CN116171023A - Micro-channel heat radiation structure with bionic structure and heat radiation device - Google Patents
Micro-channel heat radiation structure with bionic structure and heat radiation device Download PDFInfo
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- CN116171023A CN116171023A CN202310217469.XA CN202310217469A CN116171023A CN 116171023 A CN116171023 A CN 116171023A CN 202310217469 A CN202310217469 A CN 202310217469A CN 116171023 A CN116171023 A CN 116171023A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device, and relates to the technical field of electronic element heat dissipation. The invention comprises the following steps: the first-stage heat dissipation flow channel is connected with a plurality of second-stage heat dissipation flow channels, and the second-stage heat dissipation flow channels and the first-stage heat dissipation flow channels are communicated with each other; and a tertiary heat dissipation runner is arranged between the primary heat dissipation runner and the secondary heat dissipation runner, the tertiary heat dissipation runner is integrally in a vein-like shape, and the tertiary heat dissipation runner is communicated with the primary heat dissipation runner and the secondary heat dissipation runner respectively. The bionic lotus leaf microstructure inner wall modification adopted by the invention reduces heat exchange thermal resistance and flow resistance, the hydrophobicity of the microstructure can enable fluid to flow more rapidly, the capillary action of the three-stage heat dissipation flow channels is enhanced, and the heat dissipation performance of each stage heat dissipation flow channel is indirectly improved.
Description
Technical Field
The invention relates to the technical field of electronic element heat dissipation, in particular to a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device.
Background
At present, when designing a heat dissipation device, air cooling is widely applied to cooling of electronic components as the most mature cooling technology, along with continuous improvement of chip power, in order to cope with huge heat flow which is more than 1000W/cm < 2 > and cannot be processed by convection air cooling, a micro-channel heat dissipation technology adopting cooling liquid for heat dissipation becomes a development direction, and in order to achieve better heat dissipation, a learner adopts leaf veins as a research starting point to design a symmetrical and asymmetrical simulated leaf vein flow channel structure, and fig. 1 and 2 show schematic diagrams of simulated leaf vein Y-shaped micro-channel structures adopted in the prior art, but no microstructure is designed in each flow channel, the simple and smooth flow channel surface can continuously rub with fluid, the fluid flow effect is general, and the pressure loss in the flow channel is large, and heat is concentrated at a flow channel inlet.
Disclosure of Invention
The invention aims to provide a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device, which can enable the whole heat dissipation channel to dissipate heat more rapidly and the temperature to be more uniform when fluid flows through the heat dissipation channel, reduce the pressure drop of the fluid and enable the fluid to flow more smoothly.
In order to achieve the above purpose, the present invention provides the following technical solutions: a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device, comprising:
the first-stage heat dissipation flow channel is connected with a plurality of second-stage heat dissipation flow channels, and the second-stage heat dissipation flow channels and the first-stage heat dissipation flow channels are communicated with each other;
a third-level heat dissipation runner is arranged between the first-level heat dissipation runner and the second-level heat dissipation runner, the whole third-level heat dissipation runner is in a vein-like shape, and the third-level heat dissipation runner is communicated with the first-level heat dissipation runner and the second-level heat dissipation runner respectively;
the bionic lotus leaf micro-structure comprises grooves, wherein protrusions are formed between adjacent grooves.
Furthermore, the number of the first-stage heat dissipation flow channels is one, and the two ends of the first-stage heat dissipation flow channels are respectively provided with an inlet and an outlet.
Further, the plurality of second-stage heat dissipation runners are distributed in a mirror image mode on two sides of the first-stage heat dissipation runner.
Furthermore, a plurality of triangular areas are respectively formed between the plurality of secondary heat dissipation flow channels and the primary heat dissipation flow channels, and the three-stage heat dissipation flow channels in a vein-like shape are distributed in the plurality of triangular areas.
Further, the triangular region is a non-isosceles triangle.
