CN116190401A - Display panel and preparation method thereof - Google Patents

Display panel and preparation method thereof Download PDF

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Publication number
CN116190401A
CN116190401A CN202111421630.2A CN202111421630A CN116190401A CN 116190401 A CN116190401 A CN 116190401A CN 202111421630 A CN202111421630 A CN 202111421630A CN 116190401 A CN116190401 A CN 116190401A
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China
Prior art keywords
light
emitting device
repairing
emitting
repair
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CN202111421630.2A
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Chinese (zh)
Inventor
董小彪
盛翠翠
王岩
王磊
林佳桦
宋玉华
钱先锐
葛泳
王程功
黄秀颀
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Chengdu Vistar Optoelectronics Co Ltd
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Chengdu Vistar Optoelectronics Co Ltd
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Priority to CN202111421630.2A priority Critical patent/CN116190401A/en
Publication of CN116190401A publication Critical patent/CN116190401A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application discloses display panel and preparation method thereof, display panel includes: a drive back plate; at least one repair light emitting device and a plurality of original light emitting devices positioned on the first surface of the driving back plate; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is greater than the distance from the side surface of the original light-emitting device, which is away from the driving back plate, to the first surface. Through the mode, the repairing success rate can be improved.

Description

Display panel and preparation method thereof
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel and a preparation method thereof.
Background
The Micro-LED display technology has the advantages of high brightness, high response speed, low power consumption, long service life and the like, and is now becoming a research hotspot for pursuing a new generation of display technology.
In the Micro-LED mass transfer process, bad points exist in the Micro-LEDs transferred to the driving backboard in a mass manner due to the limitation of the Micro-LED process or the loss of the mass transfer process. Therefore, it is necessary to secure the display effect of the display panel through the dead pixel repair process. However, the current repair process of the Micro-LED display panel has the problem of low repair success rate.
Disclosure of Invention
The application provides a display panel and a preparation method thereof, so as to improve the repair success rate.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: provided is a display panel including: a drive back plate; at least one repair light emitting device and a plurality of original light emitting devices positioned on the first surface of the driving back plate; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is greater than the distance from the side surface of the original light-emitting device, which is away from the driving back plate, to the first surface.
The original light-emitting device comprises an original light-emitting main body; preferably, the transparent buffer layer has a thickness of 0.1 micrometers to 1 micrometer. The design mode is simple, and the process is easy to realize.
The first surface of the driving backboard is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas, the normal bonding areas and the adjacent redundant bonding areas form a bonding group, and one bonding group corresponds to one repairing light-emitting device or one original light-emitting device; the repair light-emitting device is electrically connected with the redundant bonding region, and the original light-emitting device is electrically connected with the normal bonding region. Compared with in-situ repair, the redundant repair mode can reduce repair difficulty and improve repair yield.
The original light-emitting device is fixedly connected with the driving backboard through a second solder layer; wherein the melting point of the first welding material layer is lower than that of the second welding material layer. The design mode can reduce the influence of heat generated when the light-emitting device is repaired and the back plate is driven to be bonded on surrounding original light-emitting devices.
The original light-emitting device is fixedly connected with the driving backboard through a second solder layer; wherein the height of the first solder layer is greater than the height of the second solder layer. The method is simple and the process is easy to realize.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: provided is a method of manufacturing a display panel, including: after a plurality of original light emitting devices are arranged on the first surface of the driving backboard, detecting the plurality of original light emitting devices; removing the original light emitting devices with abnormal brightness in response to the abnormal brightness of at least one original light emitting device, and forming a vacancy on the driving backboard; arranging a repair light emitting device at or around the void; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is greater than the distance from the side surface of the driving back plate, which is away from the first surface, of all the original light-emitting devices remained on the driving back plate.
