CN116133228A - Circuit board and preparation method thereof - Google Patents

Circuit board and preparation method thereof Download PDF

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Publication number
CN116133228A
CN116133228A CN202111345174.8A CN202111345174A CN116133228A CN 116133228 A CN116133228 A CN 116133228A CN 202111345174 A CN202111345174 A CN 202111345174A CN 116133228 A CN116133228 A CN 116133228A
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CN
China
Prior art keywords
circuit board
printed circuit
hole
insulating structure
signal
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Pending
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CN202111345174.8A
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Chinese (zh)
Inventor
贺广祥
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Priority to CN202111345174.8A priority Critical patent/CN116133228A/en
Publication of CN116133228A publication Critical patent/CN116133228A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The embodiment of the application relates to a circuit board and a preparation method thereof. The method comprises the following steps: providing a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board; forming an insulating structure in the through hole, wherein the insulating structure is filled between a second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface; and forming a conductive structure on the side wall of the through hole between the first surface and the insulating structure. By filling the insulating structure in the through hole between the second surface of the printed circuit board, where the signal transmission layer is not arranged, and the signal wiring layer, the part (the length of the via stub) of the conductive structure exceeding the signal wiring layer is reduced, namely the length of a non-signal path in the through hole is reduced, the influence of the conductive structure on the non-signal path on the signal transmission quality is eliminated, and the signal transmission quality is improved.

