CN116140778A - Bonding welding method and judging method - Google Patents

Abstract

The invention discloses a bonding welding method and a judging method, wherein the bonding welding method comprises the following steps: s1, placing a substrate to be processed on a workbench, limiting the X direction and the Y direction of the substrate to be processed, and welding a first area, covered by a welding range of a bonding welding device, on the substrate to be processed through the bonding welding device; s2, rotating the substrate by 90 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed, and welding a second area; s3, rotating the substrate by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate to be processed, and welding a third area; and S4, rotating the substrate by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate to be processed, and welding the fourth area. The method ensures the accuracy of the welding position of the substrate, does not need the movement of a workbench, reduces the cost and avoids the defect of low precision caused by adopting the method of the movement of the tool table.

Description

Bonding welding method and judging method

Technical Field

The invention relates to a bonding welding method and a judging method.

Background

The wire bonding machine is a device for electrically welding pins of a semiconductor chip and pins of a substrate to bottom through metal wires, and the bonding mechanism of the wire bonding machine is used for welding the pins of the chips at different positions on the substrate through X, Y directional movement, because the X, Y directional movement range (namely the welding range) of the bonding mechanism is not too large to keep certain precision, when the size of the substrate is smaller than the movement range of the bonding mechanism, the pins of the chips at all positions on the substrate can be welded only through X, Y directional movement of the bonding mechanism; when the size of the area to be welded of the substrate is larger than the welding range of the bonding mechanism, only the substrate can be welded locally by the X, Y directional movement of the bonding mechanism. In order to solve the problem, in the prior art, a tooling table capable of moving in the X, Y direction is additionally arranged to bear the substrate, namely, after a part of the substrate is welded by the bonding mechanism, the tooling table bears the substrate to move under the driving of the driving mechanism, the substrate horizontally moves for a certain position and then stops, and then the substrate at the rest position is welded, however, due to high precision of bonding welding, the precision of the movement of the tooling table is difficult to ensure, so that errors are easy to occur in welding of pins, the welding effect is poor, the structure of the tooling table is more complex, and the cost is higher.

Disclosure of Invention

The invention aims to overcome the defects of high tooling table cost and poor welding precision in the prior art, and provides a bonding welding method.

The invention solves the technical problems by the following technical scheme: a bonding welding method of welding a substrate to be processed by a bonding welding apparatus having a table carrying the substrate to be processed, on which two limit mechanisms for positioning the substrate to be processed in X-direction and Y-direction are provided, comprising the steps of:

s1, placing a substrate to be processed on a workbench, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a first area, covered by a welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s2, rotating the substrate by 90 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a second area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s3, rotating the substrate by 90 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a third area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s4, rotating the substrate by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate to be processed through the two limiting mechanisms, and welding a fourth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment.

In the scheme, for the substrate to be processed, which has the size smaller than or equal to twice of the size of the welding range, after the first area covered by the welding range is welded by bonding welding equipment, the substrate is rotated by 90 degrees and then is mounted on the limiting mechanism, so that the X direction and the Y direction of the substrate are limited by the limiting mechanism, the bonding welding equipment can weld the remaining second area, the same steps are carried out twice again, the remaining third area and the fourth area can be welded, the first area, the second area, the third area and the fourth area can completely cover the whole substrate, and as the limiting mechanism is fixed on the workbench, the welding position of the substrate is always accurately limited relative to the welding range, the accuracy of the welding position of the substrate is ensured, the horizontal movement of the workbench is not required to be additionally arranged, the structure requirement on the workbench is low, the cost is reduced, the defect of low precision caused by adopting the method of the motion of the workbench in the prior art is avoided, and the welding effect on the substrate with the size larger than the welding range is improved.

Preferably, the two limiting mechanisms are respectively located on two adjacent side edges of the workbench.

In this scheme, this structure sets up, is convenient for install stop gear, and stop gear position is more reasonable moreover, does not occupy the space of workstation, and overall structure is compacter.

Preferably, the limiting mechanism is a limiting block.

In this scheme, the stopper is convenient to carry out spacingly to the base plate, and the operation of being convenient for improves welding efficiency.

