CN116009668A - Cooling device and cooling method for computer heat dissipation module - Google Patents
Cooling device and cooling method for computer heat dissipation module Download PDFInfo
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- CN116009668A CN116009668A CN202310020131.5A CN202310020131A CN116009668A CN 116009668 A CN116009668 A CN 116009668A CN 202310020131 A CN202310020131 A CN 202310020131A CN 116009668 A CN116009668 A CN 116009668A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention discloses a cooling device and a cooling method for a computer heat dissipation module, and belongs to the technical field of computer heat dissipation. Including the bottom plate, still include: the central tube is fixedly connected to the surface of the bottom plate, the outer wall of the central tube is provided with a vertical plate in an array manner, and the side wall of the vertical plate is provided with a mounting groove; the cooling liquid tank is fixedly connected to the surface of the bottom plate, the suction pump is fixedly connected to the inner wall of the cooling liquid tank, and the arc-shaped pipe is fixedly connected to the output end of the suction pump; the copper pipes are fixedly connected to the outer walls of the arc-shaped pipes, the copper pipes correspond to the vertical plates one by one, the copper pipes are fixedly connected with the corresponding vertical plates, and the outlet ends of the copper pipes are communicated with the cooling liquid tank; the screw thread is in the support section of thick bamboo of bottom plate outer wall, this device can improve radiating efficiency, has reduced external dust and has got into the support section of thick bamboo and influence the normal work of CPU, has reduced the loss, simultaneously, can realize cooling down fast, the normal work of the electronic component of being convenient for.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a cooling device and a cooling method for a computer heat dissipation module.
Background
The computer is an indispensable electronic product in our daily life and work, along with the progress of scientific technology, the configuration of the personal computer is higher and higher, and the problem of hardware heat dissipation is brought along with the configuration, if the heat dissipation effect of the computer case is poor, the aging speed of the circuit inside the case can be accelerated, and the computer hardware can be caused to be failed even burnt out when serious.
At present, most computer mainframe boxes adopt radiator fan and fin to dispel the heat to treater and the display card on the mainboard, can set up the gas pocket that supplies the air flow on the mainframe box, radiator fan blows off the heat on the fin to the mainframe box in, then drive the air flow by one or two exhaust fans that set up in addition on the mainframe box, discharge the steam, the inside air fluxion of mainframe box of this kind of cooling system is poor, outside air passively gets into in the mainframe box, result in radiating inefficiency, and in the heat dissipation process, dust in the outside air also can pour into the mainframe box inside, under the electrostatic interaction, the dust can adhere to on mainboard and other components and parts, can cause mainboard or other components and parts short circuit after a long time, bring the loss for the consumer, consequently, need improve it.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, a heat dissipation fan and a heat dissipation fin are adopted to dissipate heat of a processor and a display card on a main board, the air circulation inside a main cabinet of the heat dissipation system is poor, external air passively enters the main cabinet to cause low heat dissipation efficiency, dust in the external air can also flow into the inside of the cabinet in the heat dissipation process, the dust can be attached to the main board and other components under the action of static electricity, short circuit of the main board or other components is caused after the time, and loss is caused to consumers.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a computer heat dissipation module heat sink, includes the bottom plate, still includes: the central tube is fixedly connected to the surface of the bottom plate, a vertical plate is arranged on the outer wall of the central tube in an array mode, and a mounting groove is formed in the side wall of the vertical plate; the cooling liquid tank is fixedly connected to the surface of the bottom plate, the suction pump is fixedly connected to the inner wall of the cooling liquid tank, and the arc-shaped pipe is fixedly connected to the output end of the suction pump; the copper pipes are fixedly connected to the outer walls of the arc-shaped pipes, the copper pipes correspond to the vertical plates one by one, the copper pipes are fixedly connected with the corresponding vertical plates, and the outlet ends of the copper pipes are communicated with the cooling liquid tank; the supporting cylinder is connected with the outer wall of the bottom plate in a threaded manner.
In order to conveniently collect water drops generated in the water cooling and radiating process, preferably, the side wall of the vertical plate is provided with a first groove, the copper pipe is positioned in the first groove, a collecting pipe is fixedly connected in the first groove close to the outlet end of the copper pipe, and the outlet end of the collecting pipe is mutually communicated with the cooling liquid tank.
