CN116067683A

CN116067683A - Thermal balance detection method, thermal balance detection device and PCB processing equipment

Info

Publication number: CN116067683A
Application number: CN202111286716.9A
Authority: CN
Inventors: 季峰; 常远; 武凡凯; 韩轮成
Original assignee: Suzhou Vega Technology Co Ltd
Current assignee: Suzhou Vega Technology Co Ltd
Priority date: 2021-11-01
Filing date: 2021-11-01
Publication date: 2023-05-05

Abstract

The invention discloses a thermal balance detection method, a thermal balance detection device and PCB processing equipment, wherein the thermal balance detection method is used for detecting whether the preheating of the processing equipment reaches thermal balance or not, the processing equipment comprises a main shaft and a driving mechanism, the main shaft is used for fixing a cutter, and the thermal balance detection method comprises the following steps: preheating processing equipment; detecting and determining that the temperature of the main shaft and/or the driving mechanism reaches a preset temperature; driving a main shaft to grasp a cutter; detecting and determining that the position accuracy of the main shaft reaches a preset value; and judging that the processing equipment reaches a thermal equilibrium state. According to the heat balance detection method, when the processing equipment runs idle and is preheated, the temperature states of the main shaft and the driving mechanism are detected and determined, and the position accuracy of the main shaft is further improved, so that the processing equipment is judged to reach heat balance, the accuracy of judging the heat balance of the processing equipment can be ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the processing equipment is improved.

Description

Thermal balance detection method, thermal balance detection device and PCB processing equipment

Technical Field

The invention relates to the technical field of detection, in particular to a heat balance detection method, a heat balance detection device and PCB processing equipment.

Background

In the production process of the printed circuit board, for connection between circuit layers, installation of later-stage electronic components and the like, a drilling machine is required to be used for drilling holes in the production board, and the PCB is subjected to edge milling and forming according to design requirements. The drilling process is to drill holes with required aperture on the production plate by using a drill bit connected with the main shaft on the drilling machine through the high-speed rotation of the main shaft. During the edge milling process, a milling cutter which is connected with the main shaft by an edge milling machine is utilized, and the milling cutter mills the required shape at the edge of the production plate by the high-speed rotation of the main shaft. In the processing process, the internal temperature of the machine needs to be monitored in real time, and meanwhile, the stability of key parts is detected and judged.

In the related art, before a PCB drilling machine is used for machining a plate, the machine is preheated and run out to achieve the stable state of the machine so as to ensure the drilling quality. However, the preheating time under different working conditions is different from machine to machine, and the experience in the industry is not universal. If the preheating time is not in place, the plate is processed due to unstable temperature fluctuation, parts and plates deform along with temperature change, so that abnormal drilling and even scrapping of the plate are finally caused, otherwise, the preheating time is too long, a machine is in a heat balance state, the utilization rate of equipment is reduced, and cost waste is caused. In addition, the equipment can have shutdown conditions in the use process, such as loading and unloading, cutter replacement, abnormal alarm, equipment maintenance and the like, the influence of shutdown on the equipment state is detected and judged, distinguishing is carried out, preheating is not required in all conditions, and abnormal risks are reduced when the accurate judgment can ensure the processing efficiency. The conventional temperature sensor monitors the temperature, and only can determine whether part of heating components reach heat balance, heat transfer has hysteresis, and the components contacted with the heat source can reach a stable state after the heat source reaches balance for a period of time, so that whether the machine reaches the heat balance cannot be accurately determined by temperature detection alone.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention aims to provide a heat balance detection method which can judge whether the processing equipment reaches heat balance, reduce the abnormal processing probability, reduce the cost loss and improve the utilization rate of the processing equipment.

The invention also provides a heat balance detection device.

The invention also provides PCB processing equipment with the thermal balance detection device.

According to a first aspect of the present invention, a heat balance detection method for detecting whether or not a machining apparatus including a spindle for fixing a tool and a driving mechanism is warmed up to a heat balance, the heat balance detection method comprising: preheating processing equipment; detecting and determining that the temperature of the main shaft and/or the driving mechanism reaches a preset temperature; driving a main shaft to grasp a cutter; detecting and determining that the position accuracy of the main shaft reaches a preset value; and judging that the processing equipment reaches a thermal equilibrium state.

According to the heat balance detection method, when the processing equipment runs idle and is preheated, the temperature states of the main shaft and the driving mechanism are detected and determined, and then the position accuracy of the main shaft is further judged, so that the processing equipment is judged to reach heat balance, the accuracy of judging the heat balance of the processing equipment can be ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the processing equipment is improved.

In some embodiments, the detecting and determining that the temperature of the spindle and/or the drive mechanism reaches a preset temperature comprises: acquiring the temperature of the main shaft and/or the driving mechanism for a plurality of times; judging whether the difference value between two temperature values acquired in two adjacent times is within a preset difference value range; if yes, determining that the temperature of the main shaft and/or the driving mechanism reaches the preset temperature; if not, acquiring the temperature of the main shaft and/or the driving mechanism again and continuing to judge.

In some embodiments, the acquiring the temperature of the spindle and/or the drive mechanism multiple times comprises: the temperature of the spindle and/or the drive mechanism is acquired at a frequency every first predetermined time.

In some embodiments, the detecting and determining that the position accuracy of the spindle reaches a preset value includes: detecting the cutter for multiple times, and obtaining the center point coordinates of the main shaft stroke when detecting the cutter each time; calculating an offset value between two center point coordinates of a main shaft stroke when detecting a cutter twice, and judging whether the offset value is in a preset offset value range or not; if yes, determining that the position accuracy of the main shaft reaches a preset value; if not, repeatedly detecting the cutter, acquiring the coordinates of the central point of the main shaft stroke, calculating the offset value and judging again.

