CN116106221A - Automatic appearance detection equipment for semiconductor chip after welding - Google Patents

Automatic appearance detection equipment for semiconductor chip after welding Download PDF

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Publication number
CN116106221A
CN116106221A CN202211446220.8A CN202211446220A CN116106221A CN 116106221 A CN116106221 A CN 116106221A CN 202211446220 A CN202211446220 A CN 202211446220A CN 116106221 A CN116106221 A CN 116106221A
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China
Prior art keywords
sorting
section
sliding
assembly
chip
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CN202211446220.8A
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Chinese (zh)
Inventor
王孟哲
梁正南
赖勉力
李恩全
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Ningbo Jiuzong Intelligent Technology Co ltd
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Ningbo Jiuzong Intelligent Technology Co ltd
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Priority to CN202211446220.8A priority Critical patent/CN116106221A/en
Publication of CN116106221A publication Critical patent/CN116106221A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8841—Illumination and detection on two sides of object
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • General Health & Medical Sciences (AREA)
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Abstract

The invention relates to the field of chip appearance detection, in particular to automatic appearance detection equipment for a semiconductor chip after welding. The device comprises a device main body, wherein a material conveying track and a sorting assembly beside the material conveying track are arranged in the device main body, a material tray moving along the length direction of the material tray is arranged at the material conveying track, a plurality of placing grooves for placing chips are arranged at the upper end face of the material tray, a feeding section, a front visual detection section, a chip sorting section and a discharging section are sequentially formed at the material conveying track along the length direction, wherein the front visual detection section is used for front visual detection of the chips; the sorting assembly is used for sorting chips located in the chip sorting section, and the sortable range of the sorting assembly comprises the chip sorting section. The device main body can realize automatic transportation of chips; and the accuracy of the appearance detection result can be better improved through the front and back face recognition detection of the chip.

