CN116009714B - Touch pen, electronic equipment and pressure detection device - Google Patents
Touch pen, electronic equipment and pressure detection device Download PDFInfo
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- CN116009714B CN116009714B CN202310315626.0A CN202310315626A CN116009714B CN 116009714 B CN116009714 B CN 116009714B CN 202310315626 A CN202310315626 A CN 202310315626A CN 116009714 B CN116009714 B CN 116009714B
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Abstract
The embodiment of the application provides a touch pen, electronic equipment and a pressure detection device. The touch pen comprises a pen container, a pressure detection device and a pen point. The pressure detection device comprises a cylinder, a piston assembly and a semiconductor strain gauge. The cylinder body is arranged in the pen container. The piston assembly includes a piston and a piston rod. The piston is arranged in the cylinder. The piston rod comprises a first connecting end and a second connecting end which are oppositely arranged. Along the axial direction of the cylinder. The first connecting end is connected with the piston. Along the axial direction of the cylinder, the semiconductor strain gauge is positioned on one side of the piston, which is away from the piston rod. The semiconductor strain gauge is connected with the cylinder in a sealing way. A storage space is formed between the piston and the semiconductor strain gauge, and the storage space is used for storing flowable media. The pen point is connected with the second connecting end. The pen point moves close to or far away from the cylinder along the axial direction of the cylinder, the piston rod drives the piston to move close to or far away from the semiconductor strain gauge, and the semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation.
Description
Technical Field
The embodiment of the application relates to the technical field of terminals, in particular to a touch pen, electronic equipment and a pressure detection device.
Background
With the explosive growth of electronic devices such as smart phones or tablet computers, the functions of the electronic devices are increasing. The electronic device is equipped with a stylus in addition to the host computer for facilitating operation. The user may execute a portion of the instructions, such as volume adjustment or brightness adjustment, etc., through the stylus operating system. The user may also use a stylus to draw and write on a canvas on the electronic device. The touch control pen and the host are of a separated structure. The tip of a stylus typically needs to be in contact with the screen of the host computer. In order to obtain the accuracy of touch control, the volume design of the pen head of the touch control pen is usually smaller. A pressure sensor is arranged in the current touch pen. The pressure sensor is used for detecting the pressure value of the pen point. Whether the user uses the stylus or not can be judged through the detected pressure value, and the thickness degree of handwriting written by the stylus can be adjusted through the detected pressure value, for example, the larger the pressure is, the thicker the handwriting is. However, currently used pressure sensors include a deformable frame and a strain gage. The strain gage is attached to the collection location of the deformable frame. When the pressure of the pen point changes, the pen point can apply an acting force to the deformable frame so as to deform the deformable frame, and the strain gauge generates strain. The strain gauge converts the strain signal into an electrical signal to obtain the current pressure value of the pen point. Because the deformation precision and the sensitivity of the deformable frame are relatively deviated, the detection result of the strain gauge attached to the deformable frame is easy to have errors, so that the possibility that a touch screen is unresponsive or the thickness degree of the writing trace is not matched with the pressure is caused, and the use experience of the touch pen is affected.
Disclosure of Invention
The embodiment of the application provides a touch pen, electronic equipment and pressure detection device, which can improve the pressure detection precision and sensitivity of the touch pen.
The first aspect of the application provides a stylus, which comprises a pen container, a pressure detection device and a pen point.
The pressure detection device comprises a cylinder, a piston assembly and a semiconductor strain gauge. The cylinder body is arranged in the pen container. The piston assembly includes a piston and a piston rod. The piston is arranged in the cylinder. The piston rod includes a first connection end and a second connection end. The first connecting end and the second connecting end are oppositely arranged along the axial direction of the cylinder body. The first connecting end is connected with the piston. Along the axial direction of the cylinder, the semiconductor strain gauge is positioned on one side of the piston, which is away from the piston rod. The semiconductor strain gauge is connected with the cylinder in a sealing way. A storage space is formed between the piston and the semiconductor strain gauge, and the storage space is used for storing flowable media. The pen point is connected with the second connecting end. The pen point moves close to or far away from the cylinder along the axial direction of the cylinder, the piston rod drives the piston to move close to or far away from the semiconductor strain gauge, and the semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation.
In the touch pen provided by the embodiment of the application, the pen point is acted by pressure, the pen point can drive the piston to move close to or far away from the semiconductor strain gauge, the semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation, and the semiconductor strain gauge can convert a strain signal into an electric signal representing the current pressure value of the pen point so as to obtain the current pressure value of the pen point. Since the piston and the semiconductor strain gauge are arranged at intervals, that is, the piston and the semiconductor strain gauge are in a non-contact state, the acting force transmission mode between the piston and the semiconductor strain gauge is a non-contact transmission mode. When the position of the piston changes, the semiconductor strain gauge can quickly and accurately respond to the position change of the piston to deform, so that the accuracy and the sensitivity of the pressure detection of the pen point of the touch pen are improved, the possibility that the touch pen has a light touch screen and does not respond or the thickness degree of writing is not matched with the pressure is reduced, and the use experience of the touch pen is improved.
In one possible embodiment, the semiconductor strain gauge comprises a two-dimensional layer of semiconductor material.
The two-dimensional semiconductor material layer has good stretchability and flexibility, so that it can withstand large strains without damage. Meanwhile, the two-dimensional semiconductor material layer has high-sensitivity strain performance, and can realize sensitive response to external stress change so as to provide sensitive detection on pressure, thereby being beneficial to improving the detection precision and sensitivity of the pressure detection device.
In one possible embodiment, the semiconductor strain gauge further comprises a flexible substrate. The two-dimensional semiconductor material layer is stacked with the flexible substrate. The flexible substrate is in sealing connection with the cylinder.
The flexible substrate may provide support for the two-dimensional semiconductor material layer. When the semiconductor strain gauge is subjected to bending deformation in response to external stress, the flexible substrate and the two-dimensional semiconductor material layer can synchronously undergo bending deformation. After the stress acting on the semiconductor strain gauge disappears, the flexible substrate and the two-dimensional semiconductor material layer can synchronously recover to an initial state under the action of elastic restoring force so as to realize resetting.
