CN116190068A - Inductance electrode structure, inductance and manufacturing method thereof - Google Patents

Abstract

The inductance electrode structure comprises an inductance conductor arranged on an electrode surface on an inductance magnet, wherein the inductance conductor is connected with an internal coil of the inductance magnet, the inductance electrode structure further comprises a filler which is tightly filled around the inductance conductor and is consistent with the height of the inductance conductor, a metallized layer is attached to the surface of the inductance conductor, which is consistent with the height of the filler, and an insulating layer is coated on the surface of the inductance magnet except for the metallized layer. The inductance electrode structure is applicable to different electrode dimensions, has larger electrode area compared with a structure in which an inductance conductor is directly used as an electrode, has extremely small electrode and electrode range, can ensure high reliability requirements during welding of an inductance patch, increases mechanical properties, reduces the influence of external environment of temperature and humidity, reduces cold welding and improves yield.

Description

Inductance electrode structure, inductance and manufacturing method thereof

Technical Field

The present invention relates to inductance electrodes, and more particularly, to an inductance electrode structure, an inductance, and a method for manufacturing the inductance.

Background

An inductor is an electronic component which works by utilizing the electromagnetic conversion principle and is widely distributed in electronic circuits of various electronic products. The inductor can be divided into a winding type, a laminated type and a film patch type according to different processes, wherein the patch inductor has the characteristics of high saturation, high reliability, high precision and miniaturization, so that the patch inductor has unique advantages in the fields of consumer electronics, digital products, mobile communication, computers, set top boxes, automobile electronics and the like. Electronic products are continuously moving toward miniaturization, light weight and high performance, and higher requirements are put on the reliability and integration design of patch inductors. The patch inductor mainly comprises three parts, namely a coil, a magnetic core and an electrode. The electrode structure is mainly used for electrically connecting the electronic component and an external circuit, such as a printed circuit board (Printed Circuit Board, PCB), and the end (terminal) of the conductive component in the electronic component is an electrical connection welding spot. The electrode structure design is a key factor influencing the weldability, the welding resistance and the integrated design of the inductor. Therefore, the chip inductor is designed with consideration of the weldability, the welding resistance and the high reliability of the electrode.

The conventional patch inductance electrode can be divided into an L-shaped electrode, an end electrode, a bottom electrode and the like according to the appearance, the L-shaped electrode needs to consider the gap of a side inductance when the PCB is designed so as to avoid the phenomenon of tin connection, the same size needs to consider the size allowance of the side electrode, and the utilization rate of a magnet is reduced; the terminal electrode also needs to consider the problem of tin connection; the bottom electrode tin-dipping process has weaker electrode adhesion and is easy to oxidize. These problems can render the electrode susceptible to affecting its characteristics due to changes in temperature and humidity, for example: reducing the electrical performance and mechanical strength in certain known applications and even affecting the yield of electronic components during manufacture.

It should be noted that the information disclosed in the above background section is only for understanding the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

The invention aims to overcome the defects of the background technology and provide an inductance electrode structure, an inductance and a manufacturing method thereof.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

the inductance electrode structure comprises an inductance conductor arranged on an electrode surface of an inductance magnet, wherein the inductance conductor is connected with an internal coil of the inductance magnet, the inductance electrode structure further comprises a filler which is tightly filled around the inductance conductor and is consistent with the height of the inductance conductor, a metallized layer is attached to the surface of the inductance conductor, which is consistent with the height of the filler, and an insulating layer is coated on the surface of the inductance magnet except for the metallized layer.

Further:

the filler is epoxy resin or conductive adhesive.

The temperature resistance grade of the epoxy resin is more than 200 ℃.

The conductive adhesive comprises epoxy resin with a temperature resistance level of more than 200 ℃ and conductive metal powder, wherein the conductive metal powder is copper powder or silver powder.