In order to reduce the phenomenon that the cooling water in the cooling liquid tank flows backwards in the collecting pipe, the collecting pipe is L-shaped.
For conveniently arranging cables, preferably, the surface of the vertical plate is provided with a sliding groove, a sliding block is connected in the sliding groove in a sliding mode, the sliding block is in a T shape, the surface of the sliding block is fixedly connected with a wire clamping ring, the surface of the wire clamping ring is provided with a wire clamping groove and a third groove, and the wire clamping groove is annular.
For conveniently fixing the position of the CPU, preferably, the inner wall of the vertical plate is provided with a second groove, a first rotating rod is rotationally connected to the second groove, the outer wall of the first rotating rod is fixedly connected with a connecting plate, the inner wall of the connecting plate is rotationally connected with a second rotating rod, and the outer wall of the second rotating rod is fixedly connected with a limiting block.
In order to conveniently improve the heat dissipation efficiency of the CPU, preferably, a first heat dissipation groove is formed in a side wall of the vertical plate, and the size of the first heat dissipation groove is smaller than that of the mounting groove.
In order to facilitate air-cooled heat dissipation of the CPU, preferably, the surface of the cooling liquid tank is fixedly connected with a motor, the output end of the motor is fixedly connected with a third rotating rod, the outer wall of the third rotating rod is fixedly connected with fan blades, the outer wall of the supporting cylinder is provided with a second heat dissipation groove, and a dust screen is fixedly connected in the second heat dissipation groove.
In order to facilitate intermittent heat exchange between the hot air flow in the support cylinder and the outside air, the device further comprises: the outer wall of the fourth rotating rod is fixedly connected with a rotating plate, and the surface of the rotating plate is fixedly connected with a second magnetic strip; the connecting strip is fixedly connected to the outer wall of the third rotating rod, the side wall of the connecting strip is fixedly connected with a first magnetic strip, and the magnetism of the first magnetic strip is opposite to that of the second magnetic strip; and the springs are symmetrically and fixedly connected to the side wall of the rotating plate, and one end, far away from the rotating plate, of each spring is fixedly connected with the supporting cylinder.
In order to facilitate cleaning and collecting dust on the dust screen, further, one side of the rotating plate, which is close to the dust screen, is rotationally connected with a fifth rotating rod, the outer wall of the fifth rotating rod is fixedly connected with a rotary table, the surface of the rotary table is fixedly connected with a soft brush, the soft brush is propped against the dust screen, the dust screen is arc-shaped, the arc center of the dust screen coincides with the central shaft of the fourth rotating rod, a scraping plate is fixedly connected with the surface of the rotating plate, a dust guide pipe is arranged on the outer wall array of the supporting cylinder, the dust guide pipe is mutually communicated with a corresponding second radiating groove, and the outer wall of the dust guide pipe is in threaded connection with a dust collecting pipe.
A cooling method of a computer heat dissipation module comprises the following operation steps:
step one: arranging a plurality of CPUs in a computer on a bracket in a circumferential array;
step two: carrying out water-cooling heat dissipation on the support plate contacted with the CPU, and collecting water drops generated in the heat dissipation process;
step three: carrying out air cooling and heat dissipation on the CPU to enable the outside air to intermittently exchange heat with hot air around the CPU;
step four: the air entering the CPU is subjected to dust-proof treatment, and accumulated dust is cleaned regularly.
Compared with the prior art, the invention provides a cooling device for a computer heat dissipation module, which has the following beneficial effects:
1. this computer heat dissipation module heat sink, through with each CPU joint in the mounting groove, rotatory joint board, make stopper mortgage CPU, and then the position of fixed CPU, owing to be circumference array with CPU and arrange, leave the clearance between each CPU, be convenient for dispel the heat, simultaneously, because the copper pipe encircles CPU a week, in the use, start the suction pump and make the coolant liquid in the coolant liquid case flow into copper pipe, can reduce the temperature fast, adopt the water-cooling mode to replace traditional forced air cooling mode heat dissipation, can improve radiating efficiency, external dust has reduced and has got into the normal work that influences CPU in the support section of thick bamboo, the loss is reduced, simultaneously, can realize rapid cooling, be convenient for electronic component's normal work.