In some embodiments, the processing apparatus comprises: a tool detection module, the tool detection module comprising: the system comprises a transmitter and a receiver, wherein the transmitter transmits a detection light beam, the receiver receives the detection light beam transmitted by the transmitter, and the center point coordinates of the main shaft travel when each detection tool is acquired comprise: acquiring a first coordinate X1 of a main shaft when the cutter shields the detection light beam; acquiring a second coordinate X2 of the main shaft when the cutter leaves the detection light beam; the center point coordinates S of the spindle stroke are calculated, s=x1+ (X2-X1)/2.

In some embodiments, before the detecting and determining that the temperature of the spindle and/or the drive mechanism reaches the preset temperature, the detecting method further includes: and detecting and determining that the preheating time of the processing equipment reaches the basic preset time.

In some embodiments, the drive mechanism includes an X-axis motor, a Y-axis motor, and a Z-axis motor, and the temperature of the drive mechanism includes a temperature of the X-axis motor, a temperature of the Y-axis motor, and a temperature of the Z-axis motor.

According to a second aspect of the present invention, a heat balance detecting device for detecting whether or not preheating of a processing apparatus including a spindle for fixing a tool and a driving mechanism reaches a heat balance, the heat balance detecting device comprising: the temperature detection module is used for acquiring and determining that the temperature of the main shaft and/or the driving mechanism reaches a preset temperature; the tool detection module is used for acquiring and determining that the position precision of the spindle reaches a preset value; the control module is connected with the temperature detection module and the cutter detection module, and is used for controlling the main shaft to grasp the cutter according to the detection result of the temperature detection module and judging that the processing equipment reaches a thermal balance state according to the detection result detected by the cutter detection module.

According to the heat balance detection device, the temperature detection module is used for determining that the main shaft and the driving mechanism reach the preset temperature, and then the cutter detection module is used for detecting the cutter to determine that the position accuracy of the main shaft reaches the preset value, so that the processing equipment is judged to reach the heat balance, the detection of the preheating heat balance of the processing equipment can be realized, the accuracy of the heat balance judgment of the processing equipment is ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the processing equipment is improved.

In some embodiments, the temperature detection module detects the temperature of the spindle and/or the driving mechanism for multiple times, determines whether a difference value between two temperature values acquired in two adjacent times is within a preset difference value range, and if yes, determines that the temperature of the spindle and/or the driving mechanism reaches the preset temperature.

In some embodiments, the temperature detection module obtains the temperature of the spindle and/or drive mechanism at a frequency every first predetermined time.

In some embodiments, the tool detection module is configured to detect the tool multiple times, obtain coordinates of a center point of a spindle stroke during each tool detection, calculate an offset value between two coordinates of the center point of the spindle stroke during two adjacent tool detection, and determine whether the offset value is within a preset offset value range; if yes, determining that the position accuracy of the main shaft reaches a preset value.

In some embodiments, the tool detection module comprises: the device comprises a transmitter and a receiver, wherein the transmitter transmits a detection light beam, the receiver receives the detection light beam transmitted by the transmitter, when the cutter detection module detects the cutter, a first coordinate X1 of a main shaft when the cutter shields the detection light beam is obtained, a second coordinate X2 of the main shaft when the cutter leaves the detection light beam is obtained, and a central point coordinate S=x1+ (X2-X1)/2 of the main shaft stroke is calculated.

The PCB processing apparatus according to the third aspect of the present invention includes the heat balance detecting device according to the second aspect of the present invention.

According to the PCB processing equipment provided by the invention, by arranging the heat balance detection device of the second aspect of the embodiment, the temperature detection module can be used for firstly determining that the main shaft and the driving mechanism reach the preset temperature, and then the cutter detection module is used for detecting the cutter to determine that the position precision of the main shaft reaches the preset value, so that the PCB processing equipment is judged to reach the heat balance, the detection of the preheating heat balance of the PCB processing equipment can be realized, the accuracy of the heat balance judgment of the PCB processing equipment is ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the PCB processing equipment is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic view of a PCB processing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view of the spindle assembly shown in FIG. 1;

FIG. 3 is a schematic view of the tool detection module shown in FIG. 1;

FIG. 4 is a schematic view of the tool detector shown in FIG. 3;

fig. 5 is a control flow diagram of a thermal balance detection method according to an embodiment of the present invention.

Reference numerals:

the processing apparatus 100 is configured to process the workpiece,

the machine tool body 10, the workbench 20, the cross beam 30, the first slide rail 50, the second slide rail 60,

spindle module 40, base plate 41, spindle 42, spindle clamp 43, spindle gland 44, clamp 45,

the tool detection module 70,

mounting plate 71, base 72, tool holder 73, path detector 74, emitter 75, receiver 76.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.

A heat balance detecting method according to an embodiment of the first aspect of the present invention for detecting whether or not the preheating of the processing apparatus 100 reaches the heat balance, the processing apparatus 100 including a spindle 42 for fixing a tool and a driving mechanism that can drive the spindle 42 to move, will be described below with reference to fig. 5.

The processing apparatus 100 is described below as a specific example of the PCB processing apparatus 100, as shown in fig. 1-3, the processing apparatus 100 comprising: the machine tool comprises a machine body 10, a workbench 20, a cross beam 30 and a spindle module 40. Specifically, the workbench 20 is horizontally disposed and supported on the upper side of the machine tool 10, the upper surface of the machine tool 10 is provided with a first slide rail 50, the first slide rail 50 extends along the Y direction, and the workbench 20 is slidably disposed on the first slide rail 50. The upper side of the machine tool body 10 is provided with a cross beam 30, the cross beam 30 extends along the X direction, the cross beam 30 is supported above the machine tool body 10 and is spaced apart from the machine tool body 10 along the Z direction (namely, the up-down direction), the spindle module 40 comprises one or more spindle modules 40 which are arranged on the cross beam 30 along the X direction at intervals, wherein a second sliding rail 60 extending along the X direction is arranged on the cross beam 30, and the spindle module 40 is slidably arranged on the second sliding rail 60.

