CN116107835A

CN116107835A - Thermal simulation model correction method, system, device, equipment and storage medium

Info

Publication number: CN116107835A
Application number: CN202211659465.9A
Authority: CN
Inventors: 陈彪; 陈才; 张坤; 叶琴; 毛长雨
Original assignee: Feiteng Technology Changsha Co ltd; Phytium Technology Co Ltd
Current assignee: Feiteng Technology Changsha Co ltd; Phytium Technology Co Ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-05-12

Abstract

The application provides a method, a system, a device, equipment and a storage medium for correcting a thermal simulation model, wherein the method comprises the following steps: in the working process of each hardware unit on a preset heat transfer path of a power consumption component on a test board card, acquiring a power consumption value of the power consumption component and a detection temperature of each hardware unit, calculating actual measurement heat resistance of each hardware unit according to the power consumption value of the power consumption component and the detection temperature of each hardware unit, respectively performing thermal simulation by adopting a thermal simulation model of each hardware unit to obtain simulation temperature of each hardware unit, calculating simulation heat resistance of each hardware unit according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit, and correcting heat conduction parameters of the thermal simulation model of each hardware unit according to the actual measurement heat resistance of each hardware unit and the simulation heat resistance of each hardware unit. The thermal simulation model of each hardware unit is accurately corrected through the actually measured thermal resistance and the simulated thermal resistance of each hardware unit on the heat transfer path, and the device is convenient to operate, simple in structure and high in accuracy.

Description

Thermal simulation model correction method, system, device, equipment and storage medium

Technical Field

The present invention relates to the field of computer technologies, and in particular, to a method, a system, an apparatus, a device, and a storage medium for correcting a thermal simulation model.

Background

The thermal simulation is an important means in the heat radiation design process of the electronic product, and the feasibility of the heat radiation scheme is verified in advance through the thermal simulation before the product is sampled, or the heat radiation scheme is optimally designed, so that the design time and the design cost can be effectively saved.

At present, the precision correction of the thermal simulation model of a central processing unit (central processing unit, CPU) and a CPU radiator is mainly carried out by methods of adjusting the size parameters of the model, the thermal conductivity coefficients of materials and the like, and the adjusting method is divided into manual adjustment and automatic software adjustment for the precision correction of the thermal simulation model, mainly adjusting the size parameters of the model, the thermal conductivity coefficients of the materials and the like, wherein the adjusting method is divided into manual adjustment and automatic software adjustment.

However, manual adjustment has poor controllability, automatic fitting of a thermal resistance curve is needed by utilizing thermal simulation software to match with special test equipment during automatic adjustment, the use process is complex, and the test equipment is high in price.

Disclosure of Invention

In view of this, the embodiments of the present application provide a method, a system, an apparatus, a device, and a storage medium for correcting a thermal simulation model, so as to accurately correct the thermal simulation model of each hardware unit through actually measured thermal resistance and simulated thermal resistance of each hardware unit on a heat transfer path.

In a first aspect, an embodiment of the present application provides a method for correcting a thermal simulation model, including:

acquiring a power consumption value of a power consumption component and a detection temperature of each hardware unit in the working process of each hardware unit on a preset heat transfer path of the power consumption component on a test board;

according to the power consumption value of the power consumption component and the detection temperature of each hardware unit, calculating the actual measurement thermal resistance of each hardware unit;

respectively performing thermal simulation by adopting the thermal simulation models of the hardware units to obtain simulation temperatures of the hardware units;

according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit, calculating the simulation thermal resistance of each hardware unit;

and correcting the heat conduction parameters of the thermal simulation model of each hardware unit according to the actually measured heat resistance of each hardware unit and the simulated heat resistance of each hardware unit.

In an alternative embodiment, each of the hardware units includes: the power consumption component;

the correcting the heat conduction parameter of the thermal simulation model of each hardware unit according to the actually measured heat resistance of each hardware unit and the simulated heat resistance of each hardware unit comprises the following steps:

And correcting the heat conduction parameters of the thermal simulation model of the power consumption component according to the actual measured heat resistance of the power consumption component and the simulated heat resistance of the power consumption component.

In an alternative embodiment, each of the hardware units further includes: a heat sink assembly disposed for the power consuming assembly;

and correcting the heat conduction parameters of the thermal simulation model of the radiator assembly according to the actually measured heat resistance of the radiator assembly and the simulated heat resistance of the radiator assembly.

In an alternative embodiment, each of the hardware units further includes: a thermally conductive interface material disposed for the power consuming component;

and correcting the heat conduction parameters of the thermal simulation model of the heat conduction interface material according to the actual measured heat resistance of the heat conduction interface material and the simulated heat resistance of the heat conduction interface material.

In an optional implementation manner, the correcting the heat conduction parameter of the thermal simulation model of each hardware unit according to the actually measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit includes:

calculating the actual thermal resistance of each hardware unit and the thermal resistance error of the simulated thermal resistance of each hardware unit;

if the thermal resistance error does not meet the preset condition, correcting the heat conduction parameters of the thermal simulation model of each hardware unit according to the thermal resistance error;

carrying out thermal simulation again by adopting the corrected thermal simulation model of each hardware unit to obtain a new simulation temperature of each hardware unit;

and recalculating the new simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the new simulated temperature of each hardware unit until the actual measured thermal resistance of each hardware unit and the thermal resistance error of the new simulated thermal resistance of each hardware unit meet the preset condition.

In an optional implementation manner, in the working process of each hardware unit on the preset heat transfer path of the power consumption component on the test board, obtaining the power consumption value of the power consumption component and the detection temperature of each hardware unit includes:

Acquiring detection temperatures of at least two temperature detection points corresponding to each hardware unit and a power consumption value of the power consumption component in the working process of each hardware unit on a preset heat transfer path of the power consumption component;

the calculating the actual measurement thermal resistance of each hardware unit according to the power consumption value and the detection temperature of each hardware unit comprises the following steps:

calculating the actual measurement thermal resistance of each hardware unit according to the detected temperature values of the at least two temperature detection points and the power consumption value of the power consumption component;

the thermal simulation is performed by adopting the thermal simulation model of each hardware unit to obtain the simulation temperature of each hardware unit, including:

respectively performing thermal simulation by adopting the thermal simulation models of the hardware units to obtain simulation temperatures of at least two temperature monitoring points, which are arranged on the thermal simulation models of the hardware units and correspond to the at least two temperature detection points;

the calculating the simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulated temperature of each hardware unit comprises the following steps:

and calculating the simulated thermal resistance of each hardware unit according to the simulated temperature of the at least two temperature monitoring points and the power consumption value of the power consumption component.

