CN116151299A - Tire embedded ultrahigh frequency RFID tire tag - Google Patents

Tire embedded ultrahigh frequency RFID tire tag Download PDF

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Publication number
CN116151299A
CN116151299A CN202111247135.4A CN202111247135A CN116151299A CN 116151299 A CN116151299 A CN 116151299A CN 202111247135 A CN202111247135 A CN 202111247135A CN 116151299 A CN116151299 A CN 116151299A
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CN
China
Prior art keywords
tire
antenna
chip
tag
rfid
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Pending
Application number
CN202111247135.4A
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Chinese (zh)
Inventor
李元钦
文炳弼
文相国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruifangte Co ltd
Fujian Yuchen Microelectronics Co ltd
Original Assignee
Ruifangte Co ltd
Fujian Yuchen Microelectronics Co ltd
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Publication date
Application filed by Ruifangte Co ltd, Fujian Yuchen Microelectronics Co ltd filed Critical Ruifangte Co ltd
Priority to CN202111247135.4A priority Critical patent/CN116151299A/en
Publication of CN116151299A publication Critical patent/CN116151299A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07764Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier attachable to a tire
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Tires In General (AREA)

Abstract

The invention relates to a tire implanted ultrahigh frequency RFID tire tag, comprising: an RFID chip; and an antenna electrically connected to the RFID chip; and the chip die package is arranged around the RFID chip and protects the RFID chip.

Description

Tire embedded ultrahigh frequency RFID tire tag
The present application claims priority from korean patent application No. KR10-2021-0059577 entitled "ultra-high frequency RFID tire tag for tire implantation", filed 5/7 of 2021, the entire contents of which are incorporated herein by reference.
Technical Field
The invention relates to a tire embedded ultrahigh frequency RFID tire tag. And it relates to a manufacturing method, more particularly, it is installed inside a tire under a high temperature and high pressure environment during the tire manufacturing process, so that the history of tire manufacturing from initial production to production can be managed, and then the tire is installed to a vehicle, the tire embedded type tire tag maintains durability even in the bending and stretching movements of the tire occurring during operation, and prevents tag chip breakage and tag detachment from the tire. Thus, RFID communication can be smoothly and uninterruptedly performed until the service life of the tire is finished, and the UHF-band RFID tire tag is related.
Background
In general, RFID (radio frequency identification) technology refers to technology that uses radio waves to wirelessly identify information from a location spaced apart by a certain distance. In order to implement RFID technology, an RFID tag and an RFID reader are required. An RFID tag is an antenna and an integrated circuit, which includes an RFID chip, in which necessary information is recorded in advance, and the information is transmitted to a reader through the antenna. Typically, the information stored in the RFID chip is used to identify the RFID tagged object.
The difference between RFID and bar code systems is that it uses radio waves instead of light for reading. Thus, it does not work at close distances like a bar code reader, but can read tags at long distances, even with the advantage of being able to receive information by objects without visible distances.
These RFID tags are being applied to production management and inventory management of various manufactured products, and in particular, actively applied to tire manufacturing processes and inventory management processes.
In the application of an Enterprise Resource Planning (ERP) system such as production management in a tire manufacturing process or inventory management after manufacturing, in the case where an RFID tag is attached or buried from a molding stage of the tire manufacturing, a subsequent process is exposed as the RFID tag to a severe manufacturing environment of a vulcanization process, i.e., a high temperature environment of 150 ℃ to 230 ℃ or more and a high pressure environment of 30Bar or more, and damage occurs in the RFID tag manufacturing process.
It is an object of the present invention to design a tire-embedded ultra-high frequency RFID tire tag against the above-described problems of the prior art.
Disclosure of Invention
The invention aims to solve the problems of the prior art and provides a tire embedded ultrahigh frequency RFID tire tag which can effectively solve the problems of the prior art.
The technical scheme of the invention is as follows:
a tire-implanted ultra-high frequency RFID tire tag comprising:
an RFID chip; and
an antenna electrically connected to the RFID chip;
and the chip die package is arranged around the RFID chip and protects the RFID chip.
