CN116056341A - Wiring method and wiring system for signal wires of printed circuit board - Google Patents
Wiring method and wiring system for signal wires of printed circuit board Download PDFInfo
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- 238000004088 simulation Methods 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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Abstract
The invention discloses a wiring method and a wiring system of signal wires of a printed circuit board, wherein the signal wires comprise dynamic wires and static wires, and the wiring method comprises the following steps: establishing an equivalent transmission line model of the signal line according to basic parameters of the signal line, wherein the basic parameters of the signal line comprise characteristic impedance, signal frequency and target crosstalk rate of the signal line; performing crosstalk simulation on an equivalent transmission line model of the signal line to obtain an actual crosstalk rate; and carrying out wiring design on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate. The invention can avoid the problems of overlarge crosstalk rate, waste of space in the board and the like caused by the traditional wiring mode, and can achieve the maximization of the utilization of the wiring space resources of the printed circuit board.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a wiring method and a wiring system of signal wires of a printed circuit board.
Background
Along with the rapid development of high-speed large-scale digital integrated circuits towards high speed, low power consumption and high density, the integration level of a printed circuit board (Printed Circuit Board, abbreviated as PCB) is also higher and higher, the density of components and related signal wires is also higher and higher, so that coupling crosstalk is easier to occur between signals, and normal operation of an interference circuit is also higher and higher, for a hardware engineer designing the PCB, the risk of directly using an experience value wire is also higher and higher, on one hand, the crosstalk exceeds a threshold value due to the excessively dense wire, and on the other hand, the engineer generally increases the wire spacing as much as possible to reduce the crosstalk under the condition of space permission, so that the space in a board is also increased, and unnecessary space resource waste in the board is caused.
Disclosure of Invention
The invention provides a wiring method and a wiring system of signal wires of a printed circuit board, which aim to solve the problems of overlarge crosstalk rate, waste of space in the board and the like caused by a traditional wiring mode and achieve the maximization of the utilization of wiring space resources of the printed circuit board.
In a first aspect, the present invention provides a wiring method for a signal line of a printed circuit board, the signal line including a dynamic line and a static line, comprising:
establishing an equivalent transmission line model of the signal line according to basic parameters of the signal line, wherein the basic parameters of the signal line comprise characteristic impedance, signal frequency and target crosstalk rate of the signal line;
performing crosstalk simulation on an equivalent transmission line model of the signal line to obtain an actual crosstalk rate;
and carrying out wiring design on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes:
the actual crosstalk rate is smaller than the target crosstalk rate, and wiring design is performed according to the initial line spacing between the dynamic line and the static line and the initial dielectric layer thickness between the dynamic line and the static line.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes:
the actual crosstalk rate is larger than or equal to the target crosstalk rate, the dynamic line and the static line are positioned on the same layer, and the line spacing between the dynamic line and the static line is used as a variable to perform crosstalk simulation on an equivalent transmission line model of the signal line so as to obtain a line spacing minimum value corresponding to the target crosstalk rate;
and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design by the initial dielectric layer thickness between the dynamic line and the static line.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes:
the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, and wiring design is carried out on the line spacing of the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to whether the line spacing of the dynamic line and the static line can be adjusted.
Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, the line spacing between the dynamic line and the static line can be adjusted, and according to a preset database of the line spacing, the crosstalk simulation is performed on an equivalent transmission line model of the signal line to obtain a minimum line spacing value corresponding to the target crosstalk rate, and meanwhile, the thickness of the dielectric layer is kept unchanged;
and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design by the initial dielectric layer thickness between the dynamic line and the static line.
Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are located in different layers, the line spacing between the dynamic line and the static line cannot be adjusted, and the equivalent transmission line model of the signal line is subjected to crosstalk simulation by taking the thickness of the dielectric layer between the dynamic line and the static line as a variable, so that the corresponding minimum thickness value of the dielectric layer of the target crosstalk rate is obtained;
and taking the minimum value of the dielectric layer thickness corresponding to the target crosstalk rate as the dielectric layer thickness between the dynamic line and the static line, and carrying out wiring design at the initial line spacing between the dynamic line and the static line.
