CN116106221A - Automatic inspection equipment for the appearance of semiconductor chips after soldering - Google Patents

Abstract

The invention relates to the field of chip appearance detection, in particular to an automatic detection device for the appearance of semiconductor chips after welding. It includes the main body of the device. The main body of the device is equipped with a material conveying track and a sorting assembly next to the material conveying track. The material conveying track is provided with a material tray moving along its length. The placement slot for placing the chip, the material conveying track is sequentially formed along the length direction with a feeding section, a frontal visual inspection section for the frontal visual inspection of the chip, a chip sorting section and a feeding section; the sorting component is used to align the The chips in the sorting section are sorted, and the sortable range of the sorting component includes the chip sorting section. The main body of the device in the present invention can firstly realize the automatic transportation of the chip; and the accuracy of the appearance inspection result can be preferably improved by identifying and detecting the front and back of the chip.

Description

Automatic inspection equipment for the appearance of semiconductor chips after soldering

technical field

The invention relates to the field of chip appearance detection, in particular to an automatic detection device for the appearance of semiconductor chips after soldering.

Background technique

A semiconductor chip refers to a semiconductor device that can realize a certain function by etching and wiring on a semiconductor sheet. In the production process of semiconductor chips, it is necessary to weld the semi-finished chip and the shell. Since the chip may be damaged to varying degrees during the welding process; therefore, after the welding is completed, it is necessary to perform visual inspection on the semiconductor chip to remove defective products that do not meet the quality standards.

Existing detection equipment usually uses a detection camera to sequentially take pictures of the chips to be tested for identification and detection. On the one hand, this detection method cannot simultaneously identify and detect multiple chips to be detected, which restricts the improvement of detection efficiency; on the other hand, the This detection method is difficult to quickly and efficiently identify and detect both the front and back sides of the detection chip, so defective products may be missed and not detected during the detection process.

Contents of the invention

In order to overcome the technical problems in the prior art, the invention provides an automatic detection device for the appearance of semiconductor chips after welding;

Automatic inspection equipment for the appearance of semiconductor chips after welding, which includes the main body of the device. The main body of the device is equipped with a material conveying track and a sorting component next to the material conveying track. The material conveying track is provided with a material tray moving along its length. The upper end surface is provided with a plurality of placement slots for placing chips, and the material conveying track is sequentially formed along the length direction with a feeding section, a frontal visual inspection section for frontal visual inspection of chips, a chip sorting section and a feeding section; The sorting component is used to sort the chips located in the chip sorting section. The sortable range of the sorting component includes the chip sorting section, and also includes the reverse visual inspection for chip reverse visual detection in the main body of the device. Detection section as well as bad discharge section.

The main body of the device in the present invention can first realize the automatic transportation of the material tray with multiple chips placed on it through the material conveying track; and the accuracy of the appearance detection result can be better improved by identifying and detecting the front and back sides of the chip, thereby effectively Avoid undetected defects on the undetected surface due to single-sided inspection.

Preferably, the main body of the device includes a casing, the casing includes an upper casing and a lower casing, and the material conveying track includes a plurality of sets of first vertical plates and second vertical plates vertically arranged at the bottom plate of the upper casing and parallel to each other, It also includes a transmission belt and a drive wheel assembly that are arranged in parallel on the inner walls of the opposite sides of the first vertical board and the second vertical board; the bottom of both ends of the first vertical board along the material conveying direction is provided with a sliding assembly, and the sliding assembly includes Sliding guide rail, the sliding guide rail is arranged perpendicular to the direction of material conveying; the sliding guide rail is provided with a slider that slides with it, and the upper part of the slider is connected with the bottom end of the first vertical plate through the connecting plate; the first vertical plate is far from the second vertical plate There is a drive motor on one side of the drive wheel assembly, which includes a drive wheel connected to the output end of the drive motor and a driven wheel for tensioning and supporting the transmission belt; the upper surface of the transmission belt is used to place the material tray and drive the material tray to convey along the material track moves.