In one possible embodiment, the material of the two-dimensional semiconductor material layer includes at least one of molybdenum disulfide, tungsten disulfide, indium selenide, tungsten diselenide, and graphene.
In one possible embodiment, the semiconductor strain gauge is bonded to the barrel to form a sealed connection.
The semiconductor strain gauge and the cylinder body are bonded, so that on one hand, the connection between the semiconductor strain gauge and the cylinder body can be guaranteed to achieve a good sealing state; on the other hand, no mechanical connecting piece is required to be arranged between the semiconductor strain gauge and the cylinder body, and corresponding connecting structures such as connecting holes are also not required to be arranged on the semiconductor strain gauge and the cylinder body, so that the use quantity of parts is reduced, the structural integrity of the semiconductor strain gauge is ensured, and the possibility that the semiconductor strain gauge is easy to tear around the connecting structures due to the fact that the connecting structures are arranged on the semiconductor strain gauge and the structural integrity is damaged is reduced.
In one possible embodiment, the semiconductor strain gauge is sealingly connected to the end face of the cylinder.
The contact area of the contact surface formed between the end surface of the cylinder and the semiconductor strain gauge is larger, so that the connection reliability and stability between the cylinder and the semiconductor strain gauge can be improved.
In one possible embodiment, the semiconductor strain gauge comprises a two-dimensional layer of semiconductor material. Along the axial direction of the cylinder, the orthographic projection of the two-dimensional semiconductor material layer of the semiconductor strain gauge is positioned in the orthographic projection of the end face of the cylinder.
In one possible embodiment, the piston is connected to the cylinder in a sealing manner.
The piston, the cylinder and the semiconductor strain gauge form a storage space in a sealed state. Because the storage space is in a sealed state, when the position of the piston changes, acting force can be quickly and effectively transferred to the semiconductor strain gauge, so that the semiconductor strain gauge can quickly and accurately respond to the position change of the piston to generate corresponding deformation, and the sensitivity and the detection precision of the pressure detection device are guaranteed.
In one possible embodiment, at least one of the piston and the cylinder has a fluid passage thereon. The fluid passage extends in the axial direction of the cylinder. The fluid channel is communicated with the storage space and the space of the piston on the side facing away from the semiconductor strain gauge.
During the manufacturing process of the piston or the cylinder, the outer surface of the piston or the inner wall of the cylinder may allow for a predetermined machining error such that a micro-sized channel may exist in the outer surface of the piston or the inner wall of the cylinder. Channels on the outer surface of the piston or on the inner wall of the cylinder may form fluid passages. The flow rate of the medium through the fluid channel is relatively slow and the flow per unit time is relatively small when the position of the piston changes, so that the medium flowing through the fluid channel has less influence on the process of transmitting the acting force in the process of transmitting the acting force to the semiconductor strain gauge through the medium in the storage space by the piston. Therefore, under the condition that the semiconductor strain gauge can effectively respond to the position change of the piston to generate corresponding deformation, the processing precision requirement of the outer surface of the piston or the inner wall of the cylinder body can be relatively reduced, and the processing difficulty and the processing cost of the piston or the cylinder body are reduced.
In one possible embodiment, the flowable medium is a gas, which is advantageous for reducing the overall weight of the stylus and for reducing the weight of the stylus. In addition, in the embodiment of the storage space in which the piston, the cylinder and the semiconductor strain gauge form a sealed state, if the piston, the cylinder and the semiconductor strain gauge have a sealing failure, the flowable medium is gas, so that when the medium in the storage space leaks, the leaked medium does not pollute the pressure detection device or other structural parts in the pen container.
In one possible embodiment, the pressure detecting device further comprises an elastic member. The pen point moves close to or far away from the barrel body so that the elastic piece accumulates or releases elastic potential energy.
When the elastic piece accumulates elastic potential energy, the damping acting force along the axial direction of the barrel body can be applied to the pen point, so that the movement process of the pen point is relatively mild and smooth, the deformation process of the semiconductor strain gauge is guaranteed to be mild and smooth, the movement speed of the pen point is reduced to be too high, the semiconductor strain gauge is enabled to be deformed greatly in a short time, the possibility that the semiconductor strain gauge is easy to fatigue failure or damage is caused, and in addition, the possibility that the movement speed of the pen point is too high and the user experience is influenced is also reduced. When the elastic member releases elastic potential energy, a restoring force can be applied to the pen point, so that the pen point can be quickly and accurately restored to an initial state.
In one possible embodiment, the cylinder and the piston rod are each connected to an elastic element. Alternatively, the pen container and the piston rod are respectively connected with the elastic piece.
In one possible embodiment, the pressure detection device further comprises a stop. The limiting piece is connected with the cylinder body. Along the axial direction of the cylinder, the limiting piece is arranged on one side of the piston, which is away from the semiconductor strain gauge. The limiting piece is used for limiting the piston.
The limiting piece is used for limiting the piston to limit the position of the piston, so that when the piston is in contact with the limiting piece, the piston and the pen point can accurately recover to an initial state, the high position precision of the pen point after reset is ensured, and the high detection precision of the pressure detection device is further ensured. The limiting piece can prevent the piston from withdrawing from the cylinder.
In one possible embodiment, the stop is a stop plate. The limiting piece comprises an avoidance hole. The piston rod penetrates through the avoiding hole.
A second aspect of the present application provides an electronic device, including the stylus described above. The touch pen comprises a pen container, a pressure detection device and a pen point. The pressure detection device comprises a cylinder, a piston assembly and a semiconductor strain gauge. The cylinder body is arranged in the pen container. The piston assembly includes a piston and a piston rod. The piston is arranged in the cylinder. The piston rod includes a first connection end and a second connection end. The first connecting end and the second connecting end are oppositely arranged along the axial direction of the cylinder body. The first connecting end is connected with the piston. Along the axial direction of the cylinder, the semiconductor strain gauge is positioned on one side of the piston, which is away from the piston rod. The semiconductor strain gauge is connected with the cylinder in a sealing way. A storage space is formed between the piston and the semiconductor strain gauge, and the storage space is used for storing flowable media. The pen point is connected with the second connecting end. The pen point moves close to or far away from the cylinder along the axial direction of the cylinder, the piston rod drives the piston to move close to or far away from the semiconductor strain gauge, and the semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation.
