CN116156389A

CN116156389A - Audio crosstalk optimization circuit, audio crosstalk optimization method and terminal equipment

Info

Publication number: CN116156389A
Application number: CN202310155641.3A
Authority: CN
Inventors: 张雨
Original assignee: Shanghai Wingtech Information Technology Co Ltd
Current assignee: Shanghai Wingtech Information Technology Co Ltd
Priority date: 2023-02-22
Filing date: 2023-02-22
Publication date: 2023-05-23

Abstract

The embodiment of the application discloses an audio crosstalk optimization circuit, an audio crosstalk optimization method and terminal equipment. The audio crosstalk optimizing circuit comprises an audio interface, a grounding passage and a low-resistance module, wherein the audio interface comprises a transmission pin, the grounding pin of the audio playing device is connected with the transmission pin of the audio interface under the condition that the audio playing device is connected with the audio interface, the low-resistance module is connected with the grounding passage (the passage between the transmission pin and the grounding end in parallel, so that the line impedance of the passage between the transmission pin and the grounding end is reduced, the line impedance of the passage between the grounding pin and the grounding end of the audio playing device is reduced, the signal crosstalk generated between the left channel and the right channel of the audio playing device is reduced, and the crosstalk performance of the audio playing device is improved.

Description

Audio crosstalk optimization circuit, audio crosstalk optimization method and terminal equipment

Technical Field

The application relates to the technical field of electronic circuits, in particular to an audio crosstalk optimization circuit, an audio crosstalk optimization method and terminal equipment.

Background

The audio playing device comprises a left channel playing circuit and a right channel playing circuit, wherein the left channel playing circuit and the right channel playing circuit are connected to the grounding end of the terminal device through grounding pins in the audio playing device to realize grounding, namely the left channel playing circuit and the right channel playing circuit are grounded through a common grounding loop, so that playing of audio signals is realized.

However, due to the impedance of the common ground loop, signal crosstalk between the left channel playing circuit and the right channel playing circuit is caused, so that the difference between the left channel and the right channel is not obvious, the sound field distribution is disordered, and the experience of the audio and video scene of the user is influenced.

At present, signal crosstalk between a left channel playing circuit and a right channel playing circuit is larger, and crosstalk performance is poor.

Disclosure of Invention

The embodiment of the application discloses an audio crosstalk optimization method, an audio crosstalk optimization circuit, a terminal device and a storage medium, which can reduce signal crosstalk generated between a left channel and a right channel of audio playing equipment and improve crosstalk performance of the audio playing equipment.

The embodiment of the application discloses an audio crosstalk optimization circuit, which comprises:

the audio interface is used for accessing audio playing equipment and comprises a transmission pin which is used for being connected with a grounding pin of the audio playing equipment under the condition that the audio playing equipment is accessed;

the grounding path is used for connecting the transmission pin and the grounding end;

and the low-resistance module is used for being connected with the grounding path in parallel under the condition that the audio playing equipment is accessed to reduce the line impedance of the path between the grounding pin of the audio playing equipment and the grounding end.

As an alternative embodiment, the audio crosstalk optimization circuit further includes:

and the control module is connected with the low-resistance module and used for controlling the low-resistance module to be connected with the grounding passage in parallel under the condition that the audio playing equipment is accessed.

As an alternative embodiment, the transmission pins include a first transmission pin and a second transmission pin; when the accessed audio playing device is a first type device, the first transmission pin is connected with a grounding pin of the audio playing device, and the second transmission pin is connected with an MIC pin of the audio playing device; when the accessed audio playing device is a second type device, the first transmission pin is connected with the MIC pin of the audio playing device, and the second transmission pin is connected with the grounding pin of the audio playing device;

the low-resistance module is used for being connected with a grounding path which is connected with the first transmission pin and the grounding end in parallel under the condition that the accessed audio playing equipment is the first type equipment;

the low-resistance module is also used for being connected with a grounding path connected with the second transmission pin and the grounding end in parallel under the condition that the accessed audio playing equipment is the second type equipment.

As an alternative embodiment, the low resistance module includes:

the first switch unit is connected in series between the first transmission pin and the grounding end, and is used for being in a conducting state when the accessed audio playing device is the first type device, and is in a disconnecting state when the accessed audio playing device is the second type device;

the second switch unit is connected in series between the second transmission pin and the grounding end, and is used for being in an off state when the accessed audio playing device is the first type device, and in an on state when the accessed audio playing device is the second type device.

As an optional implementation manner, the audio crosstalk optimization circuit further includes a control module, the first switching unit includes a first switching element and a second switching element, and the second switching unit includes a third switching element and a fourth switching element;

the first end of the first switching element is connected with the first transmission pin, the second end of the first switching element is connected with the grounding end, the third end of the first switching element is respectively connected with the power supply module and the first end of the second switching element, the second end of the second switching element is connected with the grounding end, and the third end of the second switching element is connected with the control module;

The first end of the third switching element is connected with the second transmission pin, the second end of the third switching element is connected with the grounding end, the third end of the third switching element is respectively connected with the power supply module and the first end of the fourth switching element, the second end of the fourth switching element is connected with the grounding end, and the third end of the fourth switching element is connected with the control module;

the control module is used for controlling the second switching element to be in an off state and controlling the fourth switching element to be in an on state under the condition that the accessed audio playing equipment is the first type equipment so as to enable the first switching element to be in an on state and enable the third switching element to be in an off state; the control module is further configured to control the second switching element to be in a conducting state and control the fourth switching element to be in a disconnecting state when the accessed audio playing device is the second type device, so that the first switching element is in a disconnecting state, and the third switching element is in a conducting state.

