CN116015228A - Radio frequency compensation circuit and radio frequency amplification system - Google Patents
Radio frequency compensation circuit and radio frequency amplification system Download PDFInfo
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- CN116015228A CN116015228A CN202211715545.1A CN202211715545A CN116015228A CN 116015228 A CN116015228 A CN 116015228A CN 202211715545 A CN202211715545 A CN 202211715545A CN 116015228 A CN116015228 A CN 116015228A
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Abstract
The embodiment of the invention discloses a radio frequency compensation circuit and a radio frequency amplification system, wherein the radio frequency compensation circuit is connected with a radio frequency amplifier comprising an input pad unit and an output pad unit; the radio frequency compensation circuit comprises an input compensation circuit connected with the input pad unit and an output compensation circuit connected with the output pad unit; the input compensation circuit comprises an input feeder line and at least one first inductance unit, a first capacitance unit and a first folding inductance unit which are connected in series, and the output compensation circuit comprises an output feeder line and at least one second folding inductance unit, a second capacitance unit and a second inductance unit which are connected in series; the first folding inductance unit and the second folding inductance unit comprise microstrip line structures of at least one bending area. The compensation circuit with low-pass characteristics is constructed by equivalent of actual wiring of the amplifier package as a simple electrical device, so that the matching gain, the input/output standing wave and the gain flatness performance in the passband of the radio-frequency amplifier chip are improved in the ultra-wideband frequency band range.
Description
Technical Field
The present invention relates to the field of radio frequency and microwave circuits, and in particular, to a radio frequency compensation circuit and a radio frequency amplifying system.
Background
Amplifiers are an important component of radio frequency transceiver circuitry and are widely used in communication systems. The performance of the amplifier significantly affects the receiving sensitivity, the transmitting power and other indexes of the radio frequency system. In the design process of the radio frequency receiving and transmitting system, the performance index of the selected amplifier chip is designed by a chip manufacturer and calibrated under certain test conditions, so that how to further play the performance of the amplifier chip in the layout and wiring of a radio frequency circuit printed board (PCB) is a problem to be solved in the layout of the radio frequency printed board.
At present, SOT-89 packaging is a common packaging form of a radio frequency amplifier, a certain impedance mismatch phenomenon is generated when a radio frequency microstrip line is interconnected with an input/output pad of the amplifier in the process of layout and wiring of a radio frequency circuit PCB, the impedance mismatch phenomenon can introduce larger reflection/return loss along with gradual increase of frequency, and the input/output standing wave of the amplifier is rapidly deteriorated along with the impedance mismatch phenomenon, so that an amplifier chip plays a good state of test performance in an actual radio frequency system circuit.
In the prior art, the bandwidth of the compensation circuit is limited, and power cannot be furthest transmitted from the input end to the output end of the amplifier within the working bandwidth of the amplifier, so that the best performance of the radio frequency amplifier chip is affected.
Disclosure of Invention
The embodiment of the invention provides a radio frequency compensation circuit and a radio frequency amplification system, wherein the actual wiring of an amplifier package is equivalent to a simple electrical device to construct the low-pass characteristic compensation circuit, so that the matching gain, the input/output standing wave and the gain flatness performance in a passband of a radio frequency amplifier chip are improved in an ultra-wideband frequency band range, and the transmission power in the radio frequency circuit is improved.
According to an aspect of the present invention, there is provided a radio frequency compensation circuit connected to a radio frequency amplifier, the radio frequency amplifier including an input pad unit and an output pad unit;
the radio frequency compensation circuit comprises an input compensation circuit and an output compensation circuit, wherein the input compensation circuit is connected with the input pad unit, and the output compensation circuit is connected with the output pad unit;
the input compensation circuit comprises an input feeder line, at least one first inductance unit, at least one first capacitance unit and at least one first folding inductance unit which are connected in series, and the output compensation circuit comprises at least one second folding inductance unit, at least one second capacitance unit, at least one second inductance unit and an output feeder line which are connected in series;
the first folding inductance unit and the second folding inductance unit comprise microstrip line structures of at least one bending area.
Optionally, the inductance unit and the capacitance unit in the input compensation circuit are alternately connected in series between the input feeder and the input pad unit;
the inductance unit and the capacitance unit in the output compensation circuit are alternately connected in series between the output pad unit and the output feeder line.