Optionally, performing crosstalk simulation on the equivalent transmission line model of the signal line to obtain an actual crosstalk rate includes:
the signal line is a microstrip line, and crosstalk simulation is carried out on the far end of an equivalent transmission line model of the signal line to obtain the actual crosstalk rate;
or the signal line is a strip line, and the near end of the equivalent transmission line model of the signal line is subjected to crosstalk simulation to obtain the actual crosstalk rate.
Optionally, after the wiring design is performed on the line spacing between the dynamic line and the static line and the dielectric layer thickness between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate, the method further includes:
and performing crosstalk simulation verification on the equivalent transmission line model of the signal line according to the actual line spacing between the dynamic line and the static line and the actual dielectric layer thickness between the dynamic line and the static line.
Optionally, before establishing the equivalent transmission line model of the signal line according to the basic parameters of the signal line, the method further comprises:
the signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to the formula (1);
wherein Z is 0 Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W, the width of the signal wire is W, the thickness of the copper sheet of the signal wire is T, and the distance from the signal wire to the reference plane is H;
the signal line is a strip line, and the characteristic impedance of the signal line is determined according to the formula (2);
wherein Z is 0 Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W, the width of the signal wire is W, the thickness of the copper sheet of the signal wire is T, and the distance from the signal wire to the reference plane is H;
determining a target crosstalk rate of the signal line according to formula (3);
wherein k is 0 Setting a target crosstalk rate threshold for a signal line for a user, wherein V i For dynamic line incident voltage peak, V c Is the crosstalk voltage peak of the static line.
In a second aspect, the present invention provides a wiring system for signal lines of a printed circuit board, including a wiring method for signal lines of a printed circuit board according to any embodiment of the present invention.
According to the embodiment of the invention, the equivalent transmission model of the signal line is established according to the basic parameters of the signal line, the crosstalk simulation is carried out on the equivalent transmission line model of the signal line to obtain the actual crosstalk rate, and the wiring design is carried out on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate. The problems of overlarge crosstalk rate, waste of space in the board and the like caused by the traditional wiring mode can be avoided, and the maximization of the utilization of the wiring space resources of the printed circuit board is achieved.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a block diagram of a signal line of a printed circuit board according to an embodiment of the present invention;
fig. 2 is a flowchart of a wiring method of signal lines of a printed circuit board according to an embodiment of the present invention;
fig. 3 is an equivalent transmission line model of a signal line of a printed circuit board according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for routing signal lines of a printed circuit board according to another embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the invention provides a wiring method of a signal line of a printed circuit board, fig. 1 is a structural diagram of the signal line of the printed circuit board provided by the embodiment of the invention, referring to fig. 1, the signal line comprises a dynamic line 01 and a static line 02, wherein TX is a signal transmitting end, RX is a signal receiving end, voltage meters V1 and V2 are respectively arranged at two ends of the static line 02 and used for detecting voltage changes at two ends of the static line 02, the dynamic line 01 can influence the static line 02 to cause crosstalk between signals in a transmission process, near-end crosstalk can be formed at the voltage meter V1 end of the static line 02, and far-end crosstalk can be formed at the voltage meter V2 end of the static line 02, and referring to fig. 2, the wiring method of the signal line of the printed circuit board provided by the embodiment of the invention comprises:
The signal line may be a microstrip line or a strip line. The characteristic impedance of the signal line can be determined according to the line width, copper thickness, lamination and other material parameters of the current signal line; and the target crosstalk rate can be determined by the dynamic line 01 incident voltage peak and the crosstalk voltage peak of the static line. Fig. 3 is an equivalent transmission line model of a signal line of a printed circuit board according to an embodiment of the present invention, referring to fig. 3, the signal line can be divided into shorter line segments L1 to Ln (infinitely small in the limit) containing all the characteristics of the signal line, such as loss, inductance (L) L1 ～L Ln ) And capacitor (C) L1 ～C Ln ) Characteristic, and mutual capacitance (C) is generated between the dynamic line 01 and the static line 02 m1 ～C mn ) And mutual inductance (L) m1 ～L mn )。
And 120, performing crosstalk simulation on the equivalent transmission line model of the signal line to obtain an actual crosstalk rate.
