacturing a display panel is the same as step S1 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S2A: and transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate.
Step S2A in the second embodiment of the method for manufacturing a display panel is the same as step S2 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S3A: packaging the Micro-LED chips to form a packaging layer; the packaging layer is positioned on one side of the Micro-LED chips away from the prefabricated packaging substrate.
Referring to fig. 9, fig. 9 is a schematic structural diagram of step S3A in the method for manufacturing a display panel provided in fig. 8. Specifically, the Micro-LED chips 12 on the prefabricated package substrate 11 are packaged, so that planarization of one side of the Micro-LED chips 12 far from the prefabricated package substrate 11 is realized; by packaging the plurality of Micro-LED chips 12, light interference between the plurality of Micro-LED chips 12 can be prevented. The encapsulation layer 17 may have a single-layer structure or a multilayer structure, and is specifically selected as required. For example, encapsulation is performed with a black glue.
Step S4A: the electrodes of the plurality of Micro-LED chips are exposed.
Referring to fig. 10, fig. 10 is a schematic structural diagram of step S4A in the method for manufacturing a display panel provided in fig. 8. Specifically, the electrodes 121 of the plurality of Micro-LED chips 12 are exposed by etching the encapsulation layer 17 to be electrically connected with the electrodes 161 on the driving substrate 16.
Step S5A: and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate.
Referring to fig. 11, fig. 11 is a schematic structural diagram of step S5A in the method for manufacturing a display panel provided in fig. 8. Step S5A in the second embodiment of the method for manufacturing a display panel is the same as step S3 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
In the second embodiment of the display panel manufacturing method provided by the present application, the horizontal structure side of the Micro-LED chip 12 is adhered to the pre-fabricated package substrate 11 by the laser transfer technology; the Micro-LED chips 12 are packaged, so that the Micro-LED chips 12 are further fixed, and the structural stability of the display panel is improved; then the structure is bound (bound) to the driving substrate 16 at one time, so that the problem of development of the conductive buffer glue layer of the Micro-LED chip 12 for carrying laser transfer on the driving substrate 16 is solved, and the light emitting type can be controlled and the light emitting effect can be improved. The prefabricated package substrate 11 not only serves as a bearing substrate in the process of transferring the Micro-LED chip 12 by laser, but also can serve as a package structure, and a cover plate in the prior art is not required to be arranged.
Referring to fig. 12, fig. 12 is a schematic flow chart of a third embodiment of a method for manufacturing a display panel according to the present application.
Step S1B: a pre-fabricated package substrate is provided.
Step S1B in the third embodiment of the method for manufacturing a display panel is the same as step S1 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S2B: and transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate.
Step S2B in the third embodiment of the method for manufacturing a display panel is the same as step S2 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S3B: packaging the Micro-LED chips to form a packaging layer; the packaging layer is positioned on one side of the Micro-LED chips away from the prefabricated packaging substrate.
Step S3B in the third embodiment of the method for manufacturing a display panel is the same as step S3A in the second embodiment of the method for manufacturing a display panel, and will not be described again.
Step S4B: the electrodes of the plurality of Micro-LED chips are exposed.
Step S4B in the third embodiment of the method for manufacturing a display panel is the same as step S4A in the second embodiment of the method for manufacturing a display panel, and will not be described again.
Step S5B: and preparing electrode extension wires on one side of the packaging layer far away from the prefabricated packaging substrate, wherein the electrode extension wires are electrically connected with the electrodes of the Micro-LED chips.
Referring to fig. 13, fig. 13 is a schematic structural diagram of step S5B in the method for manufacturing a display panel provided in fig. 12. Specifically, an electrode extension line 18 is prepared on one side of the packaging layer 17 away from the prefabricated packaging substrate 11, the electrode extension line 18 is disposed on the surface of the packaging layer 17 away from the prefabricated packaging substrate 11, and one end of the electrode extension line 18 is electrically connected with an electrode of the Micro-LED chip 12 exposed from the packaging layer 17. By arranging the electrode extension wires 18, the alignment precision of the subsequent Micro-LED chip 12 and the driving substrate 16 can be increased, the alignment difficulty is reduced, and the yield is improved.
Step S6B: and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate.
Referring to fig. 14, fig. 14 is a schematic structural diagram of step S6B in the method for manufacturing a display panel provided in fig. 12.
