CN116153209A - Display module, manufacturing method thereof and display device - Google Patents

Abstract

The disclosure provides a display module, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display module comprises a cover plate; the display panel comprises a non-bending region, a first bending region and a binding region which are sequentially connected, wherein the non-bending region comprises a central region and a peripheral region positioned at the periphery of the central region; the flexible circuit board is connected to one side, far away from the cover plate, of the binding area and comprises a third area, a second bending area and a fourth area which are sequentially connected, and the fourth area is bent to one side, far away from the cover plate, of the third area through the second bending area; the first supporting piece is arranged on the surface, far away from the cover plate, of the third area of the flexible circuit board; the protection layer is attached to the second area, at least part of the protection layer is located on one side, away from the cover plate, of the flexible circuit board, and the side wall of the first supporting piece is attached to at least part of the side wall of the protection layer. The present disclosure helps to reduce the amount of deformation of the display panel when injection molding or to protect the display panel from deformation.

Description

Display module, manufacturing method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device.

Background

In the display device, a display panel and the like are generally attached to a cover plate, and then the cover plate is connected with a middle frame, so that the middle frame supports a display module through the cover plate.

In the prior art, an injection Molding (Insert Molding) process is generally adopted to form a circle of hard resin ring on the back surface (the side far away from the light emitting surface) of the display module, and the resin ring is connected with the middle frame. However, the mold used in the injection molding process is liable to cause deformation of the display panel or the like.

The above information disclosed in the background section is only for enhancement of understanding of the background of the disclosure and therefore it may include information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

The disclosure aims to provide a display module, a manufacturing method thereof and a display device so as to improve the quality of the display module.

In order to achieve the above purpose, the present disclosure adopts the following technical scheme:

according to a first aspect of the present disclosure, there is provided a display module, including:

the cover plate is provided with a first area and a second area positioned at the periphery of the first area;

the display panel is arranged on one side of the cover plate, the orthographic projection of the display panel on the cover plate is positioned in the first area, the display panel comprises a non-bending area, a first bending area and a binding area which are sequentially connected, the binding area is bent to one side, far away from the cover plate, of the non-bending area through the first bending area, and the non-bending area comprises a central area and a peripheral area positioned at the periphery of the central area;

the flexible circuit board is connected to one side, far away from the cover plate, of the binding area and comprises a third area, a second bending area and a fourth area which are sequentially connected, the fourth area is bent to one side, far away from the cover plate, of the third area through the second bending area, and in the direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is smaller than the minimum distance between the edge of the second bending area and the edge of the display panel;

the first support piece is arranged on the surface of the third area of the flexible circuit board, which is far away from the cover plate, and the orthographic projection of the first support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

the protective layer is attached to the second area, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least part of the protective layer is located on one side, away from the cover plate, of the flexible circuit board, and the side wall of the first supporting piece is attached to at least part of the side wall of the protective layer.

In an exemplary embodiment of the present disclosure, the display module further includes:

the composite heat dissipation film is arranged between the display panel and the flexible circuit board;

the second support piece is arranged on the surface of the composite heat dissipation film, which is far away from the cover plate, the orthographic projection of the second support piece on the cover plate is not overlapped with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate.

In one exemplary embodiment of the present disclosure, the material of the first support or the second support comprises closed cell foam.

In one exemplary embodiment of the present disclosure, the orthographic connection of both the first support and the second support on the cover plate forms a non-closed loop structure that surrounds the orthographic projection of the central region on the cover plate.

In an exemplary embodiment of the present disclosure, the width of the first support is 1mm to 2mm and the width of the second support is 1mm to 2mm in the direction from the central region to the peripheral region;

the thickness of the first support member is 0.2mm-0.5mm in the direction perpendicular to the cover plate, and the thickness of the second support member is 0.2mm-0.5mm.

In an exemplary embodiment of the present disclosure, a distance between an edge of the third region and an edge of the display panel in a direction parallel to the cover plate is 0mm to 0.1mm.

In one exemplary embodiment of the present disclosure, the protective layer is formed using an injection molding process.