Furthermore, the number of the first-stage heat dissipation flow channels is multiple, and the plurality of first-stage heat dissipation flow channels are distributed in a radial mode as a whole.
Furthermore, the secondary heat dissipation flow channels are arranged in a spider-web-like manner among the plurality of primary heat dissipation flow channels.
Furthermore, a plurality of quadrilateral areas are formed between the secondary heat dissipation flow channel and the primary heat dissipation flow channel, and the three-stage heat dissipation flow channels imitating the veins are distributed in the quadrilateral areas.
Further, the connection parts of the primary heat dissipation flow channel, the secondary heat dissipation flow channel and the tertiary heat dissipation flow channel are provided with chamfers.
According to one aspect of the present invention, a heat dissipating device is provided, including the micro-fluidic channel heat dissipating structure having a bionic structure.
The invention has at least the following beneficial effects:
1. the multistage heat dissipation flow channel based on the topological optimization design of the veins and the cobweb is adopted, the length of the pipeline and the asymmetric irregular distribution of the internal flow channel can cause the flow velocity to generate difference, the flow channel presents unidirectional circulation flow in steady state operation under the action of capillary pressure difference, and the flow channel accords with the shape structure of the bionic veins, so that the area of the heat sink can be fully utilized after topological optimization, and a better heat dissipation effect can be obtained.
2. The bionic lotus leaf microstructure inner wall modification adopted by the invention reduces heat exchange thermal resistance and flow resistance, the hydrophobicity of the microstructure can enable fluid to flow more rapidly, the capillary action of the three-stage heat dissipation flow channels is enhanced, and the heat dissipation performance of each stage heat dissipation flow channel is indirectly improved.
Of course, it is not necessary for any one product to practice the invention to achieve all of the advantages set forth above at the same time.
Drawings
FIG. 1 is a schematic diagram of a Y-shaped micro-channel with simulated veins in the prior art;
FIG. 2 is a schematic diagram of an asymmetric micro-fluidic channel structure with simulated vein topology optimization in the prior art;
FIG. 3 is a schematic overall structure of a first embodiment of the present invention;
FIG. 4 is a schematic overall structure of a second embodiment of the present invention;
fig. 5 is a schematic diagram of a lotus leaf imitation micro-nano structure according to the invention.
Reference numerals:
1. a primary heat dissipation runner; 2. a secondary heat dissipation flow channel; 3. three-stage heat dissipation flow channels; 4. bionic lotus leaf microstructure; 5. a groove; 6. a protrusion; 7. chamfering.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments in this disclosure without inventive faculty, are intended to fall within the scope of this disclosure.
Embodiment one:
referring to fig. 3-4, the present invention provides a technical solution: a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device, comprising: the electronic component cooling device comprises a first-stage cooling flow channel 1, wherein an inlet and an outlet are respectively formed in two ends of the first-stage cooling flow channel 1 and are used for injecting and discharging cooling liquid, so that the cooling liquid is used for absorbing heat and cooling the electronic component;
the first-stage heat dissipation runner 1 is connected with a plurality of second-stage heat dissipation runners 2, the second-stage heat dissipation runners 2 are communicated with the first-stage heat dissipation runner 1, so that cooling liquid can enter the second-stage heat dissipation runners 2 from the first-stage heat dissipation runner 1, the second-stage heat dissipation runners 2 are distributed in a mirror image mode on two sides of the first-stage heat dissipation runner 1, three-stage heat dissipation runners 3 are arranged between the first-stage heat dissipation runner 1 and the second-stage heat dissipation runner 2, and the three-stage heat dissipation runners 3 are communicated with the first-stage heat dissipation runner 1 and the second-stage heat dissipation runner 2 respectively, and cooling liquid entering the first-stage heat dissipation runner 2 and the second-stage heat dissipation runner 2 can flow into the three-stage heat dissipation runners 3 conveniently;
the three-stage heat dissipation flow channels 3 are in a vein-like shape as a whole, a plurality of triangular areas are respectively formed between the two-stage heat dissipation flow channels 2 and the first-stage heat dissipation flow channel 1, and the vein-like three-stage heat dissipation flow channels 3 are arranged in the triangular areas;
the inner walls of the primary heat dissipation flow channel 1, the secondary heat dissipation flow channel 2 and the tertiary heat dissipation flow channel 3 are uniformly provided with a plurality of bionic lotus leaf microstructures 4, each bionic lotus leaf microstructure 4 comprises a groove 5, protrusions 6 are formed between every two adjacent grooves 5, the width of each groove 5 is 5-10 microns, and the width of each protrusion 6 is 5-8 microns.
