CN116017908A

CN116017908A - Semi-finished waterproof device and finished waterproof device

Info

Publication number: CN116017908A
Application number: CN202211666624.8A
Authority: CN
Inventors: 花国樑
Original assignee: Shanghai Minborui Sensor Co ltd
Current assignee: Shanghai Minborui Sensor Co ltd
Priority date: 2022-08-03
Filing date: 2022-12-23
Publication date: 2023-04-25
Also published as: CN116160615A; WO2024027600A1

Abstract

Disclosed is a waterproof device semi-finished product comprising: the plurality of semi-finished structural units are semi-finished wire strips, and the semi-finished wire strips are sequentially arranged at intervals in the length direction; and the plastic layer covers the outer surface of the semi-finished wire rod belt, namely the outer surfaces of a plurality of semi-finished structural units are completely wrapped, wherein two adjacent semi-finished structural units are connected through the plastic layer. According to the semi-finished waterproof device, the plastic layer is covered on the outer surface of each semi-finished structural unit, and the plastic layer is filled at the position of the fracture where two adjacent semi-finished structural units are connected, so that after each semi-finished structural unit is separated and then the plastic layer filled at the position of the fracture is cut, each obtained semi-finished waterproof device is completely wrapped by the plastic layer, and the problem of water inlet failure of the finished waterproof device caused by the fact that two layers of plastic are not tightly fused or are not sticky due to material is solved.

Description

Semi-finished waterproof device and finished waterproof device

Technical Field

The invention relates to the technical field of waterproof device finished products, in particular to a waterproof device semi-finished product and a waterproof device finished product.

Background

Along with the continuous progress of technology, the use surface of the waterproof device finished product is wider and wider, the waterproof and dampproof requirements on the waterproof device finished product are stricter in the market, and the waterproof device semi-finished product is used as the early basic process for manufacturing the waterproof device finished product, and is usually characterized in that a wire is cut off, a chip is welded, and then a glue filling process is carried out to prevent moisture from entering the chip; it is obvious that, because the material composition of the glue and the plastic material composition in the wire are far different, complete fusion between the two is impossible, and even more, the plastic of the wire is compared with the plastic of the wire according to the temperature resistance, so that the fusion of the glue and the plastic of the wire is more difficult.

In some cases (such as high-temperature wire plastics), the problem of insufficient combination of glue filling and plastics can occur, so that water vapor in the air can quickly penetrate into the chip gradually through the gap of the interlayer, thereby causing the failure of the finished product of the waterproof device, and particularly the plastic materials of the high-temperature wires are not sticky to any glue; therefore, the existing waterproof device finished product manufacturing technology is utilized, and huge obstruction exists in further improving waterproof and moistureproof capacity.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art.

Therefore, an object of the present invention is to provide a semi-finished waterproof device, wherein a plastic layer covers the outer surface of the semi-finished structural unit, so as to completely wrap the outer surface of each semi-finished structural unit, thereby achieving the purposes of waterproof and moistureproof.

Another object of the present invention is to provide a finished product of the waterproof device, which is manufactured by continuously processing the semi-finished product of the waterproof device.

In order to achieve the above object, according to one aspect of the present invention, there is provided a waterproof device semi-finished product cut from an injection molding tape comprising a plurality of waterproof device semi-finished products connected end to end, the waterproof device semi-finished products comprising:

a semifinished wire band comprising a plurality of semifinished structural units sequentially arranged at intervals in a length direction of the semifinished wire band, each of the semifinished structural units comprising a chip, at least one wire group, and an insulating structure attached to and spacing and fixing the wire groups; and

the plastic layer covers the outer surface of each semi-finished product structural unit so as to completely wrap the outer surface of each semi-finished product structural unit, the plastic layer is formed by cooling plastic,

wherein two adjacent semi-finished product structural units in a semi-finished product of the waterproof device are connected through the plastic layer.

According to the semi-finished waterproof device, the plastic layer is covered on the outer surface of each semi-finished structural unit, and the plastic layer is filled at the position of the fracture where two adjacent semi-finished structural units are connected, so that after each semi-finished structural unit is separated and then the plastic layer filled at the position of the fracture is cut, each obtained semi-finished waterproof device is completely wrapped by the plastic layer, and the problem of water inlet failure of the finished waterproof device due to the fact that two layers of plastic are combined in a non-tight mode or are not sticky due to material is solved.