Further, a lead frame is further included between the RFID chip and the antenna, and electrically connects the RFID chip and the antenna.
Further, a portion of the lead frame body protrudes outside the chip mold package, and when the antenna is combined with the chip mold package, the antenna may contact and be inserted into the lead frame body protruding outward.
Further, the antenna is a coil-type antenna, and the antenna is mounted or locked on the outer circumferences of the two ends of the chip die package.
Further, the coil of the antenna has a wire diameter of 0.15-0.35 mm, an inner diameter of 0.6-1.0 mm, an outer diameter of 0.8-1.6 mm, a coil pitch of 0.6-1.0 mm, and the number of turns of the antenna on one side of 25-45 turns.
Further, a portion of the antenna is combined with the chip mold package for increasing a coupling force with the chip mold package and securing flexibility, thereby improving durability of the bending and stretching motion.
Further, the pitches of the coils of the antenna are matched with those of the corresponding tire, and the constituent materials of the tire are filled into the antenna, so that the air inflow caused by the difference of physical properties of the tire in the vulcanization process is prevented.
Further, an end portion of the antenna is inserted into the inside of the chip die package and is in electrical contact with the lead frame body.
Further, a portion of the chip mold package coupled to the antenna is coated with conductive ink or gold plating, and the portion of the chip mold package coupled to the antenna is electrically connected to the lead frame body.
Further, the antenna is made of steel or stainless steel.
Further, the antenna is made of copper-tin-plated or copper-zinc-plated alloy and is implanted into the tire, and a coating process is not needed.
Further, the tire tag is implanted into the inner sidewall of the inner liner of the tire by an automatic labeling device during the tire manufacturing process, and the center of the tire tag is disposed at a position 10 to 100mm from the bead.
Further, the antenna is a rectangular coil type antenna, and a rectangular short edge of the antenna is implanted in the same direction as the tire is pressurized during tire building, for facilitating the inflow of tire constituent substances into the interior of the antenna, maintaining the flexibility of the antenna.
Further, the tire label is packaged by a reel spool or a tray.
Accordingly, the present invention provides the following effects and/or advantages:
the use environment of the invention is that the RFID tag is implanted into the tire, while the existing attached RFID tag falls off or is attached to the inner surface of the tire due to repeated bending and stretching movements of the tire during running, and the position of the RFID tag can be seen by naked eyes and is manually detached, so that the problems of damage and the like are caused. Implantable tags can well overcome these problems.
In addition, the invention has the effect of tightly combining the chip mold package including the chip and the coil antenna with the tire until the tire is scrapped. That is, in the case of the antenna coil spring according to the present invention, the tire constituent material not only bonds with the outside of the coil but also penetrates into the inside, and the coil spring can be firmly fixed by connecting the tire constituent material inside and outside of the coil spring to each other.
In addition, the core of the present invention is environment-friendly because the chip mold package including the chip does not appear in the PCB, but is combined with the coil type antenna by the chip mold package itself, the PCB is not required, and the soldering process can be omitted. Since the PCB fabrication and soldering processes are excluded, a rapid process speed can be achieved and costs can be saved.
In addition, the present invention can form a chip mold package protecting a chip through a mold. At this time, a multi-chip mold package can be formed for a plurality of chips at the same time, thereby achieving the effect of improving the process speed. In addition, the invention can simply connect the chip and the antenna together through the chip die package, thereby achieving the effect of simplifying the manufacturing process.
The invention does not mount the RFID chip on the PCB, so that the welding engineering which is the engineering necessary for the actual operation of the PCB can be omitted, thereby eliminating the manpower of the welding procedure, reducing the labor cost, relieving the environmental pollution caused by heavy metal treatment engineering, and fundamentally avoiding bad products caused by the welding procedure and having expected effect.
It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
Drawings
Fig. 1 (a) and (b) are perspective views of a conventional tire label manufactured by soldering an antenna to a PCB, in accordance with an embodiment of the present invention.
