CN116091470A - Intelligent industrial control method and device based on 5G technology, electronic equipment and storage medium - Google Patents

Intelligent industrial control method and device based on 5G technology, electronic equipment and storage medium Download PDF

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CN116091470A
CN116091470A CN202310125662.0A CN202310125662A CN116091470A CN 116091470 A CN116091470 A CN 116091470A CN 202310125662 A CN202310125662 A CN 202310125662A CN 116091470 A CN116091470 A CN 116091470A
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circuit
image
circuit board
coordinate data
industrial control
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丁永波
刘威
王志远
黄建新
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Shenzhen Weibu Information Co Ltd
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Abstract

The invention relates to an intelligent industrial control technology of a circuit board, and discloses an intelligent industrial control method based on a 5G technology, which comprises the following steps: receiving circuit images and identity information of a circuit board to be detected, identifying components and circuit wires in the circuit images, calculating position coordinate data of each component in the circuit images and calculating circuit coordinate data of the circuit wires in the circuit images, generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data, acquiring a preset standard analog circuit diagram corresponding to the identity information of the circuit board to be detected, comparing the analog circuit diagram with the preset standard analog circuit diagram in a consistent mode, and sending a pause instruction and an abnormality early warning instruction by using a 5G communication module when the comparison is inconsistent. The invention also provides an intelligent industrial control device, electronic equipment and medium based on the 5G technology. The invention can improve the efficiency of the circuit board mounting detection and reduce the cost of the circuit board mounting detection.

Description

Intelligent industrial control method and device based on 5G technology, electronic equipment and storage medium
Technical Field
The invention relates to the technical field of intelligent industrial control of circuit boards, in particular to an intelligent industrial control method, device, electronic equipment and computer readable storage medium based on a 5G technology.
Background
In the production process of the production line flow sheet of the integrated circuit board, certain quality problems such as component mounting offset, less welding, missing welding and the like exist, and in order to ensure the mounting quality of the electronic components on the circuit board, the mounting condition of the circuit board needs to be detected.
Traditional circuit board mounting detection mainly relies on manual inspection, however, a plurality of welding spots and tiny parts exist on a circuit board generally, under the complex background, the manual detection is high in labor intensity and low in detection efficiency, and is easily influenced by personal subjective factors, so that the improvement of the production efficiency and the product quality of enterprises is greatly limited.
The current method for the circuit board mounting detection is to use an X-ray detection technology, namely X-rays penetrate through components mounted on the detected circuit board and then are received by an image enhancer, the image enhancer converts invisible X-ray detection signals into optical images, then a high-definition camera is used for shooting the optical images, the optical images are input into a computer for A/D conversion into digital images, and the digital processing and mounting quality analysis are carried out on the images by the computer.
According to the detection method, detection tool equipment such as an X-ray machine, an image intensifier, an optical lens and the like are required to be installed, so that the detection cost is high.
Disclosure of Invention
The invention provides an intelligent industrial control method and device based on a 5G technology and a computer readable storage medium, and mainly aims to improve the efficiency of circuit board mounting detection and reduce the cost of the circuit board mounting detection.
In order to achieve the above purpose, the invention provides an intelligent industrial control method based on a 5G technology, which comprises the following steps:
receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity-related data of the circuit board to be detected;
identifying components and circuit wires in the circuit image by using a pre-trained circuit image identification model;
calculating position coordinate data of each component in the circuit image and calculating line coordinate data of a circuit wiring in the circuit image;
generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data;
acquiring a preset standard simulation circuit diagram corresponding to the identity-related data of the circuit board to be detected;
And carrying out consistency comparison on the simulation circuit diagram and the preset standard simulation circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
Optionally, the identifying the components and the circuit traces in the circuit image by using a pre-trained circuit image identification model includes:
performing vector conversion operation on the circuit image to obtain a vector matrix corresponding to the circuit image;
extracting element and device characteristics and circuit wiring characteristics of the vector matrix by using the pre-trained circuit image recognition model;
matching a preset component label corresponding to each component characteristic by using a pre-trained activation function, and marking the corresponding component according to the matched component label;
and marking circuit wiring pixel points in the circuit image according to the circuit wiring characteristics, and communicating the circuit wiring pixel points to obtain the circuit wiring.
Optionally, the calculating the position coordinate data of each component in the circuit image includes:
Identifying a corresponding datum point region of a preset datum point in the circuit image in the circuit board to be detected;
acquiring the circle center of each reference point region, and generating a coordinate origin of the circuit image according to the space corresponding relation between the circle centers of each reference point region;
performing edge detection processing on the marked components to obtain a graphic frame corresponding to each component;
randomly selecting a preset number of pixel points from each graphic frame to serve as measurement points in sequence, and calculating the space distance between each measurement point and the origin of coordinates to obtain the coordinate value of each measurement point;
and collecting the coordinate value of each measuring point to obtain the position coordinate data of the corresponding component.
Optionally, the calculating the line coordinate data of the circuit trace in the circuit image includes:
segmenting the circuit wire according to the shape of the circuit wire;
sequentially calculating a starting point coordinate value of a starting point of each segment relative to the coordinate origin and an ending point coordinate value of an ending point of each segment relative to the coordinate origin;
calculating azimuth angles of the corresponding segments according to the starting point coordinate values and the ending point coordinate values;
When the segments are in a circular curve shape, calculating the radius of a circular curve of the corresponding segment;
and collecting the starting point coordinate value, the end point coordinate value, the azimuth angle and the radius of the circular curve of each segment to obtain the line coordinate data.
Optionally, the acquiring the center of each reference point area includes:
separating the datum point region from the background of the circuit image;
calculating edge points of the separated reference point areas to obtain image contours corresponding to the reference point areas;
carrying out ellipse fitting on the image contour, and generating an external rectangle corresponding to the image contour after ellipse fitting;
calculating the ratio of the difference value between the length and the width of the external rectangle to the width of the external rectangle;
and when the ratio is smaller than a preset ratio threshold, taking the center point of the fitted image contour as the circle center of the corresponding reference area.
Optionally, the comparing the consistency of the analog circuit diagram with the preset standard analog circuit diagram includes:
respectively extracting corner features of the analog circuit diagram and corner features of the preset standard analog circuit;
binary coding is carried out on the corner features of the analog circuit diagram to obtain a diagonal feature vector, and binary coding is carried out on the corner features of the preset standard analog circuit to obtain a reference corner feature vector;
Calculating the distance between the diagonal point feature vector and the reference corner point feature vector;
when the distance is smaller than or equal to a preset distance threshold value, outputting result information consistent in comparison;
and outputting inconsistent comparison result information when the distance is not smaller than the preset distance threshold value.
Optionally, before the components and the circuit traces in the circuit image are identified by using the pre-trained circuit image identification model, the method further includes:
performing pixel correction on the circuit image by using a flat field correction algorithm;
performing binarization processing on the image subjected to pixel correction to obtain a binarized image;
performing cavity region filling processing on the binarized image by using a closed operation algorithm; and
And performing edge smoothing processing on the binarized image by using an open operation algorithm.
