CN116041956A - High-performance polyimide-polyaromatic amide reinforced molding powder composition and preparation method thereof - Google Patents

High-performance polyimide-polyaromatic amide reinforced molding powder composition and preparation method thereof Download PDF

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CN116041956A
CN116041956A CN202211738789.1A CN202211738789A CN116041956A CN 116041956 A CN116041956 A CN 116041956A CN 202211738789 A CN202211738789 A CN 202211738789A CN 116041956 A CN116041956 A CN 116041956A
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polyaramid
polyimide
powder composition
molding powder
reinforced molding
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曲程科
王子潇
徐广锐
杨才冉
柳汝信
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Shanghai Plastics Research Institute Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The invention relates to a high-performance polyimide-polyaramid reinforced molding powder composition and a preparation method thereof, wherein the composition comprises the following components in percentage by mass: 1 to 99 percent of polyaramid and 1 to 99 percent of polyimide. The polyaramid and polyimide are dry blended to give a molding powder composition. Compared with the prior art, the composition has the flexural strength and modulus larger than those of polyimide and the flexural strength and modulus larger than those of polyaramid.

Description

High-performance polyimide-polyaromatic amide reinforced molding powder composition and preparation method thereof
Technical Field
The invention belongs to the technical field of high polymer materials, and particularly relates to a reinforced molding powder composition suitable for molding and a preparation method thereof.
Background
Polyimide is a polymer with imide ring in the main chain, and has excellent mechanical performance and heat stability. With the development of aerospace, weaponry and electronic appliances, the demand for polyimide materials with heat resistance, high strength and light weight is rapidly increasing, and the polyimide materials have been developed into high-performance materials with wide variety and various products through decades of development.
The polyaramid is a generic name of a polymer containing aromatic rings and amide groups in a molecular main chain structure, has excellent mechanical property and electrical property, and is resistant to high temperature, solvents and chemical corrosion, and the main products are aromatic polyamide fibers, which are divided into para-aromatic polyamide fibers and meta-aromatic polyamide fibers. The para-position aromatic polyamide fiber has higher tensile strength and modulus, and is widely applied to the fields of military industry, aerospace, rubber reinforcement and the like; the meta-aromatic polyamide fiber has low modulus, high temperature resistance and insulativity, and is widely applied to safety protection articles such as flame retardant materials, heat resistant materials, electrical insulating paper and the like.
The existing polyimide synthesis method is mainly divided into two types, namely polyimide is synthesized by using a monomer containing an imide ring, and the imide ring is formed in the polymerization process or in the macromolecular reaction, wherein the polyimide is polymerized by dianhydride and diamine, by tetrabasic acid and diamine, by dianhydride and diisocyanate, and the like. Patent CN109749100A provides a process for directly obtaining a finer polyimide powder product from the polymerization of dianhydride and diamine, the resulting product having uniform particles and an impact strength of 92-100 kJ/m 2 Tensile strength is 110-116 MPa, and bending strength is 151-158 MPa. Patent CN 115279820a provides a method for synthesizing aromatic polyimide powder, which improves the mechanical strength of a molded body by controlling the content of volatile components, and the bending strength of the obtained molded body exceeds 60MPa. The polyimide material obtained by the above method still cannot fully satisfy the current requirements of high-definition military and civil products in terms of properties such as tensile strength, tensile modulus, bending strength, impact strength and the like of a formed body, and therefore, development of a product with more excellent properties than the conventional polyimide material is highly demanded.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a high-performance polyimide-polyaromatic amide reinforced molding powder composition and a preparation method thereof. The molding powder composition consists of polyaramid and polyimide, and the flexural strength and modulus of the molded product are improved by introducing the polyaramid with N-H bond, and the flexural strength and modulus of the molded product are greater than those of the polyimide and than those of the polyaramid. Meanwhile, the synthesis of the polyaramid requires low-temperature conditions, chloride ions generated in the process are difficult to completely remove, the high-temperature resistance of the material is affected, and the high-performance molding powder prepared by the two different reaction conditions is mixed by the method, so that the problem that the reaction conditions are difficult to blend is solved.
The aim of the invention can be achieved by the following technical scheme: the high-performance polyimide-polyaromatic amide reinforced molding powder composition is characterized by comprising the following components in percentage by mass: 1 to 99 percent of polyaramid and 1 to 99 percent of polyimide.