Description

Automatic appearance detection equipment for semiconductor chip after welding
Technical Field
The invention relates to the field of chip appearance detection, in particular to automatic appearance detection equipment for a semiconductor chip after welding.
Background
The semiconductor chip is a semiconductor device which is manufactured by etching and wiring a semiconductor sheet and can realize a certain function. In the production of semiconductor chips, it is necessary to solder the semiconductor chips to the case. The chip may be damaged to different degrees in the welding process; therefore, after the welding is completed, appearance detection is required to be performed on the semiconductor chip to remove defective products with quality not reaching standards.
The existing detection equipment usually uses a detection camera to sequentially carry out photographing, identifying and detecting on the chips to be detected, on one hand, the detection mode can not simultaneously carry out identifying and detecting on a plurality of chips to be detected, and the improvement of detection efficiency is restricted; on the other hand, the detection mode is difficult to quickly and efficiently identify and detect the front side and the back side of the detection chip, so that the condition that the defective products are missed and not detected possibly occurs in the detection process.
Disclosure of Invention
In order to overcome the technical problems in the prior art, the invention provides automatic appearance detection equipment for a semiconductor chip after welding;
the automatic appearance detection equipment after welding of the semiconductor chip comprises a device main body, wherein a material conveying track and a sorting assembly beside the material conveying track are arranged in the device main body, a material tray moving along the length direction of the material tray is arranged at the material conveying track, a plurality of placing grooves for placing the chip are formed at the upper end face of the material tray, a feeding section, a front visual detection section, a chip sorting section and a discharging section are sequentially formed at the material conveying track along the length direction, and the front visual detection section is used for front visual detection of the chip; the sorting assembly is used for sorting chips located in the chip sorting section, the sortable range of the sorting assembly comprises the chip sorting section, and the sorting assembly further comprises a reverse visual detection section and a bad discharge section, wherein the reverse visual detection section is arranged in the device main body and used for visual detection of the reverse surface of the chips.
The device main body can realize automatic transportation of a material tray with a plurality of chips through the material conveying track; and the accuracy of the appearance detection result can be better improved through the front and back face recognition detection of the chip, so that the condition that defects exist on the undetected face and are not detected due to single-face detection is effectively avoided.
Preferably, the device main body comprises a shell, wherein the shell comprises an upper shell and a lower shell, the material conveying track comprises a plurality of groups of first vertical plates and second vertical plates which are vertically arranged at the bottom plate of the upper shell and are parallel to each other, and the device main body also comprises a transmission belt and a transmission wheel assembly which are in transmission fit at the inner walls of two opposite sides of the first vertical plates and the second vertical plates; the bottoms of the two ends of the first vertical plate along the material conveying direction are provided with sliding assemblies, and the sliding assemblies comprise sliding guide rails which are arranged vertically to the material conveying direction; the sliding guide rail is provided with a sliding block in sliding fit with the sliding guide rail, and the upper part of the sliding block is connected with the bottom end of the first vertical plate through a connecting plate; a driving motor is arranged on one side of the first vertical plate far away from the second vertical plate, and the driving wheel assembly comprises a driving wheel connected with the output end of the driving motor and a driven wheel used for tensioning and supporting a driving belt; the upper surface of drive belt is used for placing the material dish and drives the material dish and remove along material conveying track.
In the use process of the device main body, a worker can drive the transmission belt to move through the driving motor; and, first riser and second riser can play the spacing effect of preferred material dish on the drive belt to guaranteed that the material dish can pass through front vision detection section and chip letter sorting section smoothly steadily along material conveying track.
Preferably, the side walls of the two sides of the upper shell are provided with a feed inlet and a discharge outlet, and the feeding section and the discharging section are respectively positioned at the feed inlet and the discharge outlet; and a through backflow channel is formed between the outer walls of the two sides of the lower shell along the conveying direction of the material disc, and a backflow conveying belt for conveying the empty material disc is arranged at the backflow channel, and the conveying direction of the backflow conveying belt is opposite to the conveying direction of the material conveying track.
The recycling of the material tray can be realized through the feed inlet, the discharge outlet and the reflux conveying belt.