In order to solve the above problems, the present invention further provides an intelligent industrial control device based on 5G technology, the device comprising:
the image and identity information receiving module is used for receiving the circuit image of the circuit board to be detected and the identity related data of the circuit board to be detected, which are sent by the automatic image acquisition terminal through the 5G communication module;
The image recognition module is used for recognizing components and circuit wires in the circuit image by utilizing a pre-trained circuit image recognition model;
the simulation circuit diagram generation module is used for calculating position coordinate data of each component in the circuit image and circuit coordinate data of circuit wiring in the circuit image, and generating a simulation circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data;
the standard circuit diagram acquisition module is used for acquiring a preset standard analog circuit diagram corresponding to the identity association data of the circuit board to be detected;
and the industrial control module is used for carrying out consistency comparison on the analog circuit diagram and the preset standard analog circuit diagram to obtain a consistency comparison result, and when the consistency comparison result is abnormal, a pause instruction is sent to a preset production line control terminal through the 5G communication module, and an abnormality early warning instruction is sent to the automatic image acquisition terminal.
In order to solve the above-mentioned problems, the present invention also provides an electronic apparatus including:
a memory storing at least one instruction; and
And the processor executes the instructions stored in the memory to realize the intelligent industrial control method based on the 5G technology.
In order to solve the above problems, the present invention further provides a computer readable storage medium, in which at least one instruction is stored, the at least one instruction being executed by a processor in an electronic device to implement the above-mentioned intelligent industrial control method based on 5G technology.
The embodiment of the invention collects the circuit image of the circuit board to be detected, realizes the separation of the object to be detected and the pad background by identifying the components and the circuit wiring in the circuit image, calculates the position coordinate data of each component in the circuit image and the circuit coordinate data of the circuit wiring in the circuit image, further generates the simulation circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data, maps the actual mounting result of the circuit board to be detected into the simulation circuit diagram, and finally realizes the detection of the mounting quality of the circuit board by comparing the pattern consistency of the simulation circuit diagram with that of the standard simulation circuit diagram, thereby improving the mounting detection efficiency of the circuit board and reducing the cost compared with the manual detection by the intelligent industrial control method based on the 5G technology.
Drawings
FIG. 1 is a schematic diagram of a 5G technology-based intelligent industrial control system according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of an intelligent industrial control method based on a 5G technology according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a detailed implementation flow of one of the steps in the intelligent industrial control method based on the 5G technology according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a detailed implementation flow of another step in the intelligent industrial control method based on the 5G technology according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a detailed implementation flow of another step in the intelligent industrial control method based on the 5G technology according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a detailed implementation flow chart of another step in the intelligent industrial control method based on the 5G technology according to an embodiment of the present invention;
FIG. 7 is a functional block diagram of an intelligent industrial control device based on 5G technology according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an electronic device for implementing the intelligent industrial control method based on the 5G technology according to an embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The embodiment of the application provides an intelligent industrial control method based on a 5G technology. The execution subject of the intelligent industrial control method based on the 5G technology includes, but is not limited to, at least one of a server, a terminal, and the like, which can be configured to execute the method provided by the embodiment of the present application. In other words, the intelligent industrial control method based on the 5G technology may be executed by software or hardware installed in a terminal device or a server device, where the software may be a blockchain platform. The server may be an independent server, or may be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (ContentDelivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.
Referring to fig. 1, a schematic structural diagram of an intelligent industrial control system based on a 5G technology according to an embodiment of the present invention is shown. In this embodiment, the intelligent industrial control system 00 based on the 5G technology includes: the automatic image acquisition terminal 001, the server terminal 000 and the production line control terminal 002, wherein the automatic image acquisition terminal 001 is mainly used for acquiring circuit images and identity related data of a circuit board to be detected. The server terminal 000 is mainly used for identifying the circuit image of the circuit board to be detected, generating an analog circuit diagram of the circuit board to be detected, comparing the consistency of the analog circuit diagram with the corresponding standard analog circuit diagram, and sending out corresponding control instructions and early warning instructions. The production line control terminal 002 is used for controlling the production of the production line according to the control instruction.
In detail, the automatic image capturing terminal 001 may be disposed between a station to be detected and a next station, for example, in a task of performing quality industrial control of a mounting process of a circuit board by using the intelligent industrial control system 00 based on the 5G technology, the automatic image capturing terminal 001 may be disposed between a chip mounter and a corresponding next station.
In this embodiment, the automatic image capturing terminal 001 includes: the image collection device 0011, the early warning indication device 0013 and the 5G communication module 0012, wherein, the image collection device 0011 is utilized to collect the circuit image of the circuit board to be detected and the identity related data of the circuit board to be detected, the 5G communication module 0012 is utilized to send the collected circuit image and the acquired identity related data to the server terminal 000, and the early warning indication device 0013 is used for sending abnormal early warning according to the early warning instruction sent by the server terminal 000 and received by the 5G communication module 0012, for example, the abnormal early warning can be light early warning of a preset color or voice early warning of preset broadcasting information.
In this embodiment, the server terminal 000 includes: the server terminal 000 receives the circuit image and the identity related data sent by the automatic image acquisition terminal 001 through the 5G communication module 0001, and then performs preprocessing and image recognition operations on the circuit image by using the image recognition module 0002.
Preferably, the pre-trained circuit image recognition model may be deployed in the image recognition module 0002, and position coordinate data of each component in the circuit image and line coordinate data of a circuit trace in the circuit image are recognized and calculated by using the circuit image recognition model, and a simulated circuit diagram of the circuit board to be detected is generated according to the position coordinate data and the line coordinate data.
In this embodiment, the image comparison module 0003 is configured to compare the analog circuit diagram with the preset standard analog circuit diagram, and when the comparison result is abnormal, send a pause instruction to the production line control terminal 002 and send an abnormality early warning instruction to the automatic image acquisition terminal 001 through the 5G communication module 0001.
In this embodiment, the production line control terminal 002 is provided with a 5G communication module 0021, and the 5G communication module 0021 is used to receive a pause instruction sent by the server terminal 000, and control the production of the production line where the circuit board to be detected is located according to the pause instruction.
Referring to fig. 2, a flow chart of an intelligent industrial control method based on a 5G technology according to an embodiment of the invention is shown. In this embodiment, the intelligent industrial control method based on the 5G technology includes:
S1, receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity related data of the circuit board to be detected;
in the embodiment of the invention, a PCB (Printed Circuit Board ) is taken as an example to illustrate an intelligent industrial control method based on a 5G technology, and it is to be noted that the intelligent industrial control method based on the 5G technology provided by the invention is also suitable for the mounting detection of circuit boards such as ceramic circuit boards, alumina ceramic circuit boards, circuit boards and aluminum substrates.