Wherein the step of disposing a repair light emitting device at or around the void comprises: obtaining a repair light-emitting body having the same light-emitting color as the original light-emitting device having abnormal brightness; the repairing luminous main body comprises a light-emitting surface and a non-light-emitting surface which are arranged in a back-to-back mode; a transparent buffer layer is arranged on the light-emitting surface of the repairing luminous main body so as to form the repairing luminous device; and enabling the non-light-emitting surface of the repairing light-emitting main body to face the driving backboard, and bonding and connecting the repairing light-emitting device with the vacancy or the surrounding of the vacancy. The steps for setting and repairing the light-emitting device are simpler, and the process is easy to realize.
Wherein the step of obtaining a repair light-emitting body having the same light-emitting color as the original light-emitting device having abnormal brightness includes: obtaining a growth substrate, wherein a plurality of repairing luminous bodies are arranged on the growth substrate; the side, provided with a plurality of repairing luminous bodies, of the growth substrate faces the temporary substrate, and the non-light-emitting surface of the repairing luminous body is fixed with a bonding adhesive layer on the temporary substrate; removing the growth substrate; preferably, the step of disposing a repair light emitting device at or around the void comprises: and simultaneously transferring a plurality of repair light emitting devices from the temporary substrate to the empty spaces at corresponding positions or around the empty spaces by using a transfer assembly. The design mode can improve the repairing efficiency.
Wherein before the step of arranging the plurality of repairing light-emitting main bodies on the growth substrate, the step of arranging the plurality of repairing light-emitting main bodies on the temporary substrate comprises the following steps: a first solder layer is arranged on the non-light-emitting surface; the melting point of the first welding material layer is lower than that of a second welding material layer between the original light-emitting device and the driving backboard. The design mode can reduce the influence of heat generated when the light-emitting device is repaired and the back plate is driven to be bonded on surrounding original light-emitting devices.
Wherein, the step of disposing a plurality of original light emitting devices on the first surface of the driving back plate includes: providing a driving backboard, wherein a plurality of normal bonding areas and a plurality of redundant bonding areas are arranged on the first surface of the driving backboard, and the normal bonding areas and the adjacent redundant bonding areas form a bonding group; forming a first welding material layer on a plurality of the redundant bonding areas, and forming a second welding material layer on a plurality of the normal bonding areas; wherein the height of the first solder layer is greater than the height of the second solder layer; and arranging the original light-emitting device on the second solder layer of at least part of the normal bonding region. The design mode is simpler, and the process is easy to realize.
Preferably, the step of repairing the light emitting device around the void includes: obtaining a target bonding group where the original light-emitting device with abnormal brightness is located; and arranging a repairing light-emitting device on the redundant bonding region of the target bonding group. Compared with in-situ repair, the redundant repair mode has higher repair yield.
In the prior art case of distinguishing, the beneficial effect of this application is: the display panel comprises a driving backboard, at least one repairing light-emitting device and a plurality of original light-emitting devices, wherein the at least one repairing light-emitting device and the plurality of original light-emitting devices are arranged on the first surface of the driving backboard; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is larger than the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface. The design mode can ensure that the transfer head for transferring the repaired light-emitting device does not influence other surrounding original light-emitting devices in the repairing process so as to improve the repairing yield; when the number of the repairing light emitting devices is multiple, the repairing light emitting devices can be simultaneously transferred to the corresponding positions by using the transfer head in the design mode, so that the repairing efficiency is improved.
In addition, the melting point of the first welding material layer between the repairing light-emitting device and the driving backboard is lower than that of the second welding material layer between the original light-emitting device and the driving backboard, and the design mode can reduce the influence of heat generated when the repairing light-emitting device and the driving backboard are bonded on surrounding original light-emitting devices, so that the yield and the repairing success rate of the display panel are ensured.