A third aspect of the present application provides a pressure sensing device comprising a barrel, a piston assembly, and a semiconductor strain gauge.
The piston assembly includes a piston and a piston rod. The piston is arranged in the cylinder. The piston rod includes a first connection end and a second connection end. The first connecting end and the second connecting end are oppositely arranged along the axial direction of the cylinder body. The first connecting end is connected with the piston. Along the axial direction of the cylinder, the semiconductor strain gauge is positioned on one side of the piston, which is away from the piston rod. The semiconductor strain gauge is connected with the cylinder in a sealing way. A storage space is formed between the piston and the semiconductor strain gauge. The storage space is used for storing the flowable medium. The piston moves close to or far from the semiconductor strain gauge along the axial direction of the cylinder, and the semiconductor strain gauge is used for generating corresponding deformation in response to the position change of the piston.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is an exploded view of a host according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a stylus according to an embodiment of the present application;
FIG. 4 is a schematic view of a partial cross-sectional structure of a related art stylus;
FIG. 5 is a schematic view of a partial cross-sectional structure of a related art stylus;
FIG. 6 is a schematic diagram of a partial cross-sectional structure of a stylus according to an embodiment of the present application;
FIG. 7 is a schematic view of a partial cross-sectional structure of a stylus according to an embodiment of the present application;
FIG. 8 is an enlarged schematic view of FIG. 6 at M;
FIG. 9 is a schematic view of a partial cross-sectional structure of a pressure detection device according to an embodiment of the present application;
FIG. 10 is an enlarged schematic view of the portion N in FIG. 6;
FIG. 11 is a schematic view of a partial cross-sectional structure of a stylus according to another embodiment of the present application;
FIG. 12 is a schematic view of a partial cross-sectional structure of a stylus according to another embodiment of the present application;
FIG. 13 is a schematic view of a partial cross-sectional structure of a stylus according to another embodiment of the present application;
fig. 14 is a schematic partial cross-sectional view of a stylus according to still another embodiment of the present application.
Reference numerals:
10. an electronic device;
20. a host; 21. a touch screen; 22. a housing; 23. a main board; 24. an electronic device;
30. a stylus;
40. a pen container;
50. a pen point;
60. a pressure detection device; 60a, a storage space;
61. a cylinder; 611. an end face;
62. a piston assembly; 621. a piston; 622. a piston rod; 622a, a first connection end; 622b, a second connection end;
63. a semiconductor strain gauge; 631. a layer of two-dimensional semiconductor material; 632. a flexible substrate;
64. An elastic member;
65. a limiting piece;
99. a pressure sensor; 991. a deformable frame; 992. a strain gage;
100. adhesive glue;
110. a fluid channel;
x, axial direction.
Detailed Description
The electronic device in the embodiment of the present application may be referred to as a User Equipment (UE) or a terminal (terminal), and the electronic device may be, for example, a tablet (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), or a mobile terminal or a fixed terminal. The form of the electronic device in the embodiment of the present application is not particularly limited.
In the present embodiment, fig. 1 schematically shows a structure of an electronic device 10. Referring to fig. 1, an electronic device 10 is illustrated as a handheld device having wireless communication capabilities. The handheld device of the wireless communication function may be a mobile phone, for example.
Fig. 2 schematically shows a partially exploded structure of the host. Referring to fig. 1 and 2, an electronic device 10 includes a host 20 and a stylus 30. The host 20 of the embodiment of the present application includes a touch screen 21, a housing 22, a motherboard 23, and an electronic device 24. The touch panel 21 has a display area for displaying image information. The touch screen 21 is mounted to the housing 22, and a display area of the touch screen 21 is exposed so as to present image information to a user. The main board 23 is connected to the housing 22 and is located inside the touch screen 21, so that the main board 23 is not easily observed by a user outside the electronic device 10. The electronic device 24 is disposed on the motherboard 23. The motherboard 23 may be a printed circuit board (Printed Circuit Board, PCB). For example, the electronic device 24 is soldered to the motherboard 23 by a soldering process. The electronics 24 include, but are not limited to, a central processing unit (Central Processing Unit, CPU), a smart algorithm chip, or a Power Management chip (PMIC).
Wireless signal interaction between the host 20 and the stylus 30 may be achieved through a bluetooth network or a near field communication (Near Field Communication, NFC) network, thereby facilitating free movement of the stylus 30 without being constrained by a wire harness. The stylus 30 may perform related operations, such as clicking, writing or drawing, etc., on the touch screen 21 of the host 20. The stylus 30 may also operate the host 20 remotely, such as unlocking or locking the host 20, answering or hanging up an incoming call, etc. The stylus 30 may be a columnar structure having a predetermined length to make it easier for a user to hold the stylus 30.
In some implementations, the stylus 30 may be an inductive stylus. When the stylus 30 is an inductive pen, an electromagnetic induction board needs to be integrated on the touch screen 21 that interacts with the stylus 30. Coils are distributed on the electromagnetic induction plate, and coils are integrated in the induction pen. Based on the electromagnetic induction principle, in the magnetic field range generated by the electromagnetic induction plate, along with the movement of the induction pen, the induction pen can accumulate electric energy. The inductive pen can transmit the accumulated electric energy to the electromagnetic induction plate through the coil in the inductive pen through free oscillation. The electromagnetic induction plate can scan the coil on the electromagnetic induction plate based on the electric energy from the induction pen, and calculate the position of the induction pen on the touch screen 21.
In some implementations, the stylus 30 may be a capacitive pen. The capacitive pen may include: passive capacitive pens and active capacitive pens. Passive capacitive pens may be referred to as passive capacitive pens and active capacitive pens may be referred to as active capacitive pens. When stylus 30 is an active capacitive stylus, one or more electrodes may be provided in the active capacitive stylus (e.g., within the tip). The active capacitive pen may emit a signal through the electrode. When the stylus 30 is an active capacitive stylus, an integrated electrode array is required on the touch screen 21 that interacts with the stylus 30. In one embodiment, the electrode array may be a capacitive electrode array. The electronic device 10 may receive a signal from the active capacitive pen via the electrode array, such that upon receipt of the signal, the position of the active capacitive pen on the touch screen 21, and the tilt angle of the active capacitive pen, is identified based on the change in capacitance value on the touch screen 21.
