CN116104845A - Uniform ventilation speed reduction structure and wafer conveying box - Google Patents

Uniform ventilation speed reduction structure and wafer conveying box Download PDF

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Publication number
CN116104845A
CN116104845A CN202310387277.3A CN202310387277A CN116104845A CN 116104845 A CN116104845 A CN 116104845A CN 202310387277 A CN202310387277 A CN 202310387277A CN 116104845 A CN116104845 A CN 116104845A
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China
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air
buffer channel
buffer
air inlet
opening
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CN202310387277.3A
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CN116104845B (en
Inventor
刘浩
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/02—Influencing flow of fluids in pipes or conduits
    • F15D1/025—Influencing flow of fluids in pipes or conduits by means of orifice or throttle elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
    • F16K17/20—Excess-flow valves
    • F16K17/34—Excess-flow valves in which the flow-energy of the flowing medium actuates the closing mechanism
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems
    • F16L55/02—Energy absorbers; Noise absorbers
    • F16L55/027—Throttle passages
    • F16L55/02736—Throttle passages using transversal baffles defining a tortuous path
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/20—Arrangements or systems of devices for influencing or altering dynamic characteristics of the systems, e.g. for damping pulsations caused by opening or closing of valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)

Abstract

The present disclosure relates to a uniform ventilation and deceleration structure and a wafer transfer box, and relates to the technical field of semiconductors, the uniform ventilation and deceleration structure comprises: buffer channel and labyrinth turbulence structure; one end of the buffer channel is provided with an air inlet, and the other end extends to a position to be ventilated; the labyrinth turbulence structure comprises a valve movably connected with the air inlet and a baffle fixedly connected with the buffer channel, an adjustable first opening is formed between the valve and the inner wall of the buffer channel, and the baffle blocks air flow entering the buffer channel through the first opening from flowing to the position to be ventilated. The flow of the air flow after passing through the air inlet is disturbed and blocked through the labyrinth turbulence structure, so that the flow of the air flow is blocked and changed in direction, the purpose of reducing the air flow speed is achieved, the possibility of dust raising caused by overlarge air blowing of the air flow speed on a wafer is reduced, and the risk that dust raising is caused by nitrogen gas is introduced and then the subsequent manufacturing process is reduced.

Description

Uniform ventilation speed reduction structure and wafer conveying box
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a uniform ventilation and deceleration structure and a wafer transfer box.
Background
Currently, according to the process requirements, the process requirements of part of the products require that the products are reduced to be in contact with air, and the wafer transfer box is introduced with nitrogen after being loaded into the machine, so that the air pressure in the wafer transfer box is higher than the air pressure of the machine atmospheric module.
The disadvantages of the prior art are: the internal air pressure of the wafer transfer box is required to be high, the preset pressure is required to be reached in a short time, and dynamic balance is maintained, so that the nitrogen gas pressure needs to be supplied to the wafer transfer box, the flow rate of the nitrogen gas is high, and the risk of influencing the process due to dust formation is caused.
Disclosure of Invention
The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of the claims.
To overcome the problems in the related art, the present disclosure provides a uniform ventilation and deceleration structure and a wafer transfer cassette.
In a first aspect of embodiments of the present disclosure, there is provided a uniform ventilation and deceleration structure, the uniform ventilation and deceleration structure including: buffer channel and labyrinth turbulence structure; one end of the buffer channel is provided with an air inlet, and the other end extends to a position to be ventilated; the labyrinth turbulence structure comprises a valve movably connected with the air inlet and a baffle fixedly connected with the buffer channel, an adjustable first opening is formed between the valve and the inner wall of the buffer channel, and the baffle blocks air flow entering the buffer channel through the first opening from flowing to the position to be ventilated.
According to some embodiments of the disclosure, the first opening is closed when the gas inlet is not passing through, and the opening degree of the first opening is proportional to the flow rate of the gas flow passing through the gas inlet.
According to some embodiments of the disclosure, a second opening for air flow to pass through is formed between the top end of the baffle and the inner wall of the buffer channel, and the first opening and the second opening are staggered in the length direction of the buffer channel.
According to some embodiments of the disclosure, the valve comprises a door plate hinged to the air inlet, and the rotation axis of the door plate is arranged at an angle with the direction of air flow through the air inlet.
According to some embodiments of the disclosure, an elastic member for driving the door plate to rotate and then covering the first opening is disposed in the buffer channel.
In a second aspect of the disclosed embodiments, a wafer transfer box is provided, where the wafer transfer box includes a box body and an air inlet provided on the box body, the air inlet is communicated with the air inlet, the foregoing uniform ventilation and speed reduction structure is built in the box body, multiple sub-transfer layers are separated in the box body, and each sub-transfer layer corresponds to a buffer channel.
According to some embodiments of the disclosure, the buffer channels are distributed in a stepwise manner, and the air inlets are distributed in a vertical direction along an oblique direction.
According to some embodiments of the present disclosure, two ends of the air inlet are located at the inner side and the outer side of the box body respectively, and the inner diameter of the air inlet from one end located at the inner side of the box body to one end of the air inlet located at the outer side of the box body is gradually reduced.