Drawings
For a clearer description of the technical solutions in the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic structural diagram of an embodiment of a display panel of the present application;
FIG. 2 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 3 is a schematic structural diagram of another embodiment of a display panel according to the present application;
FIG. 4 is a schematic top view of an embodiment of a driving back plate;
FIG. 5 is a schematic flow chart of an embodiment of a method for manufacturing a display panel according to the present disclosure;
fig. 6 is a flowchart of an embodiment corresponding to step S103 in fig. 5;
fig. 7 is a flowchart of an embodiment corresponding to step S201 in fig. 6;
fig. 8a is a schematic structural diagram of an embodiment corresponding to step S301 in fig. 7;
FIG. 8b is a schematic diagram illustrating an embodiment of the method of FIG. 7 corresponding to step S302;
fig. 8c is a schematic structural diagram of an embodiment corresponding to step S303 in fig. 7;
fig. 8d is a schematic structural diagram of an embodiment corresponding to step S202 in fig. 6;
fig. 8e is a schematic structural diagram of an embodiment corresponding to step S203 in fig. 6.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a display panel of the present application, the display panel 1 may be a Micro-LED display panel, etc., and the display panel 1 includes a driving back plate 10, at least one repair light emitting device 12 and a plurality of original light emitting devices 14.
Specifically, the driving back plate 10 may be an LTPS back plate, an IGZO back plate, an LTPO back plate, or the like, in which a plurality of pixel driving circuits are disposed, and the structure of the pixel driving circuits may be any of the prior art; for example, the pixel driving circuit may be 2T1C, 7T1C, or the like, and will not be described here. The repair light emitting device 12 and the original light emitting device 14 may be located on the first surface 100 of the driving back plate 10, a plurality of exposed bonding regions are disposed on the first surface 100 of the driving back plate 10, and the repair light emitting device 12 and the original light emitting device 14 may be bonded and connected with the bonding regions at corresponding positions. Wherein, the distance from the side surface of the repairing light emitting device 12 facing away from the driving back plate 10 to the first surface 100 is greater than the distance from the side surface of all the original light emitting devices 14 facing away from the driving back plate 10 to the first surface 100. Alternatively, in the present embodiment, the original light emitting device 14 disposed on the driving back plate 10 may emit red light, green light, blue light, or the like, and the thicknesses of the original light emitting devices 14 emitting different colors of light may be different. At this time, the distance from the side surface of the repair light emitting device 12 facing away from the driving back plate 10 to the first surface 100 is larger than the distance from the side surface of the original light emitting device 14 having the same light emitting color facing away from the driving back plate 10 to the first surface 100, but also larger than the distance from the side surface of the original light emitting device 14 having a different light emitting color facing away from the driving back plate 10 to the first surface 100. The design mode can ensure that the transfer head for transferring the repairing light-emitting device 12 does not influence the surrounding other original light-emitting devices 14 in the repairing process so as to improve the repairing yield; when the number of the repairing light emitting devices 12 is plural, the above design method can use the transfer head to transfer the plural repairing light emitting devices 12 to the corresponding positions at the same time, so as to improve the repairing efficiency.
In one embodiment, as shown in fig. 1, the repair light emitting device 12 includes a repair light emitting body 120 and a transparent buffer layer 122 on a side of the repair light emitting body 120 facing away from the driving back plate 10; the primary light emitting device 14 includes a primary light emitting body 140, and a transparent buffer layer is not disposed on a side of the primary light emitting body 140 facing away from the driving back plate 10. In the above design manner, the transparent buffer layer 122 is introduced to make the way of repairing the distance from the side surface of the light emitting device 12 facing away from the driving back plate 10 to the first surface 100 greater than the distance from the side surface of the original light emitting device 14 facing away from the driving back plate 10 to the first surface 100 simpler, and the process is easy to implement. Of course, in other embodiments, a bonding electrode (not labeled) is further disposed on the side of the repair light emitting device 12 and the original light emitting device 14 facing the driving back plate 10, and the repair light emitting device 12 and the original light emitting device 14 are bonded to the driving back plate 10 through the bonding electrode.