In the embodiment of the invention, in order to collect the circuit board image and the identity information of the circuit board to be detected, an automatic image collecting terminal can be assembled between the chip mounter and the corresponding next station, wherein the selection of a camera and a lens and the selection of a light source related to the automatic image collecting terminal can be set according to actual conditions, and the collecting route and the photographing frequency of the automatic image collecting terminal can be set according to the motion path and the speed of the actual PCB to be detected.
Preferably, the automatic image acquisition terminal may be provided with an early warning signal indicating device and the preset 5G communication module, and the collected circuit images of the circuit board to be detected can be rapidly transmitted at high speed and low time delay by using the preset 5G communication module.
In the embodiment of the invention, the identity information of the circuit board to be detected can be realized in advance by spraying the two-dimensional code of the identity information of the main board at the preset position on the circuit board to be detected, and the two-dimensional code information comprises, but is not limited to, the information of the model, the production batch and the like of the corresponding circuit board.
S2, identifying components and circuit wires in the circuit image by using a pre-trained circuit image identification model;
it can be understood that, in the circuit image, each patch area, that is, the area where the individual component or the circuit trace is located is very small relative to the whole circuit image area, in order to accurately obtain the patch area and remove the interference area, a preprocessing operation is required to be performed on the circuit image before the component and the circuit trace in the circuit image are identified by using the pre-trained circuit image identification model.
Illustratively, the preprocessing operation for the circuit image includes, but is not limited to: and carrying out pixel correction on the circuit image by using a flat field correction algorithm, carrying out binarization processing on the image subjected to the pixel correction to obtain a binarized image, carrying out cavity region filling processing on the binarized image by using a closed operation algorithm, and carrying out edge smoothing processing on the binarized image by using an open operation algorithm.
In the embodiment of the invention, the problem of nonuniform pixel response in the circuit image can be eliminated by performing flat field correction on the circuit image, and the gray values of all pixel points in the circuit image are ensured to be relatively uniform. The binarization processing is performed on the circuit image, because the pixel value of the gray level image is 256, the data operation on the gray level image is very time-consuming, if the gray level image is converted into a binary image with the pixel value of 2, the large data operation amount is reduced, and meanwhile, the binary image can reflect the geometric characteristics of the image, so that the separation of the patch area and the background area is facilitated. Filling and edge smoothing are carried out on the hollow area of the circuit image, so that the shape and the characteristics of the bonding pads in the circuit image can be unified.
In the embodiment of the invention, the pre-trained circuit image recognition model can be an image recognition model based on a neural network. And training the circuit image recognition model by utilizing a circuit board image sample with large data volume, wherein in the training process, the circuit image recognition model continuously learns image features in the circuit board image sample, and then maps the features of the image to a neural network for image recognition and classification.
In detail, referring to fig. 3, the identifying the components and the circuit traces in the circuit image by using the pre-trained circuit image identification model includes:
s21, performing vector conversion operation on the circuit image to obtain a vector matrix corresponding to the circuit image;
s22, extracting element and device characteristics and circuit wiring characteristics of the vector matrix by using the pre-trained circuit image recognition model;
s23, matching preset component labels corresponding to the component features by using a pre-trained activation function, and marking the corresponding components according to the matched component labels;
and S24, marking circuit wiring pixel points in the circuit image according to the circuit wiring characteristics, and communicating the circuit wiring pixel points to obtain the circuit wiring.
In the embodiment of the invention, the pre-trained circuit image recognition model comprises an input layer, a convolution layer and an output layer, wherein the input layer is used for carrying out vector coding on the circuit image, and the circuit image information is converted into digital information which can be recognized by a computer. And extracting the component characteristics and the circuit routing characteristics of the circuit image by carrying out convolution calculation on the vector matrix in the convolution layer. And at the output layer, calculating the relative probability value between the component characteristics and the preset component labels by connecting with a pre-trained activation function, and selecting the component label with the highest probability value as the classification of the corresponding component.
In the embodiment of the present invention, the pre-trained activation function includes, but is not limited to, a softmax activation function, a sigmoid activation function, and a relu activation function, and the preset component tag includes, but is not limited to, a resistor, a capacitor, a diode, a voltage regulator, a triode, and the like.
In one embodiment of the present invention, the relative probability value may be calculated using the following activation function:
Figure BDA0004082696630000091
wherein p (a|x) is the relative probability value, w, between the component feature x and the component tag a a The weight vector of the component label a is represented by T, the transposed operation symbol is represented by exp, the expected operation symbol is represented by A, and the number of the preset component labels is represented by A.
According to the embodiment of the invention, the components and the circuit wiring in the circuit image are identified by means of the pre-trained circuit image identification model, so that the separation of the patch area and the pad background area is realized.
S3, calculating position coordinate data of each component in the circuit image and calculating line coordinate data of circuit wiring in the circuit image;
it can be understood that, in the mounting process of the circuit board, a plurality of optical positioning points, also called reference points or Mark points, are set at preset positions of the circuit board, and the reference points are used as measurable points common to all steps of the mounting process.
In detail, referring to fig. 4, the calculating the position coordinate data of each component in the circuit image includes:
s31, identifying a corresponding datum point region of a preset datum point in the circuit image of the circuit board to be detected;
s32, acquiring the circle centers of the reference point areas, and generating a coordinate origin of the circuit image according to the space corresponding relation between the circle centers of the reference point areas;
s33, carrying out edge detection processing on the marked components to obtain a graph frame corresponding to each component;
s34, randomly selecting a preset number of pixel points from each graphic frame to serve as measurement points, and calculating the space distance between each measurement point and the origin of coordinates to obtain the coordinate value of each measurement point;
and S35, collecting coordinate values of each measuring point to obtain position coordinate data of the corresponding component.
In the embodiment of the invention, the pixel characteristics of the preset reference point can be extracted by using the pre-trained circuit image recognition model, and the pixel characteristics of the preset reference point are mapped to the corresponding reference point area.
It will be appreciated that, in general, there may be a plurality of fiducial points on a circuit board, and each fiducial point is a circle, and the exact location of the corresponding fiducial point may be determined by obtaining the center of each of the fiducial point areas. In practical application, because the datum point area is deformed sometimes so as to influence the accurate positioning of the datum point, the embodiment of the invention can ensure the accuracy of the positioning of the datum point by carrying out ellipse fitting on the datum point area by the following method:
Separating the datum point region from the background of the circuit image;
calculating edge points of the separated reference point areas to obtain image contours corresponding to the reference point areas;
carrying out ellipse fitting on the image contour, and generating an external rectangle corresponding to the image contour after ellipse fitting;
calculating the ratio of the difference value between the length and the width of the external rectangle to the width of the external rectangle;
and when the ratio is smaller than a preset ratio threshold, taking the center point of the fitted image contour as the circle center of the corresponding reference area.
In the embodiment of the present invention, the preset ratio threshold may be determined according to actual tuning data, for example, the preset ratio threshold may be 0.1.
In the embodiment of the invention, a point with the minimum average distance between the center of each datum point area and the center of the circle can be selected through calculation to serve as the origin of coordinates of the circuit image.