Further, the composition comprises the following components in percentage by mass: 10-60% of polyaramid and 40-90% of polyimide. More preferably, the polyaramid is 15-40% and the polyimide is 60-85%. To ensure the relative molecular mass and processing window of the composition, the inherent viscosity is in the range of 35 to 110ml/g.
Further, the polyimide has a polymerization degree of 3 to 1000, and the polyimide is in the form of particles, and is characterized by a particle diameter of 20 to 500 mesh, preferably 40 to 200 mesh, and most preferably 80 to 200 mesh.
Further, the polymerization degree of the polyaramid is 3-1000, and the polyaramid is granular, and is characterized in that the grain diameter is 20-200 meshes, preferably 40-200 meshes, and most preferably 80-120 meshes.
The polyimide consists of at least one aromatic tetracarboxylic dianhydride and at least one diprimary amine;
the polyimide preparation method comprises the following steps: adding aromatic tetracarboxylic dianhydride and diprimary amine in an equimolar ratio into an organic solvent and a water splitting agent which are mixed in a certain proportion, mixing for 1-5 hours at room temperature under the protection of inert gas, refluxing for 2-5 hours at 130-180 ℃, stopping heating, cooling to 40-80 ℃, filtering reaction liquid, pouring the obtained solid into a filtrate, standing for 12-48 hours, washing the solid with the filtrate for 3-5 times, finally placing the solid into an oven, reserving for 2-4 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and sieving with a 40-200 mesh sieve to obtain light yellow polyimide powder.
Wherein the aromatic tetracarboxylic dianhydride is a mixture or one of 4,4' -diphenyl ether dianhydride (s-ODPA), pyromellitic dianhydride (PMDA), 3', 4' -biphenyl tetracarboxylic dianhydride (BPDA) and 3,3', 4' -Benzophenone Tetracarboxylic Dianhydride (BTDA);
the diprimary amine comprises one or more of p-phenylenediamine, m-phenylenediamine, 4' -diphenyl ether diamine, 4' -diamino diphenyl sulfone and 3,3' -diamino diphenyl sulfone.
Further, the inert gas is one of high-purity nitrogen, high-purity argon and high-purity helium.
Further, the organic solvent is one or more of DMF, DMAC, DMSO, NMP.
Further, the water-splitting agent is one or more of toluene and xylene.
Further, the organic solvent and the water diversion agent are mixed according to the mass ratio of 9:1 to 6:4, mixing.
Further, the ratio of the total mass of the aromatic tetracarboxylic dianhydride and the diprimary amine to the total mass of the organic solvent and the water-splitting agent is 1: 10-3: 10.
further, the effluent is one or more of methanol, ethanol and acetone.
The polyaromatic amide consists of at least one aromatic diacid chloride or at least one diprimary amine;
the polyaramid is prepared as follows: adding aromatic diacid chloride and diprimary amine with equal molar ratio into an organic solvent, mixing, stirring for 3-8 hours at-10-0 ℃ under the protection of inert gas, spraying the obtained reaction liquid into deionized water through high-pressure air, carrying out suction filtration, washing the obtained solid with deionized water for 3-5 times, finally placing the solid into an oven, keeping for 2-4 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and sieving with a 40-200 mesh sieve to obtain white polyaramid powder.
Wherein the aromatic diacid chloride comprises one or two of terephthaloyl chloride (TPC) or isophthaloyl chloride (IPC),
the diprimary amine comprises one or more of p-phenylenediamine, m-phenylenediamine, 4' -diphenyl ether diamine, 4' -diamino diphenyl sulfone and 3,3' -diamino diphenyl sulfone.
Further, the inert gas is one of high-purity nitrogen, high-purity argon and high-purity helium.
Further, the organic solvent is one or more of DMF, DMAC, DMSO, NMP.
Further, the mass ratio of the total mass of the aromatic diacid chloride and the diprimary amine to the organic solvent is 1: 10-3: 10.
the preparation method of the high-performance polyimide-polyaramid reinforced molding powder composition comprises the following steps: and uniformly mixing polyimide powder and polyaramid powder, and performing compression molding to obtain the plastic part.
The molding temperature is 280-350 deg.c, molding pressure is 15-70 MPa, and the molding heat maintaining time is 3-30 min depending on the thickness of the product.