Step S6B in the third embodiment of the method for manufacturing a display panel is the same as step S3 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
In the third embodiment of the display panel manufacturing method provided by the present application, the horizontal structure side of the Micro-LED chip 12 is adhered to the pre-fabricated package substrate 11 by the laser transfer technology; the Micro-LED chips 12 are packaged, so that the Micro-LED chips 12 are further fixed, and the structural stability of the display panel is improved; electrode extension lines 18 are designed on one side of the packaging layer 17 far away from the prefabricated packaging substrate 11, so that alignment accuracy is improved; then the structure is bound (bound) to the driving substrate 16 at one time, so that the problem of development of the conductive buffer glue layer of the Micro-LED chip 12 for carrying laser transfer on the driving substrate 16 is solved, and the light emitting type can be controlled and the light emitting effect can be improved. The prefabricated package substrate 11 not only serves as a bearing substrate in the process of transferring the Micro-LED chip 12 by laser, but also can serve as a package structure, and a cover plate in the prior art is not required to be arranged.
Referring to fig. 15, fig. 15 is a schematic flow chart of a fourth embodiment of a method for manufacturing a display panel according to the present application.
Step S1C: a pre-fabricated package substrate is provided.
Step S1C in the fourth embodiment of the method for manufacturing a display panel is the same as step S1 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S2C: and transferring the Micro-LED chips on the transfer substrate to a prefabricated packaging substrate.
Step S2C in the fourth embodiment of the method for manufacturing a display panel is the same as step S2 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
Step S3C: packaging the Micro-LED chips to form a packaging layer; the packaging layer is positioned on one side of the Micro-LED chips away from the prefabricated packaging substrate.
Step S3C in the fourth embodiment of the method for manufacturing a display panel is the same as step S3A in the second embodiment of the method for manufacturing a display panel, and will not be described again.
Step S4C: the electrodes of the plurality of Micro-LED chips are exposed.
Step S4C in the fourth embodiment of the method for manufacturing a display panel is the same as step S4A in the second embodiment of the method for manufacturing a display panel, and will not be described again.
Step S5C: and preparing electrode extension wires on one side of the packaging layer far away from the prefabricated packaging substrate, wherein the electrode extension wires are electrically connected with the electrodes of the Micro-LED chips.
Step S5C in the fourth embodiment of the method for manufacturing a display panel is the same as step S5B in the third embodiment of the method for manufacturing a display panel, and will not be described again.
Step S6C: an adhesive layer is arranged on one side of the packaging layer and/or the driving substrate.
Referring to fig. 16, fig. 16 is a schematic structural diagram of step S6C in the method for manufacturing a display panel provided in fig. 15. Specifically, the adhesive layer 19 is disposed on a side of the encapsulation layer 17 away from the pre-fabricated encapsulation substrate 11; or, the adhesive layer 19 is disposed on the side of the driving substrate 16 where the electrode 161 is disposed (as shown in fig. 16); alternatively, the side of the encapsulation layer 17 remote from the pre-package substrate 11 and the side of the drive substrate 16 on which the electrodes 161 are provided are each provided with an adhesive layer 19. By disposing the adhesive layer 19 between the encapsulation layer 17 and the driving substrate 16, the prefabricated encapsulation substrate 11 with the encapsulation layer 17 is easy to adhere to the driving substrate 16, so that the structural stability of the display panel is improved, and no void exists between the prefabricated encapsulation substrate and the driving substrate.
Step S7C: and bonding the prefabricated packaging substrate provided with the Micro-LED chips with the driving substrate so that the Micro-LED chips are electrically connected with the driving substrate.
Referring to fig. 17, fig. 17 is a schematic structural diagram of step S7C in the method for manufacturing a display panel provided in fig. 15.
Step S7C in the fourth embodiment of the method for manufacturing a display panel is the same as step S3 in the first embodiment of the method for manufacturing a display panel, and will not be described again.
In the fourth embodiment of the display panel manufacturing method provided by the present application, the horizontal structure side of the Micro-LED chip 12 is adhered to the pre-fabricated package substrate 11 by the laser transfer technology; the Micro-LED chips 12 are packaged, so that the Micro-LED chips 12 are further fixed, and the structural stability of the display panel is improved; electrode extension lines 18 are designed on one side of the packaging layer 17 far away from the prefabricated packaging substrate 11, so that alignment accuracy is improved; then the structure is bound (bound) to the driving substrate 16 provided with the adhesive layer 19 at one time, so that the problem of development of the conductive buffer adhesive layer of the Micro-LED chip 12 for carrying laser transfer on the driving substrate 16 is solved, and the light emitting type can be controlled and the light emitting effect can be improved. The prefabricated package substrate 11 not only serves as a bearing substrate in the process of transferring the Micro-LED chip 12 by laser, but also can serve as a package structure, and a cover plate in the prior art is not required to be arranged.
