CN116017951A - Liquid cooling cabinet and liquid cooling system - Google Patents
Liquid cooling cabinet and liquid cooling system Download PDFInfo
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- CN116017951A CN116017951A CN202310033207.8A CN202310033207A CN116017951A CN 116017951 A CN116017951 A CN 116017951A CN 202310033207 A CN202310033207 A CN 202310033207A CN 116017951 A CN116017951 A CN 116017951A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The disclosure provides a liquid-cooled cabinet and a liquid cooling system, relates to the technical field of computers, and in particular relates to the technical fields of cloud computing, data centers and the like. The liquid-cooled cabinet includes: a cabinet body; the circulating system and the heating device are arranged in the cabinet body; the circulating system is used for conveying cooling liquid; the heating device is immersed in the cooling liquid; the heat generating device includes: the system comprises a whole cabinet server, a centralized power supply module and a centralized power supply bus; and the whole cabinet server is connected with the centralized power supply module through the centralized power supply bus. The present disclosure may enhance the effectiveness of a liquid-cooled cabinet.
Description
Technical Field
The disclosure relates to the technical field of computers, in particular to the technical fields of cloud computing, data centers and the like, and particularly relates to a liquid cooling type cabinet and a liquid cooling system.
Background
As technology advances, the cooling of data centers has begun to trend. The liquid cooling technology of the data center is mainly divided into cold plate type liquid cooling and immersion type liquid cooling. The cold plate type liquid cooling mainly adopts liquid cooling heat dissipation for a heating source with large power consumption in the system, and electronic elements are not in direct contact with cooling liquid, and other devices adopt air cooling heat dissipation; the immersion liquid cooling takes liquid as a heat transfer medium, directly submerges the heating electronic element in the cooling liquid, and takes away heat through direct contact of the cooling liquid and the electronic element to effectively improve the heat dissipation effect.
Disclosure of Invention
The present disclosure provides a liquid-cooled cabinet and a liquid cooling system.
According to an aspect of the present disclosure, there is provided a liquid-cooled cabinet comprising: a cabinet body; the circulating system and the heating device are arranged in the cabinet body; the circulating system is used for conveying cooling liquid; the heating device is immersed in the cooling liquid; the heat generating device includes: the system comprises a whole cabinet server, a centralized power supply module and a centralized power supply bus; and the whole cabinet server is connected with the centralized power supply module through the centralized power supply bus.
According to another aspect of the present disclosure, there is provided a liquid cooling system including: the liquid-cooled cabinet of any of the above; and a CDU controlling the liquid cooled cabinet.
According to the technical scheme of the disclosure, the effect of the liquid-cooled cabinet can be improved.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.
Drawings
The drawings are for a better understanding of the present solution and are not to be construed as limiting the present disclosure. Wherein:
FIG. 1 is a schematic diagram according to a first embodiment of the present disclosure;
FIG. 2 is a schematic diagram according to a first embodiment of the present disclosure;
fig. 3 is a schematic diagram of a complete machine cabinet liquid cooling server versus a complete machine cabinet air cooling server according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of sensors within a cabinet provided in accordance with an embodiment of the present disclosure;
FIG. 5 is a schematic diagram according to a third embodiment of the present disclosure;
fig. 6 is a schematic diagram according to a fourth embodiment of the present disclosure.
Detailed Description
Exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present disclosure to facilitate understanding, and should be considered as merely exemplary. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
In the related art, for immersion liquid cooling, a standard server architecture is generally based, however, the effect needs to be improved.
Fig. 1 is a schematic view of a first embodiment of the present disclosure, which provides a liquid-cooled cabinet. As shown in fig. 1, the liquid-cooled cabinet 100 of the present embodiment includes: the cabinet body 101, the circulation system and the heating device that set up in the cabinet body 101 is internal.
Wherein, circulation system is used for transmitting the coolant liquid. The cooling liquid is, for example: fluorinated liquids, or mineral oils, etc. The circulation system may in particular comprise a pipe loop for transporting the cooling liquid.
The heat generating device is immersed in the cooling liquid. Through the direct contact of the heating device and the cooling liquid, the heat of the heating device is taken away along with the flow of the cooling liquid, and the immersed liquid cooling heat dissipation is realized.
In this embodiment, the heat generating device includes: the integrated cabinet server 102, the centralized power supply module 103 and the centralized power supply bus 104; the whole cabinet server 102 is connected with the centralized power supply module 103 through the centralized power supply bus 104.