Fig. 2 is a perspective view of a chip die package mounted in a state where an antenna is directly connected to an RFID chip, according to an embodiment of the present invention.
Fig. 3 is a perspective view of a chip die package mounted in a state in which an antenna is connected to an RFID chip through a lead frame body according to an embodiment of the present invention.
Fig. 4 is a perspective view of a chip die package mounted in a state in which an antenna is connected to an RFID chip through a lead frame body according to another embodiment of the present invention.
Fig. 5 is a schematic illustration of forming protrusions or threads on both ends of a chip die package according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of an antenna bonding portion of a fabricated chip die package according to an embodiment of the present invention, the antenna being brought into contact with and bonded to a lead frame by forming a gold plating layer with conductive ink or gold plating.
Fig. 7 is a schematic diagram of a method of producing a chip die package on a pre-assembled leadframe and RFID chip by an injection molding process, in accordance with an embodiment of the invention.
Fig. 8 is a schematic view of a rectangular antenna according to an example of the present invention, and the direction of pressurization of the tire when the tire is implanted is indicated by an arrow.
FIG. 9 is a schematic illustration of a roll-to-roll package of mass-produced tire labels, according to an embodiment of the present invention.
Fig. 10 and 11 are schematic views of the implantation location of a tire tag in a tire according to an embodiment of the present invention.
Reference numerals in the drawings:
100, tyre label; 110, packaging a chip mould;
111, RFID chip; 112, a processing groove;
113, a lead wire; 114, screw thread;
115, a lead frame body; 130, an antenna;
150, gold plating.
Detailed Description
The following drawings are presented to enable one of ordinary skill in the art to practice the invention in more detail. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention in the drawings, portions not related to the description are omitted, and similar reference numerals are given to similar portions through the entire detailed table.
Throughout the list, when some portion indicates that a certain constituent element is to be "included", if no particular contrary expression is intended, other constituent elements are not excluded, but it means that other constituent elements may be included.
In addition, the terms "… … unit", "… … group" and the like in the list refer to at least a unit for processing one function or action.
For the convenience of understanding by those skilled in the art, the structure of the present invention will now be described in further detail with reference to the accompanying drawings:
referring to fig. 1, the tire-embedded ultra-high frequency RFID tire tag 100 of the present invention comprises:
an RFID chip 111; and
an antenna 130 electrically connected to the RFID chip 111;
and a chip mold package 110 surrounding the RFID chip 111 and protecting the RFID chip 111.
As shown in fig. 2, the implanted tire tag 100 of the present invention is provided with an RFID chip 111, and the RFID chip 111 on the upper side is electrically connected to an antenna 130 through a lead 113; and a chip mold package 110 surrounding the RFID chip 111 to protect the RFID chip 111.
The RFID chip 111 employs a conventional chip, but in the present invention, the chip is not mounted on PCB (Printed Circuit Board), but is composed of a chip die package 110. Compared with the actual operation of the PCB, the method can eliminate the difficulty of welding, save labor cost by eliminating welding personnel, reduce manufacturing unit price, prevent heavy metal pollution caused by welding and solve the problem of product reject ratio rise caused by errors frequently occurring in the welding process.
On the other hand, in the chip die package 110, the RFID chip 111 is buried inside. The chip mold package 110 embeds the entire RFID chip 111 therein to protect the chip from external forces acting in various manners such as a tire bending and stretching motion, and in addition, since the antenna 130 or a lead frame body 115 described later can consolidate the connection chip, the stability of the connection state can be secured. The shape of the chip die package 110 is not particularly limited, and the single-sided shape may be embodied as a plurality of polygons, curved shapes, or the like. The die package 110 is a synthetic resin, and may be made of, for example, an epoxy resin that ensures heat resistance of a tire during running, but other materials may be used as long as heat resistance is ensured. Because, if the durability of the chip die package 110 is reduced, the protected RFID chip 111 and the lead frame 115 cannot be protected.