According to a second aspect of the present disclosure, there is provided a method for manufacturing a display module, including:

providing a die core, wherein the die core is provided with a containing cavity, the die core comprises a first die core and a second die core, the second die core is positioned at one side of the first die core in a first direction, the second die core is abutted with the first die core to form the containing cavity, and an injection molding opening communicated with the containing cavity is formed in the second die core;

placing a display assembly in the accommodating cavity, wherein the display assembly comprises a cover plate, a display panel, a flexible circuit board and a first supporting piece, and the first direction is perpendicular to the plane of the cover plate;

the cover plate is provided with a first area and a second area positioned at the periphery of the first area; the display panel is arranged on one side of the cover plate, the orthographic projection of the display panel on the cover plate is positioned in the first area, the display panel comprises a non-bending area, a first bending area and a binding area which are sequentially connected, the binding area is bent to one side, far away from the cover plate, of the non-bending area through the first bending area, and the non-bending area comprises a central area and a peripheral area positioned at the periphery of the central area; the flexible circuit board is connected to one side, far away from the cover plate, of the binding area, and comprises a third area, a second bending area and a fourth area which are sequentially connected, wherein the fourth area is bent to one side, far away from the cover plate, of the third area through the second bending area, and in the direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is smaller than the minimum distance between the edge of the second bending area and the edge of the display panel; the first supporting piece is arranged on the surface, far away from the cover plate, of the third area of the flexible circuit board, and the orthographic projection of the first supporting piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

injecting injection molding materials through an injection molding opening of the second mold core to form a protective layer, wherein the protective layer is attached to the second area, the height of the protective layer is not smaller than the distance from the flexible circuit board to the cover plate, at least part of the area of the protective layer is positioned on one side of the flexible circuit board away from the cover plate, and the side wall of the first supporting piece is attached to at least part of the side wall of the protective layer;

the side wall of the second die core comprises a first side wall and a second side wall located at the periphery of the first side wall, an injection cavity is formed between the first side wall and the second side wall, the second side wall is abutted with the side wall of the first die core, and at least part of the first side wall is abutted with the first supporting piece.

In one exemplary embodiment of the present disclosure, the display assembly further includes a composite heat dissipation film and a second support, the composite heat dissipation film being disposed between the display panel and the flexible circuit board; the second support piece is arranged on the surface of the composite heat dissipation film, which is far away from the cover plate, the orthographic projection of the second support piece on the cover plate is not overlapped with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

wherein the orthographic projection of the first sidewall on the cover plate is located within the orthographic projection of the combination of the first support and the second support on the cover plate.

According to a third aspect of the present disclosure, there is provided a display device comprising the display module set according to the first aspect.

The display module provided by the disclosure, the first supporting piece is arranged on the surface of the third area of the flexible circuit board, which is far away from the cover plate, and the orthographic projection of the first supporting piece on the cover plate is positioned in the orthographic projection of the peripheral area of the display panel on the cover plate. In the structure, the flexible circuit board has certain structural strength, and can give certain supporting force to the first supporting piece, and the arrangement of the first supporting piece is to adopt an injection molding process to manufacture and form the display module to provide a structural foundation, so that the deformation of the display panel is reduced or the display panel is protected from deformation.

Drawings

The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.

Fig. 1 is a schematic cross-sectional structure of a display module according to an exemplary embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a cover plate structure in an exemplary embodiment of the present disclosure;

FIG. 3 is a schematic view of a non-bending region of a display panel according to an exemplary embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a flexible circuit board deployment configuration in an exemplary embodiment of the present disclosure;

fig. 5 is a schematic plan view of a display module according to an exemplary embodiment of the present disclosure;

fig. 6 is another schematic plan view of a display module according to an exemplary embodiment of the present disclosure;

fig. 7 is a schematic view of a structure of a flexible circuit board in a display module according to an exemplary embodiment of the present disclosure when the flexible circuit board is unfolded;

FIG. 8 is a schematic diagram of a mold core structure in an exemplary embodiment of the present disclosure;

fig. 9 is a schematic diagram of injection molding a protective layer in an exemplary embodiment of the present disclosure.

The main element reference numerals in the drawings are explained as follows:

100-cover plate; 110-a first region; 120-a second region; 200-a display panel; 210-non-inflection region; 211-a central region; 212-peripheral region; 220-a first inflection region; 230-binding area; 300-a flexible circuit board; 301-a third region; 302-a second inflection region; 303-fourth region; 401-a first support; 402-a second support; 403-a third support; 500-a protective layer; 600-a composite heat dissipation film; 700-an optical adhesive layer; 800-a polarizing layer; 11-a first mold core; 12-a second mold core; 121-an injection molding port; 122-a first sidewall; 123-a second sidewall; 124-injection molding cavity; 13-a receiving cavity; 01-a first scaffold; 02-a second mould frame.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure.

In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the disclosed aspects may be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the main technical ideas of the present disclosure.

When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

The terms "a," "an," "the" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc. The terms "first" and "second" and the like are used merely as labels, and are not intended to limit the number of their objects.