The spindle module 40 includes a base plate 41 and a spindle 42, the base plate 41 is slidably connected with the second slide rail 60, the spindle 42 is disposed on the base plate 41, and the spindle 42 is movable along the Z direction relative to the base plate 41, for example, a third slide rail extending along the Z direction is disposed on the base plate 41, and the spindle 42 is slidably disposed on the third slide rail. Further, the spindle module 40 further includes a spindle clamp 43 and a spindle gland 44, and the spindle 42 is disposed on the base plate 41 through the spindle clamp 43 and the spindle gland 44. The lower end of the spindle 42 is provided with a clamp 45, the clamp 45 being used for clamping a tool for machining a workpiece to be machined, for example, a tool for machining a PCB board.

The processing apparatus 100 further includes: the driving mechanism is used for driving the spindle 42 to move, specifically, the driving mechanism comprises an X-axis motor, a Y-axis motor and a Z-axis motor, the X-axis motor is connected with the spindle module 40 and used for driving the spindle module 40 to move along the X direction on the second slide rail 60, and the X-axis motor is arranged on the cross beam 30. The X-axis motor may include a plurality of X-axis motors in one-to-one correspondence with and connected to the plurality of spindle modules 40. The Y-axis motor is arranged on the lathe bed 10, the Y-axis motor is connected with the workbench 20 and used for driving the workbench 20 to move on the first sliding rail 50 along the Y direction, the Z-axis motor is arranged on the bottom plate 41, and the Z-axis motor is used for driving the main shaft 42 to move on the third sliding rail along the Z axis.

The processing apparatus 100 further includes: the tool detection module 70, the tool detection module 70 is disposed on the workbench 20, and the tool detection module 70 includes: the tool holder comprises a mounting plate 71, a base 72, a tool holder 73 and a tool diameter detector 74, wherein the mounting plate 71 is a horizontal plate arranged on the workbench 20, the base 72 is arranged on the mounting plate 71 and used for mounting the tool holder 73, the tool holder 73 is arranged on the base 72, the tool holder 73 is used for fixing a tool, the tool diameter detector 74 is arranged on the mounting plate 71 and is spaced from the base 72, and the tool diameter detector 74 is used for detecting the diameter of the tool. The path detector 74 includes an emitter 75 and a receiver 76, the emitter 75 emits a detection beam, the receiver 76 receives the detection beam emitted from the emitter 75, when the laser (detection beam) emitted from the emitter 75 is not shielded by an object (tool), the receiver 76 receives the laser (detection beam) and outputs a high level, and when the laser (detection beam) emitted from the emitter 75 is shielded by an object (tool), the receiver 76 does not receive the laser and outputs a low level, thereby realizing the detection of the path of the tool.

In the related art, in order to ensure the quality of the PCB drilling process performed by the PCB processing apparatus 100, the thermal equilibrium stable state of the processing apparatus 100 is generally achieved by preheating and idle running the processing apparatus 100 before the PCB processing apparatus 100 is used to drill the board. However, the preheating time varies from one processing apparatus 100 to another, and experience in the industry is not universal. If the preheating time is not in place, the temperature fluctuation is unstable, the plate is processed, parts and the plate deform along with the temperature change, so that the drilling is abnormal, even the plate is scrapped, otherwise, the preheating time is too long, the processing equipment 100 is in a heat balance state, the utilization rate of the equipment is reduced, and the cost is wasted.

Therefore, the invention provides a heat balance detection method for detecting whether the processing equipment reaches heat balance during idle preheating, so as to ensure that the processing equipment can reach heat balance, and the PCB can be drilled and processed in time after the heat balance is reached.

As shown in fig. 1, a thermal balance detection method according to an embodiment of the present invention includes:

step S1, the processing apparatus 100 is preheated. Namely: the processing device 100 is started, and the processing device 100 performs preheating idle running.

Step S2, detecting and determining that the temperature of the spindle 42 and/or the driving mechanism reaches a preset temperature. That is, the temperature of the spindle 42 and/or the driving structure is detected, it is determined whether the temperature of the spindle 42 and/or the driving mechanism reaches a preset temperature, and when it is determined that the temperature of the spindle 42 and/or the driving mechanism reaches the preset temperature, the next step is performed. In this step, only the temperature of the spindle 42 may be detected and determined to reach the preset temperature, only the temperature of the driving mechanism may be detected and determined to reach the preset temperature, and both the temperature of the spindle 42 and the temperature of the driving mechanism may be detected and determined to reach the preset temperature. It should be noted that, the preset temperature of the spindle 42 may be the same as or different from the preset temperature of the driving mechanism; the preset temperature of the spindle 42 and the preset temperature of the driving mechanism may be preset according to the specific conditions of the machining apparatus 100, the spindle 42 and the driving mechanism, and the preset temperatures of the machining apparatuses 100 of different models may be different. Alternatively, the temperature of the spindle 42 and the temperature of the drive mechanism may be detected by providing a temperature sensor.

When the temperature of the spindle 42 and/or the driving mechanism reaches the preset temperature, the processing apparatus 100 can be considered to initially meet the heat balance condition, but the detection result is inaccurate due to the hysteresis of the heat transfer of the temperature detection, so the following steps are further required to be continuously performed to determine the heat balance of the processing apparatus 100:

Step S3, the spindle 42 is driven to grasp the tool. That is, when the temperature of the spindle 42 and/or the driving mechanism reaches the preset temperature, the spindle 42 can be controlled to move to the position of the tool, the tool is grasped, the tool is detected, and at the same time, the spindle 42 grasps the tool, and when the processing device 100 finally reaches the thermal equilibrium state, the spindle 42 can drive the tool to directly process the workpiece to be processed.

Step S4, detecting and determining that the position accuracy of the spindle 42 reaches a preset value.

Step S5, it is determined that the processing apparatus 100 reaches the thermal equilibrium state.