Description

Circuit board and preparation method thereof
Technical Field
The embodiment of the application relates to the technical field of circuit board manufacturing, in particular to a circuit board and a preparation method thereof.
Background
With the development of semiconductor technology, a multilayer wiring board has been developed in order to mount complicated wiring on the same wiring board. The multi-layer circuit board comprises a plurality of dielectric layers and a plurality of conductive layers which are alternately stacked. In order to electrically connect at least two conductive layers, a through hole (through hole) is formed on the multi-layer circuit board, and then a conductive material (e.g., copper) is deposited in the through hole, so as to form a conductive via (conductive via) for electrically connecting at least two conductive layers. The conductive through hole is provided with a tail (stub) which is positioned below the at least two conductive layers, the tail is unfavorable for signal transmission, and the higher the signal transmission rate is, the larger the influence of the tail is.
Typical mode of eliminating or reducing the tail of the conductive through hole is to remove the tail of the conductive through hole without connection or transmission effect through back drilling technology or blind buried hole technology, but the back drilling technology is suitable for circuit boards with thicker plate thickness and larger through holes, the back drilling technology is not practical for high-density circuit boards, the cost of the blind drilling technology increases along with the increase of lamination times, the blind drilling technology is not practical for circuit boards with more layers, and along with the increase of signal transmission rate, under the conditions of more layers of circuit boards and smaller through hole diameters, how to eliminate or reduce the influence of the tail of the conductive through hole on signal quality becomes the problem to be solved urgently.
Disclosure of Invention
The embodiment of the application provides a circuit board and a preparation method thereof, which can optimize the length of the tail part of a conductive through hole, and achieve the purpose of eliminating or reducing the influence of the tail part of the conductive through hole on signal transmission quality.
A preparation method of a circuit board comprises the following steps:
providing a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board;
forming an insulating structure in the through hole, wherein the insulating structure is filled between a second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface;
and forming a conductive structure on the side wall of the through hole between the first surface and the insulating structure.
In one embodiment, the step of forming an insulating structure in the via includes:
providing a clamp, wherein the clamp is provided with a first panel and a second panel which are parallel to each other, and a window is formed in the second panel;
placing a printed circuit board between the first panel and the second panel, wherein the second panel is in contact with the second surface, and the window exposes the through hole;
and injecting an insulating material into the through hole through the window to form an insulating structure.
In one embodiment, the insulating material comprises an epoxy or an organic resin.
In one embodiment, a conductive structure is formed on a sidewall of the via between the first surface and the insulating structure using a electroless copper process and an electroplating process.
In one embodiment, the conductive structure extends along the sidewall to cover the third surface of the insulating structure.
In one embodiment, a fourth surface of the insulating structure is flush with the second surface, the fourth surface being disposed opposite the third surface.
In one embodiment, the first distance between the third surface and the second surface is less than or equal to the second distance between the signal trace layer and the second surface.
In one embodiment, the upper surface of the conductive structure is flush with the first surface.
In one embodiment, the aperture of the through hole is less than 0.3 millimeters.
A circuit board, comprising:
the printed circuit board is provided with a signal transmission layer on the first surface, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board;
the insulation structure is positioned in the through hole, is filled between the second surface of the printed circuit board and the signal wiring layer, and is arranged opposite to the first surface;
and the conductive structure is positioned on the side wall of the through hole between the first surface and the insulating structure.
In one embodiment, the material of the insulating structure comprises an epoxy or an organic resin.
In one embodiment, the conductive structure extends along the sidewall to cover the third surface of the insulating structure.
In one embodiment, a fourth surface of the insulating structure is flush with the second surface, the fourth surface being disposed opposite the third surface.
In one embodiment, the first distance between the third surface and the second surface is less than or equal to the second distance between the signal trace layer and the second surface.
In one embodiment, the upper surface of the conductive structure is flush with the first surface.
The preparation method of the circuit board comprises providing a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board; forming an insulating structure in the through hole, wherein the insulating structure is filled between a second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface; and forming a conductive structure on the side wall of the through hole between the first surface and the insulating structure. By filling the insulating structure in the through hole between the second surface of the printed circuit board, where the signal transmission layer is not arranged, and the signal wiring layer, the part (the length of the via stub) of the conductive structure exceeding the signal wiring layer is reduced, namely the length of a non-signal path in the through hole is reduced, the influence of the conductive structure on the non-signal path on the signal transmission quality is eliminated, and the signal transmission quality is improved.
The circuit board comprises a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board; the insulation structure is filled between the second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface; and the conductive structure is positioned on the side wall of the through hole between the first surface and the insulating structure. By filling the insulating structure in the through hole between the second surface of the printed circuit board, where the signal transmission layer is not arranged, and the signal wiring layer, the part (the length of the via stub) of the conductive structure exceeding the signal wiring layer is reduced, namely the length of a non-signal path in the through hole is reduced, the influence of the conductive structure on the non-signal path on the signal transmission quality is eliminated, and the signal transmission quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for a person having ordinary skill in the art.
FIG. 1 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment;
FIG. 2 is a schematic cross-sectional view of a printed circuit board according to an embodiment;
