CN116017118A

CN116017118A - Driving assembly and camera module

Info

Publication number: CN116017118A
Application number: CN202111221269.9A
Authority: CN
Inventors: 卞强龙; 姜瑶清; 魏罕钢; 杨巧凤; 戎琦; 黄桢
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2021-10-20
Filing date: 2021-10-20
Publication date: 2023-04-25

Abstract

The driving assembly uses an elastic piece group of a circuit board as a reset and limit element of an SMA driver, and the overall height size of the chip anti-shake part is reduced in an element multiplexing mode. And the height difference is arranged between the inner circuit board and the outer circuit of the circuit board so that the elastic piece group is in a stretching state, and the elastic piece group in the stretching state provides a tightening force for enabling the ball assembly to be abutted against the chip anti-shake fixing part, so that noise generated by separation between the ball assembly and the chip anti-shake fixing part is avoided.

Description

Driving assembly and camera module

Technical Field

The application relates to the field of camera shooting modules, in particular to a driving assembly and a camera shooting module, wherein the driving assembly reduces the overall height size of an anti-shake part of a chip in a mode that an elastic piece group of a circuit board serves as a reset and limit element of an SMA driver through element multiplexing.

Background

With the popularity of mobile electronic devices, related technologies of camera modules used for mobile electronic devices to assist users in capturing images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely used in various fields such as medical, security, industrial production, etc.

Currently, consumers in the market have increasingly high and diversified functions of camera modules configured in mobile electronic devices, for example, camera modules of mobile electronic devices are required to have anti-shake functions. It should be understood that when using a mobile electronic device for photographing, photographing effects may be poor due to physiological tremors of a human body having a certain frequency under normal conditions and shaking caused by movement. Therefore, it is expected that the mobile electronic device is equipped with an anti-shake device to drive the optical lens or the photosensitive chip to move to realize optical anti-shake.

At present, various schemes have been applied to solve the anti-shake problem of the camera module, wherein one of the major technical difficulties is that the anti-shake structure increases the size of the camera module, which is contrary to the trend of the mobile electronic device towards light weight and thin profile.

Therefore, an optimized anti-shake structure for a camera module is desired to meet the dual technical requirements of anti-shake and structural design.

Disclosure of Invention

An advantage of the present application is that it provides a drive assembly and camera module, wherein, drive assembly reduces the whole height dimension of chip anti-shake portion with the reset and spacing component of the elastic component group SMA driver of circuit board through the multiplexing mode of component.

Another advantage of the present application is to provide a driving assembly and a camera module, wherein a height difference is provided between an inner circuit board and an outer circuit of the circuit board so that the elastic member set is in a stretched state, and the elastic member set in the stretched state provides a tightening force for the ball assembly to abut against the chip anti-shake fixing portion, so as to avoid noise generated due to separation between the ball assembly and the chip anti-shake fixing portion.

Still another advantage of the present application is to provide a driving assembly and a camera module, wherein at least three balls of the ball assembly form a horizontal mounting surface so that the inner circuit board moves on a horizontal plane, thereby improving anti-shake stability.

Other advantages and features of the present application will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

To achieve at least one of the above advantages, the present application provides a driving assembly, comprising:

the chip anti-shake fixing part comprises at least one driving element fixing part positioned in the accommodating cavity;

the chip anti-shake movable part is positioned in the accommodating cavity and comprises a movable carrier and at least one driving element movable part which is connected to the movable carrier in a linkage manner;

A circuit board suspended and fixed in the accommodating cavity, wherein the circuit board comprises an inner circuit board, an outer circuit board and an elastic piece group extending between the inner circuit board and the outer circuit board, the inner circuit board is suspended and arranged in the outer circuit board through the elastic piece group, the inner circuit board is suitable for mounting a photosensitive chip, and the inner circuit board is fixed on a movable carrier of the chip anti-shake movable part;

a driving element including at least one SMA wire extending between the at least one driving element fixing portion and the at least one driving element movable portion; and

and a ball assembly movably clamped between the movable carrier and the chip anti-shake fixing portion, wherein a height difference is formed between the inner circuit board and the outer circuit board so that the elastic member group is in a stretched state, and the elastic member group in the stretched state provides a pressing force for the ball assembly to abut against the chip anti-shake fixing portion.

In the driving assembly according to the application, the anti-shake fixing portion comprises a base and an upper cover buckled with the base, and the accommodating cavity is formed between the upper cover and the base.

In the drive assembly according to the present application, the ball assembly and the at least one SMA wire are located between the upper cover and the movable carrier.

In a drive assembly according to the present application, the ball assembly and the at least one SMA wire are located between the base and the movable carrier.

In the driving assembly according to the present application, the inner circuit board is higher than the outer circuit board.

In the drive assembly according to the present application, the height difference between the inner circuit board and the outer circuit board is between 0.05mm and 0.1 mm.

In the drive assembly according to the application, the magnitude of the urging force is between 20mN and 50 mN.

In the drive assembly according to the present application, the ball assembly includes at least three balls rollably clamped between the base and the movable carrier, the top ends of the at least three balls forming a plane parallel to the inner circuit board.

In the driving assembly according to the application, the top surface of the inner circuit board is provided with a photosensitive chip mounting area and a peripheral area formed at the periphery of the photosensitive chip mounting area, wherein the at least three balls correspond to the peripheral area.

In the driving assembly according to the present application, the at least three balls are fixed to the movable carrier, or the at least three balls are fixed to the base.

In the driving assembly according to the present application, the at least one driving element movable portion includes a first driving element movable portion and a second driving element movable portion that are disposed opposite to each other, the at least one driving element fixed portion includes a first driving element fixed portion and a second driving element fixed portion that are disposed opposite to each other, and the first driving element fixed portion, the second driving element fixed portion, the first driving element movable portion and the second driving element movable portion are located at four corners of the housing cavity; the at least one SMA wire comprises a first SMA wire extending in the first driving element fixing portion and the first driving element movable portion, a second SMA wire extending in the first driving element movable portion and the second driving element fixing portion, a third SMA wire extending in the second driving element fixing portion and the second driving element movable portion, and a fourth SMA wire extending in the second driving element movable portion and the first driving element fixing portion.

In the drive assembly according to the present application, the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located in the same plane, and the planes in which the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located are parallel to the plane in which the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, wherein the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire have the same length.

In the driving assembly according to the application, in the Z-axis direction set by the driving assembly, a gap is formed between the first SMA wire, the second SMA wire, the third SMA wire, the fourth SMA wire and the elastic piece group, and the gap is greater than or equal to 0.1mm.

In a drive assembly according to the present application, the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located outside of the inner circuit board.

In the driving assembly according to the present application, the chip anti-shake fixing portion further includes a fixing carrier stacked on the substrate, the fixing carrier includes a fixing carrier body and a first fixing carrier support portion and a second fixing carrier support portion extending outwardly from the fixing carrier relatively, respectively, wherein the first driving element fixing portion and the second driving element fixing portion are mounted to the first fixing carrier support portion and the second fixing carrier support portion, respectively, and wherein the movable carrier includes a movable carrier body and a first movable carrier support portion and a second movable carrier support portion extending downwardly and outwardly from the movable carrier body relatively, respectively, and wherein the first driving element movable portion and the second driving element movable portion are mounted to the first movable carrier support portion and the second movable carrier support portion, respectively.