According to some embodiments of the present disclosure, a filter element is fixedly connected to the cartridge body, wherein the filter element is communicated with the air inlet and is used for blocking the flow of the air entering the cartridge body through the air inlet.
According to some embodiments of the present disclosure, a buffer plate is provided inside the case, and a buffer hole through which the air flow passes is provided on the buffer plate, and the buffer plate is located on a flow path of the air flow flowing to the sub-transmission layer through the buffer channel.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: the flow of the airflow after passing through the air inlet is disturbed and blocked by the labyrinth turbulence structure, so that the flow of the airflow is blocked and changed in direction, the purpose of reducing the flow speed of the airflow is achieved, the possibility of dust raising caused by overlarge blowing of the flow speed of the airflow on a wafer is reduced, and the risk of dust raising caused by gas introduction and subsequent manufacturing process is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. Other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic diagram illustrating a structure of a uniform ventilation and deceleration structure when not in operation, according to an exemplary embodiment.
FIG. 2 is a schematic diagram illustrating an operational state representing a uniform ventilation deceleration structure, according to an exemplary embodiment.
Fig. 3 is a schematic diagram showing baffle distribution positions according to another exemplary embodiment.
FIG. 4 is a schematic diagram illustrating a uniform ventilation deceleration structure in a stacked use condition, according to an example embodiment.
Fig. 5 is a schematic diagram showing a structure of a wafer cassette according to an exemplary embodiment.
FIG. 6 is a schematic diagram showing the position of a buffer plate, according to an example embodiment.
Fig. 7 is a schematic diagram illustrating a buffer plate structure according to an exemplary embodiment.
Fig. 8 is a schematic view showing a structure of a cassette in which buffer channels are arranged in a stepwise manner according to another exemplary embodiment.
Fig. 9 is a schematic diagram showing a structure of a filter cartridge according to an exemplary embodiment.
1. A buffer channel; 11. an air inlet; 12. a first opening; 13. a second opening; 2. a labyrinth turbulence structure; 21. a valve; 211. a door panel; 212. an elastic member; 22. a baffle; 3. a buffer plate; 31. buffering holes; 4. a case body; 41. an air duct; 42. an air inlet; 43. a sub-transport layer; 431. a wafer; 5. a filter element; 51. a vent hole; 6. a venting channel; 61. and a gas leakage port.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure. It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be arbitrarily combined with each other.
As described in the background art, the pressure requirement of the wafer cassette is high, and the preset pressure is reached in a short time and the dynamic balance is maintained, so that a large nitrogen pressure needs to be supplied to the wafer cassette, which results in a high nitrogen flow rate, and the risk of affecting the process due to dust formation is generated.
The utility model provides a uniform ventilation deceleration structure and wafer conveying box based on this, through the maze vortex structure to the flow of the air current after the air inlet disturbed the hindrance, make the flow of this part air current obstructed and change the direction, reach the purpose that reduces the gas velocity of flow, reduce the too big jetting of gas velocity of flow and cause the possibility of dust on the wafer, reduced because the nitrogen gas lets in and cause the dust and then bring the risk for follow-up processing head.
In an exemplary embodiment of the present disclosure, a uniform ventilation and deceleration structure and a wafer cassette are provided, as shown in fig. 1, fig. 1 is a schematic structural diagram illustrating a case where the uniform ventilation and deceleration structure is not operated according to an exemplary embodiment; FIG. 2 is a schematic diagram illustrating an operational state representing a uniform ventilation deceleration structure, according to an example embodiment; FIG. 3 is a schematic diagram showing baffle distribution locations, according to another exemplary embodiment; FIG. 4 is a schematic diagram illustrating a uniform ventilation deceleration structure in a stacked use condition, according to an example embodiment; fig. 5 is a schematic diagram illustrating a structure of a wafer cassette according to an exemplary embodiment; FIG. 6 is a schematic diagram showing the position of a buffer plate, according to an example embodiment; FIG. 7 is a schematic diagram illustrating a buffer plate structure, according to an example embodiment; FIG. 8 is a schematic diagram showing a configuration of a wafer cassette showing a buffer channel being distributed in a stepwise manner according to another exemplary embodiment; fig. 9 is a schematic diagram showing a structure of a filter cartridge according to an exemplary embodiment.
The following description is given for the purpose of facilitating understanding of the present embodiment by those skilled in the art, and is not intended to limit the scope of the present invention to the particular embodiments described below.
Referring to fig. 1 and 2, an exemplary embodiment of the present disclosure provides a uniform ventilation and deceleration structure, including: a buffer channel 1 and a labyrinth turbulence structure 2; one end of the buffer channel 1 is provided with an air inlet 11, and the other end extends to a position to be ventilated; the labyrinth turbulence structure 2 is disposed in the buffer channel 1, and the labyrinth turbulence structure 2 is used for blocking the directional flow of the air inlet 11 to the position to be ventilated and enabling the air flow to the position to be ventilated in a disordered free diffusion manner.