Fig. 3 schematically shows the structure of the stylus 30. Referring to fig. 1 to 3, the stylus 30 includes a barrel 40 and a tip 50. The barrel 40 may be an elongated shaft. The barrel 40 includes a grip portion. When a user performs a writing or clicking operation using the stylus 30, the user's finger is generally held within a predetermined area of the barrel 40. The grip portion of the barrel 40 is used to facilitate the placement of the fingers of the user. The holding part can be designed and distinguished from other areas in terms of color or structure, so that a user can conveniently observe and contact the holding part. The barrel 40 may provide protection to structural members disposed within the barrel 40, reducing the likelihood of structural members being damaged by impact. The pen tip 50 can be in direct contact with the touch screen 21 of the host 20 to write on the touch screen 21 or click on a function icon on the touch screen 21. The nib 50 may be movably coupled to the barrel 40 in the axial direction of the barrel 40 such that the nib 50 may move relative to the barrel 40 when subjected to an axial force. For example, the nib 50 may move closer to the barrel 40 when the nib 50 contacts the touch screen 21 and applies pressure to the nib 50. The nib 50 may be moved away from the barrel 40 when the nib 50 is removed from the touch screen 21. When writing with the stylus 30, the writing trace may be relatively thin when the pressure between the pen tip 50 and the touch screen 21 is small, and the writing trace may be relatively thick when the pressure between the pen tip 50 and the touch screen 21 is large, so as to control the thickness of the writing trace by the pressure between the pen tip 50 and the touch screen 21.
In the related art, fig. 4 schematically shows a partial cross-sectional structure of a related art stylus 30. Fig. 5 schematically shows a partial cross-sectional structure of a related art stylus 30. Referring to fig. 4 and 5, a pressure sensor 99 is provided in the stylus 30. The pressure sensor 99 is used for detecting a pressure value generated between the pen head 50 and the touch screen 21. The pressure sensor 99 may be provided in the barrel 40. The pressure sensor 99 includes a deformable frame 991 and a strain gauge 992. The deformable frame 991 may be welded to the barrel 40. The nib 50 is connected to a deformable frame 991. The strain gage 992 is attached to the deformable frame 991 at a stress-collecting point. Between the deformable frame 991 and the strain gage 992 is a contact-type force transmission. The pressure sensor 99 is provided in the barrel 40. For example, the deformable frame 991 is a rectangular frame. In the longitudinal direction, the tip 50 is attached to one rim and the strain gauge 992 is attached to the other rim. The nib 50 may move in a direction approaching the barrel 40 when the nib 50 contacts the touch screen 21 and applies pressure to the touch screen 21. At this point, as shown in FIG. 5, the nib 50 exerts a force on the deformable frame 991. The two rims of the deformable frame 991 in the long side direction are inclined so that the deformable frame 991 can be changed from a rectangular shape to a parallelogram shape. After the deformable frame 991 is deformed, the strain gauge 992 may generate a corresponding strain, and convert the strain signal into an electrical signal indicative of the current pressure value of the tip 50, so as to obtain the current pressure value of the tip 50. After the tip 50 is removed from the touch screen 21, the deformable frame 991 may revert from a parallelogram to a rectangular shape. The material of the deformable frame 991 may be a metallic material, such as copper or a copper alloy. However, the deformation accuracy and sensitivity of the deformable frame 991 are relatively deviated due to the deviation of the machining accuracy and the fitting position accuracy of the deformable frame 991, and thus the detection result of the strain gauge 992 attached to the deformable frame 991 is liable to be erroneous.
In the stylus 30 provided in the embodiments of the present application, the force transmission may be achieved through the piston, so that when the nib 50 receives pressure, the nib 50 may transmit the force to the semiconductor strain gauge through the piston. The semiconductor strain gauge itself may deform and convert the strain signal into an electrical signal representative of the current pressure value of the tip 50 to obtain the current pressure value of the tip 50. The acting force transmission mode between the piston and the semiconductor strain gauge is a non-contact transmission mode, so that the semiconductor strain gauge can rapidly and accurately respond to the position change of the piston to deform, and the accuracy and the sensitivity of detecting the pressure of the pen point 50 are improved.
Fig. 6 schematically shows a partially cut-away structure of the stylus 30. Referring to fig. 6, the stylus 30 of the embodiment of the present application further includes a pressure detection device 60. The nib 50 is connected to a pressure detecting device 60. The pressure detecting device 60 is used for detecting the pressure value of the pen head 50.
The pressure detection device 60 includes a cylinder 61, a piston assembly 62, and a semiconductor strain gauge 63. The barrel 61 is disposed within the barrel 40. The relative positions of the barrel 61 and the barrel 40 are fixed, and the barrel 61 does not move in the axial direction X of the barrel 61. Illustratively, the cartridge body 61 is removably attachable to the barrel 40 to facilitate assembly or disassembly of the pressure sensing device 60 from the barrel 40. Alternatively, the barrel 61 and the barrel 40 may be bonded to each other. The piston assembly 62 includes a piston 621 and a piston rod 622. The piston 621 is disposed within the barrel 61. The piston 621 is slidably coupled to the cylinder 61 along the axial direction X of the cylinder 61. The piston rod 622 includes a first connection end 622a and a second connection end 622b. Along the axial direction X of the cylinder 61, the first connection end 622a and the second connection end 622b of the piston rod 622 are disposed opposite to each other, i.e., the two ends of the piston rod 622 are the first connection end 622a and the second connection end 622b, respectively. The first connecting end 622a of the piston rod 622 is connected to the piston 621, while the second connecting end 622b of the piston rod 622 is remote from the piston 621. The second connecting end 622b of the piston rod 622 is adapted to be connected to other stressed structural members. For example, the nib 50 may be coupled to the second connection end 622b of the piston rod 622. Illustratively, the first connecting end 622a of the piston rod 622 may be removably coupled to the piston 621. The second connecting end 622b of the piston 621 may be removably connected to the nib 50. Along the axial direction X of the cylinder 61, the semiconductor strain gauge 63 is located on the side of the piston 621 facing away from the piston rod 622. The semiconductor strain gauge 63 is hermetically connected to the cylinder 61. Along the axial direction X of the cylinder 61, a space is provided between the semiconductor strain gauge 63 and the piston 621. A storage space 60a is formed between the piston 621 and the semiconductor strain gauge 63. The storage space 60a is used for storing a flowable medium. When the piston 621 moves close to or away from the semiconductor strain gauge 63, the piston 621 can push the medium in the storage space 60a to flow and change the pressure of the medium, so as to transfer the acting force to the semiconductor strain gauge 63 through the medium, so that the semiconductor strain gauge 63 deforms correspondingly.