As an optional implementation manner, the grounding terminal includes a first grounding terminal and a second grounding terminal, where the first transmission pin is connected to the first grounding terminal through the grounding path in the case where the accessed audio playing device is the first type device, and the second transmission pin is connected to the first grounding terminal through the grounding path in the case where the accessed audio playing device is the second type device, the second end of the first switching element is connected to the first grounding terminal, the second end of the second switching element is connected to the second grounding terminal, the second end of the third switching element is connected to the first grounding terminal, and the second end of the fourth switching element is connected to the second grounding terminal.

The embodiment of the application discloses an audio crosstalk optimization method, which is applied to any audio crosstalk optimization circuit disclosed in the embodiment of the application, and comprises the following steps:

and under the condition that the audio interface is connected with the audio playing device, controlling the low-resistance module to be connected with the grounding passage in parallel so as to reduce the line impedance of the passage between the grounding pin of the audio playing device and the grounding end, wherein the grounding passage is used for connecting the transmission pin of the audio interface with the grounding end, and the transmission pin of the audio interface is used for being connected with the grounding pin of the audio playing device under the condition that the audio playing device is connected with the grounding pin of the audio playing device.

As an alternative embodiment, the transmission pins include a first transmission pin and a second transmission pin;

under the condition that the audio interface is connected into the audio playing device, the control of the low-resistance module to be connected with the grounding path in parallel comprises the following steps:

controlling the low-resistance module to be connected in parallel with a grounding path connecting the first transmission pin and the grounding end under the condition that the accessed audio playing equipment is first-type equipment; when the first type device is connected to the audio interface, a grounding pin of the first type device is connected with the first transmission pin, and a MIC pin of the first type device is connected with the second transmission pin;

Controlling the low-resistance module to be connected in parallel with a grounding path connecting the second transmission pin and the grounding end under the condition that the accessed audio playing equipment is second-type equipment; and under the condition that the second type equipment is connected with the audio interface, the grounding pin of the second type equipment is connected with the second transmission pin, and the MIC pin of the second type equipment is connected with the first transmission pin.

As an optional implementation manner, the low-resistance module includes a first switch unit and a second switch unit, where the first switch unit is connected in series between the first transmission pin and the ground terminal, and the second switch unit is connected in series between the second transmission pin and the ground terminal;

and under the condition that the accessed audio playing equipment is first type equipment, controlling the low-resistance module to be connected with a grounding path connected with the first transmission pin and the grounding end in parallel, wherein the method comprises the following steps:

controlling the first switch unit to be in a conducting state and controlling the second switch unit to be in a disconnecting state under the condition that the accessed audio playing equipment is the first type equipment;

and under the condition that the accessed audio playing equipment is the second type equipment, controlling the low-resistance module to be connected with a grounding path connected with the second transmission pin and the grounding end in parallel, wherein the method comprises the following steps:

And under the condition that the accessed audio playing equipment is the second type equipment, controlling the first switch unit to be in an off state and controlling the second switch unit to be in an on state.

The embodiment of the application discloses a terminal device, which comprises any audio crosstalk optimization circuit disclosed in the embodiment of the application.

Compared with the related art, the embodiment of the application has the following beneficial effects:

the embodiment of the application provides an audio crosstalk optimization circuit, the circuit includes an audio interface, a grounding passage and a low-resistance module, the audio interface includes a transmission pin, the grounding pin of the audio playing device is connected with the transmission pin of the audio interface under the condition that the audio playing device is connected with the audio interface, the low-resistance module is connected with the grounding passage (the passage between the connection transmission pin and the grounding end) in parallel, the line impedance of the passage between the transmission pin and the grounding end is reduced, and therefore the line impedance of the passage between the grounding pin and the grounding end of the audio playing device is reduced, the impedance of a public grounding loop of a left channel playing circuit and a right channel playing circuit of the audio playing device is reduced, the signal crosstalk generated between the left channel and the right channel of the audio playing device is reduced, and the crosstalk performance of the audio playing device is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a circuit configuration diagram of an audio signal processing circuit in the related art;

fig. 2 is a schematic circuit diagram of an audio crosstalk optimizing circuit according to an embodiment of the present disclosure;

fig. 3 is a schematic flow chart of an audio crosstalk optimization method disclosed in an embodiment of the present application;

FIG. 4 is a schematic circuit diagram of another audio crosstalk optimization circuit disclosed in an embodiment of the present application;

FIG. 5 is a flow chart of another audio crosstalk optimization method disclosed in an embodiment of the present application;

FIG. 6 is a schematic diagram of a low-resistance module according to an embodiment of the present disclosure;

FIG. 7 is a flow chart of a control method of a low-resistance module according to an embodiment of the disclosure;

fig. 8 is a schematic diagram of a unit structure of a switching unit according to an embodiment of the present disclosure;

Fig. 9 is a flow chart of yet another audio crosstalk optimization method disclosed in an embodiment of the present application.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Examples of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments should be understood as "electrical connection", "communication connection", and the like if there is transmission of electrical signals or data between objects to be connected.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Also, the term "and/or" as used in this specification includes any and all combinations of the associated listed items.