Preferably, a first stop component and a second stop component for stopping and releasing the material disc are arranged at the material conveying track along the transmission direction of the transmission belt at intervals; the first stop assembly is arranged on the front visual detection section, and the second stop assembly is arranged on the chip sorting section; the upper side of the front vision detection section is provided with an upper camera module, and the shooting range of the upper camera module is covered with a position where the material disc is located when the first stop component stops the material disc.
The first stop assembly can ensure that the upper camera module positioned on the upper side of the front vision detection section can take enough time to shoot and scan the material disc; further, accuracy of the front visual detection result is guaranteed, and defective products are effectively prevented from being omitted. The second stop assembly can ensure that when the sorting assembly works, the material tray can keep stopping until the sorting assembly finishes sorting the detected chips and then passes through; thereby ensuring smooth and stable operation of the sorting assembly.
Preferably, the first stop assembly and the second stop assembly comprise stop modules, and the stop modules comprise photoelectric sensors and servo cylinders which are arranged on the inner wall of the second vertical plate near one side of the first vertical plate through mounting blocks; the photoelectric sensor is used for sensing a transmission track positioned on the upper side of the photoelectric sensor, and the piston rod motion of the servo cylinder is interfered with the motion of the material disc along the material conveying track.
When the photoelectric sensor senses that the upper side of the photoelectric sensor is provided with a material disc to pass through, the photoelectric sensor sends a signal to the servo cylinder, and a piston rod of the servo cylinder stretches out to stop the material disc, so that the photoelectric sensor is matched with the upper camera module and the sorting assembly to work, and the photoelectric sensor has better practicability.
Preferably, the sorting assembly comprises a manipulator rotating around the vertical direction and further comprises a material sucker moving along the height direction; the material sucker is arranged at the movable end of the manipulator and used for sucking and putting down the chip, and the contact range of the material sucker is the sorting range of the sorting assembly when the manipulator moves.
The chip can be driven to move among the chip sorting section, the reverse vision detection section and the bad discharge section through the mechanical arm and the material sucker.
Preferably, the material sucker comprises a sliding table cylinder, a mounting plate and a vacuum sucker, and the upper part of the sliding table cylinder is connected with the moving end of the manipulator; the sliding rail of the sliding table cylinder is arranged along the height direction, and the sliding table is arranged at the sliding rail and is in sliding fit with the sliding rail; the mounting plate is horizontally arranged at the lower end of the sliding table and comprises a fitting part which is fitted with the lower end of the sliding table and an extending part which extends out of the lower end of the sliding table; a plurality of sucker mounting holes are uniformly arranged at the extending part of the mounting plate along the material conveying direction, and vacuum suckers for sucking chips are arranged at the sucker mounting holes; the arrangement quantity of the sucker mounting holes and the vacuum suckers corresponds to the quantity of the placing grooves arranged in a single row in the length direction of the material tray.
The sliding table cylinder can better realize the up-and-down movement of the vacuum chuck, so that the vacuum chuck is ensured to absorb and put down the chip when the vacuum chuck moves along with the manipulator and the sliding table. In addition, the arrangement quantity of the vacuum chucks corresponds to the placing grooves at the positions of the material trays, so that the material chucks can be guaranteed to sequentially absorb chips at each row of the positions of the material trays, and sorting efficiency is improved.
Preferably, a lower camera module is arranged in the lower shell, and the lower camera module is positioned at the lower side of the reverse visual detection section; when the sorting assembly absorbs the chips and then moves to the reverse vision detection section, the reverse sides of the chips absorbed by the sorting assembly are all in the shooting range of the lower camera module.
The invention can scan and shoot the back side of the chip through the lower camera module and transmit the data to the computer, and the computer can classify the chip by matching the back side shooting scanning data of the chip with the front side detection result obtained before.
The defective discharge section department is equipped with defective discharge module, and defective discharge module includes defective products delivery track, and defective products delivery track department is equipped with rather than sliding fit's conveying component, and conveying component department is equipped with a plurality of standing grooves that are used for placing the defective products. The defective product conveying track comprises a moving platform and a screw rod module which is arranged on the lower side of the moving platform and has the same arrangement direction as the moving platform; the screw rod module comprises a servo motor, a coupler and a ball screw connected with the output end of the servo motor through the coupler; the two sides of the ball screw are provided with sliding rails arranged along defective product conveying rails, the ball screw is provided with a moving seat in sliding fit with the sliding rails, and the upper part of the moving seat is connected with a conveying assembly through a connecting block; the conveying assembly comprises a sliding plate connected with the connecting block and in sliding fit with the moving platform, and a plurality of defective product conveying discs arranged on the upper surface of the sliding plate.