In the drive assembly according to the present application, the stationary carrier body has at least three ball grooves for receiving the at least three balls.

In the driving assembly according to the application, the chip anti-shake fixing portion further comprises a supporting piece arranged on the substrate, and the top surface of the supporting piece is abutted to the outer circuit board.

In the driving assembly according to the application, a gap is formed between the elastic piece group of the circuit board and the upper cover, and the chip anti-shake movable part further comprises an anti-collision assembly fixed on the top surface of the inner circuit board.

In the driving assembly according to the present application, the elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner with respect to a center set by the inner circuit board, wherein the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively distributed around four corners of the inner circuit board, and the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively connected to one of inner sides of the outer circuit board and one of outer sides of the inner circuit board which are vertically distributed.

According to another aspect of the present application, there is also provided a camera module, including:

an optical lens;

a photosensitive chip; and

the driving assembly as described above, wherein the photosensitive chip is mounted to the inner circuit board.

Further objects and advantages of the present application will become fully apparent from the following description and the accompanying drawings.

These and other objects, features, and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings, and the appended claims.

Drawings

The foregoing and other objects, features and advantages of the present application will become more apparent from the following more particular description of embodiments of the present application, as illustrated in the accompanying drawings. The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the application and not constitute a limitation to the application. In the drawings, like reference numerals generally refer to like parts or steps.

Fig. 1 illustrates a schematic perspective view of an imaging module according to an embodiment of the present application.

Fig. 2 illustrates a schematic diagram of a photosensitive assembly and a driving assembly of the camera module according to an embodiment of the present application.

Fig. 3 illustrates a perspective exploded view of the photosensitive assembly and the driving assembly according to an embodiment of the present application.

Fig. 4A illustrates a schematic diagram of a circuit board of the photosensitive assembly according to an embodiment of the present application.

Fig. 4B illustrates a partial enlarged schematic view of the wiring board according to an embodiment of the present application.

Fig. 5A illustrates a schematic cross-sectional view of the drive assembly and the photosensitive assembly according to an embodiment of the present application.

Fig. 5B illustrates a schematic cross-sectional view of a variant embodiment of the drive assembly and the photosensitive assembly according to an embodiment of the present application.

Fig. 6 illustrates a schematic view of a movable carrier and a fixed carrier of the drive assembly according to an embodiment of the present application.

Fig. 7 illustrates a top view of the movable carrier and the stationary carrier according to an embodiment of the present application.

Fig. 8 illustrates a bottom view of the drive assembly after removal of a substrate in accordance with an embodiment of the present application.

Fig. 9 illustrates a perspective view of a base, a ball assembly, and a chip anti-shake fixing portion of the driving assembly according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application and not all of the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Exemplary camera Module

As shown in fig. 1 to 9, an image capturing module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive member 30, an optical lens 10 held on a photosensitive path of the photosensitive member 30, and a driving member 20 for driving the optical lens 10 and/or the photosensitive member 30 to move to achieve optical performance adjustment, for example, optical anti-shake, optical focusing, and the like.

Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11, and the lens group 12 includes at least one optical lens, and the number of the at least one optical lens may be one or more, and is not limited. The photosensitive assembly 30 includes a circuit board 31, a photosensitive chip 321 electrically connected to the circuit board 31, an electronic component 322, and a connector, wherein the photosensitive chip 321 is configured to receive the external light collected by the optical lens 10 for imaging, and is electrically connected to an external mobile electronic device through the circuit board 31 and the connector.

The photosensitive chip 321 includes a photosensitive area and a non-photosensitive area, and the photosensitive chip 321 is electrically connected to the circuit board 31 through a photosensitive chip pad located in the non-photosensitive area, for example, the photosensitive chip 321 may be electrically connected to the circuit board 31 by wire bonding (wire bonding), soldering, FC process (flip chip), RDL (rewiring layer technology), or the like. The photosensitive chip 321 is adapted to be fixed to the upper surface of the wiring board 31 by an adhesive medium (here, in the embodiment of the present application, a surface defining the wiring board 31 toward the lens is defined as an upper surface). In some examples of the present application, in order to reduce the overall height of the camera module 1, the photosensitive chip 321 is disposed in the through hole of the circuit board 31, so as to reduce the influence of the thickness of the circuit board 31 on the thickness of the photosensitive component 30, and reduce the height of the camera module 1.

The photosensitive assembly 30 further includes a filter element 324, and the filter element 324 is held on the photosensitive path of the photosensitive chip 321 for filtering the imaging light entering the photosensitive chip 321. In a specific example, the filter element 324 is mounted on the base 323 of the photosensitive assembly 30 and corresponds to at least the photosensitive area of the photosensitive chip 321, the base 323 is implemented as a separately molded plastic bracket that is attached to the surface of the circuit board 31 through an adhesive medium and is used for supporting other components, or the base 323 is implemented as a molded base that is integrally molded at a predetermined position of the circuit board 31 through a molding process, which is not limited in this application. It should be noted that, in other examples of the present application, the filter element 324 can also be mounted at other positions of the image capturing module, for example, the filter element 324 is formed in the optical lens 10 (for example, as a filter attached to a surface of a certain optical lens of the optical lens 10).

The driving assembly 20 includes a chip driving part 201, the chip driving part 201 may include a chip anti-shake part 21, the chip anti-shake part 21 is adapted to drive the photosensitive chip 321 of the photosensitive assembly 30 to translate in the X-axis direction and the Y-axis direction and/or rotate around the Z-axis direction, so as to implement translational anti-shake and/or rotational anti-shake of the photosensitive assembly 30; alternatively, the chip anti-shake unit 21 is adapted to drive the photosensitive chip 321 of the photosensitive assembly 30 to rotate in the X-axis direction and the Y-axis direction to realize oblique anti-shake of the photosensitive assembly 30. In this application, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane in which the X-axis direction and the Y-axis direction lie, in other words, the X-axis, the Y-axis, and the Z-axis constitute a three-dimensional stereoscopic coordinate system.

In some examples of the present application, the chip driving part 201 further includes a chip focusing part, that is, the chip driving part 201 may further drive the photosensitive chip 321 of the photosensitive assembly 30 to move along the optical axis (i.e., the Z-axis direction), so as to implement a chip focusing function.

In the embodiment of the present application, the chip anti-shake portion 21 and the chip focusing portion may be a voice coil motor, a piezoelectric motor, an SMA (shape memory alloy ) motor, or the like type of driving motor. The shape memory alloy is an alloy material which can completely eliminate the deformation of the shape memory alloy at a lower temperature after heating and raising the temperature and restore the original shape of the shape memory alloy before deformation. For example, when the shape memory alloy is subjected to a limited plastic deformation at a temperature below the phase transition temperature, it may be returned to its original shape prior to deformation by heating, wherein heating of the SMA wire may be achieved by energizing the SMA wire.

In some specific examples of the present application, the driving assembly 20 may further include a lens driving part 202, where the lens driving part 202 includes a lens driving fixed part, a lens driving movable part, a lens suspension part connecting the lens driving fixed part and the lens driving movable part, and a driving element, and the optical lens 10 is mounted on the lens driving movable part of the lens driving part 202, and the driving element drives the lens driving fixed part and the optical lens 10 to move so as to implement a lens anti-shake or lens focusing function.