The higher the signal frequency in the signal line is, the smaller the signal rising time is, the larger the crosstalk influence is, and the minimum rising time of the current wiring signal is determined and can be used for later modeling and simulation. According to the basic parameters of the existing signal line, an equivalent transmission line model of the current signal line is established by using ANSYS simulation software, and the actual crosstalk rate of the signal line can be calculated.
And 130, carrying out wiring design on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate.
The wiring design of the printed circuit board can be determined according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate, so that the space waste in the board can be avoided while the influence of crosstalk is reduced, and the maximization of the utilization of PCB wiring space resources is achieved.
According to the embodiment of the invention, the equivalent transmission model of the signal line is established according to the basic parameters of the signal line, the crosstalk simulation is carried out on the equivalent transmission line model of the signal line to obtain the actual crosstalk rate, and the wiring design is carried out on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate. The problems of overlarge crosstalk rate, waste of space in the board and the like caused by the traditional wiring mode can be avoided, and the maximization of the utilization of the wiring space resources of the printed circuit board is achieved.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes: the actual crosstalk rate is smaller than the target crosstalk rate, and wiring design is performed according to the initial line spacing between the dynamic line and the static line and the initial dielectric layer thickness between the dynamic line and the static line.
The actual crosstalk rate is smaller than the target crosstalk rate, which means that the actual crosstalk rate formed by the initial line spacing between the dynamic line and the static line and the initial dielectric layer thickness at the moment does not reach the target crosstalk rate threshold, and the wiring design can be performed according to the initial line spacing between the current dynamic line and the static line and the initial dielectric layer thickness.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes:
the actual crosstalk rate is larger than or equal to the target crosstalk rate, the dynamic line and the static line are positioned on the same layer, and the line spacing between the dynamic line and the static line is used as a variable to perform crosstalk simulation on an equivalent transmission line model of the signal line so as to obtain a line spacing minimum value corresponding to the target crosstalk rate; and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design by the initial dielectric layer thickness between the dynamic line and the static line.
The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are positioned on the same layer, so that the thickness of an initial dielectric layer between the dynamic line and the static line is unchanged, the line spacing between the dynamic line and the static line is used as a variable, a proper step length and a proper range are set, the step length can be set to be one or a plurality of times of line width of a signal line at the moment, crosstalk simulation is carried out according to the set variable data set to obtain a line spacing minimum value corresponding to the target crosstalk rate, and wiring design is carried out according to the line spacing minimum value and the thickness of the initial dielectric layer, so that the signal line crosstalk rate is controlled within the target range, and space waste in a board caused by the use of excessive line spacing is avoided.
Optionally, the wiring design of the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate includes:
the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, and wiring design is carried out on the line spacing of the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to whether the line spacing of the dynamic line and the static line can be adjusted.
The actual crosstalk rate is greater than or equal to the target crosstalk rate, and the dynamic line and the static line are positioned on different layers, so that whether the space allowance in the printed circuit board supports line spacing adjustment between the dynamic line and the static line or not can be realized. If the space in the board is sufficient, the line spacing between the dynamic line and the static line can be adjusted to carry out wiring design; if the space in the board is insufficient, the thickness of the dielectric layer between the dynamic line and the static line is adjusted to carry out wiring design.
Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, the line spacing between the dynamic line and the static line can be adjusted, and according to a preset database of the line spacing, the crosstalk simulation is performed on an equivalent transmission line model of the signal line to obtain a minimum line spacing value corresponding to the target crosstalk rate, and meanwhile, the thickness of the dielectric layer is kept unchanged; and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design by the initial dielectric layer thickness between the dynamic line and the static line.