With the continuous development of terminal technologies, terminal devices such as a notebook computer, a personal computer, and a tablet computer all have an audio playing function, as shown in fig. 1, the terminal device 100 is generally provided with an audio chip 110 and an audio interface 120, the audio interface 120 includes a left channel pin L, a right channel pin R, and a common pin G1, two ends of the left channel pin L are respectively connected with a left channel output circuit 111 of the audio chip 110 and a first end of a left channel playing circuit 210 of the audio playing device 200, two ends of the right channel pin R are respectively connected with a right channel output circuit 112 of the audio chip 110 and a first end of a right channel playing circuit 220 of the audio playing device 200, one end of the common pin G1 is connected with a ground end GND of the terminal device 100, and the other end of the common pin G1 is connected with a second end of the left channel playing circuit 210 and a second end of the right channel playing circuit 220.

The audio chip 110 may be configured to decode (decoder) a left channel initial signal and a right channel initial signal (initial signals corresponding to the left channel playing circuit 210 and the right channel playing circuit 220 of the audio playing device 200, which are generally processed by a processor of the terminal device), convert digital to analog, amplify power, and the like, and output a left channel output signal and a right channel output signal, where the left channel output signal is output to the left channel playing circuit 210 of the audio playing device 200 through the left channel pin L of the audio interface 120 for playing, and the right channel output signal is output to the right channel playing circuit 220 of the audio playing device 200 through the right channel pin R of the audio interface 120 for playing. The audio chip 110 may be a coder-decoder (CODEC) chip, a high-fidelity (HiFi) chip, or other chips for audio coding and decoding.

As described in the background art, since the left channel playing circuit 210 and the right channel playing circuit 220 are grounded through the common ground circuit, signal crosstalk between the left channel playing circuit 210 and the right channel playing circuit 220 is caused, so that the difference between the left channel and the right channel is not obvious, the sound field distribution is disordered, and the experience of the audio/video scene of the user is affected. The inventor has found that the common ground loop may be long due to the layout of the terminal device 100, and that even though the common ground loop passes through a plurality of FPCs (Flexible Printed Circuit, flexible circuit boards) and small boards for some terminal devices 100, the line impedance of the common ground loop may be relatively large, and even if the width of the line of the common ground loop or the number of pins of the connector is increased, the impedance of the common ground loop may still be relatively large, resulting in a large crosstalk of signals generated between the left and right channels of the audio playback device.

In view of this, the embodiments of the present application provide an audio crosstalk optimization circuit that may be applied to a terminal device 100, and that may improve crosstalk performance of the terminal device 100 to which the audio playback device 200 is connected.

Referring to fig. 2, which illustrates an audio crosstalk optimization circuit provided in an embodiment of the present application, as shown in fig. 2, the audio crosstalk optimization circuit may include an audio interface 120, a ground path (such as a horizontal line portion of the dot shown in fig. 2), and a low-resistance module 130, where the audio interface 120 may include a transmission pin P, and the audio interface 120 is used to access the audio playing device 200, and in the case where the audio playing device 200 is accessed, the transmission pin P of the audio interface 120 is connected to the ground pin G2 of the audio playing device 200, the ground path is used to connect the transmission pin P and the ground end GND, and the low-resistance module 130 is used to connect in parallel with the ground path in order to reduce a line impedance of the path between the ground pin G2 of the audio playing device 200 and the ground end GND in the case where the audio playing device 200 is accessed.

It should be noted that, one end of the ground pin G2 of the audio playing device 200 is respectively connected to the second end of the left channel playing circuit 210 and the second end of the right channel playing circuit 220 of the audio playing device 200, the audio playing device 200 is grounded through the ground pin G2 of the audio playing device 200 and the transmission pin P of the audio interface 120 of the audio crosstalk optimizing circuit, and the low-resistance module 130 is connected in parallel with the ground path when the audio playing device 200 is connected to the audio interface 120, so that even if the line length of the ground path is longer, the line impedance of the path between the transmission pin P and the ground end GND is reduced, so that the line impedance of the path between the ground pin G2 of the audio playing device 200 and the ground end GND is reduced, and the impedance of the common ground loop of the left channel playing circuit 210 and the right channel playing circuit 220 of the audio playing device 200 is reduced, so as to improve the crosstalk performance of the audio playing device. Alternatively, the audio playing device 200 may include headphones, and the audio interface 120 may include a headphone jack, where the headphones are connected to the headphone jack through a headphone plug, so as to play the left channel output signal and the right channel output signal through the headphones.

In one embodiment, the audio crosstalk optimization circuit may further include a control module connected to the low-resistance module 130 for controlling the low-resistance module 130 to be connected in parallel with the ground path in case the audio playback device 200 is connected. The control module may be the audio chip 110 or another processor other than the audio chip. In the case that the control module is an audio chip, the audio chip may control the low-resistance module 130 to be connected in parallel with the ground path in addition to providing the left channel output signal and the right channel output signal to the audio playback device 200.

In another embodiment, the low resistance module 130 may include a connection branch having one end connected to the transmission pin P and the other end connected to the ground GND, and it is understood that the connection branch is connected in parallel to the ground path, that is, the low resistance module 130 is connected in parallel to the ground path.