2. This computer heat dissipation module heat sink, at the cooling in-process, the drop of water that copper pipe outer wall produced flows into the collecting pipe in from first recess, collects at last in the cooling liquid case, has improved electronic component's life, and simultaneously, when installing CPU, the circuit between each CPU is regular in the card wire casing, is convenient for cable conversion winding displacement direction through the card wire casing of setting, makes things convenient for the maintenance of this device.
3. This computer heat dissipation module heat sink rotates through starting motor drive flabellum, can drive the air current on every side and circulate to improved radiating efficiency, simultaneously, under the mutually supporting effect between first magnetic stripe and second magnetic stripe, thereby constantly open the second heat dissipation groove that corresponds, and then be convenient for the circulation of air current, open the second heat dissipation groove through intermittent type nature mode, when the second heat dissipation groove is opened, the atmospheric pressure in the second heat dissipation groove is great, under the effect of air current, can play certain dust removal effect to the dust screen, be convenient for realize the self-cleaning function of dust screen.
4. This computer heat dissipation module heat sink drives the soft brush through the rotating plate and constantly brushes the dust screen to be convenient for further clear up the accumulated dust on the dust screen, simultaneously, the scraper blade scrapes the dust that falls in the second heat dissipation inslot to leading in the dirt pipe, collects in the dirt pipe at last, after using a period, when maintaining this device, only need rotatory dirt pipe can take out the dirt pipe, thereby the dust of collecting in the clearance dirt pipe of being convenient for.
Drawings
FIG. 1 is a schematic diagram of a cooling device for a heat sink module of a computer according to the present invention;
FIG. 2 is a schematic diagram of a portion of a cooling device of a heat sink module of a computer according to the present invention;
FIG. 3 is an enlarged schematic view of the structure of the cooling device of the computer heat dissipation module shown in FIG. 2;
FIG. 4 is a schematic diagram of a portion of a cooling device of a heat dissipation module of a computer according to the present invention;
FIG. 5 is a schematic view of a support cylinder in a cooling device of a heat sink module of a computer according to the present invention;
FIG. 6 is an enlarged schematic view of the structure of the cooling device of the computer heat dissipation module shown in FIG. 5;
fig. 7 is a schematic diagram of a portion of a cooling device of a heat dissipation module of a computer according to the present invention.
In the figure: 1. a bottom plate; 101. a central tube; 102. a vertical plate; 103. a mounting groove; 104. a cooling liquid tank; 105. a suction pump; 106. copper pipe; 107. an arc tube; 108. a first groove; 109. a collection pipe; 2. a second groove; 201. a splice plate; 202. a limiting block; 203. a first rotating lever; 204. a second rotating rod; 205. a first heat sink; 206. a support cylinder; 3. a motor; 301. a third rotating rod; 302. a fan blade; 303. a second heat sink; 304. a dust screen; 305. a connecting strip; 306. a first magnetic stripe; 307. a fourth rotating lever; 308. a rotating plate; 309. a second magnetic stripe; 4. a spring; 401. a fifth rotating lever; 402. a soft brush; 403. a scraper; 404. a dust guide pipe; 405. a dust collecting pipe; 406. a turntable; 5. a chute; 501. a slide block; 502. a wire clamping ring; 503. wire clamping groove; 504. and a third groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Example 1:
referring to fig. 1 to 3, a cooling device for a computer heat dissipation module includes a base plate 1, because in the prior art, in order to improve the computing capability of a computer, clusters are often implemented by adopting a cluster, the clusters are connected by a group of loosely integrated computer software and/or hardware to highly tightly cooperate to complete computing work, and single computers in the cluster system are often called nodes and are usually connected by a local area network, because CPUs are relatively concentrated, heat generated during working is relatively large, and in order to ensure normal working of each CPU, the cooling device for a computer heat dissipation module further includes: the central tube 101 is fixedly connected to the surface of the bottom plate 1, the outer wall of the central tube 101 is provided with a vertical plate 102 in an array manner, and the side wall of the vertical plate 102 is provided with a mounting groove 103; the cooling liquid box 104 is fixedly connected to the surface of the bottom plate 1, the suction pump 105 is fixedly connected to the inner wall of the cooling liquid box 104, and the arc-shaped pipe 107 is fixedly connected to the output end of the suction pump 105; copper pipes 106 fixedly connected to the outer walls of the arc-shaped pipes 107, the copper pipes 106 are in one-to-one correspondence with the vertical plates 102, the copper pipes 106 are fixedly connected with the corresponding vertical plates 102, and the outlet ends of the copper pipes 106 are communicated with the cooling liquid tank 104; a support cylinder 206 screwed to the outer wall of the base plate 1.