As shown in fig. 2, in order to enable smooth identification of radio waves, the RFID chip 111 of the present invention must be electrically connected to the antenna 130, typically by using the lead frame 115 and PCB as a medium. In contrast, in the present invention, the antenna 130 is directly connected to the RFID chip 111, and the antenna 130 is fixed with the chip die package 110. The chip die package 110 will function to protect the RFID chip 111 and also maintain the antenna 130 in a normal connection state with the RFID chip 111.
The present invention can manufacture the tire label 100 without a PCB, and can be used for a long period of time while ensuring durability. At this time, the chip mold package 110 is molded in a state where the antenna 130 is inserted into the mold.
Fig. 2 shows a configuration in which the antenna 130 is inserted into the chip die package 110. In this case, a portion of the lead frame body 115 may not be exposed to the outside of the chip mold package 110. The antenna 130 inserted inside is physically and electrically connected directly inside the lead frame body 115 and the die package 110. As to whether or not the lead frame body 115 can be exposed to the outside of the chip die package 110, it will be decided according to the design of the mold.
In addition, fig. 3 and 4 show mounting perspective views of a chip die package in a state where an antenna 130 is connected to an RFID chip 111 through a lead frame body 115 according to various embodiments of the present invention.
As shown in fig. 3 and 4, in the connection method of the RFID chip 111 and the antenna 130, instead of the direct connection, a dielectric connection called a lead frame body (lead) 115 may be used. In this case, the antenna 130 is mounted on the outer peripheral end of the chip die package 110, and the lead frame 115 serves as an intermediary of electrical connection between the RFID chip 111 and the antenna 130. That is, the RFID chip 111 is connected to the lead frame body 115 to be energized. Further, by connecting the antenna 130 to the lead frame body 115, the rfid chip 111 and the antenna 130 are electrically connected.
The method of forming the chip die package 110 of the present invention is illustrated next.
First, a plurality of combinations of the RFID chip 111 and the antenna 130 or a plurality of combinations of the RFID chip 111 and the lead frame body 115 may be mounted in a mold using an injection molding process, and the liquid chip mold package 110 such as an epoxy resin is formed by injecting an injection molding material of the mold and curing by heating or curing at room temperature. The mold includes a region in which a plurality of combinations of the RFID chip 111 and the antenna 130 connected or a plurality of combinations of the RFID chip 111 and the lead frame body 115 connected may be disposed, and the chip mold packages 110 are formed in one region, so that a plurality of chip mold packages 110 may be formed at a time. The shape of the lead frame body 115 is not shown in the present embodiment, and is not limited to a specific shape.
Next, when the chip-die package 110 is formed in a state where the RFID chip 111 and the antenna 130 are connected, the tire tag 100 is manufactured immediately, and next, when the chip-die package 110, the RFID chip 111, and the lead frame body 115 are connected to form a plurality of compositions, the antenna 130 is additionally connected. At this time, the RFID chip 111 and the antenna 130 must be electrically connected and molded such that a portion of the lead frame body 115 may partially protrude to the outside of the chip mold package 110. When the lead frame 115 protrudes outside the chip-die package 110, the antenna 130 is coupled to the chip-die package 110, and the antenna 130 contacts and is connected to the lead frame 115.
The shape of the antenna 130 is not particularly limited, but since the antenna 130 is mounted to be embedded in the tire, it is preferable that the antenna 130 may be a coil-type antenna capable of maximizing a contact area with the tire by allowing the tire component to penetrate well. In the case of coil-type antennas, it is most durable even in the case of repeated stresses imposed by the bending/stretching movements of the tyre. Since the coil antenna is annular in shape as a whole, there is no region of stress concentration during the tire bending/stretching motion. If there is a region in the antenna 130 where stress is concentrated due to bending movement of the tire, the portion is first damaged, and thus the tire tag 100 cannot function or loses its function.
As shown in fig. 5, for example, the chip die packages 110 are provided at both ends, so that the connected antenna 130 is kept in a fixed state, and the original functions of the tire tag 100 can be stably exhibited. The protrusion is formed or the screw 114 is formed, the protrusion serves as a stopper of the antenna 130 mounted by press-fitting, or may be fixed by screwing the coil-type antenna onto the screw 114.