The audio crosstalk optimization circuit provided by the embodiment of the application comprises an audio interface 120, a grounding path and a low-resistance module 130, wherein the audio interface 120 comprises a transmission pin P, the grounding pin G2 of the audio playing device 200 is connected with the transmission pin P of the audio interface 120 under the condition that the audio playing device 200 is connected with the audio interface 120, the low-resistance module 130 is connected with the grounding path (the path between the connection transmission pin P and the grounding end GND) in parallel, so that the line impedance of the path between the transmission pin P and the grounding end GND is reduced, and the line impedance of the path between the grounding pin G2 of the audio playing device 200 and the grounding end GND is reduced, so that the impedance of a public grounding loop of a left channel playing circuit 210 and a right channel playing circuit 220 of the audio playing device 200 is reduced, and the crosstalk performance of the audio playing device is improved.

Referring to fig. 3, an audio crosstalk optimization method provided in an embodiment of the present application is shown, and as shown in fig. 3, the method may include step S100. The audio crosstalk optimization method can be applied to a control module of an audio crosstalk optimization circuit.

S100, controlling the low-resistance module to be connected with the grounding path in parallel under the condition that the audio interface is connected with the audio playing device.

In the audio crosstalk optimization method provided in the embodiment of the present application, when the audio interface 120 is connected to the audio playing device 200, the control module may control the low-resistance module 130 to be connected to the ground path, so as to reduce the line impedance of the path between the transmission pin P and the ground end GND, thereby reducing the line impedance of the path between the ground pin G2 of the audio playing device 200 and the ground end GND, so that the impedance of the common ground loop of the left channel playing circuit 210 and the right channel playing circuit 220 of the audio playing device is reduced, and the crosstalk performance of the audio playing device is improved.

For the audio playing device 200 that can collect environmental audio, the audio playing device 200 is further provided with an audio collecting circuit and a MIC (Microphone) pin, the MIC pin is connected with the audio collecting circuit, the audio collecting circuit is used for processing the collected environmental audio to generate a Microphone signal, the Microphone signal is output through the MIC pin, and when the audio playing device 200 is connected to the audio interface 120, the audio crosstalk optimizing circuit can receive the Microphone signal to realize functions such as voice communication.

The audio player capable of collecting the environmental audio signals includes two types, one is a first type device and the other is a second type device, and the MIC pins and the ground pins of the two types are different, so that when the audio playing devices 200 of the different types are connected to the audio interface 120, the ground pins of the audio playing devices 200 of the different types are connected to the different positions of the audio interface 120. Illustratively, one of the first type of device and the second type of device is a CTIA (Cellular Telecommunications Industry Association, mobile communications industry Association) headset and the other of the first type of device and the second type of device is an OMTP (Open Mobile Terminal Platform ) headset.

In order to achieve the adaptation to different types of audio playing devices 200 and to make the crosstalk performance better, the embodiment of the present application provides an audio crosstalk optimization circuit, as shown in fig. 4, where the audio optimization circuit may include an audio interface 120, a low-resistance module 130, and a ground path (such as a horizontal dot line portion shown in fig. 4), the audio interface 120 may include a transmission pin, and the transmission pin may include a first transmission pin P1 and a second transmission pin P2. In the case where the audio playback apparatus 200 to which the audio interface 120 is connected is a first type apparatus, the first transmission pin P1 is connected to the ground pin G2 of the audio playback apparatus 200, the second transmission pin P2 is connected to the MIC pin M of the audio playback apparatus 200, and in the case where the audio playback apparatus 200 to which the audio interface 120 is connected is a second type apparatus, the first transmission pin P1 is connected to the MIC pin M of the audio playback apparatus 200, and the second transmission pin P2 is connected to the ground pin G2 of the audio playback apparatus 200. The low resistance module 130 may be used to connect in parallel with a ground path connecting the first transmission pin P1 and the ground GND in the case where the accessed audio playback device 200 is a first type device. The low-resistance module 130 may also be used to connect in parallel with a ground path connecting the second transmission pin P2 and the ground GND in case the accessed audio playback device 200 is a second type of device.

It should be noted that, in the case of the first type device being connected, the ground path is used to conduct the first transmission pin P1 and the ground terminal GND, in the case of the second type device being connected, the ground path is used to conduct the second transmission pin P2 and the ground terminal GND, and the low resistance module 130 is connected in parallel with the ground path, so that the line impedance of the path between the ground pin G2 of the audio player and the ground terminal GND of the terminal device can be reduced, and the crosstalk performance of the audio playing device is improved. Since the low-resistance module 130 can be connected with different transmission pins (the first transmission pin P1 or the second transmission pin P2) under the condition that different types of audio playing devices 200 are connected, the ground impedance of the path between the ground pin G2 of the audio playing device 200 and the ground end GND can be reduced, and the receiving of the microphone signal is not affected.

