CN116120786B - Carbon-based water-based conductive ink for high-temperature-resistant PCB and preparation method thereof - Google Patents
Carbon-based water-based conductive ink for high-temperature-resistant PCB and preparation method thereof Download PDFInfo
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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Abstract
The invention discloses carbon-based water-based conductive ink for a high-temperature-resistant PCB and a preparation method thereof, and relates to the technical field of conductive ink for PCBs. The carbon-based water-based conductive ink for the high-temperature-resistant PCB comprises the following components in percentage by mass: 15-30% of water-based high-temperature-resistant resin, 3-8% of dispersing agent, 8-15% of solvent, 17-30% of carbon-based substance and the balance of water; the carbon-based material is a mixture of carbon black, graphite and carbon nanotubes. The carbon-based water-based conductive ink for the high-temperature-resistant PCB has excellent adhesive force after being subjected to high-temperature treatment, has good conductive performance, and also has the advantages of good printing adaptability, clear and continuous circuit, no bubbles and the like; and the carbon-based material content is large, the cost is low, the performance is stable, and the relations among good conductivity, high adhesive force, good printing adaptability, stable performance, low cost and good environmental protection of the conductive ink can be well considered.
Description
Technical Field
The invention relates to the technical field of conductive ink for a PCB (printed Circuit Board), in particular to carbon-based water-based conductive ink for a high-temperature-resistant PCB and a preparation method thereof.
Background
In the PCB industry, electronic paste used for printed circuits needs to have the performance characteristics of good conductivity, high adhesive force, good printing adaptability, stable performance and the like.
The metal-based electronic paste has the problems of high cost and high energy consumption because of good conductivity, high curing temperature and long curing time. The carbon-based electronic paste is widely used due to low cost and stable performance, but the electronic carbon paste used in the market at present is solvent type, has high VOC emission and poor environmental protection.
The development of aqueous electronic carbon paste is an effective way to solve the problem, and the PCB board inevitably undergoes welding operation in the manufacturing process, so that the aqueous electronic carbon paste has higher requirement on the adhesive force of the aqueous carbon paste at high temperature.
Therefore, it is necessary to study a carbon-based water-based conductive ink for a high-temperature-resistant PCB, which has the characteristics of low cost and stable performance, and can meet the requirement of adhesion of the PCB at high temperature.
Disclosure of Invention
The invention aims to overcome the technical defects, and solve the technical problems that the electronic paste used by the printed circuit in the prior art cannot be good in conductivity, high in adhesive force, good in printing adaptability, stable in performance and the relation between cost and environmental protection.
The invention provides a carbon-based water-based conductive ink for a high-temperature-resistant PCB, which uses carbon black, graphite and carbon nano tube compounded carbon-based substances as conductive fillers, and constructs a three-dimensional electron transmission channel in the preparation process of carbon paste, so that the conductivity of the ink is improved; and then adding water-based high-temperature resistant resin to coat the carbon material, wherein the resin can be uniformly dispersed on the surface of the carbon material, so that the ink has excellent adhesive force after high-temperature treatment, good conductivity, good printing adaptability, suitability for the field of PCB (printed Circuit Board) and the like, and the PCB has the advantages of clear and continuous circuit, no bubbles and the like. And the carbon-based material content is large, the cost is low, the performance is stable, and the relations among good conductivity, high adhesive force, good printing adaptability, stable performance, low cost and good environmental protection of the conductive ink can be well considered.
The invention also provides a preparation method of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, which has simple process and convenient operation and can be used for mass production.
Specifically, the invention discloses carbon-based water-based conductive ink for a high-temperature-resistant PCB, which comprises the following components in percentage by mass:
15-30% of water-based high-temperature resistant resin,
3-8% of dispersing agent,
8-15% of solvent,
17-30% of carbon material,
the balance of water;
the carbon-based material is a mixture of carbon black, graphite and carbon nanotubes.
Preferably, the aqueous high temperature resistant resin comprises the following components in percentage by mass:
20-30% of acrylic acid monomer,
8-12% of polyurethane monomer,
8-10% of auxiliary agent.
Preferably, the auxiliary agent comprises an emulsifier, a neutralizing agent.
