CN116088278A - Laser direct writing lithography device and method - Google Patents

Laser direct writing lithography device and method Download PDF

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Publication number
CN116088278A
CN116088278A CN202310009055.8A CN202310009055A CN116088278A CN 116088278 A CN116088278 A CN 116088278A CN 202310009055 A CN202310009055 A CN 202310009055A CN 116088278 A CN116088278 A CN 116088278A
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China
Prior art keywords
laser
exposure
platform
mirror
computer
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CN202310009055.8A
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Chinese (zh)
Inventor
陈修涛
高明
韩非
董辉
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Hefei Xinguan Semiconductor Co ltd
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Hefei Xinguan Semiconductor Co ltd
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Priority to CN202310009055.8A priority Critical patent/CN116088278A/en
Publication of CN116088278A publication Critical patent/CN116088278A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A laser direct writing lithography device and method, the device includes a movable platform, a laser control board, a computer, an exposure unit placed on the movable platform, a camera unit connected with the computer, a platform controller, the platform controller is connected with the controlled end of the driving unit; the exposure unit comprises a close-packed laser, a convex lens array, a rotating mirror or a vibrating mirror, an F-theta scanning field lens and corner drive of the rotating mirror or the vibrating mirror, which are connected with a laser control board through signals, wherein scattered light emitted by an optical fiber array in the close-packed laser is scattered onto the convex lens array, the scattered light is converted into multiple paths of parallel light, then the multiple paths of parallel light irradiates onto the rotating mirror or the vibrating mirror, the scattered light is focused into a spot point corresponding to each laser diode LD in the close-packed laser through the F-theta scanning field lens, and the rotating mirror or the vibrating mirror moves under the control of the corresponding corner drive. The invention is suitable for any exposure requirement, whether the fine line high-energy exposure or the mixed wave exposure, and the quantity can meet the requirement only by changing the type of the laser diode LD.

Description

Laser direct writing lithography device and method
Technical Field
The invention belongs to the technical field of PCB plate making, and particularly relates to a laser direct writing lithography device and method.
Background
The current digital exposure equipment using PCB plate making mainly comprises a laser direct imaging exposure machine of DMD laser and an exposure machine of single-point turning mirror technology.
The laser direct imaging exposure machine of the DMD laser is limited and the maximum light power which can be born by a single DMD is limited, and when the energy required for PCB exposure is large, the exposure speed is slow. Meanwhile, the manufacturing technology of the DMD belongs to the MEMS manufacturing technology, and the plating is mainly aluminum. Therefore, only laser exposure of 400nm or more can be used, and the exposure requirement of 355-455 nm wavelength is required for the image solder mask exposure, which is difficult to meet. At present, the PCB of the solder mask layer is exposed, the wavelength is in the range of 355-455 nm, and the exposure requirement of high energy is very big, and the DMD can hardly meet the requirement of solder mask exposure.
The exposure scheme of Australian-Tibet technology is a high-speed turning mirror scheme, which can solve the problems, but the laser uses high-speed pulse laser, the power of the laser is limited, the technology cannot meet the requirement of high-function exposure, and meanwhile, only one wavelength laser can be used, and meanwhile, the exposure speed is limited by the switching speed of the laser.
Disclosure of Invention
In order to solve the technical problems, the invention provides a laser direct writing lithography device and a method, and the specific technical scheme is as follows:
the laser direct writing lithography device comprises a moving platform, a laser control board, a computer, an exposure unit arranged on the moving platform, a camera unit connected with the computer and a platform controller, wherein the platform controller is connected with a controlled end of a driving unit; the exposure unit comprises a close-packed laser, a convex lens array, a turning mirror or a vibrating mirror, an F-theta scanning field lens and corner drive of the turning mirror or the vibrating mirror, which are connected with a laser control board through signals, wherein scattered light emitted by an optical fiber array in the close-packed laser is scattered onto the convex lens array, the scattered light is converted into multiple paths of parallel light, then the multiple paths of parallel light irradiates onto the turning mirror or the vibrating mirror, the scattered light is focused into a spot point corresponding to each laser diode LD in the close-packed laser through the F-theta scanning field lens, and the turning mirror or the vibrating mirror moves under the control of the corresponding corner drive.