Optionally, the radio frequency compensation circuit includes a microstrip line wiring layer, a dielectric substrate, and a microstrip line bottom layer, wherein the microstrip line wiring layer is located at one side of the dielectric substrate, and the microstrip line bottom layer is located at the other side of the dielectric substrate away from the microstrip line wiring layer;
the input compensation circuit, the input pad unit, the output compensation circuit and the output pad unit are all positioned on the microstrip line wiring layer, and the dielectric substrate is used for providing preset characteristic impedance for the microstrip line wiring layer and the bottom layer of the microstrip line is grounded.
Optionally, the input feeder, the first inductance unit, the first capacitance unit, the first folded inductance unit, the second capacitance unit, the second inductance unit and the output feeder are microstrip line structures.
Optionally, the input feeder and the output feeder are formed by a first microstrip line with a characteristic impedance equal to 50Ω;
the first capacitor unit and the second capacitor unit are formed by a second microstrip line with characteristic impedance smaller than 50Ω;
the first inductance unit, the second inductance unit, the first folding inductance unit and the second folding inductance unit are composed of a third microstrip line with characteristic impedance larger than 50Ω.
Optionally, the widths of the third microstrip line, the first microstrip line and the second microstrip line decrease sequentially.
Optionally, the bending region includes a right angle bend, and the first folded inductance unit and the second folded inductance unit include at least one microstrip line structure in a shape of a Chinese character 'ji'.
Optionally, the input compensation circuit and the output compensation circuit are symmetrically arranged about the radio frequency amplifier.
Optionally, the radio frequency compensation circuit is formed based on an SOT-89 package structure.
According to another aspect of the present invention, there is provided a radio frequency amplifying system comprising a radio frequency amplifier and any one of the above radio frequency compensation circuits.
The radio frequency compensation circuit provided by the embodiment of the invention is connected with a radio frequency amplifier, and the radio frequency amplifier comprises an input pad unit and an output pad unit; the radio frequency compensation circuit comprises an input compensation circuit and an output compensation circuit, wherein the input compensation circuit is connected with the input pad unit, and the output compensation circuit is connected with the output pad unit; the input compensation circuit comprises an input feeder line, at least one first inductance unit, at least one first capacitance unit and at least one first folding inductance unit which are connected in series, and the output compensation circuit comprises at least one second folding inductance unit, at least one second capacitance unit, at least one second inductance unit and an output feeder line which are connected in series; the first folding inductance unit and the second folding inductance unit comprise microstrip line structures of at least one bending area. The packaged actual wiring is equivalent to a simple electrical device, a compensation circuit with low-pass characteristic is constructed, the purposes of high gain, good flatness and high standing wave ratio of the original amplifier chip are achieved in an ultra-wide frequency range, and an ultra-wide band compensation circuit of the amplifier can be achieved by adopting a low-pass filter with lower order, and insertion loss introduced by wiring of a printed board is reduced by properly arranging the inductor.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another RF compensation circuit according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a structural layout of a radio frequency compensation circuit according to an embodiment of the present invention;
fig. 6 is a transmission performance comparison chart of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 7 is a graph showing standing wave performance of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 8 is a diagram showing a comparison of transmission performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention;
FIG. 9 is a graph showing the comparison of the input standing wave performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention;
fig. 10 is a comparison chart of the output standing wave performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic diagram of a radio frequency compensation circuit according to an embodiment of the present invention, and referring to fig. 1, a radio frequency compensation circuit 10 according to an embodiment of the present invention is connected to a radio frequency amplifier 20, where the radio frequency amplifier 20 includes an input pad unit 21 and an output pad unit 22;
the radio frequency compensation circuit 10 includes an input compensation circuit 11 and an output compensation circuit 12, the input compensation circuit 11 is connected with an input pad unit 21, and the output compensation circuit 12 is connected with an output pad unit 22;
the input compensation circuit 11 comprises an input feed line 111, at least one first inductance unit 112, at least one first capacitance unit 113 and at least one first folded inductance unit 114 connected in series, and the output compensation circuit 12 comprises at least one second folded inductance unit 124, at least one second capacitance unit 123, at least one second inductance unit 122 and an output feed line 121 connected in series;
the first folded inductance unit 114 and the second folded inductance unit 124 include microstrip line structures of at least one bending region.