During the use of the main body of the device of the present invention, the staff can drive the drive belt to move by driving the motor; and the first vertical plate and the second vertical plate can better limit the position of the material tray on the drive belt, thereby It ensures that the material tray can pass through the front visual inspection section and the chip sorting section smoothly and stably along the material conveying track.

As a preference, the sidewalls on both sides of the upper shell are provided with a feed port and a discharge port, and the feeding section and the unloading section are located at the feed port and the discharge port respectively; A through return channel is formed between the outer walls on both sides of the machine, and a return conveyor belt for conveying empty material trays is provided at the return channel. The conveying direction of the return conveyor belt is opposite to the conveying direction of the material conveying track.

The recycling of the material tray can be realized through the inlet, the outlet and the return conveyor belt.

As a preference, the material conveying track is provided with a first stop assembly and a second stop assembly for stopping and releasing the material tray at intervals along the driving direction of the transmission belt; the first stop assembly is arranged in the front visual detection section, and the second stop assembly The components are located in the chip sorting section; the upper side of the front visual inspection section is equipped with an upper camera module, and the shooting range of the upper camera module is covered with the position of the material tray when the first stop component stops the material tray.

The first stop component can ensure that the upper camera module located on the upper side of the front visual inspection section can have sufficient time to photograph and scan the material tray; thus ensuring the accuracy of the front visual inspection results to effectively avoid defective products case of omission. The second stop component can ensure that when the sorting component is working, the material tray can keep stopping until the sorting component sorts the detected chips and then releases them; thus ensuring the smooth and stable work of the sorting component.

Preferably, both the first stop assembly and the second stop assembly include a stop module, and the stop module includes a photoelectric sensor and a servo cylinder arranged on the inner wall of the second riser near the first riser through the installation block; The photoelectric sensor is used to sense the transmission track located on its upper side, and the movement of the piston rod of the servo cylinder interferes with the movement of the material tray along the material delivery track.

When the photoelectric sensor senses that there is a material tray passing through its upper side, it sends a signal to the servo cylinder, and the piston rod of the servo cylinder stretches out to stop the material tray, so as to cooperate with the upper camera module and the sorting component to work. Good practicality.

Preferably, the sorting assembly includes a manipulator that rotates around the vertical direction, and also includes a material suction cup that moves along the height direction; the material suction cup is arranged on the moving end of the manipulator for picking up and putting down chips, and the contact range of the material suction cup when the manipulator is active is sorting. The sorting range for the component.

The manipulator and the material sucker can better drive the chip to move between the chip sorting section, the reverse visual inspection section and the bad discharge section.

As preferably, the material sucker includes a slide table cylinder, a mounting plate and a vacuum suction cup, the upper part of the slide table cylinder is connected with the moving end of the manipulator; the slide rail of the slide table cylinder is arranged along the height direction, and the slide table is arranged at the slide rail place and the slide rail Sliding fit; the mounting plate is horizontally arranged at the lower end of the sliding table, and the mounting plate includes a fitting part that fits with the lower end of the sliding table and a protruding part protruding from the lower end of the sliding table; the protruding part of the mounting plate is evenly arranged along the material conveying direction. There are a plurality of suction cup installation holes, and vacuum suction cups for absorbing chips are installed at the suction cup installation holes; the number of suction cup installation holes and vacuum suction cups is corresponding to the number of placement slots arranged in a single row in the length direction of the material tray.

The sliding table cylinder can better realize the up and down movement of the vacuum chuck, thus ensuring that the vacuum chuck can preferably absorb and put down the chips while following the movement of the manipulator and the sliding table. In addition, the arrangement quantity of the vacuum suction cups corresponds to the placement slots on the material tray, so as to ensure that the material suction cups can sequentially pick up the chips of each row on the material tray, thereby improving the sorting efficiency.

As a preference, the lower housing is provided with a lower camera module, and the lower camera module is located on the lower side of the reverse visual inspection section; when the sorting assembly moves the chip to the reverse visual inspection section after being sucked by the sorting assembly, the reverse of the chips sucked by the sorting assembly are all in the The lower camera module is within the shooting range.

The present invention can scan and photograph the reverse side of the chip through the lower camera module and transmit the data to the computer, and the computer can classify the chips by photographing the scanned data on the reverse side of the chip and matching with the previously obtained positive detection results.