Specifically, in one embodiment of the present application, the lens driving section 202 includes a lens focusing section adapted to drive the optical lens 10 to move along the optical axis to achieve a lens focusing function; in another embodiment of the present application, the lens driving part 202 includes a lens focusing part and a lens anti-shake part, so that the lens driving part 202 is adapted to simultaneously implement a lens focusing function and a lens anti-shake function; in still another embodiment of the present application, the lens driving part 202 includes only a lens anti-shake part, so that the lens anti-shake part drives the optical lens 10 to move to realize a lens anti-shake function. It should be noted that, when the lens driving portion 202 and the chip driving portion 201 both have anti-shake functions, the camera module is adapted to simultaneously implement the lens anti-shake function and the chip anti-shake function, and implement the "dual OIS" function, thereby improving the anti-shake effect of the camera module.

In the embodiment of the present application, the lens focusing part and the lens anti-shake part may be a voice coil motor, a piezoelectric motor, an SMA (shape memory alloy ) motor, or the like type of driving motor. When the lens anti-shake part is a voice coil motor, the driving element is a coil-magnet pair; when the lens anti-shake part is a piezoelectric motor, the driving element is a piezoelectric element; when the lens anti-shake part is an SMA motor, the driving element is an SMA wire.

As shown in fig. 2 to 9, a chip anti-shake portion of the driving assembly according to an embodiment of the present application is illustrated, wherein fig. 2 is a schematic view of a photosensitive assembly and a driving assembly of the camera module according to an embodiment of the present application, fig. 3 is a schematic view of a perspective explosion of the photosensitive assembly and the driving assembly according to an embodiment of the present application, fig. 4A is a schematic view of a circuit board of the photosensitive assembly according to an embodiment of the present application, fig. 4B is a schematic view of a part of the circuit board according to an embodiment of the present application, fig. 5A is a schematic view of a cross section of the driving assembly and the photosensitive assembly according to an embodiment of the present application, fig. 5B is a schematic view of a cross section of a variant embodiment of the driving assembly and the photosensitive assembly according to an embodiment of the present application, fig. 6 is a schematic view of a movable carrier and a fixed carrier of the driving assembly according to an embodiment of the present application, fig. 7 is a schematic view of a top view of the movable carrier and the fixed carrier of the driving assembly according to an embodiment of the present application, fig. 8 is a schematic view of a circuit board after removal of a substrate, and fig. 5B is a schematic view of a chip anti-shake portion of the driving assembly according to an embodiment of the present application.

As shown in fig. 2 and 3, in the embodiment of the present application, the photosensitive assembly 30 includes a circuit board 31, and a mounting member 32 and a connector mounted on the circuit board 31. The wiring board 31 includes a wiring board main body 311, a connection tape, and a connector portion (the connection tape, the connector portion, and the connector are not shown in the drawing) mounted to an end of the connector portion, the connection tape connecting the wiring board main body 311 and the connector portion and effecting electrical communication between the wiring board main body 311 and the connector portion.

As shown in fig. 4A to 5, the circuit board body 311 includes an outer circuit board 3113, an inner circuit board 3111, and an elastic member group 3112 connecting the outer circuit board 3113 and the inner circuit board 3111, the mount 32 is adapted to be mounted on an upper surface of the inner circuit board 3111, and the mount 32 includes a photosensitive chip 321 electrically connected to the inner circuit board 3111, an electronic component 322, and a base 323 mounted and fixed to the inner circuit board 3111 and a filter element 324 mounted on the base 323. In one embodiment of the present application, the inner circuit board 3111 may be provided with a groove or a through hole (circuit board through hole 31115), and the photosensitive chip 321 is mounted and fixed in the groove or the circuit board through hole 31115 of the inner circuit board 3111, so as to reduce the height of the camera module.

That is, in the embodiment of the present application, the upper surface of the inner circuit board 3111 has a photosensitive chip mounting area to which the photosensitive chip 321 is mounted and a peripheral area surrounding the photosensitive chip mounting area to which the electronic component 322 and the base 323 are mounted. Also, in the embodiment of the present application, when the upper surface portion of the inner circuit board 3111 is recessed to form a groove or a through hole, the photosensitive chip mounting area is the groove or the through hole.

As shown in fig. 4A, in the embodiment of the present application, the outer circuit board 3113 is disposed around the inner circuit board 3111, the outer circuit board 3113 is connected to the inner circuit board 3111 through the elastic member group 3112, wherein the inner circuit board 3111 is suspended inside the outer circuit board 3113 through the elastic member group 3112 to form an elastic circuit board, so that the inner circuit board 3111 can move (e.g., translate, rotate, tilt, etc. the inner circuit board 3111 relative to the outer circuit board 3113) under an external force, and when the external force is eliminated, the inner circuit board 3111 can be restored to an initial position by virtue of the elasticity of the elastic member group 3112. That is, in the embodiment of the present application, the circuit board 311 has at least the following characteristics compared to a conventional circuit board: (1) The inner circuit board 3111 and the outer circuit board 3113 of the circuit board 311 are relatively movable; (2) After the inner circuit board 3111 moves relative to the outer circuit board 3113, the elastic set 3112 can restore the inner circuit board 3111 to an original position; (3) Due to the elastic member group 3112, the functions of the wiring board 311 can be multiplexed (which will be described later).

Further, in the embodiment of the present application, the elastic member group 3112 is further adapted to electrically connect the inner circuit board 3111 and the outer circuit board 3113, so that the photosensitive chip 321 mounted on the inner circuit board 3111 can be electrically connected to the outer circuit board 3113 through the inner circuit board 3111, the elastic member group 3112. That is, in the embodiment of the present application, the elastic member group 3112 not only structurally connects the inner circuit board 3111 and the outer circuit board 3113, but also electrically connects the inner circuit board 3111 and the outer circuit board 3113.

In this embodiment, the elastic member group 3112 includes a plurality of elastic members, and preferably, the plurality of elastic members have the same shape and the same material, so that each of the plurality of elastic members provides the same elastic force to the inner circuit board 3111. In one embodiment of the present application, the elastic member group 3112 is disposed in a rotationally symmetrical manner with respect to the center set by the inner circuit board 3111, that is, the elastic member group 3112 is adapted to overlap with the original shape after rotating around its center by a certain angle, so that the inner circuit board 3111 can translate with respect to the outer circuit board 3113 and rotate in the plane of the inner circuit board 3111 by external force. In another embodiment of the present application, the elastic member group 3112 is disposed in an axisymmetric manner with respect to a center set by the inner circuit board 3111, so that the inner circuit board 3111 can be driven to translate and tilt with respect to the outer circuit board 3113 by an external force. The structure of the elastic member group 3112 may be other irregular shapes, which is not limited thereto.

In the example illustrated in fig. 4A and 4B, the outer circuit board 3113 has a rectangular structure, and has a rectangular through hole on the inner side, the inner circuit board 3111 has a rectangular structure and is located inside the rectangular through hole of the outer circuit board 3113, and four inner sides of the outer circuit board 3113 are parallel to four outer sides of the inner circuit board 3111, respectively. The elastic member group 3112 includes four elastic members, which are respectively disposed around four corners of the inner circuit board 3111 and connect one of the inner sides of the outer circuit board 3113 and one of the outer sides of the inner circuit board 3111, which are vertically disposed, that is, the inner side of the outer circuit board 3113 and the outer side of the inner circuit board 3111, which are fixedly connected by the elastic members, are mutually perpendicular.