The insulating layer is an inorganic insulating coating layer or an organic insulating coating layer, the inorganic insulating coating layer is an oxide or salt substance containing at least one or more elements of Si, al and P, and the organic insulating coating layer is epoxy resin with the heat resistance grade of more than 200 ℃.

The metallization layer is formed by sequentially laminating Cr, ni and Ag, or sequentially laminating Ni and Sn.

The electrode structure is a bottom electrode, a terminal electrode or an L-shaped electrode.

An inductor is provided with the inductor electrode structure.

A manufacturing method of an inductance electrode comprises the following steps:

s1, coating a filler on an electrode surface on an inductance magnet, enabling the electrode surface to cover an inductance conductor, filling the filler around the inductance conductor, and solidifying the inductance conductor;

s2, coating an insulating layer on the whole inductor treated in the step S1 by using an insulating material;

s3, exposing the surface of the inductance conductor through material reduction treatment of the insulating material and the filler, wherein the height of the filler after material reduction treatment is consistent with that of the inductance conductor;

and S4, forming a metallization layer on the surface of the inductance conductor with the uniform height of the filler.

Further:

in the step S1, the coating is blade coating or spraying; and (5) bonding and shaping the filler by adopting a baking or quick-drying curing mode.

In step S2, the insulating layer is coated by dipping or brushing.

In step S3, the material reduction treatment is realized by polishing or engraving.

In step S4, the metallization layer is formed by electroplating or PVD processing.

The invention has the following beneficial effects:

the invention provides an inductance electrode structure and a manufacturing method thereof, wherein a filler with the same height as the inductance conductor is tightly filled and solidified around the inductance conductor arranged on an electrode surface, a metallization layer is attached to the surface with the same height as the inductance conductor and the filler, and the rest surfaces of the inductance magnet are coated with insulation layers.

Drawings

Fig. 1 is a schematic diagram of an inductor structure after the filler is coated according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of an inductor structure with an insulating layer coated on the surface according to an embodiment of the invention.

Fig. 3 is a schematic diagram of an inductance structure after material reduction treatment according to an embodiment of the invention.

Fig. 4 is a schematic diagram of a manufactured inductor electrode according to an embodiment of the present invention.

Fig. 5 is a flowchart of a method for manufacturing an inductance electrode structure according to an embodiment of the invention.

Reference numerals:

001. inductance magnet

002. Inductance conductor

003. Insulating layer

004. Filling material

005. Metallization layer

Detailed Description

The following describes embodiments of the present invention in detail. It should be emphasized that the following description is merely exemplary in nature and is in no way intended to limit the scope of the invention or its applications.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. In addition, the connection may be for both a fixing action and a coupling or communication action.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing embodiments of the invention and to simplify the description by referring to the figures, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 4, an embodiment of the present invention provides an inductance electrode structure, which includes an inductance conductor 002 disposed on an electrode surface on an inductance magnet 001, wherein the inductance conductor 002 is connected with an internal coil of the inductance magnet 001, and further includes a filler 004 tightly filled around the inductance conductor 002 and having a height identical to that of the inductance conductor 002, a metallization layer 005 is attached to a surface of the inductance conductor 002 and the filler 004 having a height identical to that of the inductance conductor 002, and an insulating layer 003 is coated on a surface of the inductance magnet 001 except for the metallization layer 005.

In some embodiments, the filler 004 is epoxy or conductive glue.

In a preferred embodiment, the epoxy resin has a temperature resistance rating of 200 ℃ or higher.

In a preferred embodiment, the conductive adhesive comprises epoxy resin with a temperature resistance level of 200 ℃ or more and conductive metal powder, wherein the conductive metal powder is copper powder or silver powder.

In some embodiments, the insulating layer 003 is an inorganic insulating coating layer or an organic insulating coating layer, the inorganic insulating coating layer is an oxide or salt substance containing at least one or more elements of Si, al, and P, and the organic insulating coating layer is an epoxy resin with a heat resistance rating of 200 ℃ or higher.

In some embodiments, the metallized layer 005 is a stack of Cr, ni, ag, or a stack of Ni, sn.