The coil of the antenna has a wire diameter of 0.15-0.35 mm, an inner diameter of 0.6-1.0 mm, an outer diameter of 0.8-1.6 mm, a coil pitch of 0.6-1.0 mm, and the number of turns of the antenna on one side of 25-45 turns. The reason for this is that the shape of the antenna 130 needs to be optimized for each tire manufacturer because the composition and viscosity of the rubber used by each tire manufacturer in the tire manufacturing process are different from each other. In particular, this is to prevent a phenomenon in which tire constituent materials are sufficiently introduced into the coil antenna 130 and air is filled in the coil antenna 130 during tire vulcanization. If the tire constituent material does not flow into the interior of the coil antenna 130, air may instead remain in the interior space of the antenna 130, which may cause the tire to internally burst according to the bending and stretching motions of the tire. This may lead to serious accidents, and thus it is necessary to avoid that the air inside the tire is generated from different components, such as the tire tag 100 as a constituent material of the tire. In addition, by firmly fixing the antenna 130 inside the tire, there is an effect of improving the durability of the tire tag 100.
In addition, if the wire diameter is too small, the antenna 130 may be broken by the flexing and extending movement of the tire; if the wire diameter is too large, the flexibility of the antenna 130 is low, and it is difficult to flexibly cope with the deflection/extension of the tire due to such disturbance, stress is generated in the tire, and the tire may be damaged finally. In addition, if the pitch of the coil is too small, it is difficult for the tire component to flow too much material into the antenna 130 as described above, and if it is too large, the flexibility of the antenna 130 may not match the bending/stretching movement of the tire, and the antenna 130 may be damaged. Therefore, the above-mentioned range of values has critical meanings on its upper and lower limits.
In addition, when the antenna 130 is applied to different tires, the pitch interval is adjusted so that the tire constituent material is filled into the inside of the antenna 130, thereby preventing inflow of air due to different physical characteristics during vulcanization. For example, when the tire has a high viscosity, the tire constituent material may infiltrate into the antenna 130 when the pitch interval of the antenna 130 is large, and when the tire has a small viscosity, it may flow, because of good performance, even when the pitch interval of the antenna 130 is small, the tire constituent material may infiltrate into the antenna 130.
Fig. 5 shows a processing groove 112 formed on the screw 114, and the lead frame 115 of fig. 3 (a) and 4 (a) is exposed to the outside through the processing groove 112. The shape of the processing groove 112 is formed to correspond to the shape of the lead frame body 115. Therefore, the shapes of the processing groove 112 corresponding to the lead frame body 115 of fig. 3 (a) and the lead frame body 115 of fig. 4 (a) are different.
On the other hand, in the coil antenna, the pitch interval of the portion coupled to the chip mold package 110 is relatively smaller than that of the remaining portion, and thus the antenna 130 and the chip mold package 110 may improve coupling force, which allows the antenna to well withstand bending/stretching movements of the tire. When the pitch is reduced, the contact area between the chip die package 110 and the antenna 130 becomes large, and thus the friction force, the coupling force, and the like become large. In particular, since this is the portion where the mechanical coupling force is the weakest, the coupling strength is increased by reducing the pitch interval, and the flexibility of the coil antenna 130 is doubled to effectively respond to the bending/stretching motion of the tire.
As shown in fig. 6, in the chip mold package 110, a plating layer 150 is formed on a portion coupled with the antenna 130 by conductive ink or plating, and the portion to which the antenna 130 is coupled is by being in electrical contact with the lead frame body 115, the antenna 130 and the lead frame body 115 may be electrically connected. In this case, the antenna 130 does not have to directly contact the lead frame 115, and the plating 150 functions as a bridge between the lead frame body 115 and the antenna 130.