With continued reference to fig. 4, in one embodiment, the audio crosstalk optimization circuit may further include a control module 140, where the control module 140 includes a switching unit 141 and a microphone signal processing unit 142, and the microphone signal processing unit 142 is configured to process, e.g., analog-to-digital convert, the microphone signal. The switching unit 141 is connected to the first transmission pin P1, the second transmission pin P2, the ground terminal GND and the microphone signal processing unit 142, respectively, and is configured to conduct the first transmission pin P1 and the ground terminal GND to form a ground path, and conduct the second transmission pin P2 and the microphone signal processing unit 142 when the audio playing device 200 accessed by the audio interface 120 is a first type device, so that the microphone signal processing unit 142 can process a microphone signal. The control module 140 is further configured to, when the audio playing device 200 accessed by the audio interface 120 is a second type device, conduct the second transmission pin P2 and the ground GND to form a ground path, and conduct the first transmission pin P1 and the microphone signal processing unit 142, so that the microphone signal processing unit 142 can process the microphone signal. It should be noted that, when the switching unit 141 of the control module 140 is far from the audio interface 120, the impedance of the ground path is large, and the impedance of the path between the ground pin G2 of the audio playing device 200 and the ground GND can be reduced by connecting the low-resistance module 130 in parallel with the ground path, and the setting position of the low-resistance module 130 is not limited by the control module 140, so that the line of the low-resistance module 130 can be short, i.e. the impedance of the low-resistance module 130 is far less than the impedance of the ground path, and the impedance of the path between the ground pin G2 of the audio playing device 200 and the ground GND can be greatly reduced by connecting the low-resistance module 130 in parallel with the ground path.

In one embodiment, the control module 140 may be further connected to the low-resistance module 130, where the control module 140 is configured to control the low-resistance module 130 to be connected in parallel to a ground path connecting the first transmission pin P1 and the ground GND in case that the accessed audio playback device 200 is a first type device. The control module 140 may be further configured to control the low-resistance module 130 to be connected in parallel with a ground path connecting the second transmission pin P2 and the ground GND in case that the accessed audio playback device 200 is a second type device.

Referring to fig. 5, another audio crosstalk optimization method provided in the embodiment of the present application may be applied to a control module, as shown in fig. 5, and the method may include steps S120 to S140.

And S120, controlling the low-resistance module to be connected with a grounding path connected with the first transmission pin and the grounding end in parallel under the condition that the accessed audio playing equipment is first-type equipment.

And S140, controlling the low-resistance module to be connected with a grounding path connected with the second transmission pin and the grounding end in parallel under the condition that the accessed audio playing equipment is second-type equipment.

With continued reference to fig. 5, in one embodiment, the audio crosstalk optimization method may further include steps S130 to S150.

And S130, controlling the first transmission pin to be connected with the grounding end under the condition that the accessed audio playing equipment is of the first type equipment so as to form a grounding path for connecting the first transmission pin and the grounding end.

And S150, controlling the second transmission pin to be connected with the grounding end under the condition that the accessed audio playing equipment is second type equipment so as to form a grounding path for connecting the second transmission pin and the grounding end.

According to the audio crosstalk optimization method provided by the embodiment, the grounding end GND can be connected with the first transmission pin P1 or the second transmission pin P2 according to the type of the accessed audio playing device 200, so that the audio playing device 200 can be grounded through the first transmission pin P1 or the second transmission pin P2, meanwhile, the impedance of a passage between the grounding pin G2 of the audio playing device 200 and the grounding end GND can be ensured to be smaller, and the crosstalk performance of the audio playing device is improved.

With continued reference to fig. 5, in one embodiment, the method may further include step S110.

S110, determining the type of the audio playing device accessed by the audio interface.

It should be noted that, since the impedance of the first transmission pin P1 and the second transmission pin P2 is different when different types of audio playback devices 200 are connected to the audio interface 120, the type of the audio playback device 200 connected to the audio interface 120 can be determined by detecting the impedance of the first transmission pin P1 and the second transmission pin P2.

Referring to fig. 6, a schematic diagram of a low-resistance module according to an embodiment of the disclosure is shown, and as shown in fig. 6, the low-resistance module may include a first switch unit 131 and a second switch unit 132. Specifically, the first switch unit 131 is connected in series between the first transmission pin P1 and the ground GND, and the second switch unit 132 is connected in series between the second transmission pin P2 and the ground GND. The first switch unit 131 is configured to be in an on state when the accessed audio playing device 200 is a first type device, and the first switch unit 131 is also configured to be in an off state when the accessed audio playing device 200 is a second type device. The second switch unit 132 is configured to be in an off state when the accessed audio playing device 200 is a first type device, and the second switch unit 132 is also configured to be in an on state when the accessed audio playing device 200 is a second type device.

It should be noted that, in the case where the audio device to which the audio interface 120 is connected is a first type device, the first transmission pin P1 is connected to the ground GND through the first switch unit 131, so that the first switch unit 131 is connected in parallel to the ground path connecting the first transmission pin P1 and the ground GND, so as to reduce the line impedance of the path between the first transmission pin P1 and the ground GND, that is, reduce the impedance of the path between the ground pin of the audio playing device 200 and the ground GND. Meanwhile, since the second switch unit 132 is in the off state, it is ensured that the second transmission pin P2 is not connected to the ground GND due to the second switch unit 132 being provided, so that the microphone signal processing unit 142 cannot acquire the microphone signal.

Similarly, in the case where the audio device to which the audio interface 120 is connected is a second type device, the second transmission pin P2 is connected to the ground GND through the second switch unit 132, so that the second switch unit 132 is connected in parallel with the ground path connecting the second transmission pin P2 and the ground GND, thereby reducing the line impedance of the path between the second transmission pin P2 and the ground GND, that is, reducing the impedance of the path between the ground pin of the audio playing device 200 and the ground GND. Meanwhile, since the first switch unit 131 is in the off state, it is ensured that the first transmission pin P1 is connected to the ground GND due to the first switch unit 131 being provided, so that the microphone signal processing unit 142 cannot acquire the microphone signal.