FIG. 3 is a schematic cross-sectional view of the printed circuit board after forming the insulating structure in an embodiment corresponding to FIG. 2;
FIG. 4 is a schematic cross-sectional view of the printed circuit board after forming the conductive structures in an embodiment corresponding to FIG. 3;
FIG. 5 is a flowchart of step S104 in an embodiment;
fig. 6 is a schematic cross-sectional view of a printed circuit board after injection of an insulating material in one embodiment.
Reference numerals illustrate:
102. a printed circuit board; 104. a signal transmission layer; 106. a signal wiring layer; 108. a through hole; 110. an insulating structure; 112. a conductive structure; 114. a clamp; 202. a first panel; 204. a second panel; 206. a window; 208. a first sealing device; 210. a second sealing device; 212. an insulating material; 214. and (5) pressurizing the machine.
Detailed Description
In order to facilitate an understanding of the embodiments of the present application, the embodiments of the present application will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. However, embodiments of the present application may be embodied in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the present application belong. The terminology used herein in the description of the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In the description of the embodiments of the present application, it should be understood that the terms "upper," "lower," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on the methods or positional relationships shown in the drawings, merely to facilitate describing the embodiments of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first surface may be referred to as a second surface, and similarly, a second surface may be referred to as a first surface, without departing from the scope of the present application. Both the first surface and the second surface are surfaces of the printed circuit board, but they are not the same surface of the printed circuit board.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise. In the description of the present application, the meaning of "several" means at least one, such as one, two, etc., unless explicitly defined otherwise.
Fig. 1 is a schematic flow chart of a method for manufacturing a circuit board in an embodiment, fig. 2 is a schematic cross-sectional view of a printed circuit board in an embodiment, and as shown in fig. 1 and fig. 2, a method for manufacturing a circuit board is provided in the embodiment, and the method includes:
s102, providing a printed circuit board with a signal transmission layer, a signal wiring layer and a through hole.
Specifically, a printed circuit board 102 is provided, a signal transmission layer 104 is provided on a first surface of the printed circuit board 102, a signal routing layer 106 is provided in the printed circuit board 102, a through hole 108 penetrating through the printed circuit board 102 is provided in the printed circuit board 102, wherein the signal transmission layer 104 refers to a signal transmission circuit located on the surface of the printed circuit board 102 and used for transmitting signals to each circuit provided in the printed circuit board 102, the signal routing layer 106 is a conductive layer used for transferring signals in the printed circuit board 102, it is understood that, in order to arrange more complex circuits in a narrow area, multiple conductive layers used for transferring signals can be provided in the printed circuit board 102, namely, multiple signal routing layers 106 are provided in the printed circuit board 102, and the signal transmission in the printed circuit board 102 is realized through the conductive structure between the adjacent signal routing layers 106 and the signal routing layer 106 or between the signal transmission layer 104 and the signal routing layer 106, and at this time, the signal routing layer 106 is located far from the signal routing layer 106 in the transferring process. The through holes 108 are formed on the surface of the printed circuit board 102 at positions where signal transmission between the adjacent signal wiring layers 106 and 106 or between the signal transmission layer 104 and the signal wiring layers 106 is required, and signal transmission between the signal wiring layers 106 and 106 or between the signal transmission layer 104 and the signal wiring layers 106 is realized by conductive structures formed on the sidewalls of the through holes 108 subsequently, the through holes 108 penetrate through the printed circuit board 102, and the number of through holes 108 formed on each printed circuit board 102 may be the same or different, and in specific applications, the positions and the number of the through holes 108 corresponding to the printed circuit board 102 are set according to actual needs. Illustratively, as shown in FIG. 2, two vias 108 are provided on the printed circuit board 102.
S104, forming an insulating structure in the through hole.
Fig. 3 is a schematic cross-sectional view of the printed circuit board after forming the insulating structure in an embodiment corresponding to fig. 2, as shown in fig. 3, specifically, an insulating structure 110 is formed in the through hole 108, where the insulating structure 110 is filled between the second surface of the printed circuit board 102 and the signal trace layer 106, and the second surface is disposed opposite to the first surface. It can be understood that, in order to enable smooth signal transmission between the signal transmission layer 104 and the signal trace layer 106, an end of the insulating structure 110 close to the first surface cannot be higher than the signal trace layer 106, i.e. the insulating structure 110 is located in the through hole 108 between the second surface of the printed circuit board 102 and the signal trace layer 106 far from the first surface when transmitting signals, and at the same time, the insulating structure 110 fills the through hole 108 between the second surface of the printed circuit board 102 and the signal trace layer 106 far from the first surface when transmitting signals. The height of the insulating structure 110 is related to the position of the signal trace layer 106 away from the first surface used in the signal transmission corresponding to the through hole 108, and the positions of the signal trace layers 106 involved in the signal transmission are different for different through holes 108, so that the heights of the corresponding insulating structures 110 are different (see fig. 3).
And S106, forming a conductive structure on the side wall of the through hole between the first surface and the insulating structure.
Fig. 4 is a schematic cross-sectional view of the printed circuit board after forming the conductive structure in an embodiment corresponding to fig. 3, as shown in fig. 4, specifically, a conductive structure 112 is formed on a sidewall of a through hole between a first surface of the printed circuit board 102 and the insulating structure 110 to electrically connect the signal transmission layer 104 located on the first surface and the signal trace layer 106 (actually used for signal transmission) located in the printed circuit board 102, wherein the conductive structure 112 located between the signal trace layer 106 and the insulating structure 110 belongs to the conductive structure 112 on a non-signal transmission path, which is called via stub (via stub), and affects the quality of a transmission signal.