Here, the positional accuracy of the spindle 42 refers to an error between an actual coordinate of the spindle 42 and a preset coordinate when the spindle 42 is positioned at a certain preset coordinate position, and since the tool is fixed to the spindle 42, the position at which the tool is directed, that is, the position at which the spindle 42 is located, the positional accuracy of the spindle 42 may be: the actual coordinates at which the tool is pointed at the machining position are error from the theoretical coordinates of the machining position.

When the machining apparatus 100 runs idle to preheat, the overall temperature of the spindle module 40 of the machining apparatus 100 is increased compared with that of the spindle module 40 without preheating, and thus, the overall structure of the spindle module 40 expands and contracts to some extent compared with that of the spindle module without preheating, and thus, the spindle position deviates, that is, when the spindle 42 is positioned at the theoretical position (preset coordinate position), there is a certain deviation between the actual position of the spindle 42 and the theoretical position of the spindle 42. Therefore, by further detecting and determining whether the positional accuracy of the spindle 42 reaches a preset value, it is possible to further accurately determine whether the processing apparatus 100 satisfies the heat balance condition, and thus, it is possible to improve the accuracy and reliability of the heat balance determination for the processing apparatus 100.

For example, after the tool is grabbed, the tool is driven to move by the spindle 42, so as to realize multiple detection of the tool, wherein the detection of the tool can be to detect the tool diameter of the tool, in the process of detecting the tool diameter for multiple times, the position of the spindle 42 can be obtained by obtaining the position of the tool, the position coordinate of the spindle 42 can be obtained, and then the position precision of the spindle 42 can be obtained, so that whether the position precision of the spindle 42 reaches a preset value can be judged, whether the processing equipment 100 is in thermal balance can be judged, and whether the processing equipment 100 reaches a thermal balance state of preheating idle running can be judged more accurately.

When the processing apparatus 100 reaches a thermal equilibrium state, the driving mechanism may drive the spindle 42 to drive the tool for processing a workpiece (e.g., PCB) to be processed. Thus, the probability of abnormal processing can be reduced, cost loss can be reduced, and the utilization rate of the processing equipment 100 can be improved.

According to the heat balance detection method of the embodiment of the invention, when the processing equipment 100 runs idle and is preheated, the temperature states of the main shaft 42 and the driving mechanism are detected and determined, and then the position accuracy of the main shaft 42 is further judged, so that the processing equipment 100 is judged to reach the heat balance, the accuracy of judging the heat balance of the processing equipment 100 can be ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the processing equipment 100 is improved.

In one embodiment of the present invention, detecting and determining that the temperature of the spindle 42 and/or the drive mechanism reaches a preset temperature includes: acquiring the temperature of the spindle 42 and/or the drive mechanism a plurality of times; judging whether the difference value between two temperature values acquired in two adjacent times is within a preset difference value range; if yes, determining that the temperature of the main shaft 42 and/or the driving mechanism reaches a preset temperature; if not, the temperature of the spindle 42 and/or the drive mechanism is again acquired and the determination is continued.

Further, acquiring the temperature of the spindle 42 and/or the drive mechanism multiple times includes: the temperature of the spindle 42 and/or the drive mechanism is acquired at a frequency every first predetermined time.

For example, when the processing apparatus 100 is idle to warm up, the temperature sensor may collect the temperatures T of the spindle 42 and the driving mechanism, and the time interval during which the temperature sensor collects the temperatures is a first predetermined time Δt1, the temperature sensor may transmit the collected temperature data to the data processing module, and the data processing module may compare the temperature difference between two temperature values Tn-1 and Tn of the spindle 42 (or the driving mechanism) acquired two adjacent times with a preset difference Δt, and when the difference between Tn and Tn-1 is greater than Δt, continue to collect the temperature of the spindle 42 (or the driving mechanism). When the difference between Tn and Tn-1 is less than ΔT, the acquisition of the temperature of each spindle 42 is stopped, at which point the temperature of the spindles 42 and/or the drive mechanism has reached a preset temperature.

It will be appreciated that when the processing apparatus 100 reaches a thermal equilibrium state of run-flat preheating, the temperature of the spindle module 40 may be maintained in a stable range, and the positional deviation of the spindle 42 affected by the temperature may also be maintained in the stable range. Thus, in one embodiment of the present invention, detecting and determining that the positional accuracy of the spindle 42 reaches a preset value includes: detecting the cutter for multiple times, and acquiring the center point coordinates of the travel of the main shaft 42 when detecting the cutter each time; calculating an offset value between two center point coordinates of the travel of the main shaft 42 when the cutter is detected twice, and judging whether the offset value is in a preset offset value range or not; if yes, determining that the position accuracy of the main shaft reaches a preset value; if not, repeatedly detecting the tool, acquiring the coordinates of the center point of the spindle 42, calculating the offset value and judging again.

For example, when the machining apparatus 100 runs empty and warms up, the tool is detected a plurality of times, specifically, at a frequency of every second predetermined time Δt2, during which the acquired center point coordinates of the spindle 42 stroke are transmitted to the data processing module, which may compare the offset value between the two center points Sn-1 and Sn of the adjacent two acquired spindle 42 strokes with the preset offset value Δs, and when the offset value of Sn and Sn-1 is larger than Δs, continue to detect the tool next time and acquire the center point of the spindle 42 again. When the difference between Sn and Sn-1 is smaller than DeltaS, the detection of the tool is stopped, and at this time, the position accuracy of the spindle is judged to reach a preset value.

In one embodiment of the present invention, the processing apparatus 100 may include: the tool detection module 70, the tool detection module 70 includes: an emitter 75 and a receiver 76, the emitter 75 emitting a detection beam, the receiver 76 receiving the detection beam emitted by the emitter 75. When the laser (detection beam) emitted by the emitter 75 is not blocked by an object (cutter), the receiver 76 receives the laser (detection beam) and outputs a high level, and when the laser (detection beam) emitted by the emitter 75 is blocked by an object (cutter), the receiver 76 outputs a low level without receiving the laser, thereby realizing the detection of the cutter diameter of the cutter.