More specifically, in the embodiment of the present application, each of the elastic members includes at least one elastic arm 31120, where the at least one elastic arm 31120 extends from the outer side surface of the inner circuit board 3111 along a direction perpendicular to the outer side surface, extends away from the inner circuit board 3111, bends and extends in a direction parallel to the outer side surface of the inner circuit board 3111, bends and extends in a direction parallel to another outer side surface adjacent to the outer side surface, and extends in a direction perpendicular to the other outer side surface, extends in a direction away from the inner circuit board 3111, and is connected to the inner side surface of the outer circuit board 3113. In other words, the at least one elastic arm 31120 is connected to the inner side surface of the outer circuit board 3113 by three 90 ° (right angle) bent extensions from the outer side surface of the inner circuit board 3111. In this application, when the number of the at least one elastic arms 31120 is plural, the gaps between the plurality of elastic arms 31120 may be equal or unequal, which is determined according to the requirement that the outer circuit board 3113 suspend the inner circuit board 3111 and the photosensitive chip 321 in electrical conduction. At least one electrical conductive trace is provided on the spring arm 31120 for providing an electrical connection between the inner circuit board 3111 and the outer circuit board 3113. At least one electrical conductive trace is provided on the spring for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113.

As shown in fig. 4B, in the embodiment of the present application, each of the elastic arms 31120 includes a first elastic arm member 31120a, a second elastic arm member 31120B, a third elastic arm member 31120c and a fourth elastic arm member 31120d, where the first elastic arm member 31120a, the second elastic arm member 31120B, the third elastic arm member 31120c and the fourth elastic arm member 31120d are connected to each other (for example, may be connected to each other by an integrally formed manner, or may be connected to each other by an adhesively-fixing manner). The first elastic arm member 31120a extends away from one side of the inner circuit board 3111 in a direction perpendicular to the outer side of the inner circuit board 3111, the second elastic arm member 31120b is disposed perpendicular to and connected to the first elastic arm member 31120a, the third elastic arm member 31120c is disposed perpendicular to and connected to the second elastic arm member 31120b, the fourth elastic arm member 31120d is disposed perpendicular to and connected to the third elastic arm member 31120c, and the fourth elastic arm member 31120d is further connected to the outer circuit board 3113 to form the elastic arm 31120, and one or more elastic arms 31120 constitute an elastic member. The outer side surface of the inner circuit board 3111 to which the elastic arms 31120 are connected is adjacent to and perpendicular to the inner side surface of the outer circuit board 3113.

In one example of the present application, the four elastic members of the elastic member group 3112 are a first elastic member 31121, a second elastic member 31122, a third elastic member 31123, and a fourth elastic member 31124, respectively. The four adjacent inner sides of the outer circuit board 3113 are a first inner side 31131, a second inner side 31132, a third inner side 31133 and a fourth inner side 31134 in a counterclockwise order, and the adjacent inner sides are perpendicular to each other; the four adjacent outer sides of the inner circuit board 3111 are a first outer side 31111, a second outer side 31112, a third outer side 31113 and a fourth outer side 31114 in a counterclockwise order, and the adjacent outer sides are perpendicular to each other. The first inner side surface 31131 is parallel to the first outer side surface 31111, the second inner side surface 31132 is parallel to the second outer side surface 31112, the third inner side surface 31133 is parallel to the third outer side surface 31113, and the fourth inner side surface 31134 is parallel to the fourth outer side surface 31114.

The first elastic member 31121 extends from a first outer side 31111 of the inner circuit board 3111 to a second inner side 31132 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the second elastic member 31122 extends from the second outer side 31112 of the inner circuit board 3111 toward the third inner side 31133 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the third outer side 31113 of the inner circuit board 3111 extends toward the fourth inner side 31134 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the fourth outer side 31114 of the inner circuit board 3111 extends toward the first inner side 31131 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113.

Further, a method of manufacturing the wiring board 31 (the first elastic member 31121, the second elastic member 31122, the third elastic member 31123, and the fourth elastic member 31124) having the elastic member group 3112 will be described. Firstly, providing a basal layer, wherein the basal layer comprises a PI layer (polyimide layer); then, forming a metal layer on one side of the PI layer of the substrate layer, wherein the metal layer can be made of titanium copper or other alloys, for example, copper materials are deposited on one side of the PI layer of the substrate layer to form an electric conduction line; then, the base layer is divided by laser cutting, mechanical cutting, etching, etc., unnecessary portions of the base layer are removed, and at least one elastic arm 31120 is formed, thereby forming elastic members (first elastic member 31121, second elastic member 31122, third elastic member 31123, and fourth elastic member 31124). The base layer has a certain elasticity, so that the elastic arms 31120 are adapted to provide elastic force for restoring the inner circuit board 3111, and in other embodiments, a metal layer may not be provided, and instead, a plurality of PI layers may be included in the base layer and enable the multi-layer circuit to be conducted. Accordingly, in embodiments of the present application, the spring may further include an insulating layer surrounding the metal layer to prevent a short circuit problem from occurring between the plurality of spring arms 31120 in the spring.

In the above embodiment, the substrate layer including the PI layer is a component in a common soft and hard combined board, and the soft and hard combined board is a circuit board formed by combining a flexible circuit board and a hard circuit board together through a pressing process and the like, and has the characteristics of the flexible circuit board and the hard circuit board. In other words, the elastic member of the circuit board 31 may be formed by a portion of the circuit board 31, for example, the circuit board 31 may be a rigid-flex board including the outer circuit board 3113, the inner circuit board 3111, and a flexible circuit board located between the outer circuit board 3113 and the inner circuit board 3111 and electrically connecting the outer circuit board 3113 and the inner circuit board 3111, the flexible circuit board of the circuit board 31 is formed by dividing at least one elastic arm 31120 by laser cutting, mechanical cutting, etching, or the like to thereby form the elastic member, and in this embodiment, four sets of the elastic members are formed by removing unnecessary portions of the flexible circuit board to form the rotationally symmetrical elastic member set 3112. Further, the flexible circuit board of the circuit board 31 may be provided with a metal layer composed of other components such as titanium copper or other alloys to enhance the elasticity (K value) of the elastic member.

Further, in the embodiment of the present application, as shown in fig. 2 to 9, the chip anti-shake unit 21 includes a chip anti-shake fixing unit 211, a chip anti-shake movable unit 212, a driving element for driving the chip anti-shake movable unit 212 to move relative to the chip anti-shake fixing unit 211, and a chip anti-shake electrical connection unit (not shown), where the driving element is respectively connected to the chip anti-shake movable unit 212 and the chip anti-shake fixing unit 211, and the chip anti-shake electrical connection unit is electrically connected to the circuit board 31 and provides a driving power for the chip anti-shake unit 21. Specifically, in the embodiment of the present application, the chip anti-shake fixing portion 211 has a receiving cavity, and the circuit board 311 is suspended and fixed in the receiving cavity, that is, the outer circuit board 3113 of the circuit board 311 is fixed in the receiving cavity and the inner circuit board 3111 of the circuit board is movable relative to the outer circuit board 3111. Further, the chip anti-shake movable portion 212 and the inner circuit board 3111 may be interlocked, for example, the chip anti-shake movable portion 212 may be mounted and fixed on the inner circuit board 3111 of the circuit board 31, so that when the driving element drives the chip anti-shake movable portion 212 to move relative to the chip anti-shake fixing portion 211, the inner circuit board 3111 of the circuit board 311 moves relative to the outer circuit board 3113, thereby driving the photosensitive chip 321 mounted on the inner circuit board 3111 to move, so as to implement the chip anti-shake function.

