CN116120557A - MQ silicon resin without waste emission and preparation method thereof - Google Patents
MQ silicon resin without waste emission and preparation method thereof Download PDFInfo
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- CN116120557A CN116120557A CN202211701865.1A CN202211701865A CN116120557A CN 116120557 A CN116120557 A CN 116120557A CN 202211701865 A CN202211701865 A CN 202211701865A CN 116120557 A CN116120557 A CN 116120557A
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- 239000002699 waste material Substances 0.000 title claims abstract description 17
- 229920005989 resin Polymers 0.000 title claims abstract description 16
- 239000011347 resin Substances 0.000 title claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 12
- 239000010703 silicon Substances 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title abstract description 11
- IJOOHPMOJXWVHK-UHFFFAOYSA-N trimethylsilyl-trifluoromethansulfonate Natural products C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920002050 silicone resin Polymers 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000006184 cosolvent Substances 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 230000003472 neutralizing effect Effects 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000012044 organic layer Substances 0.000 claims description 5
- 239000005051 trimethylchlorosilane Substances 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-IGMARMGPSA-N silicon-28 atom Chemical group [28Si] XUIMIQQOPSSXEZ-IGMARMGPSA-N 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000047 product Substances 0.000 abstract description 3
- 239000006227 byproduct Substances 0.000 abstract description 2
- 239000008346 aqueous phase Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002920 hazardous waste Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- -1 polysiloxanes Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Silicon Compounds (AREA)
Abstract
An MQ silicon resin without waste emission and a preparation method thereof relate to the field of adhesives; the MQ silicone resin without waste emission comprises the following components in parts by weight: 15-20 parts of ethyl silicate, 8-15 parts of trimethyl monochlorosilane, 8-15 parts of deionized water, 20-30 parts of organic solvent, 1-5 parts of cosolvent and 0.1-3 parts of neutralizer. The invention also provides a preparation method of the MQ resin without waste discharge, and the preparation method of the organic silicon resin is simple in process, the byproduct acid water can be recycled, no discharge is generated, the yield of the MQ silicon resin can be improved, the product is clear, and the M/Q ratio and the structure are easy to control.
Description
Technical Field
The invention belongs to the technical field of silicon resin, and relates to MQ silicon resin without waste emission and a preparation method thereof.
Background
MQ silicone is an emerging resin-based product that has been widely used in the fields of defoamers, adhesives, electronic potting adhesives, and the like. The prior MQ silicone resin is formed by a monofunctional (M group) chain R 3 SiO 1/2 And tetrafunctional (Q-group) mer SiO 4/2 Is subjected to hydrolytic condensationThe resulting structurally specific polysiloxanes are generally produced using alcohols, water, and benzene as solvents and hydrochloric acid or sulfuric acid as liquid acid catalysts. Because the solution contains a large amount of inorganic salts, waste acid and organic matters, and the oil phase and the water phase are incompatible, a large amount of waste is generated in the separation process, and the main components of the waste are a mixture of an organic solvent and acidic water. The subsequent treatment of the waste can only be used as dangerous waste treatment, and the cost is high. Therefore, the cost of the hazardous waste generated in the preparation process of the MQ resin can be greatly reduced.
Disclosure of Invention
A first object of the present invention is to provide a component of MQ silicone resin free from waste discharge, which addresses the above-described problems of the prior art.
The aim of the invention can be achieved by the following technical scheme: the MQ silicone resin without waste emission is characterized by comprising the following components in parts by weight: 15 to 20 parts of ethyl silicate, 8 to 15 parts of trimethyl chlorosilane, 10 to 30 parts of deionized water, 1 to 5 parts of cosolvent, 20 to 30 parts of organic solvent and 0.1 to 3 parts of neutralizer.
Further, the ethyl silicate is silicon-28 or silicon-40.
Further, the cosolvent is one or a mixture of several of methanol, ethanol and isopropanol.
Further, the organic solvent is one or a mixture of toluene and xylene.
Further, the neutralizing agent is hexamethyldisilazane.
The second purpose of the invention is to provide a preparation process of the MQ silicon resin without waste discharge, so as to reduce the hazardous waste generated in the process of producing the MQ resin and reduce the production cost.