Further, acquiring the center point coordinates of the spindle 42 stroke each time the tool is detected includes: acquiring a first coordinate X1 of the main shaft 42 when the cutter shields the detection light beam; acquiring a second coordinate X2 of the spindle 42 when the tool leaves the detection beam; the center point coordinates S of the spindle 42 stroke are calculated, s=x1+ (X2-X1)/2.

For example, the machining apparatus 100 is provided with a grating scale for recording coordinates of the spindle 42, when the tool is detected, the driving mechanism drives the spindle 42 to a preset position, so that the spindle 42 moves along the X-axis direction until the tool blocks the detection beam emitted by the emitter 75, the data of the grating scale is recorded as X1, and continues to drive the spindle 42 to move along the X-axis direction until the tool leaves the detection beam emitted by the emitter 75, the data of the grating scale is recorded as X2, at this time, X2-X1 is a tool width, that is, a travel distance of the spindle 42, and coordinates s=x1+ (X2-X1)/2 of a center point of a travel of the spindle 42 are calculated. Thus, by calculating the center point coordinates of the stroke of the spindle 42 when detecting the tool a plurality of times, the offset value between the center point coordinates of every two adjacent times can be calculated, and it can be determined whether the offset value is within the preset offset value range, and when the offset value is within the preset offset value range, it can be finally determined that the machining apparatus 100 has reached the heat balance.

In one embodiment of the present invention, before detecting and determining that the temperature of the spindle 42 and/or the drive mechanism reaches the preset temperature, the detection method further includes: the preheating time of the processing apparatus 100 is detected and determined to reach the basic preset time. That is, after the preheating of the processing apparatus 100 is started, the preheating time of the processing apparatus 100 is recorded, and after the preheating time reaches the basic preset time, the detection of the temperatures of the spindle 42 and the driving mechanism is started again, and it is determined whether the temperatures of the spindle 42 and the driving mechanism reach the preset temperature. In this way, the preheating time of the processing apparatus 100 is detected before the temperature of the spindle 42 is detected, and the temperatures of the spindle 42 and the driving mechanism are not detected before the basic preset time is not reached, so that the workload of detection and calculation in the detection process can be reduced, and the detection method is simpler and is convenient to implement.

In one embodiment of the invention, the drive mechanism includes an X-axis motor, a Y-axis motor, and a Z-axis motor, and the temperature of the drive mechanism includes the temperature of the X-axis motor, the temperature of the Y-axis motor, and the temperature of the Z-axis motor. When detecting the temperature of the driving mechanism, the temperature of the X-axis motor, the temperature of the Y-axis motor, and the temperature of the Z-axis motor can be detected simultaneously. Thus, the preheating heat balance state of the processing apparatus 100 can be determined in all directions.

According to the heat balance detection device, the heat balance detection device is used for detecting whether the processing equipment reaches heat balance when the processing equipment is idle to preheat, so that the processing equipment can reach heat balance, and the PCB can be drilled and processed in time after the heat balance is reached. The machining apparatus 100 includes a spindle 42 for fixing a tool and a driving mechanism. The heat balance detection device of the embodiment of the invention comprises: a temperature detection module, a tool detection module 70, and a control module.

Specifically, the temperature detection module is configured to acquire and determine that the temperature of the spindle 42 and/or the drive mechanism reaches a preset temperature. When the processing apparatus 100 is started, the temperature detection module detects the temperature of the spindle 42 and/or the driving mechanism after the processing apparatus 100 performs the warm-up run, and determines whether the temperature of the spindle 42 and/or the driving mechanism reaches a preset temperature. The temperature detection module may only detect and determine that the temperature of the main shaft 42 reaches the preset temperature, or may only detect and determine that the temperature of the driving mechanism reaches the preset temperature, or may detect and determine that the temperature of the main shaft 42 reaches the preset temperature and the temperature of the driving mechanism reaches the preset temperature. It should be noted that, the preset temperature of the spindle 42 may be the same as or different from the preset temperature of the driving mechanism; the preset temperature of the spindle 42 and the preset temperature of the driving mechanism may be preset according to the specific conditions of the machining apparatus 100, the spindle 42 and the driving mechanism, and the preset temperatures of the machining apparatuses 100 of different models may be different. Alternatively, the temperature detection module includes a temperature sensor by which the temperature of the spindle 42 and the temperature of the drive mechanism can be detected.

The tool detection module 70 is used for acquiring and determining that the position accuracy of the spindle 42 reaches a preset value. Here, the positional accuracy of the spindle 42 refers to an error between an actual coordinate of the spindle 42 and a preset coordinate when the spindle 42 is positioned at a certain preset coordinate position, and since the tool is fixed to the spindle 42, the position at which the tool is directed, that is, the position at which the spindle 42 is located, the positional accuracy of the spindle 42 may be: the actual coordinates at which the tool is pointed at the machining position are error from the theoretical coordinates of the machining position.

The tool detection module 70 may be configured to directly detect the position accuracy of the spindle 42, or may detect the position accuracy of the spindle 42 in an indirect manner, for example, the detection of the tool by the tool detection module 70 may be configured to detect the tool diameter of the tool, and in the process of detecting the tool diameter multiple times, the position of the spindle 42 may be obtained by obtaining the position of the tool, so as to obtain the position coordinate of the spindle 42, and further obtain the position accuracy of the spindle 42.

The control module is connected with the temperature detection module and the tool detection module 70, and is used for controlling the spindle 42 to grasp the tool according to the detection result of the temperature detection module, and is used for judging that the processing equipment 100 reaches the thermal equilibrium state according to the detection result detected by the tool detection module 70.

When the temperature detection module determines that the temperature of the spindle 42 and/or the driving mechanism reaches the preset temperature, the control module can control the spindle 42 to move to the position where the cutter is located to grasp the cutter, and then the control module can control the spindle 42 to drive the cutter to move so as to detect the cutter through the cutter detection module 70.