It should be noted that, in the present embodiment, the elastic member group 3112 of the wiring board 31 forms a suspension system of the chip shake preventing portion 21, and the chip shake preventing movable portion 212 is suspended in the chip shake preventing fixing portion 211 by the elastic member group 3112. Specifically, the chip anti-shake movable portion 212 is connected to the elastic member group 3112 through the inner circuit board 3111, and the chip anti-shake fixing portion 211 is connected to the elastic member group 3112 through the outer circuit board 3113, so that the elastic member group 3112 serves as a suspension system such that the chip anti-shake movable portion 212 is suspended in the chip anti-shake fixing portion 211.

Fig. 3 and 5A show a specific structure of the chip anti-shake unit 21, where the chip anti-shake fixing unit 211 includes a base 2111 and an upper cover 2112, the upper cover 2112 has a rectangular through hole for providing a clear aperture of the photosensitive chip 321 to obtain imaging light collected by the optical lens 10, and the base 2111 is fixedly connected with the upper cover 2112, forms a housing, and forms a housing cavity to house and protect the chip anti-shake movable unit 212, the driving element, the photosensitive assembly 30, and other camera module components. In the embodiment of the present application, the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2111 and the base 2112, in such a way that the circuit board 311 is suspended and fixed in the receiving cavity of the chip anti-shake fixing portion 211. That is, in the embodiment of the present application, the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2112 and the base 2111, so that the outer circuit board 3111 is held stationary with respect to the chip anti-shake fixing portion 211, that is, the circuit board 311 is suspended and fixed in the receiving cavity of the chip anti-shake fixing portion 211.

The anti-shake fixing portion further includes a fixing carrier 2113 and two driving element fixing portions (for convenience of description, a first driving element fixing portion 2114 and a second driving element fixing portion 2115 are defined), the fixing carrier 2113 is fixed to the base 2111 by bonding or integrally forming, the fixing carrier 2113 includes a fixing carrier main body 21131 and two fixing carrier branches (a first fixing carrier branch 21132 and a second fixing carrier branch 21133) located at opposite angles of the fixing carrier main body 21131, and the two fixing carrier branches are connected to the fixing carrier main body 21131 by bonding or integrally forming. The first driving element fixing portion 2114 is fixed to the first fixing carrier support portion 21132 by bonding or integral molding, and the second driving element fixing portion 2115 is fixed to the second fixing carrier support portion 21133 by bonding or integral molding, so that the fixing carrier 2113 is fixed to the driving element by the two driving element fixing portions.

The chip anti-shake movable portion 212 includes a movable carrier 2121 and two driving element movable portions (for convenience of description, a first driving element movable portion 2122 and a second driving element movable portion 2123 are defined), the movable carrier 2121 includes a movable carrier body 21211 for fixing to the inner circuit board 3111, and two movable carrier supports (a first movable carrier support 21212 and a second movable carrier support 21213) located diagonally to the movable carrier body 21211, and the movable carrier supports are connected to the movable carrier body 21211 by adhesion or an integral molding. The movable carrier 2121 is fixed to the bottom surface of the inner circuit board 3111 of the circuit board 31 by adhesion to the movable carrier body 21211 (the side where the circuit board is adhered to the photosensitive chip is the front surface, and the opposite side is the bottom surface), and in other embodiments, the movable carrier 2121 may be integrally formed on the bottom surface of the inner circuit board 3111 by a process such as molding, or the movable carrier 2121 may be a part of the inner circuit board 3111. The first driving element movable portion 2122 is fixed to the first movable carrier support portion 21212 by adhesion or integral molding, and the second driving element movable portion 2123 is fixed to the second movable carrier support portion 21213 by adhesion or integral molding, so that the movable carrier 2121 is fixed to the driving element by two driving element movable portions.

The two fixed carrier supports are disposed at opposite corners of the inner circuit board 3111, the two movable carrier supports are disposed at the other opposite corners of the inner circuit board 3111, and thus the two fixed carrier supports and the two movable carrier supports are disposed at four corners of the inner circuit board 3111, and thus the two driving element fixing portions and the two driving element movable portions are spaced apart from each other at four corners of the inner circuit board 3111.

The driving element of the chip anti-shake unit 21 includes four SMA (shape memory alloy) wires 213 (a first SMA wire 2131, a second SMA wire 2132, a third SMA wire 2133, and a fourth SMA wire 2134) respectively fixed between the fixed carrier support and the movable carrier support, both ends of the first SMA wire 2131 are respectively fixed to the first driving element fixing portion 2114 and the first driving element movable portion 2122, both ends of the second SMA wire 2132 are respectively fixed to the first driving element movable portion 2122 and the second driving element fixing portion 2115, both ends of the third SMA wire 2133 are respectively fixed to the second driving element fixing portion 2115 and the second driving element movable portion 2123, and both ends of the fourth SMA wire 2134 are respectively fixed to the second driving element movable portion 2123 and the first driving element fixing portion 2114. The first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are disposed adjacent and counterclockwise.

Specifically, each of the driving element fixing parts further includes two driving element fixing ends, the first driving element fixing part 2114 includes a first driving element fixing end 2114a and a second driving element fixing end 2114b, and the second driving element fixing part 2115 includes a third driving element fixing end 2115c and a fourth driving element fixing end 2115d; each of the driving element movable portions further includes two driving element movable ends, the first driving element movable portion 2122 includes a first driving element movable end 2122a and a second driving element movable end 2122b, and the second driving element movable portion 2123 includes a third driving element movable end 2123c and a fourth driving element movable end 2123d. The two ends of the first SMA wire 2131 are respectively fixed to the second driving element fixed end 2114b and the first driving element movable end 2122a, the two ends of the second SMA wire 2132 are respectively fixed to the second driving element movable end 2122b and the third driving element fixed end 2115c, the two ends of the third SMA wire 2133 are respectively fixed to the fourth driving element fixed end 2115d and the third driving element movable end 2123c, and the two ends of the fourth SMA wire 2134 are respectively fixed to the fourth driving element movable end 2123d and the first driving element fixed end 2114a.

Wherein the first driving element fixing end 2114a and the second driving element fixing end 2114b of the first driving element fixing portion 2114 may be electrically connected or not electrically connected; the third driving element fixing end 2115c and the fourth driving element fixing end 2115d of the second driving element fixing portion 2115 may be electrically connected or not electrically connected; the first driving element movable end 2122a and the second driving element movable end 2122b of the first driving element movable portion 2122 may be electrically connected or not electrically connected; the third driving element movable end 2123c of the second driving element movable portion 2123 and the fourth driving element movable end 2123d may be electrically connected or not electrically connected, and the present application is not limited thereto.