The plurality of the whole cabinet servers can be connected to the unified centralized power supply module through the unified centralized power supply bus.
The standard server is a 19-inch server, and the whole cabinet server is a 21-inch server.
In the related art, a cabinet based on a standard server architecture cannot be compatible with a whole cabinet server due to the small size of a standard server.
In this embodiment, the server adopts a whole cabinet server, and the size of the whole cabinet server is larger than that of the standard server, so that the server can be compatible with the standard server.
Specifically, the cabinet of the embodiment can provide a plurality of server accommodating spaces, each server accommodating space can accommodate one whole cabinet server, and because the size of the whole cabinet server is larger than that of a standard server, each server accommodating space can accommodate one standard server, so that the whole cabinet server and the standard server can be compatible.
The cabinet can be divided into centralized power supply and distributed power supply from the power supply angle, wherein the centralized power supply is to concentrate all power supplies at one place in a resource pool mode, and the distributed power supply is to set a plurality of power supplies in a distributed mode.
The Power supply concentrated at one place may be called a concentrated Power supply module, specifically a concentrated Power supply Power rack (powershell), and correspondingly, the distributed Power supply module may be a Power distribution unit (Power DistributionUnit, PDU).
In the related art, a distributed power module (PowerDistributionUnit, PDU) is generally used in a standard server-based architecture, and the distributed power module is generally a socket, and the standard server is plugged into a power port of the PDU through a power line.
However, the use is not convenient enough due to the need for a power cord to connect to the power port of the PDU.
In this embodiment, a centralized power supply module is adopted, and the whole cabinet server is connected with the centralized power supply module through a centralized power supply bus.
The concentrated power supply bus refers to a bus having conductive capability, and may be, for example, a copper bar.
The centralized power supply bus is used for supplying power to the server of the whole cabinet, a power line is not needed, and the use is more convenient.
In the embodiment, the liquid-cooled cabinet is realized based on the whole cabinet server, and the accommodating space of the whole cabinet server is larger than the accommodating space of the standard server, so that the whole cabinet server and the standard server can be compatible, and the application range is more comprehensive and flexible; the centralized power supply module and the centralized power supply bus are adopted to supply power for the whole cabinet server, so that the problems of complex cable deployment and the like which are connected by adopting a power line can be avoided. Therefore, the effect of the liquid-cooled cabinet can be improved.
Fig. 2 is a schematic diagram of a second embodiment of the present disclosure, which provides a liquid-cooled cabinet. As shown in fig. 2, the liquid-cooled cabinet (tank) includes: the cabinet 201 is in a sealed state in a use state of the cabinet 201. The cabinet 201 is provided with a liquid inlet 202 and a liquid return opening 203, the cooling liquid flows into the circulation system inside the cabinet through the liquid inlet, and after heat exchange, the cooling liquid flows out of the cabinet through the liquid return opening. Valves are arranged in the liquid inlet 202 and the liquid return 203, and the inflow or non-inflow (outflow or non-outflow) of the cooling liquid into the cabinet can be controlled by opening and closing the valves.
In this embodiment, by arranging valves inside the liquid inlet and the liquid return port, control of a single cabinet (tank) can be achieved.
As shown in fig. 2, the cabinet 201 includes a circulation system (not shown) and a heat generating device inside.
The circulation system is used for conveying cooling liquid, and the heating device is immersed in the cooling liquid.
The heat generating component includes: the integrated cabinet server 207, the centralized power supply module 204 and the centralized power supply bus, wherein the integrated cabinet server 207 is connected with the centralized power supply module 204 through the centralized power supply bus.
The whole cabinet server is provided with a first wiring terminal; the centralized power supply module is provided with a second wiring terminal; the first connection terminal is interconnected with the concentrated power supply bus bar, and the second connection terminal is interconnected with the concentrated power supply bus bar.
In the embodiment, the wiring terminal is interconnected with the centralized power supply bus, so that cable connection is not needed, and centralized power supply can be conveniently performed for the whole cabinet server.
Specifically, the concentrated power supply bus bar is a concentrated power supply copper bar 205.
The binding post is conductive CLIP (CLIP), and for distinguishing, the conductive CLIP on the complete machine cabinet server can be called first conductive CLIP, and the conductive CLIP on the concentrated power supply module can be called second conductive CLIP. The first conductive clip and the second conductive clip both clip the centralized power supply copper bar.