Further, the semi-finished wire rod belt comprises a plurality of fracture positions, one fracture position is arranged between two adjacent semi-finished structural units, and the two adjacent semi-finished structural units are connected only through insulating materials in the first wire rod belt at the fracture positions when injection molding is not performed through wire rod injection molding equipment.

Further, each of the wire groups includes at least two wires extending in the length direction.

Further, the chip is arranged on the wire set, and the effective pins of the chip are respectively connected with wires in the wire set.

Each independent semi-finished product structure unit comprises at least one chip, and the number of effective pins on the chip is the same as the number of wires in the wire group.

Further, the wire set includes one end and another end, the one end is located at the head of the semi-manufactured structural unit, the other end is located at the tail of the semi-manufactured structural unit, wherein, in two adjacent semi-manufactured structural units, the one end of the wire set on one semi-manufactured structural unit is separated from the other end of the wire set on the other semi-manufactured structural unit by a fracture. The one end and the other end are both connected by an insulating material in the first wire strip.

Further, the chip is disposed on the one end of the wire set, wherein in two adjacent semi-finished product structural units, the chip on one semi-finished product structural unit is spaced from the other end of the wire set on the other semi-finished product structural unit through a fracture, and the chip and the other end in the waterproof device semi-finished product are connected after being completely covered by the plastic layer. The semi-finished product structural unit is formed by the wire group with the chip between the two fracture and the first wire strip, namely the second wire strip with the chip.

Further, the chip includes at least one of NTC, PTC, photo-transistor, magneto-sensitive transistor, conductive line, and circuit board with element.

Further, the plastic layer material is a plastic material for injection molding, and the temperature resistance of the plastic is in the range of-60 ℃ to 350 ℃.

Further, the wire material in the wire group is configured of copper, silver, aluminum, iron or other alloy material.

Further, the semi-finished waterproof device is formed by injection molding of wire injection molding equipment based on a second wire strip with a chip, namely a semi-finished wire strip, wherein the second wire strip is manufactured by punching wires in the first wire strip according to a preset length to form a plurality of fractures, and the second wire strip with the chip between the two fractures forms a semi-finished structural unit.

Wherein the first wire strip includes a plurality of wire sets and an insulating material for attaching to the wire sets and spacing and securing the wire sets.

Further, the first wire strip is formed on the wire by injection molding, pasting or braiding, and the insulating material comprises a film, a braided wire strip, bakelite or a first plastic.

In another aspect, the invention provides a finished waterproof device comprising an injection molding belt comprising a plurality of semi-finished waterproof devices connected end to end; cutting off the semi-finished waterproof device at the cut-off position of the fracture of the lead according to the position of the chip, so as to form a plurality of single semi-finished waterproof devices; and then carrying out tail treatment (peeling, terminal punching, jack seat or tin dipping) on the single semi-finished waterproof device to form the finished waterproof device. Wherein, the surface of every waterproof device finished product is all wrapped up by the plastic layer completely.

Further, the finished waterproof device comprises the semi-finished waterproof device described in any one of the above; and the shell is arranged on the outer surface of the inner chip of the semi-finished waterproof device and is constructed as a metal layer, a metal tube or a metal sticker.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure with reference to the accompanying drawings, and may assist in a comprehensive understanding of the present disclosure.

FIG. 1A is a schematic illustration of a first wire strip according to some exemplary embodiments of the present invention;

FIG. 1B is a schematic illustration of a second wire strip with chips (i.e., a semifinished wire strip) according to some exemplary embodiments of the invention;

fig. 2 is a schematic illustration of an injection molded strip of a plurality of end-to-end waterproof device blanks formed after injection molding with a wire injection molding apparatus according to some exemplary embodiments of the present invention;

FIG. 3 is a schematic cross-sectional view of an injection molded belt according to some exemplary embodiments of the invention;

fig. 4 is a schematic illustration of a finished waterproof device according to some exemplary embodiments of the present invention;

fig. 5 is a schematic view of a finished waterproof device according to further exemplary embodiments of the present invention;

FIG. 6 is a schematic diagram of a wire injection molding apparatus according to some exemplary embodiments of the invention;

it is noted that the dimensions of structures or regions may be exaggerated or reduced in the drawings for describing embodiments of the present disclosure for clarity, i.e., the drawings are not drawn to actual scale.