Alternatively, for the repair light emitting device 12 and the original light emitting device 14 having the same light emitting color, the thickness and structure of the repair light emitting body 120 may be the same as those of the original light emitting body 140, and the design may reduce the complexity of the process preparation. Alternatively, the thickness and structure of the repair light emitting device 12 having different light emission colors may be different from each other by adjusting the thickness of the transparent buffer layer 122 so that the overall thickness of all the repair light emitting devices 12 having different light emission colors is the same. The design method can reduce the difficulty of transferring the repairing light-emitting devices 12 in batches later, and provides technical support for transferring the repairing light-emitting devices 12 with different light-emitting colors simultaneously.
The transparent buffer layer 122 may be made of an inorganic material, such as SiOx or SiNx, and may be formed by vapor deposition. Of course, the material of the transparent buffer layer 122 may be an organic material, such as polyurethane, epoxy, etc., and may be formed by coating and curing. Optionally, the thickness of the transparent buffer layer 122 is 0.1 micrometers-1 micrometer (e.g., 0.2 micrometers, 0.5 micrometers, 0.8 micrometers, etc.). The thickness design manner can ensure the light-emitting efficiency of the repairing light-emitting device 12 on the basis of realizing the purpose that the distance from the side surface of the repairing light-emitting device 12, which is far away from the driving back plate 10, to the first surface 100 is larger than the distance from the side surface of all the original light-emitting devices 14, which is far away from the driving back plate 10, to the first surface 100.
With continued reference to fig. 1, the repair light emitting device 12 is fixedly connected to the driving back plate 10 through the first solder layer 16, and the original light emitting device 14 is fixedly connected to the driving back plate 10 through the second solder layer 18; wherein the melting point of the first solder layer 16 is lower than the melting point of the second solder layer 18. For example, the material of the first solder layer 16 may be low melting point alloy solder, such as In/Sn/Bi alloy; the material of the second solder layer 18 may be ACF, metal solder (such as In, sn, inSn alloy). The above design method can reduce the influence of the heat generated when repairing the light emitting device 12 and driving the back plate 10 to the surrounding original light emitting device 14, so as to ensure the yield and repair success rate of the display panel 1.
In another embodiment, referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of a display panel of the present application, in this embodiment, a repair light-emitting device 12 is fixedly connected to a driving back plate 10 through a first solder layer 16, and an original light-emitting device 14 is fixedly connected to the driving back plate 10 through a second solder layer 18; wherein the height of the first solder layer 16 is greater than the height of the second solder layer 18. In the above design manner, the first solder layer 16 with a higher height is used to make the distance from the side surface of the repairing light emitting device 12 facing away from the driving back plate 10 to the first surface 100 greater than the distance from the side surface of the original light emitting device 14 facing away from the driving back plate 10 to the first surface 100, which is simpler and the process is easy to implement. At this time, the structure and thickness of the repair light emitting device 12 may be the same as those of the original light emitting device 14 capable of emitting the same color, to reduce the complexity of the process preparation. In addition, the melting point of the first solder layer 16 may be lower than that of the second solder layer 18 to reduce the influence of the heat generated when repairing the light emitting device 12 and the driving back plate 10 to the surrounding original light emitting device 14.
In another embodiment, referring to fig. 3, fig. 3 is a schematic structural diagram of another embodiment of a display panel of the present application. In the present embodiment, the manner of fig. 1 and 2 may be combined, that is, the height of the first solder layer 16 is increased while introducing the transparent buffer layer 122 in repairing the light emitting device 12.
