CN116015096A - Piezoelectric ceramic chip and ultrasonic motor - Google Patents

Piezoelectric ceramic chip and ultrasonic motor Download PDF

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Publication number
CN116015096A
CN116015096A CN202310253644.0A CN202310253644A CN116015096A CN 116015096 A CN116015096 A CN 116015096A CN 202310253644 A CN202310253644 A CN 202310253644A CN 116015096 A CN116015096 A CN 116015096A
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China
Prior art keywords
piezoelectric ceramic
chip
electrode
electrodes
layers
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CN202310253644.0A
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Chinese (zh)
Inventor
任永珊
李照
贺立龙
刘威
朱颖
梁雪
周妤
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Chuanglian Electronic Component Group Co ltd
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Chuanglian Electronic Component Group Co ltd
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Priority to CN202310253644.0A priority Critical patent/CN116015096A/en
Publication of CN116015096A publication Critical patent/CN116015096A/en
Pending legal-status Critical Current

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Abstract

The application discloses piezoceramics chip and ultrasonic motor, piezoceramics chip includes multilayer chip unit, and multilayer chip unit stacks gradually and sets up, and the chip unit includes: a piezoelectric ceramic sheet; the electrode areas are circumferentially arranged on the same side face of the piezoelectric ceramic plate, a plurality of electrodes are arranged in each electrode area, the electrodes in the same electrode area have the same electric polarity, the electrode areas with opposite electric polarities are alternately arranged on the piezoelectric ceramic plate, and the electrodes with the same electric polarity in the multi-layer chip unit are all electrically connected together and led out through leads. The piezoelectric ceramic chip with multiple layers is adopted, so that the overall miniaturization of the ultrasonic motor is realized, and the ultrasonic motor has the advantages of low energy consumption, low power supply voltage, simple matched circuit, low noise, high anti-interference capability and the like, and is also suitable for complex application scenes.