It can be understood that, in general, the circuit trace in the circuit board includes a shape such as a straight line and a curve, and corresponding coordinate data can be collected according to different shapes of the circuit trace.
In detail, referring to fig. 5, the calculating the line coordinate data of the circuit trace in the circuit image includes:
S36, segmenting the circuit wire according to the shape of the circuit wire;
s37, sequentially calculating a start coordinate value of the start point of each segment relative to the coordinate origin and an end coordinate value of the end point of each segment relative to the coordinate origin;
s38, calculating azimuth angles of the corresponding segments according to the starting point coordinate values and the ending point coordinate values;
s39, calculating the radius of a circular curve of the corresponding segment when the segment is in the shape of the circular curve;
and S40, collecting the starting point coordinate value, the end point coordinate value, the azimuth angle and the radius of the circular curve of each segment to obtain the line coordinate data.
In the embodiment of the invention, the coordinate data of each segment can be calculated by using a line coordinate calculation formula.
For example, when the segment is a straight line, the coordinate values of the segment may be calculated using the following line coordinate formula.
X=X 0 +L*cosα 1
Y=Y 0 +L*sinα 1
Wherein X and Y are respectively the abscissa and the ordinate of the segment relative to the origin of coordinates, X 0 For the starting point coordinate value of the segment, Y 0 For the end point coordinate value of the segment, α 1 For the azimuth of the segment, L is the distance from the origin of coordinates to the start of the segment.
In the embodiment of the invention, the position coordinate data of each component in the circuit image and the line coordinate data of the circuit wiring in the circuit image are obtained through calculation, so that the space layout relationship of each component and the circuit wiring in the circuit board to be detected under the background of the circuit board bonding pad is formed by the position coordinate data and the line coordinate data, and the problem of offset of the subsequent investigation components is facilitated.
S4, generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data, and acquiring a preset standard analog circuit diagram corresponding to the identity information of the circuit board to be detected;
in the embodiment of the invention, the spatial position relationship of each component in the bonding pad, the spatial relative relationship between each component and the spatial position relationship of the circuit wiring in the bonding pad reflected by the analog circuit diagram are the same as the components and the circuit layout in the circuit image.
In the embodiment of the invention, the coordinate origin of the analog circuit diagram can be randomly initialized, and corresponding components and circuit wires can be laid out according to the position coordinate data and the line coordinate data, wherein each component can be replaced by a standard component symbol.
In the embodiment of the invention, the preset standard analog circuit diagram is a diagram of the layout of each component and circuit wiring in the bonding pad, which is output based on the original technical scheme of the circuit board to be detected and is accurate and standard.
In the embodiment of the invention, the standard analog circuit matched with the identity information of the circuit board to be detected can be queried in the mapping relation table of the preset main board type and the standard analog circuit diagram.
In the embodiment of the invention, the space layout of each component in the circuit board to be detected is reflected by utilizing the analog circuit diagram, so that the interference information in the circuit image can be effectively removed, and the pureness of the check comparison detection information is realized.
S5, carrying out consistency comparison on the analog circuit diagram and the preset standard analog circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
In an embodiment of the present invention, an image matching function of an image recognition model based on a neural network may be trained in advance, and a difference between the simulated circuit diagram and the standard simulated circuit diagram may be analyzed using the trained image recognition model.
In another embodiment of the present invention, the consistency comparison between the analog circuit diagram and the preset standard analog circuit diagram is implemented by using corner features of the image. Usually, the image has large gradient value at the corner point and the change rate of the gradient direction is also large, that is, the corner point displays the position of the image with severe gray level change in the two-dimensional space, and the position has obvious difference with the surrounding collar points, so that the information of each local part in the image can be obtained by calculating the corner point in the image.
In detail, referring to fig. 6, the step of comparing the consistency of the analog circuit diagram with the preset standard analog circuit diagram to obtain a consistency comparison result includes:
s51, respectively extracting corner features of the analog circuit diagram and corner features of the preset standard analog circuit;
s52, performing binary coding on corner features of the analog circuit diagram to obtain a diagonal feature vector, and performing binary coding on the corner features of the preset standard analog circuit to obtain a reference corner feature vector;
s53, calculating the distance between the diagonal point feature vector and the reference corner point feature vector;
s54, outputting result information consistent in comparison when the distance is smaller than or equal to a preset distance threshold value;
And S55, outputting inconsistent comparison result information when the distance is not smaller than the preset distance threshold value.
In the embodiment of the invention, the corner features of the analog circuit diagram and the corner features of the preset standard analog circuit can be extracted by utilizing a Harris algorithm, then the detected corner features are converted into binary codes by utilizing a BRISK feature description method, so that corner feature vectors described in a binary mode can be obtained, finally, the Hamming distance between the two corner feature vectors is calculated, when the distance is not smaller than the preset distance threshold value, the fact that the difference between the two images is larger is indicated, otherwise, the fact that the two images are similar is indicated, wherein the distance threshold value can be determined according to actual adjustment data.
In the embodiment of the invention, when the comparison results are inconsistent, early warning industrial control information, temporary stop control information and the like can be generated, and when the comparison results are consistent, production continuous industrial control information can be generated.
In the embodiment of the invention, when the result information of inconsistent comparison is output, the industrial control information of the pause instruction can be sent to the production line control terminal through the pre-installed 5G communication module so as to control the production line control terminal to stop the production of the production line, and the abnormal early warning instruction is sent to the corresponding image acquisition terminal so as to control the early warning signal indicating device of the corresponding image acquisition terminal to send out abnormal early warning, for example, the abnormal early warning can be light early warning of preset color or voice early warning of preset broadcast information.
Preferably, if the analysis and comparison result is abnormal, an abnormal report may be generated, where the abnormal report includes, but is not limited to, information such as an abnormal mounting position or a line position, a possible result caused by the abnormal, and the abnormal report is sent to a predetermined terminal through the 5G communication module.
The embodiment of the invention collects the circuit image of the circuit board to be detected, realizes the separation of the object to be detected and the pad background by identifying the components and the circuit wiring in the circuit image, calculates the position coordinate data of each component in the circuit image and the circuit coordinate data of the circuit wiring in the circuit image, further generates the simulation circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data, maps the actual mounting result of the circuit board to be detected into the simulation circuit diagram, and finally realizes the detection of the mounting quality of the circuit board by comparing the pattern consistency of the simulation circuit diagram with that of the standard simulation circuit diagram.
Fig. 7 is a functional block diagram of an intelligent industrial control device based on 5G technology according to an embodiment of the present invention.
The intelligent industrial control device 100 based on the 5G technology can be installed in electronic equipment. According to the implemented functions, the intelligent industrial control device 100 based on the 5G technology includes: the system comprises an image and identity information receiving module 101, an image identifying module 102, an analog circuit diagram generating module 103, a standard circuit diagram obtaining module 104 and an industrial control module 105. The module of the invention, which may also be referred to as a unit, refers to a series of computer program segments, which are stored in the memory of the electronic device, capable of being executed by the processor of the electronic device and of performing a fixed function.