The connection parts among the first-stage heat dissipation flow channel 1, the second-stage heat dissipation flow channel 2 and the third-stage heat dissipation flow channel 3 are respectively provided with a chamfer 7, and the chamfers 7 are utilized to reduce the resistance of cooling liquid fluid in each-stage heat dissipation flow channel, so that the fluid can be more conveniently diffused from the upper-stage heat dissipation flow channel 1 to the lower-stage heat dissipation flow channel 1.
It should be noted that, as shown in fig. 3, the primary heat dissipation runner 1, the secondary heat dissipation runner 2 and the tertiary heat dissipation runner 3 are all made of copper materials, and may be formed by selective laser sintering 3D printing, and considering that the dispersion and convergence of the cooling liquid are reversible processes, the primary heat dissipation runner 1 and the secondary heat dissipation runner 2 may be regarded as an array formed by triangular areas, the triangular areas are non-isosceles or non-equilateral triangles, in the areas formed by such non-special triangles, the wiener diagram is utilized to topologically optimize the areas, the interior of the random runners can generate capillary action to continuously suck the cooling liquid, and the outlet converges, so that the asymmetric random distribution of the formed tertiary heat dissipation runners 3 can cause the difference of flow velocity, and the steady state working presents unidirectional circulation under the action of capillary pressure difference, thereby fully utilizing the area of the heat dissipation device and obtaining better heat dissipation effect.
The selective laser sintering is that an SLS method adopts an infrared laser as an energy source, the used modeling materials are mainly powder materials, during processing, firstly, the powder is preheated to a temperature slightly lower than the melting point of the powder, and then the powder is paved under the action of a scraping roller; the laser beam is selectively sintered under the control of a computer according to the layering section information, the next layer of sintering is carried out after one layer of sintering is completed, and redundant powder is removed after all sintering is completed, so that a sintered part can be obtained.
The 3D printing, namely a rapid prototyping technology, is also called additive manufacturing, and is a technology for constructing an object by using a powdery metal or plastic and other bondable materials in a layer-by-layer printing mode based on a digital model file, wherein the 3D printing is usually realized by using a digital technical material printer, is usually used for manufacturing models in the fields of mould manufacturing, industrial design and the like, and is gradually used for directly manufacturing some products.
Furthermore, the three-stage heat dissipation runner 3 is a vein-like capillary runner subjected to topological optimization, copper powder is subjected to 3D printing sintering into a structure with a complex runner shape through selective laser sintering during preparation, a nano-scale bionic lotus leaf microstructure 4 is etched in the formed structure by utilizing a femtosecond laser processing technology, then the runner is assembled into a heat dissipation device, a certain volume of working medium is injected into the runner, and then the runner is sealed.
The bionic lotus leaf microstructure 4 can be etched on the inner wall of the flow channel manufactured by adopting a femtosecond laser processing technology; or a photosensitive resin material is adopted, and after the thin wall with the bionic lotus leaf microstructure 4 is manufactured by utilizing a laser forming technology, the thin wall is fixed in each level of heat dissipation flow channels.