In one embodiment of the present application, gaps exist between the four SMA wires 213 and the elastic member group 3112, so as to avoid interference between the four SMA wires 213 and the elastic member group 3112, and the gaps between the four SMA wires 213 and the elastic member group 3112 in the Z-axis direction are greater than 0.1mm.

In one embodiment of the present application, the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are located on the same plane, and the plane is parallel to the plane of the inner circuit board 3111, so that the driving element is adapted to drive the inner circuit board 3111 to move in the plane of the inner circuit board 3111 by driving the four SMA wires 213 to deform.

It should be noted that, although in the embodiment of the present application, the chip anti-shake fixing portion 211 includes two driving

element fixing portions

2114, 2115, the chip anti-shake movable portion 212 includes two driving element

movable portions

2122,2123, the two driving

element fixing portions

2114, 2115 and the two driving element

movable portions

2122,2123 are located at four corners of the receiving cavity of the chip anti-shake fixing portion 211, and include four

SMA wires

2131, 2132, 2133,2134 extending between the two driving element fixing portions and the two driving element movable portions, it should be understood that in the embodiment of the present application, the chip anti-shake fixing portion 211 includes at least one driving element fixing portion, and the chip anti-shake movable portion 212 includes at least one driving element movable portion, and includes at least one SMA wire 213 extending between the at least one driving element fixing portion and the at least one driving element movable portion.

For example, in one specific example of the present application, the at least one driving element movable portion includes a first driving element movable portion 2122 and a second driving element movable portion 2123 that are oppositely disposed at opposite sides of the movable carrier 2121, and the at least one driving element fixed portion includes only one driving element fixed portion, wherein the driving element fixed portion is located on a middle vertical line of a connection set by the first driving element movable portion 2122 and the second driving element movable portion 2123, and the at least one SMA wire 213 includes a first SMA wire 2131 extending between the first driving element movable portion 2122 and the driving element fixed portion and a second SMA wire 2132 extending between the second driving element movable portion 2123 and the driving element fixed portion.

Of course, in the present embodiment, in the case where the number of the driving element movable portions and the driving element fixed portions is determined (for example, when including the first driving element movable portion 2122, the second driving element movable portion 2123, the first driving element fixed portion 2114, and the second driving element fixed portion 2115 as illustrated in fig. 7 and 8), a greater or lesser number of the SMA wires 213 are provided, for example, two of the first SMA wires 2131 may be provided between the first driving element fixed portion 2114 and the first driving element movable portion 2122, or two of the SMA wires 2132 may be provided between the first driving element movable portion 2122 and the second driving element fixed portion 2115, or two of the third SMA wires 2133 may be provided between the second driving element fixed portion 2115 and the second driving element movable portion 2123, or two of the fourth SMA wires 2134 may be provided between the second driving element movable portion 3 and the first driving element fixed portion 2124, which is not limited thereto.

Further, in the embodiment of the present application, by inclining the first movable carrier support 21212 and the second movable carrier support 21213 toward the fixed carrier 2113 with respect to the movable carrier body 21211 (that is, the movable carrier 2121 includes a movable carrier body 21211 and a first movable carrier support 21212 and a second movable carrier support 21213 which face downward and outward from the movable carrier body 21211, respectively), the movable ends of the driving elements fixed to the first movable carrier support 21212 and the second movable carrier support 21213 are made to be at the same height as the fixed ends of the driving elements fixed to the first fixed carrier support 21132 and the second fixed carrier support 21133.

For example, in a specific example of the present application, the movable carrier 2121 is implemented as a metal sheet, the first movable carrier support 21212 and the second movable carrier support 21213 are integrally formed with the movable carrier body 21211, and the first movable carrier support 21212 and the second movable carrier support 21213 are bent such that the first movable carrier support 21212 and the second movable carrier support 21213 extend obliquely to the movable carrier body 21211, thereby adjusting the height of the movable end of the driving element.

In particular, in one embodiment of the present application, four of the SMA wires 213 (the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133, and the fourth SMA wire 2134) are positioned on a bottom side of the inner circuit board 3111, and four of the SMA wires 213 are positioned below the bottom side of the inner circuit board 3111. Specifically, as shown in fig. 7 and 8, four SMA wires 213 are located outside the inner circuit board 3111, and the first SMA wire 2131 is perpendicular to the second SMA wire 2132 and the fourth SMA wire 2134 and parallel to the third SMA wire 2133. In another embodiment of the present application, the lengths of the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are equal, thereby being adapted to drive the translation of the inner circuit board 3111 in the plane of the inner circuit board 3111 by driving the deformation of the four SMA wires 213.

Fig. 8 illustrates a bottom view of the chip anti-shake portion 21 after the base 2111 and the upper cover 2112 are removed. As shown in fig. 8, the fixed carrier 2113, the movable carrier 2121, and the four SMA wires 213 are mounted on the bottom surface side of the circuit board 31, and the four SMA wires 213 are located outside the elastic member group 3112, so as to reduce the risk of interference between the SMA wires 213 and the elastic member group 3112.

The inner circuit board 3111 is fixed to the movable carrier 2121 in such a manner that the inner circuit board 3111 is fixed to the chip shake preventing movable portion 212, the outer circuit board 3113 is fixed to the chip shake preventing fixed portion 211 by being sandwiched between the base 2111 and the upper cover 2112, and a gap is provided between the elastic member group 3112 and the upper cover 2112 of the circuit board 31, so that deformation of the elastic member group 3112 due to impact affecting performance of the elastic member group 3112 is prevented. In some examples of the present application, the chip anti-shake fixing portion 211 further includes a support member 2116, where the support member 2116 is fixed to the base 2111 by bonding or integrally forming, and a top surface of the support member 2116 has a plane to provide the support of the outer circuit board 3113, so as to increase stability of the outer circuit board 3113 fixed between the base 2111 and the upper cover 2112.

In order to make the movement of the movable carrier 2121 smoother, in the embodiment of the present application, the chip anti-shake unit 21 further includes a ball assembly 214 disposed between the chip anti-shake fixing portion 211 and the chip anti-shake movable portion 212. The ball assembly 214 includes at least three balls 2141, and the at least three balls 2141 are configured to reduce friction resistance when the chip anti-shake movable portion 212 moves relative to the chip anti-shake fixing portion 211. Specifically, the at least three balls 2141 are adapted to be disposed between the movable carrier 2121 and the base 2111, and the at least three balls 2141 are configured to provide support for the movable carrier 2121 and reduce frictional resistance experienced by the movable carrier 2121 when translating relative to the base 2111. That is, in the present embodiment, the ball assembly 214 and the at least one SMA wire 213 are positioned between the base 2111 and the movable carrier 2121.

As shown in fig. 5A to 9, in the embodiment of the present application, four balls 2141 are disposed between the movable carrier 2121 and the base 2111, and the movable carrier 2121 is driven by the driving element, and the movable carrier 2121 translates relative to the base 2111 by the four balls 2141. The fixing carrier body 21131 of the fixing carrier 2113 has four ball grooves 211311, the four balls 2141 are respectively accommodated in the four ball grooves 211311, the balls 2141 protrude from the fixing carrier body 21131, and thus the movement space of the four balls 2141 is limited in the four ball grooves 211311, and the balls 2141 are not easily dropped.