Reference numerals:

the semi-finished construction unit 100 is provided,

the first strip of wire 200 is provided with a pair of wire rods,

the second wire strip 300 is provided with a pair of wire strips,

wire injection molding apparatus 400, guide pulley 401, handpiece 402,

the fracture 10 is provided with a hole for the fracture,

the insulating material 20 in the first strip of wire,

the number of conductors of the conductor set 30, the conductors 31,

the head 40 of the semifinished structural unit,

the tail portion 50 of the semifinished structural unit,

chip 60, active pins 61.

Plastic layer 500, metal shell 600, terminal hole seat 700.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items.

In this document, unless specifically stated otherwise, directional terms such as "upper," "lower," "left," "right," "inner," "outer," and the like are used to denote orientations or positional relationships shown based on the drawings, and are merely used to facilitate the description of the present disclosure, rather than to indicate or imply that the devices, elements, or components referred to must have a particular orientation, be configured or operated in a particular orientation. It should be understood that when the absolute positions of the described objects are changed, the relative positional relationship they represent may also be changed accordingly. Accordingly, these directional terms should not be construed to limit the present disclosure.

Along with the continuous progress of technology, the application range of the waterproof device finished product is wider and wider, and the waterproof and dampproof requirements on the waterproof device finished product are stricter in the market. As a preliminary basic process for manufacturing the waterproof device, the semi-finished product of the waterproof device is usually manufactured by cutting a wire, soldering a chip on the wire, and then performing a glue filling process to prevent moisture from entering the chip. Obviously, because the material composition of the glue is far different from the plastic material composition of the wire, the glue and the plastic material of the wire cannot be completely fused, and more than dozens of plastic of the wire are compared according to temperature resistance, the glue and the plastic of the wire are more difficult to be completely fused; it is therefore difficult to completely prevent moisture from entering the chip by lengthening the length of the chip site housing, which is now commonly used.

Aiming at the problems that the combination of pouring sealant and plastic is not tight enough when wires with different temperature resistance are plastic, water vapor in the air can gradually permeate into a chip through a gap of an interlayer to cause the failure of a finished product of a waterproof device; aiming at the high-temperature wire material which is not sticky by any glue, the traditional glue filling process cannot play a role in water prevention, and the water prevention can be realized only by lengthening the length of the shell. Therefore, the existing waterproof device finished product manufacturing technology is utilized, and huge obstruction exists in further improving waterproof and moistureproof capacity.

The semi-finished product of the waterproof device provided by the embodiment of the invention is completely wrapped by the plastic layer after injection molding, namely, after cutting, the cutting surface is also covered by the plastic layer after injection molding, so that the problem of waterproof failure caused by insufficient tight combination of plastic materials of most wires and pouring sealant in the prior art is solved, and the problem that part of high-temperature wires are not waterproof is thoroughly solved.

It should be noted that the finished waterproof device provided by the embodiment of the present invention is not limited to a specific type, that is, the method for manufacturing the semi-finished waterproof device provided by the embodiment of the present invention is suitable for manufacturing all types of finished waterproof devices.

According to some embodiments of the present invention, there is provided a semifinished structural unit 100 comprising: insulating material 20, wire set 30, and chip 60 in the first wire strip; the insulating material 20 in the first wire strip here may be a film material, a braided wire strip, bakelite or a first plastic.

Specifically, as shown in fig. 1A-3, the wire set 30 includes at least two wires 31 therein, and the wire set 30 is attached to the insulating material 20 in the first wire strip and extends in the length direction; the chip 60 is disposed on the wire set 30 and soldered to the wires 31 in the wire set 30 via the active pins 61.