In the related art, when a rigid resin ring is formed on the back surface (the side far from the light emitting surface) of the display assembly by using an injection Molding (Insert Molding) process, the display assembly is generally placed in a receiving cavity formed by the lower mold core and the upper mold core. The display assembly comprises a display panel, a flexible circuit board arranged on the backlight surface of the display panel, and a composite heat dissipation film arranged between the display panel and the flexible circuit board. The upper die core is provided with an injection hole, and injection molding materials can enter the injection cavity through the injection hole to form a resin ring. In the related art, the upper mold core is abutted against the composite heat dissipation film during injection molding, and the composite heat dissipation film is generally of a multi-layer structure, and comprises an SCF layer and a metal layer which are sequentially stacked along the direction away from the display panel, when the upper mold core is abutted against the metal layer, the metal layer is deformed, so that the composite heat dissipation film is deformed, and the structures such as the display panel are further deformed.

As shown in fig. 1 to 6, the present disclosure provides a display module including a cover plate 100, a display panel 200, a flexible circuit board 300, a first support 401, and a protective layer 500. The cover plate 100 has a first region 110 and a second region 120 located at a periphery of the first region 110. The display panel 200 is disposed on one side of the cover plate 100, the orthographic projection of the display panel 200 on the cover plate 100 is located in the first area 110, the display panel 200 includes a non-bending area 210, a first bending area 220 and a binding area 230, which are sequentially connected, the binding area 230 is bent to one side of the non-bending area 210 away from the cover plate 100 through the first bending area 220, and the non-bending area 210 includes a central area 211 and a peripheral area 212 located at the periphery of the central area 211. The flexible circuit board 300 is connected to a side of the binding region 230 away from the cover plate 100, and the flexible circuit board 300 includes a third region 301, a second bending region 302, and a fourth region 303 sequentially connected, wherein the fourth region 303 is bent to a side of the third region 301 away from the cover plate 100 by the second bending region 302, and a maximum distance between an edge of the third region 301 and an edge of the display panel 200 is smaller than a minimum distance between an edge of the second bending region 302 and an edge of the display panel 200 in a direction parallel to the cover plate 100. The first support 401 is disposed on the surface of the third region 301 of the flexible circuit board 300 remote from the cover plate 100, and the front projection of the first support 401 on the cover plate 100 is located within the front projection of the peripheral region 212 on the cover plate 100. The protective layer 500 is attached to the second area 120, the height of the protective layer 500 is not less than the distance from the flexible circuit board 300 to the cover plate 100, at least part of the area of the protective layer 500 is located at one side of the flexible circuit board 300 away from the cover plate 100, and at least part of the side wall of the protective layer 500 is attached to the first supporting member 401.

The display module provided by the present disclosure, the first support 401 is disposed on the surface of the third region 301 of the flexible circuit board 300, which is far away from the cover plate 100, and the front projection of the first support 401 on the cover plate 100 is located within the front projection of the peripheral region 212 of the display panel 200 on the cover plate 100. In this structure, the flexible circuit board 300 has a certain structural strength, and can give a certain supporting force to the first supporting member 401, and the arrangement of the first supporting member 401 provides a structural basis for forming the display module by using an injection molding process, which is helpful for reducing the deformation amount of the display panel 200 or protecting the display panel 200 from deformation.

The specific structure of each component of the display module provided in the present disclosure will be described in detail below with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1 to 6, the present disclosure provides a display module including a cover plate 100, a display panel 200, a flexible circuit board 300, a first support 401, and a protective layer 500.

As shown in fig. 1 and 2, the cover plate 100 may be a transparent cover plate 100, such as glass. The cover plate 100 has a first region 110 and a second region 120 located at the periphery of the first region 110. The display panel 200 is disposed at one side of the cover plate 100. The display panel 200 has a light-emitting surface and a non-light-emitting surface far from the light-emitting surface. The cover plate 100 is located at a side of the display panel 200, which is not light-emitting surface. The front projection of the display panel 200 on the cover plate 100 is located in the first area 110. The display panel 200 may be a flexible display panel such as an OLED (Organic Light-Emitting Diode) display panel.

The display panel 200 may include a substrate base, a driving circuit layer, a light emitting device layer, and the like. The drive circuit layer is arranged on one side of the substrate, the light-emitting device layer is arranged on one side, far away from the substrate, of the drive circuit layer, and the light-emitting device layer comprises a plurality of light-emitting devices. The driving circuit layer is used for driving the light emitting device to emit light. The substrate included in the display panel 200 may be Polyimide (PI). The substrate may also be a composite of multiple layers of materials, for example, in one embodiment of the present disclosure, the substrate may include a base Film layer (Bottom Film), a pressure sensitive adhesive layer, a first polyimide layer, and a second polyimide layer, which are sequentially stacked.