A defective discharge module is provided at the defective discharge section, and the defective discharge module includes a defective product conveying track. The defective product conveying track is provided with a conveying assembly slidingly matched with it, and the conveying assembly is provided with a plurality of placement slots for placing defective products. The defective product conveying track includes a mobile platform and a screw module located on the lower side of the mobile platform and arranged in the same direction as the mobile platform; the screw module includes a servo motor and a coupling, and also includes Connected ball screw; both sides of the ball screw are provided with slide rails arranged along the conveying track of defective products, and the ball screw is provided with a moving seat that slides and cooperates with the slide rail, and the upper part of the moving seat is connected with a conveying Assemblies; the conveying assembly includes a sliding plate connected with the connecting block and slidingly matched with the mobile platform, and a plurality of defective product conveying plates arranged on the upper surface of the sliding plate.

The staff can control the movement of the conveying components through the screw module. Therefore, when the placement slot at the single defective conveying tray is full, the screw module can drive the defective conveying tray to move to the end of the defective conveying track, which is convenient for the staff to empty the full defective conveying tray. After emptying, the staff can put it back to the beginning of the conveying track and continue to place cores.

Description of drawings

Fig. 1 is the structural representation of the device main body in embodiment 1;

2 is a schematic diagram of the internal structure of the upper housing in Embodiment 1;

Fig. 3 is a schematic diagram of the right view structure of Fig. 2;

Fig. 4 is the structural representation of the material delivery track in embodiment 1;

Fig. 5 is the enlarged schematic view of place A in Fig. 4;

Fig. 6 is the structural representation of the sliding assembly in embodiment 1;

Figure 7 is a schematic structural view of the stop assembly in Embodiment 1;

Fig. 8 is the structural representation of the material sucker in embodiment 1;

Fig. 9 is a structural schematic diagram of a bad discharge module in embodiment 1;

FIG. 10 is a schematic structural view of the return conveyor belt in Embodiment 1.

Detailed ways

Example 1

In conjunction with Figures 1-10, this embodiment provides an automatic detection device for the appearance of semiconductor chips after soldering, including a device main body 100, which is provided with a material delivery track 210 and a sorting assembly located next to the material delivery track 210, and the material delivery track 210 is provided with a material tray 260 for moving and matching along its length direction. The upper end surface of the material tray 260 is provided with a plurality of placement grooves for placing chips. The material delivery track 210 is sequentially formed with feeding sections, The front visual inspection section, the chip sorting section and the unloading section are used for the front visual inspection of chips; the sorting component is used to sort the chips located in the chip sorting section, and the sorting range of the sorting component includes the chip sorting section. The sorting section also includes a reverse visual detection section for chip reverse visual inspection and a defective discharge section for discharging defective products, which are arranged in the main body 100 of the device.

During the use of the device main body 100 in this embodiment, the staff first places the chips to be detected in the placement slots at the material tray 260; The selection and adjustment of specific matching conditions can automatically detect multiple chips at the same time during the use of the device main body 100 . Then the staff can put the material tray 260 with the chip into the feeding section of the material conveying track 210; the material tray 260 arrives at the front visual inspection section along the material conveying track 210 for positive recognition and detection; and judges the front appearance of the chip by the computer Whether there is a defect; Compared with the prior art, the device main body 100 in this embodiment can automatically identify and detect multiple chips at the same time, thereby better improving the detection efficiency.

The material tray 260 passes through the front detection section along the material conveying track 210 and then enters the chip sorting section; when the material tray 260 reaches the chip sorting section, the sorting component will absorb the chips on the material tray 260; The sucked chip first moves to the reverse side visual inspection section to carry out reverse recognition and detection of the chip, and the computer finds out whether there is any defect in the appearance of the reverse side of the chip. After the recognition and detection of the reverse side of the chip is completed, the computer will classify the chips into qualified products and defective products according to the front and reverse recognition results of the chip; the sorting component will put the qualified products and defective products into the feeding section and the defective discharge segment.