On the production line, the direction of extension of the plurality of semifinished structural units 100 (i.e. semifinished wire strips) after end-to-end connection is consistent with the direction of the production line, and the wires 31 of two adjacent semifinished structural units are cut off at the break 10 and connected by means of the insulating material 20 in the first wire strip. It will be appreciated that the break 10 may space apart two adjacent semifinished structural units 100 and simultaneously connect two adjacent semifinished structural units 100 for unitary movement in a production line.

The length direction is the direction in which the wires 31 extend and the direction in which the semi-finished structural units 100 are connected end to end is identical, the horizontal direction is the direction in which the wires 31 are arranged in the horizontal direction, and the stacking direction is the direction in which the wires 31 are arranged in the vertical direction.

Different numbers of wires 31 may be provided in the semi-finished structural unit 100 according to the number of effective pins 61 of the chip, where the number of effective pins and the number of wires are the same. For example, the wires 31 in the wire set 30 may be arranged in parallel.

The wire set 30 is fixed by the insulating material 20 in the first wire tape, and the insulating material 20 in the first wire tape may be disposed between the wires 31 in the wire set 30 or may be disposed at the periphery of the wire set 30, and the chip 60 is soldered to the wire set 30 through the active pins 61. The plurality of semi-finished structural units 100 (i.e., the semi-finished wire strips) shown in fig. 1B-3 are fed into the wire injection molding apparatus 400 shown in fig. 6, so that the outer surfaces of the insulating material 20, the outer surfaces of the wire sets 30, the outer surfaces of the chips 60 and the welding points of the chips 60 and the wire sets 30 in the first wire strip are completely wrapped by the plastic layer, thereby achieving the purposes of water resistance and moisture resistance.

It should be noted that one chip 60 may be included in one semi-finished structure unit 100, or a plurality of chips 60 may be included.

The first wire ribbon 200 is formed on the wires by injection molding, pasting or braiding, and the insulating material 20 includes a film, a braided wire ribbon, bakelite or a first plastic; the second wire rod belt 300 is manufactured by punching and cutting the wires in the first wire rod belt 200 according to a preset length to form a plurality of fractures 10, and the second wire rod belt 300 with the chip is a semi-finished wire rod belt; while the second wire strip 300 with the chip between two interruptions 10 constitutes the semifinished structural unit 100. Also, the semifinished wire band is composed of a plurality of semifinished structural units 100. After being injection molded by the wire injection molding apparatus 400, two adjacent semi-finished structural units 100 are connected by a plastic layer, and the plastic layer is cut off to form a semi-finished waterproof device.

Referring now to fig. 2, an injection molded tape comprising a plurality of end-to-end flashing semi-finished devices, according to some embodiments of the present invention, comprises: a plurality of semi-finished product structural units, fracture positions and plastic layers covering the plurality of semi-finished product structural units.

Specifically, a plurality of semi-finished product structural units 100 are sequentially arranged at intervals in the length direction, and two adjacent semi-finished product structural units 100 are connected through a plastic layer 500 to form an injection molding belt consisting of a plurality of semi-finished products of waterproof devices connected end to end.

In order to achieve the purpose of waterproof and moistureproof, in the embodiment of the present invention, the outer surface of each semi-finished structural unit 100 is covered with a plastic layer 500, so that the outer surface of each semi-finished structural unit 100 is completely wrapped. It will be appreciated that after the end-to-end plurality of semi-finished structural units 100 (i.e., the second wire strip 300 with chips) are fed into the wire injection molding apparatus 400 at a certain speed for injection molding and the insulating material 20 in the first wire strip for connection is broken, each semi-finished structural unit 100 must be completely wrapped with the plastic layer 500, thereby achieving the effect of preventing moisture from entering the interior of the semi-finished structural unit 100.

Referring to fig. 3, the wire set 30 includes one end disposed at the head 40 of the semi-finished structural unit 100 and the other end disposed at the tail 50 of the semi-finished structural unit 100. In two adjacent semi-finished structural units 100, one end of the wire set 30 on one semi-finished structural unit 100 is separated from the other end of the wire set 30 on the other semi-finished structural unit 100 by the fracture 10, and one end and the other end are connected after being completely covered by the plastic layer 500. It will be appreciated that the lead set 30 on the tail portion 50 of one semi-finished unit 100 is completely disconnected from the lead set 30 on the head portion 40 of another semi-finished unit 100 and then completely covered by the plastic layer 500 for connection.

