CN116052951A - High-purity copper flat wire and preparation method and application thereof - Google Patents
High-purity copper flat wire and preparation method and application thereof Download PDFInfo
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- CN116052951A CN116052951A CN202310130868.2A CN202310130868A CN116052951A CN 116052951 A CN116052951 A CN 116052951A CN 202310130868 A CN202310130868 A CN 202310130868A CN 116052951 A CN116052951 A CN 116052951A
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 136
- 239000010949 copper Substances 0.000 title claims abstract description 136
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000000137 annealing Methods 0.000 claims abstract description 13
- 238000011084 recovery Methods 0.000 claims abstract description 12
- 238000010008 shearing Methods 0.000 claims abstract description 6
- 238000001125 extrusion Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 12
- 239000004020 conductor Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 238000005728 strengthening Methods 0.000 description 5
- 238000009749 continuous casting Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01254—Flat-harness manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01209—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The embodiment of the invention discloses a high-purity oxygen-free copper flat wire, and a preparation method and application thereof. The preparation method of the high-purity oxygen-free copper flat wire comprises the following steps: continuously extruding the high-purity oxygen-free copper rod with equal diameter, and shearing and deforming to keep the diameter of the copper rod unchanged to obtain an ultrafine-grained copper rod; continuously extruding to obtain fine-grain copper flat wires; carrying out room-temperature small deformation drawing to obtain a copper flat wire with uniform edge and core structures; and (5) carrying out recovery annealing to obtain the copper flat wire. The invention improves the conductivity of the copper flat wire without reducing the mechanical property of the copper flat wire, obtains the high-purity oxygen-free copper flat wire with excellent mechanical and conductivity, and provides a material foundation for the safe and stable operation of the ultra/extra-high voltage transformer.
Description
Technical Field
The embodiment of the invention belongs to the technical field of calendaring processing, and particularly relates to a high-purity copper flat wire, a preparation method and application thereof.
Background
The stability of the ultra/extra-high voltage transformer serving as important equipment for power transmission and transformation is always the focus of industry attention. The pure copper electromagnetic wire is taken as one of important components, and the improvement of the comprehensive performance of the electric conduction and the mechanics is always the important importance of the development of the electric power industry. Currently, pure copper electromagnetic wires adopted by ultra/extra-high voltage transformers are mainly used for improving conductivity by improving purity of copper, and mechanical properties of the pure copper electromagnetic wires are improved by adopting deformation strengthening. Because the transformer works at a higher temperature for a long time, the mechanical property of the transformer can be attenuated along with the extension of time, so that a certain degree of hidden danger is brought to the safe operation of the ultra/extra-high voltage transformer. Therefore, on the premise of ensuring that the conductivity and mechanical properties of pure copper meet the requirements, the long-term working stability of the pure copper electromagnetic wire becomes a key for safe operation of the ultra/extra-high voltage transformer.
Currently, pure copper electromagnetic wires for ultra/extra-high voltage transformers are generally manufactured by up-casting. In the patents CN103406377a and CN101564738A, pure copper flat wires are prepared by room temperature drawing process. In patent CN102360635a, a pure copper flat wire is produced by a process flow of drawing and then finish rolling. When the pure copper flat wire prepared by the method is used for electromagnetic wire production, a fibrous structure is formed due to deformation reinforcement, and a large number of dislocation is generated in the pure copper flat wire, so that potential safety hazards and potential stability hazards of a transformer are necessarily caused in a long-term use process at a certain temperature. In patent CN106098246a, a composite process of continuous equal channel angular extrusion-room temperature drawing is adopted to produce a copper flat wire, besides the problem of deformation strengthening, because the driving force of forming depends on the friction force between copper and an extrusion roller in the continuous equal channel angular extrusion process, the process of the core copper and the process of the edge copper are greatly different, thereby causing the difference of the structure and the performance of the core copper and the edge copper flat wire, which inevitably leads to local premature failure of a final product in the use process, and further reduces the service life of the final product.
Therefore, how to obtain the high-purity oxygen-free copper flat wire with fine crystals and uniform tissues, so that the mechanical and conductive properties are well matched, and the requirement of the winding wire of the ultra/extra-high voltage transformer on the conductor is met, and the technical problem to be solved is currently needed to be solved.