The properties of the obtained molding powder composition are as follows:
glass transition temperature: 251-300 DEG C
5% temperature of air atmosphere weight loss: 544-562 DEG C
Air atmosphere weight loss 10% temperature: 574-585 DEG C
The properties of the molded powder composition molded product are as follows:
tensile strength: 23 ℃, 124-138 MPa
Flexural strength: 23 ℃, 171-202 MPa
Flexural modulus: 23 ℃, 3.32-3.81 GPa
Impact strength of simple beam: 23 ℃, 265-277 kJ/m 2
Compressive strength: 23 ℃, 155-168 MPa
Compared with the prior art, the invention has the following beneficial effects:
1. the molding powder composition consists of the polyaromatic amide and polyimide, improves the bending strength and modulus of polyimide molded products by introducing the polyaromatic amide with N-H bonds, and has the bending strength and modulus larger than those of polyimide used and than those of the polyaromatic amide used.
2. The invention adopts a dry blending mode to obtain the molding powder, the molding powder is molded to obtain the plastic part, the bending strength and the modulus of the molding powder are obviously improved, and the molding powder composition has the bending strength and the modulus which are larger than those of polyimide and polyaramid, and has wide application prospect in the high and new technical field.
Drawings
FIG. 1 is a FTIR spectrum of the molding powder composition of example 1.
FIG. 2 is a TG pattern of the molding powder composition of example 1.
FIG. 3 is a DSC chart of the molding powder composition of example 1.
Detailed Description
For a better understanding of the present invention, the following examples are set forth to illustrate the present invention further, but are not to be construed as limiting the present invention. Other variations and modifications to the present invention will be within the scope of the present invention, as those of ordinary skill in the art may also make other changes and modifications without departing from the spirit and scope of the present invention.
Example 1
The preparation method in this example comprises the following steps:
1. preparation of polyimide powder: 100.12g (0.50 mol) of pyromellitic dianhydride was weighed out and dissolved in 1000g of DMAc and xylene at 8:2 mass ratio, then adding 155.11g (0.50 mol) of 4,4' -biphenyl ether dianhydride, stirring for 4 hours at room temperature under the protection of high-purity nitrogen, refluxing for 4 hours at 160 ℃, stopping heating, pumping and filtering the reaction liquid when the temperature is reduced to 40 ℃, pouring the obtained solid into acetone, standing for 18 hours, washing the solid with acetone for 3 times, finally putting the solid into an oven, sequentially keeping for 2 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and sieving with a 120-mesh sieve to obtain polyimide powder, wherein the yield is 91.12%.
2. Preparation of polyaramid powder: 100.12g (0.50 mol) of 4,4' -diphenyl ether diamine is weighed and dissolved in 1000g of DMAc, 50.76g (0.25 mol) of terephthaloyl chloride and 50.76g (0.25 mol) of isophthaloyl chloride are weighed and mixed uniformly, the mixture is added into a reaction system, the mixture is stirred for 7 hours at room temperature under nitrogen atmosphere, then the obtained reaction solution is sprayed into deionized water through high-pressure air, suction filtration is carried out, the obtained solid is washed by the deionized water for 5 times, finally the solid is put into an oven, the solid is sequentially reserved for 2 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and a 120-mesh sieve is adopted to obtain the polyaramid powder, and the yield is 92.83%.
3. Mixing the polyimide powder obtained in the step 1 and the polyaramid powder obtained in the step 2 by 8:2, uniformly mixing the components according to the mass ratio to obtain the molding powder composition.
The molding powder composition obtained had an inherent viscosity of 98ml/g, which was found to be 1780cm by FTIR analysis -1 And 1380cm -1 Strong infrared peaks (shown in fig. 1) appear at both sites, respectively assigned to c=o asymmetric stretches and C-N stretches, indicating that the powder has been imidized. FIG. 2 is a graph of TG pattern of the resulting molded powder composition with air atmosphere weight loss of 5% and 10% at 562℃and 584℃respectively; FIG. 3 is a DSC chart of the resulting molding powder composition having a glass transition temperature of 259 ℃; the obtained molding powder composition was molded at 350℃under 30MPa to give a plastic sample whose properties are shown in Table 1 (i.e., the properties of the polyimide powder obtained in step 1 of example 1, the polyaramid powder obtained in step 2, and the three powders of the molding powder composition obtained in step 3), and the properties of the plastic sample were shown in Table 2 (i.e., the plastic sample obtained by molding the three powders obtained in steps 1 to 3 at 350℃under 30MPa, respectively).