The space allowance in the printed circuit board is sufficient to support the line interval adjustment between the dynamic line and the static line, the line interval between the dynamic line and the static line can be set as a variable, the thickness of the initial dielectric layer is unchanged, a proper step length and a proper range are set, a preset data set of the line interval is obtained to perform crosstalk simulation, a minimum line interval value corresponding to a target crosstalk rate is obtained, and wiring design is performed according to the minimum line interval value and the thickness of the initial dielectric layer. The crosstalk rate of the signal lines is controlled within a target range, and the waste of space in the board caused by the use of excessive line spacing is avoided.
Optionally, the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are located in different layers, the line spacing between the dynamic line and the static line cannot be adjusted, and the equivalent transmission line model of the signal line is subjected to crosstalk simulation by taking the thickness of the dielectric layer between the dynamic line and the static line as a variable, so that the corresponding minimum thickness value of the dielectric layer of the target crosstalk rate is obtained; and taking the minimum value of the dielectric layer thickness corresponding to the target crosstalk rate as the dielectric layer thickness between the dynamic line and the static line, and carrying out wiring design at the initial line spacing between the dynamic line and the static line.
The space allowance in the printed circuit board is insufficient and the line spacing adjustment between the dynamic line and the static line is not supported, the thickness of a dielectric layer between the dynamic line and the static line can be set as a variable, the line spacing is kept unchanged, a proper step length and a proper range are set for crosstalk simulation, a minimum value of the thickness of the dielectric layer corresponding to a target crosstalk rate is obtained, and wiring design is carried out according to the initial line spacing and the minimum thickness of the dielectric layer. The invention can quantitatively determine the design parameters of the signal wires of the printed circuit board according to the target crosstalk value, can avoid the space waste in the board while reducing the crosstalk rate, and achieves the maximization of the utilization of the wiring space resources of the printed circuit board.
Optionally, performing crosstalk simulation on the equivalent transmission line model of the signal line to obtain an actual crosstalk rate includes: the signal line is a microstrip line, and crosstalk simulation is carried out on the far end of an equivalent transmission line model of the signal line to obtain the actual crosstalk rate; or the signal line is a strip line, and the near end of the equivalent transmission line model of the signal line is subjected to crosstalk simulation to obtain the actual crosstalk rate.
The signal line is a microstrip line, and the relative capacitive coupling is smaller than the relative inductive coupling due to different upper and lower medium layers of the microstrip line, so that the far-end crosstalk coupling of the microstrip line is larger, and the simulation software is utilized to simulate the far-end crosstalk of the equivalent transmission line model, so that the actual crosstalk rate of the microstrip line is calculated; the signal line is a strip line, and because the upper medium and the lower medium of the strip line are the same, under the normal condition, the far-end crosstalk is far smaller than the near-end crosstalk, the simulation software is utilized to simulate the near-end crosstalk of the equivalent transmission line model, and the actual crosstalk rate of the strip line is obtained through calculation.
Optionally, after the wiring design is performed on the line spacing between the dynamic line and the static line and the dielectric layer thickness between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate, the method further includes:
and performing crosstalk simulation verification on the equivalent transmission line model of the signal line according to the actual line spacing between the dynamic line and the static line and the actual dielectric layer thickness between the dynamic line and the static line.
The crosstalk parameters of the printed circuit board circuit can be tested and evaluated through the parameter setting and simulation analysis of the simulation platform, so that theoretical support is provided for the design optimization of the printed circuit board, the design efficiency is improved, the problems of long development period and low success rate caused by repeatedly optimizing the printed circuit board and manufacturing the sample are reduced, and the design parameter optimization process is limited to the software design level before the sample is manufactured.
Specifically, fig. 4 is a flowchart of a wiring method of signal lines of a printed circuit board according to another embodiment of the present invention, and referring to fig. 4, the method includes:
And 240, performing far-end crosstalk simulation on the equivalent transmission line model to obtain an actual crosstalk rate.
And 250, performing near-end crosstalk simulation on the equivalent transmission line model to obtain an actual crosstalk rate.
And 280, performing crosstalk simulation on an equivalent transmission line model of the signal line by taking the line spacing between the dynamic line and the static line as a variable to obtain a minimum value of the line spacing corresponding to the target crosstalk rate. Step 310 is then performed.