It should be noted that, referring to fig. 2-3, the inner wall of the vertical plate 102 is provided with a second groove 2, the second groove 2 is rotationally connected with a first rotating rod 203, the outer wall of the first rotating rod 203 is fixedly connected with a connecting plate 201, the inner wall of the connecting plate 201 is rotationally connected with a second rotating rod 204, and the outer wall of the second rotating rod 204 is fixedly connected with a limiting block 202.
In this embodiment, the first rotating rod 203 and the second rotating rod 204 have a certain resistance, and the first rotating rod 203 and the second rotating rod 204 can only rotate under the assistance of an external force.
When the cooling device is used, each CPU is clamped in the mounting groove 103, the connecting plate 201 is rotated by taking the first rotating rod 203 as the center, then the limiting block 202 is rotated by taking the second rotating rod 204 as the center, so that the limiting block 202 mortgage the CPUs, and further the positions of the CPUs are fixed.
Because the cooling liquid is easy to condense water drops on the outer wall of the copper tube 106 in the process of passing heat on the CPU in the copper tube 106, and the service life of the electronic component is easy to be influenced by the water drops, referring to FIGS. 1-3, the side wall of the vertical plate 102 is provided with a first groove 108, the copper tube 106 is positioned in the first groove 108, a collecting tube 109 is fixedly connected in the first groove 108 close to the outlet end of the copper tube 106, and the outlet end of the collecting tube 109 is mutually communicated with the cooling liquid tank 104.
During the cooling process, water drops generated by the outer wall of the copper tube 106 flow into the collecting tube 109 from the first groove 108 and are finally collected in the cooling liquid tank 104, so that the service life of the electronic component is prolonged.
In order to reduce the occurrence of backflow of the cooling water in the cooling liquid tank 104 in the collecting pipe 109, referring to fig. 1, the collecting pipe 109 has an L-shape.
Example 2:
referring to fig. 4-5, substantially the same as example 1, further, a specific embodiment for conveniently organizing cables was added.
Because the circuit of the computer cluster is complicated, if the circuit is not regular, the maintenance of the computer is easily affected by the disordered cables, therefore, referring to fig. 4-5, the surface of the vertical plate 102 is provided with a sliding groove 5, a sliding block 501 is slidably connected in the sliding groove 5, the sliding block 501 is in a T shape, the surface of the sliding block 501 is fixedly connected with a wire clamping ring 502, the surface of the wire clamping ring 502 is provided with a wire clamping groove 503 and a third groove 504, the wire clamping groove 503 is in a ring shape, the circuits among the CPUs are regular in the wire clamping grooves 503, and the cable is convenient to switch the wire arrangement direction through the arranged wire clamping grooves 503, so that the maintenance of the device is convenient.
Example 3:
referring to fig. 4 to 7, substantially the same as in example 2, further, a specific embodiment for improving heat dissipation efficiency was added.
Referring to fig. 4, the side wall of the vertical plate 102 is provided with a first heat dissipation groove 205, the size of the first heat dissipation groove 205 is smaller than that of the mounting groove 103, and the contact area between the CPU and the outside air is conveniently increased through the arranged first heat dissipation groove 205, so that the heat dissipation efficiency is improved.
Referring to fig. 4-5, a motor 3 is fixedly connected to the surface of the cooling liquid tank 104, a third rotating rod 301 is fixedly connected to the output end of the motor 3, fan blades 302 are fixedly connected to the outer wall of the third rotating rod 301, a second heat dissipation groove 303 is formed in the outer wall of the supporting cylinder 206, and a dust screen 304 is fixedly connected to the inside of the second heat dissipation groove 303.