Description

Piezoelectric ceramic chip and ultrasonic motor
Technical Field
The application relates to the technical field of ultrasonic motors, in particular to a piezoelectric ceramic chip and an ultrasonic motor.
Background
An ultrasonic motor is different from a traditional motor, and is a motor for directly converting electric energy into mechanical energy through an inverse piezoelectric effect. The core device of the ultrasonic motor is a piezoelectric ceramic chip, a plurality of electrodes with positive and negative polarities alternating in sequence are arranged on the piezoelectric ceramic chip, the electrodes can enable the piezoelectric ceramic chip to vibrate in the corresponding direction after an alternating current power supply is input, and the vibration directions caused by the electrodes with opposite polarities are opposite, so that each area of the piezoelectric ceramic chip can drive a rotating shaft to rotate after alternating vibration. Compared with the traditional electromagnetic motor, the ultrasonic motor has the advantages of simple structure, easy miniaturization, low noise, no electromagnetic radiation interference and the like, thus becoming a research hot spot of miniature drivers and being widely applied in the fields of camera automatic focusing, camera piezoelectric shutters, dot matrix printers, hard disk drives and the like.
At present, a piezoelectric ceramic chip used for an ultrasonic motor is of a single-layer structure, for example, the invention patent application with the publication number of CN109004861A is disclosed. The piezoelectric ceramic chip with the single-layer structure has the defects of large volume, high energy consumption, large voltage and large size of a matched circuit, and has high requirements on application scenes.
Disclosure of Invention
The embodiment of the application provides a piezoelectric ceramic chip and an ultrasonic motor, which are used for solving the problems of large volume, high energy consumption, large voltage and large size of a matched circuit of the piezoelectric ceramic chip with a single-layer structure in the prior art.
In one aspect, an embodiment of the present application provides a piezoelectric ceramic chip, including multilayer chip unit, multilayer chip unit stacks gradually and sets up, and the chip unit includes:
a piezoelectric ceramic sheet;
the electrode areas are circumferentially arranged on the same side face of the piezoelectric ceramic plate, a plurality of electrodes are arranged in each electrode area, the electrodes in the same electrode area have the same electric polarity, the electrode areas with opposite electric polarities are alternately arranged on the piezoelectric ceramic plate, and the electrodes with the same electric polarity in the multi-layer chip unit are all electrically connected together and led out through leads.
On the other hand, the embodiment of the application also provides an ultrasonic motor which comprises the piezoelectric ceramic chip.
The piezoelectric ceramic chip and the ultrasonic motor have the following advantages:
the piezoelectric ceramic chip with multiple layers is adopted, so that the overall miniaturization of the ultrasonic motor is realized, and the ultrasonic motor has the advantages of low energy consumption, low power supply voltage, simple matching circuit, low noise, high anti-interference capability and the like, and is also suitable for complex application scenes.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a multilayer structure of a piezoelectric ceramic chip according to an embodiment of the present application;
fig. 2 is a schematic diagram of a printed pattern of a conductive paste according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an odd-layer electrode print pattern according to an embodiment of the present disclosure;
fig. 4 is a design diagram of an even-numbered electrode print pattern according to an embodiment of the present application.
Reference numerals illustrate: 100-piezoelectric ceramic plate, 200-conductor layer, 300-electrode region and 310-electrode.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Fig. 1 to 4 are schematic structural diagrams of a piezoelectric ceramic chip according to an embodiment of the present application. The embodiment of the application provides a piezoceramics chip, including multilayer chip unit, multilayer chip unit stacks gradually and sets up, and the chip unit includes:
a piezoelectric ceramic sheet 100;
the electrode regions 300, a plurality of electrode regions 300 are circumferentially disposed on the same side of the piezoelectric ceramic sheet 100, a plurality of electrodes 310 are disposed in each electrode region 300, the electrodes 310 in the same electrode region 300 have the same electric polarity, the electrode regions 300 of opposite electric polarity are alternately disposed on the piezoelectric ceramic sheet 100, and the electrodes 310 having the same electric polarity in the multi-layered chip unit are all electrically connected together and led out by leads.
Illustratively, the region where the plurality of electrodes 310 having the same electric polarity are located is the electrode region 300. In the embodiment of the present application, the piezoelectric ceramic sheet 100 is a circular sheet, the plurality of electrode regions 300 are circumferentially arranged around the center of the piezoelectric ceramic sheet 100, and an insulating region is provided between two adjacent electrode regions 300. The electrode 310 in the entire piezoelectric ceramic chip has both positive and negative polarities, which are determined by the direction of the current input through the leads.
In the present application, the number of layers of the chip unit is greater than 3 and is an odd number, and the number of the electrode areas 300 on the piezoelectric ceramic sheet 100 is an odd number and is 3-11. As shown in fig. 2 and 3, in the embodiment of the present application, there are three electrode areas 300 on the piezoceramic sheet 100, where two electrode areas 300 are the same in size and are symmetrically disposed on the left and right sides, the number of electrodes 310 in each electrode area 300 is four, the size of the remaining one electrode area 300 is slightly smaller than that of the other two electrode areas 300, and only one electrode 310 in the electrode areas 300 is located at the bottom end of all the electrode areas 300. An insulating region is disposed between two adjacent electrode regions 300, and the size of the insulating region is larger than that of the insulating region between two adjacent electrodes 310 in the same electrode region 300, and correspondingly, the insulating region between two electrode regions 300 with the same size is located at the top end of the whole electrode region 300.
Further, as shown in fig. 4, the multi-layered chip units are divided into odd and even layers in the arrangement order, wherein the electrode regions 300 provided on the piezoelectric ceramic sheet 100 of the n-th and n+1-th chip units of the adjacent two layers correspond to each other in position, and the electrode regions 300 provided on the corresponding positions of the adjacent two layers of chip units are mirror-symmetrical in shape and opposite in electric polarity.
In one possible embodiment, the conductor layer 200 is disposed in the electrode region 300, and the electrodes 310 in the same electrode region 300 are all disposed on the conductor layer 200.
Illustratively, the conductor layer 200 electrically connects the electrodes 310 located in the same electrode region 300, so that all the electrodes 310 in the same electrode region 300 have the same electric polarity, improving the operation stability of the electrodes 310 after the later energization.
Further, the conductor layer 200 is formed by printing a conductor paste on the piezoelectric ceramic sheet 100, the electrode 310 is formed by printing a silver palladium paste on the conductor layer 200, and the piezoelectric ceramic sheet 100 is a film made by a casting method. Specifically, the preparation method of the piezoelectric ceramic chip in the application is as follows:
the piezoelectric ceramic sheet 100 in the form of a membrane is prepared by using a ceramic slurry by a tape casting method, then the conductor layer 200 is printed on the piezoelectric ceramic sheet 100, specifically, a steel mesh with a conductor layer pattern can be arranged on the piezoelectric ceramic sheet 100, the printing of the conductor layer 200 can be completed by coating the conductor slurry on the steel mesh, then the electrode 310 is printed on the conductor layer 200, specifically, a steel mesh with an electrode pattern can be arranged on the conductor layer 200, and the printing of the electrode 300 can be completed by coating silver-palladium slurry on the steel mesh. After the conductor layer 200 and the electrode 310 are printed, the multilayer chip units are sequentially stacked, and finally fired at a low temperature, for example, 1000 ℃, to obtain the piezoelectric ceramic chip of the present application.
In one possible embodiment, the piezoelectric ceramic sheet 100 is provided with a via hole between two adjacent electrodes 310 in each electrode region 300, the electrodes 310 in the electrode regions 300 having the same electric polarity on two adjacent even layers or two adjacent odd layers in the multi-layered chip unit are electrically connected by the via hole, and the piezoelectric ceramic sheet 100 in the chip unit located between two adjacent even layers or two adjacent odd layers is provided with an insulating region around the via hole.
For example, since the piezoelectric ceramic chip in the present application is composed of a plurality of layers of chip units, it is important that each layer of chip units is normally powered. The electrodes 310 on two adjacent even layers or two adjacent odd layers are connected through the through holes penetrating the piezoelectric ceramic sheet 100, so that the electrodes 310 on the transition layers, namely the adjacent two even layers or the adjacent two odd layers, on the chip unit work normally, are not influenced by wires in the through holes, and are communicated with each other.
Further, since the electrode 310 on the chip unit of the transition layer needs to be connected to the electrode 310 on the other chip units, the piezoelectric ceramic sheet 100 of the chip unit directly adjacent to the chip unit of the transition layer needs to be provided with a via hole, but it needs to be ensured that the via holes provided on the adjacent piezoelectric ceramic sheet 100 need to be staggered, that is, the axes of the via holes are not coincident, so as to avoid interference of wires in the via holes.
In the present application, a plurality of independent chip units are stacked to form a piezoelectric ceramic chip, a multi-layer structure is adopted, and electrodes 310 and conductor layers 200 are arranged between each piezoelectric ceramic chip 100, and based on the structure, the polarization directions of adjacent electrode areas 300 on the same piezoelectric ceramic chip 100 are the same or opposite through different polarization modes and polarization directions. When the piezoelectric ceramic chip works, when certain alternating voltages are introduced into different electrode areas 300, the different electrode areas 300 can generate stretching bending vibration in different modes, so that the requirement of multiple degrees of freedom motion in space is met. Compared with the existing single-layer chip with the same thickness, the piezoelectric ceramic chip with the multilayer structure has the advantages of small volume, small loss, small required power voltage and larger flexible bending deformation quantity, and the deformation quantity can be increased or reduced by a method of increasing or reducing the number of layers of the chip units or the thickness of the piezoelectric ceramic chip.
The embodiment of the application also provides an ultrasonic motor which comprises the piezoelectric ceramic chip. Besides the piezoelectric ceramic chip, the ultrasonic motor also needs to be provided with a motor base, a rotor, an elastomer, a motor shaft and the like, and the structures and the connection modes of the components are all in the prior art, so that the ultrasonic motor is not described in detail in the application.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims (10)