When the pen head 50 moves close to or far from the barrel 61 along the axial direction X of the barrel 61, the pen head 50 drives the piston 621 to move close to or far from the semiconductor strain gauge 63 through the piston rod 622, and the semiconductor strain gauge 63 is used for corresponding deformation in response to the position change of the piston 621. For example, fig. 7 schematically shows a partially cut-away structure of the stylus 30. Referring to fig. 7, when the pen head 50 drives the piston 621 to move close to the semiconductor strain gauge 63, the piston 621 transmits a force to the semiconductor strain gauge 63 through the medium in the storage space 60a, so that the semiconductor strain gauge 63 is deformed in a rising manner in a direction away from the piston 621. When the pen head 50 drives the piston 621 to move away from the semiconductor strain gauge 63, the semiconductor strain gauge 63 deforms toward the direction approaching to the piston 621, and finally the pen head 50, the piston 621 and the semiconductor strain gauge 63 can be restored to the initial state. Illustratively, in the initial state, the semiconductor strain gauge 63 may be, but is not limited to being, in a flat state.
When the semiconductor material in the semiconductor strain gauge 63 is mechanically deformed under the action of external force, the resistivity of the semiconductor material can be correspondingly changed, and the phenomenon is called strain resistance effect, so that the semiconductor strain gauge 63 can convert a strain signal into a corresponding electric signal.
In the stylus 30 provided in the embodiment of the present application, the pen point 50 is under pressure, the pen point 50 can drive the piston 621 to move close to or far away from the semiconductor strain gauge 63, the semiconductor strain gauge 63 is used for responding to the position change of the piston 621 to generate corresponding deformation, and the semiconductor strain gauge 63 itself can convert the strain signal into an electrical signal representing the current pressure value of the pen point 50, so as to obtain the current pressure value of the pen point 50. Since the piston 621 and the semiconductor strain gauge 63 are disposed at a distance from each other, that is, the piston 621 and the semiconductor strain gauge 63 are in a non-contact state, the force transmission system between the piston 621 and the semiconductor strain gauge 63 is a non-contact transmission system. When the position of the piston 621 changes, the semiconductor strain gauge 63 can quickly and accurately respond to the change of the position of the piston 621 to deform, so that the accuracy and the sensitivity of pressure detection of the pen head 50 of the stylus 30 are improved, the possibility that the touch screen 21 does not respond or the thickness of writing is not matched with the pressure of the stylus 30 is reduced, and the use experience of the stylus 30 is improved.
In some implementations, the nib 50 may be located on the outside of the barrel 40. Alternatively, at least a portion of the nib 50 may be located within the barrel 40. The axis of the nib 50, the axis of the piston rod 622, the axis of the piston 621, the axis of the barrel 61 and the axis of the barrel 40 may coincide. The nib 50 may be, but is not limited to, tapered. The piston rod 622 may be, but is not limited to, a cylindrical rod. The piston 621 may be, but is not limited to being, cylindrical. The barrel 61 and the barrel 40 may each be, but are not limited to, cylinders. The semiconductor strain gauge 63 as a whole may be, but is not limited to, a wafer structure.
Fig. 8 is an enlarged view at M in fig. 6. Referring to fig. 6 and 8, a semiconductor strain gauge 63 of an embodiment of the present application may include a two-dimensional semiconductor material layer 631. The two-dimensional semiconductor material layer 631 has good stretchability and flexibility so that it can withstand large strains without being damaged. Meanwhile, the two-dimensional semiconductor material layer 631 has high-sensitivity strain performance, and can realize sensitive response to external stress changes so as to provide sensitive detection on pressure, thereby being beneficial to improving the detection precision and sensitivity of the pressure detection device 60.
In some examples, the material of the two-dimensional semiconductor material layer 631 includes, but is not limited to, at least one of molybdenum disulfide, tungsten disulfide, indium selenide, tungsten diselenide, and graphene.
The semiconductor strain gauge 63 further includes a flexible substrate 632. The flexible substrate 632 may have good stretchability and flexibility. The two-dimensional semiconductor material layer 631 is stacked on the flexible substrate 632. The lamination direction of the two-dimensional semiconductor material layer 631 and the flexible substrate 632 may be the same as the axial direction X of the cylinder 61. The flexible substrate 632 is hermetically connected to the cylinder 61. The flexible substrate 632 may provide support for the two-dimensional semiconductor material layer 631. The flexible substrate 632 and the two-dimensional semiconductor material layer 631 can be simultaneously subjected to bending deformation when the semiconductor strain gauge 63 is subjected to bending deformation in response to external stress. After the stress acting on the semiconductor strain gauge 63 is removed, the flexible substrate 632 and the two-dimensional semiconductor material layer 631 can be synchronously restored to the original state under the action of the elastic restoring force so as to realize the reset.
In some examples, the material of flexible substrate 632 may be, but is not limited to, polyethylene terephthalate (polyethylene terephthalate, PET) or Polyimide (PI).
In some examples, along the axial direction X of the barrel 61, the orthographic projected area of the two-dimensional semiconductor material layer 631 is less than the orthographic projected area of the flexible substrate 632. The outer contour of the two-dimensional semiconductor material layer 631 may be the same as the outer contour of the flexible substrate 632, for example, the two-dimensional semiconductor material layer 631 and the flexible substrate 632 may each be circular. The axis of the two-dimensional semiconductor material layer 631 coincides with the axis of the flexible substrate 632.