It can be understood that the device main body 100 in this embodiment can first realize the automatic transportation of the material tray 260 on which multiple chips are placed through the material conveying track 210; The accuracy of the results can effectively avoid the undetected situation of undetected defects on the undetected surface due to single-sided inspection.

Specifically, as shown in Fig. 1, Fig. 2, Fig. 4, and Fig. 6, the device main body 100 in this embodiment includes a casing, the casing includes an upper casing 110 and a lower casing 120, and the material conveying track 210 includes multiple A set of first riser 211 and second riser 212 vertically arranged on the bottom plate of the upper casing 110 and parallel to each other, and also includes a drive fit at the opposite inner walls of the first riser 211 and second riser 212 arranged in parallel The drive belt 214 and the drive wheel assembly; the bottom of the first vertical plate 211 along the two ends of the material conveying direction is provided with a sliding assembly 213, the sliding assembly 213 includes a sliding guide rail 2131, and the sliding guide rail 2131 is arranged perpendicular to the material conveying direction; the sliding guide rail 2131 There is a sliding block 2132 which slides with it, and the upper part of the sliding block 2132 is connected with the bottom end of the first vertical plate 211 through the connecting plate 2133; the side of the first vertical plate 211 far away from the second vertical plate 212 is provided with a drive motor 215, The drive wheel assembly includes a drive wheel 216 connected to the output end of the drive motor 215 and a driven wheel 217 for tensioning and supporting the drive belt 214; the upper surface of the drive belt 214 is used to place the material tray 260 and drive the material tray 260 along the material delivery track 210 moves.

Specifically, during the use of the device main body 100 in this embodiment, the staff can drive the transmission belt 214 to move by driving the motor 215; The material tray 260 plays a better position-limiting role, thereby ensuring that the material tray 260 can smoothly and stably pass through the front visual inspection section and the chip sorting section along the material conveying track 210; Up to the normal progress of positive visual inspection and chip sorting.

In addition, the slider 2132 can drive the first vertical plate 211 to slide along its sliding direction, so that the distance between the first vertical plate 211 and the second vertical plate 212 can be adjusted, and then the material conveying track 210 can be adjusted to be suitable for different sizes. The conveying work of the material tray 260.

In addition, as shown in FIG. 1 , the sidewalls on both sides of the upper casing 110 are provided with a feed inlet and a discharge outlet, and the feeding section and the unloading section are respectively located at the feed inlet and the discharge outlet; the lower casing 120 A through return channel is formed between the outer walls on both sides along the conveying direction of the material tray 260. The return channel is provided with a return conveyor belt 130 for conveying the empty material tray 260. The conveying direction of the return conveyor belt 130 is in line with the material conveying track 210 The conveying direction is opposite.

It can be understood that the use of the material tray 260 can be used to form a cycle through the feed inlet, the feed outlet and the return conveyor belt 130. The staff puts the material tray 260 carrying the chip to be detected into the feeding section from the feed inlet, and then has After the detection and sorting is completed, the empty material tray 260 reaches the discharge port through the feeding section; at this time, the staff can transport the empty material tray 260 to the feed port through the return conveyor belt 130 and then load the chips to be tested , so that the recycling of the material tray 260 is realized, and the loading requirement of chips can be met by recycling a small amount of material tray 260 .

The aforementioned material conveying track 210 is provided with a first stop assembly and a second stop assembly for stopping and releasing the material tray 260 at intervals along the driving direction of the transmission belt 214; The stop component is set in the chip sorting section; the upper side of the front visual detection section is provided with an upper camera module 220, and the shooting range of the upper camera module 220 is covered with the first stop component to stop the material tray 260 when the material tray 260 is located. Location.

The first stop component can ensure that when the material tray 260 passes the front visual detection section along the material conveying track 210, the material tray 260 can stop for a period of time before passing through, thereby ensuring that the upper camera module located on the upper side of the front visual inspection section The 220 can have sufficient time to photograph and scan the material tray 260; thereby ensuring the accuracy of the results of the frontal visual inspection, so as to effectively avoid the omission of defective products. The second stopping component can ensure that when the sorting component is working, the material tray 260 can keep stopping until the sorting component sorts the detected chips and then passes through; thereby ensuring the smooth and stable operation of the sorting component.