In this embodiment, the repairing process of the display panel 1 may take an in-situ repairing method, that is, after the original light emitting device 14 having abnormal light emission is removed, a repairing light emitting device 12 is reintroduced at the position. Of course, in other embodiments, referring to fig. 4, fig. 4 is a schematic top view of an embodiment of the driving back plate, and the repairing process of the display panel 1 may adopt a redundancy repairing method. Specifically, the first surface 100 of the driving backboard 10 is provided with a plurality of normal bonding areas 110 and a plurality of redundant bonding areas 112, and the normal bonding areas 110 and the adjacent redundant bonding areas 112 form a bonding group 11, and one bonding group 11 corresponds to one repair light emitting device 12 or one original light emitting device 14; wherein repair light emitting device 12 (not shown in fig. 4) is electrically connected to redundant bonding region 112, and original light emitting device 14 (not shown in fig. 4) is electrically connected to normal bonding region 110. When the original light emitting device 14 that is abnormally illuminated is removed, a repair light emitting device 12 may be introduced on the redundant bonding region 112 that is located within the same bonding group 11 as the original light emitting device 14 that is abnormally illuminated. Compared with in-situ repair, the redundant repair mode can reduce repair difficulty and improve repair yield. Alternatively, in the present embodiment, the plurality of normal bonding areas 110 and the plurality of redundant bonding areas 112 on the driving back plate 10 may be arranged in an array along the row direction and the column direction, and the redundant bonding areas 112 in the same bonding group 11 may be located in the row direction or the column direction of the normal bonding areas 110, which is not limited in this application.
Further, similar to the embodiments described above, the redundant bonding region 112 may have the first solder layer 16 disposed thereon, the normal bonding region 110 may have the second solder layer 18 disposed thereon, and the first solder layer 16 may have a height greater than the second solder layer 18. For example, the height of the first solder layer 16 is 1-2 microns (e.g., 1.5 microns, etc.) higher than the height of the second solder layer 18. Further, the melting point of the first solder layer 16 may be lower than the melting point of the second solder layer 18. The structure of the repair light emitting device 12 disposed on the redundant bonding region 112 may be the same as that of fig. 1 or 2, and will not be described herein.
In addition, referring to fig. 1 again, the display panel 1 may further include a limiting layer 13, in which a plurality of openings are disposed in the limiting layer 13, and each bonding area on the driving back plate 10 is exposed from the opening; and the thickness of the stopper layer 13 is smaller than that of the original light emitting device 14. The probability of repairing the positional shift of the light emitting device 12 and the original light emitting device 14 can be reduced by introducing the stopper layer 13. Alternatively, the spacing layer 13 may be an insulating layer formed on the driving back plate 10, or the spacing layer 13 may be formed as a film layer in the driving back plate 10, which is not limited in this application.
Referring to fig. 5, fig. 5 is a schematic flow chart of an embodiment of a method for manufacturing a display panel of the present application, where the method specifically includes:
s101: after a plurality of original light emitting devices are arranged on the first surface of the driving backboard, the plurality of original light emitting devices are detected.
Specifically, when the in-situ repair method is adopted, the specific implementation process of the step S101 may be: each bonding region on the first surface of the driving backboard is provided with an original light-emitting device; and after the driving backboard applies an electric signal to each original light-emitting device, the brightness of each original light-emitting device is obtained.
When the redundant repair method is adopted and the structure of the driving back plate is as shown in fig. 4, the above step S101 further includes: providing the driving back plate 10, the first surface 100 of the driving back plate 10 is provided with a plurality of normal bonding areas 110 and a plurality of redundant bonding areas 112, and the normal bonding areas 110 and the adjacent redundant bonding areas 112 form a bonding group 11. The specific implementation process of the step S101 may be: providing an original light emitting device at each of the normal bonding regions 110 on the first surface 100 of the driving backplate 10; after the driving back plate 10 applies an electrical signal to each of the original light emitting devices, the luminance of each of the original light emitting devices is obtained.
S102: and in response to the abnormal brightness of at least one original light emitting device, removing the original light emitting device with abnormal brightness, and driving the backboard to form a vacancy.
Specifically, the luminance abnormality includes luminance lower than a first threshold and luminance higher than a second threshold; wherein the second threshold is greater than the first threshold. The above manner of removing the original light emitting device with abnormal brightness may be: and after melting the solder layer between the original light-emitting device with abnormal brightness and the driving backboard by utilizing laser, removing the original light-emitting device with abnormal brightness.
S103: arranging repairing light-emitting devices around the empty space or empty space; the distance from the side surface of the repairing light emitting device, which is away from the driving back plate, to the first surface is larger than the distance from the side surface of the driving back plate, which is away from the driving back plate, to the first surface of all the original light emitting devices remained on the driving back plate.