In a second aspect, an embodiment of the present application further provides a system for modifying a thermal simulation model, including: test board and correction equipment;

the test board card is provided with: each hardware unit, a temperature detection component arranged for each hardware unit, a power consumption component and a power consumption detection component corresponding to the power consumption component;

the temperature detection component is used for collecting the detection temperature of each hardware unit, and the power consumption detection component is used for collecting the power consumption value of the power consumption component;

the correction device is provided with: the correction device is configured to execute any one of the methods according to the first aspect according to the detected temperature and the power consumption value, so as to correct the thermal simulation model of each hardware unit.

In a third aspect, an embodiment of the present application further provides a device for correcting a thermal simulation model, including:

the acquisition module is used for acquiring the power consumption value of the power consumption component and the detection temperature of each hardware unit in the working process of each hardware unit on the preset heat transfer path of the power consumption component on the test board;

the calculation module is used for calculating the actual measurement thermal resistance of each hardware unit according to the power consumption value and the detection temperature of each hardware unit;

The simulation module is used for respectively performing thermal simulation by adopting the thermal simulation models of the hardware units to obtain simulation temperatures of the hardware units;

the calculation module is further used for calculating the simulation thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit;

and the correction module is used for correcting the heat conduction parameters of the thermal simulation model of each hardware unit according to the actually measured heat resistance of each hardware unit and the simulated heat resistance of each hardware unit.

the correction module is specifically configured to:

In an alternative embodiment, the correction module is specifically configured to:

In an alternative embodiment, the acquiring module is specifically configured to:

the computing module is specifically configured to:

the simulation module is specifically configured to:

the computing module is specifically configured to:

In a third aspect, an embodiment of the present application further provides a correction apparatus, including: the system comprises a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the correction device is running, the processor communicates with the memory through the bus, and the processor executes the machine-readable instructions to execute the correction method of the thermal simulation model in any aspect.

In a fourth aspect, embodiments of the present application further provide a computer readable storage medium, where a computer program is stored, where the computer program is executed by a processor to perform a method for correcting a thermal simulation model according to any one of the first aspects.

The application provides a method, a system, a device, equipment and a storage medium for correcting a thermal simulation model, wherein the method comprises the following steps: in the working process of each hardware unit on a preset heat transfer path of a power consumption component on a test board card, acquiring a power consumption value of the power consumption component and a detection temperature of each hardware unit, calculating actual measurement heat resistance of each hardware unit according to the power consumption value of the power consumption component and the detection temperature of each hardware unit, respectively performing thermal simulation by adopting a thermal simulation model of each hardware unit to obtain simulation temperature of each hardware unit, calculating simulation heat resistance of each hardware unit according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit, and correcting heat conduction parameters of the thermal simulation model of each hardware unit according to the actual measurement heat resistance of each hardware unit and the simulation heat resistance of each hardware unit. The thermal simulation model of each hardware unit is accurately corrected through the actually measured thermal resistance and the simulated thermal resistance of each hardware unit on the heat transfer path, and the device is convenient to operate, simple in structure, high in accuracy and low in cost.

In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flowchart illustrating a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

FIG. 2 is a second flow chart of a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

FIG. 3 is a flowchart illustrating a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

FIG. 4 is a flowchart illustrating a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

FIG. 5 is a flowchart of a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

FIG. 6 is a flowchart illustrating a method for correcting a thermal simulation model according to an embodiment of the present disclosure;

Fig. 7 is a schematic exploded view of a test board according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a CPU thermal resistance link provided in an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of a thermal simulation model correction system according to an embodiment of the present application;

FIG. 10 is a schematic structural diagram of a thermal simulation model correction device according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a correction apparatus according to an embodiment of the present application.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.

With the wider and wider application of thermal simulation in the design process of electronic products and the higher and higher importance degree, some problems of thermal simulation are also increasingly highlighted, wherein the most important problem is the simulation precision problem, how to improve the thermal simulation precision is a great difficulty faced by the current thermal simulation technology, and for the precision correction of a thermal simulation model of a central processing unit (central processing unit, CPU) and a CPU radiator, the adjustment method is mainly carried out by methods of adjusting model size parameters, material heat conductivity coefficients and the like, and is divided into manual adjustment and automatic software adjustment, wherein the manual adjustment controllability is poor, and it is difficult to ensure that the CPU, interface materials and the radiator simulation model simultaneously meet the precision requirement, and the whole body is pulled to be moved; the method has the advantages that the method is high in accuracy, but the use process is complex and the testing equipment is high in price.

Based on the above, the correction method is convenient to operate, simple in structure, high in precision, low in cost and applicable to all types of thermal simulation software, and can be used for simultaneously correcting the precision of the thermal simulation model of each hardware unit on the heat transfer path.

It should be noted that, in a conventional thermal simulation model, the accuracy of the thermal simulation model is generally measured by the structural size and the accuracy of material parameters of the model, but in practice, the structural size, the material parameters and the contact thermal resistance of each hardware unit on the heat transfer path are generally difficult to accurately quantify, and many uncertainty factors exist.

The method of modifying the thermal simulation model provided herein is described below in connection with several specific embodiments.

Fig. 1 is a schematic flow chart of a method for correcting a thermal simulation model according to an embodiment of the present application, where an execution body of the embodiment may be a correction device, such as a computer device or a terminal device.

As shown in fig. 1, the method may include:

s101, acquiring a power consumption value of a power consumption component and detection temperature of each hardware unit in the working process of each hardware unit on a preset heat transfer path of the power consumption component on the test board.

The power consumption component is a component for generating heat and is arranged on the test board, for example, the CPU component, the test board can comprise a CPU main board, a preset heat transfer path of the power consumption component can be a path for conducting heat and radiating heat generated by the power consumption component, and the preset heat transfer path of the power consumption component comprises at least one hardware unit, namely, the heat generated by the power consumption component is conducted and radiated through the at least one hardware unit.

The test board card can be provided with a power consumption monitoring module for acquiring a power consumption value of the power consumption component.

