CN116017855B - Operation method for single-piece soft and hard combined plate - Google Patents
Operation method for single-piece soft and hard combined plate Download PDFInfo
- Publication number
- CN116017855B CN116017855B CN202211692177.3A CN202211692177A CN116017855B CN 116017855 B CN116017855 B CN 116017855B CN 202211692177 A CN202211692177 A CN 202211692177A CN 116017855 B CN116017855 B CN 116017855B
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- Prior art keywords
- plate
- soft
- carrier plate
- hard combined
- adhesive tape
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000002390 adhesive tape Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention discloses an operation method for a single-piece soft and hard combined plate, which comprises the following steps: providing a first carrier plate, a fixed plate and a plurality of single-chip good soft and hard combined plates; attaching an adhesive tape layer on the surface of the fixed plate; filling the soft and hard combined plates with a plurality of single-chip good products into the fixing grooves one by one so as to be adhered to the adhesive tape layer; operating an SMT process on the first surface of the rigid-flex board; providing a second carrier plate; reversing the relatively fixed second carrier plate and the fixed plate by 180 degrees, and removing the first carrier plate; operating SMT technology on the second surface of the soft and hard combined plate of each single-chip good product; and removing the adhesive tape layer to obtain the rigid-flex board after operation. The invention at least comprises the following advantages: the double-sided operation can be realized on the basis of one-time positioning by utilizing the sandwich structure and the action of bonding and overturning, and the direct input of single-chip good products is omitted, so that most single-point detection is omitted, the accuracy required by the whole operation method can be ensured to be higher, and the operation period is shorter.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an operation method for a single soft and hard combined board.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
In operation, the rigid-flex board is a multi-link structure, wherein each rigid-flex board corresponds to an optical point, and it is noted that a portion of the rigid-flex board in the multi-link structure has defective products. When the SMT technology is operated on the soft and hard combined plate with the connecting plate structure, each optical point is required to be detected to obtain the defective products, so that the required area of a detection station is large, the accuracy requirement is high, and the period is also longer; and then the front and back operation of the connecting plate structure is realized by utilizing a magnetic adsorption and disassembly type fixing mode, so that the front and back operation needs a positioning process, the accuracy requirement is further improved, and in the operation, such as a pasting process, the optical point still needs to be identified again. Because the software combined plate is a highly integrated element, the requirements of high precision, long period and the like in the working procedure can increase the working difficulty, thereby causing the defects of low productivity and high production cost.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the invention section.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides an operation method for a single-chip soft and hard combined plate, which can realize double-sided operation on the basis of one-time positioning by utilizing a sandwich structure and the action of bonding and overturning, saves most single-point detection, ensures higher accuracy required by the whole operation method and has shorter operation period.
The embodiment of the application discloses: an operation method for a single soft and hard combined plate comprises the following steps:
providing a first carrier plate, a fixed plate and a plurality of single-chip good-quality soft and hard combined plates, wherein fixed grooves which are in one-to-one correspondence with the single soft and hard combined plates are formed in the fixed plate;
an adhesive tape layer is attached to the surface, facing the first carrier, of the fixing plate, and the fixing plate is fixedly arranged relative to the first carrier through the adhesive tape layer;
filling the soft and hard combined plates of a plurality of single-chip good products into the fixing grooves one by one, so that the soft and hard combined plates of each single-chip good product can be immersed into the fixing grooves and adhered to the adhesive tape layer;
operating an SMT process on the first surface of the soft and hard combined plate of each single-chip good product;
providing a second carrier plate, and fixedly arranging the second carrier plate relative to the fixed plate;
reversing the second carrier plate and the fixed plate which are relatively fixed by 180 degrees, and removing the first carrier plate;
operating an SMT process on the second surface of the soft and hard combined plate of each single-chip good product;
and removing the adhesive tape layer to obtain the rigid-flex board after operation.
Further, in the step of providing the first carrier plate, the fixing plate and the plurality of single-chip good-quality soft and hard combined plates, the fixing plate is made of steel materials, and the ratio of the section size of the fixing groove to the section size of the corresponding soft and hard combined plate is 1: between 0.96 and 0.98.
Further, in the step of providing the first carrier plate and the step of providing the second carrier plate, magnet pieces are disposed on the first carrier plate and the second carrier plate, and the magnet pieces can adsorb the fixing plate.
Further, in the step of providing the first carrier plate and the step of providing the second carrier plate, the first carrier plate and the second carrier plate are made of aluminum, and the thickness is between 3 mm and 5 mm.
