CN116048154A - Automatic test method, system and equipment for multi-point sensor chip ATE - Google Patents
Automatic test method, system and equipment for multi-point sensor chip ATE Download PDFInfo
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Abstract
The invention relates to the technical field of multi-point automatic testing of sensor chips, in particular to a multi-point automatic testing method, system and equipment for sensor chips ATE. The scheme includes that a testing machine sets a current temperature measuring mode in real time, and sends the temperature measuring mode to a chip channel selection switch longitudinally through communication and acquisition; the chip channel selection switch selects a temperature sensor of the enabling part according to a temperature measurement mode; the testing machine sends a control command to the chip channel selection switch in real time through a sending bus; the chip channel selection switch sends a bus command to the corresponding temperature measuring sensor according to the control command; and the temperature data in the sensor chip is compensated by combining temperature curve control and is sent to a temperature control box, so that real-time temperature control is completed. The scheme provides a device and a method for measuring and compensating temperature, wherein each chip to be measured corresponds to a standard temperature in a single-point temperature acquisition mode, and parameters of the chip to be measured are compensated according to the standard temperature.
Description
Technical Field
The invention relates to the technical field of multi-point automatic testing of sensor chips, in particular to a multi-point automatic testing method, system and equipment for sensor chips ATE.
Background
The traditional chip temperature testing method is insufficient in precision, the difference of the ambient temperature is about 0.5 ℃, the difference of the periphery of the box body is 1 ℃, and the temperature curve obtained by the chip is insufficient in precision.
Before the technology of the invention, the simulation parameter adjustment and the test period of the existing chip temperature test method are longer, and the online adjustment is not supported; the bus test mode is not supported.
Disclosure of Invention
In view of the above problems, the present invention provides a method, a system and a device for automatically testing a multi-point sensor chip ATE, and provides a device and a method for measuring and compensating temperature, wherein each measured chip corresponds to a standard temperature in a single-point temperature acquisition mode, and parameters of the measured chip are compensated according to the standard temperature.
According to a first aspect of an embodiment of the present invention, a method for automatically testing a multi-point sensor chip ATE is provided.
In one or more embodiments, preferably, the method for automatically testing the multi-point sensor chip ATE includes:
the testing machine sets the current temperature measuring mode in real time, and sends the temperature measuring mode to the chip channel selection switch longitudinally through communication and acquisition;
the chip channel selection switch selects a temperature sensor of the enabling part according to the temperature measurement mode;
the testing machine sends a control command to the chip channel selection switch in real time through a sending bus;
the chip channel selection switch sends a bus command to the corresponding temperature measuring sensor according to the control command;
the temperature measuring sensor reads feedback information in real time according to the transmission information and sends the feedback information to the testing machine through a feedback bus;
the testing machine obtains real-time temperature data, displays the real-time temperature data on the upper computer, combines the temperature curve control compensation sensor chip internal temperature data, and sends the temperature data to the temperature control box to complete real-time temperature control.
In one or more embodiments, preferably, the testing machine sets a current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch longitudinally through communication and collection, which specifically includes:
the testing machine is connected with the chip channel selection switch through an IO pin;
the testing machine is provided with a chip to be tested, and then outputs high level through an IO pin;
the chip channel selection switch acquires the chip to be tested corresponding to the high level in real time.
In one or more embodiments, preferably, the chip channel selection switch selects the temperature sensor of the enabling part according to the temperature measurement mode, and specifically includes:
after the chip channel selection switch obtains a corresponding high-level signal, automatically matching and enabling a corresponding analog switch;
the analog switch starts to gate the tested chip, and then enables part of the temperature sensor.
In one or more embodiments, preferably, the test machine sends a control command to the chip channel selection switch in real time through a sending bus, and specifically includes:
setting the tester to enter a bus test mode;
the current feedback is obtained on line in a mode of one-by-one inspection by a single temperature measuring sensor, so that a corresponding control signal is formed;
and transmitting the control signal to the chip channel selection switch through the transmission bus by a preset protocol.