In the above embodiment, the ball groove 211311 is a through groove or hole, so that the balls 2141 are adapted to directly contact the base 2111. In other embodiments, the ball groove 211311 is a groove and the balls 2141 indirectly contact the base 2111 through the bottom of the ball groove 211311.

It should be noted that, in the embodiment of the present application, the inner circuit board 3111 and the outer circuit board 3113 are not on the same plane, that is, the plane of the inner circuit board 3111 and the plane of the outer circuit board 3113 have a height difference, so that the elastic member group 3112 is in a stretched state, and the elastic member group 3112 in a stretched state provides a tightening force for the ball assembly 214 to abut against the chip anti-shake fixing portion 211. That is, the elastic member group 3112 of the circuit board 311 makes the at least three balls 2141 clamped between the movable carrier 2121 of the chip anti-shake movable portion 212 and the chip anti-shake fixing portion 211, so that the at least three balls 2141 are acted upon by forces in two directions, and when the movable carrier 2121 is stationary relative to the chip anti-shake fixing portion 211, the at least three balls 2141 are relatively stationary, in other words, the at least three balls 2141 are unlikely to generate noise due to impact of the balls 2141 caused by shake of the camera module.

More specifically, in one embodiment of the present application, the plane of the inner circuit board 3111 and the plane of the outer circuit board 3113 have a height difference, and the force generated by the elastic set 3112 along the Z-axis (perpendicular to the direction of the inner circuit board 3111) makes the inner circuit board 3111 press the at least three balls 2141 in the ball assembly 214 through the movable carrier 2121, and the at least three balls 2141 are pressed by the movable carrier 2121 with a size of 20mN-50mN (milli-newton). When the pressure is greater than 20mN, the at least three balls 2141 are not easily detached; when the pressure is less than 50mN, the friction force between the at least three balls 2141 and the movable carrier 2121 is small, the friction force between the at least three balls 2141 and the base 2111 is small, and when the movable carrier 2121 moves relative to the base 2111, the friction resistance received by the movable carrier 2121 is small, and the requirement for the driving force of the driving element (SMA wire) is reduced.

The magnitude of the force generated by the elastic member group 3112 in the Z-axis direction is affected by the height difference between the inner circuit board 3111 and the outer circuit board 3113, and the height difference between the inner circuit board 3111 and the outer circuit board 3113 is between 0.05mm and 0.1 mm. When the height difference is smaller than 0.05mm, the elastic force along the Z-axis direction generated by the elastic member group 3112 is insufficient to prevent the at least three balls 2141 from falling off; when the height difference is greater than 0.1mm, the elasticity of the elastic member group 3112 in a plane (XY plane) perpendicular to the Z axis direction may be affected.

With further reference to fig. 5A, the inner circuit board 3111 is higher than the outer circuit board 3113, and the elastic member group 3112 connects the inner circuit board 3111 and the outer circuit board 3113 obliquely upward, so that the inner circuit board 3111 generates downward (i.e., toward the balls 2141) force by the elastic member group 3112. The distance between the inner circuit board 3111 and the base 2111 is greater than the distance between the outer circuit board 3113 and the base 2111, and the inner circuit board 3111 presses down the four balls 2141 on the base 2111 by the movable carrier 2121 fixed to the bottom surface of the inner circuit board 3111, preventing the balls 2141 from falling off. The four balls 2141 support the movable carrier 2121, and the movable carrier 2121 slides on the four balls 2141.

In some embodiments of the present application, the four balls 2141 have the same dimensions, such that the four balls 2141 provide a plane of the movable carrier 2121 parallel to the plane of the base 2111, allowing the movable carrier 2121 to move (translate and/or rotate) in a plane parallel to the base 2111, and the inner circuit board 3111, which is fixed to the movable carrier 2121, to follow the movable carrier 2121 in a plane parallel to the base 2111. The flatness of the base 2111 and the dimensional accuracy of the balls 2141 can greatly affect the movement accuracy of the movable carrier 2121.

In one embodiment of the present application, the at least three balls 2141 are fixed to the base 2111 and/or the fixed carrier 2113, preventing the at least three balls 2141 (ball assembly 214) from falling out. The top surfaces of the at least three balls 2141 form a plane parallel to the inner circuit board 3111, thereby translating the inner circuit board 3111 in the plane of the inner circuit board. For example, the at least three balls 2141 are fixed to the base 2111 in the ball groove 211311 by bonding, and the balls 2141 are made of plastic, metal or other materials; alternatively, the at least three balls 2141 are fixed to the fixing carrier body 21131 of the fixing carrier 2113 by means of adhesion, and the material of the balls 2141 is suitably plastic, metal or other materials; alternatively, the at least three balls 2141 are fixed to the base 2111 by welding in the ball groove 211311, the balls 2141 are preferably made of metal, and the base 2111 is also made of metal; alternatively, the at least three balls 2141 are fixed to the fixing carrier body 21131 of the fixing carrier 2113 by welding, and the material of the balls 2141 is suitably a metal material, and the material of the fixing carrier 2113 is also a metal material.

In one embodiment of the present application, the at least three balls 2141 are fixed to the movable carrier 2121 to avoid the at least three balls 2141 (ball assembly 214) from falling out. The bottom surfaces of the at least three balls 2141 form a plane parallel to the inner circuit board 3111, thereby translating the inner circuit board 3111 in the plane of the inner circuit board. For example, the at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by means of adhesion, and the material of the balls 2141 is suitably plastic, metal or other material; alternatively, the at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by welding, and the material of the balls 2141 is suitably a metal material, and the material of the movable carrier 2121 is also a metal material.

In one embodiment of the present application, the ball assembly 214 may also be replaced with a slider assembly that includes at least three sliders. The at least three sliding blocks are integrally formed with the substrate, the at least three sliding blocks protrude out of the ball grooves, and the top surfaces of the at least three sliding blocks form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 translates in the plane of the inner circuit board; alternatively, the at least three sliders are integrally formed with the fixing carrier body 21131 of the fixing carrier 2113, and the top surfaces of the at least three sliders form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 translates in the plane of the inner circuit board; alternatively, the at least three sliders are integrally formed with the movable carrier body 21211 of the movable carrier 2121, and the bottom surfaces of the at least three sliders form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 translates in the plane of the inner circuit board.

Fig. 5B shows another embodiment of the present application, which is different from the embodiment shown in fig. 5A in that a through hole (a through hole 31115 of the circuit board) is formed in the middle of the inner circuit board 3111, and the photosensitive chip 321 is accommodated in the through hole and is directly adhered to the movable carrier 2121, so that the height of the module is reduced. When the movable carrier 2121 moves, the photosensitive chip 321 fixed to the movable carrier 2121 moves with the movable carrier 2121.