Specifically, the rotating mirror is a polyhedral rotating mirror, and the vibrating mirror is a one-dimensional vibrating mirror or a two-dimensional vibrating mirror.
Specifically, the exposure unit array is provided in plurality.
Specifically, the close-packed laser comprises an optical fiber array, a laser diode array, a close-packed optical fiber head and a driving plate, each optical fiber is coupled with a corresponding laser diode LD, the interface of the close-packed optical fiber head is correspondingly connected with the corresponding optical fiber, the optical fibers are arranged in a plurality of rows, each row is formed by arranging a plurality of optical fibers at equal intervals, and the laser diodes LD are arranged on a bracket according to a set sequence; the laser diode LD is a single-wavelength laser tube or a combination of laser tubes with multiple wavelengths, and the driving plate drives the corresponding laser diode LD switch;
the laser control board is connected with the driving board and controls each laser diode LD on the driving board to be turned on or turned off according to the designated power; the angle signal of the oscillating mirror or the rotating mirror is connected with the oscillating mirror to determine the movement position of the oscillating mirror or the rotating mirror; the position information of the platform is determined by being connected with the position signal of the platform controller; the receiving computer sends out the corresponding figure data of each exposure unit.
Specifically, the laser control board is in communication with the computer in one of a network port, an optical fiber, a USB and an HDMI interface.
Specifically, the mobile platform comprises a bottom platform and a portal frame arranged on the bottom platform, the calibration camera and the sucker move back and forth on a scanning shaft of the bottom platform, and the scanning shaft vertically passes through the portal frame; the alignment camera and the exposure units are respectively and correspondingly arranged on an alignment shaft and a stepping shaft which correspond to each other on the portal frame, the alignment shaft and the stepping shaft are arranged on a horizontal support column of the portal frame in parallel, and the rotation direction of the rotating mirror or the vibrating mirror is perpendicular to the motion direction of the sucker.
Specifically, the platform controller controls the calibration camera, the sucker, the alignment camera and the exposure unit to move on corresponding shafts and is connected with the computer, and the computer calculates the position information of the calibration camera and the alignment camera and sends the position information of the platform to the laser control board.
The method for using the laser direct writing lithography device comprises the following steps:
s1, measuring the installation position of each exposure unit by using a calibration camera, and calculating the corresponding exposure pattern position by a computer according to the installation position of each exposure unit;
s2, placing the PCB to be subjected to photoetching on a sucker, aiming at a MARK of the PCB grasped by a camera, calculating the placement position of the PCB by a computer, and performing corresponding moving operation on an original exposure image by the computer according to the placement position of the PCB to ensure that the positions of the exposure images correspond to the PCB one by one;
s3, the computer cuts the pattern into a plurality of strips according to the calibration result of the step S1, wherein each strip corresponds to the exposure area of one exposure unit, and in addition, the computer needs to perform inclination treatment on the exposure pattern of each strip in advance, and the calculation formula is as follows: x=x i ；y＝y i ±x i *V 0 /V 1 The method comprises the steps of carrying out a first treatment on the surface of the Wherein x is i ，y i As the original coordinate point, V 0 The direction of the linear velocity of the movement of the light spot reflected by the vibrating mirror or the rotating mirror on the PCB is vertical to the movement direction of the sucker; v (V) 1 Is the scanning line speed in the motion direction of the sucker; x and y are transformed coordinate points;
s4, the computer rasterizes the transformed vector image and sends the rasterized vector image to a close-packed laser controller corresponding to the exposure unit;
s5, the computer sends a signal to the platform controller, the platform controller controls the platform to move, the platform feeds back a position signal to the laser control panel, and the position is set to be the y-axis position; the vibrating mirror or the rotating mirror starts to move, and the position is fed back to the laser control board and is set as an x-axis position; the laser control board controls the switch of the laser diode LD according to the current x and y positions and the corresponding image points, thereby realizing the exposure control of the graph.