In one or more embodiments, preferably, the chip channel selection switch sends a bus command to a corresponding temperature measurement sensor according to the control command, and specifically includes:
the chip channel selection switch automatically enables the corresponding temperature measuring sensor after receiving the signal of the sending bus;
and sending the bus command in the preset protocol form to the corresponding temperature measuring sensor.
In one or more embodiments, preferably, the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the testing machine through a feedback bus, which specifically includes:
after the temperature sensor receives the bus command, automatically collecting feedback code information serving as the feedback information;
in the collecting process, the feedback information is transmitted through the feedback bus at fixed intervals and is set into a bus test mode, and the tester automatically analyzes.
In one or more embodiments, preferably, the testing machine obtains real-time temperature data, displays the real-time temperature data on an upper computer, combines temperature curve control with temperature data inside the compensation sensor chip, sends the temperature data to a temperature control box, and completes real-time temperature control, and specifically includes:
acquiring accurate temperature of a chip at a corresponding moment in historical data on a current test board by the test machine, setting forward current of a PN junction and a forward voltage drop calculation curve of the PN junction according to a first calculation formula and a second calculation formula, and reversely pushing according to preset data to acquire current forward current and voltage data of the PN junction;
under the condition that the current PN junction forward current is unchanged by reverse thrust, fitting the second calculation formula into a third calculation formula form on the testing machine to serve as a calculation mode of the actually measured PN junction forward voltage drop;
setting a calculation mode of a forward voltage drop predicted value of the PN junction according to a fourth calculation formula;
acquiring all historical test data, and calculating a first target compensation coefficient and a second target compensation coefficient by using a fifth calculation formula;
calculating the measured temperature by using a sixth calculation formula;
taking the difference between the measured temperature and the standard temperature data as the internal temperature data of the compensation sensor chip, and sending the internal temperature data to a temperature control box to complete real-time temperature control;
the first calculation formula is as follows:
wherein I is PN junction forward current, B is emission surface area,t is absolute temperature, eta is a constant related to materials and processes, K is a Boltzmann constant, q is electron charge, U is the forward voltage drop of PN junction, U 0 The potential difference between the bottom of the conduction band and the top of the valence band is absolute zero;
the second calculation formula is as follows:
the third calculation formula is as follows:
U C ＝f(T)
wherein U is C Is the measured forward voltage drop of the PN junction;
the fourth calculation formula is as follows:
U P ＝AT’+B
wherein U is P The positive voltage drop predicted value of the PN junction is that A is a first compensation coefficient, B is a second compensation coefficient, and T' is the temperature fed back by the temperature measuring sensor obtained at the corresponding moment in the historical data;
the fifth calculation formula is:
(Am，Bm)＝Arg min[Σ(U c_i -U P_i )]
wherein Am is a first target compensation coefficient, bm is a second target compensation coefficient, arg min () is a function of the first compensation coefficient and the second compensation coefficient corresponding to the minimum integrated error of the extracted forward voltage drop, U C_i For the positive voltage drop of the PN junction corresponding to the ith chip, U P_i The positive voltage drop predicted value of the PN junction corresponding to the ith chip is obtained;
the sixth calculation formula is:
T C ＝(U P -Bm)/Am
wherein T is C Is the measured temperature.
According to a second aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic test system is provided.
In one or more embodiments, preferably, the multi-point sensor chip ATE automatic test system comprises:
the mode selection module is used for setting the current temperature measurement mode in real time by the testing machine and longitudinally transmitting the temperature measurement mode to the chip channel selection switch through communication and acquisition;
the acquisition and slice selection module is used for the chip channel selection switch to select the temperature measurement sensor of the enabling part according to the temperature measurement mode;
the bus sending module is used for sending a control command to the chip channel selection switch through a sending bus in real time by the testing machine;
the information selecting module is used for sending a bus command to the corresponding temperature measuring sensor by the chip channel selecting switch according to the control command;
the information feedback module is used for reading feedback information according to the transmission information in real time by the temperature measuring sensor and sending the feedback information to the testing machine through a feedback bus;
and the temperature compensation module is used for acquiring real-time temperature data by the testing machine, displaying the real-time temperature data on the upper computer, controlling the temperature data in the compensation sensor chip by combining a temperature curve, and sending the temperature data to the temperature control box to finish real-time temperature control.