Preferably, in the carbon-based material, carbon black accounts for 5-8% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, graphite accounts for 10-18% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, and carbon nanotubes account for 2-4% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Preferably, the solvent is a mixture of isohexide and isopropanol, and the mass ratio of the isohexide to the isopropanol is (1-3): 1.
preferably, the dispersant is one or more of BYK-aqueous wetting dispersant, disponer W-18 aqueous wetting agent, sago-9710 aqueous wetting dispersant.
Preferably, the anti-foaming agent is also included, and the anti-foaming agent accounts for 0.5-2% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Preferably, the defoamer is one or a mixture of a plurality of defomW-0506 aqueous defoamer, TEGO Foamex 805N aqueous defoamer and standard silicone fluorine defoamer SF-809B.
Preferably, the water is deionized water.
The preparation method of the carbon-based water-based conductive ink for the high-temperature-resistant PCB comprises the following steps of:
mixing a dispersing agent, a solvent, and/or a defoaming agent, and/or water, adding a carbon substance, and stirring uniformly to obtain carbon slurry;
mixing and stirring the carbon slurry and ball milling beads, and filtering to obtain primary carbon slurry;
grinding the primary carbon paste, adding water-based high-temperature-resistant resin into the ground primary carbon paste, and uniformly mixing to obtain the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the carbon-based water-based conductive ink for the high-temperature-resistant PCB, carbon black, graphite and carbon nano tube composite carbon-based substances are used as conductive fillers, a three-dimensional electron transmission channel is constructed in the preparation process of carbon paste, and the conductive performance of the ink is improved; and then adding water-based high-temperature resistant resin to coat the carbon material, wherein the resin can be uniformly dispersed on the surface of the carbon material, so that the ink has excellent adhesive force after high-temperature treatment, good conductivity, good printing adaptability, suitability for the field of PCB (printed Circuit Board) and the like, and the PCB has the advantages of clear and continuous circuit, no bubbles and the like. And by adding the specially prepared solvent, the dispersibility of the high-temperature-resistant resin in the system and the coating property of the high-temperature-resistant resin on the carbon material are improved, the surface tension of the ink can be adjusted, the wettability and the leveling property of the ink are improved, and the printing adaptability is improved.
(2) The carbon-based water-based conductive ink for the high-temperature-resistant PCB has the advantages of high carbon-based substance content, reduced VOC (volatile organic compound) emission of the ink on the basis of ensuring conductivity and adhesive force, simplified printing waste liquid recovery treatment process, economy, environment friendliness, low carbon and capability of well considering the relations of good conductivity, high adhesive force, good printing adaptability, stable performance, low cost and good environmental friendliness of the conductive ink.
(3) The preparation method of the carbon-based water-based conductive ink for the high-temperature-resistant PCB has the advantages of simple process and convenient operation, and can be used for mass production.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the carbon-based water-based conductive ink for a high temperature resistant PCB prepared in example 1 of the present invention after the adhesion test after the high temperature treatment at 250 ℃;
fig. 2 is a schematic diagram of the carbon-based water-based conductive ink for a high temperature resistant PCB prepared in example 3 according to the present invention after the adhesion test after the high temperature treatment at 250 ℃;
fig. 3 is a schematic diagram of the conductive ink prepared in comparative example 8 after the adhesion test by the high temperature treatment at 250 ℃.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It should be understood that the embodiments described are some, but not all, of the embodiments of the present invention and are intended to be illustrative of the present invention and not limiting of the scope of the present invention.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
A water-based high-temperature resistant resin,
the composition comprises the following components in percentage by mass:
20-30% of acrylic acid monomer,
8-12% of polyurethane monomer,
8-10% of auxiliary agent.
Also included is water, which may be used as a balance of additive ingredients, preferably deionized water.
The auxiliary agent comprises an emulsifying agent and a neutralizing agent, wherein the emulsifying agent can be a common commercial product, namely sodium lauryl sulfate, fatty alcohol polyoxyethylene ether, span-80 and the like; the neutralizing agent can be preferably a neutralizing agent commonly used for waterborne polyurethane, namely triethylamine, triethanolamine, N-methyldiethanolamine and the like.