Illustratively, referring to fig. 1 and 2, the buffer channel 1 is cylindrical in shape, and an air flow enters the inside of the buffer channel 1 through the air inlet 11 of the buffer channel 1 and exits the buffer channel 1 through the other end of the buffer channel 1. The labyrinth turbulence structure 2 is built in the interior of the damper passage 1 and is located on the airflow path through the interior of the damper passage 1. The labyrinth turbulence structure 2 comprises a plurality of structural components for blocking the flow of the air flow in the buffer channel 1, when the air flow entering the buffer channel 1 flows through the structural components of the labyrinth turbulence structure 2, the labyrinth turbulence structure 2 forces the air flow to change the flow direction and the flow path, the air flow blocked by the flow can block the normal flow of the air flow subsequently entering the buffer channel 1, the flow speed of the air flow in the buffer channel 1 is further reduced, and the air flow with reduced flow speed is introduced into the position to be ventilated through the other end of the buffer channel 1 in a disordered diffusion mode in the buffer channel 1.
In this embodiment, one end of the buffer channel 1 is used for air intake, and the other end extends to a position to be ventilated, for example, a storage platform, a closed space or an open space at the air outlet end of the buffer channel 1. When the gas with a certain speed enters the buffer channel 1 through one end of the buffer channel 1 under the action of pressure, the flow of the gas can impact on the labyrinth turbulence structure 2, and the labyrinth turbulence structure 2 is fixedly connected with the buffer channel 1, so that the flow speed of the gas can be reduced while the gas in the flow is borne by the labyrinth turbulence structure 2, the gas which is slowed down by the labyrinth turbulence structure 2 can play a certain role in blocking the gas flow which subsequently enters the buffer channel 1, so that the flow speed of the gas which subsequently enters the buffer channel 1 is reduced, and the gas is further slowed down after contacting the labyrinth turbulence structure 2 in the buffer channel 1, so that the flow speed of the gas which enters the buffer channel 1 is reduced, and the gas which is blocked by the labyrinth turbulence structure 2 enters the position to be ventilated through the other end of the buffer channel 1 in a disordered diffusion mode, thereby reducing the possibility of dust emission caused by the excessive gas flow speed and reducing the risk brought to the subsequent manufacture.
In other embodiments, the buffer channel 1 may be of other shapes, for example, the buffer channel 1 may be provided in a bent tube shape having a bent section, and the flow rate of the air flow entering the inside of the buffer channel 1 through the air inlet 11 is reduced by the bent section of the buffer channel 1. Or the buffer channel 1 is provided with a shape of a tee joint, a four-way joint and other multiple outlets, so that the purpose that air flows through one air inlet 11 into the buffer channel 1 and is simultaneously supplied to a plurality of positions to be ventilated is achieved.
In an exemplary embodiment of the present disclosure, referring to fig. 1 and 2, the labyrinth turbulence structure 2 includes a valve 21 movably connected to the air inlet 11 and a baffle 22 fixedly connected to the buffer channel 1, an adjustable first opening 12 is formed between the valve 21 and an inner wall of the buffer channel 1, and the baffle 22 blocks an air flow entering the buffer channel 1 through the first opening 12 from flowing to a position to be ventilated.
Illustratively, the valve 21 is fixed at the air inlet 11 of the buffer channel 1, the first opening 12 is opened and closed by opening and closing the valve 21, and the opening size is changed by the opening degree of the valve 21. The baffle 22 is fixedly connected to the inner wall of the buffer channel 1, the baffle 22 is perpendicular to the length direction of the buffer channel 1, the baffle 22 is opposite to the first opening 12, and after the valve 21 is opened, air flow entering the buffer channel 1 through the first opening 12 is blown to the baffle 22 and is blocked by the baffle 22.
In this embodiment, when the external air flows to the air inlet 11 of the buffer channel 1, the flowing air impacts the valve 21 and opens the valve 21, the first opening 12 is opened, the air flow flows through the valve 21 into the buffer channel 1 through the first opening 12, the air flow is blocked by the baffle 22 when flowing to the baffle 22 in the buffer channel 1, the air flow changes the flow direction and path while the speed is reduced, and further decreases the speed and changes the flow direction after being blocked by the inner wall of the buffer channel 1; the subsequent air flow through the air inlet 11 and the first opening 12 collides with and mixes with the air flow inside the damper passage 1, and the flow velocity is reduced before contact with the damper 22, and further reduced after contact with the damper 22. The air in the buffer channel 1 is reduced in flow speed under the actions of the obstruction of the baffle 22, the obstruction of the inner wall of the buffer channel 1 and the obstruction of the air flow in front, the flowing direction is changed, along with the continuous introduction of the air in the buffer channel 1, the air after the flow speed is reduced is pushed by the air introduced in the follow-up to bypass the baffle 22 to enter the position to be ventilated through the other port of the buffer channel 1, and compared with the air flow directly sprayed to the position to be ventilated, the air flow after the speed and the direction of the air flow are reduced through the buffer channel 1 and the labyrinth turbulence structure 2, the possibility of dust emission caused by overlarge air flow speed is reduced, and the risk of dust emission and subsequent manufacturing procedure caused by nitrogen introduction is reduced.
It should be understood that the labyrinth turbulence structure 2 described above includes only one baffle 22, and in other embodiments, there may be a plurality of baffles 22, for example, two baffles 22 are disposed at intervals along the length direction of the buffer channel 1, so as to further separate the inner space of the buffer channel 1, thereby improving the deceleration effect on the air flow, referring to fig. 3. In the case of two or more baffles 22, the height of the baffles 22 may be different from each other, for example, the height of the baffles 22 in the direction close to the air inlet 11 may be lower than the height of the other baffles 22 to exert a stepped deceleration effect on the air flow entering the buffer channel 1. The shape of the baffle 22 may be a flat plate, a cambered surface, or a bent wavy or corrugated paper shape.