Specifically, when an in-situ repair mode is adopted, a repair light-emitting device can be arranged in the vacancy; when a redundant repairing mode is adopted, a target bonding group where an original light-emitting device with abnormal brightness is located can be obtained, and a repairing light-emitting device is arranged on a redundant bonding region of the target bonding group; namely, arranging repairing light-emitting devices around the empty space; and the color of the light emitted by the led repairing light-emitting device is the same as that of the light emitted by the removed original light-emitting device.
In one embodiment, referring to fig. 6, fig. 6 is a flow chart of an embodiment corresponding to step S103 in fig. 5, where step S103 specifically includes:
s201: obtaining a repair light-emitting body having the same light-emitting color as the original light-emitting device having abnormal brightness; the repairing luminous main body comprises a light-emitting surface and a non-light-emitting surface which are arranged in a back-to-back mode.
Specifically, referring to fig. 7, fig. 7 is a flow chart of an embodiment corresponding to step S201 in fig. 6. The specific implementation process of the step S201 may be:
s301: obtaining a growth substrate 20, and disposing a plurality of repairing light emitting bodies 120 on the growth substrate 20; the light-emitting surface 1220 of the repairing light-emitting body 120 is located between the growth substrate 20 and the non-light-emitting surface 1222.
Specifically, referring to fig. 8a, fig. 8a is a schematic structural diagram of an embodiment corresponding to step S301 in fig. 7. The material of the growth substrate 20 may be a sapphire substrate, and the bonding electrode 24 is further disposed on the non-light-emitting surface 1222 side of the repairing light-emitting body 120, and the bonding electrode 24 may include a P electrode and an N electrode.
S302: the growth substrate 20 is provided with a plurality of repairing light emitting bodies 120, the side faces the temporary substrate 26, and the non-light emitting surface 1222 of the repairing light emitting bodies 120 is fixed with the bonding adhesive layer 28 on the temporary substrate 26.
Specifically, referring to fig. 8b, fig. 8b is a schematic structural diagram of an embodiment corresponding to step S302 in fig. 7. In the present embodiment, at least a portion of the bonding electrode 24 on the non-light-emitting surface 1222 of the repairing light-emitting body 120 may be embedded into the bonding adhesive layer 28 to fix the position of the repairing light-emitting body 120.
S303: the growth substrate 20 is removed.
Specifically, referring to fig. 8c, fig. 8c is a schematic structural diagram of an embodiment corresponding to step S303 in fig. 7. In the present embodiment, irradiation may be performed from a side of the growth substrate 20 facing away from the repair light emitting body 120 by a laser light source to separate the growth substrate 20 from the repair light emitting body 120.
S202: the transparent buffer layer 122 is disposed on the light emitting surface 1220 of the repair light emitting body 120 to form the repair light emitting device 12.
Specifically, referring to fig. 8d, fig. 8d is a schematic structural diagram of an embodiment corresponding to step S202 in fig. 6. When the transparent buffer layer 122 is made of inorganic material, it can be formed by vapor deposition; when the transparent buffer layer 122 is made of an organic material, the transparent buffer layer can be formed by coating and curing.
S203: the non-light-emitting surface 1222 of the repair light-emitting body 120 is faced to the driving back plate 10 and the repair light-emitting device 12 is bonded to the void or the void periphery.
Specifically, referring to fig. 8e, fig. 8e is a schematic structural diagram of an embodiment corresponding to step S203 in fig. 6. In the present embodiment, the repair light emitting devices 12 on the temporary substrate 26 may be transferred to the empty space or around the empty space of the driving back plate 10 using the transfer member 23.