According to a third aspect of embodiments of the present invention, there is provided a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement a method according to any of the first aspect of embodiments of the present invention.
According to a fourth aspect of embodiments of the present invention there is provided an electronic device comprising a memory and a processor, the memory being for storing one or more computer program instructions, wherein the one or more computer program instructions are executable by the processor to implement the method of any of the first aspects of embodiments of the present invention.
The technical scheme provided by the embodiment of the invention can comprise the following beneficial effects:
in the scheme of the invention, the switching mode of the switch channel is controlled by ATE, so that an analog switch is enabled, the tested chip is gated, and the analog parameters of different temperatures are tested by matching with the high-low temperature box and the on-line adjustment function, thereby completing the parameter compensation of the standard temperature to the tested chip.
In the scheme of the invention, the chip to be tested is gated by enabling the corresponding analog switch, so that the purpose of testing a plurality of chips on one board is achieved, and the testing efficiency is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for automated testing of a multi-point sensor chip ATE according to one embodiment of the present invention.
Fig. 2 is a flow chart of a test machine in an automatic test method for a multi-point sensor chip ATE according to an embodiment of the present invention, which sets a current temperature measurement mode in real time and sends the temperature measurement mode to a chip channel selection switch longitudinally through communication and acquisition.
FIG. 3 is a flow chart of a temperature sensor of the chip channel selector switch in the automatic test method for multi-point sensor chip ATE according to one embodiment of the present invention.
Fig. 4 is a flow chart of the test machine in the automatic test method for the multi-point sensor chip ATE according to one embodiment of the present invention, which transmits control commands to the chip channel selection switch through the transmission bus in real time.
FIG. 5 is a flow chart of the chip channel selection switch sending a bus command to a corresponding temperature sensor according to the control command in an automatic test method for a multi-point sensor chip ATE according to an embodiment of the present invention.
FIG. 6 is a flow chart of the method for automatically testing the multi-point sensor chip ATE according to an embodiment of the present invention, wherein the temperature sensor reads feedback information in real time according to the transmission information and sends the feedback information to the tester through a feedback bus.
Fig. 7 is a flowchart showing that the tester obtains real-time temperature data and displays the real-time temperature data on an upper computer, and the temperature data is transmitted to a temperature control box in combination with temperature curve control compensation sensor chip in the automatic test method of the multi-point sensor chip ATE according to an embodiment of the present invention, so as to complete real-time temperature control.
Fig. 8 is a block diagram of a multi-point sensor chip ATE automatic test system according to an embodiment of the present invention.
Fig. 9 is a block diagram of an electronic device in one embodiment of the invention.
Detailed Description
In some of the flows described in the specification and claims of the present invention and in the foregoing figures, a plurality of operations occurring in a particular order are included, but it should be understood that the operations may be performed out of order or performed in parallel, with the order of operations such as 101, 102, etc., being merely used to distinguish between the various operations, the order of the operations themselves not representing any order of execution. In addition, the flows may include more or fewer operations, and the operations may be performed sequentially or in parallel. It should be noted that, the descriptions of "first" and "second" herein are used to distinguish different messages, devices, modules, etc., and do not represent a sequence, and are not limited to the "first" and the "second" being different types.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The traditional chip temperature testing method is insufficient in precision, the difference of the ambient temperature is about 0.5 ℃, the difference of the periphery of the box body is 1 ℃, and the temperature curve obtained by the chip is insufficient in precision.
Before the technology of the invention, the simulation parameter adjustment and the test period of the existing chip temperature test method are longer, and the online adjustment is not supported; the bus test mode is not supported.