As shown in Fig. 5 and Fig. 7, both the first stopper assembly and the second stopper assembly include a stopper module 218, and the stopper module 218 includes an inner wall on the side of the second riser 212 near the first riser 211 through a mounting block 2183. The photoelectric sensor 2181 and the servo cylinder 2182 at the place; the photoelectric sensor 2181 is used to sense the transmission track located on its upper side, and the movement of the piston rod of the servo cylinder 2182 interferes with the movement of the material tray 260 along the material conveying track 210.

When the photoelectric sensor 2181 senses that there is a material tray 260 passing through its upper side, it sends a signal to the servo cylinder 2182, and the piston rod of the servo cylinder 2182 stretches out to stop the material tray 260, thereby cooperating with the upper camera module 220 and sorting Components work and have better usability.

As shown in Figure 2, the sorting assembly includes a manipulator 230 that rotates around the vertical direction, and also includes a material suction cup 240 that moves along the height direction; the material suction cup 240 is arranged on the moving end of the manipulator 230 for sucking and putting down chips, and the manipulator 230 moves The contact range of the material sucker 240 is the sorting range of the sorting assembly.

The material suction cup 240 driven by the manipulator 230 can preferably absorb and sort the chips. Specifically, when in use, the manipulator 230 first drives the material suction cup 240 to suck the chips at the chip sorting section. After the suction, the manipulator 230 Drive the material suction cup 240 to move to the reverse detection section for reverse detection; after the detection is completed, the manipulator 230 first drives the material suction cup 240 to move to the defective discharge section, and puts down the chips classified as defective products in the defective discharge section according to the classification result obtained by the computer; Then move back to the chip sorting section, put the chips classified as qualified products back to the material tray 260 at the chip sorting section; then the second stop component at the chip sorting section is released, and the material tray containing qualified products 260 moves along the material conveying track 210 to the blanking conveying track to complete blanking.

As shown in Fig. 2 and Fig. 8, aforementioned material sucker 240 comprises slide table cylinder 241, mounting plate 243 and vacuum sucker 245, and the top of slide table cylinder 241 is connected with the moving end of manipulator 230; The slide rail 253 of slide table cylinder 241 Arranged along the height direction, the slide table 242 is arranged at the slide rail 253 to slide and cooperate with the slide rail 253; The protruding portion of the lower end of the slide table 242; the protruding portion of the mounting plate 243 is evenly arranged with a plurality of suction cup mounting holes 244 along the material conveying direction, and a vacuum suction cup 245 for sucking chips is installed at the suction cup mounting holes 244; the suction cup mounting holes 244 And the arrangement quantity of the vacuum suction cups 245 corresponds to the quantity of the placing slots arranged in a single row in the length direction of the material tray 260 .

Specifically, the sliding table cylinder 241 can preferably move the vacuum chuck 245 up and down, thereby ensuring that the vacuum chuck 245 can preferably absorb and put down the chip while following the movement of the manipulator 230 and the sliding table. In addition, the number of vacuum chucks 245 corresponds to the placement slots on the material tray 260 , so as to ensure that the material chucks 240 can sequentially pick up the chips of each row on the material tray 260 , thereby improving the sorting efficiency.

In this embodiment, the lower housing 120 is provided with a lower camera module 310, and the lower camera module 310 is located on the lower side of the reverse visual inspection section; The reverse side of the sucked chip is within the shooting range of the lower camera module 310 .

Understandably, the lower camera module 310 can scan and photograph the reverse side of the chip and transmit the data to the computer, and the computer can classify the chips based on the scanning data taken from the reverse side of the chip and the previously obtained positive detection results.