Femtosecond laser is a laser operated in a pulse form, which is thousands of times shorter than the shortest pulse obtained by an electronic method, and has very high instantaneous power, which can reach hundreds of trillion watts, which is more than one hundred times higher than the total power generated worldwide, and finally the femtosecond laser can be focused into a space area smaller than the diameter of hair, so that the intensity of an electromagnetic field is more than several times higher than the acting force of atomic checkup of electrons around the femtosecond laser, many of the extreme physical conditions are not available on the earth, and other methods are impossible to obtain, and in the micro-machining field, the method can safely cut, punch and engrave due to the extremely small influence on the periphery of materials, and is even applied to the photoetching process of an integrated circuit.
It should be noted that, as shown in fig. 4, the bionic lotus leaf microstructure 4 mainly refers to a microstructure that imitates the surface of a lotus leaf, so that the bionic lotus leaf microstructure 4 has the hydrophobic property of the surface of the lotus leaf, the grooves 5 in the bionic lotus leaf microstructure 4 are filled with air, so that a layer of extremely thin air layer is formed on the surface of the inner wall of the runner, according to the generally accepted kex-baxter model, the larger the contact area between the liquid and the air on the solid surface, the stronger the hydrophobicity of the surface is, so that when the cooling liquid flows through the bionic lotus leaf microstructure 4, the fluid far larger in size than the structure and the inner wall of the runner are separated by a layer of extremely thin air, only a plurality of point contacts are formed between the fluid and the protrusions 6, and a hydrophobic surface is formed, so that the fluid forms a sphere-like aggregation under the action of self surface tension, and after the inner wall of the runner becomes rough, the contact angle between the fluid and the inner wall of the runner becomes large, the fluid cannot infiltrate into the surface when passing through the hydrophobic surface, thereby causing flow obstruction, and therefore, the heat dissipation resistance of the fluid in each level of the runner can be reduced better.
Specifically, when the structure of the embodiment is used for heat dissipation, a cooling liquid fluid enters the primary heat dissipation flow channel 1 from the inlet, then is diffused into the secondary heat dissipation flow channel 2, flows through the secondary heat dissipation flow channel 2 and enters the irregular tertiary heat dissipation flow channel 3 through capillary action, if bubbles are generated at all levels, the high-temperature fluid is easier to cool through the primary heat dissipation flow channel 1 due to the difference of widths and lengths of all levels, and flows into the secondary and tertiary flow channels to flow back to the primary heat dissipation flow channel 1 and be discharged through the outlet after being cooled by being contacted with the flow channel wall due to the action of capillary pressure difference, wherein the bionic lotus leaf microstructure 4 arranged on the inner wall of each level heat dissipation flow channel can enhance the hydrophobic performance of the cooling liquid fluid and the inner wall of the flow channel, so that when the cooling liquid flows through the flow channel, the contact angle is larger, the heat dissipation speed can be accelerated, the temperature can be more uniform, the pressure drop of the fluid can be reduced, and the flow of the fluid can be smoother.
Embodiment two:
referring to fig. 4-5, the present invention provides a technical solution: a micro-channel heat dissipation structure with a bionic structure and a heat dissipation device, comprising: the heat dissipation device comprises a plurality of primary heat dissipation flow channels 1, wherein the plurality of primary heat dissipation flow channels 1 are integrally arranged in a radial manner, a secondary heat dissipation flow channel 2 is arranged in a spider-web like manner among the plurality of primary heat dissipation flow channels 1, and the secondary heat dissipation flow channels 2 and the primary heat dissipation flow channels 1 are communicated with each other;
a third-level heat dissipation flow channel 3 is arranged between the first-level heat dissipation flow channel 1 and the second-level heat dissipation flow channel 2, a plurality of quadrilateral areas are formed between the second-level heat dissipation flow channel 2 and the first-level heat dissipation flow channel 1, the three-level heat dissipation flow channel 3 in a pseudo-vein shape is arranged in the quadrilateral areas, and the three-level heat dissipation flow channel 3 is communicated with the first-level heat dissipation flow channel 1 and the second-level heat dissipation flow channel 2 respectively;
the inner walls of the primary heat dissipation flow channel 1, the secondary heat dissipation flow channel 2 and the tertiary heat dissipation flow channel 3 are uniformly provided with a plurality of bionic lotus leaf microstructures 4, each bionic lotus leaf microstructure 4 comprises a groove 5, protrusions 6 are formed between every two adjacent grooves 5, the width of each groove 5 is 5-10 microns, and the width of each protrusion 6 is 5-8 microns.