And 300, performing crosstalk simulation on an equivalent transmission line model of the signal line according to a preset database of line intervals to obtain a minimum line interval value corresponding to the target crosstalk rate.
And 320, performing crosstalk simulation on the equivalent transmission line model of the signal line by taking the thickness of the dielectric layer as a variable to obtain a corresponding minimum thickness value of the dielectric layer of the target crosstalk rate.
And 340, performing crosstalk simulation verification according to the actual line spacing between the dynamic line and the static line and the actual dielectric layer thickness.
By way of example, the invention can be simulated and verified under different working conditions, taking a certain printed circuit board as an example, firstly, the same-layer strip line is selected as a verification object, the coupling length of the static line of the dynamic line is about 30mm, the copper thickness is 1oz, the line width is 0.2mm, the rising time of an excitation signal is set to be 1ns, and the target crosstalk rate is 5%. And establishing an equivalent transmission line model by using ANSYS software, determining the optimized electrical parameters of the signal line through the distribution design and simulation results of the dynamic line and the static line, and designing a printed circuit board according to the optimized parameters, wherein the parameters before and after optimization are shown in a table 1.
TABLE 1
| Before optimization | After optimization | |
| Line spacing | 0.2mm | 0.22mm |
| Crosstalk rate | 6.21％ | 4.9％ |
Table 1 is a comparison of the same-layer routing parameters before and after optimization, and since the same-layer strip line is selected as the verification object, the thickness of the dielectric layer remains unchanged, and the crosstalk rate of the printed circuit board can be reduced by optimizing the line spacing between the dynamic line and the static line corresponding to the target crosstalk rate. The line spacing is optimized from 0.2mm before optimization to 0.22mm, so that the crosstalk rate can be reduced from 6.21% to 4.9%.
And secondly, selecting a group of strip lines with different layers for verification, wherein the coupling length of the static line of the dynamic line is about 250mm, the line width is 0.2mm, the rising time of an excitation signal is set to be 1ns, and the target crosstalk rate is 5%. And establishing an equivalent transmission line model by using ANSYS software, determining the optimized electrical parameters of the signal line through the distribution design and simulation results of the dynamic line and the static line, and designing a printed circuit board according to the optimized parameters, wherein the parameters before and after optimization are shown in a table 2.
TABLE 2
| Before optimization | After optimization | |
| Line spacing | 0.55mm | 0.55mm |
| Thickness of dielectric layer | 269μm | 400μm |
| Crosstalk rate | 5.44％ | 4.52％ |
Table 2 for comparison of different layer routing parameters before and after optimization, it can be found from table 2 that when the line spacing between the dynamic line and the static line cannot be adjusted, the crosstalk rate of the printed circuit board can be reduced by adjusting the thickness of the dielectric layer between the dynamic line and the static line corresponding to the target crosstalk rate. The dielectric layer thickness was optimized from 269 μm before optimization to 400 μm, which can reduce the crosstalk rate from 5.44% to 4.52%.
From simulation results, it can be seen that the embodiment of the invention can quantitatively design proper wiring parameters according to the target crosstalk rate, thereby ensuring that the crosstalk of signal wires is controlled within the target range, avoiding the waste of space in a board caused by the use of excessive wire spacing, and maximizing the utilization of PCB wiring space resources, thereby improving the PCB design efficiency, reducing the problems of long development period and low success rate caused by repeatedly optimizing the PCB and manufacturing the sample, and limiting the design parameter optimization process to the software design level before the sample is manufactured.
Optionally, before establishing the equivalent transmission line model of the signal line according to the basic parameters of the signal line, the method further comprises:
the signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to the formula (1);
wherein Z is o Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W, the width of the signal wire is W, the thickness of the copper sheet of the signal wire is T, and the distance from the signal wire to the reference plane is H.
The signal line is a strip line, and the characteristic impedance of the signal line is determined according to the formula (2);
wherein Z is o Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W, the width of the signal wire is W, the thickness of the copper sheet of the signal wire is T, and the distance from the signal wire to the reference plane is H.