As shown in Figure 9, a defective discharge module 250 is provided at the aforementioned defective discharge section, and the defective discharge module 250 includes a conveying track for defective products. A slot for placing defective products. The defective product conveying track includes a mobile platform 259 and a screw module that is located on the lower side of the mobile platform 259 and is arranged in the same direction as the mobile platform 259; the screw module includes a servo motor 251 and a shaft coupling 252, and also includes a 252 is a ball screw 254 connected to the output end of the servo motor 251; the two sides of the ball screw 254 are provided with slide rails 253 arranged along the conveying track of defective products, and the ball screw 254 is provided with a moving part slidingly matched with the slide rail 253 Seat 255, the upper part of mobile seat 255 is connected with conveying assembly through connecting block 256; Conveying assembly comprises the sliding plate 257 that is connected with connecting block 256 and slides with mobile platform 259, and is located at the sliding plate 257 upper surface place. Defective product delivery tray 258.

Specifically, the staff can control the movement of the conveying component through the screw module. Thereby make when the placement slot at single defective product conveying tray 258 place is full, screw mandrel module can drive this defective product conveying tray 258 to move to the end of defective product conveying track, is convenient for the staff to put the defective product conveying tray 258 that is full empty. After emptying, the staff can put it back to the beginning of the conveying track and continue to place cores.

In order to further understand the content of the present invention, the present invention will be described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the examples are only for explaining the present invention and not for limiting it.

It is easy to understand that, on the basis of one or several embodiments provided by this application, those skilled in the art can combine, split, recombine, etc., the embodiments of this application to obtain other embodiments, and these embodiments do not exceed the scope of this application. The scope of protection applied for.

The above schematically describes the present invention and its implementation, which is not restrictive, and what is shown in the drawings is only one of the implementations of the present invention, and the actual structure is not limited thereto. Therefore, if a person of ordinary skill in the art is inspired by it, without departing from the inventive concept of the present invention, without creatively designing a structural mode and embodiment similar to the technical solution, it shall all belong to the protection scope of the present invention .

Claims (10)