The method for manufacturing the circuit board comprises providing a printed circuit board 102, wherein a signal transmission layer 104 is arranged on a first surface of the printed circuit board 102, a signal wiring layer 106 is arranged in the printed circuit board 102, and a through hole 108 penetrating through the printed circuit board 102 is arranged in the printed circuit board 102; forming an insulating structure 110 in the through hole 108, wherein the insulating structure 110 is filled between a second surface of the printed circuit board 102 and the signal trace layer 106, and the second surface is opposite to the first surface; a conductive structure 112 is formed on the sidewalls of the via 108 between the first surface and the insulating structure 110. By filling the insulating structure 110 in the via hole 108 between the second surface of the printed circuit board 102 where the signal transmission layer 106 is not disposed and the signal trace layer 106, the portion of the conductive structure 112 beyond the signal trace layer 106 (the length of the via stub) is reduced, i.e., the length of the non-signal path in the via hole 108 is reduced, the influence of the conductive structure 112 on the signal transmission quality on the non-signal path is eliminated, and the quality of signal transmission is improved.
In one embodiment, the material of the conductive structure 112 includes a metallic material, such as metallic copper, metallic aluminum, and the like.
In one embodiment, the conductive structure 112 is formed on the sidewall of the via 108 between the first surface and the insulating structure using a electroless copper process and an electroplating process.
Fig. 5 is a schematic flow chart of step S104 in an embodiment, as shown in fig. 5, in one embodiment, step S104 includes:
s202, providing a fixture with a first panel and a second panel.
FIG. 6 is a schematic cross-sectional view of a printed circuit board after injecting an insulating material, as shown in FIG. 6, a fixture 114 is provided, the fixture 114 has a first panel 202 and a second panel 204 parallel to each other, and a window 206 is formed in the second panel 204; it will be appreciated that the first panel 202 and the second panel 204 may be connected to each other or separated from each other without affecting the subsequent injection of the insulating material.
S204, placing the printed circuit board between the first panel and the second panel.
The printed circuit board 102 is placed between the first panel 202 and the second panel 204 with the second panel 204 in contact with the second surface, and the window 206 exposes the through hole 108. The first panel 202 is used for sealing the first surface, the second panel 204 is provided with a window 206 for sealing the rest of the second surface while preserving an injection window of insulating material. It can be understood that, when the number of through holes 108 formed on the printed circuit board 102 is greater than or equal to 2, and the positions of the signal trace layers 106 corresponding to the through holes and far from the first surface for transmitting signals are different, different jigs 114 are used to form the insulating structures 110 in the through holes 108, where the positions of the windows 206 formed on the second panel 204 of the jigs 114 correspond to the positions of the through holes on the printed circuit board 102.
In one embodiment, the fixture 114 further includes a first sealing device 208 and a second sealing device 210, wherein the first sealing device 208 is located between the first panel 202 and the first surface of the printed circuit board 102, the second sealing device 210 is located between the second panel 204 and the second surface of the printed circuit board 102, and a notch corresponding to the window 206 is formed in the second sealing device 210. The sealing effect between the first panel 202, the second panel 204 and the printed circuit board 102 can be improved while the second face is exposed to the through hole 108 by the first sealing means 208 and the second sealing means 210.
And S206, injecting an insulating material into the through hole through the window to form an insulating structure.
Specifically, insulating material 212 is injected into the corresponding via 108 through the window 206 to form the insulating structure 110. Illustratively, the insulation material 212 may be pushed into the via 108 by the pressing machine 214, and the injection depth of the insulation material 212 may be controlled by controlling the pushing depth of the pressing machine 214, so as to control the space between the insulation structure 110 and the signal trace layer 106, and avoid injecting the insulation material into the signal region (the region between the signal transmission layer 104 and the signal trace layer 106 in the via 108).
In one embodiment, the insulating material 212 comprises an epoxy or an organic resin, and in other embodiments, other suitable non-conductive materials may be selected.
In one embodiment, as shown in fig. 4, the conductive structure 112 extends along the sidewall to cover a third surface of the insulating structure 110, where the third surface refers to a surface of the insulating structure 110 adjacent to the first surface.
With continued reference to fig. 4, in one embodiment, a fourth surface of the insulating structure 110 is flush with the second surface, the fourth surface being disposed opposite the third surface.
With continued reference to fig. 4, in one embodiment, the first distance D1 between the third surface and the second surface is less than or equal to the second distance D2 between the signal trace layer 106 and the second surface. With this arrangement, the injection of insulating material into the signal region (the region between the signal transmission layer 104 and the signal trace layer 106 in the via hole 108) can be avoided. It will be appreciated that the smaller the difference Δd between the second distance D2 and the first distance D1, the shorter the via stub, and the higher the quality of the signal transmission. The difference Δd is affected by the injection accuracy of the insulating material 212, and the higher the injection accuracy, the smaller the difference Δd may be, in order to avoid injection of the insulating material 212 into the signal region, the difference Δd is not smaller than the injection accuracy of the insulating material 212.
In one embodiment, the aperture of the through-hole 108 is less than 0.3 millimeters.
As shown in fig. 4, in one embodiment, the upper surface of the conductive structure 112 is flush with the first surface.
As shown in fig. 4, the present application further provides a circuit board, including: a printed circuit board 102, an insulating structure 110, and a conductive structure 112. The first surface of the printed circuit board 102 is provided with a signal transmission layer 104, the printed circuit board 102 is provided with a signal wiring layer 106, and the printed circuit board 102 is provided with a through hole 108 penetrating through the printed circuit board 102. The insulating structure 110 is located in the through hole 108, and the insulating structure 110 is filled between the second surface of the printed circuit board 102 and the signal trace layer 106, where the second surface is disposed opposite to the first surface. Conductive structure 112 is located on the sidewall of via 108 between the first surface and insulating structure 110.