Determining a target crosstalk rate of the signal line according to formula (3);
wherein k is o Setting a target crosstalk rate threshold for a signal line for a user, wherein V i For dynamic line incident voltage peak, V c Is the crosstalk voltage peak of the static line.
Specifically, the basic parameters of the signal line can be determined through the above formula, if the signal line is a microstrip line, the characteristic impedance of the signal line can be determined according to the formula (1), the threshold value of the target crosstalk rate is determined according to the formula (3), and the equivalent transmission line model of the current microstrip line is established by utilizing ANSYS simulation software; if the signal line is a strip line, the characteristic impedance of the signal line can be determined according to a formula (2), the threshold value of the target crosstalk rate is determined according to the formula (3), and an equivalent transmission line model of the current strip line is established by using ANSYS simulation software.
The embodiment of the invention also provides a wiring system of the signal wire of the printed circuit board, which comprises the wiring method of the signal wire of the printed circuit board.
The wiring system of the signal wires of the printed circuit board provided by the embodiment of the invention can quantitatively determine the design parameters of the signal wires of the printed circuit board according to the target crosstalk rate threshold, can avoid the space waste in the board while reducing the influence of the crosstalk rate, and achieves the maximization of the utilization of wiring space resources of the printed circuit board.
The technical scheme of the embodiment of the invention adopts a software verification method to carry out simulation analysis and design verification on crosstalk parameters of the high-frequency circuit design of the printed circuit board. By establishing an equivalent transmission line model, setting a target crosstalk rate, obtaining extreme points meeting the target crosstalk rate by utilizing simulation analysis, and quantitatively obtaining design parameters such as minimum line spacing, dielectric layer thickness and the like of wiring, thereby ensuring that the design requirement is met and simultaneously saving the space of a circuit board as much as possible. The invention provides an advanced software simulation analysis method and verification strategy for improving the design efficiency of the printed circuit board and optimizing wiring parameters, avoiding repeated optimization and manufacturing of finished product plates by virtue of test data, and reducing the development period and success rate of products. After the design of the printed circuit board is finished, the crosstalk parameters of the circuit of the printed circuit board can be tested and evaluated through the parameter setting and the simulation analysis of the simulation platform without manufacturing a sample piece and a test, so that theoretical support is provided for the design optimization of the printed circuit board, the design efficiency is improved, the problems of long development period and low success rate caused by repeatedly optimizing the printed circuit board and manufacturing the sample piece are reduced, and the design parameter optimization process is limited to a software design layer before the sample piece is manufactured.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. A wiring method of a signal line of a printed circuit board, the signal line including a dynamic line and a static line, comprising:
establishing an equivalent transmission line model of the signal line according to basic parameters of the signal line, wherein the basic parameters of the signal line comprise characteristic impedance, signal frequency and target crosstalk rate of the signal line;
performing crosstalk simulation on an equivalent transmission line model of the signal line to obtain an actual crosstalk rate;
and carrying out wiring design on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate.
2. The wiring method of signal lines of a printed circuit board according to claim 1, wherein the wiring design of the line spacing between the dynamic line and the static line and the dielectric layer thickness between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate comprises:
and the actual crosstalk rate is smaller than the target crosstalk rate, and wiring design is carried out according to the initial line interval between the dynamic line and the static line and the initial dielectric layer thickness between the dynamic line and the static line.
3. The wiring method of signal lines of a printed circuit board according to claim 1, wherein the wiring design of the line spacing between the dynamic line and the static line and the dielectric layer thickness between the dynamic line and the static line according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate comprises:
the actual crosstalk rate is larger than or equal to the target crosstalk rate, the dynamic line and the static line are positioned on the same layer, and the line spacing between the dynamic line and the static line is used as a variable to perform crosstalk simulation on an equivalent transmission line model of the signal line so as to obtain a line spacing minimum value corresponding to the target crosstalk rate;
and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design with the initial dielectric layer thickness between the dynamic line and the static line.