Preferably, the limiting mechanism is detachable relative to the workbench.

In this scheme, this structure sets up, and limit structure is convenient for in time change when appearing damaging, guarantees limit structure's spacing effect.

The invention also discloses a judging method for judging whether the substrate to be processed is suitable for being welded by adopting the bonding welding method, and the judging method comprises the following steps:

s7, obtaining the X-direction and Y-direction dimensions of a substrate to be processed, and obtaining the X-direction and Y-direction dimensions of a welding range of bonding welding equipment;

s8, comparing the welding range of the substrate to be processed and the welding equipment, and judging that the substrate to be processed is suitable for being welded by adopting the bonding welding method if the X-direction size of the substrate to be processed is smaller than or equal to twice the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to twice the Y-direction range size of the welding range.

In the scheme, the judging method can rapidly and accurately judge whether the substrate is suitable for the welding method, the substrate suitable for the welding method can be screened out, the working efficiency is effectively improved, and welding failure caused by unsuitable size of the substrate is avoided.

The invention also discloses another bonding welding method, which is used for welding the substrate to be processed through bonding welding equipment, wherein the bonding welding equipment is provided with a workbench for bearing the substrate to be processed, two limiting mechanisms for positioning the substrate to be processed along the X direction and the Y direction are arranged on the workbench, and the bonding welding method comprises the following steps:

s5, placing the substrate to be processed on a workbench, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a fifth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s6, rotating the substrate by 180 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a sixth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment.

In the scheme, after the bonding welding equipment is used for welding the fifth area covered by the welding range, the substrate rotates 180 degrees, and the X direction and the Y direction of the substrate are limited by the limiting mechanism, the bonding welding equipment can be used for welding the sixth area, so that the fifth area and the sixth area can cover the whole substrate (namely, the substrate is only in the X direction or only in the Y direction and is larger than the welding range and is not larger than twice of the welding range), the welding method is simple, the requirement on a workbench is low, the cost is reduced, and the relative precision is high.

Preferably, the two limiting mechanisms are respectively located on two adjacent side edges of the workbench.

Preferably, the limiting mechanism is a limiting block.

Preferably, the limiting mechanism is detachable relative to the workbench.

The invention also discloses a judging method for judging whether the substrate to be processed is suitable for being welded by adopting the bonding welding method, and the judging method comprises the following steps:

s9, acquiring X-direction and Y-direction dimensions of a substrate to be processed, and acquiring the sizes of the X-direction and Y-direction dimensions of a welding range of bonding welding equipment;

s10, comparing the welding range of the substrate to be processed and the welding equipment, and judging that the substrate to be processed is suitable for welding by adopting the bonding welding method if the X-direction size of the substrate to be processed is smaller than or equal to twice the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to the Y-direction range size of the welding range or if the X-direction size of the substrate to be processed is smaller than or equal to the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to twice the Y-direction range size of the welding range.

In the scheme, the judging method can rapidly and accurately judge whether the substrate is suitable for the welding method, the substrate suitable for the welding method can be screened out, the working efficiency is effectively improved, and welding failure caused by unsuitable size of the substrate is avoided.

The invention has the positive progress effects that: after a first area covered by a welding range is welded through bonding welding equipment, the substrate rotates for a certain angle to weld other areas, so that the whole substrate is covered by the welding range, and the limit mechanism is always accurate and limited, so that the accuracy of the welding position of the substrate is ensured, a workbench is not required to move, the method has low structural requirements on a tooling table, the cost is reduced, the defect of low precision caused by adopting a tooling table moving method in the prior art is avoided, and the welding effect on a larger substrate is improved; the judging method can rapidly and accurately judge whether the substrate is suitable for the welding method, can screen the substrate suitable for the welding method, effectively improves the working efficiency, and avoids welding failure caused by unsuitable size of the substrate.

Drawings

Fig. 1 is a flowchart of a bonding method according to embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of a workbench according to embodiment 1 of the present invention.

Fig. 3 is a schematic structural diagram of a substrate in embodiment 1 of the present invention.