In actual use, one skilled in the art will generally refer to the end to which the chip 60 is soldered as the head 40 of the semi-finished unit 100, and the opposite end as the tail 50 of the semi-finished unit 100, separated by the break 10. In the manufacture of finished waterproof devices, the end-to-end semifinished structural units 100 need to be cut apart.

According to the semi-finished waterproof device, the plastic layer 500 is covered on the outer surface of each semi-finished structural unit 100, and the plastic layer 500 is filled at the position of the fracture 10 where two adjacent semi-finished structural units 100 are connected, so that after each semi-finished structural unit 100 is separated and then the plastic layer 500 filled at the position of the fracture 10 is cut, each obtained semi-finished waterproof device is completely wrapped by the plastic layer 500, and the problem of water inlet failure of the finished waterproof device due to the fact that two layers of plastic are fused in a non-tight mode or are not sticky due to material reasons is solved.

Referring to fig. 4, an injection molding tape composed of a plurality of semi-finished waterproof devices connected end to end is cut at the cut-off position of the wire according to the position of the chip, thereby composing a plurality of single semi-finished waterproof devices; and then tail treatment (peeling, terminal crimping and jack 700) is carried out on the semi-finished product of the single waterproof device, so that the finished product of the waterproof device is formed. Wherein, the surface of every waterproof device finished product is all wrapped up by the plastic layer completely.

Referring to fig. 5, a metal case 600 is added to the position of the chip, thus forming another waterproof device finished product.

In order to prevent the chips 60, the insulating material 20 in the first wire ribbon and the wires 31 from being exposed at the positions between the head and the tail after cutting, it is required that the wires 31 with the chips 60 must be cut off first to form a plurality of semi-finished structural units 100 (i.e. semi-finished wire ribbon), and in the injection molding process of the re-injection molding, the head and the tail of the semi-finished structural units 100 connected by the insulating material 20 in the first wire ribbon must be melted or torn at the position of the fracture 10, so that the plastic layer 500 completely wraps the outer surface of the insulating material 20 in the first wire ribbon, the outer surface of the wire set 30 and the outer surface of the chips 60, thereby achieving the purpose of waterproof and dampproof.

It will be appreciated that the second wire strip with chips (i.e., the semi-finished wire strip), after being injection molded by the wire injection molding apparatus 400 shown in fig. 6, the plastic layer 500 covers not only the outer surfaces of the chips 60, the insulating material 20 in the first wire strip, and the wires 31, but also the cross section of the cut fracture 10.

It should be noted that, when not cut, since the chips 60 are disposed at the head 40 of the semi-finished structural unit 100, all the chips 60 are located between the head 40 of one semi-finished structural unit 100 and the tail 50 of the other semi-finished structural unit 100, in order to avoid damaging the chips 60 when cutting the two semi-finished structural units 100 connected end to end apart, on the one hand, and to completely wrap the chips 60 with the plastic layer 500 after cutting, on the other hand, the chips 60 after welding must be kept at a certain distance from the tail 50 of the other semi-finished structural unit, that is, the length of the fracture 10 formed after cutting the first wire strip 200 must be greater than the length of the chips 60 after welding the wires at the fracture 10 after plastic layer is subjected to plastic layer injection molding again, as to how long it is, depending on the debugging result of the device.

In the embodiment of the present invention, the composition of the insulating material and the composition of the plastic layer in the first wire belt are not particularly limited, and in the actual manufacturing process, if the insulating material and the plastic layer in the first wire belt are both plastic materials, they may or may not be compatible in the secondary injection molding.