Specifically, the signal transmission layer 104 refers to a signal transmission circuit located on the surface of the printed circuit board 102 and used for transmitting signals to each circuit disposed in the printed circuit board 102, and the signal trace layer 106 is a conductive layer used for transferring signals in the printed circuit board 102, it is understood that, in order to arrange more complex circuits in a small area, multiple conductive layers used for transferring signals may be disposed in the printed circuit board 102, that is, multiple layers of signal trace layers 106 are disposed in the printed circuit board 102, and the signal transmission in the printed circuit board 102 is realized through a conductive structure between adjacent signal trace layers 106 and 106 or between the signal transmission layer 104 and the signal trace layer 106, where the signal trace layer 106 is located far from the signal trace layer 106 in the signal transferring process. The through holes 108 are formed on the surface of the printed circuit board 102 at positions where signal transmission between the adjacent signal wiring layers 106 and 106 or between the signal transmission layer 104 and the signal wiring layers 106 is required, and signal transmission between the signal wiring layers 106 and 106 or between the signal transmission layer 104 and the signal wiring layers 106 is realized by conductive structures formed on the sidewalls of the through holes 108 subsequently, the through holes 108 penetrate through the printed circuit board 102, and the number of through holes 108 formed on each printed circuit board 102 may be the same or different, and in specific applications, the positions and the number of the through holes 108 corresponding to the printed circuit board 102 are set according to actual needs. Illustratively, as shown in FIG. 2, two vias 108 are provided on the printed circuit board 102.
The insulating structure 110 is filled between the second surface of the printed circuit board 102 and the signal trace layer 106, and the second surface is disposed opposite to the first surface. It can be understood that, in order to enable smooth signal transmission between the signal transmission layer 104 and the signal trace layer 106, an end of the insulating structure 110 close to the first surface cannot be higher than the signal trace layer 106, i.e. the insulating structure 110 is located in the through hole 108 between the second surface of the printed circuit board 102 and the signal trace layer 106 far from the first surface when transmitting signals, and at the same time, the insulating structure 110 fills the through hole 108 between the second surface of the printed circuit board 102 and the signal trace layer 106 far from the first surface when transmitting signals. And, the height of the insulating structure 110 is related to the position of the signal trace layer 106 away from the first surface used in the signal transmission corresponding to the through hole 108, and the positions of the signal trace layers 106 involved in the signal transmission are different for different through holes 108, so that the heights of the corresponding insulating structures 110 are different (see fig. 3).
The conductive structure 112 is located on a sidewall of the through hole between the first surface of the printed circuit board 102 and the insulating structure 110 to electrically connect the signal transmission layer 104 located on the first surface and the signal trace layer 106 (actually used for signal transmission) located in the printed circuit board 102, wherein the conductive structure 112 located between the signal trace layer 106 and the insulating structure 110 belongs to the conductive structure 112 on the non-signal transmission path, which is called as "via stub" and affects the quality of the transmission signal.
The circuit board comprises a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board; the insulation structure is filled between the second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface; and the conductive structure is positioned on the side wall of the through hole between the first surface and the insulating structure. By filling the insulating structure in the through hole between the second surface of the printed circuit board, where the signal transmission layer is not arranged, and the signal wiring layer, the part (the length of the via stub) of the conductive structure exceeding the signal wiring layer is reduced, namely the length of a non-signal path in the through hole is reduced, the influence of the conductive structure on the non-signal path on the signal transmission quality is eliminated, and the signal transmission quality is improved.
In one embodiment, the material of the conductive structure 112 includes a metallic material, such as metallic copper, metallic aluminum, and the like.
In one embodiment, the material of the insulating structure 110 comprises an epoxy or an organic resin, and in other embodiments, other suitable non-conductive materials may be selected.
In one embodiment, the conductive structure 112 extends along the sidewall to cover a third surface of the insulating structure 110, where the third surface refers to a surface of the insulating structure 110 adjacent to the first surface.
In one embodiment, a fourth surface of the insulating structure 110 is flush with the second surface, the fourth surface being disposed opposite the third surface.
Referring to fig. 4, in one embodiment, a first distance D1 between the third surface and the second surface is smaller than or equal to a second distance D2 between the signal trace layer 106 and the second surface.
With this arrangement, the injection of insulating material into the signal region (the region between the signal transmission layer 104 and the signal trace layer 106 in the via hole 108) can be avoided. It will be appreciated that the smaller the difference Δd between the second distance D2 and the first distance D1, the shorter the via stub, and the higher the quality of the signal transmission. The difference Δd is affected by the injection accuracy of the insulating material 212, and the higher the injection accuracy, the smaller the difference Δd may be, in order to avoid injection of the insulating material 212 into the signal region, the difference Δd is not smaller than the injection accuracy of the insulating material 212.
In one embodiment, the aperture of the through-hole 108 is less than 0.3 millimeters.
In one embodiment, the upper surface of the conductive structure is flush with the first surface.
The application also provides an electronic device, which comprises the circuit board.
It should be understood that, although the steps in the flowcharts of fig. 1 and 5 are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in fig. 1, 5 may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed sequentially, but may be performed alternately or alternately with at least a portion of the other steps or sub-steps of other steps.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few implementations of the examples of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the embodiments of the present application, which are all within the scope of the embodiments of the present application. Accordingly, the protection scope of the embodiments of the present application shall be subject to the appended claims.