Referring to fig. 18, fig. 18 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
The display panel provided by the embodiment of the application can be prepared by any embodiment of the preparation method of the display panel. Preparing a display panel by using any embodiment of the preparation method of the display panel, wherein the display panel comprises a prefabricated packaging substrate 11, a driving substrate 16 and a plurality of Micro-LED chips 12, the prefabricated packaging substrate 11 and the driving substrate 16 are arranged oppositely, the Micro-LED chips 12 are arranged between the driving substrate 16 and the prefabricated packaging substrate 11, and a conductive buffer glue layer is not arranged between the Micro-LED chips 12 and the driving substrate 16; the plurality of Micro-LED chips 12 are electrically connected to a drive substrate 16. Wherein a plurality of Micro-LED chips 12 are fixed to a side of the pre-package substrate 11 facing the driving substrate 16.
A display panel is prepared by taking a fourth embodiment of the display panel preparation method as an example, and the structure of the display panel is described.
The pre-packaging substrate 11 comprises a packaging substrate 111 and a buffer adhesive 112, wherein a plurality of pits 1111 are formed on one side of the packaging substrate 111, and the buffer adhesive 112 is filled in the pits 1111; the plurality of Micro-LED chips 12 are fixed to the package substrate 111 by a buffer adhesive 112. The pits 1111 facilitate control of the light emission type of the Micro-LED chip 12 disposed thereon. The refractive index of the buffer adhesive 112 meets the light-emitting design of the Micro-LED chip 12, which is beneficial to the light-emitting of the Micro-LED chip 12 and improves the light-emitting effect. The package substrate 111 may be a hard film or a flexible film. When the package substrate 111 is a hard film, it may be a PCB board, glass, or the like; when the package substrate 111 is a flexible film, it may be PI glue. It will be appreciated that, since the driving substrate 16 is hard, when the package substrate 111 is made of a flexible film, it is easier to perform a roll operation, for example, when the pre-fabricated package substrate 11 provided with the Micro-LED chip 12 is attached to the driving substrate 16.
The display panel further comprises an encapsulation layer 17, the encapsulation layer 17 covers one side of the Micro-LED chips 12 far away from the prefabricated encapsulation substrate 11 and is filled in gaps of the Micro-LED chips 12, and electrodes 121 of the Micro-LED chips 12 are exposed on one side of the encapsulation layer 17. By packaging the plurality of Micro-LED chips 12, light interference between the plurality of Micro-LED chips 12 can be prevented, and structural stability of the display panel can be improved.
The display panel further comprises electrode extension lines 18, wherein the electrode extension lines 18 are arranged on one side of the packaging layer 17 away from the prefabricated packaging substrate 11 and are electrically connected with the electrodes 121 of the Micro-LED chips 12 through the solders 15, and no conductive buffer glue layer is needed. By arranging the electrode extension wires 18, the alignment precision of the subsequent Micro-LED chip 12 and the driving substrate 16 can be increased, the alignment difficulty is reduced, and the yield is improved.
The display panel further includes an adhesive layer 19, wherein the adhesive layer 19 is disposed between the encapsulation layer 17 and the driving substrate 16. By disposing the adhesive layer 19 between the encapsulation layer 17 and the driving substrate 16, the prefabricated encapsulation substrate 11 with the encapsulation layer 17 is easy to adhere to the driving substrate 16, so that the structural stability of the display panel is improved, and no void exists between the prefabricated encapsulation substrate and the driving substrate.
It will be appreciated that the encapsulation layer 17, the electrode extension lines 18 and the adhesive layer 19 in the display panel are optional structures, and are selected as required.
It will be appreciated that the display panel provided in the present application may be applied to the field of display devices such as desktop computers, notebook computers, personal digital assistants (Personal Digital Assistant; PDAs), cell phones, televisions, and the like.
The foregoing is only the embodiments of the present application, and not the patent scope of the present application is limited by the foregoing description, but all equivalent structures or equivalent processes using the contents of the present application and the accompanying drawings, or directly or indirectly applied to other related technical fields, which are included in the patent protection scope of the present application.