Referring to fig. 5-7, the cooling device of the heat dissipation module of the computer further includes: the fourth rotating rod 307 is rotatably connected in the second heat dissipation groove 303, the outer wall of the fourth rotating rod 307 is fixedly connected with a rotating plate 308, and the surface of the rotating plate 308 is fixedly connected with a second magnetic stripe 309; the connecting strip 305 is fixedly connected to the outer wall of the third rotating rod 301, the first magnetic strip 306 is fixedly connected to the side wall of the connecting strip 305, and the magnetism of the first magnetic strip 306 is opposite to that of the second magnetic strip 309; and springs 4 symmetrically and fixedly connected to the side walls of the rotating plate 308, and one end of each spring 4 away from the rotating plate 308 is fixedly connected with the supporting cylinder 206.
When the dustproof mesh 304 is used, the motor 3 is started to drive the third rotating rod 301 to rotate, the third rotating rod 301 drives the fan blades 302 to rotate, the fan blades 302 drive surrounding air flow to circulate, and therefore heat dissipation efficiency is improved, meanwhile, the third rotating rod 301 drives the connecting strip 305 to rotate, when the first magnetic strip 306 is in contact with the corresponding second magnetic strip 309, the connecting strip 305 drives the corresponding rotating plate 308 to rotate around the fourth rotating rod 307, under the action of the spring 4, when the first magnetic strip 306 is separated from the corresponding second magnetic strip 309, the rotating plate 308 returns to the original position, and accordingly the corresponding second heat dissipation groove 303 is continuously opened, circulation of air flow is facilitated, and due to the fact that the second heat dissipation groove 303 is intermittently opened, air pressure in the second heat dissipation groove 303 is larger, a certain dust removal effect can be achieved on the dustproof mesh 304 under the action of the air flow, and self-cleaning function of the dustproof mesh 304 is facilitated.
Example 4:
referring to fig. 5-7, substantially the same as example 3, further embodiments are added to facilitate cleaning and collection of dust on the dust screen 304.
Referring to fig. 5-7, a fifth rotating rod 401 is rotatably connected to one side of the rotating plate 308, which is close to the dust screen 304, a turntable 406 is fixedly connected to the outer wall of the fifth rotating rod 401, a soft brush 402 is fixedly connected to the surface of the turntable 406, the soft brush 402 abuts against the dust screen 304, the dust screen 304 is arc-shaped, the arc center of the dust screen 304 coincides with the central axis of the fourth rotating rod 307, a scraping plate 403 is fixedly connected to the surface of the rotating plate 308, a dust guide pipe 404 is arranged on the outer wall of the supporting cylinder 206 in an array, the dust guide pipe 404 is mutually communicated with the corresponding second heat dissipation groove 303, and a dust collecting pipe 405 is connected to the outer wall of the dust guide pipe 404 in a threaded manner.
The rotating plate 308 continuously brushes the dust screen 304 in the rotating process, so that accumulated dust on the dust screen 304 is further cleaned, meanwhile, the scraping plate 403 scrapes the dust falling into the second heat dissipation groove 303 into the dust guide pipe 404, and finally the dust is collected in the dust collection pipe 405, and when the device is maintained after being used for a period of time, the dust collection pipe 405 can be taken out only by rotating the dust collection pipe 405, so that the dust collected in the dust collection pipe 405 is cleaned conveniently.
A cooling method of a computer heat dissipation module comprises the following operation steps:
step one: arranging a plurality of CPUs in a computer on a bracket in a circumferential array;
step two: carrying out water-cooling heat dissipation on the support plate contacted with the CPU, and collecting water drops generated in the heat dissipation process;
step three: carrying out air cooling and heat dissipation on the CPU to enable the outside air to intermittently exchange heat with hot air around the CPU;
step four: the air entering the CPU is subjected to dust-proof treatment, and accumulated dust is cleaned regularly.