In the input compensation circuit 11, at least one first inductance unit 112, at least one first capacitance unit 113 and at least one first folding inductance unit 114 are connected in series and connected with the input pad unit 21 of the radio frequency amplifier 20; the input pad unit 21 of the radio frequency amplifier 20 is connected to the output compensation circuit 12, and in the output compensation circuit 12, at least one second folded inductance unit 124, at least one second capacitance unit 123, and at least one second inductance unit 122 are connected in series and connected to the output feeder 121. The values of the first inductance unit 112, the first capacitance unit 113, the first folded inductance unit 114, the second inductance unit 122, the second capacitance unit 123, and the second folded inductance unit 124 may be fixed or variable; the number and types of the microstrip line structures and the bending number and angles of the bending areas of the first folded inductance unit 114 and the second folded inductance unit 124 are determined by specific circuits, and the first folded inductance unit 114 and the second folded inductance unit 124 are completely symmetrical structures (including position symmetry), and in other embodiments, may be three-sided enclosed rectangular opening structures (not shown in fig. 1).
In the prior art, for a broadband compensation circuit, it is common practice to introduce a passive network between the microstrip line and the amplifier pad for compensating the capacitive effect generated by the amplifier pad, so as to realize maximum power transmission. Among them, passive networks generally include pi-type networks, L-type networks, and T-type networks. The passive compensation network may be composed of lumped parameter circuits or microstrip stub circuits: the lumped parameter compensation circuit consists of passive devices such as a resistor, a capacitor, an inductor and the like, the circuit implementation size is smaller, but due to the influence of the self-distributed parameter effect of the lumped parameter device, the lumped parameter compensation circuit is generally only suitable for the radio frequency circuit compensation of a low frequency band such as an L wave band or below, the accurate inductance capacitance value required by matching is difficult to obtain, and the practical circuit implementation is difficult; the microstrip stub compensation circuit is suitable for the microwave circuit compensation of a high frequency band, the circuit is simple to realize, wherein the common matching circuit of a single branch and a double branch is only used for matching a single frequency point or a narrow-band circuit, if broadband matching is required to be realized, a plurality of matching branches are necessarily added, and the circuit realization area is large; the matching network has the problems of narrow matching bandwidth coverage and large occupied area, impedance matching in ultra-wideband is difficult to realize, if the bandwidth needs to be increased, more branches need to be increased, larger circuit area is occupied, and meanwhile, under the condition of increasing frequency, the traditional microstrip stub compensation circuit can introduce overlong PCB wiring, so that larger link loss is caused.
It will be appreciated that, as shown in fig. 1, the signal enters the input feeder 111 in the input compensation circuit 11, sequentially passes through the first inductance unit 112, the first capacitance unit 113 and the first folding inductance unit 114 to reach the input pad unit 21 of the radio frequency amplifier 20, then enters the output compensation circuit 12 from the output pad unit 22 of the radio frequency amplifier 20, sequentially flows through the second folding inductance unit 124, the second capacitance unit 123 and the second inductance unit 122, and finally flows out of the compensation circuit 10 from the output feeder 121.
It should be noted that, in the above process, the series circuit of the first inductance unit 112, the first capacitance unit 113, the first folded inductance unit 114 and the input pad unit 21 may be regarded as a fourth-order step impedance low-pass filter, so as to jointly complete the input low-pass broadband compensation of the packaged amplifier, and improve the impedance mismatch effect on the radio frequency path caused by the PCB layout wiring, thereby better realizing the transmission performance and the input standing wave performance of the amplifier chip; the series circuit of the second folded inductance unit 124, the second capacitance unit 123, the second inductance unit 122 and the output pad unit 22 can be regarded as a fourth-order step impedance low-pass filter, and the output low-pass broadband compensation of the packaged amplifier is completed, so that the impedance mismatch effect on the radio frequency path caused by the PCB layout is improved, and the transmission and output standing wave performance of the amplifier chip is better realized.