In one embodiment, the control module 140 is connected to the first switch unit 131 and the second switch unit 132, where the control module 140 is configured to control the first switch unit 131 to be in a conducting state and control the second switch unit 132 to be in a disconnecting state when the accessed audio playing device 200 is a first type device, and the control module 140 is further configured to control the first switch unit 131 to be in a disconnecting state and control the second switch unit 132 to be in a conducting state when the accessed audio playing device 200 is a second type device.

In one embodiment, the first switching unit 131 may include a first N-channel field effect transistor, and the second switching unit 132 may include a second N-channel field effect transistor. Optionally, the gate of the first N-channel field effect transistor is connected to the control module 140, the source of the first N-channel field effect transistor is connected to the ground GND, the drain of the first N-channel field effect transistor is connected to the first transmission pin P1, the gate of the second N-channel field effect transistor is connected to the control module 140, the source of the second N-channel field effect transistor is connected to the ground GND, and the drain of the second N-channel field effect transistor is connected to the second transmission pin P2. The control module outputs a first level signal to the gate of the first N-channel field effect transistor and outputs a second level signal to the gate of the second N-channel field effect transistor when the audio playing device 200 connected to the audio interface 120 is a first type device, and outputs a second level signal to the gate of the first N-channel field effect transistor and outputs a first level signal to the gate of the second N-channel field effect transistor when the audio playing device 200 connected to the audio interface 120 is a first type device. It can be appreciated that the first level signal may be a high level signal, and the second level signal may be a low level signal, so that the gates of the first N-channel field effect transistor and the second N-channel field effect transistor are in a conductive state when receiving the first level signal, and are in a non-conductive state when receiving the second level signal.

Alternatively, the first N-channel field effect transistor and the second N-channel field effect transistor may be N-channel Junction Field Effect Transistors (JFETs) or N-channel metal-oxide semiconductor field effect transistors (MOS transistors).

Referring to fig. 7, a control method of a low-resistance module according to an embodiment of the present application is shown, and the method may be applied to the control module 140 shown in fig. 6, and as shown in fig. 7, the method may include steps S122 to S142.

And S122, controlling the first switch unit to be in a conducting state and controlling the second switch unit to be in a disconnecting state under the condition that the accessed audio playing device is the first type device.

And S142, controlling the first switch unit to be in an off state and controlling the second switch unit to be in an on state under the condition that the accessed audio playing device is the second type device.

In one implementation, the audio crosstalk optimization method may further include controlling the first switching unit 131 and the second switching unit 132 to be in an off state before determining the type of the audio playback device 200 to which the audio interface 120 is connected. Note that, if the first switching unit 131 and the second switching unit 132 are in the off state, the first switching unit 131 and the second switching unit 132 may be controlled to be in the off state, or the operation may not be performed, or the first switching unit 131 and the second switching unit 132 may be maintained to be in the off state. Before determining the type of the audio playing device 200 to which the audio interface 120 is connected, the first switch unit 131 and the second switch unit 132 are controlled to be in an off state, so that it is possible to avoid that the first transmission pin P1 and the second transmission pin P2 are connected to the ground GND, which results in affecting the detected impedance of the first transmission pin P1 and the second transmission pin P2, and the type of the audio playing device 200 to which the audio interface 120 is connected cannot be determined.

Referring to fig. 8, a schematic diagram of a unit structure of a switching unit according to an embodiment of the present application is shown, and as shown in fig. 8, a first switching unit may include a first switching element Q1 and a second switching element Q2, and a second switching unit may include a third switching element Q3 and a fourth switching element Q4. Specifically, the first end of the first switching element Q1 is connected to the first transmission pin P1, the second end of the first switching element Q1 is connected to the ground end GND, the third end of the first switching element Q1 is connected to the power module and the first end of the second switching element Q2, the second end of the second switching element Q2 is connected to the ground end GND, the third end of the second switching element Q2 is connected to the control module 140, the first end of the third switching element Q3 is connected to the second transmission pin P2, the second end of the third switching element Q3 is connected to the ground end GND, the third end of the third switching element Q3 is connected to the power module and the first end of the fourth switching element Q4, the second end of the fourth switching element Q4 is connected to the ground end GND, and the third end of the fourth switching element Q4 is connected to the control module 140. The control module 140 may be configured to control the second switching element Q2 to be in an off state and control the fourth switching element Q4 to be in an on state when the accessed audio playback device 200 is a first type device. The control module 140 may be further configured to control the second switching element Q2 to be in an on state and control the fourth switching element Q4 to be in an off state when the accessed audio playback device 200 is a second type device.

It should be noted that, the power module is configured to provide the third voltage, when the voltages of the third terminal of the first switching element Q1 and the third terminal of the third switching element Q3 are the third voltage, the first switching element Q1 and the third switching element Q3 are in a conductive state, that is, the first terminal of the first switching element Q1 is conductive with the second terminal of the first switching element Q1, and the first terminal of the third switching element Q3 is conductive with the second terminal of the third switching element Q3. When the second switching element Q2 is in the on state, the voltage of the third terminal of the first switching element Q1 matches the voltage of the ground terminal GND, and the first switching element Q1 is in the off state. When the second switching element Q2 is in the off state, the voltage of the third terminal of the first switching element Q1 matches the voltage (third voltage) supplied by the power supply module, and the first switching element Q1 is in the on state. Similarly, when the fourth switching element Q4 is in the on state, the third switching element Q3 is in the off state, and when the fourth switching element Q4 is in the off state, the third switching element Q3 is in the on state. When the first switching element Q1 is in the on state, the first switching element 131 can be considered to be in the on state, and when the first switching element Q1 is in the off state, the first switching element 131 can be considered to be in the off state. Similarly, when the third switching element Q3 is in the on state, the second switching element 132 can be considered to be in the on state, and when the third switching element Q3 is in the off state, the second switching element 132 can be considered to be in the off state.