Further, in the step of attaching a glue strip layer to a surface of the fixing plate facing the first carrier plate, and fixing the fixing plate relative to the first carrier plate through the glue strip layer, the glue strip layer is made of PI material, where each fixing groove corresponds to at least one glue strip layer.
Further, in the step of providing the first carrier plate, the fixing plate and the plurality of single-chip good-quality soft and hard combined plates, at least one datum point serving as a datum optical point is arranged on both sides of the fixing plate.
Further, in the step of filling the plurality of single-chip good-quality soft and hard combined boards into the fixing groove one by one, the method further comprises: and scanning the datum points on the fixed plate through a CCD (charge coupled device) camera piece, and filling the plurality of single-chip good products into the fixed grooves one by matching with a mechanical arm.
By the technical scheme, the invention has the following beneficial effects:
1. firstly, a plurality of single-chip good-product soft and hard combined plates are directly provided, and compared with a connecting plate structure in the prior art, the connecting plate structure can limit each single-chip good-product soft and hard combined plate by utilizing the arrangement of the fixing grooves, and the optical point corresponding to each single-chip good-product soft and hard combined plate in the prior art is not required to be set and detected, so that the accuracy of the single-chip good-product soft and hard combined plates is ensured, and meanwhile, the operation period is shortened;
2. utilize sandwich structure that first carrier plate, fixed plate and second carrier plate formed in the application, utilize the bonding of adhesive tape layer to guarantee the position relativity of soft or hard combined plate at its first face of operation and second face to utilize the process such as SMT in once locate mode can realize the operation, when further guaranteeing the accuracy of single-chip good product soft or hard combined plate.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments, as illustrated in the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of operation in an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, in the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
Referring to FIG. 1
The embodiment discloses an operation method for a single-piece soft and hard combined board, which comprises the following steps:
providing a first carrier plate, a fixed plate and a plurality of single-chip good-quality soft and hard combined plates, wherein fixed grooves which are in one-to-one correspondence with the single soft and hard combined plates are formed in the fixed plate;
an adhesive tape layer is attached to the surface, facing the first carrier, of the fixing plate, and the fixing plate is fixedly arranged relative to the first carrier through the adhesive tape layer;
filling the soft and hard combined plates of a plurality of single-chip good products into the fixing grooves one by one, so that the soft and hard combined plates of each single-chip good product can be immersed into the fixing grooves and adhered to the adhesive tape layer;
operating an SMT process on the first surface of the soft and hard combined plate of each single-chip good product;
providing a second carrier plate, and fixedly arranging the second carrier plate relative to the fixed plate;
reversing the second carrier plate and the fixed plate which are relatively fixed by 180 degrees, and removing the first carrier plate;
operating an SMT process on the second surface of the soft and hard combined plate of each single-chip good product;
and removing the adhesive tape layer to obtain the rigid-flex board after operation.
Among the above-mentioned setting mode, at first directly provide a plurality of single-chip good soft and hard combined board, for the structure is pulled in the link among the prior art, its setting that utilizes the fixed slot can carry out spacingly to every single-chip good soft and hard combined board, and need not to set up and detect the optics point that every soft and hard combined board among the prior art corresponds again to guarantee the accuracy of single-chip good soft and hard combined board again, also can shorten the operating period.
In addition, utilize sandwich structure that first carrier plate, fixed plate and second carrier plate formed in this application, utilize the bonding of adhesive tape layer to guarantee the position relativity of soft or hard combined plate at its first face of operation and second face to utilize the process such as SMT in once locate mode can realize the operation, when further guaranteeing the accuracy of single-chip good product soft or hard combined plate.
In the step of providing a first carrier plate, a fixing plate and a plurality of single-chip good-quality soft and hard combined plates, the fixing plate is made of steel materials, and the ratio of the section size of the fixing groove to the section size of the corresponding soft and hard combined plate is 1: between 0.96 and 0.98. The setting mode of this department can make soft and hard combined plate can put into this fixed slot effectively on the one hand, and also at the in-process of putting into, the spacing effect of the inside wall of this fixed slot can make the position of soft and hard combined plate by the direction to be in on the required position after being placed.
In the step of providing the first carrier plate and the step of providing the second carrier plate, magnet pieces are arranged on the first carrier plate and the second carrier plate, and the magnet pieces can adsorb the fixing plate. The magnetic adsorption type fixing device is convenient to install and detach, and has shorter installation and detachment periods relative to locking modes such as threads, welding and the like. Preferably, the first and second carrier plates are made of aluminum material with a thickness of 3-5mm
In the step of attaching a glue strip layer to the surface of the fixing plate facing the first carrier plate, and fixing the fixing plate relative to the first carrier plate through the glue strip layer, the glue strip layer is made of PI material, and each fixing groove corresponds to at least one glue strip layer. Preferably, two adhesive tape layers are arranged in parallel, and the two adhesive tape layers can be bonded with the corresponding soft and hard combined plates.