In an exemplary embodiment of the present disclosure, referring to fig. 1 and 2, when the gas inlet 11 is not passing through, the first opening 12 is closed, and the opening degree of the first opening 12 is proportional to the flow rate of the gas flow passing through the gas inlet 11.
Illustratively, referring to fig. 1 and 2, the top end of the valve 21 is fixed to the buffer channel 1, and the first opening 12 is formed between the bottom end of the valve 21 and the inner wall of the buffer channel 1. When the external air flow reaches the air inlet 11 and impinges on the valve 21, the valve 21 is opened under the impingement of the air flow, and the first opening 12 becomes larger along with the opening of the valve 21, i.e. the larger the flow velocity of the air flow is, the larger the impingement of the valve 21 is, the larger the opening degree of the valve 21 is, and the larger the opening degree of the first opening 12 is. When the external air flow stops flowing, the valve 21 at the air inlet 11 is not impacted by the air flow, after the valve 21 is closed, the gap between the bottom end of the valve 21 and the inner wall of the buffer channel 1 disappears, and the first opening 12 is closed.
In this embodiment, the larger the flow rate of the external air, the larger the volume of air blown from the air blowing source to the air inlet 11 in a unit time, which requires the larger first opening 12 to allow the air at the air inlet 11 to flow through the buffer channel 1 to the position to be ventilated at the other end of the buffer channel 1. Through the degree of opening of the valve 21 and the gas flow rate at the gas inlet 11 are related, when the gas flow rate at the gas inlet 11 is larger, the first opening 12 can meet the requirement that the gas enters the buffer channel 1 at a larger degree of opening, and meanwhile, the larger first opening 12 can reduce the flow rate of the gas flowing through the first opening 12 relative to the smaller first opening 12, namely, the flow rate of the gas entering the buffer channel 1 is reduced, the possibility of dust emission caused by overlarge gas flow rate is reduced, and the risk brought by dust emission caused by nitrogen gas introduction to subsequent processes is reduced.
In an exemplary embodiment of the present disclosure, referring to fig. 2 and 3, a second opening 13 through which the air flow passes is formed between the top end of the baffle 22 and the inner wall of the buffer channel 1.
Illustratively, referring to fig. 2 and 3, the bottom end of the baffle 22 is fixed to the bottom side inner wall of the buffer channel 1, the side wall of the baffle 22 is fixed to the inner side wall of the buffer channel 1, and the second opening 13 is formed between the top end of the baffle 22 and the top inner wall of the buffer channel 1. The gas entering the interior of the buffer channel 1 through the gas inlet 11 and the first opening 12, after being blocked by the baffle 22, flows through the second opening 13 around the baffle 22 to the position to be ventilated at the other end of the buffer channel 1.
In this embodiment, the second opening 13 provides a passage for the gas blocked from flowing by the baffle 22 to continue to flow toward the other end of the buffer passage 1, so that the gas in the buffer passage 1 between the baffle 22 and the valve 21 can flow to the position to be ventilated after decelerating, and provide a buffer space for the gas that subsequently enters the buffer passage 1 through the gas inlet 11 and the first opening 12.
It should be understood that the above-mentioned fixed connection between the baffle 22 and the inner wall of the buffer channel 1 is only a specific embodiment, and in other embodiments, the baffle 22 may be inserted into a groove adapted in the buffer channel 1, or adhered to the inner wall of the buffer channel 1, and the purpose of changing the size of the second opening 13 is achieved by sliding the baffle 22 or replacing the baffle 22, so as to adjust the flow rate of the gas flowing to the position to be ventilated.
In other embodiments, in the case where a plurality of baffles 22 are disposed in the buffer channel 1, referring to fig. 3, there are two second openings 13, and the sizes of the two second openings 13 are different according to the sizes of the corresponding baffles 22. Similarly, the second opening 13 is not necessarily formed and exists only between the top end of the baffle plate 22 and the top inner wall of the buffer channel 1, and when the top end of the baffle plate 22 is fixedly connected to the top of the buffer channel 1 while a gap is left between the bottom end of the baffle plate 22 and the bottom inner wall of the buffer channel 1, the second opening 13 is formed and exists between the bottom end of the baffle plate 22 and the bottom inner wall of the buffer channel 1.
In an exemplary embodiment of the present disclosure, referring to fig. 2 and 4, the first openings 12 and the second openings 13 are staggered in the length direction of the buffer channel 1.
Illustratively, the first openings 12 are formed and exist between the bottom end of the valve 21 and the inner wall of the buffer channel 1, and the second openings 13 are formed and exist between the top end of the baffle 22 and the inner wall of the buffer channel 1, that is, the first openings 12 and the second openings 13 are staggered in the length direction of the buffer channel 1 with reference to the central axis of the buffer channel 1.