The working principle of the invention is as follows:
when in use, each CPU is clamped in the mounting groove 103, the joint plate 201 is rotated by taking the first rotating rod 203 as the center, then the limiting block 202 is rotated by taking the second rotating rod 204 as the center, so that the limiting block 202 mortgage the CPU, the position of the CPU is further fixed, the circuits among the CPUs are orderly arranged in the wire clamping groove 503, and the wire arrangement direction is conveniently converted by the arranged wire clamping groove 503;
starting a suction pump 105 to enable the cooling liquid in the cooling liquid tank 104 to flow into the copper pipe 106, and finally collecting the cooling liquid in the cooling liquid tank 104, wherein the copper pipe 106 surrounds the CPU for a circle, so that the temperature can be quickly reduced, and meanwhile, water drops generated by the outer wall of the copper pipe 106 flow into the collecting pipe 109 from the first groove 108, and finally are collected in the cooling liquid tank 104;
the third rotating rod 301 is driven by the starting motor 3 to rotate, the third rotating rod 301 drives the fan blade 302 to rotate, surrounding air flows are driven by the fan blade 302 to circulate, meanwhile, the third rotating rod 301 drives the connecting strip 305 to rotate, when the first magnetic strip 306 is in contact with the corresponding second magnetic strip 309, the connecting strip 305 drives the corresponding rotating plate 308 to rotate around the fourth rotating rod 307, under the action of the spring 4, when the first magnetic strip 306 is separated from the corresponding second magnetic strip 309, the rotating plate 308 returns to the original position, so that the corresponding second heat dissipation groove 303 is continuously opened, the circulation of air flows is facilitated, and due to the fact that the second heat dissipation groove 303 is intermittently opened, air pressure in the second heat dissipation groove 303 is large, a certain dust removing effect can be achieved on the dust-proof net 304 under the action of the air flows, and the dust-proof function of the dust-proof net 304 is conveniently realized;
the rotating plate 308 continuously brushes the dust screen 304 in the rotating process, so that accumulated dust on the dust screen 304 is further cleaned, meanwhile, the scraping plate 403 scrapes the dust falling into the second heat dissipation groove 303 into the dust guide pipe 404, and finally the dust is collected in the dust collection pipe 405, and when the device is maintained after being used for a period of time, the dust collection pipe 405 can be taken out only by rotating the dust collection pipe 405, so that the dust collected in the dust collection pipe 405 is cleaned conveniently.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art who is skilled in the art to which the present invention pertains should make equivalent substitutions or modifications according to the technical scheme and the inventive concept disclosed herein, and should be covered by the scope of the present invention.
Claims (10)
1. The utility model provides a computer heat dissipation module heat sink, includes bottom plate (1), its characterized in that still includes:
the central tube (101) is fixedly connected to the surface of the bottom plate (1), a vertical plate (102) is arranged on the outer wall of the central tube (101), and a mounting groove (103) is formed in the side wall of the vertical plate (102);
the cooling liquid box (104) is fixedly connected to the surface of the bottom plate (1), the suction pump (105) is fixedly connected to the inner wall of the cooling liquid box (104), and the arc-shaped pipe (107) is fixedly connected to the output end of the suction pump (105);
the copper pipes (106) are fixedly connected to the outer walls of the arc-shaped pipes (107), the copper pipes (106) are in one-to-one correspondence with the vertical plates (102), the copper pipes (106) are fixedly connected with the corresponding vertical plates (102), and the outlet ends of the copper pipes (106) are communicated with the cooling liquid tank (104);
and the support cylinder (206) is connected to the outer wall of the bottom plate (1) in a threaded manner.
2. The cooling device for the computer heat dissipation module according to claim 1, wherein a first groove (108) is formed in the side wall of the vertical plate (102), the copper pipe (106) is located in the first groove (108), a collecting pipe (109) is fixedly connected in the first groove (108) close to the outlet end of the copper pipe (106), and the outlet end of the collecting pipe (109) is mutually communicated with the cooling liquid tank (104).
3. A cooling device for a heat sink module of a computer according to claim 2, characterized in that the collecting pipe (109) is L-shaped.
4. The cooling device for the computer heat dissipation module according to claim 1, wherein a chute (5) is formed in the surface of the vertical plate (102), a sliding block (501) is connected in a sliding manner in the chute (5), the sliding block (501) is in a T shape, a wire clamping ring (502) is fixedly connected to the surface of the sliding block (501), a wire clamping groove (503) and a third groove (504) are formed in the surface of the wire clamping ring (502), and the wire clamping groove (503) is in a ring shape.