1. The utility model provides a piezoceramics chip, its characterized in that includes multilayer chip unit, the multilayer the chip unit stacks gradually and sets up, the chip unit includes:
a piezoelectric ceramic sheet (100);
the electrode areas (300) are circumferentially arranged on the same side face of the piezoelectric ceramic plate (100), a plurality of electrodes (310) are arranged in each electrode area (300), the electrodes (310) in the same electrode area (300) have the same electric polarity, the electrode areas (300) with opposite electric polarities are alternately arranged on the piezoelectric ceramic plate (100), and the electrodes (310) with the same electric polarity in a plurality of layers of chip units are all electrically connected together and led out by leads.
2. A piezoelectric ceramic chip according to claim 1, wherein the electrode regions (300) of adjacent two layers of the chip unit are arranged at corresponding positions with opposite electric polarities.
3. A piezoceramic chip as claimed in claim 2, characterized in that the electrode areas (300) of adjacent two layers of the chip units are arranged in corresponding positions in mirror symmetry in shape.
4. A piezoelectric ceramic chip according to claim 1, wherein a conductor layer (200) is provided in the electrode region (300), and the electrodes (310) in the same electrode region (300) are all provided on the conductor layer (200).
5. A piezoelectric ceramic chip according to claim 4, wherein the conductor layer (200) is formed by printing a conductor paste on the piezoelectric ceramic sheet (100).
6. A piezoelectric ceramic chip according to claim 4, wherein the electrode (310) is formed by printing silver palladium paste on the conductor layer (200).
7. A piezoceramic chip as claimed in claim 4, characterized in that the piezoceramic chip (100) is provided with a via between two adjacent electrodes (310) in each electrode area (300), the electrodes (310) in the electrode areas (300) having the same electrical polarity on two adjacent even or two adjacent odd layers in the multilayer chip unit being electrically connected by the via, the piezoceramic chip (100) in the chip unit between two adjacent even or two adjacent odd layers being provided with an insulating region around the via.
8. The piezoelectric ceramic chip according to claim 1, wherein the number of layers of the chip unit is an odd number and the number of layers is greater than 3.
9. A piezoelectric ceramic chip according to claim 1, wherein the number of electrode areas (300) on the piezoelectric ceramic sheet (100) is an odd number and the number is 3-11.
10. An ultrasonic motor comprising a piezoelectric ceramic chip according to any one of claims 1 to 9.
CN202310253644.0A 2023-03-16 2023-03-16 Piezoelectric ceramic chip and ultrasonic motor Pending CN116015096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310253644.0A CN116015096A (en) 2023-03-16 2023-03-16 Piezoelectric ceramic chip and ultrasonic motor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310253644.0A CN116015096A (en) 2023-03-16 2023-03-16 Piezoelectric ceramic chip and ultrasonic motor

Publications (1)

Publication Number Publication Date
CN116015096A true CN116015096A (en) 2023-04-25

Family

ID=86028338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310253644.0A Pending CN116015096A (en) 2023-03-16 2023-03-16 Piezoelectric ceramic chip and ultrasonic motor

Country Status (1)

Country Link
CN (1) CN116015096A (en)

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