As shown in fig. 1 to 5, the embodiment of the invention further provides a method for manufacturing an inductance electrode, which includes the following steps:

s1, coating a filler 004 on an electrode surface on an inductance magnet 001, enabling the electrode surface to cover an inductance conductor 002, filling the filler around the inductance conductor 002, and solidifying the filler;

s2, coating the whole inductor treated in the step S1 with an insulating layer 003 by using an insulating material;

s3, exposing the surface of the inductance conductor 002 by performing material reduction treatment on the insulating layer 003 and the filler 004, so that the height of the filler 004 after the material reduction treatment is consistent with that of the inductance conductor 002;

and S4, forming a metallization layer 005 on the surface of the inductance conductor 002 and the filler 004 with the uniform height.

In some embodiments, in step S1, the inductor electrode surface 003 is coated with the filler 004, and then is bonded and shaped by baking or quick-drying curing. After the coating and curing are completed, the insulating material is coated on the inductance sample in step S2. And S3, removing the insulating film on the surface of the original electrode conductor and exposing the wire conductor through material reduction treatment, wherein the height of the filler 004 is kept consistent with that of the conductor 002 after the material reduction treatment so as to ensure the flatness of the electrode after the subsequent metallization treatment. And S4, metallizing, namely, electroplating or PVD and the like are carried out on the conductor 002 and the filler 004 which are subjected to the material reduction processing, so that a layer of Ni or Sn or other conductive metal mixture is formed on the surface of the conductor 002 and the filler.

Specific embodiments of the present invention are described further below. Fig. 5 shows a manufacturing flow of an inductance electrode structure according to an embodiment of the present invention, which specifically includes the following steps:

1. coating filler

The inductance electrode surface 003 which takes the inductance conductor 002 as an electrode is coated with a filler 004, the coating size is determined by the electrode dimension specification, and the filler is cured by baking after coating or is quickly cured and bonded by using a quick-drying filler. Fig. 1 shows the inductor structure after filler application.

2. Coating

Use insulating material to carry out insulating layer cladding with the insulating reliability of reinforcing product to the inductor after S1 the processing, even cladding during the cladding, inductance own edge has the chamfer, avoids the too sharp and damage coating of edge, makes the protective capability of coating reduce. Fig. 2 shows an inductor structure with a surface coated with an insulating material.

3. Material reduction treatment

And carrying out material reduction processing on the inductance winding wire rod subjected to insulating layer coating processing and the filler combined with the inductance winding wire rod, so that the exposed wire rod conductor is removed from the insulating film on the surface of the original electrode conductor, and the height of the filler 004 is required to be consistent with that of the conductor 002 during material reduction processing so as to ensure the flatness of the electrode after subsequent metallization processing, wherein the inductance structure subjected to material reduction processing is shown in fig. 3.

4. Metallization

And (3) carrying out metallization treatment on the conductor 002 and the filler 004 subjected to the material reduction treatment, and attaching a metallization layer 005 to the filler 004 and the conductor connected with the inner coil on the electrode surface of the inductor to obtain an inductor finished product, wherein the metal component of the surface metallization is Ni or Sn or other conductive metal mixtures. Fig. 4 shows an inductance electrode structure manufactured by the present embodiment.

The difference in peel force after the patch for the electrode state is compared with that for the conventional electrode state by experimental data as follows:

table 1: peel force contrast (unit: N) of different patch inductance electrode structures

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The invention provides an inductance electrode structure and a manufacturing method thereof, wherein a filler with the same height as the inductance conductor is tightly filled and solidified around the inductance conductor arranged on an electrode surface, a metallization layer is attached to the surface with the same height as the inductance conductor and the surface with the same height as the filler, and the rest surfaces of an inductance magnet are coated with insulation layers.