As shown in fig. 1 and fig. 3, the front projection of the display panel 200 on the cover plate 100 is located in the first area 110, and the display panel 200 includes a non-bending area 210, a first bending area 220 and a binding area 230 connected in sequence, where the binding area 230 is bent to a side of the non-bending area 210 away from the cover plate 100 through the first bending area 220. The non-inflection region 210 is used to display a picture. The first bending region 220 may bend a partial region thereof to form a side display region of the electronic display device.

The non-inflection region 210 includes a central region 211 and a peripheral region 212 located at the periphery of the central region 211. The non-bending region 210 may have a shape substantially in the shape of a circle, rectangle, regular polygon, etc., and the disclosure is not limited thereto. The peripheral region 212 may surround the central region 211 for one revolution, i.e., surround the central region 211.

As shown in fig. 1, 4 and 5, the flexible circuit board 300 is connected to a side of the binding region 230 remote from the cover plate 100. The flexible circuit board 300 may have various shapes, and the specific shape may be adjusted according to the shape of the non-bending region 210 of the display panel 200. The flexible circuit board 300 includes a third region 301, a second bending region 302, and a fourth region 303 connected in sequence, the fourth region 303 is bent to a side of the third region 301 away from the cover plate 100 by the second bending region 302, and a maximum distance between an edge of the third region 301 and an edge of the display panel 200 is smaller than a minimum distance between an edge of the second bending region and an edge of the display panel 200 in a direction parallel to the cover plate 100.

For example, the outer edge of the third region 301 of the flexible circuit board 300 is substantially flush with the edge of the display panel 200, and the edge of the second bending region 302 is recessed toward the center of the display panel 200 compared to the edge of the display panel 200. Specifically, the distance between the outer edge of the third region 301 of the flexible circuit board 300 and the edge of the display panel 200 may be 0mm to 0.1mm, preferably 0mm to 0.05mm, and may specifically be any value between 0mm, 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, or other 0mm to 0.05 mm. Within this range of values, the outer edge of the third region 301 of the flexible circuit board 300 is substantially flush with the edge of the display panel 200, helping to provide a structural basis for the subsequent placement of the first support 401. The distance between the edge of the second bending region 302 and the edge of the display panel 200 is relatively large, and may be greater than 1mm, such as 1.5mm, 2mm, 3mm, 4mm, or more. The fourth region 303 of the flexible circuit board 300 is bent to a side of the third region 301 away from the cover plate 100 by the second bending region 302, and the orthographic projection of the fourth region 303 of the flexible circuit board 300 on the cover plate 100 is located within the orthographic projection of the third region 301 of the flexible circuit board 300 on the cover plate 100.

In some embodiments of the present disclosure, the flexible circuit board 300 is a multi-layer laminate structure. Specifically, the flexible circuit board 300 is formed with green oil protective layers and metal layers alternately stacked, and the material of the metal layers may be copper (Cu). The number of green oil protection layers and metal layers included in the flexible circuit board 300 may not be limited, for example, in an embodiment, the flexible circuit board includes three green oil protection layers and three metal layers, wherein the outermost surface of the flexible circuit board 300 may be the green oil protection layer to protect the routes in the metal layers.

As shown in fig. 1, 3, 4 and 5, the first support 401 is disposed on the surface of the third region 301 of the flexible circuit board 300 away from the cover plate 100, and the front projection of the first support 401 on the cover plate 100 is located within the front projection of the peripheral region 212 on the cover plate 100, that is, the first support 401 is located at the edge position of the third region 301 of the flexible circuit board 300. The shape of the first support 401 may be set according to the shape of the third region 301 of the flexible circuit board 300. For example, the third region 301 of the flexible circuit board 300 may be substantially semicircular or semi-circular, and then the orthographic projection of the first support 401 on the cover plate 100 may be substantially in a non-closed ring-shaped structure, such as a circular arc.

In some embodiments of the present disclosure, the first support 401 is a resilient structure, e.g., the material of the first support 401 comprises foam, preferably closed cell foam. Compared with the open-cell foam, the closed-cell foam has certain elasticity and better stability and rigidity. The width of the first support 401 in the direction from the central region 211 to the peripheral region 212 may be 1.1mm to 2mm, specifically 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, but is not limited thereto. The thickness of the first support 401 in the direction perpendicular to the cover plate 100 is 0.2mm to 0.5mm, and may be specifically 0.2mm, 0.22mm, 0.24mm, 0.25mm, 0.26mm, 0.28mm, 0.3mm, 0.32mm, 0.34mm, 0.35mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.45mm, 0.46mm, 0.48mm, or 0.5mm, but is not limited thereto. The first support 401 may be connected to the flexible circuit board 300 through a glue layer.