The exposure control in step S5 includes a precision mode; the method comprises the following specific steps:
s51, setting the distance between two adjacent light spot centers of the F-theta scanning field lens in the light spot projected by the PCB in the motion direction of the sucker, namely in the y-axis direction, as a stepping distance, wherein the stepping distance is L; the number of the light points of the closely-spaced optical fibers is P; the time for the close-packed light spots to move one line is T;
s52, calculating the size of a pixel point of the vector image rasterization in the step S4, wherein M=L/N, and N is a natural number; the time for the close-packed light spots to move one line is T, and the moving distance of the moving platform must be strictly satisfied with the following conditions:
when the P/N remainder is zero, the platform movement distance is ((P/N-1) +1/N) the distance of L; the number of light spots used is ((P/N-1) +1/N) N; the motion speed of the platform is as follows: ((P/N-1) +1/N) L/T; the value of P/N is taken down to an integer;
when the P/N remainder is not zero, the platform movement distance is the distance of (P/N+1/N) L; the number of the used light spots is (P/N+1/N); the motion speed of the platform is as follows: (P/n+1/N) L/T; the value of P/N is taken down by an integer.
The exposure control in step S5 includes a random pattern; the method comprises the following specific steps: using all light spot exposure, a computer calculates the movement speed of a platform according to the energy required by the actual exposure of the PCB, then searches N nearest to the movement speed of the platform, and rasterizes the graph; the stage exposes at the actual calculated speed, each spot exposes the specific line of data, and the data exposure of the corresponding line is used when the stage moves to the closest line of data.
The invention has the advantages that: the method is suitable for any exposure requirement, whether the fine line high-energy exposure or the mixed wave exposure is carried out, and the requirements can be met only by changing the types and the quantity of the laser diodes LD.
Drawings
FIG. 1 is a block diagram of a laser direct write lithography apparatus according to the present invention.
Fig. 2 (a) and 2 (b) show the arrangement of closely-spaced optical fibers.
FIG. 3 (a) is a schematic view of the structure of a closely spaced optical fiber head
Fig. 3 (b) is an enlarged view of the arrangement of the optical fiber portion in the direction a in fig. 3 (a).
FIG. 4 is a schematic view of an exposure unit
Fig. 5 (a) is a schematic diagram in 1/2 step mode.
Fig. 5 (b) is a schematic diagram in 1/3 step mode.
In the figure:
1. a bottom platform; 111. a scanning axis; 112. scanning driving; 113. calibrating a camera; 114. a suction cup;
2. a portal frame; 21. a horizontal support column; 221. a step shaft; 222. step driving; 223. an exposure unit;
2230. a laser control board; 2231. an optical fiber array; 2232. a laser diode array; 2233. closely-spaced optical fiber heads; 2234. a driving plate; 2235. driving a corner; 2236. a convex lens array; 2237. a turning mirror or a vibrating mirror; 2238. f-theta scanning field lens.
231. An alignment shaft; 3. computer with a memory for storing data
Detailed Description
As shown in fig. 1 and 4, a laser direct writing lithography apparatus includes a moving stage, a laser control board 2230, a computer 3, an exposure unit 223 placed on the moving stage, a camera unit connected to the computer 3, and a stage controller.
The exposure unit 223 includes a close-packed laser, a convex lens array 2236, a turning mirror or vibrating mirror 2237, an F- θ scanning field mirror 2238, and a corner drive 2235 of the turning mirror or vibrating mirror 2237, where the close-packed optical fiber head 2233 outputs scattered light emitted by an optical fiber onto the convex lens array 2236, converts the scattered light into multiple parallel light, irradiates the turning mirror or the vibrating mirror, and focuses the scattered light into a spot corresponding to each laser diode LD through the F- θ scanning field mirror 2238; the rotating mirror is a polyhedral rotating mirror, and the vibrating mirror is a one-dimensional vibrating mirror or a two-dimensional vibrating mirror; the rotating or vibrating mirror 2237 moves under the control of the corresponding rotation angle drive 2235, and the array of exposure units 223 is provided in plurality, and the array in fig. 1 is provided in six.