In this embodiment, the centralized power supply can be realized by using the existing resources through the centralized power supply copper bar and the conductive clip.
In some embodiments, the heat generating component further comprises: a standard server 208 and a distributed power module 206; the standard server 208 is connected to the distributed power module 206 via a power line. Wherein the distributed power module 206 may be distributed across multiple locations (two are shown in fig. 2), the distributed power module may be a PDU. The standard server 208 is 19 inches in size and the whole cabinet server is 21 inches in size, so that the standard server 208 can be compatible.
In this embodiment, the heat generating component may further include a standard server, so that compatibility with the standard server is achieved.
In some embodiments, the heat generating device further comprises: a switch 209; the switch 209 is connected to the centralized power supply module through the centralized power supply bus; alternatively, the switch 209 is connected to the distributed power module via a power line.
Aiming at the switch, a centralized power supply mode or a distributed power supply mode can be adopted to realize a more flexible power supply scheme.
In some embodiments, the setting position of the first connection terminal set on the whole cabinet server is consistent with the setting position of the connection terminal on the air cooling server.
Taking the connection terminal as a conductive CLIP (CLIP) as an example, as shown in fig. 3, the air-cooled server of the whole cabinet includes a conductive CLIP 301 and an air-cooled heat dissipation module 302 on the air-cooled server, and the liquid-cooled server of the whole cabinet includes a conductive CLIP 303 and a liquid-cooled heat dissipation module 304 on the liquid-cooled server. The air-cooled heat dissipation module 302 may be embodied as a fan module and the heat dissipation module 304 may be embodied as a filler module.
Referring to fig. 3, the conductive clips 301 on the air-cooled server and the conductive clips 303 on the liquid-cooled server are positioned in the same location, and are all positioned at the rear of the server.
Under a standard server, the conductive portion is typically located in front of the standard server, and is not coincident with the location of the conductive portion of the air cooled server.
In this embodiment, the form layout and the materials of the servers in the air-cooled and liquid-cooled scenes may be kept consistent, but corresponding modules may be replaced under different usage scenarios, for example, in the air-cooled scene, the servers may be configured with fan modules, and in the immersed liquid-cooled environment, the fan modules may be replaced with filling modules.
The design based on the standard server cannot keep the air cooling and the liquid cooling consistent, namely the standard server of the same platform has two sets of design schemes, one set of air cooling and one set of immersed liquid cooling; the air cooling and liquid cooling modes of the immersed liquid cooling server based on the whole cabinet framework can be unified into one type, and can be used for sharing materials, so that configuration can be flexibly switched according to different use scenes of the server.
In some embodiments, the liquid-cooled cabinet further comprises: a sensor and cabinet monitoring management unit (RackMonitorandManagementUnit, RMMU) disposed inside the cabinet; the RMMU is configured to monitor and manage the liquid-cooled cabinet based on the sensing data collected by the sensor.
As shown in fig. 4, the sensor may include: a temperature sensor 401, a flow sensor 402, a drain sensor 403, and a liquid level sensor 404.
With reference to fig. 2, the cabinet may further include: the RMMU210 may obtain sensing data collected by the sensor, such as temperature, flow, leakage condition, liquid level, etc., and monitor and manage based on the sensing data.
In this embodiment, real-time monitoring and alarm can be achieved through RMMU.
Fig. 5 is a schematic diagram of a third embodiment of the disclosure, which provides a liquid cooling system.
As shown in fig. 5, the liquid cooling system 500 includes: the cdu is used to control the liquid cooled cabinet 501 and the cold distribution unit (CoolingDispensingUnit, CDU) 502.
The CDU and the liquid-cooled cabinet can be connected through a circulating pipeline. The CDU conveys the cooling liquid into the liquid-cooled cabinet through the pipeline; the cooling liquid exchanges heat with the heating devices, the heating devices in the liquid-cooled cabinet are cooled, and the temperature of the cooling liquid is raised; after the heated cooling liquid flows back to the CDU through a pipeline between the CDU and the liquid-cooled cabinet, the CDU adopts refrigeration equipment to refrigerate the reflowed cooling liquid and can be conveyed into the liquid-cooled cabinet again to form a closed-loop liquid-cooled heat dissipation system.
In this embodiment, the CDU controls the liquid-cooled cabinet, so that a closed-loop liquid cooling system can be formed.