In the step of providing the first carrier plate, the fixed plate and the plurality of single-chip good-product soft and hard combined plates, two sides of the fixed plate are respectively provided with at least one datum point serving as a datum optical point.
Wherein, in step "fill a plurality of single-chip good soft and hard combined board one by one in the fixed slot", still include: and scanning the datum points on the fixed plate through a CCD (charge coupled device) camera piece, and filling the plurality of single-chip good products into the fixed grooves one by matching with a mechanical arm.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (2)
1. The operation method for the single-piece soft and hard combined plate is characterized by comprising the following steps of:
the utility model provides a first carrier plate, fixed plate, a plurality of single yields rigid-flex board, set up on the fixed plate with single rigid-flex board one-to-one's fixed slot, first carrier plate and second carrier plate adopt aluminium system material to make, and thickness is between 3-5mm, all be provided with magnet spare on first carrier plate and the second carrier plate, magnet spare can adsorb the fixed plate, the fixed plate adopts steel material to make, the cross-section size of fixed slot rather than the ratio of the cross-section size of corresponding rigid-flex board is at 1: between 0.96 and 0.98, at least one datum point serving as a datum optical point is arranged on both sides of the fixed plate;
an adhesive tape layer is attached to the surface, facing the first carrier plate, of the fixing plate, the fixing plate is fixedly arranged relative to the first carrier plate through the adhesive tape layer, the adhesive tape layer is made of PI materials, and each fixing groove corresponds to at least one adhesive tape layer;
filling the soft and hard combined plates of a plurality of single-chip good products into the fixing grooves one by one, so that the soft and hard combined plates of each single-chip good product can be immersed into the fixing grooves and adhered to the adhesive tape layer;
operating an SMT process on the first surface of the soft and hard combined plate of each single-chip good product;
providing a second carrier plate, and fixedly arranging the second carrier plate relative to the fixed plate;
reversing the second carrier plate and the fixed plate which are relatively fixed by 180 degrees, and removing the first carrier plate;
operating an SMT process on the second surface of the soft and hard combined plate of each single-chip good product;
and removing the adhesive tape layer to obtain the rigid-flex board after operation.
2. The method according to claim 1, wherein in the step of filling the plurality of single-chip good-quality rigid-flex boards into the fixing groove, the method further comprises: and scanning the datum points on the fixed plate through a CCD (charge coupled device) camera piece, and filling the plurality of single-chip good products into the fixed grooves one by matching with a mechanical arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211692177.3A CN116017855B (en) | 2022-12-28 | 2022-12-28 | Operation method for single-piece soft and hard combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211692177.3A CN116017855B (en) | 2022-12-28 | 2022-12-28 | Operation method for single-piece soft and hard combined plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116017855A CN116017855A (en) | 2023-04-25 |
| CN116017855B true CN116017855B (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211692177.3A Active CN116017855B (en) | 2022-12-28 | 2022-12-28 | Operation method for single-piece soft and hard combined plate |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007329182A (en) * | 2006-06-06 | 2007-12-20 | Shin Etsu Polymer Co Ltd | Carrier tool, and its manufacturing process |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN203697636U (en) * | 2014-01-14 | 2014-07-09 | 湖北三赢兴电子科技有限公司 | Surface mount fixation jig for FPC (flexible printed circuit) of high-end camera shooting module |
| CN112911838A (en) * | 2021-01-29 | 2021-06-04 | 锦耀智能精密制造(深圳)有限公司 | FPC rigid-flex board sandwich pressing carrier |
-
2022
- 2022-12-28 CN CN202211692177.3A patent/CN116017855B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007329182A (en) * | 2006-06-06 | 2007-12-20 | Shin Etsu Polymer Co Ltd | Carrier tool, and its manufacturing process |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN203697636U (en) * | 2014-01-14 | 2014-07-09 | 湖北三赢兴电子科技有限公司 | Surface mount fixation jig for FPC (flexible printed circuit) of high-end camera shooting module |
| CN112911838A (en) * | 2021-01-29 | 2021-06-04 | 锦耀智能精密制造(深圳)有限公司 | FPC rigid-flex board sandwich pressing carrier |
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| Publication number | Publication date |
|---|---|
| CN116017855A (en) | 2023-04-25 |
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