Disclosure of Invention
Therefore, the embodiment of the invention provides a high-purity copper flat wire, and a preparation method and application thereof.
According to a first aspect of an embodiment of the present invention, there is provided a method for manufacturing a high-purity oxygen-free copper flat wire, including the steps of:
s1, carrying out equal-diameter continuous extrusion on a high-purity oxygen-free copper rod, and maintaining the diameter of the copper rod unchanged after shearing and large deformation to obtain an ultrafine-grained copper rod;
s2, continuously extruding the superfine copper rod to obtain a fine-grain copper flat wire;
s3, carrying out room-temperature small-deformation drawing on the fine-grain copper flat wire to obtain a copper flat wire with uniform edge and core structures;
s4, carrying out recovery annealing on the flat wire after the room-temperature deformation to obtain the copper flat wire with matched mechanics and conductivity.
Further, in the step S1, the temperature of continuous extrusion is 100-200 ℃, the rotating speed of the extrusion roller is 10-15 revolutions per minute, and the shearing deformation is 80-95%.
Further, in the step S2, the temperature of the continuous extrusion is 400-600 ℃, the rotating speed of the extrusion roller is 15-20 revolutions per minute, and the total deformation is more than 90%.
Further, in step S3, drawing deformation is performed at room temperature, the pass deformation amount is 13-17%, and the total deformation amount is not more than 35%.
Further, in the step S4, the recovery annealing temperature is 120-250 ℃, and the heat preservation time is 20-40min.
Further, in step S1, the high-purity oxygen-free copper rod is manufactured by an up-lead method, and the specific process is as follows:
evenly putting the cleaned electrolytic copper plates into a power frequency induction furnace at intervals for melting, wherein the melting temperature is 1240-1460 ℃, wood carbon is covered on the melt, the thickness is 40-60mm, the obtained copper liquid is drained to a heat preservation furnace, the temperature of the heat preservation furnace is controlled to be 1120-1150 ℃, and then copper rods with the diameter of 8-15 mm are led out through cooling of a crystallizer.
According to a second aspect of an embodiment of the present invention, there is provided a high purity oxygen free copper flat wire made by the method as set forth in any one of the above.
Further, the copper content of the high-purity oxygen-free copper flat wire is more than or equal to 99.997 wt%, the oxygen content is less than or equal to 3ppm, and the sum of the content of other impurities is less than or equal to 20ppm.
Further, the room temperature conductivity of the high-purity oxygen-free copper flat wire is not lower than 101% IACS, the yield strength is not less than 240MPa, the tensile strength is not less than 320MPa, and the elongation is not less than 15%.
According to a third aspect of an embodiment of the present invention, there is provided the use of a high purity oxygen free copper flat wire as defined in any one of the above in an ultra/extra high voltage transformer.
The embodiment of the invention has the following advantages:
1. according to the high-purity oxygen-free copper flat wire, the copper content is more than or equal to 99.997 wt%, the oxygen content is less than or equal to 3ppm, the sum of the content of other impurities is less than or equal to 20ppm, and the room-temperature conductivity of the high-purity oxygen-free copper flat wire is more than or equal to 101% IACS, the yield strength is more than or equal to 240MPa, the tensile strength is more than or equal to 320MPa, the elongation is more than or equal to 15%, so that the requirement of an ultra/extra-high voltage transformer winding wire on a copper conductor can be met.
2. According to the preparation method of the high-purity oxygen-free copper flat wire, provided by the invention, the technological processes of continuous casting, continuous diameter and constant diameter, continuous extrusion, drawing forming and recovery annealing are adopted, and the uniform regulation and control of the grain size and the structure of the pure copper flat wire is realized by regulating and controlling the forming and annealing technological conditions, so that the high-purity oxygen-free copper flat wire with excellent mechanical and conductive properties is finally obtained.