As shown in fig. 1, 5 and 6, the protective layer 500 is attached to the second region 120 of the cover plate 100, and the height of the protective layer 500 is not less than the distance between the flexible circuit board 300 and the cover plate 100. The protection layer 500 may be attached to the surface of the second region 120 of the cover 100 near the display panel 200, and further may be attached to a sidewall of the cover 100. The protective layer 500 may surround the display panel 200 to wrap the sidewall of the display panel 200, and further may wrap the first bending region 220 of the display panel 200. At least a portion of the protective layer 500 is located on a side of the flexible circuit board 300 away from the cover plate 100, and a sidewall of the first support 401 is attached to at least a portion of the sidewall of the protective layer 500. That is, the protective layer 500 wraps at least a partial region of the display panel 200 and the flexible circuit board 300. The shape of the protective layer 500 may be adjusted according to the shape of the display panel 200, for example, the front projection of the display panel 200 on the cover plate 100 is substantially circular, and then the front projection of the protective layer 500 on the cover plate 100 is substantially circular. If the front projection of the display panel 200 on the cover plate 100 is substantially rectangular, the front projection of the protective layer 500 on the cover plate 100 is substantially rectangular. The material of the protective layer 500 may be epoxy, polyurethane, silicone, or the like.

As shown in fig. 1 to 5, in some embodiments of the present disclosure, the display module further includes a composite heat dissipation film 600 and a second support 402, the composite heat dissipation film 600 being disposed between the display panel 200 and the flexible circuit board 300. The specific composite heat dissipation film 600 is located between the non-bending region 210 of the display panel 200 and the flexible circuit board 300. The composite heat dissipation film 600 includes a buffer layer and a reinforcing layer stacked and disposed on a side of the buffer layer away from the display panel 200. The buffer layer can be a Super Clean Foam (SCF) layer, and the reinforcing layer has stronger structural strength and mainly plays a role in fixation. The reinforcing layer may be a metal layer, such as a copper layer.

The second supporting member 402 is disposed on the surface of the composite heat dissipation film 600 away from the cover plate 100, the front projection of the second supporting member 402 on the cover plate 100 does not overlap with the front projection of the third region 301 on the cover plate 100, and the front projection of the second supporting member 402 on the cover plate 100 is located within the front projection of the peripheral region 212 on the cover plate 100. Further, as shown in fig. 7, when the flexible circuit board 300 is in the unfolded state, that is, when the fourth region 303 of the flexible circuit board 300 is not bent to the side of the third region 301 away from the cover plate 100 by the second bending region 302, the front projection of the second support 402 on the cover plate 100 and the front projection of the third region 301 of the flexible circuit board 300 on the cover plate 100 are at least partially overlapped when the fourth region 303, the second bending region 302 and the third region 301 of the flexible circuit board 300 are substantially in the same plane.

The shape of the second support 402 may be set according to the shape of the display panel 200. For example, the display panel 200 is substantially circular, and the shape of the orthographic projection of the second support 402 on the cover plate 100 may be substantially a non-closed ring structure, such as a circular arc.

In some embodiments of the present disclosure, the second support 402 is a resilient structure, e.g., the material of the second support 402 comprises foam, preferably closed cell foam. The width of the second support 402 in the direction from the central region 211 to the peripheral region 212 may be 1.1mm to 2mm, and may be 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2mm, but is not limited thereto. The thickness of the second support 402 in the direction perpendicular to the cover plate 100 is 0.2mm to 0.5mm, and may be specifically 0.2mm, 0.22mm, 0.24mm, 0.25mm, 0.26mm, 0.28mm, 0.3mm, 0.32mm, 0.34mm, 0.35mm, 0.36mm, 0.38mm, 0.4mm, 0.42mm, 0.44mm, 0.45mm, 0.46mm, 0.48mm, or 0.5mm, but is not limited thereto.

The second support 402 may be connected to the composite heat dissipation film 600 through an adhesive layer. In practical application, before the second support member 402 is attached to the composite heat dissipation film 600, the flexible circuit board 300 is in an unfolded state, and two side surfaces of the second support member 402 may be respectively provided with adhesive layers with different adhesive forces, for example, one side surface is provided with strong adhesive force, and the other side surface is provided with weak adhesive force. The weak adhesive surface of the second supporting member 402 may be connected to the fourth region 303 of the flexible circuit board 300, a certain bearing force is given to the second supporting member 402 by the fourth region 303 of the flexible circuit board 300, and then the strong adhesive surface of the second supporting member 402 is connected to the composite heat dissipation film 600, and the weak adhesive surface is separated from the flexible circuit board 300, so that the second supporting member 402 may be connected to the composite heat dissipation film 600.