The acrylic acid monomer and the polyurethane monomer can be commercial products.
In the case of test example 1,
a water-based high-temperature resistant resin,
the composition comprises the following components in percentage by mass:
20% of acrylic acid monomer,
8 percent of polyurethane monomer,
8 percent of auxiliary agent,
the balance of water.
Wherein the auxiliary agent comprises an emulsifying agent and a neutralizing agent, the emulsifying agent is fatty alcohol polyoxyethylene ether, and the content is 4%; the neutralizing agent is triethanolamine with the content of 4 percent.
The preparation process comprises the following steps:
adding an acrylic acid monomer, an emulsifying agent and water into a pre-stirring reaction kettle, and uniformly stirring for 30min to obtain a first emulsion without layering; adding the rest of water, an emulsifying agent and a polyurethane neutralizing agent into a reaction kettle, heating to 90 ℃, adding a first emulsion and an initiator, and reacting for 30min to obtain a second emulsion; slowly dripping polyurethane monomer into the second emulsion, wherein the whole process is controlled within 2 hours; and (3) after 2 hours of heat preservation, regulating the PH value to about 7.5, thus obtaining the water-based high temperature resistant resin sample 1.
In the case of test example 2,
a water-based high-temperature resistant resin,
the composition comprises the following components in percentage by mass:
30 percent of acrylic acid monomer,
12 percent of polyurethane monomer,
10 percent of auxiliary agent,
the balance of water.
Wherein, the auxiliary agent comprises an emulsifying agent and a neutralizing agent, the emulsifying agent is sodium lauryl sulfate, and the content is 6 percent; the neutralizing agent is N-methyldiethanolamine with the content of 4 percent.
The preparation process comprises the following steps:
adding an acrylic acid monomer, an emulsifying agent and water into a pre-stirring reaction kettle, and uniformly stirring for 30min to obtain a first emulsion without layering; adding the rest of water, an emulsifying agent and a polyurethane neutralizing agent into a reaction kettle, heating to 90 ℃, adding a first emulsion and an initiator, and reacting for 30min to obtain a second emulsion; slowly dripping polyurethane monomer into the second emulsion, wherein the whole process is controlled within 2 hours; and (3) after 2 hours of heat preservation, regulating the PH value to about 7.5, thus obtaining the water-based high temperature resistant resin sample 2.
In the case of test example 3,
a water-based high-temperature resistant resin,
the composition comprises the following components in percentage by mass:
25% of acrylic acid monomer,
10 percent of polyurethane monomer,
9% of auxiliary agent,
the balance of water.
Wherein, the auxiliary agent comprises an emulsifying agent and a neutralizing agent, the emulsifying agent is Span-80, and the content is 5%; the neutralizing agent is triethylamine, and the content is 4%.
The preparation process comprises the following steps:
adding an acrylic acid monomer, an emulsifying agent and water into a pre-stirring reaction kettle, and uniformly stirring for 30min to obtain a first emulsion without layering; adding the rest of water, an emulsifying agent and a polyurethane neutralizing agent into a reaction kettle, heating to 90 ℃, adding a first emulsion and an initiator, and reacting for 30min to obtain a second emulsion; slowly dripping polyurethane monomer into the second emulsion, wherein the whole process is controlled within 2 hours; and (3) after 2 hours of heat preservation, regulating the PH value to about 7.5, thus obtaining the water-based high temperature resistant resin sample 3.
Test comparative example 1,
the difference from test example 3 was only that the content of acrylic monomer was 40% by weight.
The same preparation method as in test example 3 was used to prepare a comparative sample 1 of the aqueous high temperature resistant resin.
Test comparative example 2,
the difference from test example 3 was only that the content of polyurethane monomer was 20% by weight.
The same preparation method as in test example 3 was used to prepare a comparative sample 2 of the aqueous high temperature resistant resin.
A carbon-based water-based conductive ink for a high-temperature-resistant PCB,
the composition comprises the following components in percentage by mass:
15-30% of water-based high-temperature resistant resin,
3-8% of dispersing agent,
8-15% of solvent,
17-30% of carbon material,
the balance of water;
the anti-foaming agent is 0.5-2% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Water may be used as the balance of the additive, preferably deionized water.