In the working process of each hardware unit on a preset heat transfer path of a power consumption component on a test board card, acquiring a power consumption value of the power consumption component through a power consumption monitoring module, and acquiring a detection temperature of each hardware unit through a temperature sensor, wherein the detection temperature is the temperature of each hardware unit in the working process of the actual test.

S102, calculating actual measurement thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the detection temperature of each hardware unit.

The actual thermal resistance of each hardware unit is the thermal resistance of each hardware unit in the actual test process, and the thermal resistance can be understood as the ratio between the temperature difference at two ends of the hardware unit and the power of the heat source when heat is transmitted on the hardware unit, that is, in the actual test process, each hardware unit collects the detected temperatures at two ends of each hardware unit on the heat transmission path through the temperature sensor, calculates the temperature difference of the detected temperatures at two ends, and determines the ratio of the temperature difference of each hardware unit and the power consumption value of the power consumption component as the actual thermal resistance of each hardware unit.

It can be understood that the test board is powered on, a power consumption load pulling program corresponding to the power consumption component is operated, in the working process of the power consumption component, the fluctuation condition of the power consumption value of the power consumption component can be observed, the detection temperature of each hardware unit is continuously monitored until the power consumption value of the power consumption component converges and stabilizes, after the temperature reaches the heat balance, namely, the detection temperature of each hardware unit converges and stabilizes, the detection temperature of each hardware unit is recorded, and then the actual measurement thermal resistance of each hardware unit is calculated according to the power consumption value of the power consumption component after the stabilization and the detection temperature of each hardware unit after the stabilization.

S103, adopting thermal simulation models of the hardware units to respectively perform thermal simulation to obtain simulation temperatures of the hardware units.

In thermal simulation software, modeling is carried out on a thermal simulation model of a power consumption component and each hardware unit, the structural size and the material parameter of the thermal simulation model of the power consumption component and the thermal simulation model of each hardware unit are respectively set according to the actual structural size and the material parameter (including the heat conduction parameter) of the power consumption component and each hardware unit, the structural size and the material parameter of the thermal simulation model of the power consumption component are respectively identical to the physical object of the power consumption component, the structural size and the material parameter of the thermal simulation model of each hardware unit are respectively identical to the physical object of each hardware unit, wherein the preset heat transfer path of the thermal simulation model of the power consumption component comprises at least one thermal simulation model of the hardware unit, the relative positions of the thermal simulation model of the power consumption component and the thermal simulation model of each hardware unit are identical to the relative positions of the power consumption component and each hardware unit in the actual test process, and the power consumption value of the thermal simulation model of the power consumption component is set to the power consumption value of the power consumption component.

The thermal simulation model of each hardware unit can be provided with a temperature monitoring point corresponding to a temperature sensor on each hardware unit and used for monitoring the simulation temperature of each hardware unit, the position of the temperature monitoring point on the thermal simulation model is the same as the position of the temperature sensor on the hardware unit, the thermal simulation model of each hardware unit is adopted to respectively perform thermal simulation, and the simulation temperature of each hardware unit is obtained through the temperature monitoring point and is the temperature of each hardware unit when the thermal simulation model of each hardware unit works in the simulation process.

It should be noted that the thermal simulation software may be various types of thermal simulation software, for example Flotherm, icepak, 6Sigma, and FloEFD, and in the process of modeling the thermal simulation model of each hardware unit by adopting the thermal simulation software, model boundary conditions, ambient temperature, and partition model grids may also be set, where the model boundary conditions may be understood that a calculation domain exists in the thermal simulation model, a model to be calculated is calculated and surrounded, and boundaries of the calculation domain need to set boundary conditions including, but not limited to, temperature, pressure, and convective heat transfer parameters; the model grid can be understood as that the entity model is subjected to gridding treatment, and after the model is divided into grids, simulation software calculates data such as temperature and the like in each grid; the ambient temperature may be understood as the temperature of the environment where the thermal simulation model of each hardware unit is located, where the ambient temperature of the thermal simulation model of each hardware unit is the same as the temperature of the environment where each hardware unit is actually located.

S104, calculating the simulation thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit.

The simulated thermal resistance of each hardware unit is the thermal resistance of the thermal simulation model of each hardware unit in the simulation process, the temperature monitoring points on the thermal simulation model monitor the temperatures at the two ends of the thermal simulation model when the thermal simulation model of each hardware unit works in the simulation process, the temperature difference between the temperatures at the two ends of the thermal simulation model is calculated, and the ratio of the temperature difference of the thermal simulation model to the power consumption component is determined as the simulated thermal resistance of each hardware unit.

It can be understood that when the simulated thermal resistance of each hardware unit is calculated, setting the power consumption value of the power consumption component as the power consumption value of the power consumption component in the actual test process, continuing the simulated temperature of each hardware unit, after the temperature reaches the thermal balance, i.e. convergence is stable, recording the simulated temperature of each hardware unit, and then calculating the actual measured thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulated temperature of each hardware unit.

S105, correcting the heat conduction parameters of the thermal simulation model of each hardware unit according to the actual measured heat resistance of each hardware unit and the simulated heat resistance of each hardware unit.

According to the actual measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit, the simulated thermal resistance of each hardware unit and the thermal resistance error of the actual measured thermal resistance can be determined, and if the thermal resistance error exceeds a preset threshold, the heat conduction parameters of the thermal simulation model of each hardware unit can be corrected so as to realize the precision correction of the thermal simulation model of each hardware unit.

In the correction method of the thermal simulation model of the embodiment, in the working process of each hardware unit on the preset heat transfer path of the power consumption component on the test board card, the power consumption value of the power consumption component and the detection temperature of each hardware unit are obtained, the actual measurement heat resistance of each hardware unit is calculated according to the power consumption value of the power consumption component and the detection temperature of each hardware unit, the thermal simulation model of each hardware unit is adopted to respectively perform thermal simulation to obtain the simulation temperature of each hardware unit, the simulation heat resistance of each hardware unit is calculated according to the power consumption value of the power consumption component and the simulation temperature of each hardware unit, and the heat conduction parameters of the thermal simulation model of each hardware unit are corrected according to the actual measurement heat resistance of each hardware unit and the simulation heat resistance of each hardware unit. The thermal simulation model of each hardware unit is accurately corrected through the actual measurement thermal resistance and the simulation thermal resistance of each hardware unit on the heat transfer path, and the method is convenient to operate, simple in structure, high in accuracy and low in cost.