In the present embodiment, the functions concerning the respective modules/units are as follows:
the image and identity information receiving module 101 is configured to receive a circuit image of a circuit board to be detected and identity related data of the circuit board to be detected, which are sent by the automatic image acquisition terminal through the 5G communication module;
the image recognition module 102 is configured to recognize components and circuit traces in the circuit image by using a pre-trained circuit image recognition model;
the analog circuit diagram generating module 103 is configured to calculate position coordinate data of each component in the circuit image and line coordinate data of a circuit trace in the circuit image, and generate an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data;
The standard circuit diagram obtaining module 104 is configured to obtain a preset standard analog circuit diagram corresponding to the identity information of the circuit board to be detected;
the industrial control module 105 is configured to perform consistency comparison on the analog circuit diagram and the preset standard analog circuit diagram to obtain a consistency comparison result, and when the consistency comparison result is abnormal, send a pause instruction to a preset production line control terminal and send an abnormality early warning instruction to the automatic image acquisition terminal through the 5G communication module.
In detail, the specific implementation manner of each module of the intelligent industrial control device 100 based on the 5G technology is as follows:
step one, receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity related data of the circuit board to be detected;
in the embodiment of the invention, a PCB (Printed Circuit Board ) is taken as an example to illustrate an intelligent industrial control method based on a 5G technology, and it is to be noted that the intelligent industrial control method based on the 5G technology provided by the invention is also suitable for the mounting detection of circuit boards such as ceramic circuit boards, alumina ceramic circuit boards, circuit boards and aluminum substrates.
In the embodiment of the invention, in order to collect the circuit board image and the identity information of the circuit board to be detected, an automatic image collecting terminal can be assembled between the chip mounter and the corresponding next station, wherein the selection of a camera and a lens and the selection of a light source related to the automatic image collecting terminal can be set according to actual conditions, and the collecting route and the photographing frequency of the automatic image collecting terminal can be set according to the motion path and the speed of the actual PCB to be detected.
Preferably, the automatic image acquisition terminal may be provided with an early warning signal indicating device and the preset 5G communication module, and the collected circuit images of the circuit board to be detected can be rapidly transmitted at high speed and low time delay by using the preset 5G communication module.
In the embodiment of the invention, the identity information of the circuit board to be detected can be realized in advance by spraying the two-dimensional code of the identity information of the main board at the preset position on the circuit board to be detected, and the two-dimensional code information comprises, but is not limited to, the information of the model, the production batch and the like of the corresponding circuit board.
Step two, identifying components and circuit wires in the circuit image by utilizing the pre-trained circuit image identification model;
It can be understood that, in the circuit image, each patch area, that is, the area where the individual component or the circuit trace is located is very small relative to the whole circuit image area, in order to accurately obtain the patch area and remove the interference area, a preprocessing operation is required to be performed on the circuit image before the component and the circuit trace in the circuit image are identified by using the pre-trained circuit image identification model.
Illustratively, the preprocessing operation for the circuit image includes, but is not limited to: and carrying out pixel correction on the circuit image by using a flat field correction algorithm, carrying out binarization processing on the image subjected to the pixel correction to obtain a binarized image, carrying out cavity region filling processing on the binarized image by using a closed operation algorithm, and carrying out edge smoothing processing on the binarized image by using an open operation algorithm.
In the embodiment of the invention, the problem of nonuniform pixel response in the circuit image can be eliminated by performing flat field correction on the circuit image, and the gray values of all pixel points in the circuit image are ensured to be relatively uniform. The binarization processing is performed on the circuit image, because the pixel value of the gray level image is 256, the data operation on the gray level image is very time-consuming, if the gray level image is converted into a binary image with the pixel value of 2, the large data operation amount is reduced, and meanwhile, the binary image can reflect the geometric characteristics of the image, so that the separation of the patch area and the background area is facilitated. Filling and edge smoothing are carried out on the hollow area of the circuit image, so that the shape and the characteristics of the bonding pads in the circuit image can be unified.
In the embodiment of the invention, the pre-trained circuit image recognition model can be an image recognition model based on a neural network. And training the circuit image recognition model by utilizing a circuit board image sample with large data volume, wherein in the training process, the circuit image recognition model continuously learns image features in the circuit board image sample, and then maps the features of the image to a neural network for image recognition and classification.
In detail, the method for identifying the components and the circuit traces in the circuit image by using the pre-trained circuit image identification model comprises the following steps:
performing vector conversion operation on the circuit image to obtain a vector matrix corresponding to the circuit image;
extracting element and device characteristics and circuit wiring characteristics of the vector matrix by using the pre-trained circuit image recognition model;
matching a preset component label corresponding to each component characteristic by using a pre-trained activation function, and marking the corresponding component according to the matched component label;
and marking circuit wiring pixel points in the circuit image according to the circuit wiring characteristics, and communicating the circuit wiring pixel points to obtain the circuit wiring.
In the embodiment of the invention, the pre-trained circuit image recognition model comprises an input layer, a convolution layer and an output layer, wherein the input layer is used for carrying out vector coding on the circuit image, and the circuit image information is converted into digital information which can be recognized by a computer. And extracting the component characteristics and the circuit routing characteristics of the circuit image by carrying out convolution calculation on the vector matrix in the convolution layer. And at the output layer, calculating the relative probability value between the component characteristics and the preset component labels by connecting with a pre-trained activation function, and selecting the component label with the highest probability value as the classification of the corresponding component.
In the embodiment of the present invention, the pre-trained activation function includes, but is not limited to, a softmax activation function, a sigmoid activation function, and a relu activation function, and the preset component tag includes, but is not limited to, a resistor, a capacitor, a diode, a voltage regulator, a triode, and the like.
In one embodiment of the present invention, the relative probability value may be calculated using the following activation function:
Figure BDA0004082696630000161
wherein p is(a|x) is the relative probability value, w, between the component feature x and the component tag a a The weight vector of the component label a is represented by T, the transposed operation symbol is represented by exp, the expected operation symbol is represented by A, and the number of the preset component labels is represented by A.
According to the embodiment of the invention, the components and the circuit wiring in the circuit image are identified by means of the pre-trained circuit image identification model, so that the separation of the patch area and the pad background area is realized.
Calculating position coordinate data of each component in the circuit image and calculating line coordinate data of circuit wiring in the circuit image;
it can be understood that, in the mounting process of the circuit board, a plurality of optical positioning points, also called reference points or Mark points, are set at preset positions of the circuit board, and the reference points are used as measurable points common to all steps of the mounting process.
In detail, the calculating the position coordinate data of each component in the circuit image includes:
identifying a corresponding datum point region of a preset datum point in the circuit image in the circuit board to be detected;
Acquiring the circle center of each reference point region, and generating a coordinate origin of the circuit image according to the space corresponding relation between the circle centers of each reference point region;
performing edge detection processing on the marked components to obtain a graphic frame corresponding to each component;
randomly selecting a preset number of pixel points from each graphic frame to serve as measurement points in sequence, and calculating the space distance between each measurement point and the origin of coordinates to obtain the coordinate value of each measurement point;
and collecting the coordinate value of each measuring point to obtain the position coordinate data of the corresponding component.