The preparation method of the MQ silicone resin without waste emission comprises the following steps:
s1: pouring deionized water with the formula amount into a three-neck flask with a stirrer, a thermometer and a constant pressure dropping funnel, starting stirring, and dropping trimethyl monochlorosilane at the temperature of 10-30 ℃ for 1-3 hours;
s2: adding the cosolvent into the three-neck flask, and then starting to dropwise add the formula amount of ethyl silicate for 2-4 hours;
s3: taking down the constant-pressure dropping funnel, erecting a spherical condensing tube, heating to reflux, and refluxing for 2-6 h;
s4: cooling to normal temperature after finishing, adding organic solvent with formula amount, stirring uniformly, pouring into a separating funnel, standing and layering for 0.5-2 hours, adding a neutralizing agent into the organic layer, and neutralizing to neutrality;
s5: heating and distilling the solvent, and distilling to above 100 ℃ to obtain the MQ silicon resin solution.
In the process, the acid aqueous phase contains water, acid and cosolvent, and the neutralizer hexamethyldisilazane can be used as the MQ silicon resin production raw material for replacing trimethyl monochlorosilane, so that the aqueous phase produced by the preparation process can be used as the raw material of the aqueous phase raw material in the next production.
Compared with the prior art, the preparation process is simplified, the byproduct acid water can be recycled, no emission is generated, the yield of the MQ silicon resin can be improved, the product is clear, and the M/Q ratio and the structure are easy to control.
Detailed Description
The following are specific examples of the present invention, and the technical solutions of the present invention are further described, but the present invention is not limited to these examples.
Example 1
(1) 30g of deionized water was poured into a three-necked flask equipped with a stirrer, a thermometer and a constant pressure dropping funnel, stirring was started, and then 60g of trimethylchlorosilane was added dropwise at 10℃over 2 hours.
(2) 13g of methanol was added to the three-necked flask, 150g of ethyl silicate was initially added dropwise using a constant pressure dropping funnel, and the addition was completed for 3 hours.
(3) And taking down the constant-pressure dropping funnel, setting up a spherical condensing tube, heating to reflux, and refluxing for 3 hours.
(4) Cooling to normal temperature after finishing, adding 200g of toluene, stirring uniformly, pouring into a separating funnel, standing and layering for 1 hour, taking an organic layer, adding hexamethyldisilazane, and neutralizing to be neutral.
(5) Heating up the distilled solvent, distilling to above 100 ℃, and taking away low-boiling-point substances to obtain the MQ silicone resin solution.
Example 2
(1) 15g of deionized water and 20 acid aqueous phase were poured into a three-necked flask equipped with a stirrer, a thermometer and a constant pressure dropping funnel, stirring was started, and then 50g of trimethylchlorosilane was added dropwise at 10℃for 1.5 hours.
(2) 20g of ethanol was added to the three-necked flask, 160g of ethyl silicate was initially added dropwise using a constant pressure dropping funnel, and the addition was completed for 3.5 hours.
(3) And taking down the constant-pressure dropping funnel, setting up a spherical condensing tube, heating to reflux, and refluxing for 3.5 hours.
(4) Cooling to normal temperature after finishing, adding 250g of toluene, stirring uniformly, pouring into a separating funnel, standing and layering for 1.5 hours, taking an organic layer, adding hexamethyldisilazane, and neutralizing to be neutral.
(5) Heating up the distilled solvent, distilling to above 100 ℃, and taking away low-boiling-point substances to obtain the MQ silicone resin solution.
Example 3
(1) 50g of deionized water was poured into a three-necked flask equipped with a stirrer, a thermometer and a constant pressure dropping funnel, stirring was turned on, and then 80g of trimethylchlorosilane was added dropwise at 10℃over 2.5 hours.
(2) 35g of isopropyl alcohol was added to the three-necked flask, and 130g of ethyl silicate was initially added dropwise using a constant pressure dropping funnel over 2.5 hours.
(3) And taking down the constant-pressure dropping funnel, setting up a spherical condensing tube, heating to reflux, and refluxing for 2.5 hours.
(4) Cooling to normal temperature after finishing, adding 200g of dimethylbenzene, stirring uniformly, pouring into a separating funnel, standing and layering for 1 hour, taking an organic layer, adding hexamethyldisilazane, and neutralizing to be neutral.