The carbon-based material is a mixture of carbon black, graphite and carbon nanotubes; in the carbon-based substance, carbon black accounts for 5-8% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, graphite accounts for 10-18% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, and carbon nano tubes account for 2-4% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
The solvent may be isohexanediol (MPD), isopropanol (IPA) and a mixture of isohexanediol (MPD) and Isopropanol (IPA), preferably a mixture of isohexanediol (MPD) and Isopropanol (IPA), wherein the mass ratio of isohexanediol (MPD) and Isopropanol (IPA) is (1-3): 1.
the dispersant is one or more of BYK-aqueous wetting dispersant, dispener W-18 aqueous wetting agent and Sago-9710 aqueous wetting dispersant. Specifically, the BYK-wetting dispersant can be selected from BYK-ET 3033 wetting dispersants.
The defoamer is one or more of defomW-0506 aqueous defoamer, TEGO Foamex 805N aqueous defoamer and standard and beauty silicone fluorine defoamer SF-809B.
The preparation method of the carbon-based water-based conductive ink for the high-temperature-resistant PCB comprises the following steps of:
mixing a dispersing agent, a solvent, and/or a defoaming agent, and/or water, adding a carbon substance, and stirring uniformly to obtain carbon slurry;
mixing and stirring the carbon slurry and ball milling beads, and filtering to obtain primary carbon slurry;
grinding the primary carbon paste, adding water-based high-temperature-resistant resin into the ground primary carbon paste, and uniformly mixing to obtain the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Wherein, the mass ratio of the carbon slurry to the ball-milling beads is preferably (2-5): 1. more preferably, the mass ratio of the carbon slurry to the ball-milling beads is 3:1.
in particular, the method comprises the steps of,
respectively weighing the components of the carbon-based water-based conductive ink for the high-temperature-resistant PCB according to the parts by weight;
placing a dispersing agent, and/or a defoaming agent, and/or deionized water, stirring the solvent in a stirring kettle for 30-60min, sequentially adding carbon black, graphite and carbon nano tubes after uniformly mixing, and stirring until uniform after fully wetting;
mixing the carbon slurry and ball-milling beads according to a mass ratio of 3:1, placing the mixture in an electric stirrer, stirring for 1-3 hours, taking out and filtering to form primary carbon slurry;
finally, the primary carbon slurry is placed in a sand mill to be ground until the grain diameter is below 5 mu m; and adding the water-based high-temperature-resistant resin into the ground primary carbon slurry, and stirring at a low speed until the mixture is uniform to obtain the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
The raw materials of examples 1 to 4 are shown in Table 1 below.
TABLE 1 raw materials Table (/ wt%) for examples 1-4
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Water-based high-resistance Warm resin | Sample 1;15 | Sample 3;25 | Sample 2;30 | Sample 3;15 |
| Dispersing agent | BYK-aqueous wetting dispersant; 5 | Dispenser W-18 aqueous A wetting agent; 8 | Sago-9710 aqueous wetting A dispersing agent; 3 | Dispenser W-18 aqueous conditioner A wetting agent; 5 |
| Solvent(s) | MPD：IPA=1：1；14 | MPD：IPA=3：1；8 | MPD：IPA=2：1；15 | MPD：IPA=2：1；15 |
| Defoaming agent | TEGO Foamex 805N aqueous A defoaming agent; 1.5 | DefomW-0506 water-based medicine A foaming agent; 2 | Talmethyl silicon fluoride defoamer SF- 809B；2 | TEGO Foamex 805N Water A sexual defoaming agent; 2 |
| Carbon black | 5 | 8 | 5 | 6 |
| Graphite | 18 | 15 | 10 | 12 |
| Carbon nanotubes | 2 | 3 | 4 | 3 |
| Water and its preparation method | Allowance of | Allowance of | Allowance of | Allowance of |
Examples 1-4 were all prepared as follows:
respectively weighing the components of the carbon-based water-based conductive ink for the high-temperature-resistant PCB according to the parts by weight;
placing a dispersing agent, a defoaming agent, deionized water and a solvent into a stirring kettle, stirring for 45min, sequentially adding carbon black, graphite and carbon nano tubes after uniformly mixing, and stirring until uniform after fully wetting;
mixing the carbon slurry and ball-milling beads according to a mass ratio of 3:1, placing the mixture in an electric mixer, stirring for 2 hours, taking out the mixture, and filtering the mixture to form primary carbon slurry;
grinding the primary carbon slurry in a sand mill until the particle size is below 5 mu m;
and adding resin into the ground primary carbon paste, and stirring at a low speed until the mixture is uniform to obtain the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
Meanwhile, the following comparative examples were set.