The semiconductor strain gauge 63 is bonded to the barrel 61 to form a sealed connection. The semiconductor strain gauge 63 and the cylinder 61 are bonded, so that on one hand, the connection between the semiconductor strain gauge 63 and the cylinder 61 can be guaranteed to achieve a good sealing state; on the other hand, no mechanical connection is required between the semiconductor strain gauge 63 and the cylinder 61, and no corresponding connection structure, such as a connection hole, is required between the semiconductor strain gauge 63 and the cylinder 61, so that the number of components is reduced, the structural integrity of the semiconductor strain gauge 63 is ensured, and the possibility that the semiconductor strain gauge 63 is easily torn around the connection structure due to the connection structure arranged on the semiconductor strain gauge 63 and the structural integrity is damaged is reduced.
In some examples, the semiconductor strain gauge 63 and the barrel 61 may be bonded using a bonding glue.
Referring to fig. 8, a semiconductor strain gauge 63 may be sealingly connected to an end face 611 of the barrel 61. The contact area of the contact surface formed between the end surface 611 of the cylinder 61 and the semiconductor strain gauge 63 is large, so that the reliability and stability of the connection between the cylinder 61 and the semiconductor strain gauge 63 can be improved. The end face 611 of the barrel 61 may be planar. The end face 611 of the barrel 61 may be perpendicular to the axis of the barrel 61. The end face 611 of the cylinder 61 is used as a reference surface, so that after the semiconductor strain gauge 63 is arranged on the end face 611 of the cylinder 61, the semiconductor strain gauge 63 cannot be inclined relative to the axis of the cylinder 61, and the center of the semiconductor strain gauge 63 can be raised along the axis of the cylinder 61 instead of being raised along the direction deviating from the axis of the cylinder 61 after the semiconductor strain gauge 63 responds to external stress, so that the uniformity of stress distribution on the semiconductor strain gauge 63 is guaranteed, and good strain performance and strain precision are maintained.
In some examples, the semiconductor strain gauge 63 is bonded to the end face 611 of the barrel 61 to form a sealed connection. Illustratively, the semiconductor strain gauge 63 and the end face 611 of the barrel 61 may be bonded using the bonding glue 100. The adhesive paste 100 is provided between the semiconductor strain gauge 63 and the end surface 611 of the cylinder 61 along the axial direction X of the cylinder 61. The thickness of the adhesive 100 is uniform.
In some examples, along the axial direction X of the barrel 61, the orthographic projection of the two-dimensional semiconductor material layer 631 in the semiconductor strain gage 63 is located within the orthographic projection of the end face 611 of the barrel 61.
Along the axial direction X of the cylinder 61, the end face 611 of the cylinder 61 is orthographic projected in a ring shape. Illustratively, the front projection of the end face 611 of the barrel 61 is annular, while the front projection of the two-dimensional semiconductor material layer 631 is circular. The axis of the two-dimensional semiconductor material layer 631 may coincide with the axis of the cylinder 61.
Fig. 9 schematically shows a partially cut-away structure of the pressure detecting device 60. As shown in fig. 9, a semiconductor strain gauge 63 may be provided in the cylinder 61. The semiconductor strain gauge 63 may be hermetically connected to the inner wall of the cylinder 61. The barrel 61 may provide protection to the semiconductor strain gauge 63, reducing the likelihood of structural damage to the semiconductor strain gauge 63 from impact or scraping of the semiconductor strain gauge 63 during shipping or assembly. The barrel 61 also protects the junction formed between the semiconductor strain gauge 63 and the barrel 61 from impact or scraping, reducing the likelihood of cracking or flaking of the junction, resulting in a seal failure between the semiconductor strain gauge 63 and the barrel 61.
In some examples, the semiconductor strain gauge 63 is bonded to the inner wall of the barrel 61 to form a sealed connection. Illustratively, the semiconductor strain gauge 63 and the inner wall of the cylinder 61 may be bonded using the bonding glue 100. At least one side of the semiconductor strain gauge 63 may be provided with an adhesive paste 100 along the axial direction X of the cylinder 61. The adhesive 100 has a ring shape.
Illustratively, the forward projection of the bond paste 100 is annular along the axial direction X of the barrel 61. Along the axial direction X of the cylinder 61, the orthographic projection of the two-dimensional semiconductor material layer 631 in the semiconductor strain gauge 63 is located within the orthographic projection of the adhesive paste 100. The front projection of the two-dimensional semiconductor material layer 631 does not overlap with the front projection of the adhesive paste 100.
Illustratively, the orthographic projection of the bond paste 100 may be circular, while the orthographic projection of the two-dimensional semiconductor material layer 631 may be circular. The axis of the two-dimensional semiconductor material layer 631 may coincide with the axis of the annular adhesive glue 100.
In some implementations, the piston 621 of the piston assembly 62 is sealingly connected to the barrel 61. The piston 621, the cylinder 61, and the semiconductor strain gauge 63 form a sealed storage space 60a. When the piston 621 approaches or moves away from the semiconductor strain gauge 63, the piston 621 may transmit force to the semiconductor strain gauge 63 through the medium in the storage space 60a. Since the storage space 60a is in a sealed state, when the position of the piston 621 changes, the acting force can be quickly and effectively transferred to the semiconductor strain gauge 63, so that the semiconductor strain gauge 63 can quickly and accurately respond to the change of the position of the piston 621 to generate corresponding deformation, thereby being beneficial to ensuring the sensitivity and the detection precision of the pressure detection device 60.
In some examples, the flowable medium stored in the sealed storage space 60a may be a liquid or a gas.
In some examples, the material of the barrel 61 may be metal or plastic. The material of the piston 621 may be rubber.
In some implementations, at least one of the piston 621 and the barrel 61 of the piston assembly 62 has a fluid passage thereon. Illustratively, one of the piston 621 and the barrel 61 may have a fluid passageway therein. Illustratively, fig. 10 is an enlarged view at N of fig. 6. Referring to fig. 6 and 10, the piston 621 and the cylinder 61 each have a fluid passage 110. The fluid passage 110 on the piston 621 may be in communication with the fluid passage 110 on the barrel 61. The fluid passage 110 extends along the axial direction X of the cylinder 61. The fluid passage 110 communicates with the reservoir space 60a and the space of the piston 621 on the side facing away from the semiconductor strain gauge 63. The storage space 60a formed by the piston 621, the cylinder 61, and the semiconductor strain gauge 63 is not completely sealed. The fluid channel 110 may be a hole or slot of relatively small cross-sectional area such that the flow rate of the medium through the fluid channel 110 is relatively slow.