The staff can control the movement of the conveying assembly through the screw rod module. Therefore, when the placing groove at the position of the single defective product conveying disc is full, the screw rod module can drive the defective product conveying disc to move to the tail end of the defective product conveying track, and the full defective product conveying disc is convenient for a worker to empty. After emptying, the worker can put the core back to the beginning of the conveying track for further use in core placement.
Drawings
Fig. 1 is a schematic structural view of a device main body in embodiment 1;
fig. 2 is a schematic view showing the internal structure of the upper case in embodiment 1;
FIG. 3 is a right side view of the schematic diagram of FIG. 2;
FIG. 4 is a schematic view showing the structure of a material conveying track in embodiment 1;
FIG. 5 is an enlarged schematic view of FIG. 4 at A;
fig. 6 is a schematic structural view of a sliding assembly in embodiment 1;
FIG. 7 is a schematic view of the stop assembly of embodiment 1;
FIG. 8 is a schematic view of the material sucker in example 1;
fig. 9 is a schematic diagram of the structure of the defective discharge module in embodiment 1;
fig. 10 is a schematic view of the structure of the return conveyor in example 1.
Detailed Description
Example 1
Referring to fig. 1-10, the embodiment provides an apparatus for automatically detecting appearance of a welded semiconductor chip, which comprises a device main body 100, wherein a material conveying track 210 and a sorting assembly arranged beside the material conveying track 210 are arranged in the device main body 100, a material tray 260 which is movably matched with the material conveying track 210 along the length direction is arranged at the material conveying track 210, a plurality of placing grooves for placing the chip are arranged at the upper end surface of the material tray 260, and a feeding section, a front visual detection section for front visual detection of the chip, a chip sorting section and a discharging section are sequentially formed at the material conveying track 210 along the length direction; the sorting assembly is used for sorting chips located in the chip sorting section, the sortable range of the sorting assembly comprises the chip sorting section, and the sorting assembly further comprises a reverse visual detection section and a defective discharge section, wherein the reverse visual detection section is arranged in the device main body 100 and used for visual detection of the reverse surface of the chips, and the defective discharge section is used for discharging defective products.
In the use process of the device main body 100 in this embodiment, a worker first places a chip to be detected in a placement groove at the material tray 260; the number of the placement slots at the tray 260 may be selected and adjusted according to the sorting assembly and the specific fit of the tray 260, so as to automatically detect a plurality of chips simultaneously during the use of the apparatus main body 100. Then, the worker can put the material tray 260 with the chips into the feeding section of the material conveying track 210; the material tray 260 reaches the front vision inspection section along the material conveying track 210 for front recognition inspection; judging whether flaws exist in the appearance of the front surface of the chip or not through a computer; compared with the prior art, the device main body 100 in this embodiment can perform automatic identification and detection on a plurality of chips at the same time, thereby preferably improving the detection efficiency.
The material tray 260 passes through the front detection section along the material transfer track 210 and then enters the chip sorting section; when the material tray 260 reaches the chip sorting section, the sorting assembly can suck the chips on the material tray 260; the sorting assembly can carry the sucked chips to the reverse visual detection section to carry out reverse recognition detection on the chips, and whether flaws exist on the reverse appearance of the chips or not is obtained through a computer. After the back surface recognition detection of the chip is finished, the computer classifies the chip into qualified products and defective products according to the front surface recognition result and the back surface recognition result of the chip; the sorting assembly can place qualified products and defective products into the blanking section and the defective discharge section respectively.
It will be appreciated that the apparatus body 100 in the present embodiment is capable of automated transportation of the tray 260 with the plurality of chips placed thereon by the material conveying rail 210 first; and the accuracy of the appearance detection result can be better improved through the front and back face recognition detection of the chip, so that the condition that defects exist on the undetected face and are not detected due to single-face detection is effectively avoided.
Specifically, as shown in fig. 1, 2, 4 and 6, the device main body 100 in this embodiment includes a housing, the housing includes an upper housing 110 and a lower housing 120, the material conveying track 210 includes a plurality of groups of first risers 211 and second risers 212 vertically disposed at a bottom plate of the upper housing 110 and parallel to each other, and further includes a driving belt 214 and a driving wheel assembly which are in driving fit at inner walls of two opposite sides of the first risers 211 and the second risers 212 and disposed in parallel to each other; the bottoms of the two ends of the first vertical plate 211 along the material conveying direction are provided with sliding assemblies 213, the sliding assemblies 213 comprise sliding guide rails 2131, and the sliding guide rails 2131 are arranged perpendicular to the material conveying direction; a sliding block 2132 which is in sliding fit with the sliding guide rail 2131 is arranged at the sliding guide rail 2131, and the upper part of the sliding block 2132 is connected with the bottom end of the first vertical plate 211 through a connecting plate 2133; a driving motor 215 is arranged on one side of the first vertical plate 211 far away from the second vertical plate 212, and the driving wheel assembly comprises a driving wheel 216 connected with the output end of the driving motor 215 and a driven wheel 217 for tensioning and supporting the driving belt 214; the upper surface of the belt 214 is used to place the tray 260 and move the tray 260 along the material delivery track 210.