It should be noted that, the fact that the secondary heat dissipation flow channels 2 are arranged in a cobweb-like manner among the plurality of primary heat dissipation flow channels 1 means that the arrangement mode of the secondary heat dissipation flow channels 2 is in a cobweb-like shape, a plurality of quadrilateral areas formed between the secondary heat dissipation flow channels 2 and the primary heat dissipation flow channels 1 can be set to be square or trapezoid, and based on the technical scheme of the embodiment, the quadrilateral areas are set to be trapezoid.
It should be noted that, as shown in fig. 4, the connection positions of the primary heat dissipation flow channel 1, the secondary heat dissipation flow channel 2 and the tertiary heat dissipation flow channel 3 are all provided with chamfers 7, and the chamfers 7 can reduce the resistance of the cooling liquid fluid in each stage of heat dissipation flow channel, so that the fluid can be more conveniently diffused from the previous stage of heat dissipation flow channel 1 to the next stage of heat dissipation flow channel 1.
It should be noted that, as shown in fig. 5, the primary heat dissipation runner 1, the secondary heat dissipation runner 2 and the tertiary heat dissipation runner 3 are all made of copper materials, and may be formed by selective laser sintering 3D printing, and considering that the dispersion and convergence of the cooling liquid are reversible processes, the primary heat dissipation runner 1 and the secondary heat dissipation runner 2 may be regarded as an array formed by quadrilateral regions, and the quadrilateral regions are trapezoidal, in the quadrilateral regions, the vernoniron is utilized to topologically optimize the heat dissipation runners, the interior of the random runners can generate capillary action to continuously suck the cooling liquid, and the asymmetric random distribution of the formed tertiary heat dissipation runners 3 converges at the outlet, so that the flow velocity is different, the unidirectional circulation flow is presented in the steady state working under the action of capillary pressure difference, the area of the heat dissipation device can be fully utilized, and the better heat dissipation effect is obtained.
The selective laser sintering is that an SLS method adopts an infrared laser as an energy source, the used modeling materials are mainly powder materials, during processing, firstly, the powder is preheated to a temperature slightly lower than the melting point of the powder, and then the powder is paved under the action of a scraping roller; the laser beam is selectively sintered under the control of a computer according to the layering section information, the next layer of sintering is carried out after one layer of sintering is completed, and redundant powder is removed after all sintering is completed, so that a sintered part can be obtained.
The 3D printing, namely a rapid prototyping technology, is also called additive manufacturing, and is a technology for constructing an object by using a powdery metal or plastic and other bondable materials in a layer-by-layer printing mode based on a digital model file, wherein the 3D printing is usually realized by using a digital technical material printer, is usually used for manufacturing models in the fields of mould manufacturing, industrial design and the like, and is gradually used for directly manufacturing some products.
Furthermore, the three-stage heat dissipation runner 3 is a vein-like capillary runner subjected to topological optimization, copper powder is subjected to 3D printing sintering into a structure with a complex runner shape through selective laser sintering during preparation, a nano-scale bionic lotus leaf microstructure 4 is etched in the formed structure by utilizing a femtosecond laser processing technology, then the runner is assembled into a heat dissipation device, a certain volume of working medium is injected into the runner, and then the runner is sealed.
The bionic lotus leaf microstructure 4 can be etched on the inner wall of the flow channel manufactured by adopting a femtosecond laser processing technology; or a photosensitive resin material is adopted, and after the thin wall with the bionic lotus leaf microstructure 4 is manufactured by utilizing a laser forming technology, the thin wall is fixed in each level of heat dissipation flow channels.