In the embodiment of the invention, the pixel characteristics of the preset reference point can be extracted by using the pre-trained circuit image recognition model, and the pixel characteristics of the preset reference point are mapped to the corresponding reference point area.
It will be appreciated that, in general, there may be a plurality of fiducial points on a circuit board, and each fiducial point is a circle, and the exact location of the corresponding fiducial point may be determined by obtaining the center of each of the fiducial point areas. In practical application, because the datum point area is deformed sometimes so as to influence the accurate positioning of the datum point, the embodiment of the invention can ensure the accuracy of the positioning of the datum point by carrying out ellipse fitting on the datum point area by the following method:
Separating the datum point region from the background of the circuit image;
calculating edge points of the separated reference point areas to obtain image contours corresponding to the reference point areas;
carrying out ellipse fitting on the image contour, and generating an external rectangle corresponding to the image contour after ellipse fitting;
calculating the ratio of the difference value between the length and the width of the external rectangle to the width of the external rectangle;
and when the ratio is smaller than a preset ratio threshold, taking the center point of the fitted image contour as the circle center of the corresponding reference area.
In the embodiment of the present invention, the preset ratio threshold may be determined according to actual tuning data, for example, the preset ratio threshold may be 0.1.
In the embodiment of the invention, a point with the minimum average distance between the center of each datum point area and the center of the circle can be selected through calculation to serve as the origin of coordinates of the circuit image.
It can be understood that, in general, the circuit trace in the circuit board includes a shape such as a straight line and a curve, and corresponding coordinate data can be collected according to different shapes of the circuit trace.
In detail, the calculating the line coordinate data of the circuit trace in the circuit image includes:
Segmenting the circuit wire according to the shape of the circuit wire;
sequentially calculating a starting point coordinate value of a starting point of each segment relative to the coordinate origin and an ending point coordinate value of an ending point of each segment relative to the coordinate origin;
calculating azimuth angles of the corresponding segments according to the starting point coordinate values and the ending point coordinate values;
when the segments are in a circular curve shape, calculating the radius of a circular curve of the corresponding segment;
and collecting the starting point coordinate value, the end point coordinate value, the azimuth angle and the radius of the circular curve of each segment to obtain the line coordinate data.
In the embodiment of the invention, the coordinate data of each segment can be calculated by using a line coordinate calculation formula.
For example, when the segment is a straight line, the coordinate values of the segment may be calculated using the following line coordinate formula.
X=X 0 +L*cosα 1
Y=Y 0 +L*sinα 1
Wherein X and Y are respectively the abscissa and the ordinate of the segment relative to the origin of coordinates, X 0 For the starting point coordinate value of the segment, Y 0 For the end point coordinate value of the segment, α 1 For the azimuth of the segment, L is the distance from the origin of coordinates to the start of the segment.
In the embodiment of the invention, the position coordinate data of each component in the circuit image and the line coordinate data of the circuit wiring in the circuit image are obtained through calculation, so that the space layout relationship of each component and the circuit wiring in the circuit board to be detected under the background of the circuit board bonding pad is formed by the position coordinate data and the line coordinate data, and the problem of offset of the subsequent investigation components is facilitated.
Step four, generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data, and acquiring a preset standard analog circuit diagram corresponding to the identity information of the circuit board to be detected;
in the embodiment of the invention, the spatial position relationship of each component in the bonding pad, the spatial relative relationship between each component and the spatial position relationship of the circuit wiring in the bonding pad reflected by the analog circuit diagram are the same as the components and the circuit layout in the circuit image.
In the embodiment of the invention, the coordinate origin of the analog circuit diagram can be randomly initialized, and corresponding components and circuit wires can be laid out according to the position coordinate data and the line coordinate data, wherein each component can be replaced by a standard component symbol.
In the embodiment of the invention, the preset standard analog circuit diagram is a diagram of the layout of each component and circuit wiring in the bonding pad, which is output based on the original technical scheme of the circuit board to be detected and is accurate and standard.
In the embodiment of the invention, the standard analog circuit matched with the identity information of the circuit board to be detected can be queried in the mapping relation table of the preset main board type and the standard analog circuit diagram.
In the embodiment of the invention, the space layout of each component in the circuit board to be detected is reflected by utilizing the analog circuit diagram, so that the interference information in the circuit image can be effectively removed, and the pureness of the check comparison detection information is realized.
And fifthly, carrying out consistency comparison on the analog circuit diagram and the preset standard analog circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
In an embodiment of the present invention, an image matching function of an image recognition model based on a neural network may be trained in advance, and a difference between the simulated circuit diagram and the standard simulated circuit diagram may be analyzed using the trained image recognition model.
In another embodiment of the present invention, the consistency comparison between the analog circuit diagram and the preset standard analog circuit diagram is implemented by using corner features of the image. Usually, the image has large gradient value at the corner point and the change rate of the gradient direction is also large, that is, the corner point displays the position of the image with severe gray level change in the two-dimensional space, and the position has obvious difference with the surrounding collar points, so that the information of each local part in the image can be obtained by calculating the corner point in the image.
In detail, the step of comparing the consistency of the analog circuit diagram with the preset standard analog circuit diagram to obtain a consistency comparison result includes:
respectively extracting corner features of the analog circuit diagram and corner features of the preset standard analog circuit;
binary coding is carried out on the corner features of the analog circuit diagram to obtain a diagonal feature vector, and binary coding is carried out on the corner features of the preset standard analog circuit to obtain a reference corner feature vector;
calculating the distance between the diagonal point feature vector and the reference corner point feature vector;
when the distance is smaller than or equal to a preset distance threshold value, outputting result information consistent in comparison;
and outputting inconsistent comparison result information when the distance is not smaller than the preset distance threshold value.
In the embodiment of the invention, the corner features of the analog circuit diagram and the corner features of the preset standard analog circuit can be extracted by utilizing a Harris algorithm, then the detected corner features are converted into binary codes by utilizing a BRISK feature description method, so that corner feature vectors described in a binary mode can be obtained, finally, the Hamming distance between the two corner feature vectors is calculated, when the distance is not smaller than the preset distance threshold value, the fact that the difference between the two images is larger is indicated, otherwise, the fact that the two images are similar is indicated, wherein the distance threshold value can be determined according to actual adjustment data.
In the embodiment of the invention, when the comparison results are inconsistent, early warning industrial control information, temporary stop control information and the like can be generated, and when the comparison results are consistent, production continuous industrial control information can be generated.
In the embodiment of the invention, when the result information of inconsistent comparison is output, the industrial control information of the pause instruction can be sent to the production line control terminal through the pre-installed 5G communication module so as to control the production line control terminal to stop the production of the production line, and the abnormal early warning instruction is sent to the corresponding image acquisition terminal so as to control the early warning signal indicating device of the corresponding image acquisition terminal to send out abnormal early warning, for example, the abnormal early warning can be light early warning of preset color or voice early warning of preset broadcast information.