3. According to the preparation method of the high-purity oxygen-free copper flat wire, provided by the invention, the flat wire is formed by adopting the continuous diameter-continuous extrusion of the equal diameter, so that the superfine crystal flat wire can be obtained, and the mechanical property of pure copper is improved by adopting a fine crystal strengthening means. Compared with deformation strengthening, fine-grain strengthening enhances the stability and reliability of the high-purity oxygen-free copper flat wire in the actual service process. And then the structure non-uniformity of the edge part and the core part of the continuous extrusion copper flat wire is improved through small deformation drawing, so that the consistency of the material in the overall performance is maintained. And finally, the recovery annealing is carried out, so that the physical defects caused by deformation are eliminated, the conductivity of the copper flat wire is improved on the basis of not changing the mechanical property of the copper flat wire, and a material basis is provided for the safe and stable operation of the ultra/extra-high voltage transformer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
FIG. 1 shows the microstructure morphology of different parts of a high-purity oxygen-free copper flat wire after continuous extrusion in example 1 of the present invention;
fig. 2 is a stress-strain curve of the high-purity oxygen-free copper flat wire of example 1 after continuous extrusion at room temperature stretching;
FIG. 3 shows the microstructure morphology of different parts of the high-purity oxygen-free copper flat wire after small deformation drawing in example 1 of the present invention;
FIG. 4 is a stress-strain curve of the high purity oxygen free copper flat wire of example 1 drawn with small deformation at room temperature;
fig. 5 is a stress-strain curve of the high-purity oxygen-free copper flat wire structure and room temperature stretching after recovery annealing in example 1 of the present invention.
Detailed Description
Other advantages and advantages of the present invention will become apparent to those skilled in the art from the following detailed description, which, by way of illustration, is to be read in connection with certain specific embodiments, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The preparation method of the high-purity oxygen-free copper flat wire provided by the embodiment comprises the following steps:
(1) The high-purity oxygen-free copper rod with the diameter of 12mm is prepared by adopting the conventional upward continuous casting technology. The specific process is as follows: evenly putting the cleaned electrolytic copper plates into a power frequency induction furnace at intervals for melting, wherein the melting temperature is 1250 ℃, and wood carbon is covered on the melt, and the thickness is 50mm. The temperature of the holding furnace is 1140 ℃, and copper rods with the diameter of 12mm are led out through cooling of a crystallizer. And then carrying out constant-diameter continuous extrusion, wherein the extrusion temperature is 150 ℃, the rotation speed of an extrusion roller is 12 revolutions per minute, and the shearing deformation is 90%, so that the superfine crystal copper rod with the diameter of 12mm is obtained.
(2) The superfine crystal copper rod prepared by the steps is continuously extruded to prepare a flat wire with the diameter of 1.64mm and the diameter of 6.62mm, the extrusion temperature is 450 ℃, the rotating speed of an extrusion roller is 18 revolutions per minute, and the total deformation is 90.39%.
(3) And drawing the copper flat wire manufactured by the steps to a 1.23 mm/6.28 mm flat wire through small deformation, wherein the pass deformation is 15%, and the total deformation is 28.85%, so that the copper flat wire with uniform edge and core tissues is obtained.
(4) And (5) carrying out recovery annealing on the copper flat wire at 240 ℃ for 25 min.
As can be seen from fig. 1 (wherein, (a) center, (b) side portions) and fig. 2, the high purity anaerobic round copper flat wire of example 1 after continuous extrusion had a core average grain size of 4 μm, a concentrated and uniform size distribution, and a side portion average grain size of 5.5 μm, and a non-uniform distribution, resulting in a significant difference in mechanical properties between the side portions and the core portions. Fig. 3 (a) center (b) side and fig. 4 show the structure and mechanical properties of the copper flat wire after small deformation drawing, respectively. It can be seen that the average grain sizes of the core and the edge are basically equivalent, both are about 4.5 μm, and the distribution is relatively uniform, and the mechanical properties are not obviously different. Fig. 5 shows the structure and properties of the copper flat wire after recovery annealing without significant change in average grain size relative to the small deformed flat wire. The final copper flat wire obtained had a yield strength of 255MPa, a tensile strength of 325MPa, an elongation of 22% and a conductivity of 101.3% iacs, as shown in table 1. In addition, table 2 also shows the impurity content and purity of the high-purity oxygen-free round copper flat wire produced in example 1. It is clear from the combination of tables 1 and 2 that the high-purity anaerobic round copper flat wire prepared in example 1 can completely meet the requirement of the winding wire for the ultra/extra-high voltage transformer on the copper conductor.