In comparative example 1,
the only difference from example 3 is that: the solvent is MPD.
Comparative example 2,
the only difference from example 3 is that: the solvent is MPD: ipa=0.4: 1.
comparative example 3,
the only difference from example 3 is that: the solvent is MPD: ipa=5: 1.
comparative example 4,
the only difference from example 2 is that: the carbon-based material was graphite alone, and the content of graphite was 26wt%.
Comparative example 5,
the difference from example 2 was only that the carbon-based material was a mixture of carbon black and graphite, in which the content of carbon black was 8wt% and the content of graphite was 18wt%.
Comparative example 6,
the difference from example 2 was only that the carbon black content was 15wt%, the graphite content was 8wt% and the carbon nanotube content was 3wt%.
Comparative example 7,
the difference from example 2 was only that the content of carbon black was 1wt%, the content of graphite was 22wt%, and the content of carbon nanotubes was 3wt%.
In comparative example 8,
the only difference from example 2 is that the aqueous high temperature resistant resin used was comparative sample 1.
Comparative example 9,
the only difference from example 2 is that the aqueous high temperature resistant resin used was comparative sample 2.
The above comparative examples 1 to 3 were prepared in the same manner as in example 3; comparative examples 4 to 9 were prepared in the same manner as in example 2.
Performance tests were conducted on the carbon-based aqueous conductive inks prepared in examples 1 to 4 and comparative examples 1 to 9; the test results obtained are shown in tables 2 to 4 below.
Specifically, the test procedure is as follows:
and (3) sheet resistance test: measuring the sheet resistance and the resistivity by adopting a four-probe sheet resistance tester and a universal meter;
surface tension test: a surface tension tester;
viscosity test: a rotational viscometer;
adhesion test: 3M tape tearing method test;
adhesion test after high temperature treatment at 250 ℃): after high temperature treatment, the test is carried out by adopting a tape tearing method.
Table 2 table of test results for examples 1-4
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Square resistance (omega/25 mu m) | 11.8 | 9.4 | 13.0 | 14.8 |
| Surface tension (mN/m) | 32.5 | 28.6 | 28.7 | 30.2 |
| Viscosity (mPa. S) | 4450 | 6050 | 4000 | 4100 |
| Adhesion force | >95% | >95% | >95% | >95% |
| Adhesion after high temperature treatment at 250 DEG C | >95% | >95% | >95% | >95% |
Table 3 comparative tables of test results for comparative examples 1-3 and example 3
Table 4 comparative tables of test results of comparative examples 4 to 9 and example 2
The schematic diagram of the carbon-based water-based conductive ink for the high-temperature-resistant PCB prepared in the embodiment 1 after the adhesion test is performed at the high temperature of 250 ℃ is shown in fig. 1; the schematic diagram of the carbon-based water-based conductive ink for the high-temperature-resistant PCB prepared in the embodiment 3 of the invention after the adhesion test of the carbon-based water-based conductive ink subjected to the high-temperature treatment at 250 ℃ is shown in fig. 2; the schematic diagram of the carbon-based aqueous conductive ink prepared in comparative example 8 after the adhesion test at the high temperature of 250 ℃ is shown in fig. 3.
In the carbon-based water-based conductive ink for the high-temperature-resistant PCB, the high-temperature-resistant refers to that the adhesive force after the high-temperature treatment at 250 ℃ is still more than 95%, namely the adhesive force after the high-temperature treatment at 250 ℃ is not greatly changed, and the adhesive force is stable.