In various embodiments of the present invention, in the step of coating the filler, the type of the filler and the coating process means are not limited, and the filler may be epoxy resin, conductive adhesive, or the like, and the coating process means may be blade coating, spray coating, or the like. In the coating step, the coating material and the coating process are not limited, and the material may be SiO2, znO, or the like, and the coating process means may be dipping, brushing, or the like. In the material reduction treatment process, the specific material reduction treatment process means is not limited, and polishing or engraving can be carried out. In the metallization process, the choice and specific construction means of the metallization material are not limited, the metallization material can be Ni or Sn, and the construction means can be electroplating or PVD. The electrode structure is not limited in kind, and the electrode structure may be an L-shaped electrode, a bottom electrode, a terminal electrode, or the like.

The background section of the present invention may contain background information about the problems or environments of the present invention and is not necessarily descriptive of the prior art. Accordingly, inclusion in the background section is not an admission of prior art by the applicant.

The foregoing is a further detailed description of the invention in connection with specific/preferred embodiments, and it is not intended that the invention be limited to such description. It will be apparent to those skilled in the art that several alternatives or modifications can be made to the described embodiments without departing from the spirit of the invention, and these alternatives or modifications should be considered to be within the scope of the invention. In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "preferred embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Those skilled in the art may combine and combine the features of the different embodiments or examples described in this specification and of the different embodiments or examples without contradiction. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope of the invention as defined by the appended claims.

Claims (10)

1. An inductance electrode structure comprises an inductance conductor arranged on an electrode surface of an inductance magnet, wherein the inductance conductor is connected with an internal coil of the inductance magnet, and the inductance electrode structure is characterized by further comprising a filler which is tightly filled around the inductance conductor and is consistent with the height of the inductance conductor, a metallized layer is attached to the surface of the inductance conductor and the height of the filler, and an insulating layer is coated on the surface of the inductance magnet except for the metallized layer.

2. The inductor electrode structure of claim 1, wherein the filler is an epoxy or a conductive paste.

3. The inductor electrode structure of claim 2, wherein the epoxy resin has a temperature resistance rating of 200 ℃ or higher.

4. The inductor electrode structure of claim 2, wherein the conductive paste comprises epoxy resin with a temperature resistance rating of 200 ℃ or higher and conductive metal powder, and the conductive metal powder is copper powder or silver powder.

5. The inductor electrode structure as claimed in any one of claims 1 to 4, wherein the insulating layer is an inorganic insulating coating layer or an organic insulating coating layer, the inorganic insulating coating layer is an oxide or salt substance containing at least one or more elements of Si, al, P, and the organic insulating coating layer is an epoxy resin having a heat resistance rating of 200 ℃ or higher.

6. The inductor electrode structure as claimed in any one of claims 1 to 4, wherein the metallization layers are Cr, ni, ag stacked in sequence or Ni, sn stacked in sequence.

7. The inductive electrode structure of any of claims 1 to 4, wherein said electrode structure is a bottom electrode, a terminal electrode or an L-shaped electrode.

8. An inductor having an inductor electrode structure as claimed in any one of claims 1 to 7.

9. The manufacturing method of the inductance electrode is characterized by comprising the following steps:

s1, coating a filler on an electrode surface on an inductance magnet, enabling the electrode surface to cover an inductance conductor, filling the filler around the inductance conductor, and solidifying the inductance conductor;

s2, coating an insulating layer on the whole inductor treated in the step S1 by using an insulating material;

s3, exposing the surface of the inductance conductor through material reduction treatment of the insulating material and the filler, so that the height of the filler after material reduction treatment is consistent with that of the inductance conductor;

and S4, forming a metallization layer on the surface of the inductance conductor with the uniform height of the filler.

10. The method of manufacturing an inductor electrode according to claim 9, wherein one or more of the following treatments are used:

in the step S1, the coating is blade coating or spraying; the filler is bonded and shaped by adopting a baking or quick-drying curing mode;

in the step S2, the insulating layer is coated by soaking or brushing;

in the step S3, the material reduction treatment is realized through polishing or engraving;

in step S4, the metallization layer is formed by electroplating or PVD processing.

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