The embodiment of the invention provides a method, a system and equipment for automatically testing a multi-point sensor chip ATE. The scheme provides a device and a method for measuring and compensating temperature, wherein each chip to be measured corresponds to a standard temperature in a single-point temperature acquisition mode, and parameters of the chip to be measured are compensated according to the standard temperature.
According to a first aspect of an embodiment of the present invention, a method for automatically testing a multi-point sensor chip ATE is provided.
FIG. 1 is a flow chart of a method for automated testing of a multi-point sensor chip ATE according to one embodiment of the present invention.
In one or more embodiments, preferably, the method for automatically testing the multi-point sensor chip ATE includes:
s101, setting a current temperature measurement mode in real time by a testing machine, and longitudinally transmitting the temperature measurement mode to a chip channel selection switch through communication and acquisition;
s102, the chip channel selection switch selects a temperature sensor of an enabling part according to the temperature measurement mode;
s103, the testing machine sends a control command to the chip channel selection switch in real time through a sending bus;
s104, the chip channel selection switch sends a bus command to the corresponding temperature sensor according to the control command;
s105, the temperature measuring sensor reads feedback information in real time according to the transmission information and sends the feedback information to the testing machine through a feedback bus;
and S106, the testing machine obtains real-time temperature data, displays the real-time temperature data on an upper computer, controls the temperature data inside the compensation sensor chip by combining a temperature curve, and sends the temperature data to a temperature control box to complete real-time temperature control.
In the embodiment of the invention, in order to realize the system, the system comprises a testing machine, two bus communication circuits (comprising a sending bus and a receiving bus, used for setting the testing machine to select to enter a bus testing mode, and capable of adjusting analog signal functions such as code return current and the like on line through single-point inspection function matching addresses), a multi-channel chip testing board (used for placing all chips), a standard temperature acquisition circuit (used for acquiring and feeding back the chip temperature), a chip channel selection circuit (used for enabling a corresponding analog switch to gate a tested chip), an upper computer and a temperature control box. And then, the analog switch is enabled by the switching mode of the control switch channel of the testing machine, the tested chip is gated, and the analog parameters of different temperatures and the on-line adjustment function are tested by matching with the high-low temperature box.
Fig. 2 is a flow chart of a test machine in an automatic test method for a multi-point sensor chip ATE according to an embodiment of the present invention, which sets a current temperature measurement mode in real time and sends the temperature measurement mode to a chip channel selection switch longitudinally through communication and acquisition.
In one or more embodiments, as shown in fig. 2, preferably, the testing machine sets a current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch longitudinally through communication and collection, which specifically includes:
s201, the testing machine is connected with the chip channel selection switch through an IO pin;
s202, setting a chip to be tested on the tester, and outputting a high level through an IO pin;
s203, the chip channel selection switch acquires the chip to be tested corresponding to the high level in real time.
In the embodiment of the invention, different sensor chips can be tested according to different sockets, and only the IO pin function on the tester needs to be modified to be matched with the pin of the tested chip.
FIG. 3 is a flow chart of a temperature sensor of the chip channel selector switch in the automatic test method for multi-point sensor chip ATE according to one embodiment of the present invention.
As shown in fig. 3, in one or more embodiments, preferably, the on-chip channel selection switch selects the temperature measurement sensor of the enabling part according to the temperature measurement mode, and specifically includes:
s301, after the chip channel selection switch obtains a corresponding high-level signal, automatically matching and enabling a corresponding analog switch;
s302, the analog switch starts to strobe the tested chip so as to enable part of the temperature sensor.
In the embodiment of the invention, the chip channel selection circuit gates the tested chips by enabling the corresponding analog switches, so that the purpose of testing a plurality of chips on one board is achieved, and the testing efficiency is improved.
Fig. 4 is a flow chart of the test machine in the automatic test method for the multi-point sensor chip ATE according to one embodiment of the present invention, which transmits control commands to the chip channel selection switch through the transmission bus in real time.