Preferably, if the analysis and comparison result is abnormal, an abnormal report may be generated, where the abnormal report includes, but is not limited to, information such as an abnormal mounting position or a line position, a possible result caused by the abnormal, and the abnormal report is sent to a predetermined terminal through the 5G communication module.
The embodiment of the invention collects the circuit image of the circuit board to be detected, realizes the separation of the object to be detected and the pad background by identifying the components and the circuit wiring in the circuit image, calculates the position coordinate data of each component in the circuit image and the circuit coordinate data of the circuit wiring in the circuit image, further generates the simulation circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data, maps the actual mounting result of the circuit board to be detected into the simulation circuit diagram, and finally realizes the detection of the mounting quality of the circuit board by comparing the pattern consistency of the simulation circuit diagram with that of the standard simulation circuit diagram, thereby the intelligent industrial control device based on the 5G technology improves the mounting detection efficiency of the circuit board and reduces the cost compared with the manual detection.
Fig. 8 is a schematic structural diagram of an electronic device for implementing an intelligent industrial control method based on 5G technology according to an embodiment of the present invention.
The electronic device 1 may comprise a processor 10, a memory 11 and a bus, and may further comprise a computer program stored in the memory 11 and executable on the processor 10, such as a smart industrial control program based on 5G technology.
The memory 11 includes at least one type of readable storage medium, including flash memory, a mobile hard disk, a multimedia card, a card memory (e.g., SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, etc. The memory 11 may in some embodiments be an internal storage unit of the electronic device 1, such as a removable hard disk of the electronic device 1. The memory 11 may in other embodiments also be an external storage device of the electronic device 1, such as a plug-in mobile hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card) or the like, which are provided on the electronic device 1. Further, the memory 11 may also include both an internal storage unit and an external storage device of the electronic device 1. The memory 11 may be used not only for storing application software installed in the electronic device 1 and various data, such as codes of intelligent industrial control programs based on 5G technology, but also for temporarily storing data that has been output or is to be output.
The processor 10 may be comprised of integrated circuits in some embodiments, for example, a single packaged integrated circuit, or may be comprised of multiple integrated circuits packaged with the same or different functions, including one or more central processing units (Central Processing Unit, CPU), microprocessors, digital processing chips, graphics processors, combinations of various control chips, and the like. The processor 10 is a Control Unit (Control Unit) of the electronic device, connects respective parts of the entire electronic device using various interfaces and lines, executes programs or modules (e.g., an intelligent industrial Control program based on 5G technology, etc.) stored in the memory 11 by running or executing the programs or modules, and invokes data stored in the memory 11 to perform various functions of the electronic device 1 and process the data.
The bus may be a peripheral component interconnect standard (Peripheral Component Interconnect, PCI) bus or an extended industry standard architecture (Extended Industry Standard Architecture, EISA) bus, among others. The bus may be classified as an address bus, a data bus, a control bus, etc. The bus is arranged to enable a connection communication between the memory 11 and at least one processor 10 etc.
Fig. 8 shows only an electronic device with components, and it will be appreciated by a person skilled in the art that the structure shown in fig. 8 does not constitute a limitation of the electronic device 1, and may comprise fewer or more components than shown, or may combine certain components, or may be arranged in different components.
For example, although not shown, the electronic device 1 may further include a power source (such as a battery) for supplying power to each component, and preferably, the power source may be logically connected to the at least one processor 10 through a power management device, so that functions of charge management, discharge management, power consumption management, and the like are implemented through the power management device. The power supply may also include one or more of any of a direct current or alternating current power supply, recharging device, power failure detection circuit, power converter or inverter, power status indicator, etc. The electronic device 1 may further include various sensors, bluetooth modules, wi-Fi modules, etc., which will not be described herein.
Further, the electronic device 1 may also comprise a network interface, optionally the network interface may comprise a wired interface and/or a wireless interface (e.g. WI-FI interface, bluetooth interface, etc.), typically used for establishing a communication connection between the electronic device 1 and other electronic devices.
The electronic device 1 may optionally further comprise a user interface, which may be a Display, an input unit, such as a Keyboard (Keyboard), or a standard wired interface, a wireless interface. Alternatively, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch, or the like. The display may also be referred to as a display screen or display unit, as appropriate, for displaying information processed in the electronic device 1 and for displaying a visual user interface.
It should be understood that the embodiments described are for illustrative purposes only and are not limited to this configuration in the scope of the patent application.
The smart industrial control program based on 5G technology stored in the memory 11 of the electronic device 1 is a combination of a plurality of instructions, which when run in the processor 10, can implement:
receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity-related data of the circuit board to be detected;
identifying components and circuit wires in the circuit image by using a pre-trained circuit image identification model;
Calculating position coordinate data of each component in the circuit image and calculating line coordinate data of a circuit wiring in the circuit image;
generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data;
acquiring a preset standard simulation circuit diagram corresponding to the identity-related data of the circuit board to be detected;
and carrying out consistency comparison on the simulation circuit diagram and the preset standard simulation circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
Further, the modules/units integrated in the electronic device 1 may be stored in a computer readable storage medium if implemented in the form of software functional units and sold or used as separate products. The computer readable storage medium may be volatile or nonvolatile. For example, the computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM).
The present invention also provides a computer readable storage medium storing a computer program which, when executed by a processor of an electronic device, can implement:
receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity-related data of the circuit board to be detected;
identifying components and circuit wires in the circuit image by using a pre-trained circuit image identification model;
calculating position coordinate data of each component in the circuit image and calculating line coordinate data of a circuit wiring in the circuit image;
generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data;
acquiring a preset standard simulation circuit diagram corresponding to the identity-related data of the circuit board to be detected;
and carrying out consistency comparison on the simulation circuit diagram and the preset standard simulation circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
In addition, each functional module in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units can be realized in a form of hardware or a form of hardware and a form of software functional modules.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.
The blockchain is a novel application mode of computer technologies such as distributed data storage, point-to-point transmission, consensus mechanism, encryption algorithm and the like. The Blockchain (Blockchain), which is essentially a decentralised database, is a string of data blocks that are generated by cryptographic means in association, each data block containing a batch of information of network transactions for verifying the validity of the information (anti-counterfeiting) and generating the next block. The blockchain may include a blockchain underlying platform, a platform product services layer, an application services layer, and the like.
The embodiment of the application can acquire and process the related data based on the holographic projection technology. Among these, artificial intelligence (Artificial Intelligence, AI) is the theory, method, technique and application system that uses a digital computer or a digital computer-controlled machine to simulate, extend and extend human intelligence, sense the environment, acquire knowledge and use knowledge to obtain optimal results.
Furthermore, it is evident that the word "comprising" does not exclude other elements or steps, and that the singular does not exclude a plurality. A plurality of units or means recited in the system claims can also be implemented by means of software or hardware by means of one unit or means. The terms second, etc. are used to denote a name, but not any particular order.
Finally, it should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.