The close-packed laser comprises an optical fiber array 2231, a laser diode array 2232, a close-packed optical fiber head 2233 and a driving plate 2234, wherein each optical fiber is coupled with a corresponding laser diode LD, the interface of the close-packed optical fiber head 2233 is correspondingly connected with the corresponding optical fiber, a plurality of optical fibers are arranged in each row at equal intervals, and the laser diodes LD are arranged on a bracket according to a set sequence; the laser diode LD is a single wavelength laser tube or a combination of multiple wavelength laser tubes, and the driving board 2234 drives the corresponding laser diode LD switch. The fiber array 2231 is illustrated in fig. 2 (a) and 2 (b), where white and black circles in fig. 2 (b) represent different wavelengths, respectively.
The laser control board 2230 is connected to the driving board 2234, and controls each laser diode LD on the driving board 2234 to be turned on or off according to a specified power; the angle signal of the oscillating mirror or the rotating mirror is connected with the oscillating mirror to determine the movement position of the oscillating mirror or the rotating mirror; the position information of the platform is determined by being connected with the position signal of the platform controller; connected to the computer 3, the receiving computer 3 sends out graphic data corresponding to each exposure unit 223. The laser control board 2230 communicates with the computer 3 in one of a network port, an optical fiber, a USB and an HDMI.
The mobile platform comprises a bottom platform 1 and a portal frame 2 arranged on the bottom platform 1, wherein a calibration camera 113 and a sucking disc 114 move back and forth on a scanning shaft 111 of the bottom platform 1, and the scanning shaft 111 vertically penetrates through the portal frame 2; the alignment camera and the plurality of exposure units 223 are respectively and correspondingly arranged on the corresponding alignment shaft 231 and the stepping shaft 221 on the portal frame 2, the alignment shaft 231 and the stepping shaft 221 are arranged on the horizontal support column 21 of the portal frame 2 in parallel, and the stepping drive 222 drives the exposure units 223 to move back and forth on the stepping shaft 221. The direction of rotation of the rotating or vibrating mirror 2237 is perpendicular to the direction of motion of the suction cup 114.
The camera unit comprises an alignment camera, a sucking disc 114 and a calibration camera 113, wherein the alignment camera comprises a sucking disc 114 arranged on a platform, a calibration camera 113 positioned on the sucking disc 114 and an alignment camera arranged on a portal frame 2, the calibration camera 113 is fixed at a position close to the side of the sucking disc 114, and the sucking disc 114 is used for sucking a PCB to be photoetched and calibrating the position and the area range of each exposure unit 223; the moving alignment camera is used for capturing MARK positions of the exposed PCB and determining the placement position of each PCB; the computer 3 correspondingly changes the original exposure pattern according to the placement position of the PCB, and ensures one-to-one correspondence with the position of the PCB;
the mobile platform comprises a bottom platform 1 and a portal frame 2 arranged on the bottom platform 1, wherein the calibration camera 113 and the sucking disc 114 move back and forth on a scanning shaft 111 of the bottom platform 1 under the action of a scanning drive 112, and the scanning shaft 111 vertically penetrates through the portal frame 2; the alignment camera and the exposure unit 223 are respectively and correspondingly arranged on corresponding alignment shafts 231 and stepping shafts 221 on the gantry 2, and the alignment shafts 231 and the stepping shafts 221 are arranged on the horizontal support column 21 of the gantry 2 in parallel.
The stage controller controls the movement of the calibration camera 113 and the alignment camera while controlling the suction cup 114 to move for exposure movement, and is connected to the computer 3, and the computer 3 calculates the position information of the calibration camera 113, the alignment camera and the laser control board 2230, and sends the position information of the stage to the laser control board 2230.