In an embodiment of the present invention, the materials of the insulating material and the plastic layer in the first wire tape, if both are plastic materials, may include plastic materials of high temperature wires, such as Polytetrafluoroethylene (PTFE), perfluoro (ethylene propylene) copolymer (FEP), poly Perfluoroalkoxy (PFA) resin, poly Chlorotrifluoroethylene (PCTFF), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), silica gel, rubber, etc.; and plastic materials for low temperature wire such as polyvinyl chloride (PVC), irradiated polyvinyl chloride (XLPVC), polyethylene (PE), irradiated polyethylene (XLPE) and Polyurethane (PU), thermoplastic elastomer (TPE), polypropylene (PP), polymers of ethylene, propylene or other higher olefins (PO), and the like.

According to the embodiment of the invention, the plastic layer material is plastic material for injection molding, and the temperature resistant range of the plastic layer material can be between minus 60 ℃ and 350 ℃.

The temperature resistant range of the insulating material and the temperature resistant range of the plastic layer in the first wire belt can be controlled, so that the heat resistance and cold resistance of the waterproof device finished product can be improved, namely, the temperature resistant range of the waterproof device finished product can be determined from the temperature resistant ranges of the insulating material and the plastic layer in the first wire belt.

According to the embodiment of the present invention, only if the temperature in the wire injection molding apparatus 400 needs to be higher than the melting temperature of the insulating material 20 in the first wire strip, the insulating material around the fracture 10 is completely melted during injection molding, and at the same time, the plastic layer at this temperature needs to be guaranteed to be in a melted state, so that the insulating material 20 in the first wire strip melted by the fracture 10 and the semi-finished structural unit 100 can be wrapped.

After a plurality of semi-finished structural units 100 (i.e., semi-finished wire strips) are fed into the wire injection molding apparatus 400 having a temperature, the wire injection molding apparatus 400 is operated at a certain speed, and then the temperature in the wire injection molding apparatus 400 is increased, and the insulating material 20 in the first wire strip 200 at the position of the fracture 10 is gradually melted or torn off in consideration of the shape, thickness, etc. of the fracture 10, so that the plastic layer 500 completely encapsulates the outer surface of the insulating material 20 in the first wire strip 200, the outer surface of the wire set 30, and the outer surface of the chip 60. Thus, the insulating material 20 in the first wire strip may comprise a film, a woven wire strip, bakelite, or a first plastic, etc.

The insulating material and the plastic layer in the first wire belt can be made of high-temperature-resistant plastic materials. Because a plurality of high-temperature-resistant plastic materials have the characteristic of being not compatible with each other, in the manufacturing process of the waterproof device finished product, the waterproof device finished product with high-temperature resistance and high waterproof property can be obtained by manufacturing according to the method and controlling the relation between the atmospheric pressure and the thickness of the high-temperature-resistant plastic materials, and even if the temperature measurement is carried out on the seabed, the severe requirement of long-term working under high pressure can be realized.

According to an embodiment of the present invention, the material of the wire is configured of a copper material, a silver material, an aluminum material, an iron material, or other alloy material.

According to an embodiment of the invention, the chip comprises at least one of an NTC, a PTC, a photo-transistor, a magneto-sensitive tube, a conducting wire and a circuit board with elements.

The manufacturing method of the waterproof device finished product according to some exemplary embodiments of the present invention is to continue processing based on the manufacturing method of the waterproof device semi-finished product, and the manufacturing method further includes: and cutting off the semi-finished waterproof device at the cut-off position of the lead according to the position of the chip to form a plurality of semi-finished waterproof device, wherein the outer surface of each semi-finished waterproof device is completely wrapped by the plastic layer.

The position of the cut-off part of the stamping is completely covered by the plastic layer, so that the position to be cut can be judged according to the position of the head chip, and the position to be cut can be judged according to the position of the broken wire.

In one embodiment, on the basis of an injection molding belt consisting of a plurality of waterproof and moistureproof semi-finished products connected end to end, cutting off the semi-finished products of the waterproof devices at the cut-off position of the fracture of a lead, peeling off the tail part of the semi-finished products, and forming a plurality of single waterproof device finished products by using a tin dipping process or punching terminal hole seats; the head part containing the chip is completely wrapped by the plastic layer, so that the effects of water resistance and moisture resistance can be achieved.

A finished waterproof device according to some exemplary embodiments of the present invention includes: the waterproof device semi-finished product and the shell. The shell is arranged on the outer surface of the inner chip of the semi-finished waterproof device and is constructed by a metal layer, a metal tube or a metal sticker.