When the machining apparatus 100 runs idle to preheat, the overall temperature of the spindle module 40 of the machining apparatus 100 is increased compared with that of the spindle module 40 without preheating, so that the overall structure of the spindle module 40 expands and contracts to some extent compared with that of the spindle module without preheating, and thus the position of the spindle 42 is deviated, that is, when the spindle 42 is positioned at the theoretical position (preset coordinate position), the actual position of the spindle 42 is deviated from the theoretical position of the spindle 42 to some extent.

Therefore, in the process of detecting the tool for multiple times, the position of the spindle 42 can be obtained by obtaining the position of the tool, so as to obtain the position coordinate of the spindle 42, and then further obtain the position accuracy of the spindle 42, so as to determine whether the position accuracy of the spindle 42 reaches the preset value, further determine whether the processing equipment 100 is in thermal equilibrium, and realize more accurate determination of whether the processing equipment 100 reaches the thermal equilibrium state of preheating idle running.

When the tool detection module 70 determines that the position accuracy of the spindle 42 reaches a preset value, the control module can determine that the processing equipment 100 is in a heat balance state when the spindle 42 drives the tool to directly process the workpiece to be processed.

According to the heat balance detection device provided by the embodiment of the invention, the temperature detection module is used for determining that the main shaft 42 and the driving mechanism reach the preset temperature, and then the cutter detection module 70 is used for detecting the cutter to determine that the position precision of the main shaft 42 reaches the preset value, so that the heat balance of the processing equipment 100 is determined, the detection of the preheating heat balance of the processing equipment 100 can be realized, the accuracy of the heat balance determination of the processing equipment 100 is ensured, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the processing equipment 100 is improved.

In one embodiment of the present invention, the temperature detection module is configured to detect the temperature of the spindle 42 and/or the driving mechanism multiple times, determine whether a difference between two temperature values acquired two adjacent times is within a preset difference range, and if yes, determine that the temperature of the spindle 42 and/or the driving mechanism reaches the preset temperature. Further, the temperature detection module obtains the temperature of the spindle 42 and/or the drive mechanism at a frequency every first predetermined time.

Specifically, when the processing apparatus 100 runs idle and is preheated, the temperature sensor of the temperature detection module collects the temperatures T of the spindle 42 and the driving mechanism every a first predetermined time Δt1, the temperature sensor may send the collected temperature data to the data processing module, and the data processing module may compare the temperature difference between two temperature values Tn-1 and Tn of the spindle 42 (or the driving mechanism) obtained two adjacent times with a preset difference Δt, and when the difference between Tn and Tn-1 is greater than Δt, continue to collect the temperature of the spindle 42 (or the driving mechanism). When the difference between Tn and Tn-1 is less than ΔT, the temperature acquisition of each spindle 42 is stopped, and the temperature detection module determines that the temperature of the spindle 42 and/or the drive mechanism has reached a preset temperature.

It will be appreciated that when the processing apparatus 100 reaches a thermal equilibrium state of run-flat preheating, the temperature of the spindle module 40 may be maintained in a stable range, and the positional deviation of the spindle 42 affected by the temperature may also be maintained in the stable range. Therefore, in one embodiment of the present invention, the tool detection module 70 is configured to detect the tool multiple times, obtain the coordinates of the center point of the travel of the spindle 42 during each tool detection, calculate the offset value between the coordinates of two center points of the travel of the spindle 42 during two adjacent tool detection, and determine whether the offset value is within the preset offset value range; if so, it is determined that the position accuracy of the spindle 42 reaches a preset value. Wherein the tool detection module 70 comprises: an emitter 75 and a receiver 76, the emitter 75 emitting a detection beam, the receiver 76 receiving the detection beam emitted by the emitter 75. When the tool detection module 70 detects a tool, a first coordinate X1 of the spindle 42 when the tool blocks the detection beam is acquired, a second coordinate X2 of the spindle 42 when the tool leaves the detection beam is acquired, and a center point coordinate s=x1+ (X2-X1)/2 of the stroke of the spindle 42 is calculated.

For example, the tool detection module 70 detects the tool at a frequency of every second predetermined time Δt2, and in the process of detecting the tool, the obtained coordinates of the center point of the travel of the spindle 42 are transmitted to the data processing module, and the data processing module may compare the offset value between two center points Sn-1 and Sn of the travel of the spindle 42 obtained two adjacent times with the preset offset value Δs, and when the offset value of Sn and Sn-1 is greater than Δs, continue to detect the tool the next time and collect the center point of the spindle 42 again. When the difference between Sn and Sn-1 is smaller than DeltaS, the detection of the tool is stopped, and at this time, the position accuracy of the spindle 42 reaches a preset value.

The method for obtaining the center point coordinate S of the stroke of the spindle 42 may be: the tool detection module 70 includes a grating ruler for recording coordinates of the spindle 42, when the tool is detected, the driving mechanism drives the spindle 42 to reach a preset position, so that the spindle 42 moves along the X-axis direction until the tool blocks the detection beam emitted by the emitter 75, data of the grating ruler is recorded as X1, the spindle 42 continues to be driven to move along the X-axis direction until the tool leaves the detection beam emitted by the emitter 75, data of the grating ruler is recorded as X2, at this time, X2-X1 is a tool width, that is, a walking distance of the spindle 42, and a center point coordinate s=x1+ (X2-X1)/2 of a stroke of the spindle 42 is calculated.

Thus, by calculating the center point coordinates of the stroke of the spindle 42 when detecting the tool a plurality of times, the offset value between the center point coordinates of every two adjacent times can be calculated, and it can be determined whether the offset value is within the preset offset value range, and when the offset value is within the preset offset value range, it can be finally determined that the machining apparatus 100 has reached the heat balance.

The PCB processing apparatus 100 according to the embodiment of the third aspect of the present invention includes the heat balance detecting device according to the embodiment of the above second aspect of the present invention.