Table 1: powder Properties of the polyimide, polyaromatic Polyamide and Molding powder compositions of example 1
Project Example 1 Example 1 polyimide EXAMPLE 1 polyaromatic amide
Glass transition temperature (. Degree. C.) 259 266 272
Air atmosphere weight loss 5% temperature (. Degree.C.) 562 553 568
Air atmosphere weight loss 10% temperature (DEG C) 584 575 589
Table 2: plastic sample Properties of the polyimide, polyaromatic Polyamide and Molding powder compositions of example 1
Project Example 1 Example 1 polyimide EXAMPLE 1 polyaromatic amide
Tensile strength of 23 ℃ (MPa) 131 130 128
Flexural Strength, 23 ℃ (MPa) 199 161 170
Flexural modulus, 23 ℃ (GPa) 3.72 3.06 3.22
Impact strength of 23 ℃ (kJ/m) 2 ) 269 264 274
Compressive strength (23 ℃ (MPa)) 157 140 138
As can be seen from Table 1 above, the molding powder composition prepared by the process of the present invention has a reduced glass transition temperature compared to the polyimide and the polyaramid therein, and an air atmosphere weight loss of 5% and 10% is between the polyimide and the polyaramid. As can be seen from Table 2, the obtained plastic sample was molded by dry blending at high temperature and high pressure, and the flexural strength and modulus thereof were greatly increased, the compressive strength was also increased, and the tensile strength and impact strength thereof were only slightly floated.
Example 2
1. Preparation of polyimide powder: 54.07g (0.50 mol) of m-phenylenediamine was weighed out and dissolved in 1000g of DMAc and toluene at 7: 109.06g (0.50 mol) of pyromellitic dianhydride is added into the mixed solvent according to the mass ratio of 3, stirring is carried out for 3 hours at room temperature under the protection of high-purity nitrogen, then reflux is carried out for 3 hours at 160 ℃, heating is stopped, the reaction solution is filtered by suction when the temperature is reduced to 50 ℃, the obtained solid is poured into acetone, standing is carried out for 18 hours, then the solid is washed by acetone for 3 times, finally the solid is put into an oven, the solid is sequentially kept for 3 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and the polyimide powder is obtained through a 80-mesh sieve, and the yield is 90.82 percent.
2. Preparation of polyaramid powder: 100.12g (0.50 mol) of 4,4' -diphenyl ether diamine is weighed and dissolved in 1000g of DMAc, 60.91g (0.30 mol) of terephthaloyl chloride, 40.61g (0.20 mol) of isophthaloyl chloride are weighed, uniformly mixed, added into a reaction system, stirred for 7 hours at room temperature under nitrogen atmosphere, then the obtained reaction solution is sprayed into deionized water through high-pressure air, suction filtration is carried out, the obtained solid is washed by the deionized water for 5 times, finally the solid is put into an oven, sequentially kept for 3 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃ and then sieved by a 80-mesh sieve, thus obtaining the polyaramid powder with the yield of 89.97%.
3. Mixing the polyimide powder obtained in the step 1 and the polyaramid powder obtained in the step 2 in a ratio of 6:4, uniformly mixing the components according to the mass ratio to obtain the molding powder composition.
The inherent viscosity of the molding powder composition obtained was 68ml/g, and the properties thereof are shown in Table 3. The plastic specimens were molded at 350℃and 30MPa, and the properties of the plastic specimens are shown in Table 4.
Example 3
1. Preparation of polyimide powder: 54.07g (0.50 mol) of m-phenylenediamine was weighed out and dissolved in 1000g of DMAc and xylene at 8:2 mass ratio, then adding 155.11g (0.50 mol) of 4,4' -biphenyl ether dianhydride, stirring for 3 hours at room temperature under the protection of high-purity nitrogen, refluxing for 3 hours at 160 ℃, stopping heating, pumping and filtering the reaction solution when the temperature is reduced to 40 ℃, pouring the obtained solid into acetone, standing for 18 hours, washing the solid with acetone for 4 times, finally putting the solid into an oven, sequentially keeping for 2 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and sieving with a 100-mesh sieve to obtain polyimide powder, wherein the yield is 92.63%.