As shown in fig. 5, in some embodiments of the present disclosure, the orthographic connection of both the first support 401 and the second support 402 on the cover plate 100 forms a non-closed loop structure that surrounds the orthographic projection of the central region 211 on the cover plate 100. It should be noted that the annular structure herein is not particularly limited to a circular ring, but may be a ring of other shapes, such as a rectangular ring, a square ring, or other polygonal ring.

As shown in fig. 8 and 9, in the present disclosure, the protective layer 500 may be formed using an injection molding process. Specifically, the method comprises the following steps:

(1) The mold core is provided, the mold core is provided with a containing cavity 13, the second mold core 12 is positioned at one side of the first mold core 11 in the first direction, the second mold core 12 is abutted with the first mold core 11 to form the containing cavity 13, and the second mold core 12 is provided with an injection molding opening 121 communicated with the containing cavity 13. The first mold core 11 and the second mold core 12 may be fixed by the first mold frame 01 and the second mold frame 02.

(2) The display assembly is placed in the accommodating cavity 13, and the display assembly includes the cover plate 100, the display panel 200, the flexible circuit board 300 and the first supporting member 401, and the first direction is perpendicular to the plane of the cover plate 100. The structures of the cover plate 100, the display panel 200, the flexible circuit board 300 and the first support member 401 may refer to the above-mentioned embodiments, and are not described in detail herein.

(3) Injection molding material is injected through the injection molding opening 121 of the second mold core 12 to form the protection layer 500.

The side wall of the second mold core 12 includes a first side wall 122 and a second side wall 123 located at the periphery of the first side wall 122, an injection cavity 124 is formed between the first side wall 122 and the second side wall 123, the injection cavity 124 is communicated with the injection port 121, the second side wall 123 is abutted with the side wall of the first mold core 11, and at least part of the first side wall 122 is abutted with the first supporting member 401. Injection molding material is injected into the injection molding cavity 124 through the injection molding opening 121, and the injection molding material forms the protective layer 500. The first sidewall 122 may be interference-abutted to the first support 401. In this way, the first supporting member 401 can absorb and buffer the impact force of the first sidewall 122 of the second mold core 12 on the display panel 200, the composite heat dissipation film 600, and the like, so as to avoid forming a mold mark on the composite heat dissipation film 600 and the like, thereby helping to prevent the structures from deforming.

Further, the display assembly further comprises a second support 402, the orthographic projection of the first sidewall 122 on the cover plate 100 being located within the orthographic projection of both the first support 401 and the second support 402 combined on the cover plate 100. Specifically, the width of the first sidewall 122 is smaller than the width of the first support 401 or the second support 402 in a direction parallel to the cover plate 100, and the width of the first sidewall 122 is 0.6mm to 0.8mm.

As shown in fig. 1, in some embodiments of the present disclosure, the display module may further include an optical adhesive layer 700 and a polarizing layer 800. The optical adhesive layer 700 is disposed between the non-bending region 210 of the display panel 200 and the cover plate 100, and the polarizing layer 800 is disposed between the optical adhesive layer 700 and the non-bending region 210 of the display panel 200.

The polarizing layer 800 is used for solving the reflection problem of external light so as to meet the anti-reflection requirement of the display product. In some embodiments, the polarizing layer 800 includes a phase difference layer and a polarizing layer. The retardation layer and the polarizing layer may be connected by a pressure-sensitive adhesive layer. The phase difference layer is arranged on one side of the optical adhesive layer 700 away from the display panel 200; the polarizing layer is disposed on a side of the retardation layer away from the display panel 200, and the front projection of the polarizing layer on the display panel 200 at least partially overlaps the front projection of the retardation layer on the display panel 200.

The phase difference layer may be a single layer or multiple layers, which may be a half-wave plate or a quarter-wave plate, or a combination thereof, through which the polarization properties of photons are modulated. The polarizing layer may be an iodine-based polarizing layer, which is dyed with an iodine dye and has polarizing properties based on optical dichroism including crystals.

Further, the display panel 200 further includes a third supporting member 403 disposed between the bonding area 230 of the display panel 200 and the composite heat dissipation film 600 to support the bonding area 230.