In one application scenario, when the driving back plate 10 includes a plurality of voids, and the light emitting colors of the repair light emitting devices 12 to be repaired around the voids are the same, the plurality of repair light emitting devices 12 may be simultaneously transferred from the temporary substrate 26 to the voids or around the voids at the corresponding positions by using the transfer member 23, so as to improve the repair efficiency. In general, the colors of all the repair light emitting devices 12 required to be disposed on the driving back plate 10 may be different, and at this time, the repair light emitting devices 12 of the respective light emitting colors may be transferred to the corresponding positions by the transfer members 23 in batches. Alternatively, the color and position of the repair light emitting device 12 may be set according to the requirement on the driving back plate 10, the repair light emitting device 12 having the corresponding light emitting color may be set at the corresponding position of the temporary substrate 26, and the thickness of all the repair light emitting devices 12 may be the same; and then all the repair light emitting devices 12 on the temporary substrate 26 are simultaneously transferred to the corresponding positions of the driving back plate 10 using the transfer member 23.
As shown in fig. 8e, when the in-situ repair method is adopted, the first solder layer 16 between the repair light emitting device 12 and the driving back plate 10 may be formed on the driving back plate 10 before the repair light emitting device 12 is disposed. Alternatively, the first solder layer 16 may be formed on the repair light emitting device 12. For example, the steps S301 to S302 may further include: disposing a first solder layer 16 on the non-light-emitting surface 1222; wherein the melting point of the first solder layer 16 is lower than the melting point of the second solder layer 18 between the original light emitting device 14 and the driving back plate 10. When the non-light-emitting surface 1222 is provided with bonding electrodes (not labeled), the first solder layer 16 is located on a side of the bonding electrodes facing away from the non-light-emitting surface 1222. In addition, the height of the first solder layer 16 may be greater than the height of the second solder layer 18; at this point, the transparent buffer layer 122 may or may not be subsequently introduced on the light-emitting surface 1220.
When the redundancy repair method is adopted, as shown in fig. 4, when the driving back plate 10 is provided, the first solder layer 16 may be formed in advance in the plurality of redundancy bonding areas 112, and the second solder layer 18 may be formed in the plurality of normal bonding areas 110; wherein the height of the first solder layer 16 is greater than the height of the second solder layer 18. When the repairing light-emitting device 12 is formed later, the first solder layer 16 is not required to be introduced on the repairing light-emitting device 12, and the process is simpler in the design mode; and the design can synchronously form the first solder layer 16 and the second solder layer 18 on the driving backboard 10 so as to improve the process preparation efficiency.
The application further provides a display device, including any display panel in the above embodiments, it can be understood that the display device may be specifically an intelligent device such as a mobile phone, a television, a tablet, an intelligent bracelet, etc., and the effect of the display device may be described above, which is not repeated herein.
The foregoing description is only exemplary embodiments of the present application and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the present application.

Claims (10)

1. A display panel, comprising:
a drive back plate;
at least one repair light emitting device and a plurality of original light emitting devices positioned on the first surface of the driving back plate; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is greater than the distance from the side surface of the original light-emitting device, which is away from the driving back plate, to the first surface.
2. The display panel of claim 1, wherein the display panel comprises,
the repairing light-emitting device comprises a repairing light-emitting main body and a transparent buffer layer positioned on one side of the repairing light-emitting main body, which is away from the driving backboard, and the original light-emitting device comprises an original light-emitting main body;
preferably, the transparent buffer layer has a thickness of 0.1 micrometers to 1 micrometer.
3. The display panel according to claim 1 or 2, wherein,
the first surface of the driving backboard is provided with a plurality of normal bonding areas and a plurality of redundant bonding areas, the normal bonding areas and the adjacent redundant bonding areas form a bonding group, and one bonding group corresponds to one repairing light-emitting device or one original light-emitting device;
the repair light-emitting device is electrically connected with the redundant bonding region, and the original light-emitting device is electrically connected with the normal bonding region.
4. A display panel according to any one of claims 1-3, wherein,
the repair light-emitting device is fixedly connected with the driving backboard through a first solder layer, and the original light-emitting device is fixedly connected with the driving backboard through a second solder layer;
wherein the melting point of the first welding material layer is lower than that of the second welding material layer.