Specifically, during use of the apparatus main body 100 in the present embodiment, a worker can drive the transmission belt 214 to move by driving the motor 215; in addition, the first vertical plate 211 and the second vertical plate 212 can play a better limiting role on the material tray 260 positioned on the driving belt 214, so that the material tray 260 can smoothly and stably pass through the front vision detection section and the chip sorting section along the material conveying track 210; and further, the influence on the normal operation of the front vision detection and the chip sorting work due to the error of the moving route of the material tray 260 is avoided.
In addition, the sliding block 2132 can drive the first vertical plate 211 to slide along the sliding direction thereof, so that the distance between the first vertical plate 211 and the second vertical plate 212 can be adjusted, and further, the adjustment of the material conveying track 210 is realized so as to be suitable for conveying work of material trays 260 with different sizes.
In addition, as shown in fig. 1, a feed port and a discharge port are arranged at the side walls of two sides of the upper shell 110, and a feed section and a discharge section are respectively arranged at the feed port and the discharge port; a through backflow passage is formed between the outer walls of the lower housing 120 along the conveying direction of the material tray 260, and a backflow conveying belt 130 for conveying the empty material tray 260 is arranged at the backflow passage, and the conveying direction of the backflow conveying belt 130 is opposite to the conveying direction of the material conveying rail 210.
As can be appreciated, the use of the material tray 260 can be circulated through the feed inlet, the discharge outlet and the return conveyor 130, the worker places the material tray 260 carrying the chip to be detected into the feed section from the feed inlet, and then the empty material tray 260 after the sorting is detected reaches the discharge outlet through the discharge section; at this time, the worker can transport the empty material tray 260 to the feed inlet through the reflow conveyor 130 and then load the chips to be detected, so that the recycling of the material tray 260 is realized, and the loading requirement of the chips can be met through recycling a small amount of material trays 260.
A first stop assembly and a second stop assembly for stopping and releasing the material tray 260 are arranged at the material conveying track 210 along the transmission direction of the transmission belt 214 at intervals; the first stop assembly is arranged on the front visual detection section, and the second stop assembly is arranged on the chip sorting section; the upper side of the front vision detection section is provided with an upper camera module 220, and the shooting range of the upper camera module 220 is covered with a position of the material tray 260 when the first stopping component stops the material tray 260.
The first stopping component can ensure that the material tray 260 can stop for a period of time and then pass through when the material tray 260 passes through the front visual detection section along the material conveying track 210, so that the upper camera module 220 positioned on the upper side of the front visual detection section can have enough time to shoot and scan the material tray 260; further, accuracy of the front visual detection result is guaranteed, and defective products are effectively prevented from being omitted. The second stop assembly can ensure that when the sorting assembly works, the material tray 260 can keep stopping until the sorting assembly completes sorting the detected chips and then passes through; thereby ensuring smooth and stable operation of the sorting assembly.
As shown in fig. 5 and 7, the first stop assembly and the second stop assembly each comprise a stop module 218, and the stop module 218 comprises a photoelectric sensor 2181 and a servo cylinder 2182 which are arranged on the inner wall of the second vertical plate 212 near the first vertical plate 211 through a mounting block 2183; the photoelectric sensor 2181 is used for sensing the transmission track on the upper side of the photoelectric sensor, and the piston rod motion of the servo cylinder 2182 interferes with the motion of the material tray 260 along the material conveying track 210.
When the photoelectric sensor 2181 senses that the material tray 260 passes through the upper side of the material tray, a signal is sent to the servo cylinder 2182, and a piston rod of the servo cylinder 2182 extends to stop the material tray 260, so that the material tray is matched with the upper camera module 220 and the sorting assembly to work, and the material tray has better practicability.
As shown in fig. 2, the sorting assembly includes a robot arm 230 that rotates in a vertical direction, and further includes a material suction cup 240 that moves in a height direction; the material sucker 240 is disposed at a moving end of the manipulator 230 and is used for sucking and putting down the chip, and a contact range of the material sucker 240 is a sorting range of the sorting assembly when the manipulator 230 moves.