In an alternative embodiment, each hardware unit includes: the power consuming components are described below in connection with fig. 2.

Fig. 2 is a second flow chart of a method for correcting a thermal simulation model according to an embodiment of the present application, as shown in fig. 2, the method may include:

s201, acquiring a power consumption value of the power consumption component and a detection temperature of the power consumption component in a working process of the power consumption component on a preset heat transfer path of the power consumption component on the test board.

S202, calculating actual measurement thermal resistance of the power consumption component according to the power consumption value of the power consumption component and the detection temperature of the power consumption component.

The preset heat transfer path of the power consumption component comprises at least one hardware unit, and the at least one hardware unit comprises: the power consumption component, namely the power consumption component is included in a preset heat transfer path of the power consumption component, in the working process of testing the power consumption component on the board card, the power consumption value of the power consumption component and the detection temperature of the power consumption component are obtained, and the actual measurement thermal resistance of the power consumption component is calculated according to the power consumption value of the power consumption component and the detection temperature of the power consumption component.

S203, performing thermal simulation by adopting a thermal simulation model of the power consumption component to obtain the simulation temperature of the power consumption component.

S204, calculating the simulation thermal resistance of the power consumption component according to the power consumption value of the power consumption component and the simulation temperature of the power consumption component.

In thermal simulation software, modeling is carried out on a thermal simulation model of the power consumption component, thermal simulation is carried out by adopting the established thermal simulation model of the power consumption component, the simulation temperature of the power consumption component is obtained, and the simulation thermal resistance of the power consumption component is calculated according to the power consumption value of the power consumption component and the simulation temperature of the power consumption component.

See steps S101-S104 in fig. 1 for a specific implementation of steps S201-S204.

Accordingly, in the step S105, the correction of the heat conduction parameter of the thermal simulation model of each hardware unit according to the actually measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit includes:

s205, correcting the heat conduction parameters of the thermal simulation model of the power consumption component according to the actual measured heat resistance of the power consumption component and the simulated heat resistance of the power consumption component.

According to the actual measured thermal resistance of the power consumption component and the simulated thermal resistance of the power consumption component, the simulated thermal resistance of the power consumption component and the thermal resistance error of the actual measured thermal resistance can be determined, and if the thermal resistance error exceeds a preset threshold, the heat conduction parameters of the thermal simulation model of the power consumption component can be corrected so as to realize the precision correction of the thermal simulation model of the power consumption component.

Wherein the thermal conductivity parameters of the thermal simulation model of the power consuming component may include: thermal conductivity and material thickness of thermally conductive interface materials in thermal simulation models of power consuming components.

In an alternative embodiment, each hardware unit further comprises: a heat sink assembly for a power consuming assembly is described below in connection with fig. 3.

Fig. 3 is a flow chart III of a method for correcting a thermal simulation model according to an embodiment of the present application, as shown in fig. 3, the method may include:

s301, acquiring a power consumption value of a power consumption component and a detection temperature of the radiator component in a working process of the radiator component on a preset heat transfer path of the power consumption component on the test board.

S302, calculating actual measurement thermal resistance of the radiator assembly according to the power consumption value of the power consumption assembly and the detection temperature of the radiator assembly.

The preset heat transfer path of the power consumption component comprises at least one hardware unit, and the at least one hardware unit comprises: and aiming at the radiator component arranged on the power consumption component, the radiator component is used for radiating heat generated by the power consumption component, the power consumption value of the power consumption component and the detection temperature of the radiator component are obtained in the working process of the radiator component on the preset heat transfer path of the power consumption component on the test board card, and the actual measurement thermal resistance of the radiator component is calculated according to the power consumption value of the power consumption component and the detection temperature of the radiator component.

S303, performing thermal simulation by adopting a thermal simulation model of the radiator assembly to obtain the simulation temperature of the radiator assembly.

S304, calculating the simulated thermal resistance of the radiator component according to the power consumption value of the power consumption component and the simulated temperature of the radiator component.

In thermal simulation software, modeling is carried out on a thermal simulation model of the power consumption component and a thermal simulation model of the radiator component, a power consumption value of the thermal simulation model of the power consumption component is set to be an actual power consumption value of the power consumption component, thermal simulation is carried out by adopting the established thermal simulation model of the radiator component, a simulation temperature of the radiator component is obtained, and a simulation thermal resistance of the radiator component is calculated according to the power consumption value of the power consumption component and the simulation temperature of the radiator component.

See steps S101-S104 in fig. 1 for a specific implementation of steps S301-S304.

s305, correcting the heat conduction parameters of the thermal simulation model of the radiator assembly according to the actual measured heat resistance of the radiator assembly and the simulated heat resistance of the radiator assembly.

According to the actual measured thermal resistance of the radiator assembly and the simulated thermal resistance of the radiator assembly, the simulated thermal resistance of the radiator assembly and the thermal resistance error of the actual measured thermal resistance can be determined, and if the thermal resistance error exceeds a preset threshold, the heat conduction parameters of the thermal simulation model of the radiator assembly can be corrected so as to realize the precision correction of the thermal simulation model of the radiator assembly.

Wherein the thermal conductivity parameters of the thermal simulation model of the heat sink assembly may include: fin thermal conductivity, substrate thermal conductivity, fan air volume of a thermal simulation model of the heat sink assembly.

In this embodiment, the thermal simulation model of the radiator assembly is accurately corrected by the actually measured thermal resistance and the simulated thermal resistance of the radiator assembly, and the actually measured thermal resistance of the radiator is calculated, so that the radiator can be used for the heat conduction performance of the radiator, and the larger the thermal resistance is, the worse the heat dissipation capability is, and therefore the radiator can be used for the comparison test and the model selection of the performance of the radiator.

In an alternative embodiment, each hardware unit further comprises: the thermally conductive interface material for the power consuming components is described below in connection with fig. 4.

Fig. 4 is a flow chart four of a method for correcting a thermal simulation model according to an embodiment of the present application, as shown in fig. 4, the method may include:

s401, acquiring a power consumption value of the power consumption component and a detection temperature of the heat conduction interface material in a working process of the heat conduction interface material on a preset heat transfer path of the power consumption component on the test board.