The method for using the laser direct writing lithography device comprises the following steps:
s1, measuring the installation position of each exposure unit 223 by using a calibration camera 113, and calculating a corresponding exposure pattern position by using the computer 3 according to the installation position of each exposure unit 223;
s2, placing the PCB to be subjected to photoetching on a sucker 114, aiming at a MARK of the PCB grasped by a camera, calculating the placement position of the PCB by a computer 3, and performing corresponding moving operation on an original exposure image by the computer 3 according to the placement position of the PCB to ensure that the position of the exposure image corresponds to the PCB one by one;
s3, the computer 3 cuts the graph into a plurality of strips according to the calibration result of the step S1, and each strip corresponds to the exposure area of one exposure unit 223. Because the galvanometer or the rotating mirror moves and the platform moves, a transverse line of exposure of the galvanometer on the PCB becomes an oblique line. To ensure that each stripe is exposed correctly. The computer 3 needs to perform the tilting process in advance to ensure the correctness of the final exposure pattern. The calculation formula is as follows: x=x i ；y＝y i ±x i *V 0 /V 1 The method comprises the steps of carrying out a first treatment on the surface of the Wherein x is i ，y i As the original coordinate point, V 0 For oscillating or turning mirror reflectionThe linear velocity of the spot movement on the PCB is perpendicular to the chuck 114 movement; v (V) 1 Is the scan line speed in the direction of motion of chuck 114; and x and y are coordinate points after transformation.
S4, the computer 3 rasterizes the transformed vector image to a laser control board 2230, and the laser control board 2230 corresponds the rasterized image to the station of the optical unit at the moment;
s5, the computer 3 sends a signal to a platform controller, the platform controller controls the platform to move, and the platform feeds back a position signal to the laser control board 2230 and sets the position as a y-axis position; the galvanometer or turning mirror starts to move and feeds back the position to the laser control board 2230, set to the x-axis position; the laser control board 2230 controls the switching of the laser diode LD according to the current x, y positions and the corresponding image points, thereby realizing the exposure control of the pattern. Specific exposure control modes are two modes:
when in the precision mode:
s51, setting the distance between two adjacent light spot centers of the light spots projected by the F-theta scanning field lens 2238 on the PCB in the motion direction of the platform, namely the y-axis direction, as a stepping distance, wherein the stepping distance is L; the number of the light points of the closely-spaced optical fibers is P; the time for the close-packed light spots to move one line is T;
s52, calculating the size of a pixel point of the vector image rasterization in the step S4 to be M=L/N, wherein N is a natural number, the time T of the close-packed light spots moving one line, and the moving distance of the moving platform must strictly meet the following conditions:
when the P/N remainder is zero, the platform movement distance is ((P/N-1) +1/N) L. The number of spots used is ((P/N-1) +1/N) N, the stage movement speed is: ((P/N-1) +1/N) L/T. The value of P/N is taken down to an integer;
when the P/N remainder is not zero, the stage motion distance is the distance of (P/n+1/N) x L. The number of light spots used is (P/n+1/N), the stage movement speed is: (P/n+1/N) L/T. The value of P/N is taken down by an integer.
As shown in fig. 5 (a), when p=16 and n=2, the densely arranged light spots move for one row, and the moving platform moves for a distance (7+1/2) L. 15 spots are used. This ensures that each spot is exposed 2 times. If 16 points are used, the last point corresponds to three exposures, resulting in exposure energies that are different from elsewhere. The motion speed of the platform is as follows: (7+1/2) L/T;
as shown in fig. 5 (b), when p=16 and n=3, the densely arranged light spots move for one row, and the moving platform moves for a distance (5+1/3) L. 16 spots are used. This ensures that each spot is exposed 3 times. The motion speed of the platform is as follows: (5+1/3) L/T.
Therefore, in the precision mode, the number of times of exposure per point can be ensured to be uniform. The energy of each part of the whole PCB is consistent, but the movement speed of the platform is discrete. The computer 3 needs to calculate the movement speed of the stage according to the energy required for the actual exposure of the PCB board and then find the N nearest to this speed. The motion speed of the platform is recalculated according to the N value.