5. The display panel according to any one of claims 1 to 4, wherein,
the repair light-emitting device is fixedly connected with the driving backboard through a first solder layer, and the original light-emitting device is fixedly connected with the driving backboard through a second solder layer;
wherein the height of the first solder layer is greater than the height of the second solder layer.
6. A method for manufacturing a display panel, comprising:
after a plurality of original light emitting devices are arranged on the first surface of the driving backboard, detecting the plurality of original light emitting devices;
removing the original light emitting devices with abnormal brightness in response to the abnormal brightness of at least one original light emitting device, and forming a vacancy on the driving backboard;
arranging a repair light emitting device at or around the void; the distance from the side surface of the repairing light-emitting device, which is away from the driving back plate, to the first surface is greater than the distance from the side surface of the driving back plate, which is away from the first surface, of all the original light-emitting devices remained on the driving back plate.
7. The method of manufacturing according to claim 6, wherein the step of disposing a repair light-emitting device around the void or the void comprises:
obtaining a repair light-emitting body having the same light-emitting color as the original light-emitting device having abnormal brightness; the repairing luminous main body comprises a light-emitting surface and a non-light-emitting surface which are arranged in a back-to-back mode;
a transparent buffer layer is arranged on the light-emitting surface of the repairing luminous main body so as to form the repairing luminous device;
and enabling the non-light-emitting surface of the repairing light-emitting main body to face the driving backboard, and bonding and connecting the repairing light-emitting device with the vacancy or the surrounding of the vacancy.
8. The method according to claim 7, wherein,
the step of obtaining a repair light-emitting body having the same light-emitting color as the original light-emitting device having abnormal brightness includes: obtaining a growth substrate, wherein a plurality of repairing luminous bodies are arranged on the growth substrate; the side, provided with a plurality of repairing luminous bodies, of the growth substrate faces the temporary substrate, and the non-light-emitting surface of the repairing luminous body is fixed with a bonding adhesive layer on the temporary substrate; removing the growth substrate;
preferably, the step of disposing a repair light emitting device at or around the void comprises: and simultaneously transferring a plurality of repair light emitting devices from the temporary substrate to the empty spaces at corresponding positions or around the empty spaces by using a transfer assembly.
9. The method of manufacturing according to claim 8, wherein before the step of disposing the growth substrate with the plurality of repair light-emitting bodies facing the temporary substrate, comprising:
a first solder layer is arranged on the non-light-emitting surface; the melting point of the first welding material layer is lower than that of a second welding material layer between the original light-emitting device and the driving backboard.
10. The method according to claim 6, wherein,
the step of disposing a plurality of original light emitting devices on the first surface of the driving back plate includes:
providing a driving backboard, wherein a plurality of normal bonding areas and a plurality of redundant bonding areas are arranged on the first surface of the driving backboard, and the normal bonding areas and the adjacent redundant bonding areas form a bonding group; forming a first welding material layer on a plurality of the redundant bonding areas, and forming a second welding material layer on a plurality of the normal bonding areas; wherein the height of the first solder layer is greater than the height of the second solder layer;
disposing the original light emitting device on the second solder layer of at least a portion of the normal bonding region;
preferably, the step of repairing the light emitting device around the void includes: obtaining a target bonding group where the original light-emitting device with abnormal brightness is located; and arranging a repairing light-emitting device on the redundant bonding region of the target bonding group.
CN202111421630.2A 2021-11-26 2021-11-26 Display panel and preparation method thereof Pending CN116190401A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111421630.2A CN116190401A (en) 2021-11-26 2021-11-26 Display panel and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111421630.2A CN116190401A (en) 2021-11-26 2021-11-26 Display panel and preparation method thereof

Publications (1)

Publication Number Publication Date
CN116190401A true CN116190401A (en) 2023-05-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111421630.2A Pending CN116190401A (en) 2021-11-26 2021-11-26 Display panel and preparation method thereof

Country Status (1)

Country Link
CN (1) CN116190401A (en)

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