In one embodiment, the first, second, third and fourth switching elements Q1, Q2, Q3 and Q4 may be N-channel field effect transistors. It can be understood that the drain D of the N-channel field effect transistor is a first end of the switching element (the first switching element Q1, the second switching element Q2, the third switching element Q3, and the fourth switching element Q4), the source S of the N-channel field effect transistor is a second end of the switching element, and the gate G of the N-channel field effect transistor is a third end of the switching element. The N-channel field effect transistor can be an N-channel JFET or an N-channel MOS transistor. Since the on-resistance of the N-channel fet is small, in this embodiment, the N-channel fet is used as the first switching element Q1 and the third switching element Q3, and when the first switching element Q1 or the third switching element Q3 is in the on state, the impedance of the low-resistance module is small, so that after being connected in parallel with the ground path, the impedance of the path between the ground pin and the ground GND of the audio playing device 200 can be greatly reduced. Meanwhile, the N-channel field effect transistor can play a role in ESD (Electro-Static discharge) protection, so as to prevent the control module 140 from being damaged.

In one embodiment, the ground GND may include a first ground GND1 and a second ground GND2. In the case that the accessed audio playing device 200 is a first type device, the first transmission pin P1 is connected to the first ground GND1 through a ground path, in the case that the accessed audio playing device 200 is a first type device, the second transmission pin P2 is connected to the first ground GND1 through a ground path, the second end of the first switching element Q1 is connected to the first ground GND1, the second end of the second switching element Q2 is connected to the second ground GND2, the second end of the third switching element Q3 is connected to the first ground GND1, and the second end of the fourth switching element Q4 is connected to the second ground GND2. Alternatively, the connection manner of the first ground GND1 and the second ground GND2 may include, but is not limited to, connection by magnetic beads or connection by 0 ohm resistor.

In the embodiment, by setting the first ground GND1 and the second ground GND2, the ground pin of the audio playing device 200, the second end of the first switching element Q1 and the second end of the third switching element Q3 are connected with the first ground GND1, and the second end of the second switching element Q2 and the second end of the fourth switching element Q4 are connected with the second ground GND2, so as to realize isolation of the control module 140 from the audio playing device 200 and reduce the influence of the control signal of the control module 140 on the performance of the audio playing device 200.

In one embodiment, the control module 140 includes a first interface IO1 and a second interface IO2, where the first interface IO1 and the second interface IO2 may output a first level signal or a second level signal, when the third terminal of the second switching element Q2 and the third terminal of the fourth switching element Q4 receive the first level signal, the second switching element Q2 and the third switching element Q3 are in an on state, and when the third terminal of the second switching element Q2 and the third terminal of the fourth switching element Q4 receive the second level signal, the second switching element Q2 and the fourth switching element Q4 are in an off state. For example, when the second switching element Q2 and the fourth switching element Q4 are N-channel field effect transistors, the first level signal is a high level signal and the second level signal is a low level signal.

Please refer to table 1, which illustrates the level signals output by the first interface IO1 and the second interface IO2 of the control module 140. In the case that the audio playing device 200 is not connected to the audio interface 120 or the audio playing device 200 is pulled out from the audio interface 120, the first interface IO1 and the second interface IO2 output a second level signal, so that the second switching element Q2 and the fourth switching element Q4 are in an off state, the first switching element Q1 and the third switching element Q3 are in an on state, the first transmission pin P1 and the second transmission pin P2 are respectively connected with the first ground GND1 through the first switching element Q1 and the third switching element Q3, and in the case that the audio playing device 200 is connected to the audio interface 120, the first interface IO1 and the second interface IO2 output a first level signal, so that the second switching element Q2 and the fourth switching element Q4 are in an on state, and the first switching element Q1 and the third switching element Q3 are in an off state, so as to realize line sequence detection on the type of the audio playing device 200. In the case where it is determined that the audio playback apparatus 200 connected to the audio interface 120 is a first type apparatus, the first interface IO1 outputs a second level signal, the second interface IO2 outputs a first level signal, the second switching element Q2 is in an off state, and the fourth switching element Q4 is in an on state. In the case where it is determined that the audio playback apparatus 200 connected to the audio interface is the second type apparatus, the first interface IO1 outputs the first level signal, the second interface IO2 outputs the second level signal, the second switching element Q2 is in the on state, and the fourth switching element Q4 is in the off state.

Table 1 controls the level signal of the output of the first interface and the second interface of the module

With continued reference to fig. 8, in one embodiment, the power module may include a power unit 151, a first resistor R1, and a second resistor R2, where the power unit 151 is configured to provide a fourth voltage, the power unit 151 is connected to the third terminal of the first switching element Q1 through the first resistor R1, and the power unit 151 is connected to the third terminal of the second switching element Q2 through the second resistor R2. Alternatively, the precision of the first resistor R1 and the second resistor R2 may be 1%, 5% or 10%, and the resistance value of the first resistor R1 and the second resistor R2 may range from 90K ohms to 110K ohms. Optionally, the resistance of the first resistor R1 is 90K ohms, 100K ohms or 110K ohms, and the resistance of the second resistor R2 is 90K ohms, 100K ohms or 110K ohms. Alternatively, the fourth voltage may have a voltage range of 4.5V to 5.5V. Optionally, the fourth voltage is 4.5V, 5V or 5.5V.