The manipulator 230 drives the material sucker 240 to suck and sort the chips, specifically, when in use, the manipulator 230 drives the material sucker 240 to suck the chips at the chip sorting section, and after sucking, the manipulator 230 drives the material sucker 240 to move to the reverse detection section for reverse detection; after the detection is finished, the manipulator 230 drives the material sucker 240 to move to the bad discharge section, and chips classified as bad products are put down in the bad discharge section according to the classification result obtained by the computer; then the chips are moved back to the chip sorting section, and the chips classified as qualified products are placed back to the material tray 260 at the chip sorting section; the second stop assembly at the chip sorting section is then released and the tray 260 with the acceptable product moves along the material conveyor 210 to the blanking conveyor to complete the blanking.
As shown in fig. 2 and 8, the material sucker 240 includes a sliding table cylinder 241, a mounting plate 243, and a vacuum sucker 245, and the upper part of the sliding table cylinder 241 is connected with the moving end of the manipulator 230; the sliding rail 253 of the sliding table cylinder 241 is arranged along the height direction, and the sliding table 242 is arranged at the sliding rail 253 and is in sliding fit with the sliding rail 253; the mounting plate 243 is horizontally arranged at the lower end of the sliding table 242, and the mounting plate 243 comprises an attaching part attached to the lower end of the sliding table 242 and an extending part extending out of the lower end of the sliding table 242; a plurality of sucker mounting holes 244 are uniformly arranged at the extending part of the mounting plate 243 along the material conveying direction, and a vacuum sucker 245 for sucking chips is arranged at the sucker mounting holes 244; the number of the suction cup mounting holes 244 and the vacuum suction cups 245 corresponds to the number of the placement grooves arranged in a single row in the longitudinal direction of the material tray 260.
Specifically, the slide cylinder 241 can preferably realize the up-and-down movement of the vacuum chuck 245, thereby ensuring that the vacuum chuck 245 can preferably suck and put down the chip while following the movement of the robot 230 and the slide. In addition, the number of the vacuum chucks 245 corresponds to the number of the placing grooves at the material tray 260, so that the material chucks 240 can be guaranteed to sequentially suck the chips at each row of the material tray 260, and sorting efficiency is improved.
In the present embodiment, a lower camera module 310 is disposed in the lower housing 120, and the lower camera module 310 is located at the lower side of the reverse vision detection section; when the sorting assembly sucks the chip and moves to the reverse vision detection section, the reverse sides of the chip sucked by the sorting assembly are all within the shooting range of the lower camera module 310.
It can be appreciated that the lower camera module 310 can scan and shoot the back side of the chip and transmit the data to the computer, and the computer can classify the chip by matching the back side shooting scan data of the chip with the front side detection result obtained before.
As shown in fig. 9, the defective discharge section is provided with a defective discharge module 250, the defective discharge module 250 includes a defective conveying rail, a conveying assembly slidably engaged with the defective conveying rail is provided at the defective conveying rail, and a plurality of placement grooves for placing defective products are provided at the conveying assembly. The defective product conveying track comprises a moving platform 259 and a screw rod module which is arranged on the lower side of the moving platform 259 and has the same arrangement direction with the moving platform 259; the screw rod module comprises a servo motor 251, a coupler 252 and a ball screw 254 connected with the output end of the servo motor 251 through the coupler 252; slide rails 253 arranged along defective product conveying tracks are arranged on two sides of the ball screw 254, a movable seat 255 in sliding fit with the slide rails 253 is arranged at the ball screw 254, and a conveying assembly is connected to the upper part of the movable seat 255 through a connecting block 256; the transport assembly includes a slider plate 257 connected to the connection block 256 and slidably engaged with the moving platform 259, and a plurality of defective transport trays 258 provided at the upper surface of the slider plate 257.
Specifically, the movement of the conveying assembly can be controlled by a worker through the screw module. Therefore, when the placing groove at the position of the single defective product conveying disc 258 is full, the screw rod module can drive the defective product conveying disc 258 to move to the tail end of the defective product conveying track, and the full defective product conveying disc 258 is conveniently emptied by workers. After emptying, the worker can put the core back to the beginning of the conveying track for further use in core placement.
For a further understanding of the present invention, the present invention will be described in detail with reference to the drawings and examples. It is to be understood that the examples are illustrative of the present invention and are not intended to be limiting.
It is to be understood that, based on one or several embodiments provided herein, those skilled in the art may combine, split, reorganize, etc. the embodiments of the present application to obtain other embodiments, which do not exceed the protection scope of the present application.
The invention and its embodiments have been described above by way of illustration and not limitation, and the invention is illustrated in the accompanying drawings and described in the drawings in which the actual structure is not limited thereto. Therefore, if one of ordinary skill in the art is informed by this disclosure, the structural mode and the embodiments similar to the technical scheme are not creatively designed without departing from the gist of the present invention.