In this embodiment, the first openings 12 and the second openings 13 are staggered, so that the air flow passing through the air inlet 11 and the first openings 12 is directly blown onto the baffle 22, and the baffle 22 can play the roles of blocking the air flow and changing the air flow direction, so that the air flow rate in the buffer channel 1 is reduced, and the air flows at a lower speed to the position to be ventilated, which is communicated with the other end of the buffer channel 1 through the second openings 13. The first openings 12 and the second openings 13 which are distributed in a staggered way can reduce the possibility that the air flow is directly blown to the position to be ventilated through the second openings 13 after passing through the air inlet 11 and the first openings 12, reduce the possibility of dust emission caused by overlarge air flow rate, and reduce the risk of dust emission caused by nitrogen gas introduction and further brought to the subsequent manufacturing process.
It should be understood that the above-described positional relationship of the first opening 12 and the second opening 13 may also be: the first opening 12 exists between the top end of the valve 21 and the top inner wall of the buffer channel 1, and the second opening 13 exists between the bottom end of the baffle 22 and the bottom inner wall of the buffer channel 1. Similarly, as the number of baffles 22 in the buffer channel 1 increases, the second openings 13 formed between different baffles 22 and the inner wall of the buffer channel 1 may also be staggered along the length direction of the buffer channel 1.
In other embodiments, the maximum height of the first opening 12 is equal to the height of the baffle 22. When the opening degree of the valve 21 is increased to a level that the height of the first opening 12 exceeds the height of the baffle 22, part of the air flow passing through the first opening 12 directly passes through the baffle 22 to be blown to the position to be ventilated at the other end of the buffer channel 1, the speed reducing effect of the baffle 22 fails, dust is easily formed at the position to be ventilated, and the subsequent process is influenced. When the maximum height of the first opening 12 is equal to the height of the baffle 22 (or the maximum height of the first opening 12 does not exceed the height of the baffle 22), the baffle 22 can provide a complete and stable blocking effect for the air flow entering the buffer channel 1 through the first opening 12, reduce the air flow rate, reduce the possibility of dust emission caused by overlarge air flow rate, and reduce the risk of dust emission caused by nitrogen gas introduction and further brought to the subsequent process.
In an exemplary embodiment of the present disclosure, referring to fig. 2, the valve 21 includes a door plate 211 hinged to the air inlet 11, and a rotation axis of the door plate 211 is disposed at an angle to a direction of air flow through the air inlet 11.
Illustratively, the top side of the door 211 is hinged to the inner wall of the buffer channel 1, when no airflow at the air inlet 11 impacts the door 211, the door 211 is vertically disposed under the action of gravity, and at this time, the bottom side of the door 211 abuts against the bottom inner wall of the buffer channel 1 to close the first opening 12.
In this embodiment, the door plate 211 cooperates with its own gravity to play the effect of the valve 21, when the external air flow impacts onto the door plate 211, the door plate 211 is forced to deflect towards the inside of the buffer channel 1, a first opening 12 through which the air flow passes is formed between the bottom side of the door plate 211 and the inner wall of the bottom side of the buffer channel 1, and as the flow rate of the external air increases, the stress of the door plate 211 becomes larger, the deflection angle of the door plate 211 increases, the first opening 12 increases, so that the external air flow can smoothly enter the buffer channel 1, and the increased first opening 12 can reduce the flow rate of the air passing through the first opening 12, and cooperate with the obstruction of the subsequent baffle 22 and the inner wall of the buffer channel 1, so that the flow rate of the air flowing to the position to be ventilated at the other end of the buffer channel 1 is reduced, the possibility of dust caused by overlarge air flow rate is reduced, and the risk caused by dust raising due to nitrogen gas inlet is reduced.
In an exemplary embodiment of the present disclosure, referring to fig. 4 and 5, the rotation axis of the door panel 211 is perpendicular to the direction of the air flow through the air inlet 11.
Illustratively, the length direction of the buffer channel 1 is y, the length direction of the rotation axis of the door plate 211 is x, and when no air passes through the buffer channel 1, the door plate 211 is vertically suspended and arranged along the z direction, wherein the x direction is perpendicular to the y direction and is perpendicular to the z direction at the same time, and the y direction is perpendicular to the z direction.
In this embodiment, a side of the door panel 211 facing away from the buffer channel 1 is a windward side, and the windward side of the door panel 211 is a plane for bearing the impact of external air flow. The air current flows to the position of waiting to take a breath of the other end intercommunication of buffer channel 1 through air inlet 11 along buffer channel 1 length direction, and the door plant 211 that perpendicular to buffer channel 1 length direction set up can provide the windward side that receives the air current impact, can be simultaneously the impact force conversion of air current to the power of door plant 211 pivoted of a greater degree for the size of first opening 12 and opening and close all can be along with the stable change of gas velocity of flow change, has improved the operational stability of device.
In an exemplary embodiment of the present disclosure, referring to fig. 2, an elastic member 212 for covering the first opening 12 after driving the door 211 to rotate is provided in the buffer channel 1.
Illustratively, the elastic member 212 is a torsion spring (not shown in the drawings), one end of the torsion spring is fixedly connected with the door plate 211, and the other end of the torsion spring is fixedly connected with the inner wall entity of the buffer channel 1, when the torsion spring is in a natural state, the door plate 211 is in a vertical suspension shape with the bottom side abutting against the bottom inner wall of the buffer channel 1.