1. The appearance automatic detection equipment after semiconductor chip welding is characterized in that: it includes a device main body (100), and a material conveying track (210) and a sorting component arranged beside the material conveying track (210) are arranged in the device main body (100) , the material delivery track (210) is provided with a material tray (260) that moves along its length direction, and the upper end surface of the material tray (260) is provided with a plurality of placing grooves for placing chips, and the material delivery track (210) Along the length direction, a feeding section, a frontal visual inspection section for chip frontal visual inspection, a chip sorting section and an unloading section are sequentially formed; the sorting component is used to sort the chips located in the chip sorting section, sorting The sorting range of the components includes the chip sorting section, and also includes the reverse side visual inspection section and the bad discharge section for the chip reverse side visual inspection, which are arranged in the device main body (100). 2. The appearance automatic detection equipment after semiconductor chip soldering according to claim 1, characterized in that: the device main body (100) comprises a housing, and the housing comprises an upper housing (110) and a lower housing (120), said The material conveying track (210) includes a plurality of sets of first vertical plates (211) and second vertical plates (212) vertically arranged at the bottom plate of the upper casing (110) and parallel to each other, and also includes a set of vertical plates (212) arranged parallel to the first vertical plates ( 211) and the transmission belt (214) and the transmission wheel assembly at the inner walls of the opposite sides of the second vertical plate (212); the bottom of the first vertical plate (211) along the material conveying direction is provided with a sliding assembly (213 ), the sliding assembly (213) includes a sliding guide rail (2131), and the sliding guide rail (2131) is vertically arranged with the material conveying direction; The upper part is connected with the bottom end of the first riser (211) through the connecting plate (2133); the side of the first riser (211) far away from the second riser (212) is provided with a driving motor (215), and the transmission wheel assembly includes The driving wheel (216) connected to the output end of the drive motor (215) and the driven wheel for tensioning and supporting the transmission belt (214); the upper surface of the transmission belt (214) is used to place the material tray (260) and drive the material tray (260) moves along the material conveying track (210). 3. The semiconductor chip appearance automatic detection device after welding according to claim 2, characterized in that: the side walls on both sides of the upper housing (110) are provided with a feed port and a discharge port, and the feeding section and the feeding section The sections are respectively located at the material inlet and the material outlet; the lower shell (120) is formed with a through return channel between the outer walls on both sides along the conveying direction of the material tray (260), and the return channel is provided with a valve for conveying empty materials. The return conveyer belt (130) of the disc (260), the conveying direction of the return conveyer belt (130) is opposite to the conveying direction of the material conveying track (210). 4. The automatic inspection device for the appearance of semiconductor chips after soldering according to claim 2, characterized in that: the material conveying track (210) is provided at intervals along the transmission direction of the transmission belt (214) for blocking the material tray (260). The stopping assembly and the second stopping assembly; the first stopping assembly is arranged in the front visual detection section, and the second stopping assembly is arranged in the chip sorting section; an upper camera module (220) is arranged on the upper side of the front visual inspection section, The shooting range of the upper camera module (220) covers the position of the material tray (260) when the first stop component stops the material tray (260). 5. The appearance automatic detection device after semiconductor chip welding according to claim 4, characterized in that: the first stop assembly and the second stop assembly both include a stop module (218), and the stop module (218) includes a pass The mounting block (2183) is arranged on the photoelectric sensor (2181) and the servo cylinder (2182) at the inner wall of the first vertical plate (211) of the second vertical plate (212); the photoelectric sensor (2181) is used for The transmission track on the upper side thereof performs induction, and the movement of the piston rod of the servo cylinder (2182) interferes with the movement of the material tray (260) along the material delivery track (210). 6. The semiconductor chip appearance automatic inspection device after soldering according to claim 1, characterized in that: the sorting assembly includes a manipulator (230) rotating around the vertical direction, and also includes a material sucker (240) moving along the height direction; The material sucker (240) is arranged on the moving end of the manipulator (230) for picking up and putting down the chips. When the manipulator (230) moves, the contact range of the material sucker (240) is the sorting range of the sorting component. 7. The appearance automatic detection device after semiconductor chip welding according to claim 6, characterized in that: the material sucker (240) includes a slide cylinder (241), a mounting plate (243) and a vacuum chuck (245), and the slide cylinder The top of (241) is connected with the moving end of manipulator (230); The slide rail (253) of slide table cylinder (241) is arranged along height direction, and slide table (242) is located at slide rail (253) place and slide rail ( 253) Sliding fit; the mounting plate (243) is horizontally arranged on the lower end of the sliding table (242), and the mounting plate (243) includes a fitting part that fits with the lower end of the sliding table (242) and a protruding part extending from the lower end of the sliding table; The protruding portion of the mounting plate (243) is evenly arranged with a plurality of suction cup mounting holes (244) along the material conveying direction, and a vacuum suction cup (245) for sucking chips is installed at the suction cup mounting holes (244); the suction cup mounting holes (244) ) and the arrangement quantity of the vacuum suction cups (245) correspond to the quantity of placement slots arranged in a single row in the length direction of the material tray (260). 8. The automatic inspection device for the appearance of semiconductor chips after soldering according to claim 2, characterized in that: the lower housing (120) is provided with a lower camera module (310), and the lower camera module (310) is located at the back side of the visual detection section Lower side: when the sorting component picks up the chip and moves it to the reverse side visual detection section, the back side of the chip picked up by the sorting component is within the shooting range of the lower camera module (310). 9. The automatic inspection device for the appearance of semiconductor chips after soldering according to claim 1, characterized in that: a defective discharge section is provided with a defective discharge module (250), and the defective discharge module (250) includes a defective product conveying track, and the defective product is conveyed The track is provided with a conveying assembly slidingly matched with it, and the conveying assembly is provided with a plurality of placement slots for placing defective products. 10. The semiconductor chip appearance automatic inspection device after soldering according to claim 9, characterized in that: the conveying track for defective products includes a mobile platform (259) and is located on the lower side of the mobile platform (259) and arranged with the mobile platform (259). A screw module with the same direction; the screw module includes a servo motor (251) and a shaft coupling (252), and also includes a ball screw ( 254); both sides of the ball screw (254) are provided with slide rails (253) arranged along the conveying track of defective products, and the ball screw (254) is provided with a moving seat (255) that slides and fits with the slide rails (253) , the upper part of the mobile seat (255) is connected with the conveying assembly through the connecting block (256); A plurality of defective product conveying trays (258) on the upper surface of the plate (257), and a plurality of placement grooves for placing defective products are provided on the upper surface of the defective product conveying tray (258).

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