Further, the antenna 130 is made of steel or stainless steel. As long as it has conductivity, various alloys are possible without being limited to this material. The antenna 130 may be used by copper-tin plating or copper-zinc alloy plating. In this case, the uniformity between the tire and the antenna 130 is improved, and there is an advantage in that a separate coating process can be omitted when the tire is labeled. The coating process is performed to match the tire and the antenna 130, but dip coating or spray coating is generally used, but the coating is practically difficult due to the very small size of the antenna 130, so that, for example, if the pre-plated steel wire is wound into a roll for use, there is an advantage in that a difficult plating process can be omitted. The coating agents commonly used for metal burial of tires are the Lord's brand CHEMLOK series, which are liquids that harden easily and therefore require constant stirring. In addition, there is a problem in that it is difficult to uniformly coat, and thus an improved method is required, which is solved by the present invention.
Further, the tire tag 100 is implanted into the inner sidewall of the inner liner of the tire by an automatic labeling apparatus during the tire manufacturing process, and the center of the tire tag 100 is disposed at a position 10 to 100mm from the bead. The location having the above range of values makes it easy to ensure that the characteristics of the antenna 130, in particular the identification distance, are protected from the wires of the beads/treads inside the tire. Furthermore, if too close to the bead/tread is caused by the deviation from this value, the identification distance between the tag 100 and the reader may be reduced due to the influence of the metal wire of the bead/tread. For example, if the distance from the bead is less than 10mm, the mechanical reliability of the tag 100 is more ensured because the bending and bending momentum of the bead portion is less than those of the other portions, but the antenna 130 is too close to the bead, and thus the recognition distance is reduced. In this regard, the embedded position of the tire tag 100 of the present invention is shown in fig. 10 and 11.
In addition, if it exceeds 100mm, since the amount of bending movement of the tire is large, the risk of breaking the tire tag is high, and for some tire sizes with small sidewall widths, the tire tag is too close to the tread, so that the tire tag is too close to the tread, and there is a problem that the recognition distance is reduced due to the effect. Therefore, the embedding position of the tag has a crucial meaning in the above numerical range.
Fig. 7 shows a method of producing the chip-die package 110 by injection molding on the pre-combined lead frame body 115 and the RFID chip 111, and double-headed arrows indicate the moving direction of the raw material epoxy of the chip-die package 110. Accordingly, the tire label 100 can be produced in a mass production method by implementing the chip mold package 110 in a conventional injection molding method. As an example, the lead frame body 115 of fig. 7 has a protrusion formed, and the protrusion may protrude outward through the processing groove 112 of the chip mold package 110. According to the process of fig. 7, a tire label having the shape shown in fig. 4 can be manufactured.
Meanwhile, in fig. 8, the antenna 130 according to the embodiment of the present invention has a rectangular shape and a direction of pressing against the tire when the tire tag 100 is buried is indicated by an arrow. In particular, the antenna 130 has a rectangular shape, is a coil antenna, and when the tire tag 100 is embedded in the tire building process, the rectangular short edge of the antenna 130 is implanted in the same direction as the tire is pressurized. Inflow is facilitated, flexibility of the antenna 130 is maintained, and formation of air holes inside the tire is prevented. In this case, in particular, since the coupling force between the tire tag 100 and the tire is greatly increased, the durability of the tire tag 100 can be improved, and the risk of tire breakage can be eliminated as much as possible.
The tyre tag is packaged by a reel spool or a tray. To identify the tire tag 100 manufactured through the process, a bar code, letter, number, or two-dimensional code for dual identification may be formed by printing or laser marking on the chip mold package 110 or a separate reel package. The encapsulation method may be performed by reel-to-reel packaging as shown in fig. 9.
The conventional tire label 100 has a structure welded to a PCB. However, since the front end of the PCB is not rolled, but is formed in a sheet shape, the arrangement structure is limited to a length of 2 meters of the PCB fabric even though the antennas 130 are maximally arranged. However, in the field, the sheet materials cannot be manually replaced and used continuously in units of 2 meters. Therefore, a large number of spool shapes can be satisfied. If the label 100 is made in roll form as in fig. 9, more labels 100 can be packaged than a sheet at one time, thereby saving labor costs. In addition, if the automatic labeling device is used when the label 100 is implanted on the tire, the automatic labeling device should all memorize the positions of the label 100, and the position of the winding drum is the same as the paper tube of the automatic labeling device, and the labels 100 repeatedly arranged at the same position are mounted at the same position of the tire by the automatic labeling device.