Femtosecond laser is a laser operated in a pulse form, which is thousands of times shorter than the shortest pulse obtained by an electronic method, and has very high instantaneous power, which can reach hundreds of trillion watts, which is more than one hundred times higher than the total power generated worldwide, and finally the femtosecond laser can be focused into a space area smaller than the diameter of hair, so that the intensity of an electromagnetic field is more than several times higher than the acting force of atomic checkup of electrons around the femtosecond laser, many of the extreme physical conditions are not available on the earth, and other methods are impossible to obtain, and in the micro-machining field, the method can safely cut, punch and engrave due to the extremely small influence on the periphery of materials, and is even applied to the photoetching process of an integrated circuit.
It should be noted that, as shown in fig. 4, the bionic lotus leaf microstructure 4 is mainly set up according to a micro structure on the lotus leaf surface, so that the bionic lotus leaf microstructure 4 has the hydrophobic property of the lotus leaf surface, the grooves 5 in the bionic lotus leaf microstructure 4 are filled with air, so that a layer of extremely thin air layer is formed on the surface of the inner wall of the runner, according to the generally accepted kexi-Baxter model, the larger the contact area between the liquid and the air on the solid surface is, the stronger the hydrophobicity of the surface is, therefore, when the cooling liquid flows through the bionic lotus leaf microstructure 4, the fluid far larger in size than the structure and the inner wall of the runner are separated by a layer of extremely thin air, only a few points are formed between the fluid and the protrusions 6, and a hydrophobic surface is formed, so that the fluid forms a spherical-like aggregation under the action of the surface tension of the fluid, and after the inner wall of the runner becomes rough, the contact angle between the fluid and the inner wall of the runner becomes large, the fluid cannot infiltrate into the surface when passing through the hydrophobic surface, thereby causing flow obstruction, and therefore, the flow resistance of the fluid in the various stages of heat dissipation can be reduced better.
Specifically, when the structure of the embodiment is used for heat dissipation, the cooling liquid fluid enters the radial primary heat dissipation flow channel 1 from the central inlet, then is diffused into the secondary heat dissipation flow channel 2, flows through the secondary heat dissipation flow channel 2, and simultaneously enters the irregular tertiary heat dissipation flow channel 3 through capillary action, after heat absorption, the cooling liquid can directly flow out through the peripheral walls of the various stages of heat dissipation flow channels without converging, wherein the hydrophobicity of the cooling liquid fluid and the inner wall of the flow channels can be enhanced through the bionic lotus leaf microstructures 4 arranged on the inner wall of the various stages of heat dissipation flow channels, so that when the cooling liquid flows through the flow channels, the heat dissipation speed can be accelerated due to the larger contact angle, the fluid pressure drop can be reduced, and the fluid flow is smoother.
According to one aspect of the present invention, a heat dissipating device is provided, including the micro-fluidic channel heat dissipating structure having a bionic structure.
In summary, the selective laser sintering technology adopted by the bionic lotus leaf microstructure 4 and the heat dissipation channels of each level of the bionic vein and the cobweb structure solves the technical problem that complex micro-channels cannot be manufactured in the past by manufacturing the heat dissipation channels, and the bionic lotus leaf microstructure 4 is etched on a substrate by a femtosecond laser processing technology, or a photosensitive resin thin wall with the bionic lotus leaf microstructure 4 is manufactured by a laser forming technology and then fixed in the micro-channels, so that the low resistance and low pressure drop of the flowing of fluid in the micro-channels and sufficient heat dissipation performance are ensured after the forming. It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances. When an element is referred to as being "mounted," "secured" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims (10)
1. The utility model provides a microchannel heat radiation structure with bionic structure which characterized in that includes:
the heat dissipation device comprises a primary heat dissipation flow channel (1), wherein a plurality of secondary heat dissipation flow channels (2) are connected to the primary heat dissipation flow channel (1), and the secondary heat dissipation flow channels (2) are communicated with the primary heat dissipation flow channel (1);
a tertiary heat dissipation runner (3) is arranged between the primary heat dissipation runner (1) and the secondary heat dissipation runner (2), the tertiary heat dissipation runner (3) is in a vein-like shape as a whole, and the tertiary heat dissipation runner (3) is communicated with the primary heat dissipation runner (1) and the secondary heat dissipation runner (2) respectively;
the bionic lotus leaf type heat dissipation device is characterized in that a plurality of bionic lotus leaf microstructures (4) are uniformly distributed on the inner walls of the primary heat dissipation flow channel (1), the secondary heat dissipation flow channel (2) and the tertiary heat dissipation flow channel (3), each bionic lotus leaf microstructure (4) comprises a groove (5) which is formed, and a protrusion (6) is formed between every two adjacent grooves (5).