In this embodiment, the elastic member 212 is used to increase the opening difficulty of the door panel 211, under the condition of larger flow rate of external air, the purpose of adjusting the size of the first opening 12 along with the flow rate of air is difficult to achieve by only relying on the dead weight of the door panel 211, and the added elastic member 212, such as a torsion spring, can increase the resistance applied when the door panel 211 rotates, i.e. increase the difficulty of increasing the first opening 12, is suitable for the condition of larger flow rate of external air, and can make the door panel 211 fall back to a vertical shape more stably, so that the first opening 12 is closed.
The embodiment of the disclosure further provides a wafer transfer box, referring to fig. 4 and 5, the wafer transfer box includes a box body 4 and an air inlet 42 opened on the box body 4, the foregoing uniform ventilation and speed reduction structure is built in the box body 4, the air inlet 42 is communicated with the air inlet 11, a plurality of sub-transfer layers 43 are separated in the box body 4, and each sub-transfer layer 43 corresponds to a buffer channel 1.
For example, referring to fig. 4 and 5, the sub-transport layers 43 have multiple layers, each sub-transport layer 43 has a wafer 431 disposed therein, the wafer 431 is suspended in the sub-transport layer 43, the sub-transport layers 43 are vertically stacked and distributed, and a plurality of buffer channels 1 are disposed correspondingly. The air inlets 42 are arranged at two opposite sides on the bottom wall of the box body 4, the two air inlets 42 are respectively arranged at two opposite sides on the bottom wall of the box body 4, one end of the air duct 41 is fixedly connected to the inner wall of the box body 4 at the position of the air inlet 42 and is communicated with the air inlet 42, the other end of the air duct is opened and is arranged towards the inside of the box body 4, one end of the air inlet 11 of the buffer channel 1 faces towards the inside of the box body 4, the other end of the buffer channel 1 is fixedly connected and communicated with the front end of the corresponding one-layer sub-conveying layer 43, and air flows sequentially enter the box body 4 through the air inlets 42 and the air duct 41 and finally flow into the sub-conveying layer 43 after passing through the buffer channel 1.
In this embodiment, the inside of the wafer transfer box needs to have a higher air pressure than the production environment, so that the inside of the wafer transfer box needs to be filled with a pressurized air, and the pressurized air flows to the wafer placement position communicated with the other end of the buffer channel 1 after being sequentially introduced into the box body 4 through the air inlet 42 and the air duct 41, and then is slowed down through the door plate 211 and the baffle plate 22 in the buffer channel 1. The design reduces the gas flow rate at the position to be ventilated, which is communicated with the other end of the buffer channel 1, and as each sub-transmission layer 43 is provided with the buffer channel 1 corresponding to the buffer channel, namely each sub-transmission layer 43 is provided with the buffer channel 1 for reducing the speed of the belt compressed gas flow which is to be introduced into the sub-transmission layer, the pressure in each sub-transmission layer 43 can be stably increased, the possibility of dust blowing caused on a wafer due to overlarge gas flow rate is reduced, and the risk brought to the subsequent manufacturing process due to dust blowing caused by nitrogen gas introduction is reduced.
In this embodiment, after the gas enters the interior of the box body 4 through the air inlet 42 and the air duct 41, the gas continuously impacts on the door plate 211 through the air inlet 11 at a certain speed, the door plate 211 is forced to rotate to open the first opening 12 and simultaneously reduce the flow velocity of the gas, the gas which is slowed down by the labyrinth turbulence structure 2 can play a certain role in blocking the flow of the gas which subsequently enters the buffer channel 1, so that the flow velocity of the gas which subsequently enters the buffer channel 1 is reduced and further slowed down after contacting the baffle 22, the circulation is such that the flow velocity of the gas which enters the interior of the buffer channel 1 is reduced, and the gas is blocked by the door plate 211 and the baffle 22 and then enters the sub-transmission layer 43 through the other end of the buffer channel 1 in a disordered diffusion manner, thereby reducing the possibility of dust emission caused by the excessive flow velocity of the gas blowing on the wafer 431 and reducing the risk brought about by dust emission due to the introduction of nitrogen.
In other embodiments, the air release channels 6 are fixed in the sub-transmission layers 43, the air release channels 6 are provided with air release openings 61 communicated with the sub-transmission layers 43, the air release channels 6 in each sub-transmission layer 43 are communicated with the air release channels 6 of another sub-transmission layer 43 adjacent to the sub-transmission layer 43, the top ends of the air release channels 6 are closed, and the bottom ends of the air release channels 6 extend towards the bottom wall direction of the box body 4 and penetrate through the bottom wall of the box body 4 to be communicated with the outside.