The radio frequency compensation circuit provided by the embodiment of the invention is connected with a radio frequency amplifier, and the radio frequency amplifier comprises an input pad unit and an output pad unit; the radio frequency compensation circuit comprises an input compensation circuit and an output compensation circuit, wherein the input compensation circuit is connected with the input pad unit, and the output compensation circuit is connected with the output pad unit; the input compensation circuit comprises an input feeder line, at least one first inductance unit, at least one first capacitance unit and at least one first folding inductance unit which are connected in series, and the output compensation circuit comprises at least one second folding inductance unit, at least one second capacitance unit, at least one second inductance unit and an output feeder line which are connected in series; the first folding inductance unit and the second folding inductance unit comprise microstrip line structures of at least one bending area. The number, type and connection order of the above devices are determined by the specific circuit. The series circuit of the first inductance unit, the first capacitance unit, the first folding inductance unit and the input pad unit can be regarded as a four-order step impedance low-pass filter, and the series circuit of the second folding inductance unit, the second capacitance unit, the second inductance unit and the output pad unit can be regarded as a four-order step impedance low-pass filter, so that the input low-pass broadband compensation and the output low-pass broadband compensation of the packaged amplifier are respectively completed, the impedance mismatch effect on a radio frequency path caused by PCB layout wiring is improved, the ultra-wideband compensation circuit of the amplifier is realized, and the transmission performance of an amplifier chip and the standing wave performance of input and output are better realized.
Fig. 2 is a schematic diagram of another radio frequency compensation circuit according to an embodiment of the present invention, referring to fig. 2, optionally, an inductance unit and a capacitance unit in the input compensation circuit 11 are alternately connected between the input feeder 111 and the input pad unit 21 in series;
the inductance unit and the capacitance unit in the output compensation circuit 12 are alternately connected in series between the output pad unit 22 and the output feeder 121.
Referring to fig. 1 and 2 in combination, in the input compensation circuit 11, the inductance unit includes a first inductance unit 112 (the number and the type are not limited, such as 1121 and 1122) and a first folding inductance unit 114 (the number and the type are not limited, such as 1141 and 1142), the capacitance unit includes a first capacitance unit 113 (the number and the type are not limited, such as 1131, 1132 and 1133), and at least one first inductance unit 112 and at least one first folding inductance unit 114 are sequentially connected in series with the first capacitance unit 113 as a space, and are connected with the input pad unit 21 of the radio frequency amplifier 20; the input pad unit 21 of the rf amplifier 20 is connected to the output compensation circuit 12, in the output compensation circuit 12, the inductance unit includes a second inductance unit 122 (the number and the type are not limited, such as 1221 and 1222) and a second folded inductance unit 124 (the number and the type are not limited, such as 1241 and 1242), the capacitance unit includes a second capacitance unit 123 (the number and the type are not limited, such as 1231, 1232 and 1233), and the at least one second folded inductance unit 124 and the at least one second inductance unit 122 are sequentially connected in series with the second capacitance unit 123 as a space, and are connected to the output feeder 121.
It will be appreciated that, as shown in fig. 2, the signal enters the input feeder 111 in the input compensation circuit 11, sequentially passes through 1121 in the first inductance unit, 1131 in the first capacitance unit, 1131 in the first folded inductance unit, 1132 in the first capacitance unit, 1122 in the first inductance unit, 1133 in the first capacitance unit, 1142 in the first folded inductance unit, reaches the input pad unit 21 of the radio frequency amplifier 20, enters the output compensation circuit 12 through the output pad unit 22 of the radio frequency amplifier 20, sequentially flows through 1242 in the second folded inductance unit, 1233 in the second capacitance unit, 1222 in the second inductance unit, 1232 in the second capacitance unit, 1241 in the second folded inductance unit, 1231 in the second capacitance unit, and 1221 in the second inductance unit, and finally flows out of the compensation circuit 10 through the output feeder 121.
It should be noted that, in this embodiment, the series circuit of each component of the input compensation circuit 11 and the pad unit 21 may be regarded as a fourth-order step impedance low-pass filter, the series circuit of each component of the output compensation circuit 12 and the output pad unit 22 may be regarded as a fourth-order step impedance low-pass filter, so as to respectively complete the input low-pass broadband compensation and the output low-pass broadband compensation of the packaged amplifier, and improve the impedance mismatch effect on the radio frequency path caused by the layout and wiring of the PCB, thereby implementing the ultra-wideband compensation circuit of the amplifier, better implementing the transmission performance of the amplifier chip and the standing wave performance of the input and output, and implementing the ultra-wideband compensation circuit from the L-band to the X-band, thereby overcoming the disadvantage that the conventional ultra-wideband compensation circuit needs multi-branch compensation, greatly reducing the design complexity and occupied area of the compensation circuit, and improving the signal attenuation problem caused by the too long transmission line of the conventional matching circuit.