Fig. 4 is a schematic structural diagram of a first area of a substrate welded according to embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of a substrate after the first region soldering in embodiment 1 of the present invention.

Fig. 6 is a schematic structural diagram of the substrate of embodiment 1 of the present invention welded to the second area after rotation.

Fig. 7 is a schematic diagram of a structure of soldering a second region of a substrate according to embodiment 1 of the present invention.

Fig. 8 is a schematic structural diagram of a substrate after the second region soldering in embodiment 1 of the present invention.

Fig. 9 is a schematic structural diagram of the third area welding after the substrate of embodiment 1 of the present invention is rotated.

Fig. 10 is a schematic structural diagram of a third area of a substrate welded according to embodiment 1 of the present invention.

Fig. 11 is a schematic structural diagram of a substrate after third region soldering in embodiment 1 of the present invention.

Fig. 12 is a schematic structural diagram of the fourth area welding after the substrate of embodiment 1 of the present invention is rotated.

Fig. 13 is a schematic diagram of a structure of soldering a fourth region of a substrate according to embodiment 1 of the present invention.

Fig. 14 is a schematic structural diagram of a substrate after fourth region soldering in embodiment 1 of the present invention.

Fig. 15 is a flowchart of a bonding method according to embodiment 2 of the present invention.

Fig. 16 is a schematic view showing a structure of a fifth area of the substrate to be soldered according to embodiment 2 of the present invention.

Fig. 17 is a schematic diagram of a structure of soldering a fifth region of a substrate according to embodiment 2 of the present invention.

Fig. 18 is a schematic structural diagram of a fourth area-welded substrate according to embodiment 2 of the present invention.

Fig. 19 is a schematic view showing a structure of the substrate according to embodiment 2 of the present invention welded to the sixth area after rotation.

Fig. 20 is a schematic diagram of a structure of a sixth area of a substrate welded according to embodiment 2 of the present invention.

Fig. 21 is a schematic structural diagram of a substrate after sixth area soldering according to embodiment 2 of the present invention.

Fig. 22 is a flowchart of a judging method of embodiment 3 of the present invention.

Fig. 23 is a flowchart of a judgment method of embodiment 4 of the present invention.

Description of the reference numerals

Workbench 1

Limiting mechanism 11

Substrate 2

First region 21

Second region 22

Third region 23

Fourth region 24

Fifth region 25

Sixth region 26

Welding range 3

Detailed Description

The invention is further illustrated by means of the following examples, which are not intended to limit the scope of the invention.

Example 1

As shown in fig. 1 to 14, the present embodiment discloses a bonding method for bonding a substrate 2 to be processed by a bonding apparatus having a table 1 for carrying the substrate 2 to be processed, two spacing mechanisms 11 for positioning the substrate 2 to be processed in X-direction and Y-direction being provided on the table 1, the bonding method comprising the steps of:

s1, placing a substrate 2 to be processed on a workbench 1, limiting the X direction and the Y direction of the substrate 2 to be processed through two limiting mechanisms 11, and welding a first area 21, covered by a welding range 3 of a bonding welding device, on the substrate 2 to be processed through the bonding welding device;

s2, rotating the substrate 2 by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate 2 to be processed through two limiting mechanisms 11, and welding a second area 22, covered by a welding range 3 of the bonding welding equipment, on the substrate 2 to be processed through the bonding welding equipment;

s3, rotating the substrate 2 by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate 2 to be processed through two limiting mechanisms 11, and welding a third area 23, covered by a welding range 3 of the bonding welding equipment, on the substrate 2 to be processed through the bonding welding equipment;

and S4, rotating the substrate 2 by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate 2 to be processed through the two limiting mechanisms 11, and welding a fourth area 24, covered by a welding range 3 of the bonding welding equipment, on the substrate 2 to be processed through the bonding welding equipment.