S402, calculating actual thermal resistance of the heat conduction interface material according to the power consumption value of the power consumption component and the detection temperature of the heat conduction interface material.

The preset heat transfer path of the power consumption component comprises at least one hardware unit, and the at least one hardware unit comprises: the method comprises the steps that according to the heat conduction interface material arranged on the power consumption component, the heat conduction interface material is used for conducting heat generated by the power consumption component, in the working process of the heat conduction interface material on a preset heat transfer path of the power consumption component on the test board, the power consumption value of the power consumption component and the detection temperature of the heat conduction interface material are obtained, and the actual measurement thermal resistance of the heat conduction interface material is calculated according to the power consumption value of the power consumption component and the detection temperature of the heat conduction interface material.

See steps S101-S104 in fig. 1 for a specific implementation of steps S401-S404.

S403, performing thermal simulation by adopting a thermal simulation model of the heat conduction interface material to obtain the simulation temperature of the heat conduction interface material.

S404, calculating the simulated thermal resistance of the heat conduction interface material according to the power consumption value of the power consumption component and the simulated temperature of the heat conduction interface material.

In thermal simulation software, modeling is carried out on a thermal simulation model of the power consumption component and a thermal simulation model of the heat conduction interface material, the power consumption value of the thermal simulation model of the power consumption component is set to be an actual power consumption value of the power consumption component, thermal simulation is carried out by adopting the established thermal simulation model of the heat conduction interface material, the simulation temperature of the heat conduction interface material is obtained, and the simulation thermal resistance of the heat conduction interface material is calculated according to the power consumption value of the power consumption component and the simulation temperature of the heat conduction interface material.

s405, correcting the heat conduction parameters of the thermal simulation model of the heat conduction interface material according to the actual measured heat resistance of the heat conduction interface material and the simulated heat resistance of the heat conduction interface material.

According to the actual thermal resistance of the heat conduction interface material and the simulated thermal resistance of the heat conduction interface material, the simulated thermal resistance of the heat conduction interface material and the thermal resistance error of the actual thermal resistance can be determined, and if the thermal resistance error exceeds a preset threshold, the heat conduction parameters of the thermal simulation model of the heat conduction interface material can be corrected so as to realize the precision correction of the thermal simulation model of the heat conduction interface material.

The heat conduction parameters of the thermal simulation model of the heat conduction interface material can include the heat conduction coefficient and the material thickness of the thermal simulation model of the heat conduction interface material.

In this embodiment, the thermal simulation model of the thermal interface material is accurately corrected by actually measuring the thermal resistance and the simulated thermal resistance of the thermal interface material, and the actually measuring thermal resistance of the thermal interface material is calculated, so that the thermal simulation model can be used for the thermal conductivity of the thermal interface material, and the thermal conductivity is better as the thermal resistance is smaller, so that the thermal simulation model can be used for the comparison test and the model selection of the thermal interface material.

Fig. 5 is a flowchart fifth of a method for correcting a thermal simulation model according to an embodiment of the present application, where, as shown in fig. 5, correcting a thermal conduction parameter of the thermal simulation model of each hardware unit according to an actual measured thermal resistance of each hardware unit and a simulated thermal resistance of each hardware unit may include:

s501, calculating the actually measured thermal resistance of each hardware unit and the thermal resistance error of the simulated thermal resistance of each hardware unit.

S502, if the thermal resistance error does not meet the preset condition, correcting the heat conduction parameters of the thermal simulation model of each hardware unit according to the thermal resistance error.

Calculating the actual measured thermal resistance of each hardware unit and the thermal resistance error of the simulated thermal resistance of each hardware unit, wherein the thermal resistance error is the difference value between the actual measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit.

If the thermal resistance error does not meet the preset condition, the thermal conduction parameters of the thermal simulation model of each hardware unit are corrected according to the thermal resistance error, wherein the correction coefficient can be determined according to the thermal resistance error, then the thermal conduction parameters of the thermal simulation model of each hardware unit are corrected according to the correction coefficient, the thermal resistance error and the correction coefficient can have a mapping relation, the correction coefficient corresponding to the thermal resistance error can be determined by inquiring the mapping relation, the larger the thermal resistance error is, the smaller the correction coefficient is, and the dynamic correction can be performed by adopting the corresponding correction coefficient according to the size of the thermal resistance error, so that the correction speed is high.

It should be noted that the preset condition may be that the preset threshold is not exceeded, and the preset threshold may be 5%, for example.

S503, carrying out thermal simulation again by adopting the corrected thermal simulation model of each hardware unit to obtain new simulation temperature of each hardware unit.

S504, recalculating new simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the new simulated temperature of each hardware unit until the actual measured thermal resistance of each hardware unit and the thermal resistance error of the new simulated thermal resistance of each hardware unit meet preset conditions.

The corrected thermal simulation model of each hardware unit can be provided with a temperature monitoring point corresponding to the temperature sensor on each hardware unit, and the temperature monitoring point is used for monitoring the new simulation temperature of each hardware unit.

It should be noted that, in the working process of the corrected thermal simulation model of each hardware unit, the power consumption value of the thermal simulation model of the power consumption component can be set as the power consumption value of the power consumption component, that is, before and after correction, the power consumption value of the thermal simulation model of the power consumption component is fixed as the power consumption value of the power consumption component, and then the new simulated thermal resistance of each hardware unit is recalculated according to the power consumption value of the power consumption component and the new simulated temperature of each hardware unit until the measured thermal resistance of each hardware unit and the thermal resistance error of the new simulated thermal resistance of each hardware unit meet preset conditions, that is, when the measured thermal resistance of each hardware unit and the thermal resistance error of the simulated thermal resistance do not meet preset conditions, the thermal conductivity parameters of the thermal simulation model of each hardware unit are corrected, and the corrected stop conditions are that the measured thermal resistance of each hardware unit and the thermal resistance error of the new simulated thermal resistance meet preset conditions.

Fig. 6 is a flowchart of a method for correcting a thermal simulation model according to an embodiment of the present application, as shown in fig. 6, in a working process of each hardware unit on a preset heat transfer path of a power consumption component on a test board, a power consumption value of the power consumption component and a detection temperature of each hardware unit are obtained, including:

s601, acquiring detection temperatures of at least two temperature detection points corresponding to each hardware unit and a power consumption value of the power consumption component in the working process of each hardware unit on a preset heat transfer path of the power consumption component.