Table 1 properties of the example 1 article
| Conductivity (% IACS) | Yield strength (MPa) | Tensile strength MPa | Elongation (%) |
| 101.3 | 255 | 325 | 22 |
TABLE 2 impurity content and purity of the product of example 1
Example 2
The preparation method of the high-purity oxygen-free copper flat wire provided by the embodiment comprises the following steps:
(1) The high-purity oxygen-free copper rod with the diameter of 8mm is prepared by adopting the conventional upward continuous casting technology. The specific process is as follows: evenly putting the cleaned electrolytic copper plates into a power frequency induction furnace at intervals for melting, wherein the melting temperature is 1250 ℃, and wood carbon is covered on the melt, and the thickness is 50mm. The temperature of the holding furnace is 1140 ℃, and copper rods with the diameter of 8mm are led out through cooling of a crystallizer. And then carrying out constant-diameter continuous extrusion, wherein the extrusion temperature is 200 ℃, the rotation speed of an extrusion roller is 15 revolutions per minute, and the shearing deformation is 85%, so that the superfine crystal copper rod with the diameter of 8mm is obtained.
(2) The superfine crystal copper rod prepared by the steps is continuously extruded to prepare a flat wire with the diameter of 1.08mm and the diameter of 3.85mm, the extrusion temperature is 500 ℃, the rotating speed of an extrusion roller is 20 revolutions per minute, and the total deformation is 91.72%.
(3) And drawing the copper flat wire manufactured by the steps to 0.93mm by 3.04mm flat wire through small deformation, wherein the pass deformation is 17%, and the total deformation is 32.01%, so as to obtain the copper flat wire with uniform edge and core structures.
(4) And (5) carrying out recovery annealing on the copper flat wire at 180 ℃ for 35 min.
The purity of the obtained high-purity oxygen-free copper flat wire is 99.9975% Cu, the oxygen content is 1.5ppm, and the sum of other impurity contents is not more than 18ppm. The conductivity of the alloy is 101.2 percent IACS, the yield strength is 260MPa, the tensile strength is 350MPa, and the elongation is 17 percent. The requirement of the winding wire for the ultra/extra-high voltage transformer on the copper conductor can be completely met.
Comparative example 1
The other contents were the same as in example 1 except for the following.
The continuous extrusion deformation amount in the step (2) is 83%.
The average grain size of the copper flat wire manufactured in this comparative example was measured to be 10.5 μm, and the core and the side portions thereof produced uneven structures. The purity of the copper flat wire prepared in the comparative example is 99.9975% Cu, the oxygen content is 2.4ppm, and the total content of other impurities is not more than 20ppm. The conductivity is 101.6% IACS, but the strength is reduced, the elongation is also obviously reduced, namely the yield strength is 214MPa, the tensile strength is 285MPa, and the elongation is only 10%. It can be seen that the strength and elongation of the copper flat wire manufactured in this comparative example are reduced as compared with example 1, and the requirement of the winding wire of the ultra/extra-high voltage transformer on the copper conductor is not satisfied.
Comparative example 2
The other contents were the same as in example 1 except for the following.
And (3) the deformation amount of the high-purity oxygen-free copper flat wire subjected to small deformation drawing in the step (3) is 42%.
The average grain size of the copper flat wire manufactured in this comparative example was determined to be 7.6 μm, and a small amount of elongated grains appeared locally. The copper flat wire prepared in this comparative example had an electrical conductivity of 100.4% IACS, a yield strength of 285MPa, a tensile strength of 370MPa, and an elongation of 8%. It can be seen that the strength of the copper flat wire manufactured in this comparative example was increased, but the elongation was significantly reduced, and the conductivity was also reduced, compared to example 1, and the requirement of the winding wire of the ultra/extra high voltage transformer on the copper conductor was not satisfied.
Comparative example 3
The other contents were the same as in example 1 except for the following.
The recovery annealing temperature in the step (4) is 380 ℃.