4. The wiring method of signal lines of a printed circuit board according to claim 1, wherein the wiring design of the line spacing between the dynamic and static lines and the dielectric layer thickness between the dynamic and static lines according to the magnitude relation of the actual crosstalk rate and the target crosstalk rate comprises:
the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, and wiring design is carried out on the line spacing between the dynamic line and the static line and the thickness of the dielectric layer between the dynamic line and the static line according to whether the line spacing between the dynamic line and the static line can be adjusted.
5. The method for wiring signal lines of a printed circuit board as recited in claim 4, wherein,
the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, the line spacing between the dynamic line and the static line can be adjusted, and according to a preset database of the line spacing, the crosstalk simulation is performed on an equivalent transmission line model of the signal line to obtain a minimum line spacing value corresponding to the target crosstalk rate, and meanwhile the thickness of the medium layer is kept unchanged;
and taking the minimum line interval value corresponding to the target crosstalk rate as the line interval between the dynamic line and the static line, and carrying out wiring design by the initial dielectric layer thickness between the dynamic line and the static line.
6. The method for wiring signal lines of a printed circuit board as recited in claim 4, wherein,
the actual crosstalk rate is greater than or equal to the target crosstalk rate, the dynamic line and the static line are positioned in different layers, the line spacing between the dynamic line and the static line can not be adjusted, and the equivalent transmission line model of the signal line is subjected to crosstalk simulation by taking the thickness of the dielectric layer between the dynamic line and the static line as a variable, so that the corresponding minimum thickness of the dielectric layer of the target crosstalk rate is obtained;
and taking the minimum value of the dielectric layer thickness corresponding to the target crosstalk rate as the dielectric layer thickness between the dynamic line and the static line, and carrying out wiring design with the initial line spacing between the dynamic line and the static line.
7. The wiring method of signal lines of a printed circuit board according to claim 1, wherein performing crosstalk simulation on an equivalent transmission line model of the signal lines to obtain an actual crosstalk rate comprises:
the signal line is a microstrip line, and crosstalk simulation is carried out on the far end of an equivalent transmission line model of the signal line to obtain the actual crosstalk rate;
or the signal line is a strip line, and crosstalk simulation is carried out on the near end of the equivalent transmission line model of the signal line, so that the actual crosstalk rate is obtained.
8. The wiring method of signal lines of a printed circuit board according to claim 1, wherein after the wiring design of the line spacing between the dynamic line and the static line and the dielectric layer thickness between the dynamic line and the static line according to the magnitude relation between the actual crosstalk rate and the target crosstalk rate, further comprises:
and performing crosstalk simulation verification on an equivalent transmission line model of the signal line according to the actual line spacing between the dynamic line and the static line and the actual dielectric layer thickness between the dynamic line and the static line.
9. The wiring method of signal lines of a printed circuit board according to claim 1, further comprising, before establishing an equivalent transmission line model of the signal lines based on basic parameters of the signal lines:
the signal line is a microstrip line, and the characteristic impedance of the signal line is determined according to the formula (1);
wherein Z is o Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W is the width of the signal wire, and T is the thickness of the copper sheet of the signal wireThe degree, H, is the distance from the signal line to the reference plane;
the signal line is a strip line, and the characteristic impedance of the signal line is determined according to the formula (2);
wherein Z is o Is the characteristic impedance of the signal line E r The dielectric constant of the printed circuit board material is W, the width of the signal wire is W, the thickness of the copper sheet of the signal wire is T, and the distance from the signal wire to the reference plane is H;
determining a target crosstalk rate of the signal line according to equation (3);
wherein k is o Setting a target crosstalk rate threshold for a signal line for a user, wherein V i For dynamic line incident voltage peak, V c Is the crosstalk voltage peak of the static line.
10. A wiring system for signal lines of a printed circuit board, characterized by comprising the wiring method for signal lines of a printed circuit board according to any one of claims 1 to 9.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116709634A (en) * | 2023-07-31 | 2023-09-05 | 苏州浪潮智能科技有限公司 | Circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116709634A (en) * | 2023-07-31 | 2023-09-05 | 苏州浪潮智能科技有限公司 | Circuit board |
| CN116709634B (en) * | 2023-07-31 | 2023-11-03 | 苏州浪潮智能科技有限公司 | Circuit board |
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