As shown in fig. 3, in the input compensation circuit 11, the inductance unit includes one first inductance unit 112 (type is not limited) and two first folded inductance units (type is not limited, e.g. 1141 and 1142), the capacitance unit includes two first capacitance units (type is not limited, e.g. 1131 and 1132), and the first inductance unit 112, 1131 of the first capacitance units, 1141 of the first folded inductance units, 1132 of the first capacitance units and 1142 of the first folded inductance units are sequentially connected in series and connected with the input pad unit 21 of the radio frequency amplifier 20; the output pad unit 22 of the radio frequency amplifier 20 is connected to the output compensation circuit 12, in the output compensation circuit 12, the inductance unit includes one second inductance unit 122 (the type is not limited) and two second folded inductance units (the type is not limited, such as 1241 and 1242), the capacitance unit includes two second capacitance units (the type is not limited, such as 1231 and 1232), 1242 of the second folded inductance units, 1232 of the second capacitance units, 1241 of the second folded inductance units, 1231 of the second capacitance units, and 122 are sequentially connected in series, and are connected to the output feeder 121.
As shown in fig. 4, in the input compensation circuit 11, the inductance unit includes a first inductance unit 112 (without limitation in type) and a first folded inductance unit 114 (without limitation in type), the capacitance unit includes a first capacitance unit 113 (without limitation in type), and the first inductance unit 112, the first capacitance unit 113, and the first folded inductance unit 114 are sequentially connected in series and connected to the input pad unit 21 of the rf amplifier 20; the output pad unit 22 of the radio frequency amplifier 20 is connected to the output compensation circuit 12, and in the output compensation circuit 12, the inductance unit includes a second inductance unit 122 (type is not limited) and a second folded inductance unit 124 (type is not limited), and the capacitance unit includes a second capacitance unit 123 (type is not limited), and the second folded inductance unit 124, the second capacitance unit 123, and the second folded inductance unit 124 are sequentially connected in series and are connected to the output feeder 121.
Fig. 5 is a cross-sectional view of a structural layout of a radio frequency compensation circuit according to an embodiment of the present invention, referring to fig. 5, optionally, the radio frequency compensation circuit 10 includes a microstrip line wiring layer I, a dielectric substrate II, and a microstrip line bottom layer III, where the microstrip line wiring layer I is located at one side of the dielectric substrate II, and the microstrip line bottom layer III is located at one side of the dielectric substrate II away from the microstrip line wiring layer I;
the input compensation circuit 11, the input pad unit 21, the output compensation circuit 12 and the output pad unit 22 are all located on the microstrip line wiring layer I, and the dielectric substrate II is used for providing a preset characteristic impedance for the microstrip line wiring layer I, and the microstrip line bottom layer III is grounded.
The input compensation circuit 11 and the output compensation circuit 12 may include any of the above-described structures, and the specific embodiments and the beneficial effects are as described in the above-described embodiments, and are not described herein again.
Referring to fig. 5 in conjunction with fig. 4, the first folded inductance unit 114 and the second folded inductance unit 124 are folded inductances that are folded even and have right angles, and optionally, the input feeder 111, the first inductance unit 112, the first capacitance unit 113, the first folded inductance unit 114, the second folded inductance unit 124, the second capacitance unit 123, the second inductance unit 122, and the output feeder 121 are microstrip line structures.
Illustratively, the first capacitive element and/or the second capacitive element are made of low impedance microstrip lines, i.e. microstrip lines with a narrower linewidth. For example, a low-impedance microstrip line having an impedance of 20Ω is used.
Illustratively, the first inductance unit and/or the second inductance unit are/is made of a microstrip line with high impedance, i.e. a microstrip line with a narrower line width. For example, a high-impedance microstrip line having an impedance of 100deg.C is used.
Optionally, with continued reference to fig. 5 in conjunction with fig. 4, the input feed line 111 and the output feed line 121 are constituted by a first microstrip line having a characteristic impedance equal to 50Ω;
the first capacitance unit 113 and the second capacitance unit 123 are constituted by a second microstrip line having a characteristic impedance of less than 50Ω;
the first inductance unit 112, the second inductance unit 122, the first folded inductance unit 114, and the second folded inductance unit 124 are configured by a third microstrip line having a characteristic impedance greater than 50Ω.