The average grain size of the copper flat wire prepared in the comparative example is 20.5 mu m, and the size distribution range is larger and is between 15 and 70 mu m. The copper flat wire prepared in this comparative example had an electrical conductivity of 101.8% IACS, a yield strength of 185MPa, a tensile strength of 247MPa and an elongation of 14%. It can be seen that the strength and elongation of the copper flat wire prepared in this comparative example are significantly reduced, and the requirement of the winding wire of the ultra/extra-high voltage transformer on the copper conductor is not satisfied, compared with example 1.
While the invention has been described in detail in the foregoing general description and specific examples, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.
Claims (10)
1. The preparation method of the high-purity oxygen-free copper flat wire is characterized by comprising the following steps of:
s1, carrying out equal-diameter continuous extrusion on a high-purity oxygen-free copper rod, and maintaining the diameter of the copper rod unchanged after shearing and large deformation to obtain an ultrafine-grained copper rod;
s2, continuously extruding the superfine copper rod to obtain a fine-grain copper flat wire;
s3, carrying out room-temperature small-deformation drawing on the fine-grain copper flat wire to obtain a copper flat wire with uniform edge and core structures;
s4, carrying out recovery annealing on the flat wire after the room-temperature deformation to obtain the copper flat wire with matched mechanics and conductivity.
2. The method for producing high purity oxygen-free copper flat wire according to claim 1, wherein in step S1, the continuous extrusion temperature is 100 to 200 ℃, the extrusion roll rotation speed is 10 to 15 rpm, and the shear deformation is 80 to 95%.
3. The method for producing high purity oxygen-free copper flat wire according to claim 1, wherein in step S2, the continuous extrusion temperature is 400-600 ℃, the extrusion roller rotation speed is 15-20 rpm, and the total deformation is 90% or more.
4. The method for producing a high purity oxygen-free copper flat wire according to claim 1, wherein in step S3, drawing deformation is performed at room temperature, the pass deformation is 13 to 17%, and the total deformation is not more than 35%.
5. The method for producing high purity oxygen-free copper flat wire according to claim 1, wherein in step S4, the recovery annealing temperature is 120-250 ℃ and the holding time is 20-40min.
6. The method for preparing the high-purity oxygen-free copper flat wire according to claim 1, wherein in the step S1, the high-purity oxygen-free copper rod is prepared by an upper-lead method, and the specific process is as follows:
evenly putting the cleaned electrolytic copper plates into a power frequency induction furnace at intervals for melting, wherein the melting temperature is 1240-1460 ℃, wood carbon is covered on the melt, the thickness is 40-60mm, the obtained copper liquid is drained to a heat preservation furnace, the temperature of the heat preservation furnace is controlled to be 1120-1150 ℃, and then copper rods with the diameter of 8-15 mm are led out through cooling of a crystallizer.
7. A high purity oxygen free copper flat wire made by the method of any one of claims 1-6.
8. The high purity oxygen-free copper flat wire according to claim 7, wherein the copper content of the high purity oxygen-free copper flat wire is equal to or more than 99.997wt.%, the oxygen content is equal to or less than 3ppm, and the sum of the remaining impurity contents is equal to or less than 20ppm.
9. The high purity oxygen-free copper flat wire according to claim 7, wherein the high purity oxygen-free copper flat wire has room temperature conductivity not lower than 101% iacs, yield strength not lower than 240MPa, tensile strength not lower than 320MPa, and elongation not lower than 15%.
10. Use of the high purity oxygen free copper flat wire of any one of claims 7 to 9 in an ultra/extra high voltage transformer.
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| CN202310130868.2A CN116052951A (en) | 2023-02-17 | 2023-02-17 | High-purity copper flat wire and preparation method and application thereof |
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| CN202310130868.2A CN116052951A (en) | 2023-02-17 | 2023-02-17 | High-purity copper flat wire and preparation method and application thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117727508A (en) * | 2023-12-21 | 2024-03-19 | 广东松田科技股份有限公司 | Manufacturing method of high-conductivity high-hardness flat enameled wire |
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2023
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117727508A (en) * | 2023-12-21 | 2024-03-19 | 广东松田科技股份有限公司 | Manufacturing method of high-conductivity high-hardness flat enameled wire |
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