The carbon-based water-based conductive ink has a sheet resistance of less than 15 omega/25 mu m, a viscosity of 4000-6000 mPa.s and a surface tension of less than 35 mN/m. As can be seen from tables 2-4, the proportion and type of solvent have a greater effect on the surface tension of the ink, and an increase or a lesser effect negatively affects the print adaptation and adhesion. In addition, the proportioning criticality of the carbon material also increases. On the other hand, the proportion of the acrylic acid monomer and the polyurethane monomer in the resin directly restricts the temperature resistance of the high-temperature-resistant resin, thereby affecting the high-temperature adhesive force of the ink.
The test result shows that the carbon-based water-based conductive ink for the high-temperature-resistant PCB has high carbon-based substance content, reduces the VOC emission of the ink on the basis of ensuring the conductivity and the adhesive force, simplifies the recycling treatment process of the printing waste liquid, is economical and environment-friendly, has low carbon, can well consider the relationship between good conductivity, high adhesive force, good printing adaptability, stable performance, low cost and good environment-friendliness of the conductive ink, and is suitable for the field of PCBs.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any other corresponding changes and modifications made in accordance with the technical idea of the present invention shall be included in the scope of the claims of the present invention.
Claims (6)
1. The carbon-based water-based conductive ink for the high-temperature-resistant PCB is characterized by comprising the following components in percentage by mass:
15-30% of water-based high-temperature resistant resin,
3-8% of dispersing agent,
8-15% of solvent,
17-30% of carbon material,
the balance of water;
the carbon-based substance is a mixture of carbon black, graphite and carbon nano tubes;
in the carbon-based substance, carbon black accounts for 5-8% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, graphite accounts for 10-18% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB, and carbon nano tubes account for 2-4% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB;
the solvent is a mixture of isohexide and isopropanol, and the mass ratio of the isohexide to the isopropanol is (1-3): 1, a step of;
the water-based high-temperature-resistant resin comprises the following components in percentage by mass:
20-30% of acrylic acid monomer,
8-12% of polyurethane monomer,
8-10% of auxiliary agent,
the balance of water;
the auxiliary agent comprises an emulsifying agent and a neutralizing agent.
2. The carbon-based aqueous conductive ink for high temperature resistant PCB boards of claim 1, wherein the dispersant is one or more of BYK-aqueous wetting dispersant, dispener W-18 aqueous wetting agent, sago-9710 aqueous wetting dispersant.
3. The carbon-based water-based conductive ink for the high-temperature-resistant PCB as claimed in claim 1, further comprising an antifoaming agent, wherein the antifoaming agent accounts for 0.5-2% of the total mass of the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
4. The carbon-based aqueous conductive ink for high temperature resistant PCB according to claim 3, wherein the defoamer is one or more of DefomW-0506 aqueous defoamer, TEGO foam 805N aqueous defoamer, and standard silicone fluoride defoamer SF-809B.
5. The carbon-based aqueous conductive ink for high temperature resistant PCB of claim 1 wherein the water is deionized water.
6. The method for preparing the carbon-based aqueous conductive ink for the high temperature resistant PCB according to any one of claims 4 to 5, comprising the steps of:
mixing a dispersing agent, a solvent, a defoaming agent and water, and then adding a carbon substance to stir uniformly to obtain carbon slurry;
mixing and stirring the carbon slurry and ball milling beads, and filtering to obtain primary carbon slurry;
grinding the primary carbon paste, adding water-based high-temperature-resistant resin into the ground primary carbon paste, and uniformly mixing to obtain the carbon-based water-based conductive ink for the high-temperature-resistant PCB.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310407344.3A CN116120786B (en) | 2023-04-17 | 2023-04-17 | Carbon-based water-based conductive ink for high-temperature-resistant PCB and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310407344.3A CN116120786B (en) | 2023-04-17 | 2023-04-17 | Carbon-based water-based conductive ink for high-temperature-resistant PCB and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116120786A CN116120786A (en) | 2023-05-16 |
| CN116120786B true CN116120786B (en) | 2023-07-14 |
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| US7560052B2 (en) * | 2007-03-30 | 2009-07-14 | Lexmark International, Inc. | Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing |
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