5. The cooling device for the computer heat dissipation module according to claim 1, wherein a second groove (2) is formed in the inner wall of the vertical plate (102), a first rotating rod (203) is rotationally connected to the second groove (2), a connecting plate (201) is fixedly connected to the outer wall of the first rotating rod (203), a second rotating rod (204) is rotationally connected to the inner wall of the connecting plate (201), and a limiting block (202) is fixedly connected to the outer wall of the second rotating rod (204).
6. The cooling device for a computer heat dissipation module according to claim 1, wherein a first heat dissipation groove (205) is formed on a side wall of the vertical plate (102), and the size of the first heat dissipation groove (205) is smaller than that of the mounting groove (103).
7. The cooling device for the computer heat dissipation module according to claim 1, wherein a motor (3) is fixedly connected to the surface of the cooling liquid tank (104), a third rotating rod (301) is fixedly connected to the output end of the motor (3), a fan blade (302) is fixedly connected to the outer wall of the third rotating rod (301), a second heat dissipation groove (303) is formed in the outer wall of the support cylinder (206), and a dust screen (304) is fixedly connected to the second heat dissipation groove (303).
8. The computer heat sink of claim 7, further comprising:
a fourth rotating rod (307) rotatably connected in the second heat dissipation groove (303), a rotating plate (308) is fixedly connected to the outer wall of the fourth rotating rod (307), and a second magnetic stripe (309) is fixedly connected to the surface of the rotating plate (308);
the connecting strip (305) is fixedly connected to the outer wall of the third rotating rod (301), a first magnetic strip (306) is fixedly connected to the side wall of the connecting strip (305), and the magnetism of the first magnetic strip (306) is opposite to that of the second magnetic strip (309);
and the springs (4) are symmetrically and fixedly connected to the side walls of the rotating plate (308), and one ends of the springs (4) away from the rotating plate (308) are fixedly connected with the supporting cylinder (206).
9. The cooling device for a computer heat dissipation module according to claim 8, wherein a fifth rotating rod (401) is rotatably connected to one side of the rotating plate (308) close to the dust screen (304), a rotating disc (406) is fixedly connected to the outer wall of the fifth rotating rod (401), a soft brush (402) is fixedly connected to the surface of the rotating disc (406), the soft brush (402) abuts against the dust screen (304), the dust screen (304) is arc-shaped, the arc center of the dust screen (304) coincides with the central axis of the fourth rotating rod (307),
the surface of the rotating plate (308) is fixedly connected with a scraping plate (403), a dust guide pipe (404) is arranged on the outer wall array of the supporting cylinder (206), the dust guide pipe (404) is mutually communicated with a corresponding second heat dissipation groove (303), and a dust collection pipe (405) is connected with the outer wall of the dust guide pipe (404) in a threaded manner.
10. A cooling method for a computer heat dissipation module, adopting the cooling device for the computer heat dissipation module according to any one of claims 1-9, characterized by comprising the following operation steps:
step one: arranging a plurality of CPUs in a computer on a bracket in a circumferential array;
step two: carrying out water cooling on the support plate contacted with the CPU, and collecting water drops generated in the water cooling and heat radiating process;
step three: carrying out air cooling and heat dissipation on the CPU to enable the outside air to intermittently exchange heat with hot air around the CPU;
step four: the air entering the CPU is subjected to dust-proof treatment, and accumulated dust is cleaned regularly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310020131.5A CN116009668A (en) | 2023-01-06 | 2023-01-06 | Cooling device and cooling method for computer heat dissipation module |
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| CN202310020131.5A CN116009668A (en) | 2023-01-06 | 2023-01-06 | Cooling device and cooling method for computer heat dissipation module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117620138A (en) * | 2024-01-25 | 2024-03-01 | 三明市蓝天机械制造有限公司 | Steel casting forming device |
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- 2023-01-06 CN CN202310020131.5A patent/CN116009668A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117620138A (en) * | 2024-01-25 | 2024-03-01 | 三明市蓝天机械制造有限公司 | Steel casting forming device |
| CN117620138B (en) * | 2024-01-25 | 2024-03-29 | 三明市蓝天机械制造有限公司 | Steel casting forming device |
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