Specifically, the first direction of the present embodiment is counterclockwise, however, in other alternative embodiments, the first direction may be clockwise. After the first area 21 covered by the welding range 3 is welded through the bonding welding equipment, the substrate 2 rotates 90 degrees, the X direction and the Y direction of the substrate 2 are limited by the limiting mechanism 11, the bonding welding equipment can weld the second area 22, and the third area 23 and the fourth area 24 can be welded through the same step, so that the whole substrate 2 can be completely covered by the first area 21, the second area 22, the third area 23 and the fourth area 24, and the limiting mechanism 11 always accurately limits, thereby ensuring the accuracy of the welding position of the substrate 2, and the movement of the workbench 1 is not needed.

Specifically, in the present embodiment, the welding range 3 is a rectangular area of 1*1, and the size of the substrate 2 is 1.8×1.8, however, in other alternative embodiments, the substrate 2 may be other sizes less than or equal to 2×2; in this embodiment, the size of the soldering range 3 and the substrate 2 are unit values, and do not represent specific dimensions.

As shown in fig. 2, the two limiting mechanisms 11 are respectively located on two adjacent side edges of the workbench 1, so that the limiting mechanisms 11 are convenient to install, the positions of the limiting mechanisms 11 are more reasonable, the space of the workbench 1 is not occupied, and the whole structure is more compact. Of course, in other alternative embodiments, the limiting mechanism 11 may be mounted in an intermediate position of the table 1.

Specifically, in the present embodiment, the stopper mechanism 11 is a stopper block. The limiting block is convenient to limit the substrate 2, is convenient to operate and improves welding efficiency. Of course, in other alternative embodiments, the limiting mechanism 11 may also be engaged with the limiting structure.

Specifically, in the present embodiment, the stopper mechanism 11 is detachable with respect to the table 1. The limit structure is convenient to replace in time when damaged, and the limit effect of the limit structure is guaranteed.

Example 2

The welding method of this embodiment is substantially the same as that of embodiment 1, and the differences will be described.

As shown in fig. 15 to 21, specifically, the size of the substrate 2 of the present embodiment is 1×1.8, and the bonding method includes the following steps:

s5, placing the substrate 2 to be processed on the workbench 1, limiting the X direction and the Y direction of the substrate 2 to be processed through the two limiting mechanisms 11, and welding a fifth area 25, covered by a welding range 3 of the bonding welding equipment, on the substrate 2 to be processed through the bonding welding equipment;

and S6, rotating the substrate 2 by 180 degrees along the first direction, limiting the X direction and the Y direction of the substrate 2 to be processed through the two limiting mechanisms 11, and welding a sixth area 26, covered by a welding range 3 of the bonding welding equipment, on the substrate 2 to be processed through the bonding welding equipment.

After the fifth area 25 covered by the welding range 3 is welded by the bonding welding device, the substrate 2 rotates 180 degrees, the X direction and the Y direction of the substrate 2 are limited by the limiting mechanism 11, the bonding welding device can weld the sixth area 26, and therefore the fifth area 25 and the sixth area 26 can cover the whole substrate 2.

Of course, in other alternative embodiments, the size of the substrate 2 may be 2 or less in one direction and 1 or less in the other direction.

Example 3

As shown in fig. 22, the present embodiment discloses a judging method for judging whether or not the substrate 2 to be processed is suitable for soldering by the bonding soldering method described in embodiment 1, the judging method comprising the steps of:

s7, obtaining the X-direction and Y-direction dimensions of the substrate 2 to be processed, and obtaining the X-direction and Y-direction dimensions of a welding range 3 of the bonding welding equipment;

s8, comparing the welding range 3 of the substrate 2 to be processed with that of the welding equipment, and judging that the substrate 2 to be processed is suitable for welding by adopting a bonding welding method if the X-direction size of the substrate 2 to be processed is smaller than or equal to twice the X-direction range size of the welding range 3 and the Y-direction size of the substrate 2 to be processed is smaller than or equal to twice the Y-direction range size of the welding range 3.

The judging method of the embodiment can rapidly and accurately judge whether the substrate 2 is suitable for the welding method of the invention, can screen the substrate 2 suitable for the welding method, effectively improves the working efficiency, and avoids welding failure caused by unsuitable size of the substrate 2.