Fig. 6 is a schematic diagram of a fourth embodiment of the present disclosure, which provides a liquid cooling system.
As shown in fig. 6, the liquid cooling system 600 includes: liquid cooled cabinet 601, CDU602 and refrigeration equipment 603, the liquid cooled cabinet 601 is a plurality of (represented by cabinet-1-cabinet-3), CDU is a CDU, and one CDU is used for carrying out unified control on a plurality of liquid cooled cabinets.
In the related art, the CDU and the cabinets are generally deployed in a 1:1 mode, but in this embodiment, one CDU can control a plurality of cabinets, so that the deployment cost of the CDU can be effectively reduced.
In addition, as the liquid inlet and the liquid return port of the liquid-cooled cabinet are internally provided with valves, the flow control and operation and maintenance of the single cabinet can be realized through the valves.
It is to be understood that in the embodiments of the disclosure, the same or similar content in different embodiments may be referred to each other.
It can be understood that "first", "second", etc. in the embodiments of the present disclosure are only used for distinguishing, and do not indicate the importance level, the time sequence, etc.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps recited in the present disclosure may be performed in parallel or sequentially or in a different order, provided that the desired results of the technical solutions of the present disclosure are achieved, and are not limited herein.
The above detailed description should not be taken as limiting the scope of the present disclosure. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A liquid-cooled cabinet, comprising:
a cabinet body;
the circulating system and the heating device are arranged in the cabinet body;
the circulating system is used for conveying cooling liquid;
the heating device is immersed in the cooling liquid;
the heat generating device includes: the system comprises a whole cabinet server, a centralized power supply module and a centralized power supply bus;
and the whole cabinet server is connected with the centralized power supply module through the centralized power supply bus.
2. The cabinet of claim 1 wherein,
the whole cabinet server is provided with a first wiring terminal;
the centralized power supply module is provided with a second wiring terminal;
the first connection terminal is interconnected with the concentrated power supply bus bar, and the second connection terminal is interconnected with the concentrated power supply bus bar.
3. The cabinet of claim 2 wherein,
the centralized power supply bus is a centralized power supply copper bar;
the first binding post is first conductive clip, the second binding post is the second conductive clip, just, first conductive clip with the second conductive clip all centre gripping concentrate the power supply copper bar.
4. The cabinet of claim 2 wherein,
the setting position of the first wiring terminal arranged on the whole cabinet server is consistent with the setting position of the wiring terminal on the air-cooled server.
5. The cabinet of claim 1, wherein the heat generating component further comprises:
a standard server and a distributed power supply module;
and the standard server is connected with the distributed power supply module through a power line.
6. The cabinet of claim 5, wherein the heat generating device further comprises:
a switch;
the switch is connected with the centralized power supply module through the centralized power supply bus; or alternatively, the process may be performed,
the switch is connected with the distributed power supply module through a power line.
7. The cabinet of claim 1, further comprising:
the sensor and cabinet monitoring management unit (RMMU) is arranged in the cabinet body;
the RMMU is configured to monitor and manage the liquid-cooled cabinet based on the sensing data collected by the sensor.
8. The cabinet of any one of claims 1-7, further comprising:
a liquid inlet and a liquid return port arranged on the cabinet body; the method comprises the steps of,
and the valves are arranged in the liquid inlet and the liquid return port.
9. A liquid cooling system, comprising:
the liquid-cooled cabinet of any one of claims 1-8; the method comprises the steps of,
and a cooling capacity distribution unit CDU for controlling the liquid cooling cabinet.
10. The system of claim 8, wherein,
the CDU is one;
the liquid-cooled cabinets are multiple;
the CDU is used for uniformly controlling the plurality of liquid-cooled cabinets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310033207.8A CN116017951A (en) | 2023-01-10 | 2023-01-10 | Liquid cooling cabinet and liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310033207.8A CN116017951A (en) | 2023-01-10 | 2023-01-10 | Liquid cooling cabinet and liquid cooling system |
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| Publication Number | Publication Date |
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| CN116017951A true CN116017951A (en) | 2023-04-25 |
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| CN202310033207.8A Pending CN116017951A (en) | 2023-01-10 | 2023-01-10 | Liquid cooling cabinet and liquid cooling system |
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- 2023-01-10 CN CN202310033207.8A patent/CN116017951A/en active Pending
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