Wherein, be equipped with two at least temperature check points on each hardware unit, be equipped with temperature sensor on each temperature check point for gather the detected temperature of each temperature check point on each hardware unit, still be equipped with the consumption monitoring module on the test board card, be used for obtaining the consumption value at the power consumption subassembly.

In the working process of each hardware unit on a preset heat transfer path of the power consumption component, the temperature sensors on each hardware unit are used for collecting detection temperatures of at least two temperature detection points corresponding to each hardware unit, and the power consumption monitoring module is used for obtaining the power consumption value of the power consumption component.

Accordingly, in the step S102, the actual measurement thermal resistance of each hardware unit is calculated according to the power consumption value and the detected temperature of each hardware unit, including:

S602, calculating actual measurement thermal resistance of each hardware unit according to the detected temperature values of at least two temperature detection points and the power consumption value of the power consumption component.

Calculating the temperature difference of at least two temperature detection points, and determining the ratio of the temperature difference to the power consumption value of the power consumption component as the actually measured thermal resistance of each hardware unit, wherein the temperature difference of the at least two temperature detection points can be the average value of the temperature differences of every two temperature detection points in the at least two temperature detection points.

It should be noted that, the at least two temperature detection points on each hardware unit may include two ends of the hardware unit through which the preset heat transfer path of the power consumption component passes, that is, a ratio of a temperature difference between two ends of the hardware unit to the power consumption component is determined, which is an actually measured thermal resistance of each hardware unit.

Correspondingly, in the step S103, thermal simulation is performed by using the thermal simulation models of the hardware units, to obtain simulation temperatures of the hardware units, including:

s603, performing thermal simulation by adopting the thermal simulation models of the hardware units respectively to obtain simulation temperatures of at least two temperature monitoring points, which are arranged on the thermal simulation models of the hardware units and correspond to the at least two temperature detection points.

Accordingly, in the above step S104, the calculation of the simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulated temperature of each hardware unit includes:

S604, calculating the simulated thermal resistance of each hardware unit according to the simulated temperatures of at least two temperature monitoring points and the power consumption value of the power consumption component.

And the positions of the at least two temperature monitoring points on the thermal simulation model of each hardware unit are the same as the positions of the at least two temperature detection points on each hardware unit, and the thermal simulation model of each hardware unit is adopted to respectively perform thermal simulation to obtain simulation temperatures of the at least two temperature monitoring points, which are arranged corresponding to the at least two temperature detection points, on the thermal simulation model of each hardware unit.

And then calculating the temperature difference of the simulation temperatures of the at least two temperature monitoring points, and determining the temperature difference and the power consumption value of the power consumption component as the simulation thermal resistance of each hardware unit, wherein the temperature difference of the simulation temperatures of the at least two temperature monitoring points can be the average value of the temperature differences of every two temperature monitoring points in the at least two temperature monitoring points.

It should be noted that, the at least two temperature monitoring points on the thermal simulation model of each hardware unit may include two ends of the thermal simulation model of the hardware unit through which the preset heat transfer path of the power consumption component passes, that is, a ratio of a temperature difference between two ends of the thermal simulation model of the hardware unit and the power consumption component is determined, which is a simulated thermal resistance of each hardware unit.

In summary, taking the example that each hardware unit includes a power consumption component, a heat sink component and a heat conducting interface material, where the power consumption component is a CPU component, the temperature sensor includes a temperature detection component, and the heat sink component 2 includes a heat dissipation fin, a heat pipe, a metal substrate and a fan, the description is given below with reference to fig. 7 and 8.

Fig. 7 is an exploded schematic view of a structure of a test board provided in an embodiment of the present application, and fig. 8 is a schematic view of a CPU heat dissipation thermal resistance link provided in an embodiment of the present application.

As shown in fig. 7, includes: the heat radiator assembly 2 is locked on the CPU main board through screws, wherein the heat radiator assembly 2 is fixed on the CPU main board through screws, the heat radiator assembly 2 is arranged on the CPU main board (Printed Circuit Board, PCB) main board assembly 7 (namely the CPU main board), the CPU assembly 6, the heat conduction interface material 4 for filling an interface gap and the heat radiator assembly 2 for radiating heat of the CPU, the top surface of the CPU assembly 6 is provided with grooves, the heat conduction interface material 4 can be silicone grease materials or heat conduction gasket materials, the heat conduction interface material 4 is coated or attached on the top surface of the CPU assembly casing, and the center of the bottom surface of the substrate of the heat radiator assembly 2 is provided with grooves.

The third temperature detecting component 5 can be a thermocouple with a wire diameter of 0.5mm, and the third temperature detecting component 5 is arranged in a groove on the top surface of the CPU component 6 for measuring the temperature of the central position of the top surface of the CPU component 6 (namely the shell temperature T in figure 8) _c ) Shell temperature T _c Is called Tcase.

The second temperature detecting component 3 may be a thermocouple with a wire diameter of 0.5mm, and the second temperature detecting component 3 is arranged in a groove on the bottom surface of the substrate of the heat sink component 2, so as to measure the temperature of the central position of the bottom surface of the substrate of the heat sink component 2 (i.e. the temperature T of the heat sink substrate in fig. 8) _s )。

The first temperature detecting component 1 may be a thermocouple with a wire diameter of 0.5mm, and the first temperature detecting component 1 is arranged at the position of the air inlet of the fan airflow of the radiator component 2 for measuring the air inlet temperature of the radiator component 2 (i.e. the ambient temperature T in fig. 7) _a ) Ambient temperature T _a Is called Tair.

As shown in fig. 7, a CPU thermal resistance link (i.e., CPU-TIM 2-heatsink) is used to characterize the heat transfer path of a CPU assembly, TIM2 (thermal interface material) is a thermally conductive interface material, wherein the CPU assembly includes solder balls (solderall), a Substrate (submount), a wafer (Die), a thermally conductive interface material 1 (TIM 1), and a CPU housing (LID).

It is worth to say that, the test board card can also include data acquisition module and CPU consumption monitoring module, and data acquisition module is used for obtaining CPU shell temperature, radiator base plate temperature and ambient temperature when testing, and CPU consumption monitoring module is used for obtaining the consumption value of CPU when testing.