As shown in fig. 4, in one or more embodiments, preferably, the test machine sends, in real time, a control command to the chip channel selection switch through a transmission bus, and specifically includes:
s401, setting the tester to enter a bus test mode;
s402, carrying out online current feedback acquisition through a mode of individual temperature measurement sensors in a one-by-one inspection mode, and further forming corresponding control signals;
s403, transmitting the control signal to the chip channel selection switch through the transmission bus by a preset protocol.
In the embodiment of the present invention, the preset transmission protocol at least includes an enable number, a clock signal, an SPI communication protocol, a digital value, an analog value, and standard temperature data, and the remaining positions may be specifically configured according to actual situations.
FIG. 5 is a flow chart of the chip channel selection switch sending a bus command to a corresponding temperature sensor according to the control command in an automatic test method for a multi-point sensor chip ATE according to an embodiment of the present invention.
As shown in fig. 5, in one or more embodiments, preferably, the chip channel selection switch sends a bus command to a corresponding temperature sensor according to the control command, and specifically includes:
s501, after receiving the signal of the transmission bus, the chip channel selection switch automatically enables a corresponding temperature sensor;
s502, sending the bus command in the preset protocol form to the corresponding temperature measuring sensor.
In the embodiment of the invention, the control command received by the temperature measurement sensor comprises configuration output register value, voltage reference value and current reference value output by Analog pins and clock signal output by digital quantity pins, so that Analog and clock signals can be read through a board card of a testing machine to be compared with standard values, and the corresponding register value is configured to complete the on-line adjustment function of signals.
FIG. 6 is a flow chart of the method for automatically testing the multi-point sensor chip ATE according to an embodiment of the present invention, wherein the temperature sensor reads feedback information in real time according to the transmission information and sends the feedback information to the tester through a feedback bus.
In one or more embodiments, as shown in fig. 6, preferably, the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the testing machine through a feedback bus, which specifically includes:
s601, after the temperature sensor receives the bus command, automatically collecting feedback code returning information serving as the feedback information;
s602, in the collecting process, the feedback information is fed back through the feedback bus at fixed intervals and is set into a bus test mode, and the tester automatically analyzes.
In the embodiment of the invention, the bus test mode adopts an access mode of two bus communication protocols, and the parameters such as the code return current, the pulse width and the like of the tested chip are tested and adjusted, and the verification of the product function such as a differential constant temperature alarm function is realized.
Fig. 7 is a flowchart showing that the tester obtains real-time temperature data and displays the real-time temperature data on an upper computer, and the temperature data is transmitted to a temperature control box in combination with temperature curve control compensation sensor chip in the automatic test method of the multi-point sensor chip ATE according to an embodiment of the present invention, so as to complete real-time temperature control.
As shown in fig. 7, in one or more embodiments, preferably, the testing machine obtains real-time temperature data, and displays the real-time temperature data on an upper computer, and combines temperature curve control to compensate temperature data inside a sensor chip, and sends the temperature data to a temperature control box to complete real-time temperature control, which specifically includes:
s701, obtaining accurate temperature of a chip at a corresponding moment in historical data on a current test board by the test machine, setting forward current of a PN junction and a forward voltage drop calculation curve of the PN junction according to a first calculation formula and a second calculation formula, and obtaining current forward current and voltage data of the PN junction by back-pushing according to preset data;
s702, under the condition that the current PN junction forward current is unchanged by supposing back-thrust, fitting the second calculation formula to a third calculation formula form on the testing machine, wherein the third calculation formula form is used as a calculation mode of the actually measured PN junction forward voltage drop;
s703, setting a calculation mode of a forward voltage drop predicted value of the PN junction according to a fourth calculation formula;
s704, acquiring all historical test data, and calculating a first target compensation coefficient and a second target compensation coefficient by using a fifth calculation formula;
s705, calculating the measured temperature by using a sixth calculation formula;