During the manufacturing process of the piston 621 or the cylinder 61, the outer surface of the piston 621 or the inner wall of the cylinder 61 may allow for a predetermined manufacturing error such that a micro-sized channel may exist in the outer surface of the piston 621 or the inner wall of the cylinder 61. Channels on the outer surface of the piston 621 or on the inner wall of the barrel 61 may form the fluid passage 110. The flow rate of the medium through the fluid passage 110 is relatively slow and the flow rate per unit time is relatively small when the position of the piston 621 is changed, so that the medium flowing through the fluid passage 110 has less influence on the process of transmitting the force during the process of transmitting the force to the semiconductor strain gauge 63 by the piston 621 through the medium in the storage space 60 a. Therefore, under the condition that the semiconductor strain gauge 63 can effectively respond to the position change of the piston 621 to generate corresponding deformation, the machining precision requirement of the outer surface of the piston 621 or the inner wall of the cylinder 61 can be relatively reduced, which is beneficial to reducing the machining difficulty and the machining cost of the piston 621 or the cylinder 61.
The flowable medium stored in the storage space 60a may be a gas, thereby facilitating the weight reduction of the entire stylus 30 and the weight reduction of the stylus 30. In addition, in the embodiment of the storage space 60a in which the piston 621, the cylinder 61, and the semiconductor strain gauge 63 are sealed, if the piston 621, the cylinder 61, and the semiconductor strain gauge 63 are in a failure state, the flowable medium is gas, so that the leaked medium does not contaminate the pressure detecting device 60 or other structural members in the barrel 40 when the medium in the storage space 60a leaks.
In some examples, the space on the side of the piston 621 facing away from the semiconductor strain gage 63 may be in communication with the atmosphere. The storage space 60a may be in communication with the atmosphere through the fluid passage 110. The flowable medium stored in the storage space 60a may be air.
Fig. 11 schematically shows a partially cut-away structure of the stylus 30. Referring to fig. 11, the pressure detecting device 60 further includes an elastic member 64. The elastic member 64 refers to a device that can be compressed or stretched by an external force to accumulate elastic potential energy, and can release the elastic potential energy when the external force is removed. The nib 50 moves closer to or further from the barrel 61 to cause the elastic member 64 to accumulate or release elastic potential energy. When the elastic member 64 accumulates elastic potential energy, a damping force along the axial direction X of the barrel 61 can be applied to the nib 50, so that the movement process of the nib 50 is relatively mild and smooth, thereby being beneficial to ensuring that the deformation process of the semiconductor strain gauge 63 is mild and smooth, reducing the movement speed of the nib 50 to be too fast, enabling the semiconductor strain gauge 63 to be greatly deformed in a relatively short time, so that the possibility that the semiconductor strain gauge 63 is easy to be fatigued or damaged is reduced, and in addition, reducing the possibility that the movement speed of the nib 50 is too fast, and the user experience is affected is also facilitated. When the elastic member 64 releases elastic potential energy, a restoring force can be applied to the nib 50 to quickly and accurately restore the nib 50 to the initial state.
In some examples, the barrel 61 and the piston rod 622 are each coupled to a spring 64. When the pen head 50 drives the piston rod 622 to move close to the semiconductor strain gauge 63, the piston rod 622 can compress the elastic member 64, so that the elastic member 64 accumulates elastic potential energy. After the pressure of the nib 50 disappears, the elastic member 64 can release elastic potential energy, and at this time, the elastic member 64 can apply a restoring force to the nib 50 to drive the nib 50 to move away from the barrel 61, so as to realize the restoration of the nib 50.
In some examples, fig. 12 schematically shows a partial cross-sectional structure of stylus 30. Referring to fig. 12, the barrel 40 and the piston rod 622 are respectively connected to the elastic member 64. When the pen head 50 drives the piston rod 622 to move close to the semiconductor strain gauge 63, the piston rod 622 can stretch the elastic member 64, so that the elastic member 64 accumulates elastic potential energy. After the pressure of the nib 50 disappears, the elastic member 64 can release elastic potential energy, and at this time, the elastic member 64 can apply a restoring force to the nib 50 to drive the nib 50 to move away from the barrel 61, so as to realize the restoration of the nib 50.
In some examples, the elastic member 64 is sleeved outside the piston rod 622. The elastic member 64 may be a spring. Illustratively, the elastic member 64 may be a coil spring. The axis of the elastic member 64 and the axis of the cylinder 61 may coincide.
Fig. 13 schematically shows a partially cut-away structure of the stylus 30. Referring to fig. 13, the pressure detecting device 60 further includes a stopper 65. The stopper 65 is connected to the cylinder 61. The stopper 65 is provided on a side of the piston 621 facing away from the semiconductor strain gauge 63 in the axial direction X of the cylinder 61. The limiting piece 65 is used for limiting the piston 621 so as to limit the position of the piston 621, so that when the piston 621 contacts with the limiting piece 65, the piston 621 and the pen point 50 can accurately recover to an initial state, the high position precision of the pen point 50 after reset is ensured, and the high detection precision of the pressure detection device 60 is further ensured. The stopper 65 prevents the piston 621 from being withdrawn from the cylinder 61.
Fig. 14 schematically shows a partially cut-away structure of the stylus 30. Referring to fig. 13 and 14, the nib 50 is pressed, and the nib 50 drives the piston 621 to move toward the semiconductor strain gauge 63, so that the piston 621 is out of contact with the stopper 65. When the pressure on the tip 50 is relieved, the tip 50 and the piston 621 move away from the semiconductor strain gauge 63. After the piston 621 contacts the stopper 65, the nib 50 and the piston 621 stop moving to complete the reset.
In some examples, the stop 65 is a stop plate. The stop 65 includes a relief hole. The limiting member 65 has a ring-shaped structure. The piston rod 622 is inserted into the avoiding hole. The avoidance hole is used to avoid the piston rod 622. A stop 65 may be attached to the end of the barrel 61 remote from the semiconductor strain gauge 63. The elastic member 64 may be disposed on a side of the stopper 65 facing away from the piston 621. The piston rod 622 and the stopper 65 are connected to the elastic member 64, respectively. The piston rod 622 may compress the elastic member 64 as the piston rod 622 moves in the axial direction X of the cylinder 61.