Referring to fig. 5A and 5B, in one embodiment of the present application, the ball assembly 214 is located below the inner circuit board 3111 but not directly below the photosensitive chip 321, so that when the ball assembly 214 is pressed, the ball assembly 214 causes deformation of the movable carrier 2121, and directly or indirectly deforms the photosensitive chip 321 through deformation of the inner circuit board 3111, so that the imaging quality of the imaging module is reduced, for example, the imaging has field curvature problem. Specifically, along a direction perpendicular to the photosensitive chip 321, the projection of the photosensitive chip 321 on the substrate 2111 does not overlap with the projection of the four balls 2141 of the ball assembly 214 on the substrate 2111. That is, in the embodiment of the present application, the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting area, wherein the four balls 2141 correspond to the peripheral area, and the four balls 2141 are disposed by such a position that they are not located directly under the photosensitive chip 321.

In one embodiment of the present application, the four ball grooves 211311 are respectively located on the diagonal lines of the photosensitive chip 321 and are respectively located outside four corners of the photosensitive chip 321.

It is worth mentioning that in the example illustrated in fig. 1 to 9, the ball assembly 214 and the at least one SMA wire 213 are located between the base 2111 and the movable carrier 2121. It should be appreciated that in other examples of the present application, the ball assembly 214 and the at least one SMA wire 213 may also be disposed between the movable carrier 2121 and the chip anti-shake fixing portion 211 in other manners, for example, the ball assembly 214 and the at least one SMA wire 213 may be disposed between the upper cover 2112 and the movable carrier 2121, or the ball assembly 214 may be disposed between the base 2111 and the movable carrier 2121 and the at least one SMA wire may be disposed between the upper cover 2112 and the movable carrier 2121, or the ball assembly 214 may be disposed between the upper cover 2112 and the movable carrier 2121 and the at least one SMA wire may be disposed between the base 2111 and the movable carrier 2121.

Further, in some examples of the present application, the chip anti-shake movable portion 212 further includes a bump guard 2124, and the bump guard 2124 has a frame structure. The bump guard 2124 is fixed to the inner circuit board 3111 and corresponds to the upper cover 2112 of the chip anti-shake fixing portion 211, and a projection of the bump guard 2124 in the Z-axis direction overlaps a projection of the upper cover 2112 in the Z-axis direction. When the chip anti-shake part 21 is impacted and the chip anti-shake movable part 212 moves along the Z-axis direction, the movement distance of the chip anti-shake movable part 212 in the Z-axis direction is limited, so that the chip anti-shake movable part 212 is not easy to fall off, and the ball assembly 214 is not easy to fall off from the ball groove 211311.

In one embodiment of the present application, the chip anti-shake fixing portion 211 of the chip anti-shake portion 21 and the lens driving fixing portion of the lens driving portion 202 are integrally formed, that is, the chip anti-shake fixing portion 211 and the lens driving portion 202 may share the same structural member, so as to reduce a tolerance in the assembly process of the driving assembly 20. In a specific example of the present application, the upper cover 2112 of the chip anti-shake fixing portion 211 is integrally formed with the lens driving fixing portion.

In summary, the camera module according to the embodiment of the present application is illustrated, wherein the driving assembly 20 of the camera module 1 uses the elastic member group 3112 of the circuit board 311 as a reset and limit element of the SMA driver, and reduces the overall height dimension of the chip anti-shake portion 21 in a manner of element multiplexing, so as to meet the anti-shake requirement and the dimension requirement of the camera module.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A drive assembly, comprising:

2. The drive assembly of claim 1, wherein the anti-shake fixing portion includes a base and an upper cover that is snapped with the base, the receiving cavity being formed between the upper cover and the base.

3. The drive assembly of claim 2, wherein the ball assembly and the at least one SMA wire are located between the upper cover and the movable carrier.

4. The drive assembly of claim 2, wherein the ball assembly and the at least one SMA wire are located between the base and the movable carrier.

5. The drive assembly of claim 4, wherein the inner circuit board is higher than the outer circuit board.

6. The drive assembly of claim 5, wherein a height difference between the inner circuit board and the outer circuit board is between 0.05mm and 0.1 mm.

7. The drive assembly of claim 6, wherein the magnitude of the urging force is between 20mN and 50 mN.

8. The drive assembly of claim 7, wherein the ball assembly comprises at least three balls rollably clamped between the base and the movable carrier, the top ends of the at least three balls forming a plane parallel to the inner circuit board.

9. The drive assembly of claim 8, wherein the top surface of the inner circuit board has a photosensitive die attach region and a peripheral region formed at a periphery of the photosensitive die attach region, wherein the at least three balls correspond to the peripheral region.

10. The drive assembly of claim 8, wherein the at least three balls are fixed to the movable carrier or the at least three balls are fixed to the base.

11. The drive assembly of claim 8, wherein the at least one drive element movable portion comprises oppositely disposed first and second drive element movable portions, the at least one drive element fixed portion comprises oppositely disposed first and second drive element fixed portions, the first, second, first and second drive element movable portions being located at four corners of the receiving cavity; the at least one SMA wire comprises a first SMA wire extending in the first driving element fixing portion and the first driving element movable portion, a second SMA wire extending in the first driving element movable portion and the second driving element fixing portion, a third SMA wire extending in the second driving element fixing portion and the second driving element movable portion, and a fourth SMA wire extending in the second driving element movable portion and the first driving element fixing portion.

12. The drive assembly of claim 11, wherein the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are in a same plane, and a plane in which the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are parallel to a plane in which the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, wherein the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire have a same length.

13. A drive assembly according to claim 12, wherein there is a gap between the first, second, third and fourth SMA wires and the set of elastic members in the Z-axis direction set by the drive assembly, the gap being equal to or greater than 0.1mm.

14. The drive assembly of claim 12, wherein the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located outside of the inner circuit board.

15. The drive assembly of claim 11, wherein the chip anti-shake mount further comprises a mount carrier stacked on the base, the mount carrier comprising a mount carrier body and first and second mount carrier legs extending outwardly from the mount carrier, respectively, wherein the first and second drive element mounts are mounted to the first and second mount carrier legs, respectively, wherein the movable carrier comprises a movable carrier body and first and second movable carrier legs extending downwardly and outwardly from the movable carrier body, respectively, wherein the first and second drive element movable portions are mounted to the first and second movable carrier legs, respectively.

16. The drive assembly of claim 15, wherein the stationary carrier body has at least three ball grooves for receiving the at least three balls.

17. The drive assembly of claim 15, wherein the chip anti-shake fixing portion further comprises a support member disposed on the base, and a top surface of the support member abuts against the outer circuit board.

18. The drive assembly of claim 8, wherein the elastic member set of the circuit board and the upper cover have a gap therebetween, and the chip anti-shake movable portion further comprises an anti-collision assembly fixed to a top surface of the inner circuit board.

19. The drive assembly according to claim 1, wherein the elastic member group includes a first elastic member, a second elastic member, a third elastic member, and a fourth elastic member, the first elastic member, the second elastic member, the third elastic member, and the fourth elastic member being arranged in a rotationally symmetrical manner with respect to a center set by the inner circuit board, wherein the first elastic member, the second elastic member, the third elastic member, and the fourth elastic member are respectively distributed around four corners of the inner circuit board, and the first elastic member, the second elastic member, the third elastic member, and the fourth elastic member are respectively connected to one of inner sides of the outer circuit board and one of outer sides of the inner circuit board in a vertical distribution.

20. A camera module, comprising:

an optical lens;

a photosensitive chip; and

the drive assembly of any one of claims 1 to 19, wherein the photosensitive chip is mounted to the inner circuit board.