s706, taking the difference between the actually measured temperature and the standard temperature data as the internal temperature data of the compensation sensor chip, and sending the internal temperature data to a temperature control box to complete real-time temperature control;
the first calculation formula is as follows:
wherein I is PN junction forward current, B is emission surface area, T is absolute temperature, eta is a constant related to materials and processes, K is Boltzmann constant, q is electron electric quantity, U is PN junction forward voltage drop, U 0 The potential difference between the bottom of the conduction band and the top of the valence band is absolute zero;
the second calculation formula is as follows:
the third calculation formula is as follows:
U C ＝f(T)
wherein U is C Is the measured forward voltage drop of the PN junction;
the fourth calculation formula is as follows:
U P ＝AT’+B
wherein U is P The positive voltage drop predicted value of the PN junction is that A is a first compensation coefficient, B is a second compensation coefficient, and T' is the temperature fed back by the temperature measuring sensor obtained at the corresponding moment in the historical data;
the fifth calculation formula is:
(Am，Bm)＝Arg min[Σ(U c_i -U P_i )]
wherein Am is a first target compensation coefficient, bm is a second target compensation coefficient, arg min () is a function of the first compensation coefficient and the second compensation coefficient corresponding to the minimum integrated error of the extracted forward voltage drop, U C_i For the positive voltage drop of the PN junction corresponding to the ith chip, U P_i The positive voltage drop predicted value of the PN junction corresponding to the ith chip is obtained;
the sixth calculation formula is:
T C ＝(U P -Bm)/Am
wherein T is C Is the measured temperature.
In the embodiment of the invention, after obtaining the standard temperature data in real time, a correction of the corresponding measured temperature is carried out, the corrected target is obtained to minimize the error of the voltage of the measured data and the predicted data, the current most accurate measured temperature is finally reversely deduced in real time according to the formula, the compensation is carried out according to the difference between the standard value and the measured value, and the compensation is completed through the corresponding incubator.
According to a second aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic test system is provided.
Fig. 8 is a block diagram of a multi-point sensor chip ATE automatic test system according to an embodiment of the present invention.
In one or more embodiments, preferably, the multi-point sensor chip ATE automatic test system comprises:
the mode selection module 801 is configured to set a current temperature measurement mode in real time by the testing machine, and send the temperature measurement mode to the chip channel selection switch longitudinally through communication and acquisition;
the acquisition and slice selection module 802 is used for the chip channel selection switch to select the temperature sensor of the enabling part according to the temperature measurement mode;
a bus sending module 803, configured to send a control command to the chip channel selection switch in real time through a sending bus by using the test machine;
the information slice selection module 804 is configured to send a bus command to a corresponding temperature sensor according to the control command by using the chip channel selection switch;
the information feedback module 805 is configured to read feedback information from the temperature sensor in real time according to the transmission information, and send the feedback information to the testing machine through a feedback bus;
the temperature compensation module 806 is configured to obtain real-time temperature data by using the testing machine, display the real-time temperature data on the upper computer, control and compensate temperature data inside the sensor chip by combining a temperature curve, and send the temperature data to the temperature control box to complete real-time temperature control.
In the embodiment of the invention, a system suitable for different structures is realized through a series of modularized designs, and the system can realize closed-loop, reliable and efficient execution through acquisition, analysis and control.
According to a third aspect of embodiments of the present invention, there is provided a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement a method according to any of the first aspect of embodiments of the present invention.
According to a fourth aspect of an embodiment of the present invention, there is provided an electronic device. Fig. 9 is a block diagram of an electronic device in one embodiment of the invention. The electronic device shown in fig. 9 is a general-purpose multi-point sensor chip ATE automatic test equipment. As shown in fig. 9, the electronic device 900 includes a Central Processing Unit (CPU) 901 that can perform various suitable actions and processes in accordance with computer program instructions stored in a Read Only Memory (ROM) 902 or computer program instructions loaded from a storage unit 908 into a Random Access Memory (RAM) 903. In the RAM903, various programs and data required for the operation of the electronic device 900 can also be stored. The CPU901, ROM 902, and RAM903 are connected to each other through a bus 904. An input/output (I/O) interface 905 is also connected to the bus 904.