The line widths of the first inductance unit 112, the second inductance unit 122, the first folded inductance unit 114 and the second folded inductance unit 124 corresponding to the third microstrip line are consistent, the lengths of the first inductance unit 112 and the second inductance unit 122 are consistent, the lengths of the first folded inductance unit 114 and the second folded inductance unit 124 are consistent, the lengths of the first inductance unit 112 and the first folded inductance unit 114 are not necessarily consistent, and the inductance units of the first folded inductance unit 114 and the second folded inductance unit 124 may have a structure bent at even right angles. The first microstrip line has a length L1, and the second microstrip line has a length L2.
It should be noted that, by folding the inductance unit and arranging the inductance unit in a proper shape, the design area of the input/output compensation circuit can be further reduced.
Alternatively, referring to fig. 4 in conjunction with fig. 5, the widths of the third microstrip line, the first microstrip line, and the second microstrip line decrease in order.
The first microstrip line has a line width W1 for the input feeder 111 and the output feeder 121, the second microstrip line has a line width W3 for the first capacitor unit 113 and the second capacitor unit 123, and the third microstrip line has a line width W2 for the first inductor unit 112, the second inductor unit 122, the first folded inductor unit 114 and the second folded inductor unit 124, and a line width W5 for the input pad unit 21 and the output pad unit 22.
Illustratively, W3 may be 1.97mm, W1 may be 0.54mm, and W2 may be 0.23mm.
Optionally, referring to fig. 4 in conjunction with fig. 5, the bending region includes a right angle bend, and the first folded inductance unit and the second folded inductance unit include at least one microstrip line structure in a shape of a figure.
The bending area comprises right-angle bending and bending even times, for example, four times of bending are a micro-strip line structure in a shape of a Chinese character 'ji'; in addition, the lengths of the first inductance unit 112 and the second inductance unit 122 in the third microstrip line are L3, the lengths of the first folded inductance unit 114 and the second folded inductance unit 124 in the third microstrip line from one end of the first capacitance unit 113 and the second capacitance unit 123 to the first bending are L4, the distance from the first bending to the second bending is W4, and the distance from the second bending to the third bending is L5.
Preferably, specific parameters of the radio frequency compensation circuit are w1=0.54 mm, w2=0.23 mm, w3=1.97 mm, w4=0.84 mm, w5=0.7 mm, l1=3 mm, l2=0.66 mm, l3=0.67 mm, l4=0.21 mm, l5=1.06 mm.
Optionally, the input compensation circuit and the output compensation circuit are symmetrically arranged about the radio frequency amplifier.
Optionally, the radio frequency compensation circuit is formed based on an SOT-89 package structure.
Illustratively, the dielectric substrate II plate is Rogers4350B, the thickness is 0.254mm, and the copper thickness of the microstrip line wiring layer I is 0.036mm.
Based on the above-mentioned optimized parameters, fig. 6 is a transmission performance comparison chart of a radio frequency compensation circuit according to an embodiment of the present invention, and fig. 7 is a standing wave performance comparison chart of a radio frequency compensation circuit according to an embodiment of the present invention.
Where S11 is the reflection coefficient, also known in engineering as return loss, specifically, the return signal amplitude divided by the incoming signal amplitude, and S21 is the insertion loss. The curve labeled "Uncompensate" in the figure is the corresponding curve of the port to which the compensation circuit is not added; the curve labeled "Compensate" is the corresponding curve of the port to which the compensation circuit is added; the curve labeled "Chip" is the original corresponding curve of the port.
In the four-port network, S11, S22, S33, S44 represent the return loss/reflection coefficient of each port, respectively. S21, S12, S34, S43 denote insertion loss between corresponding ports, e.g. S21 is insertion loss between port 2 and corresponding port 1. S13, S31, S24, S42 represent near-end crosstalk between ports, e.g. S13 is near-end crosstalk between two adjacent ports, port 1 and port 3. S14, S41, S23, S32 denote the far-end crosstalk between ports, e.g. S14 denotes the far-end crosstalk between the far-end port 1 and the corresponding far-end port 4.
As shown in fig. 6, in the frequency range of DC-5 GHz, the performance of the rf system circuit after the microstrip line is directly interconnected with the SOT-89 package input/output pad and connected with the compensation circuit is not significantly changed, when the frequency is 5GHz and later, the transmission loss of the port curve which is not connected with the rf compensation circuit is almost unchanged and is gradually increased, while the transmission loss of the port curve which is connected with the rf compensation circuit is continuously gradually reduced at the original rate, that is, the transmission performance of the microstrip line in the rf system circuit directly interconnected with the amplifier package pad is rapidly deteriorated, and when the frequency is 12GHz, the transmission loss of the rf path is increased to 0.6dB, and the reflection loss is 9dB; after the compensation circuit is added between the microstrip line and the chip package input/output bonding pad, the transmission loss of the radio frequency path is less than 0.15dB, and the transmission loss of the radio frequency path is obviously improved compared with that of a direct interconnection radio frequency path.