Based on the above, the testing of the heat resistance of the radiator, the heat resistance of the heat conduction interface material and the heat resistance of the CPU crust comprises the following steps:

step one, powering on a CPU main board, running a power consumption load program of the CPU, and observing the fluctuation condition of the power consumption of the CPU until the power consumption of the CPU reaches a stable state.

After the power consumption of the CPU is stable, continuously monitoring the temperatures measured by the first, second and third temperature measuring components, and after the heat radiator component and the CPU component reach heat balance, namely the measured temperatures of the first, second and third temperature measuring components are stable, recording the temperatures (T _a 、T _s 、T _c ) And reads the internal temperature sensor temperature of the CPU, i.e. the junction temperature (T) _j )，T _j Is called Tjunction in full english.

And step three, recording the junction temperature of the temperature detection component and the CPU in the step S02, and simultaneously recording the CPU power consumption (P) detected by the CPU power consumption detection module.

Step four, according to the ambient temperature T measured in the step two and the step three _a Heat sink substrate temperature T _s And calculating actual measured thermal resistance of the radiator assembly by CPU power consumption P, wherein the actual measured thermal resistance is as follows:

step five, according to the measurement in the step two and the step threeRadiator substrate temperature T _s CPU shell temperature T _c And calculating actual thermal resistance of the heat conduction interface material according to CPU power consumption P:

step six, according to the CPU shell temperature T measured in the step two and the step three _c Junction temperature T of CPU _j And calculating the actual measured crusting thermal resistance of the CPU according to the CPU power consumption P, wherein the actual measured crusting thermal resistance is as follows:

step seven, according to the heat resistance of the radiator, the heat resistance of the interface material and the heat resistance of the CPU crust calculated in the step four to the step six, the total actual measured heat resistance from the CPU component to the environment can be calculated as follows:

R _ja ＝R _jc +R _cs +R _ca

in summary, the present application provides a method for simultaneously correcting a thermal simulation model of a radiator assembly, a thermal simulation model of a heat conduction interface material, and accuracy of a thermal simulation model of a CPU assembly, and the thermal simulation models of a CPU motherboard, the CPU assembly, the heat conduction interface material, and the radiator assembly are built in thermal simulation software, wherein structural dimensions of each thermal simulation model are the same as physical objects, heat conduction parameters of each model are set according to the heat conduction parameters of the physical objects, and a power consumption value of the thermal simulation model of the CPU assembly is set as a power consumption value of the CPU assembly. The method specifically comprises the following steps:

step one, completing the tests of the heat resistance of the radiator, the heat resistance of the heat conducting interface material and the heat resistance of the CPU crust, and obtaining the actual measured heat resistance R of the radiator assembly _sa Measured thermal resistance R of thermally conductive interface material _cs CPU actual measurement thermal resistance R _jc And a power consumption value P of the CPU.

Step two, in the thermal simulation software, modeling a thermal simulation model of the device in fig. 7, and setting model boundary conditions, ambient temperature, power consumption values of the thermal simulation model of the CPU component, heat conduction parameters and dividing model grids.

Step three, after the initial model and the parameter setting are completed, referring to the positions of the first temperature monitoring point, the second temperature monitoring point and the third temperature monitoring point in fig. 7, setting temperature monitoring points at corresponding positions in the thermal simulation model, and monitoring the simulation environment temperature T _{a_0} Simulation temperature T of radiator substrate _{s_0} CPU housing simulation temperature T _{c_0} And CPU simulation junction temperature T _{j_0} The simulation calculation is restarted.

Step four, after temperature convergence is stable, recording the simulation environment temperature T _{a_0} And radiator substrate simulation temperature T _{s_0} And calculating the simulated thermal resistance of the radiator assembly as:

step five, comparing the simulated thermal resistance R of the radiator assembly _{sa_0} And measured thermal resistance R of heat sink assembly _sa If the simulated thermal resistance R of the radiator assembly _{sa_0} If the error exceeds 5%, adjusting the heat conductivity coefficient of the fin or the substrate of the thermal simulation model of the radiator assembly or the air quantity of the fan according to the error, and repeating the third and fourth steps until the radiator simulates thermal resistance R _{sa_0} And (5) the accuracy correction of the thermal simulation model of the radiator assembly is considered to be completed.

Step six, recording the simulation temperature T of the radiator substrate _{s_0} And CPU case simulation temperature T _{c_0} And calculating the simulated thermal resistance of the heat conduction interface material as follows:

step seven, comparing the simulated thermal resistance R of the heat conduction interface material _{cs_0} And the actual thermal resistance R of the heat conduction interface material _cs If the heat conduction interface material simulates thermal resistance R _{cs_0} If the error exceeds 5%, the thermal conductivity coefficient or the thermal coefficient of the thermal simulation model of the thermal interface material component is adjusted according to the errorMaterial thickness, simulation calculation, 5 calculation convergence, repeating the step six until the simulated thermal resistance R of the heat conduction interface material _{cs_0} And (5) the thermal simulation model precision correction of the heat conduction interface material can be considered to be completed when the error of the thermal simulation model precision correction is not more than 5%.

Step eight, recording the simulation temperature T of the CPU shell _{c_0} And CPU simulation junction temperature T _{j_0} And calculating the simulated crusting thermal resistance of the CPU component as follows:

step nine, comparing simulated crusting thermal resistance R of CPU component _{jc_0} And CPU actual measurement crusting thermal resistance R _jc If CPU simulates the crusting thermal resistance R _{jc_0} If the error exceeds 5%, according to the error, adjusting the heat conductivity coefficient or the material thickness of TIM1 in the thermal simulation model of the CPU assembly, performing simulation calculation, and repeating the step eight after calculation convergence until the simulation crusting thermal resistance R of the CPU assembly _{jc_0} The error of the (C) is not more than 5%, and the precision correction of the thermal simulation model of the CPU component can be considered to be completed.

On the basis of the foregoing embodiment, fig. 9 is a schematic structural diagram of a thermal simulation model correction system according to an embodiment of the present application, and as shown in fig. 9, the system may include: test board card and correction equipment.

The test board card is provided with: each hardware unit, temperature detection component, consumption subassembly and the consumption detection component that the consumption subassembly corresponds that each hardware unit set up, wherein, the consumption detection component can be realized through above-mentioned consumption monitoring module.