The foregoing description is only of the preferred embodiments of the invention, and all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (14)

1. Tire implantation formula hyperfrequency RFID tire label, its characterized in that: comprising:
an RFID chip; and
an antenna electrically connected to the RFID chip;
and the chip die package is arranged around the RFID chip and protects the RFID chip.
2. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: and a lead frame body is further arranged between the RFID chip and the antenna and electrically connected with the RFID chip and the antenna.
3. The tire-implantable ultrahigh frequency RFID tire tag of claim 2, wherein: a portion of the lead frame body protrudes outside the chip mold package, and when the antenna is combined with the chip mold package, the antenna may contact and be inserted into the lead frame body protruding outward.
4. A tire implantable ultrahigh frequency RFID tire tag according to claim 3, wherein: the antenna is a coil-type antenna, and the antenna is installed or locked and arranged on the peripheries of the two ends of the chip die package.
5. The tire-implantable ultrahigh frequency RFID tire tag of claim 4, wherein: the coil of the antenna has a wire diameter of 0.15-0.35 mm, an inner diameter of 0.6-1.0 mm, an outer diameter of 0.8-1.6 mm, a coil pitch of 0.6-1.0 mm, and the number of turns of the antenna on one side of 25-45 turns.
6. The tire-implantable ultrahigh frequency RFID tire tag of claim 4, wherein: and a part of the antenna is combined with the chip die package and is used for increasing the binding force with the chip die package and ensuring flexibility so as to improve the durability of the bending and stretching movement.
7. The tire-implantable ultrahigh frequency RFID tire tag of claim 4, wherein: the pitch of the coil of the antenna is matched with that of the corresponding tire, and the constituent materials of the tire are filled into the antenna, so that air inflow caused by the difference of physical properties of the tire in the vulcanization process is prevented.
8. The tire-implantable ultrahigh frequency RFID tire tag of claim 4, wherein: the end of the antenna is inserted into the interior of the chip die package and is in electrical contact with the leadframe body.
9. A tire implantable ultrahigh frequency RFID tire tag according to claim 3, wherein: the portion of the chip mold package bonded to the antenna is coated with conductive ink or gold plating, and the portion of the chip mold package bonded to the antenna is electrically connected to the lead frame body.
10. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: the antenna is made of steel or stainless steel.
11. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: the antenna is made of copper-tin-plated or copper-zinc-plated alloy and is implanted into the tire, and a coating process is not needed.
12. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: the tire tag is implanted into the inner sidewall of the inner liner of the tire by an automatic labeling device during the tire manufacturing process, and the center of the tire tag is disposed at a position 10 to 100mm from the bead.
13. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: the antenna is a rectangular coil antenna, and the rectangular short edge of the antenna is implanted in the same direction as the pressurization of the tire in the tire molding process, so as to facilitate the flowing of tire constituent substances into the antenna and maintain the flexibility of the antenna.
14. The tire-implantable ultrahigh frequency RFID tire tag of claim 1, wherein: the tyre tag is packaged by a reel spool or a tray.
CN202111247135.4A 2021-10-26 2021-10-26 Tire embedded ultrahigh frequency RFID tire tag Pending CN116151299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111247135.4A CN116151299A (en) 2021-10-26 2021-10-26 Tire embedded ultrahigh frequency RFID tire tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111247135.4A CN116151299A (en) 2021-10-26 2021-10-26 Tire embedded ultrahigh frequency RFID tire tag

Publications (1)

Publication Number Publication Date
CN116151299A true CN116151299A (en) 2023-05-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111247135.4A Pending CN116151299A (en) 2021-10-26 2021-10-26 Tire embedded ultrahigh frequency RFID tire tag

Country Status (1)

Country Link
CN (1) CN116151299A (en)

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