A number of components in the electronic device 900 are connected to the I/O interface 905, including: an input unit 906, an output unit 907, a storage unit 908, and a processing unit 901 perform the respective methods and processes described above, for example, the method described in the first aspect of the embodiment of the present invention. For example, in some embodiments, the methods described in the first aspect of the embodiments of the present invention may be implemented as a computer software program, which is stored on a machine readable medium, such as the storage unit 908. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 900 via the ROM 902 and/or the communication unit 909. When the computer program is loaded into RAM903 and executed by CPU901, one or more operations of the method described in the first aspect of the embodiment of the present invention may be performed. Alternatively, in other embodiments, CPU901 may be configured in any other suitable manner (e.g., by means of firmware) as one or more actions of the method described in the first aspect of embodiments of the present invention.
The technical scheme provided by the embodiment of the invention can comprise the following beneficial effects:
in the scheme of the invention, the switching mode of the switch channel is controlled by ATE, so that an analog switch is enabled, the tested chip is gated, and the analog parameters of different temperatures are tested by matching with the high-low temperature box and the on-line adjustment function, thereby completing the parameter compensation of the standard temperature to the tested chip.
In the scheme of the invention, the chip to be tested is gated by enabling the corresponding analog switch, so that the purpose of testing a plurality of chips on one board is achieved, and the testing efficiency is improved.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, magnetic disk storage, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. An automatic test method for a multipoint sensor chip (ATE), comprising the steps of:
the testing machine sets the current temperature measuring mode in real time, and sends the temperature measuring mode to the chip channel selection switch longitudinally through communication and acquisition;
the chip channel selection switch selects a temperature sensor of the enabling part according to the temperature measurement mode;
the testing machine sends a control command to the chip channel selection switch in real time through a sending bus;
the chip channel selection switch sends a bus command to the corresponding temperature measuring sensor according to the control command;
the temperature measuring sensor reads feedback information in real time according to the transmission information and sends the feedback information to the testing machine through a feedback bus;
the testing machine obtains real-time temperature data, displays the real-time temperature data on the upper computer, combines the temperature curve control compensation sensor chip internal temperature data, and sends the temperature data to the temperature control box to complete real-time temperature control.
2. The automatic test method of multi-point sensor chip ATE according to claim 1, wherein the test machine sets a current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch longitudinally through communication and acquisition, specifically comprising:
the testing machine is connected with the chip channel selection switch through an IO pin;
the testing machine is provided with a chip to be tested, and then outputs high level through an IO pin;
the chip channel selection switch acquires the chip to be tested corresponding to the high level in real time.
3. The automatic test method of multi-point sensor chip ATE according to claim 1, wherein said chip channel selection switch selects a temperature sensor of an enabling part according to said temperature measurement mode, specifically comprising:
after the chip channel selection switch obtains a corresponding high-level signal, automatically matching and enabling a corresponding analog switch;
the analog switch starts to gate the tested chip, and then enables part of the temperature sensor.
4. The automatic test method of multi-point sensor chip ATE according to claim 1, wherein said tester sends control commands to said chip channel selection switch in real time via a transmission bus, comprising:
setting the tester to enter a bus test mode;
the current feedback is obtained on line in a mode of one-by-one inspection by a single temperature measuring sensor, so that a corresponding control signal is formed;
and transmitting the control signal to the chip channel selection switch through the transmission bus by a preset protocol.
5. The automatic test method of multi-point sensor chip ATE according to claim 4, wherein said chip channel selection switch sends a bus command to a corresponding temperature sensor according to said control command, specifically comprising:
the chip channel selection switch automatically enables the corresponding temperature measuring sensor after receiving the signal of the sending bus;
and sending the bus command in the preset protocol form to the corresponding temperature measuring sensor.
6. The automatic test method of multi-point sensor chip ATE according to claim 5, wherein said temperature sensor reads feedback information in real time according to said transmission information and sends said feedback information to said tester via a feedback bus, comprising:
after the temperature sensor receives the bus command, automatically collecting feedback code information serving as the feedback information;
in the collecting process, the feedback information is transmitted through the feedback bus at fixed intervals and is set into a bus test mode, and the tester automatically analyzes.