Other components of the PCB processing apparatus 100 according to the embodiment of the present invention, such as the bed 10, the table 20, the cross beam 30, the spindle module 40, etc., and operations thereof are known to those skilled in the art, and will not be described in detail herein.

According to the PCB processing apparatus 100 of the embodiment of the present invention, by providing the heat balance detection device of the second embodiment, the temperature detection module may be used to determine that the spindle 42 and the driving mechanism reach the preset temperature, and then the tool detection module 70 is used to detect the tool to determine that the position accuracy of the spindle 42 reaches the preset value, thereby determining that the PCB processing apparatus 100 reaches the heat balance, so as to implement detection of the preheating heat balance of the PCB processing apparatus 100, ensure accuracy of the heat balance determination of the PCB processing apparatus 100, reduce abnormal processing probability, reduce cost loss, and improve utilization rate of the PCB processing apparatus 100.

A PCB processing apparatus 100 according to an embodiment of the present invention will be described below with reference to fig. 1 to 4, wherein the PCB processing apparatus 100 may be a drilling machine for drilling a circuit board or a molding machine for milling a circuit board.

Referring to fig. 1, the pcb processing apparatus 100 includes a bed 10, a cross member 30, and a table 20. The work table 20 is placed with a PCB board for processing. A linear motion assembly (first slide 50 and Y-axis motor) is mounted below the table 20 for providing Y-direction motion and control. The cross beam 30 is provided with a linear motion assembly (a second slide 60 and an X-axis motor) for providing X-direction motion and control to the spindle module 40. The spindle module 40 includes a Z-axis motor and a third slide for providing Z-direction motion and control of the spindle 42. The processing of the PCB is realized by the relative movement of the main shaft 42 and the PCB in the direction X, Y and Z. The tool detection module 70 is mounted on the table 20, and also relies on X, Y and Z-direction movement and control to effect movement when a determination of the condition of the processing apparatus 100 is desired.

As shown in fig. 2, the spindle module 40 includes a base plate 41, and a Z-axis motor and a third slide rail are mounted on the base plate 41 for driving the spindle 42 to move along the Z-axis direction. The spindle gland 44 and the spindle clamp 43 clamp and fix the spindle 42, and the bottom of the spindle clamp 43 is provided with a clamp 45 for clamping a tool. As shown in fig. 3, the tool detection module 70 includes a detector mounting plate 71, a tool diameter detector 74, and a tool holder 73, the tool holder 73 being mounted on a base 72.

The method for detecting the thermal balance of the above-described PCB processing apparatus 100 is described as follows:

s11, preheating the processing equipment 100;

s12, acquiring the temperature of the main shaft 42 or the driving mechanism for a plurality of times at the frequency of the preset time interval;

s13, judging whether the difference value of the temperatures detected by two adjacent times is within a preset range, specifically comparing the preset difference value with the detected difference value, if the detected difference value is smaller than or equal to the preset difference value, executing S14, and if the detected difference value is larger than the preset difference value, executing S12;

s14, starting the main shaft 42 to grasp a cutter;

s15, intermittently detecting the cutter for a plurality of times, and calculating the center point coordinate of the linear travel of the main shaft 42 during each cutter detection;

s16, judging whether the offset value of the center point coordinate obtained by two adjacent times of calculation is in a preset range, specifically comparing the preset offset value with the calculated offset value, if the calculated offset value is smaller than or equal to the preset offset value, executing S17, and if the calculated offset value is larger than the preset offset value, executing S15;

S17, the main shaft 42 drives the cutter to perform formal machining.

In S15, the calculation of the center point coordinates of the linear stroke of the spindle 42 at each tool detection includes: the receiver 76 acquires the X-axis coordinate X1 of the spindle 42 (the processing apparatus 100 is provided with a grating scale to record the coordinate or distance of the spindle 42) when the tool blocks the detection beam; the receiver 76 acquires the X-axis coordinate X2 of the spindle 42 when the tool leaves the detection beam, and calculates the center point coordinate s= (X2-X1)/2+x1.

That is, before the production board is processed, the PCB processing apparatus 100 is subjected to a preheating operation, and the temperature of each spindle 42 (or the X-axis motor, the Y-axis motor, and the Z-axis motor) is acquired by a temperature detection module (temperature sensor) at a time interval Δt1. The temperature sensor sends the collected temperatures of the main shafts 42 to the data processing module, the temperature difference between the temperatures Tn-1 and Tn of the main shafts 42 is compared with deltaT, and when the difference between the temperatures Tn and Tn-1 is larger than deltaT, the temperature of the main shafts 42 is continuously collected. When the difference between Tn and Tn-1 is less than DeltaT, the acquisition of the temperature of each spindle 42 is stopped. The temperature detection module outputs signals to the control module, the control module controls X, Y and Z-axis movement, and the main shaft 42 grabs the cutter on the cutter seat 73 to detect the cutter diameter.

When the laser light of the transmitter 75 is not blocked by an object, the receiver 76 receives the laser light and outputs a high level, and when the laser light is blocked by an object, the receiver 76 outputs a low level without receiving the laser light. The control module drives the main shaft 42 to reach a preset position, so that the main shaft 42 moves along the X-axis direction, data X1 of a grating ruler is recorded until the cutter blocks laser of the emitter 75, the main shaft 42 is continuously driven to move along the X-axis direction, data X2 of the grating ruler is recorded until the cutter leaves a laser spot of the emitter 75, center point coordinates S0= (X2-X1)/2+x1 of the travel of the main shaft 42 are calculated, cutter diameter detection is carried out again at intervals of delta t2, center point coordinates S1= (X2-X1)/2+x1 are calculated, the difference value between the center points S0 and S1 is compared with delta S, and cutter diameter detection is carried out again at intervals of delta t2 when the difference value between the S1 and the S0 is larger than delta S; when the difference between S1 and S0 is smaller than Δs, it is determined that the machining apparatus 100 has reached the thermal equilibrium state, and the machining apparatus 100 may perform the machining operation.