Claims (10)

1. Appearance automated inspection equipment behind semiconductor chip welding, its characterized in that: the device comprises a device main body (100), wherein a material conveying track (210) and a sorting assembly arranged beside the material conveying track (210) are arranged in the device main body (100), a material disc (260) which is matched with the material conveying track (210) in a moving way along the length direction of the material conveying track is arranged at the material conveying track, a plurality of placing grooves for placing chips are arranged at the upper end face of the material disc (260), and a feeding section, a front visual detection section for front visual detection of the chips, a chip sorting section and a discharging section are sequentially formed at the material conveying track (210) along the length direction; the sorting assembly is used for sorting chips located in the chip sorting section, the sorting range of the sorting assembly comprises the chip sorting section, and the sorting assembly further comprises a reverse side visual detection section and a bad discharge section, wherein the reverse side visual detection section is arranged in the device main body (100) and used for visual detection of the reverse side of the chips.
2. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 1, wherein: the device main body (100) comprises a shell, wherein the shell comprises an upper shell (110) and a lower shell (120), the material conveying track (210) comprises a plurality of groups of first vertical plates (211) and second vertical plates (212) which are vertically arranged at the bottom plate of the upper shell (110) and are parallel to each other, and the device main body also comprises a transmission belt (214) and a transmission wheel assembly which are in transmission fit at the inner walls of two opposite sides of the first vertical plates (211) and the second vertical plates (212) in parallel; the bottoms of the two ends of the first vertical plate (211) along the material conveying direction are provided with sliding assemblies (213), the sliding assemblies (213) comprise sliding guide rails (2131), and the sliding guide rails (2131) are arranged perpendicular to the material conveying direction; a sliding block (2132) which is in sliding fit with the sliding guide rail (2131) is arranged at the sliding guide rail, and the upper part of the sliding block (2132) is connected with the bottom end of the first vertical plate (211) through a connecting plate (2133); a driving motor (215) is arranged on one side of the first vertical plate (211) far away from the second vertical plate (212), and the driving wheel assembly comprises a driving wheel (216) connected with the output end of the driving motor (215) and a driven wheel used for tensioning and supporting the driving belt (214); the upper surface of the driving belt (214) is used for placing the material tray (260) and driving the material tray (260) to move along the material conveying track (210).
3. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 2, wherein: the side walls of the two sides of the upper shell (110) are provided with a feed inlet and a discharge outlet, and the feed section and the discharge section are respectively positioned at the feed inlet and the discharge outlet; a through backflow channel is formed between the outer walls of the two sides of the lower shell (120) along the conveying direction of the material tray (260), a backflow conveying belt (130) for conveying the empty material tray (260) is arranged at the backflow channel, and the conveying direction of the backflow conveying belt (130) is opposite to the conveying direction of the material conveying track (210).
4. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 2, wherein: a first stop component and a second stop component for stopping the material disc (260) are arranged at the material conveying track (210) along the transmission direction of the transmission belt (214) at intervals; the first stop assembly is arranged on the front visual detection section, and the second stop assembly is arranged on the chip sorting section; an upper camera module (220) is arranged on the upper side of the front vision detection section, and the shooting range of the upper camera module (220) is covered with the position of the material disc (260) when the first stop component stops the material disc (260).
5. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 4, wherein: the first stop assembly and the second stop assembly comprise stop modules (218), and the stop modules (218) comprise photoelectric sensors (2181) and servo cylinders (2182) which are arranged on the inner wall of one side of the second vertical plate (212) close to the first vertical plate (211) through mounting blocks (2183); the photoelectric sensor (2181) is used for sensing a transmission track on the upper side of the photoelectric sensor, and the piston rod motion of the servo cylinder (2182) is interfered with the motion of the material tray (260) along the material conveying track (210).
6. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 1, wherein: the sorting assembly comprises a manipulator (230) rotating around the vertical direction and also comprises a material sucker (240) moving along the height direction; the material sucker (240) is arranged at the moving end of the manipulator (230) and is used for sucking and putting down the chip, and the contact range of the material sucker (240) is the sorting range of the sorting assembly when the manipulator (230) moves.
7. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering as claimed in claim 6, wherein: the material sucker (240) comprises a sliding table cylinder (241), a mounting plate (243) and a vacuum sucker (245), and the upper part of the sliding table cylinder (241) is connected with the moving end of the manipulator (230); the sliding rail (253) of the sliding table cylinder (241) is arranged along the height direction, and the sliding table (242) is arranged at the sliding rail (253) and is in sliding fit with the sliding rail (253); the mounting plate (243) is horizontally arranged at the lower end of the sliding table (242), and the mounting plate (243) comprises a fitting part which is fitted with the lower end of the sliding table (242) and an extending part which extends out of the lower end of the sliding table; a plurality of sucker mounting holes (244) are uniformly arranged at the extending part of the mounting plate (243) along the material conveying direction, and a vacuum sucker (245) for sucking chips is arranged at the sucker mounting holes (244); the arrangement number of the sucker mounting holes (244) and the vacuum suckers (245) corresponds to the number of the placing grooves arranged in a single row in the length direction of the material tray (260).
8. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 2, wherein: a lower camera module (310) is arranged in the lower shell (120), and the lower camera module (310) is positioned at the lower side of the reverse vision detection section; when the sorting assembly absorbs the chips and then moves to the reverse vision detection section, the reverse sides of the chips absorbed by the sorting assembly are all in the shooting range of the lower camera module (310).
9. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 1, wherein: the defective discharge section is provided with a defective discharge module (250), the defective discharge module (250) comprises a defective product conveying track, the defective product conveying track is provided with a conveying assembly in sliding fit with the defective product conveying track, and the conveying assembly is provided with a plurality of placing grooves for placing defective products.
10. The apparatus for automatically detecting the appearance of a semiconductor chip after soldering according to claim 9, wherein: the defective product conveying track comprises a moving platform (259) and a screw rod module which is arranged on the lower side of the moving platform (259) and has the same arrangement direction with the moving platform (259); the screw rod module comprises a servo motor (251) and a coupler (252), and also comprises a ball screw (254) connected with the output end of the servo motor (251) through the coupler (252); slide rails (253) arranged along defective product conveying tracks are arranged on two sides of the ball screw (254), a moving seat (255) which is in sliding fit with the slide rails (253) is arranged at the ball screw (254), and a conveying assembly is connected to the upper part of the moving seat (255) through a connecting block (256); the conveying assembly comprises a sliding plate (257) connected with the connecting block (256) and in sliding fit with the moving platform (259), and a plurality of defective product conveying discs (258) arranged on the upper surface of the sliding plate (257), wherein a plurality of placing grooves used for placing defective products are formed in the upper surface of the defective product conveying discs (258).
CN202211446220.8A 2022-11-18 2022-11-18 Automatic appearance detection equipment for semiconductor chip after welding Pending CN116106221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211446220.8A CN116106221A (en) 2022-11-18 2022-11-18 Automatic appearance detection equipment for semiconductor chip after welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211446220.8A CN116106221A (en) 2022-11-18 2022-11-18 Automatic appearance detection equipment for semiconductor chip after welding

Publications (1)

Publication Number Publication Date
CN116106221A true CN116106221A (en) 2023-05-12

Family

ID=86266465

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211446220.8A Pending CN116106221A (en) 2022-11-18 2022-11-18 Automatic appearance detection equipment for semiconductor chip after welding

Country Status (1)

Country Link
CN (1) CN116106221A (en)

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