7. The automatic test method of multi-point sensor chip ATE according to claim 1, wherein the tester obtains real-time temperature data, and displays the real-time temperature data on an upper computer, and combines temperature curve control to compensate the temperature data inside the sensor chip, and sends the temperature data to a temperature control box to complete real-time temperature control, and the method specifically comprises:
acquiring accurate temperature of a chip at a corresponding moment in historical data on a current test board by the test machine, setting forward current of a PN junction and a forward voltage drop calculation curve of the PN junction according to a first calculation formula and a second calculation formula, and reversely pushing according to preset data to acquire current forward current and voltage data of the PN junction;
under the condition that the current PN junction forward current is unchanged by reverse thrust, fitting the second calculation formula into a third calculation formula form on the testing machine to serve as a calculation mode of the actually measured PN junction forward voltage drop;
setting a calculation mode of a forward voltage drop predicted value of the PN junction according to a fourth calculation formula;
acquiring all historical test data, and calculating a first target compensation coefficient and a second target compensation coefficient by using a fifth calculation formula;
calculating the measured temperature by using a sixth calculation formula;
taking the difference between the measured temperature and the standard temperature data as the internal temperature data of the compensation sensor chip, and sending the internal temperature data to a temperature control box to complete real-time temperature control;
the first calculation formula is as follows:
wherein I is PN junction forward current, B is emission surface area, T is absolute temperature, delta is material and process related constant, K is Boltzmann constant, q is electron power, U is PN junction forward voltage drop, U 0 The potential difference between the bottom of the conduction band and the top of the valence band is absolute zero;
the second calculation formula is as follows:
the third calculation formula is as follows:
U C ＝f(T)
wherein U is C Is the measured forward voltage drop of the PN junction;
the fourth calculation formula is as follows:
U P ＝AT’+B
wherein U is P The positive voltage drop predicted value of the PN junction is that A is a first compensation coefficient, B is a second compensation coefficient, and T' is the temperature fed back by the temperature measuring sensor obtained at the corresponding moment in the historical data;
the fifth calculation formula is:
(Am，Bm)＝Arg min[Σ(U c_i -U P_i )]
wherein Am is the first target complementCompensation coefficient Bm is a second target compensation coefficient, arg min () is a function of the first compensation coefficient and the second compensation coefficient corresponding to the minimum integrated error of the extracted forward voltage drop, U C_i For the positive voltage drop of the PN junction corresponding to the ith chip, U P_i The positive voltage drop predicted value of the PN junction corresponding to the ith chip is obtained;
the sixth calculation formula is:
T C ＝(U P -Bm)/Am
wherein T is C Is the measured temperature.
8. A multi-point sensor chip ATE automatic test system for implementing the method of any of claims 1-7, the system comprising:
the mode selection module is used for setting the current temperature measurement mode in real time by the testing machine and longitudinally transmitting the temperature measurement mode to the chip channel selection switch through communication and acquisition;
the acquisition and slice selection module is used for the chip channel selection switch to select the temperature measurement sensor of the enabling part according to the temperature measurement mode;
the bus sending module is used for sending a control command to the chip channel selection switch through a sending bus in real time by the testing machine;
the information selecting module is used for sending a bus command to the corresponding temperature measuring sensor by the chip channel selecting switch according to the control command;
the information feedback module is used for reading feedback information according to the transmission information in real time by the temperature measuring sensor and sending the feedback information to the testing machine through a feedback bus;
and the temperature compensation module is used for acquiring real-time temperature data by the testing machine, displaying the real-time temperature data on the upper computer, controlling the temperature data in the compensation sensor chip by combining a temperature curve, and sending the temperature data to the temperature control box to finish real-time temperature control.
9. A computer readable storage medium, on which computer program instructions are stored, which computer program instructions, when executed by a processor, implement the method of any of claims 1-7.
10. An electronic device comprising a memory and a processor, wherein the memory is configured to store one or more computer program instructions, wherein the one or more computer program instructions are executed by the processor to implement the method of any of claims 1-7.
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