2. The micro-channel heat dissipation structure with a bionic structure according to claim 1, wherein: the number of the primary heat dissipation flow channels (1) is one, and the two ends of the primary heat dissipation flow channels (1) are respectively provided with an inlet and an outlet.
3. The micro-channel heat dissipation structure with a bionic structure according to claim 2, wherein: the two-stage heat dissipation flow channels (2) are distributed in a mirror image mode on two sides of the first-stage heat dissipation flow channel (1).
4. A micro flow channel heat dissipation structure with bionic structure according to claim 3, wherein: a plurality of triangular areas are respectively formed between the plurality of secondary heat dissipation flow channels (2) and the primary heat dissipation flow channel (1), and the three-stage heat dissipation flow channels (3) imitating the veins are distributed in the triangular areas.
5. The micro-channel heat dissipation structure with a bionic structure according to claim 4, wherein: the triangular region is a non-isosceles triangle.
6. The micro-channel heat dissipation structure with a bionic structure according to claim 1, wherein: the number of the first-stage heat dissipation flow channels (1) is multiple, and the plurality of first-stage heat dissipation flow channels (1) are distributed in a radial mode as a whole.
7. The micro-channel heat dissipation structure with a bionic structure according to claim 6, wherein: the secondary heat dissipation flow channels (2) are arranged in a spider-web-like manner among the plurality of primary heat dissipation flow channels (1).
8. The micro-channel heat dissipation structure with a bionic structure according to claim 7, wherein: a plurality of quadrilateral areas are formed between the secondary heat dissipation flow channel (2) and the primary heat dissipation flow channel (1), and the three-stage heat dissipation flow channels (3) imitating the veins are distributed in the quadrilateral areas.
9. The micro-channel heat dissipation structure with a bionic structure according to claim 1, wherein: the connection parts of the primary heat dissipation flow channel (1), the secondary heat dissipation flow channel (2) and the tertiary heat dissipation flow channel (3) are provided with chamfers (7).
10. A heat dissipation device, comprising a micro flow channel heat dissipation structure having a bionic structure according to any one of claims 1 to 9.
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| CN202310217469.XA CN116171023A (en) | 2023-03-08 | 2023-03-08 | Micro-channel heat radiation structure with bionic structure and heat radiation device |
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| CN202310217469.XA CN116171023A (en) | 2023-03-08 | 2023-03-08 | Micro-channel heat radiation structure with bionic structure and heat radiation device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116632413A (en) * | 2023-07-25 | 2023-08-22 | 苏州市华盛源机电有限公司 | Micro-channel radiator for battery pack of electric automobile |
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2023
- 2023-03-08 CN CN202310217469.XA patent/CN116171023A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116632413A (en) * | 2023-07-25 | 2023-08-22 | 苏州市华盛源机电有限公司 | Micro-channel radiator for battery pack of electric automobile |
| CN116632413B (en) * | 2023-07-25 | 2023-10-03 | 苏州市华盛源机电有限公司 | Micro-channel radiator for battery pack of electric automobile |
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