When in random mode:
the random pattern does not take into account the uniformity of the exposure energy, using all spot exposures. The computer 3 calculates the movement speed of the platform according to the energy required by the actual exposure of the PCB, then searches N pairs of patterns closest to the speed to carry out rasterization, the platform exposes at the actual calculated speed, each light spot point exposes specifically what line of data, and uses which line of data to expose by the movement of the platform closest to which line of data. Thus, random mode exposure can use the energy of the laser to the maximum, but the energy of exposure cannot be ensured to be uniform.
Which exposure mode is used is determined according to the specific use requirement of the user.
The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (10)

1. The laser direct-writing lithography device comprises a moving platform, a laser control board (2230), a computer (3), an exposure unit (223) arranged on the moving platform, a camera unit connected with the computer (3) and a platform controller, wherein the platform controller is connected with a controlled end of a driving unit; the exposure unit (223) comprises a close-packed laser, a convex lens array (2236), a rotating mirror or vibrating mirror (2237), an F-theta scanning field mirror (2238) and a corner drive (2235) of the rotating mirror or vibrating mirror (2237) which are connected with a laser control board through signals, scattered light emitted by an optical fiber array (2231) in the close-packed laser is scattered onto the convex lens array (2236), the scattered light is converted into multiple paths of parallel light, then the multiple paths of parallel light irradiates onto the rotating mirror or the vibrating mirror, the scattered light is focused into a spot point corresponding to each laser diode LD in the close-packed laser through the F-theta scanning field mirror (2238), and the rotating mirror or the vibrating mirror (2237) moves under the control of the corresponding corner drive (2235).
2. The apparatus of claim 1, wherein the turning mirror is a polyhedral turning mirror and the galvanometer is a one-dimensional galvanometer or a two-dimensional galvanometer.
3. A laser direct write lithography apparatus as claimed in claim 1, characterized in that the exposure unit (223) array is provided in plurality.
4. The laser direct writing lithography apparatus according to claim 1, wherein the close-packed laser includes an optical fiber array (2231), a laser diode array (2232), a close-packed optical fiber head (2233), and a driving board (2234), each optical fiber is coupled with a corresponding laser diode LD, an interface of the close-packed optical fiber head (2233) is correspondingly connected with the corresponding optical fiber, the optical fibers are arranged in several rows, each row is arranged with several optical fibers at equal intervals, and the laser diodes LD are mounted on the support according to a set sequence; the laser diode LD is a single-wavelength laser tube or a combination of laser tubes with multiple wavelengths, and the driving board (2234) drives the corresponding laser diode LD switch;
the laser control board (2230) is connected with the driving board (2234) and controls each laser diode LD on the driving board (2234) to be turned on or off according to a specified power; the angle signal of the oscillating mirror or the rotating mirror is connected with the oscillating mirror to determine the movement position of the oscillating mirror or the rotating mirror; the position information of the platform is determined by being connected with the position signal of the platform controller; is connected with the computer (3), and the receiving computer (3) sends out the corresponding graphic data of each exposure unit (223).
5. The laser direct writing lithography apparatus according to claim 4, wherein the laser control board (2230) communicates with the computer (3) in one of a portal, an optical fiber, a USB, and an HDMI.
6. A laser direct write lithography apparatus as claimed in claim 3, characterized in that the moving stage comprises a bottom stage (1) and a gantry (2) arranged on the bottom stage (1), the calibration camera (113) and suction cup (114) being moved back and forth on a scanning axis (111) of the bottom stage (1), said scanning axis (111) passing vertically through the gantry (2); the alignment camera and the exposure units (223) are respectively and correspondingly arranged on an alignment shaft (231) and a stepping shaft (221) which are respectively arranged on the portal frame (2), the alignment shaft (231) and the stepping shaft (221) are arranged on a horizontal support column (21) of the portal frame (2) in parallel, and the rotating direction of the rotating mirror or the vibrating mirror (2237) is perpendicular to the moving direction of the sucker (114).
7. The laser direct write lithography apparatus according to claim 6, wherein the stage controller controls the calibration camera (113), the chuck (114), the alignment camera, and the exposure unit (223) to move on corresponding axes, and is connected to the computer (3), and the computer (3) calculates positional information of the calibration camera (113) and the alignment camera, and sends positional information of the stage to the laser control board (2230).