The temperature detection component is used for collecting the detection temperature of each hardware unit, and the power consumption detection component is used for collecting the power consumption value of the power consumption component; the correction device is provided with: the correction equipment is used for executing the correction method of the thermal simulation model according to the detected temperature and the power consumption value so as to correct the thermal simulation model of each hardware unit.

For a specific implementation process of the correction system of the thermal simulation model, reference may be made to the above-mentioned correction method of the thermal simulation model, which is not described herein.

Based on the same inventive concept, the embodiment of the present application further provides a device for correcting a thermal simulation model, where the device in the embodiment of the present application is similar to the method for correcting a thermal simulation model in the embodiment of the present application, so that the implementation of the device may refer to the implementation of the method, and the repetition is omitted.

Fig. 10 is a schematic structural diagram of a thermal simulation model correction device according to an embodiment of the present application, where the device may be integrated in a correction apparatus. As shown in fig. 10, the apparatus may include:

the acquiring module 601 is configured to acquire a power consumption value of a power consumption component and a detection temperature of each hardware unit in a working process of each hardware unit on a preset heat transfer path of the power consumption component on the test board;

the calculation module 602 is configured to calculate an actual measurement thermal resistance of each hardware unit according to the power consumption value and the detected temperature of each hardware unit;

the simulation module 603 is configured to perform thermal simulation by using a thermal simulation model of each hardware unit, so as to obtain a simulation temperature of each hardware unit;

the calculation module 602 is further configured to calculate a simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the simulated temperature of each hardware unit;

and the correction module 604 is configured to correct the heat conduction parameter of the thermal simulation model of each hardware unit according to the actually measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit.

In an alternative embodiment, each hardware unit includes: a power consumption component;

the correction module 604 is specifically configured to:

In an alternative embodiment, each hardware unit further comprises: a heat sink assembly disposed for the power consuming assembly;

the correction module 604 is specifically configured to:

In an alternative embodiment, each hardware unit further comprises: a thermally conductive interface material disposed for the power consuming component;

the correction module 604 is specifically configured to:

In an alternative embodiment, the correction module 604 is specifically configured to:

calculating the actual measured thermal resistance of each hardware unit and the thermal resistance error of the simulated thermal resistance of each hardware unit;

carrying out thermal simulation again by adopting the corrected thermal simulation model of each hardware unit to obtain new simulation temperature of each hardware unit;

and re-calculating the new simulated thermal resistance of each hardware unit according to the power consumption value of the power consumption component and the new simulated temperature of each hardware unit until the actual measured thermal resistance of each hardware unit and the thermal resistance error of the new simulated thermal resistance of each hardware unit meet preset conditions.

In an alternative embodiment, the obtaining module 601 is specifically configured to:

the computing module 602 is specifically configured to:

according to the detected temperature values of the at least two temperature detection points and the power consumption value of the power consumption component, calculating the actual measured thermal resistance of each hardware unit;

the simulation module 603 is specifically configured to:

respectively carrying out thermal simulation by adopting a thermal simulation model of each hardware unit to obtain simulation temperatures of at least two temperature monitoring points which are arranged on the thermal simulation model of each hardware unit and correspond to the at least two temperature detection points;

the computing module 602 is specifically configured to:

and calculating the simulated thermal resistance of each hardware unit according to the simulated temperatures of the at least two temperature monitoring points and the power consumption value of the power consumption component.

The process flow of each module in the apparatus and the interaction flow between the modules may be described with reference to the related descriptions in the above method embodiments, which are not described in detail herein.

Fig. 11 is a schematic structural diagram of a correction device provided in an embodiment of the present application, and as shown in fig. 11, the device may include: the correction device comprises a processor 701, a memory 702 and a bus 703, wherein the memory 702 stores machine-readable instructions executable by the processor 701, when the correction device is running, the processor 701 and the memory 702 are communicated through the bus 703, and the processor 701 executes the machine-readable instructions to execute the correction method of the thermal simulation model.

The embodiment of the application also provides a computer readable storage medium, and a computer program is stored on the computer readable storage medium and is executed by a processor when the computer program is executed by the processor, and the processor executes the correction method of the thermal simulation model.

In the embodiments of the present application, the computer program may also execute other machine readable instructions when executed by a processor to perform the methods as described in other embodiments, and the specific implementation of the method steps and principles are referred to in the description of the embodiments and are not described in detail herein.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments provided in the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

It should be noted that: like reference numerals and letters in the following figures denote like items, and thus once an item is defined in one figure, no further definition or explanation of it is required in the following figures, and furthermore, the terms "first," "second," "third," etc. are used merely to distinguish one description from another and are not to be construed as indicating or implying relative importance.

Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present application, and are not intended to limit the scope of the present application, but the present application is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, the present application is not limited thereto. Any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the corresponding technical solutions. Are intended to be encompassed within the scope of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A method for modifying a thermal simulation model, comprising:

2. The method of claim 1, wherein each hardware unit comprises: the power consumption component;

3. The method of claim 1, wherein each hardware unit further comprises: a heat sink assembly disposed for the power consuming assembly;

4. The method of claim 1, wherein each hardware unit further comprises: a thermally conductive interface material disposed for the power consuming component;

5. The method of claim 1, wherein modifying the thermal conductivity parameters of the thermal simulation model of each hardware unit based on the measured thermal resistance of each hardware unit and the simulated thermal resistance of each hardware unit comprises:

6. The method according to claim 1, wherein the step of obtaining the power consumption value of the power consumption component and the detected temperature of each hardware unit during the operation of each hardware unit on the preset heat transfer path of the power consumption component on the test board comprises:

7. A system for modifying a thermal simulation model, comprising: test board and correction equipment;

the correction device is provided with: the correction device is configured to execute the method according to any one of claims 1 to 6 according to the detected temperature and the power consumption value, so as to correct the thermal simulation model of each hardware unit.

8. A correction device for a thermal simulation model, comprising:

9. A correction apparatus, characterized by comprising: a processor, a memory and a bus, said memory storing machine readable instructions executable by said processor, said processor in communication with said memory via the bus when the correction device is running, said processor executing said machine readable instructions to perform the method of correcting a thermal simulation model according to any one of claims 1 to 6.

10. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon a computer program which, when executed by a processor, performs a method of modifying a thermal simulation model according to any one of claims 1 to 6.