As shown in fig. 7, in the frequency range of DC-5 GHz, the performance of the rf system circuit after the microstrip line is directly interconnected with the SOT-89 package input/output pad and connected with the compensation circuit is not significantly changed, when the frequency is 5GHz and after, the reflection curve of the port of the compensation circuit is not connected with the microstrip line, the reflection curve of the port of the compensation circuit is continuously increased, and the reflection curve of the port of the compensation circuit is reduced, and when the frequency is 12GHz, the transmission reflection loss of the rf path is 9dB; after the compensation circuit is added, the reflection loss is more than 16dB, and the reflection loss is obviously improved compared with the reflection loss of a direct interconnection radio frequency channel.
Fig. 8 is a comparison diagram of transmission performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention, fig. 9 is a comparison diagram of input standing wave performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention, fig. 10 is a comparison diagram of output standing wave performance of an amplifier of a radio frequency compensation circuit according to an embodiment of the present invention, and fig. 8 to 10 are continuously combined with fig. 4 to refer to fig. 8 to 10, wherein a curve labeled "unompensate" is a corresponding curve of a port to which the compensation circuit is not added; the curve labeled "Compensate" is the corresponding curve of the port to which the compensation circuit is added; the curve labeled "Chip" is the corresponding curve connecting the ports of the original amplifier Chip.
In this embodiment, taking the GVA-123 amplifier chip as an example, the radio frequency interconnection ultra-wideband compensation circuit for the SOT-89 packaged amplifier provided by the invention is verified, and a chip applied to the ultra-wideband SOT-89 packaged amplifier of 0.1-12 GHz is respectively brought into an uncompensated radio frequency amplification system and a radio frequency amplification system of the radio frequency compensation circuit (shown in fig. 4) based on the optimized parameters for comparison:
as shown in the simulation results, as shown in fig. 8, in the frequency range of 7 GHz-12 GHz, the performance of the amplifier chip is obviously reduced in the uncompensated radio frequency system circuit compared with the gain of the original amplifier chip, namely obvious deterioration occurs, and further the best amplification performance of the amplifier chip cannot be exerted in the uncompensated radio frequency system circuit; by adding the ultra-wideband compensation circuit into the radio frequency system circuit, the performance of the amplifier chip in the radio frequency system circuit after compensation is basically attached to the performance index of the original amplifier chip in the frequency range of 0.1-12 GHz, and the radio frequency impedance mismatch phenomenon caused by direct interconnection of the microstrip line and the SOT-89 packaging input/output bonding pad is well compensated.
As shown in FIG. 9, by adding the ultra-wideband compensation circuit into the radio frequency system circuit, in the frequency range of 0.1-12 GHz, the input standing wave curve of the amplifier chip in the radio frequency system circuit after compensation has smaller fluctuation amplitude than the input standing wave curve which is not connected into the compensation circuit, the input standing wave performance is more stable, and the reflection loss of the radio frequency path of the input standing wave curve of the original amplifier chip is improved.
As shown in FIG. 10, by adding the ultra-wideband compensation circuit in the radio frequency system circuit, in the frequency range of 0.1-12 GHz, the output standing wave curve of the amplifier chip in the radio frequency system circuit after compensation is more attached to the performance index of the original amplifier chip than the output standing wave curve which is not connected with the compensation circuit, thereby better compensating the radio frequency impedance mismatch phenomenon caused by direct interconnection of the microstrip line and the SOT-89 packaging input/output bonding pad, and improving the reflection loss of the radio frequency path compared with the input standing wave curve of the original amplifier chip.