Meanwhile, the data processing module can record the temperature and the coordinate data of the central point of the travel of the main shaft 42 in software to form a data table, and can draw the temperature and the coordinate data of the central point at different times so as to facilitate backtracking when problems occur in the later period and form big data.

According to the PCB processing equipment 100 provided by the embodiment of the invention, the states of the heat sources such as the main shaft 42 and the driving motor are primarily judged through the temperature sensor, and the position accuracy of the main shaft 42 is further detected to reach the preset value, so that whether the PCB processing equipment 100 reaches the heat balance or not is accurately judged through two times of judgment, the abnormal processing probability is reduced, the cost loss is reduced, and the utilization rate of the PCB processing equipment 100 is improved.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat balance detecting method for detecting whether or not a preheating of a processing apparatus including a spindle for fixing a tool and a driving mechanism reaches a heat balance, characterized by comprising:

preheating processing equipment;

detecting and determining that the temperature of the main shaft and/or the driving mechanism reaches a preset temperature;

driving a main shaft to grasp a cutter;

detecting and determining that the position accuracy of the main shaft reaches a preset value;

and judging that the processing equipment reaches a thermal equilibrium state.

2. The method of claim 1, wherein detecting and determining that the temperature of the spindle and/or the drive mechanism reaches a preset temperature comprises:

acquiring the temperature of the main shaft and/or the driving mechanism for a plurality of times;

judging whether the difference value between two temperature values acquired in two adjacent times is within a preset difference value range;

If yes, determining that the temperature of the main shaft and/or the driving mechanism reaches the preset temperature;

if not, acquiring the temperature of the main shaft and/or the driving mechanism again and continuing to judge.

3. The method according to claim 2, wherein the acquiring the temperature of the spindle and/or the driving mechanism a plurality of times includes: the temperature of the spindle and/or the drive mechanism is acquired at a frequency every first predetermined time.

4. A method of detecting thermal equilibrium according to any one of claims 1-3, wherein said detecting and determining that the positional accuracy of the spindle reaches a preset value comprises:

detecting the cutter for multiple times, and obtaining the center point coordinates of the main shaft stroke when detecting the cutter each time;

calculating an offset value between two center point coordinates of a main shaft stroke when detecting a cutter twice, and judging whether the offset value is in a preset offset value range or not;

if yes, determining that the position accuracy of the main shaft reaches a preset value;

if not, repeatedly detecting the cutter, acquiring the coordinates of the central point of the main shaft stroke, calculating the offset value and judging again.

5. The method of claim 4, wherein the processing apparatus comprises: a tool detection module, the tool detection module comprising: a transmitter that transmits a detection beam, and a receiver that receives the detection beam transmitted by the transmitter,

The acquiring the center point coordinates of the spindle stroke when detecting the tool each time comprises the following steps:

acquiring a first coordinate X1 of a main shaft when the cutter shields the detection light beam;

acquiring a second coordinate X2 of the main shaft when the cutter leaves the detection light beam;

the center point coordinates S of the spindle stroke are calculated, s=x1+ (X2-X1)/2.

6. The method according to claim 1, wherein before the detecting and determining that the temperature of the spindle and/or the driving mechanism reaches a preset temperature, the detecting method further comprises:

and detecting and determining that the preheating time of the processing equipment reaches the basic preset time.

7. The method of claim 1, wherein the drive mechanism comprises an X-axis motor, a Y-axis motor, and a Z-axis motor, and wherein the temperature of the drive mechanism comprises a temperature of the X-axis motor, a temperature of the Y-axis motor, and a temperature of the Z-axis motor.

8. A heat balance detecting device for detecting whether a machining apparatus, which includes a spindle for fixing a tool and a driving mechanism, is preheated to a heat balance, the heat balance detecting device comprising:

The temperature detection module is used for acquiring and determining that the temperature of the main shaft and/or the driving mechanism reaches a preset temperature;

the tool detection module is used for acquiring and determining that the position precision of the spindle reaches a preset value;

the control module is connected with the temperature detection module and the cutter detection module, and is used for controlling the main shaft to grasp the cutter according to the detection result of the temperature detection module and judging that the processing equipment reaches a thermal balance state according to the detection result detected by the cutter detection module.

9. The device according to claim 8, wherein the temperature detection module detects the temperature of the spindle and/or the driving mechanism a plurality of times, determines whether a difference between two temperature values obtained in two adjacent times is within a preset difference range, and if so, determines that the temperature of the spindle and/or the driving mechanism reaches the preset temperature.

10. The thermal balance detection device of claim 9, wherein the temperature detection module obtains the temperature of the spindle and/or drive mechanism at a frequency every first predetermined time.

11. The apparatus according to claim 8, wherein the tool detection module is configured to detect the tool a plurality of times, acquire a center point coordinate of a spindle stroke at each tool detection, calculate an offset value between two center point coordinates of the spindle stroke at two adjacent times of tool detection, and determine whether the offset value is within a preset offset value range; if yes, determining that the position accuracy of the main shaft reaches a preset value.

12. The thermal balance detection device of claim 11, wherein the tool detection module comprises: a transmitter that transmits a detection beam, and a receiver that receives the detection beam transmitted by the transmitter,

when the cutter detection module detects the cutter, a first coordinate X1 of a main shaft when the cutter shields the detection light beam is obtained, a second coordinate X2 of the main shaft when the cutter leaves the detection light beam is obtained, and a central point coordinate S=x1+ (X2-X1)/2 of the main shaft stroke is calculated.

13. The thermal balance detection device of claim 8, wherein the drive mechanism comprises an X-axis motor, a Y-axis motor, and a Z-axis motor, and wherein the temperature of the drive mechanism comprises a temperature of the X-axis motor, a temperature of the Y-axis motor, and a temperature of the Z-axis motor.

14. A PCB processing apparatus comprising a thermal balance detection device according to any one of claims 8-13.