Claims (15)

1. The preparation method of the circuit board is characterized by comprising the following steps:
providing a printed circuit board, wherein a signal transmission layer is arranged on the first surface of the printed circuit board, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board;
forming an insulating structure in the through hole, wherein the insulating structure is filled between a second surface of the printed circuit board and the signal wiring layer, and the second surface is opposite to the first surface;
and forming a conductive structure on the side wall of the through hole between the first surface and the insulating structure.
2. The method of manufacturing according to claim 1, wherein the step of forming an insulating structure in the via hole comprises:
providing a clamp, wherein the clamp is provided with a first panel and a second panel which are parallel to each other, and a window is formed in the second panel;
placing the printed circuit board between the first panel and the second panel, the second panel being in contact with the second surface, the window exposing the through hole;
and injecting an insulating material into the through hole through the window to form the insulating structure.
3. The method of manufacturing according to claim 2, wherein the insulating material comprises an epoxy resin or an organic resin.
4. The method of claim 1, wherein electroless copper deposition and electroplating processes are used to form conductive structures on sidewalls of the via between the first surface and the insulating structure.
5. The method of manufacturing of claim 1, wherein the conductive structure extends along the sidewall to cover a third surface of the insulating structure.
6. The method of manufacturing according to claim 5, wherein a fourth surface of the insulating structure is flush with the second surface, the fourth surface being disposed opposite the third surface.
7. The method of claim 5, wherein a first distance between the third surface and the second surface is less than or equal to a second distance between the signal trace layer and the second surface.
8. The method of manufacturing of claim 1, wherein an upper surface of the conductive structure is flush with the first surface.
9. The method of claim 1, wherein the aperture of the through-hole is less than 0.3 mm.
10. A wiring board, comprising:
the printed circuit board is provided with a signal transmission layer on the first surface, a signal wiring layer is arranged in the printed circuit board, and a through hole penetrating through the printed circuit board is formed in the printed circuit board;
the insulation structure is positioned in the through hole, is filled between the second surface of the printed circuit board and the signal wiring layer, and is arranged opposite to the first surface;
and the conductive structure is positioned on the side wall of the through hole between the first surface and the insulating structure.
11. The circuit board of claim 10, wherein the material of the insulating structure comprises an epoxy or an organic resin.
12. The circuit board of claim 10, wherein the conductive structure extends along the sidewall to overlie the third surface of the insulating structure.
13. The circuit board of claim 12, wherein a fourth surface of the insulating structure is flush with the second surface, the fourth surface being disposed opposite the third surface.
14. The circuit board of claim 12, wherein a first distance between the third surface and the second surface is less than or equal to a second distance between the signal trace layer and the second surface.
15. The circuit board of claim 14, wherein an upper surface of the conductive structure is flush with the first surface.
CN202111345174.8A 2021-11-15 2021-11-15 Circuit board and preparation method thereof Pending CN116133228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111345174.8A CN116133228A (en) 2021-11-15 2021-11-15 Circuit board and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111345174.8A CN116133228A (en) 2021-11-15 2021-11-15 Circuit board and preparation method thereof

Publications (1)

Publication Number Publication Date
CN116133228A true CN116133228A (en) 2023-05-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111345174.8A Pending CN116133228A (en) 2021-11-15 2021-11-15 Circuit board and preparation method thereof

Country Status (1)

Country Link
CN (1) CN116133228A (en)

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