In this embodiment, the air release channel 6 is used to communicate the sub-transmission layer 43 with the outside, so as to change the pressure inside the sub-transmission layer 43, for example, the air inside the box body 4 can be pumped out by connecting the end of the air release channel 6 extending out of the box body 4 and communicating with the outside to a wafer loading system platform. In addition, the wafer loading system is connected to the air inlet 42, so that the air in the box 4 is pumped into the box 4 through the air inlet 42 while the air is pumped out, and the pressure in the sub-transport layer 43 is kept stable. Since the interior of the box body 4 is divided into a plurality of sub-conveying layers 43 which are spaced apart, the flow of air in different sub-conveying layers 43 in the sub-conveying layers 43 has independence, when impurity particles exist on one wafer 431, the impurity particles can enter the air escape passage 6 along with the flow of air, when the impurity particles in the air escape passage 6 move to the corresponding air escape openings 61 of the sub-conveying layers 43 of other layers, because the air in all the sub-conveying layers 43 flows into the air escape passage 6 through the corresponding air escape openings 61, the impurity particles on the wafers 431 from the other sub-conveying layers 43 can stably move in the air escape passage 6 and can be carried out of the box body 4 along with the flow of air, so that the possibility that the impurity particles on different wafers 431 pollute other wafers 431 is reduced.
In order to improve the pressure adjustment efficiency of the sub-transmission layer 43, two air leakage channels 6 are provided, and the two air leakage channels 6 are respectively provided at two opposite sides of the box body corresponding to the air inlet 42.
In an exemplary embodiment of the present disclosure, referring to fig. 5 and 6, a buffer plate 3 is provided inside a case 4, a buffer hole 31 through which an air flow passes is provided on the buffer plate 3, and the buffer plate 3 is located on a flow path of the air flow flowing to a sub-transmission layer 43 through a buffer channel 1.
For example, referring to fig. 5 and 7, the buffer plate 3 is a flat plate material, and a plurality of buffer holes 31 are provided, and the buffer holes 31 are distributed in an array and penetrate the buffer plate 3 in a direction perpendicular to the buffer plate 3. The buffer plate 3 is fixedly connected to a position between the buffer channel 1 and the sub-transmission layer 43, and the air in the air duct 41 flows to the air inlet 11 to impact and open the door plate 211, flows through the buffer hole 31 and enters the sub-transmission layer 43.
In this embodiment, the buffer plate 3 provided with the buffer holes 31 can reduce the impact of gas on the wafer 431 placed in the sub-transport layer 43, reduce the speed of the gas entering the sub-transport layer 43, reduce the possibility of dust emission caused by too high gas flow velocity blowing on the wafer 431, and reduce the risk of dust emission caused by nitrogen gas introduction to subsequent processes.
In other embodiments, there are two buffer plates 3, two buffer plates 3 are distributed at intervals along the length direction of the buffer channel 1, and the buffer holes 31 on the two buffer plates 3 are distributed in a staggered manner, that is, the gas enters the cavity between the two buffer plates 3 after passing through the buffer hole 31 on the former buffer plate 3, and impacts on the plate body of the latter buffer plate 3 when flowing directly, and is diffused to the buffer hole 31 on the latter buffer plate 3 after being buffered by the plate body of the latter buffer plate 3, and flows continuously.
In an exemplary embodiment of the present disclosure, referring to fig. 8, the buffer channels 1 are distributed in a stepwise manner, and the air inlets 11 are distributed in a vertical direction in an oblique direction.
Illustratively, referring to fig. 8, the sub-transfer layers 43 are vertically stacked, and the distance from the air inlet 11 of the buffer channel 1 of the higher layer to the inner side wall of the box body 4 is greater than the distance from the air inlet 11 of the buffer channel 1 of the lower layer to the inner side wall of the box body 4, that is, as the height increases, the corresponding air inlet 11 of the sub-transfer layer 43 of the higher layer is farther from the inner side wall of the box body 4.
In this embodiment, the air flow inside the air duct 41 is freely diffused after entering the inside of the box body 4, the air inlet 11 is distributed in the vertical direction along the oblique direction, so that the channel for the air flow inside the box body 4 is in a horn shape with a big top and a small bottom, that is, the air flow speed entering the inside of the box body 4 can be slowed down, the initial speed of the air flow impacting on the door plate 211 is reduced, the possibility of dust emission caused by the blowing of the excessive air flow speed on the wafer 431 is further reduced, and the risk of dust emission caused by the nitrogen gas introduction is reduced, thereby bringing the subsequent process.
In an exemplary embodiment of the present disclosure, referring to fig. 6 and 8, two ends of the air inlet 42 are located at the inner side and the outer side of the box 4, respectively, and the inner diameter of the air inlet 42 is gradually reduced from one end located at the inner side of the box 4 to one end of the air inlet 42 located at the outer side of the box 4.
The bottom end of the air inlet 42 is communicated with the outside, the top end of the air inlet 42 is communicated with the inside of the box body 4, the inner diameter of the air inlet 42 is in a reducing arrangement, namely, the bottom end opening of the air inlet 42 is smaller than the top end opening of the air inlet 42, the cross section of the air inlet 42 is in a trapezoid shape with a wide upper part and a narrow lower part, and the inner channel of the air inlet 42 is in a horn shape arranged towards the inside of the box body 4.
In this embodiment, the external air enters from the bottom end of the air inlet 42 and leaves the air inlet 42 from the top end of the air inlet 42, so that the speed of the air flowing into the box body 4 from the outside can be reduced by expanding the port of the air outlet end of the air inlet 42, the possibility of dust emission caused by the fact that the wafer 431 is blown with the excessive air flow rate is further reduced, and the risk of the subsequent process due to dust emission caused by nitrogen gas is reduced.