Example 4

As shown in fig. 23, the present embodiment discloses a judging method for judging whether or not the substrate 2 to be processed is suitable for soldering by the bonding soldering method described in embodiment 2, the judging method comprising the steps of:

s9, acquiring the X-direction and Y-direction dimensions of the substrate 2 to be processed, and acquiring the X-direction and Y-direction dimensions of a welding range 3 of the bonding welding equipment;

s10, comparing the welding range 3 of the substrate 2 to be processed and the welding equipment, and judging that the substrate 2 to be processed is suitable for welding by adopting a bonding welding method if the X-direction size of the substrate 2 to be processed is smaller than or equal to twice the X-direction range size of the welding range and the Y-direction size of the substrate 2 to be processed is smaller than or equal to the Y-direction range size of the welding range or if the X-direction size of the substrate 2 to be processed is smaller than or equal to the X-direction range size of the welding range and the Y-direction size of the substrate 2 to be processed is smaller than or equal to twice the Y-direction range size of the welding range.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the invention, but such changes and modifications fall within the scope of the invention.

Claims (10)

1. A bonding welding method characterized in that a substrate to be processed is welded by a bonding welding apparatus having a table carrying the substrate to be processed, two limit mechanisms for positioning the substrate to be processed in X-direction and Y-direction being provided on the table, the bonding welding method comprising the steps of:

s1, placing a substrate to be processed on a workbench, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a first area, covered by a welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s2, rotating the substrate by 90 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a second area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s3, rotating the substrate by 90 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a third area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s4, rotating the substrate by 90 degrees along the first direction, limiting the X direction and the Y direction of the substrate to be processed through the two limiting mechanisms, and welding a fourth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment.

2. The bonding method according to claim 1, wherein the two limiting mechanisms are respectively located on two adjacent sides of the table.

3. The bonding method according to claim 1, wherein the stopper mechanism is a stopper block.

4. The bonding method according to claim 1, wherein the limiting mechanism is detachable with respect to the table.

5. A judging method for judging whether or not a substrate to be processed is suitable for being welded by the bonding welding method according to claim 1, the judging method comprising the steps of:

s7, obtaining the X-direction and Y-direction dimensions of a substrate to be processed, and obtaining the X-direction and Y-direction dimensions of a welding range of bonding welding equipment;

s8, comparing the welding range of the substrate to be processed and the welding equipment, and judging that the substrate to be processed is suitable for being welded by adopting the bonding welding method if the X-direction size of the substrate to be processed is smaller than or equal to twice the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to twice the Y-direction range size of the welding range.

6. A bonding welding method characterized in that a substrate to be processed is welded by a bonding welding apparatus having a table carrying the substrate to be processed, two limit mechanisms for positioning the substrate to be processed in X-direction and Y-direction being provided on the table, the bonding welding method comprising the steps of:

s5, placing the substrate to be processed on a workbench, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a fifth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment;

s6, rotating the substrate by 180 degrees along a first direction, limiting the X direction and the Y direction of the substrate to be processed through two limiting mechanisms, and welding a sixth area, covered by the welding range of the bonding welding equipment, on the substrate to be processed through the bonding welding equipment.

7. The bonding method according to claim 6, wherein the two limiting mechanisms are respectively located on two adjacent sides of the worktable.

8. The bonding method according to claim 6, wherein the limiting mechanism is a limiting block.

9. The bonding method according to claim 6, wherein the limiting mechanism is detachable with respect to the table.

10. A judging method for judging whether or not a substrate to be processed is suitable for being welded by the bonding welding method according to claim 6, the judging method comprising the steps of:

s9, acquiring X-direction and Y-direction dimensions of a substrate to be processed, and acquiring the sizes of the X-direction and Y-direction dimensions of a welding range of bonding welding equipment;

s10, comparing the welding range of the substrate to be processed and the welding equipment, and judging that the substrate to be processed is suitable for welding by adopting the bonding welding method if the X-direction size of the substrate to be processed is smaller than or equal to twice the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to the Y-direction range size of the welding range or if the X-direction size of the substrate to be processed is smaller than or equal to the X-direction range size of the welding range and the Y-direction size of the substrate to be processed is smaller than or equal to twice the Y-direction range size of the welding range.

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