As shown in fig. 1 to 6, 8 and 9, the present disclosure further provides a method for manufacturing a display module, including:

step S100, providing a mold core, wherein the mold core is provided with a containing cavity 13, the mold core comprises a first mold core 11 and a second mold core 12, the second mold core 12 is positioned at one side of the first mold core 11 in the first direction, the second mold core 12 is abutted with the first mold core 11 to form the containing cavity 13, and the second mold core 12 is provided with an injection molding opening 121 communicated with the containing cavity 13;

step S200, placing a display assembly in the accommodating cavity 13, where the display assembly includes a cover plate 100, a display panel 200, a flexible circuit board 300 and a first supporting member 401, and the first direction is perpendicular to a plane where the cover plate 100 is located;

wherein, the cover plate 100 has a first area 110 and a second area 120 located at the periphery of the first area 110; the display panel 200 is arranged on one side of the cover plate 100, the orthographic projection of the display panel 200 on the cover plate 100 is positioned in the first area 110, the display panel 200 comprises a non-bending area 210, a first bending area 220 and a binding area 230 which are sequentially connected, the binding area 230 is bent to one side, far away from the cover plate 100, of the non-bending area 210 through the first bending area 220, and the non-bending area 210 comprises a central area 211 and a peripheral area 212 positioned at the periphery of the central area 211; the flexible circuit board 300 is connected to one side of the binding area 230 away from the cover plate 100, the flexible circuit board 300 comprises a third area 301, a second bending area 302 and a fourth area 303 which are sequentially connected, the fourth area 303 is bent to one side of the third area 301 away from the cover plate 100 through the second bending area 302, and in the direction parallel to the cover plate 100, the maximum distance between the edge of the third area 301 and the edge of the display panel 200 is smaller than the minimum distance between the edge of the second bending area 302 and the edge of the display panel 200; the first supporting member 401 is disposed on the surface of the third region 301 of the flexible circuit board 300, which is far away from the cover plate 100, and the orthographic projection of the first supporting member 401 on the cover plate 100 is located within the orthographic projection of the peripheral region 212 on the cover plate 100;

step S300, injecting injection molding material through the injection molding opening 121 of the second mold core 12 to form a protection layer 500, wherein the protection layer 500 is attached to the second region 120, the height of the protection layer 500 is not less than the distance from the flexible circuit board 300 to the cover plate 100, at least part of the region of the protection layer 500 is located at one side of the flexible circuit board 300 away from the cover plate 100, and the side wall of the first support member 401 is attached to at least part of the side wall of the protection layer 500;

the side wall of the second mold core 12 includes a first side wall 122 and a second side wall 123 located at the periphery of the first side wall 122, an injection cavity 124 is formed between the first side wall 122 and the second side wall 123, the second side wall 123 is abutted with the side wall of the first mold core 11, and at least a portion of the first side wall 122 is abutted with the first supporting member 401.

In some embodiments of the present disclosure, the display assembly further includes a composite heat dissipation film 600 and a second support 402, the composite heat dissipation film 600 being disposed between the display panel 200 and the flexible circuit board 300; the second supporting member 402 is disposed on the surface of the composite heat dissipation film 600 away from the cover plate 100, the orthographic projection of the second supporting member 402 on the cover plate 100 does not overlap with the orthographic projection of the third region 301 on the cover plate 100, and the orthographic projection of the second supporting member 402 on the cover plate 100 is located within the orthographic projection of the peripheral region 212 on the cover plate 100; wherein the front projection of the first sidewall 122 on the cover plate 100 is located within the front projection of both the first support 401 and the second support 402 combined on the cover plate 100.

The disclosure also provides a display device, which comprises a display module. The display module can be any of the display modules described in the above embodiments, and the specific structure and the beneficial effects thereof can refer to the embodiments of the display module described above, which are not described herein again. The display device of the present disclosure may be an electronic device such as a mobile phone, a tablet computer, a television, and the like, which are not listed here.

It should be noted that although the steps of the methods of the present disclosure are illustrated in the accompanying drawings in a particular order, this does not require or imply that the steps must be performed in that particular order or that all of the illustrated steps be performed in order to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step to perform, and/or one step decomposed into multiple steps to perform, etc., all are considered part of the present disclosure.

It is to be understood that the disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the disclosure. The disclosure is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications are within the scope of the present disclosure. It should be understood that the present disclosure disclosed and defined herein extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present disclosure. Embodiments of the present disclosure describe the best mode known for carrying out the disclosure and will enable one skilled in the art to utilize the disclosure.