2. Preparation of polyaramid powder: 54.07g (0.50 mol) of p-phenylenediamine is weighed and dissolved in 1000g of DMAc, 50.76g (0.25 mol) of terephthaloyl chloride, 50.76g (0.25 mol) of isophthaloyl chloride are weighed, uniformly mixed, added into a reaction system, stirred for 4 hours at room temperature under nitrogen atmosphere, then the obtained reaction solution is sprayed into deionized water through high-pressure air, suction filtration is carried out, the obtained solid is washed by the deionized water for 5 times, finally the solid is put into an oven, and is sequentially reserved for 2 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and then the obtained product is sieved by a 100-mesh sieve, thus obtaining the polyaromatic polyamide powder with the yield of 93.02%.
3. Mixing the polyimide powder obtained in the step 1 and the polyaramid powder obtained in the step 2 by 9:1, and uniformly mixing the components in a mass ratio to obtain the molding powder composition.
The inherent viscosity of the resulting molding powder composition was 83ml/g, and the properties are shown in Table 3. The plastic specimens were molded at 350℃and 30MPa, and the properties of the plastic specimens are shown in Table 4.
Example 4
1. Preparation of polyimide powder: 50.06g (0.25 mol) of 4,4' -biphenylether diamine, 27.04g (0.25 mol) of p-phenylenediamine are weighed, mixed evenly, dissolved in 1000g of DMF and xylene to give 7:3 mass ratio, then adding 155.11g (0.50 mol) of 4,4' -biphenyl ether dianhydride, stirring for 2 hours at room temperature under the protection of high-purity nitrogen, refluxing for 3 hours at 150 ℃, stopping heating, pumping and filtering the reaction solution when the temperature is reduced to 60 ℃, pouring the obtained solid into ethanol, standing for 12 hours, then washing the solid with ethanol for 3 times, finally putting the solid into an oven, sequentially keeping for 3 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and sieving with a 120-mesh sieve to obtain polyimide powder with the yield of 90.88%.
2. Preparation of polyaramid powder: 100.12g (0.50 mol) of 4,4' -biphenyl ether diamine is weighed and dissolved in 1000g of DMAc, 101.52g (0.50 mol) of terephthaloyl chloride is weighed and added into a reaction system, the mixture is stirred for 5 hours at room temperature under the nitrogen atmosphere, then the obtained reaction solution is sprayed into deionized water through high-pressure air, suction filtration is carried out, the obtained solid is washed by the deionized water for 5 times, finally the solid is put into an oven, and is sequentially reserved for 3 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃ and then is sieved by a 120-mesh sieve, thus obtaining the polyaramid powder with the yield of 92.51 percent.
3. Mixing the polyimide powder obtained in the step 1 and the polyaramid powder obtained in the step 2 by 5:5, uniformly mixing the components according to the mass ratio to obtain the molding powder composition.
The inherent viscosity of the molding powder composition obtained was 101ml/g, and the properties are shown in Table 3. The plastic specimens were molded at 350℃and 30MPa, and the properties of the plastic specimens are shown in Table 4.
Example 5
1. Preparation of polyimide powder: 100.12g (0.50 mol) of 4,4 '-biphenyl ether diamine is weighed, dissolved in a solvent in which 1000g of NMP and xylene are mixed according to a mass ratio of 7:3, 155.11g (0.50 mol) of 4,4' -biphenyl ether dianhydride is added, stirring is carried out for 4 hours at room temperature under the protection of high-purity nitrogen, then reflux is carried out for 4 hours at 160 ℃, heating is stopped, the reaction solution is filtered by suction when the temperature is reduced to 50 ℃, the obtained solid is poured into acetone and is kept stand for 20 hours, then the solid is washed by acetone for 3 times, finally the solid is put into an oven, and is sequentially kept for 2 hours at 130 ℃, 190 ℃, 220 ℃ and 240 ℃ and is sieved by a 80-mesh sieve, thus obtaining polyimide powder with the yield of 88.79 percent.