Claims (10)

1. A method for manufacturing a display panel, comprising:
providing a prefabricated packaging substrate;
transferring the Micro-LED chips on the transfer substrate to the prefabricated packaging substrate;
and bonding the prefabricated packaging substrate provided with a plurality of Micro-LED chips with a driving substrate, so that the Micro-LED chips are electrically connected with the driving substrate.
2. The method of manufacturing of claim 1, wherein the step of providing a pre-fabricated package substrate specifically comprises:
acquiring a packaging substrate, wherein a plurality of pits are formed on one side of the packaging substrate;
filling buffer glue materials in the pits to obtain the prefabricated packaging substrate;
the step of transferring the Micro-LED chips on the transfer substrate to the pre-fabricated package substrate specifically includes:
and transferring the Micro-LED chips on the transfer substrate to the buffer adhesive material by adopting a laser transfer method.
3. The method of manufacturing according to claim 1, wherein before the step of bonding the pre-package substrate provided with the plurality of Micro-LED chips to the driving substrate, further comprising:
packaging a plurality of Micro-LED chips to form a packaging layer; the packaging layer is positioned at one side of the Micro-LED chips, which is far away from the prefabricated packaging substrate;
and exposing the electrodes of a plurality of Micro-LED chips.
4. The method of claim 3, wherein after the exposing the electrodes of the plurality of Micro-LED chips, further comprising:
and preparing electrode extension lines on one side of the packaging layer far away from the prefabricated packaging substrate, wherein the electrode extension lines are electrically connected with the electrodes of the Micro-LED chips.
5. The method of manufacturing according to claim 3, wherein before the step of bonding the pre-package substrate provided with the plurality of Micro-LED chips to the driving substrate, further comprising:
and an adhesive layer is arranged on one side of the encapsulation layer and/or the driving substrate.
6. The method of claim 2, wherein the package substrate is a rigid film or a flexible film.
7. A display panel, comprising:
a driving substrate;
the prefabricated packaging substrate is arranged opposite to the driving substrate;
a plurality of Micro-LED chips fixed on one side of the prefabricated packaging substrate facing the driving substrate; and a plurality of Micro-LED chips are electrically connected with the driving substrate.
8. The display panel according to claim 7, wherein the pre-package substrate comprises a package substrate and a buffer adhesive material, one side of the package substrate is provided with a plurality of pits, and the buffer adhesive material is filled in the pits;
and the Micro-LED chips are fixed on the packaging substrate through the buffer adhesive material.
9. A display panel, comprising
A driving substrate;
the prefabricated packaging substrate is arranged opposite to the driving substrate;
the Micro-LED chips are arranged between the driving substrate and the prefabricated packaging substrate, and no conductive buffer glue layer is arranged between the Micro-LED chips and the driving substrate; and a plurality of Micro-LED chips are electrically connected with the driving substrate.
10. A display device comprising the display panel of any one of claims 7-9.
CN202111423622.1A 2021-11-26 2021-11-26 Display panel, preparation method thereof and display device Pending CN116190499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111423622.1A CN116190499A (en) 2021-11-26 2021-11-26 Display panel, preparation method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111423622.1A CN116190499A (en) 2021-11-26 2021-11-26 Display panel, preparation method thereof and display device

Publications (1)

Publication Number Publication Date
CN116190499A true CN116190499A (en) 2023-05-30

Family

ID=86450989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111423622.1A Pending CN116190499A (en) 2021-11-26 2021-11-26 Display panel, preparation method thereof and display device

Country Status (1)

Country Link
CN (1) CN116190499A (en)

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