In an embodiment, please continue to refer to fig. 8, the audio crosstalk optimization circuit may further include a third resistor R3 and/or a fourth resistor R4, wherein one end of the third resistor R3 is connected to the third end of the second switching element Q2, the other end is connected to the second ground GND2, one end of the fourth resistor R4 is connected to the third end of the fourth switching element Q4, and the other end is connected to the second ground GND2, and in this embodiment, the third resistor R3 and/or the fourth resistor R4 are provided to perform a current limiting function so as to protect the second switching element Q2 and the fourth switching element Q4.

Referring to fig. 9, another audio crosstalk optimization method provided in the embodiment of the present application may be applied to the control module 140 shown in fig. 8, and the method may include steps S920 to S940.

And S920, controlling the second switch element to be in an off state and controlling the fourth switch to be in an on state under the condition that the accessed audio playing device is the first type device.

S940, when the accessed audio playing device is the second type device, the second switch unit is controlled to be in a conducting state, and the fourth switch unit is controlled to be in a disconnecting state.

Referring to fig. 9, the audio crosstalk optimization method may further include steps S912 to S914.

S912, under the condition of the audio playing device accessed by the audio interface, the second switching element and the fourth switching element are controlled to be in a conducting state.

S914, determining the type of the accessed audio playing device.

The present embodiment controls the second switching element Q2 and the fourth switching element Q4 to be in the on state so that the first switching element Q1 and the third switching element Q3 are in the off state, so that the type of the accessed audio playing device 200 can be determined by detecting the resistance values of the first transmission pin P1 and the second transmission pin P2.

With continued reference to fig. 9, the audio crosstalk optimization method may further include step S960.

S960, in the case that the audio interface is not connected to the audio playing device, the second switching element and the fourth switching element are controlled to be in an off state.

It should be noted that, when no audio playing device 200 is connected to the audio interface 120, the second switching element Q2 and the fourth switching element Q4 are connected to be in an off state, so that the first transmission pin P and the second transmission pin P2 pass through the first switching element Q1 and the third switching element Q3, respectively, and the first ground GND1, so as to avoid damage to the control module 140 caused by external electrical signals, and protect the audio crosstalk optimization circuit.

It should be understood that, although the steps in the flowcharts of fig. 3, 5, 7, and 9 are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps of fig. 3, 5, 7, 9 may include a plurality of steps or stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of execution of the steps or stages is not necessarily sequential, but may be performed in turn or alternately with at least a portion of the steps or stages of other steps or other steps.

The embodiment of the application also provides a terminal device, which can comprise any audio crosstalk optimization circuit provided by the embodiment.

The line impedance of the path between the transmission pin P and the ground GND is smaller, so that in the case that the audio playing device 200 is connected to the audio interface 120, the line impedance of the path between the ground pin G2 of the audio playing device 200 and the ground GND is smaller, that is, the impedance of the common ground loop of the left channel playing circuit 210 and the right channel playing circuit 220 of the audio playing device 200, and the crosstalk performance of the audio playing device is improved.

In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. An audio crosstalk optimization circuit, comprising:

2. The audio crosstalk optimization circuit of claim 1, further comprising:

3. The audio crosstalk optimization circuit of claim 1, wherein the transmission pins comprise a first transmission pin and a second transmission pin; when the accessed audio playing device is a first type device, the first transmission pin is connected with a grounding pin of the audio playing device, and the second transmission pin is connected with an MIC pin of the audio playing device; when the accessed audio playing device is a second type device, the first transmission pin is connected with the MIC pin of the audio playing device, and the second transmission pin is connected with the grounding pin of the audio playing device;

4. The audio crosstalk optimization circuit of claim 3, wherein the low-resistance module comprises:

5. The audio crosstalk optimization circuit of claim 4, further comprising a control module, the first switching unit comprising a first switching element and a second switching element, the second switching unit comprising a third switching element and a fourth switching element;

6. The audio crosstalk optimization circuit of claim 5, wherein the ground terminal comprises a first ground terminal and a second ground terminal, the first transmission pin is connected to the first ground terminal through the ground path in the case where the accessed audio playback device is the first type device, the second transmission pin is connected to the first ground terminal through the ground path in the case where the accessed audio playback device is the second type device, the second terminal of the first switching element is connected to the first ground terminal, the second terminal of the second switching element is connected to the second ground terminal, and the second terminal of the third switching element is connected to the first ground terminal.

7. An audio crosstalk optimization method applied to an audio crosstalk optimization circuit according to any one of claims 1 to 6, characterized in that the method comprises:

8. The audio crosstalk optimization method of claim 7, characterized in that the transmission pins comprise a first transmission pin and a second transmission pin;

9. The audio crosstalk optimization method according to claim 8, wherein the low-resistance module comprises a first switch unit and a second switch unit, the first switch unit is connected in series between the first transmission pin and the ground terminal, and the second switch unit is connected in series between the second transmission pin and the ground terminal;

10. A terminal device comprising an audio crosstalk optimization circuit according to any of claims 1 to 6.