2. Preparation of polyaramid powder: 50.06g (0.25 mol) of 4,4' -diphenyl ether diamine, 27.04g (0.25 mol) of p-phenylenediamine are weighed, uniformly mixed and dissolved in 1000g of DMAc, 101.52g (0.50 mol) of isophthaloyl dichloride is weighed, added into a reaction system, stirred for 7 hours at room temperature under nitrogen atmosphere, then the obtained reaction solution is sprayed into deionized water through high-pressure air, suction filtration is carried out, the obtained solid is washed by the deionized water for 5 times, finally the solid is put into an oven, sequentially kept for 2 hours at 130 ℃, 160 ℃, 190 ℃, 220 ℃ and 240 ℃, and the obtained solid is sieved by a 80-mesh sieve, thus obtaining the polyaromatic polyamide powder with the yield of 90.37 percent.
3. Mixing the polyimide powder obtained in the step 1 and the polyaramid powder obtained in the step 2 in a ratio of 4:6, uniformly mixing the components according to the mass ratio to obtain the molding powder composition.
The inherent viscosity of the resulting molding powder composition was 93ml/g and the properties are shown in Table 3. The plastic specimens were molded at 350℃and 30MPa, and the properties of the plastic specimens are shown in Table 4.
TABLE 3 powder Properties of the molding powder compositions of examples 1 to 5
Figure BDA0004033293720000081
TABLE 4 Properties of the Plastic samples in examples 1 to 5
Figure BDA0004033293720000082
As can be seen from Table 3, the molding powder compositions obtained in the examples of the present invention all have a higher glass transition temperature of 250℃or higher, have excellent high temperature resistance and are easy to process, and as can be seen from Table 4, the molded plastic specimens obtained in the examples of the present invention have excellent mechanical properties, and the flexural strength and modulus are at a higher level.

Claims (10)

1. The high-performance polyimide-polyaromatic amide reinforced molding powder composition is characterized by comprising the following components in percentage by mass: 1 to 99 percent of polyaramid and 1 to 99 percent of polyimide.
2. The high-performance polyimide-polyaramid reinforced molding powder composition according to claim 1, which is characterized by comprising the following components in percentage by mass: 10-60% of polyaramid and 40-90% of polyimide.
3. The high performance polyimide-polyaramid reinforced molding powder composition of claim 1, wherein the polyimide consists of at least one aromatic tetracarboxylic dianhydride and at least one diprimary amine;
wherein the aromatic tetracarboxylic dianhydride comprises one or more of 4,4' -diphenyl ether dianhydride (s-ODPA), pyromellitic dianhydride (PMDA), 3', 4' -biphenyl tetracarboxylic dianhydride (BPDA) and 3,3', 4' -Benzophenone Tetracarboxylic Dianhydride (BTDA);
the diprimary amine comprises one or more of p-phenylenediamine, m-phenylenediamine, 4' -diphenyl ether diamine, 4' -diamino diphenyl sulfone and 3,3' -diamino diphenyl sulfone.
4. The high performance polyimide-polyaramid reinforced molding powder composition of claim 1, wherein the polyaramid consists of at least one aromatic diacid chloride or at least one diprimary amine;
wherein the aromatic diacid chloride comprises one or two of terephthaloyl chloride (TPC) or isophthaloyl chloride (IPC),
the diprimary amine comprises one or more of p-phenylenediamine, m-phenylenediamine, 4' -diphenyl ether diamine, 4' -diamino diphenyl sulfone and 3,3' -diamino diphenyl sulfone.
5. The high performance polyimide-polyaramid reinforced molding powder composition of claim 1, wherein the polyimide has a degree of polymerization of 3 to 1000.
6. The high performance polyimide-polyaramid reinforced molding powder composition of claim 1, wherein the polyaramid has a degree of polymerization of 3 to 1000.
7. The high-performance polyimide-polyaramid reinforced molding powder composition according to claim 1, wherein the polyimide is in the form of particles with a particle size of 20-500 meshes;
the polyaramid is granular, and the grain diameter is 20-200 meshes.
8. The high performance polyimide-polyaramid reinforced molding powder composition of claim 7, wherein the polyimide is in the form of particles with a particle size of 40 mesh to 200 mesh;
the polyaramid is granular and has a grain size of 40-200 meshes.
9. A method of preparing a high performance polyimide-polyaramid reinforced molding powder composition according to claim 1, comprising the steps of: and uniformly mixing polyimide powder and polyaramid powder, and performing compression molding to obtain the plastic part.
10. The method for preparing a high performance polyimide-polyaramid reinforced molding powder composition according to claim 9, wherein the molding conditions are a molding temperature of 280-350 ℃ and a molding pressure of 15-70 MPa.
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