For the purpose of unified treatment, the surface of the semi-finished product of the waterproof device obtained by the manufacturing method is processed to obtain a finished product of the waterproof device which has the same appearance as the market.

The insulating materials in the chip, the welding point of the chip and the wire, the wire and the first wire band at the fracture are completely wrapped by the plastic layer subjected to secondary injection molding, so that the waterproof device finished product provided by the embodiment of the invention has stronger waterproof and moistureproof capabilities and higher market competitiveness.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

Claims

1. A waterproof device semi-finished product, a plastic injection belt comprising a plurality of waterproof device semi-finished products is produced by cutting an injection molding belt produced by injection molding plastic of a wire injection molding device, characterized by comprising:

the plastic layer covers the outer surface of each semi-finished product structural unit so as to completely wrap the outer surface of each semi-finished product structural unit, the plastic layer is formed by cooling plastic injection by wire injection molding equipment,

2. The flashing device blank according to claim 1, wherein said blank wire band comprises a plurality of break locations, one of said break locations being provided between two adjacent ones of said blank construction units; the two adjacent semi-finished structural units are connected only by the insulating material in the first wire belt at the fracture position when the two adjacent semi-finished structural units are not subjected to injection molding by the wire injection molding equipment.

3. The flashing device blank according to claim 1 or 2, wherein each of the wire sets comprises at least two wires extending in the length direction.

4. The semi-finished waterproof device according to claim 1 or 2, wherein the chips are arranged on the wire groups, the effective pins of the chips are respectively connected with wires in the wire groups,

5. The flashing device blank of claim 4, wherein each of said conductor sets comprises one end and another end, said one end being located at a head portion of said blank structural unit and said another end being located at a tail portion of said blank structural unit,

wherein, in two adjacent semi-manufactured structural units, the one end of the wire group on one semi-manufactured structural unit is separated from the other end of the wire group on the other semi-manufactured structural unit by a fracture.

6. The semi-finished waterproof device as claimed in claim 5, wherein the chip is provided on the one end of the wire group,

wherein in two adjacent semi-finished structural units, the chip on one semi-finished structural unit is separated from the other end of the wire group on the other semi-finished structural unit through a fracture; the chip in the semi-finished product of the waterproof device and the other end are connected after being completely coated by the plastic layer.

7. The waterproof device semi-finished product according to claim 1 or 2, wherein the chip comprises at least one of NTC, PTC, photo-sensitive tube, magneto-sensitive tube, conductive wire and circuit board with element.

8. The water-resistant device semifinished product according to claim 1 or 2, wherein said plastic layer material is a plastic material for injection molding, said plastic having a temperature resistance ranging between-60 ℃ and 350 ℃.

9. The water resistant device semi-finished product according to claim 1 or 2, wherein the wire material in the wire set comprises copper, silver, aluminum, iron or other alloy material.

10. The semi-finished waterproof device according to claim 1 or 2, wherein the semi-finished waterproof device is injection molded by a wire injection molding apparatus based on a second wire strip with a chip, the second wire strip is manufactured by punching and cutting wires in a first wire strip according to a preset length to form a plurality of fractures, the second wire strip with the chip between two fractures forms a semi-finished structural unit,

11. The flashing device blank of claim 10, wherein the first strip of wire is formed on the wire by injection molding, pasting or braiding, and the insulating material comprises a film, braided strip, bakelite or a first plastic.

12. A finished waterproof device comprising an injection molded tape comprising a plurality of semi-finished waterproof devices, wherein the finished waterproof device is made by: cutting the semi-finished waterproof device according to any one of claims 1 to 11 at the position of the fracture of the wire according to the position of the chip, then performing tail treatment, thereby forming a plurality of finished waterproof devices,

wherein, the surface of every waterproof device finished product is all wrapped up by the plastic layer completely.

13. A finished waterproof device comprising:

a water-repellent device semifinished product according to any one of claims 1 to 11; and

and the shell is arranged on the outer surface of the chip in the semi-finished waterproof device and is constructed by a metal layer, a metal tube or a metal sticker.