(5) Heating up the distilled solvent, distilling to above 110 ℃, and taking away low-boiling-point substances to obtain the MQ silicone resin solution.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The MQ silicone resin without waste emission is characterized by comprising the following components in parts by weight: 15 to 20 parts of ethyl silicate, 8 to 15 parts of trimethyl chlorosilane, 10 to 30 parts of deionized water, 1 to 5 parts of cosolvent, 20 to 30 parts of organic solvent and 0.1 to 3 parts of neutralizer.
2. The no-waste-drain MQ silicone resin of claim 1, wherein the ethyl silicate is silicon-28 or silicon-40.
3. The no-waste-emission MQ silicone resin of claim 1, wherein the co-solvent is one or a mixture of several of methanol, ethanol and isopropanol.
4. The no-waste-drain MQ silicone resin of claim 1, wherein the organic solvent is one or a mixture of toluene or xylene.
5. The no-waste-emissions MQ silicone resin of claim 1, wherein the neutralizing agent is hexamethyldisilazane.
6. A method of preparing the no waste vented MQ silicone resin of any of claims 1-5 comprising the steps of:
s1: pouring deionized water with the formula amount into a three-neck flask with a stirrer, a thermometer and a constant pressure dropping funnel, starting stirring, and dropping trimethyl monochlorosilane at the temperature of 10-30 ℃ for 1-3 hours;
s2: adding the cosolvent into the three-neck flask, and then starting to dropwise add the formula amount of ethyl silicate for 2-4 hours;
s3: taking down the constant-pressure dropping funnel, erecting a spherical condensing tube, heating to reflux, and refluxing for 2-6 h;
s4: cooling to normal temperature after finishing, adding organic solvent with formula amount, stirring uniformly, pouring into a separating funnel, standing and layering for 0.5-2 hours, adding a neutralizing agent into the organic layer, and neutralizing to neutrality;
s5: heating and distilling the solvent, and distilling to above 100 ℃ to obtain the MQ silicon resin solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211701865.1A CN116120557A (en) | 2022-12-29 | 2022-12-29 | MQ silicon resin without waste emission and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211701865.1A CN116120557A (en) | 2022-12-29 | 2022-12-29 | MQ silicon resin without waste emission and preparation method thereof |
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| CN116120557A true CN116120557A (en) | 2023-05-16 |
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| CN202211701865.1A Pending CN116120557A (en) | 2022-12-29 | 2022-12-29 | MQ silicon resin without waste emission and preparation method thereof |
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| RU2384591C1 (en) * | 2008-11-05 | 2010-03-20 | Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ГНЦ ФГУП ГНИИХТЭОС) | Method of producing organosilicon resins |
| CN102061142A (en) * | 2010-11-23 | 2011-05-18 | 吉林华丰有机硅有限公司 | Process for preparing organic silicon pressure-sensitive adhesive |
| CN103524741A (en) * | 2013-09-18 | 2014-01-22 | 烟台德邦先进硅材料有限公司 | Synthetic method of methyl vinyl MQ silicon resin |
| CN103804691A (en) * | 2012-11-05 | 2014-05-21 | 上海树脂厂有限公司 | Preparation method of toughened high temperature resistance silicone resin |
| CN108484914A (en) * | 2018-03-13 | 2018-09-04 | 苏州大学 | Fluorine silicon resin and preparation method thereof |
| CN109438709A (en) * | 2018-10-31 | 2019-03-08 | 莱芜市雅达电子材料有限公司 | A kind of methyl MQ process for preparing resins |
| CN109575290A (en) * | 2018-11-27 | 2019-04-05 | 湖北新四海化工股份有限公司 | The preparation method of MQ silicone resin is directly synthesized with organic silicon azeotrope |
| CN109608640A (en) * | 2018-12-27 | 2019-04-12 | 浙江新安化工集团股份有限公司 | A kind of high molecular weight MQ silicone resin and its synthetic method, application |
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| CN115353627A (en) * | 2022-08-31 | 2022-11-18 | 浙江新安化工集团股份有限公司 | Low-hydroxyl MQ resin and preparation method thereof |
-
2022
- 2022-12-29 CN CN202211701865.1A patent/CN116120557A/en active Pending
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