8. A method of using a laser direct write lithographic apparatus according to any one of claims 1 to 7, comprising the steps of:
s1, measuring the installation position of each exposure unit (223) by using a calibration camera (113), and calculating the corresponding exposure pattern position by a computer (3) according to the installation position of each exposure unit (223);
s2, placing the PCB to be subjected to photoetching on a sucker (114), aiming at a MARK of the PCB grasped by a camera, calculating the placement position of the PCB by a computer (3), and performing corresponding moving operation on an original exposure image by the computer (3) according to the placement position of the PCB to ensure that the position of the exposure image corresponds to the PCB one by one;
s3, the computer (3) cuts the pattern into a plurality of strips according to the calibration result of the step S1, wherein each strip corresponds to the exposure area of one exposure unit (223), and in addition, the computer (3) needs to perform tilt processing on each strip exposure pattern in advance, and the calculation formula is as follows: x=x i ；y＝y i ±x i *V 0 /V 1 The method comprises the steps of carrying out a first treatment on the surface of the Wherein x is i ，y i As the original coordinate point, V 0 The moving linear speed of the light spot reflected by the vibrating mirror or the rotating mirror on the PCB is perpendicular to the moving direction of the sucker (114); v (V) 1 Is the scanning line speed in the motion direction of the suction cup (114); x and y are transformed coordinate points;
s4, the computer (3) rasterizes the converted vector image and sends the rasterized vector image to a close-packed laser controller corresponding to the exposure unit (223);
s5, the computer (3) sends a signal to the platform controller, the platform controller controls the platform to move, and the platform feeds back a position signal to the laser control board (2230) and sets the position as a y-axis position; the galvanometer or turning mirror starts to move and feeds back the position to the laser control board (2230) to be set to the x-axis position; the laser control board (2230) controls the laser diode LD to switch according to the current x, y position and the corresponding image point to realize the exposure control of the pattern.
9. The method according to claim 8, wherein the exposure control in step S5 includes a precision mode; the method comprises the following specific steps:
s51, setting the distance between two adjacent light spot centers of the F-theta scanning field lens (2238) in the light spot projected by the PCB in the motion direction of the sucker (114), namely in the y-axis direction, as a stepping distance, wherein the stepping distance is L; the number of the light points of the closely-spaced optical fibers is P; the time for the close-packed light spots to move one line is T;
s52, calculating the size of a pixel point of the vector image rasterization in the step S4, wherein M=L/N, and N is a natural number; the time for the close-packed light spots to move one line is T, and the moving distance of the moving platform must be strictly satisfied with the following conditions:
when the P/N remainder is zero, the platform movement distance is ((P/N-1) +1/N) the distance of L; the number of light spots used is ((P/N-1) +1/N) N; the motion speed of the platform is as follows: ((P/N-1) +1/N) L/T; the value of P/N is taken down to an integer;
when the P/N remainder is not zero, the platform movement distance is the distance of (P/N+1/N) L; the number of the used light spots is (P/N+1/N); the motion speed of the platform is as follows: (P/n+1/N) L/T; the value of P/N is taken down by an integer.
10. The method according to claim 8 or 9, wherein the exposure control in step S5 comprises a random pattern; the method comprises the following specific steps: using all light spot exposure, a computer (3) calculates the movement speed of a platform according to the energy required by the actual exposure of the PCB, then searches N nearest to the movement speed of the platform, and rasterizes the graph; the stage exposes at the actual calculated speed, each spot exposes the specific line of data, and the data exposure of the corresponding line is used when the stage moves to the closest line of data.
CN202310009055.8A 2023-01-04 2023-01-04 Laser direct writing lithography device and method Pending CN116088278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310009055.8A CN116088278A (en) 2023-01-04 2023-01-04 Laser direct writing lithography device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310009055.8A CN116088278A (en) 2023-01-04 2023-01-04 Laser direct writing lithography device and method

Publications (1)

Publication Number Publication Date
CN116088278A true CN116088278A (en) 2023-05-09

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Country Link
CN (1) CN116088278A (en)

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