Illustratively, the diameter of the relief bore is greater than the diameter of the piston rod 622 such that a gap is formed between the piston rod 622 and the relief bore.
Illustratively, the stop 65 is integrally formed with the barrel 61.
In the pressure detection device 60 of the embodiment of the application, the piston 621 and the semiconductor strain gauge 63 are adopted to realize the force transmission in a non-contact mode, so that the diameter of the cylinder 61 has small influence on the detection precision and sensitivity of the semiconductor strain gauge 63, the diameter of the cylinder 61 can be set to be smaller, and the diameter of the pen container 40 can be set to be smaller.
One way of assembling the stylus 30 of the present embodiment may be, but is not limited to, connecting the piston 621 with the piston rod 622 and then connecting the piston 621 with the barrel 61. The semiconductor strain gauge 63 is then attached to the barrel 61. The piston 621, piston rod 622, barrel 61, and semiconductor strain gauge 63 are assembled to form a unitary structure. The barrel 61 is connected to the barrel 40. The elastic member 64 is fitted over the piston rod 622. The nib 50 is then connected to the piston rod 622. Therefore, the assembling process of the stylus 30 is relatively easy and simplified, which is advantageous for improving the assembling work efficiency.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The embodiments of the present application are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless specifically stated otherwise.
The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The term "plurality" herein refers to two or more. The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship; in the formula, the character "/" indicates that the front and rear associated objects are a "division" relationship.
It will be appreciated that the various numerical numbers referred to in the embodiments of the present application are merely for ease of description and are not intended to limit the scope of the embodiments of the present application.
It should be understood that, in the embodiments of the present application, the sequence number of each process described above does not mean that the execution sequence of each process should be determined by the function and the internal logic of each process, and should not constitute any limitation on the implementation process of the embodiments of the present application.
Claims (16)
1. A stylus, comprising:
a pen container;
the pressure detection device comprises a cylinder body, a piston assembly and a semiconductor strain gauge, wherein the cylinder body is arranged in the pen container, the piston assembly comprises a piston and a piston rod, the piston is arranged in the cylinder body, the piston rod comprises a first connecting end and a second connecting end, the first connecting end and the second connecting end are oppositely arranged along the axial direction of the cylinder body, the first connecting end is connected with the piston, the semiconductor strain gauge is positioned on one side, facing away from the piston rod, of the piston along the axial direction of the cylinder body, the semiconductor strain gauge is in sealing connection with the cylinder body, a storage space is formed between the piston and the semiconductor strain gauge, and the storage space is used for storing flowable media;
The pen point is connected with the second connecting end;
the pen point moves close to or far away from the cylinder along the axial direction of the cylinder, the piston rod drives the piston to move close to or far away from the semiconductor strain gauge, and the semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation.
2. The stylus of claim 1, wherein the semiconductor strain gauge comprises a two-dimensional layer of semiconductor material.
3. The stylus of claim 2, wherein the semiconductor strain gauge further comprises a flexible substrate, the two-dimensional semiconductor material layer is laminated with the flexible substrate, and the flexible substrate is hermetically connected with the barrel.
4. A stylus according to claim 2 or 3, wherein the material of the two-dimensional semiconductor material layer comprises at least one of molybdenum disulphide, tungsten disulphide, indium selenide, tungsten diselenide and graphene.
5. A stylus according to any one of claims 1 to 3, wherein the semiconductor strain gauge is bonded to the barrel to form a sealed connection.
6. The stylus of claim 1, wherein the semiconductor strain gauge is sealingly connected to an end face of the barrel.
7. The stylus of claim 6, wherein the semiconductor strain gauge comprises a two-dimensional semiconductor material layer, an orthographic projection of the two-dimensional semiconductor material layer of the semiconductor strain gauge being located within an orthographic projection of the end face of the barrel along an axial direction of the barrel.
8. A stylus according to any one of claims 1 to 3, wherein the piston is sealingly connected to the barrel.
9. A stylus according to any one of claims 1 to 3, wherein at least one of the piston and the barrel has a fluid passage thereon, the fluid passage extending in an axial direction of the barrel, the fluid passage communicating the reservoir space and a space on a side of the piston facing away from the semiconductor strain gauge.
10. A stylus according to any one of claims 1 to 3, wherein the flowable medium is a gas.
11. A stylus according to any one of claims 1 to 3, wherein the pressure detection means further comprises a resilient member, the tip being moved closer to or farther from the barrel to cause the resilient member to accumulate or release elastic potential energy.
12. The stylus of claim 11, wherein the barrel and the piston rod are respectively connected to the elastic member; or the pen container and the piston rod are respectively connected with the elastic piece.
13. A stylus according to any one of claims 1 to 3, wherein the pressure detection device further comprises a limiting member, the limiting member is connected to the barrel, the limiting member is disposed on a side of the piston facing away from the semiconductor strain gauge along an axial direction of the barrel, and the limiting member is configured to limit the piston.
14. The stylus of claim 13, wherein the limiting member is a limiting plate, the limiting member includes an avoidance hole, and the piston rod is disposed through the avoidance hole.
15. An electronic device comprising a stylus according to any one of claims 1 to 14.
16. A pressure detection device, comprising:
a cylinder;
the piston assembly comprises a piston and a piston rod, the piston is arranged in the cylinder body, the piston rod comprises a first connecting end and a second connecting end, the first connecting end and the second connecting end are oppositely arranged along the axial direction of the cylinder body, and the first connecting end is connected with the piston;
the semiconductor strain gauge is positioned on one side of the piston, which is opposite to the piston rod, along the axial direction of the cylinder body, and is in sealing connection with the cylinder body, and a storage space is formed between the piston and the semiconductor strain gauge and is used for storing flowable media;
The semiconductor strain gauge is used for responding to the position change of the piston to generate corresponding deformation.
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| CN202310315626.0A CN116009714B (en) | 2023-03-29 | 2023-03-29 | Touch pen, electronic equipment and pressure detection device |
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| CN202310315626.0A CN116009714B (en) | 2023-03-29 | 2023-03-29 | Touch pen, electronic equipment and pressure detection device |
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| CN116009714A (en) | 2023-04-25 |
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