In summary, in any one of the radio frequency compensation circuits provided in the embodiments of the present invention, a signal enters an input feeder line in the input compensation circuit, sequentially passes through the set electrical devices such as the first inductance unit, the first capacitance unit and the first folded inductance unit (a plurality of electrical devices are arranged at intervals by taking the first capacitance unit as an interval), reaches an input pad unit of the amplifier, enters the output compensation circuit from an output pad unit of the amplifier, sequentially passes through the set electrical devices such as the second folded inductance unit, the second capacitance unit and the second inductance unit (a plurality of electrical devices are arranged at intervals by taking the second capacitance unit as an interval), and finally flows out of the compensation circuit from the output feeder line. The ultra-wideband compensation circuit is added in the radio frequency system circuit to better compensate the radio frequency impedance mismatch phenomenon caused by direct interconnection of the microstrip line and the SOT-89 packaging input/output bonding pad.
The embodiment of the invention also provides a radio frequency amplifying system which comprises a radio frequency amplifier and any radio frequency compensation circuit provided by the embodiment. The rf amplifying system has the same or corresponding technical effects as the rf compensating circuit, and will not be described herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. The radio frequency compensation circuit is characterized by being connected with a radio frequency amplifier, wherein the radio frequency amplifier comprises an input pad unit and an output pad unit;
the radio frequency compensation circuit comprises an input compensation circuit and an output compensation circuit, wherein the input compensation circuit is connected with the input pad unit, and the output compensation circuit is connected with the output pad unit;
the input compensation circuit comprises an input feeder line, at least one first inductance unit, at least one first capacitance unit and at least one first folding inductance unit which are connected in series, and the output compensation circuit comprises at least one second folding inductance unit, at least one second capacitance unit, at least one second inductance unit and an output feeder line which are connected in series;
the first folding inductance unit and the second folding inductance unit comprise microstrip line structures of at least one bending area.
2. The radio frequency compensation circuit of claim 1 wherein the inductive and capacitive elements in the input compensation circuit are alternately connected in series between the input feed line and the input pad element;
the inductance unit and the capacitance unit in the output compensation circuit are alternately connected in series between the output pad unit and the output feeder line.
3. The radio frequency compensation circuit of claim 1, wherein the radio frequency compensation circuit comprises a microstrip line routing layer, a dielectric substrate, and a microstrip line bottom layer, the microstrip line routing layer being located on one side of the dielectric substrate, the microstrip line bottom layer being located on the other side of the dielectric substrate away from the microstrip line routing layer;
the input compensation circuit, the input pad unit, the output compensation circuit and the output pad unit are all positioned on the microstrip line wiring layer, the dielectric substrate is used for providing preset characteristic impedance for the microstrip line wiring layer, and the bottom layer of the microstrip line is grounded.
4. The radio frequency compensation circuit of claim 3 wherein the input feed line, the first inductive element, the first capacitive element, the first folded inductive element, the second capacitive element, the second inductive element, and the output feed line are microstrip line structures.
5. The radio frequency compensation circuit of claim 4 wherein said input feed line and said output feed line are comprised of a first microstrip line having a characteristic impedance equal to 50Ω;
the first capacitor unit and the second capacitor unit are formed by a second microstrip line with characteristic impedance smaller than 50Ω;
the first inductance unit, the second inductance unit, the first folding inductance unit and the second folding inductance unit are composed of a third microstrip line with characteristic impedance larger than 50Ω.
6. The radio frequency compensation circuit of claim 5 wherein the widths of the third microstrip line, the first microstrip line, and the second microstrip line decrease in sequence.
7. The radio frequency compensation circuit of claim 1 wherein,
the bending region comprises right-angle bending, and the first folding inductance unit and the second folding inductance unit comprise at least one microstrip line structure in a shape of a Chinese character 'ji'.
8. The radio frequency compensation circuit of claim 1 wherein the input compensation circuit and the output compensation circuit are symmetrically disposed about the radio frequency amplifier.
9. The rf compensation circuit of claim 1 wherein the rf compensation circuit is formed based on an SOT-89 package structure.
10. A radio frequency amplifying system comprising a radio frequency amplifier and a radio frequency compensation circuit according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211715545.1A CN116015228A (en) | 2022-12-29 | 2022-12-29 | Radio frequency compensation circuit and radio frequency amplification system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211715545.1A CN116015228A (en) | 2022-12-29 | 2022-12-29 | Radio frequency compensation circuit and radio frequency amplification system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116015228A true CN116015228A (en) | 2023-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211715545.1A Pending CN116015228A (en) | 2022-12-29 | 2022-12-29 | Radio frequency compensation circuit and radio frequency amplification system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116015228A (en) |
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2022
- 2022-12-29 CN CN202211715545.1A patent/CN116015228A/en active Pending
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