Claims (10)

1. An intelligent industrial control method based on a 5G technology is characterized by comprising the following steps:
Receiving a circuit image of a circuit board to be detected, which is sent by an automatic image acquisition terminal through a 5G communication module, and identity-related data of the circuit board to be detected;
identifying components and circuit wires in the circuit image by using a pre-trained circuit image identification model;
calculating position coordinate data of each component in the circuit image and calculating line coordinate data of a circuit wiring in the circuit image;
generating an analog circuit diagram of the circuit board to be detected according to the position coordinate data and the line coordinate data;
acquiring a preset standard simulation circuit diagram corresponding to the identity-related data of the circuit board to be detected;
and carrying out consistency comparison on the simulation circuit diagram and the preset standard simulation circuit diagram to obtain a consistency comparison result, and sending a pause instruction to a preset production line control terminal and an abnormality early warning instruction to the automatic image acquisition terminal through a 5G communication module when the consistency comparison result is abnormal.
2. The intelligent industrial control method based on 5G technology as claimed in claim 1, wherein the identifying the components and the circuit traces in the circuit image by using the pre-trained circuit image identification model comprises:
Performing vector conversion operation on the circuit image to obtain a vector matrix corresponding to the circuit image;
extracting element and device characteristics and circuit wiring characteristics of the vector matrix by using the pre-trained circuit image recognition model;
matching a preset component label corresponding to each component characteristic by using a pre-trained activation function, and marking the corresponding component according to the matched component label;
and marking circuit wiring pixel points in the circuit image according to the circuit wiring characteristics, and communicating the circuit wiring pixel points to obtain the circuit wiring.
3. The intelligent industrial control method based on the 5G technology as set forth in claim 1, wherein the calculating the position coordinate data of each of the components in the circuit image includes:
identifying a corresponding datum point region of a preset datum point in the circuit image in the circuit board to be detected;
acquiring the circle center of each reference point region, and generating a coordinate origin of the circuit image according to the space corresponding relation between the circle centers of each reference point region;
performing edge detection processing on the marked components to obtain a graphic frame corresponding to each component;
Randomly selecting a preset number of pixel points from each graphic frame to serve as measurement points in sequence, and calculating the space distance between each measurement point and the origin of coordinates to obtain the coordinate value of each measurement point;
and collecting the coordinate value of each measuring point to obtain the position coordinate data of the corresponding component.
4. The intelligent industrial control method based on 5G technology as claimed in claim 3, wherein said calculating the line coordinate data of the circuit trace in the circuit image comprises:
segmenting the circuit wire according to the shape of the circuit wire;
sequentially calculating a starting point coordinate value of a starting point of each segment relative to the coordinate origin and an ending point coordinate value of an ending point of each segment relative to the coordinate origin;
calculating azimuth angles of the corresponding segments according to the starting point coordinate values and the ending point coordinate values;
when the segments are in a circular curve shape, calculating the radius of a circular curve of the corresponding segment;
and collecting the starting point coordinate value, the end point coordinate value, the azimuth angle and the radius of the circular curve of each segment to obtain the line coordinate data.
5. The intelligent industrial control method based on the 5G technology as claimed in claim 3, wherein said obtaining the center of each reference point area comprises:
Separating the datum point region from the background of the circuit image;
calculating edge points of the separated reference point areas to obtain image contours corresponding to the reference point areas;
carrying out ellipse fitting on the image contour, and generating an external rectangle corresponding to the image contour after ellipse fitting;
calculating the ratio of the difference value between the length and the width of the external rectangle to the width of the external rectangle;
and when the ratio is smaller than a preset ratio threshold, taking the center point of the fitted image contour as the circle center of the corresponding reference area.
6. The intelligent industrial control method based on the 5G technology as set forth in claim 1, wherein the performing the consistency comparison between the analog circuit diagram and the preset standard analog circuit diagram includes:
respectively extracting corner features of the analog circuit diagram and corner features of the preset standard analog circuit;
binary coding is carried out on the corner features of the analog circuit diagram to obtain a diagonal feature vector, and binary coding is carried out on the corner features of the preset standard analog circuit to obtain a reference corner feature vector;
calculating the distance between the diagonal point feature vector and the reference corner point feature vector;
When the distance is smaller than or equal to a preset distance threshold value, outputting result information consistent in comparison;
and outputting inconsistent comparison result information when the distance is not smaller than the preset distance threshold value.
7. The intelligent industrial control method according to any one of claims 1 to 6, wherein before the components and circuit traces in the circuit image are identified by using a pre-trained circuit image identification model, the method further comprises:
performing pixel correction on the circuit image by using a flat field correction algorithm;
performing binarization processing on the image subjected to pixel correction to obtain a binarized image;
performing cavity region filling processing on the binarized image by using a closed operation algorithm; and
And performing edge smoothing processing on the binarized image by using an open operation algorithm.
8. An intelligent industrial control device based on 5G technology, characterized in that the device comprises:
the image and identity information receiving module is used for receiving the circuit image of the circuit board to be detected and the identity related data of the circuit board to be detected, which are sent by the automatic image acquisition terminal through the 5G communication module;
the image recognition module is used for recognizing components and circuit wires in the circuit image by utilizing a pre-trained circuit image recognition model;
The simulation circuit diagram generation module is used for calculating position coordinate data of each component in the circuit image and circuit coordinate data of circuit wiring in the circuit image, and generating a simulation circuit diagram of the circuit board to be detected according to the position coordinate data and the circuit coordinate data;
the standard circuit diagram acquisition module is used for acquiring a preset standard analog circuit diagram corresponding to the identity association data of the circuit board to be detected;
and the industrial control module is used for carrying out consistency comparison on the analog circuit diagram and the preset standard analog circuit diagram to obtain a consistency comparison result, and when the consistency comparison result is abnormal, a pause instruction is sent to a preset production line control terminal through the 5G communication module, and an abnormality early warning instruction is sent to the automatic image acquisition terminal.
9. An electronic device, the electronic device comprising:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the intelligent industrial control method based on 5G technology as claimed in any one of claims 1 to 7.
10. A computer readable storage medium storing a computer program, wherein the computer program when executed by a processor implements the intelligent industrial control method based on 5G technology according to any one of claims 1 to 7.
CN202310125662.0A 2023-02-07 2023-02-07 Intelligent industrial control method and device based on 5G technology, electronic equipment and storage medium Pending CN116091470A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117395983A (en) * 2023-11-16 2024-01-12 深圳市创芯智汇电子科技有限公司 Automatic detection method and device for PCB (printed circuit board) patches
CN118052992A (en) * 2024-04-09 2024-05-17 芯粒微(深圳)科技有限公司 Image recognition model generation method, system, chip and memory

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117395983A (en) * 2023-11-16 2024-01-12 深圳市创芯智汇电子科技有限公司 Automatic detection method and device for PCB (printed circuit board) patches
CN118052992A (en) * 2024-04-09 2024-05-17 芯粒微(深圳)科技有限公司 Image recognition model generation method, system, chip and memory

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