In an exemplary embodiment of the present disclosure, referring to fig. 8 and 9, a filter cartridge communicating with the air inlet 42 and for blocking the flow of air entering the box 4 through the air inlet 42 is fixedly connected to the box 4.
Illustratively, one end of the filter element is fixedly connected with the end part of the air duct 41 extending to the inside of the box body 4, the other end is closed and extends to the inside of the box body 4, the filter element 5 is provided with vent holes 51 extending over the outer wall of the filter element 5, and the vent holes 51 are mutually communicated.
In this embodiment, the external air is introduced from the bottom end of the air inlet 42 and enters the filter element 5 through the air duct 41, the air flows in the filter element 5 along the length direction of the filter element 5, the air is diffused into the box body 4 through the air holes 51 after filling the inner space of the filter element 5, the air diffused into the box body 4 continuously impacts on the door plate 211 through the air inlet 11 at a certain speed, the door plate 211 is forced to rotate to open the first opening 12 and simultaneously reduce the flow velocity of the air, the air which is reduced by the labyrinth turbulence structure 2 can play a certain role in blocking the air which subsequently enters the buffer channel 1, the flow velocity of the air which subsequently enters the buffer channel 1 is reduced, the air is further reduced after contacting the baffle 22, the circulation is such that the flow velocity of the air which enters the buffer channel 1 is reduced, and flows to the front buffer plate 3 in the other end of the buffer channel 1 in a disordered diffusion manner after being blocked by the door plate 211 and the baffle 22, the air flows into the cavity between the two buffer plates 3 after passing through the buffer holes 31 on the buffer plate 3, and then flows to the buffer plate 3 after the air flows to the buffer plate 3 after the buffer plate 3 and then passes through the buffer plate 3, and finally flows to the buffer plate 43.
The filter core 5 can further reduce the speed of the gas flowing into the box body 4 from the outside, further reduces the possibility of dust emission caused by the overlarge gas flow speed blowing on the wafer 431, and reduces the risk of dust emission caused by nitrogen gas inlet and further brought to the subsequent manufacturing process.
It should be understood that the shape of the filter element 5 is not limited, and referring to fig. 6 and 8, the filter element 5 may be cylindrical or may be in a truncated cone shape adapted to the air inlets 11 distributed in the vertical direction in an oblique direction.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A uniform ventilation and deceleration structure, characterized in that the uniform ventilation and deceleration structure comprises: buffer channel and labyrinth turbulence structure;
one end of the buffer channel is provided with an air inlet, and the other end of the buffer channel extends to a position to be ventilated;
the labyrinth turbulence structure comprises a valve movably connected with the air inlet and a baffle fixedly connected with the buffer channel, an adjustable first opening is formed between the valve and the inner wall of the buffer channel, and the baffle blocks air entering the buffer channel from flowing to the position to be ventilated through the first opening.
2. The uniform ventilation and deceleration structure according to claim 1, wherein said first opening is closed when said inlet is not passing gas, said first opening being open to a degree proportional to the flow rate of gas flow through said inlet.
3. The uniform ventilation and deceleration structure according to claim 2, wherein a second opening through which the air flow passes is formed between the top end of the baffle plate and the inner wall of the buffer channel, and the first opening and the second opening are staggered in the length direction of the buffer channel.
4. The uniform ventilation and velocity reduction structure according to claim 1, wherein the valve comprises a door plate hinged to the air inlet, the axis of rotation of the door plate being disposed at an angle to the direction of air flow through the air inlet.
5. The uniform ventilation and deceleration structure according to claim 4, wherein an elastic member for driving the door panel to rotate and then covering the first opening is provided in the buffer channel.
6. The wafer transfer box is characterized by comprising a box body and an air inlet formed in the box body, wherein the uniform ventilation and speed reduction structure according to any one of claims 1-5 is arranged in the box body, the air inlet is communicated with the air inlet, a plurality of sub-transfer layers are arranged in the box body, and each sub-transfer layer corresponds to one buffer channel.
7. The wafer cassette of claim 6, wherein the buffer channels are arranged in a stepwise fashion and the air inlets are arranged diagonally in a vertical direction.
8. The wafer carrier of claim 6, wherein the air inlet has two ends that are positioned on an inner side and an outer side of the cassette body, respectively, and the air inlet has an inner diameter that gradually decreases from an end positioned on the inner side of the cassette body to an end positioned on the outer side of the cassette body.
9. The wafer cassette of claim 6, wherein a filter element is fixedly connected within the cassette body and communicates with the air inlet and blocks the flow of air into the cassette body via the air inlet.
10. The wafer cassette of claim 6, wherein a buffer plate is disposed inside the cassette body, and a buffer hole through which the air flow passes is formed in the buffer plate, and the buffer plate is disposed on a flow path of the air flow flowing to the sub-transfer layer through the buffer channel.
CN202310387277.3A 2023-04-12 2023-04-12 Uniform ventilation speed reduction structure and wafer conveying box Active CN116104845B (en)

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CN117379881A (en) * 2023-11-20 2024-01-12 合肥开悦半导体科技有限公司 Adjustable gas filtering device and rubber coating developing machine
CN118548505A (en) * 2024-07-25 2024-08-27 陕西上郡生态肥业有限公司 Air supply system of combustion equipment

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