Claims (10)

1. A display module, comprising:

the cover plate is provided with a first area and a second area positioned at the periphery of the first area;

the display panel is arranged on one side of the cover plate, the orthographic projection of the display panel on the cover plate is positioned in the first area, the display panel comprises a non-bending area, a first bending area and a binding area which are sequentially connected, the binding area is bent to one side, far away from the cover plate, of the non-bending area through the first bending area, and the non-bending area comprises a central area and a peripheral area positioned at the periphery of the central area;

the flexible circuit board is connected to one side, far away from the cover plate, of the binding area and comprises a third area, a second bending area and a fourth area which are sequentially connected, the fourth area is bent to one side, far away from the cover plate, of the third area through the second bending area, and in the direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is smaller than the minimum distance between the edge of the second bending area and the edge of the display panel;

the first support piece is arranged on the surface of the third area of the flexible circuit board, which is far away from the cover plate, and the orthographic projection of the first support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

the protective layer is attached to the second area, the height of the protective layer is not less than the distance from the flexible circuit board to the cover plate, at least part of the protective layer is located on one side, away from the cover plate, of the flexible circuit board, and the side wall of the first supporting piece is attached to at least part of the side wall of the protective layer.

2. The display module of claim 1, wherein the display module further comprises:

the composite heat dissipation film is arranged between the display panel and the flexible circuit board;

the second support piece is arranged on the surface of the composite heat dissipation film, which is far away from the cover plate, the orthographic projection of the second support piece on the cover plate is not overlapped with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate.

3. The display module of claim 2, wherein the material of the first support or the second support comprises closed cell foam.

4. The display module of claim 2, wherein the orthographic connection of both the first support and the second support on the cover plate forms a non-closed loop structure that surrounds the orthographic projection of the central region on the cover plate.

5. The display module of claim 2, wherein the first support has a width of 1mm-2mm and the second support has a width of 1mm-2mm in a direction from the central region to the peripheral region;

the thickness of the first support member is 0.2mm-0.5mm in the direction perpendicular to the cover plate, and the thickness of the second support member is 0.2mm-0.5mm.

6. The display module of claim 1, wherein a distance between an edge of the third region and an edge of the display panel in a direction parallel to the cover plate is 0mm to 0.1mm.

7. The display module of claim 1, wherein the protective layer is formed using an injection molding process.

8. The manufacturing method of the display module is characterized by comprising the following steps:

providing a die core, wherein the die core is provided with a containing cavity, the die core comprises a first die core and a second die core, the second die core is positioned at one side of the first die core in a first direction, the second die core is abutted with the first die core to form the containing cavity, and an injection molding opening communicated with the containing cavity is formed in the second die core;

placing a display assembly in the accommodating cavity, wherein the display assembly comprises a cover plate, a display panel, a flexible circuit board and a first supporting piece, and the first direction is perpendicular to the plane of the cover plate;

the cover plate is provided with a first area and a second area positioned at the periphery of the first area; the display panel is arranged on one side of the cover plate, the orthographic projection of the display panel on the cover plate is positioned in the first area, the display panel comprises a non-bending area, a first bending area and a binding area which are sequentially connected, the binding area is bent to one side, far away from the cover plate, of the non-bending area through the first bending area, and the non-bending area comprises a central area and a peripheral area positioned at the periphery of the central area; the flexible circuit board is connected to one side, far away from the cover plate, of the binding area, and comprises a third area, a second bending area and a fourth area which are sequentially connected, wherein the fourth area is bent to one side, far away from the cover plate, of the third area through the second bending area, and in the direction parallel to the cover plate, the maximum distance between the edge of the third area and the edge of the display panel is smaller than the minimum distance between the edge of the second bending area and the edge of the display panel; the first supporting piece is arranged on the surface, far away from the cover plate, of the third area of the flexible circuit board, and the orthographic projection of the first supporting piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

injecting injection molding materials through an injection molding opening of the second mold core to form a protective layer, wherein the protective layer is attached to the second area, the height of the protective layer is not smaller than the distance from the flexible circuit board to the cover plate, at least part of the area of the protective layer is positioned on one side of the flexible circuit board away from the cover plate, and the side wall of the first supporting piece is attached to at least part of the side wall of the protective layer;

the side wall of the second die core comprises a first side wall and a second side wall located at the periphery of the first side wall, an injection cavity is formed between the first side wall and the second side wall, the second side wall is abutted with the side wall of the first die core, and at least part of the first side wall is abutted with the first supporting piece.

9. The method of claim 8, wherein the display assembly further comprises a composite heat dissipation film and a second support, the composite heat dissipation film being disposed between the display panel and the flexible circuit board; the second support piece is arranged on the surface of the composite heat dissipation film, which is far away from the cover plate, the orthographic projection of the second support piece on the cover plate is not overlapped with the orthographic projection of the third area on the cover plate, and the orthographic projection of the second support piece on the cover plate is positioned in the orthographic projection of the peripheral area on the cover plate;

wherein the orthographic projection of the first sidewall on the cover plate is located within the orthographic projection of the combination of the first support and the second support on the cover plate.

10. A display device comprising a display module according to any one of claims 1-7.

Images