CN116009665A - Fan assembly and computing device - Google Patents

Abstract

Embodiments of the present application provide a fan assembly and computing device, relating to the technical field of fans. The fan assembly includes a first housing, a fan structure, a second housing, and a waveguide plate. The first frame body is connected with the second frame body in a matched mode so as to enclose a fan accommodating cavity, and the fan structure is arranged in the fan accommodating cavity. The fan structure comprises a fan main body and fan blades, wherein the fan blades are rotationally connected with the fan main body, and the fan main body is connected with the first frame body and the second frame body. The first frame body comprises a first panel, and a first air inlet is formed in the first panel. The second frame body comprises a second panel, and the second panel is provided with a first air outlet. The fan blade is used for driving air to flow to the first air outlet through the first air inlet. The first air inlet is communicated along a first direction, and the waveguide plate is embedded into the first air inlet along the first direction. According to the embodiment of the application, the waveguide plate is embedded into the first air inlet along the first direction, so that the occupied space of the fan assembly can be reduced, and the space utilization rate in the computing equipment is improved.

Description

Fan assembly and computing device

Technical Field

Embodiments of the present application relate to the field of fans, and more particularly, to a fan assembly and a computing device.

Background

Computing devices often include a fan assembly that may be used to dissipate heat from a processing chip within the computing device. However, the space usage of fan assemblies within a computing device is often large, affecting space utilization within the computing device.

Disclosure of Invention

Embodiments of the present application provide a fan assembly and a computing device for reducing the space occupied by the fan assembly in the computing device and improving the space utilization in the computing device.

In order to achieve the above object, the following technical scheme is provided:

in one aspect, embodiments of the present application provide a fan assembly. The fan assembly includes a first housing, a fan structure, a second housing, and a waveguide plate. The first frame body is connected with the second frame body in a matched mode so as to enclose a fan accommodating cavity, and the fan structure is arranged in the fan accommodating cavity. The fan structure comprises a fan main body and fan blades, wherein the fan blades are rotationally connected with the fan main body, and the fan main body is connected with the first frame body and the second frame body. The first frame body comprises a first panel, and a first air inlet is formed in the first panel. The second frame body comprises a second panel, and the second panel is provided with a first air outlet. The fan blade is used for driving air to flow to the first air outlet through the first air inlet. The first air inlet is communicated along a first direction, and the waveguide plate is embedded into the first air inlet along the first direction.

In the embodiment of the application, install fan structure in the fan that first framework and second framework enclose and hold the intracavity, can play and keep apart the effect between fan structure and the other parts (for example cable) in the computing equipment, reduce the risk of taking place to scratch between fan structure and cable or other foreign matter, improve fan assembly's reliability in use.

And, set up flabellum and fan main part and rotate to be connected for the flabellum can drive the air and flow to first air outlet via first air intake, thereby makes the fan subassembly can realize the heat dissipation to electronic component (for example handles the chip). In addition, set up fan main part and first framework and second framework and link to each other, reduced the fan main part and taken place the risk of rocking or even squinting with respect to first framework and second framework, improved the operational reliability of fan subassembly.

It can be appreciated that the waveguide plate can be embedded in the first air inlet along the first direction, so that the fan structure can drive air to pass through the waveguide plate and flow to the first air outlet, so that the waveguide plate can straighten the disordered air inlet flow, disturbance of the air inlet side flow of the fan assembly is reduced, influence of the disturbance of the air inlet flow on electronic devices (such as a mechanical hard disk) is reduced, and the read-write speed and the read-write accuracy of the mechanical hard disk are improved, so that the data processing speed and accuracy of the computing equipment are improved. In addition, the waveguide plate can also function as a uniform air flow, so that noise of the fan assembly can be reduced.

And, set up the waveguide board and can embed in first air intake along first direction for the waveguide board can be integrated with first framework, need not to hang the waveguide board in fan framework (for example first framework) one side that keeps away from fan structure. That is, the waveguide plate is disposed to be embedded in the first air inlet along the first direction, and there may be a spatial overlap between the waveguide plate and the first panel along the first direction, so as to reduce the occupied space of the waveguide plate along the first direction, thereby reducing the thickness of the fan assembly along the first direction, reducing the volume of the fan assembly, and improving the space utilization in the computing device.

In addition, the waveguide plate can be embedded into the first air inlet, edge wrapping and other treatments are not needed for the waveguide plate, and cost of the waveguide plate is reduced, so that cost of the fan assembly is reduced.

And moreover, the waveguide plate can be embedded into the first air inlet, so that one fan structure can correspond to one waveguide plate, the length of the waveguide plate along the second direction (the direction intersecting with the first direction) is reduced, and the installation convenience of the waveguide plate is improved.

In some embodiments, the fan assembly further comprises a stop plate located between the waveguide plate and the fan body. The limiting plate is connected with the first frame body to limit the displacement of the waveguide plate in the direction approaching the fan main body. The setting like this for the limiting plate can play the effect of restriction to the displacement that the waveguide plate was close to fan main part direction, reduces the waveguide plate and removes to the direction that is close to the fan main part, causes the risk that the waveguide plate drops from first air intake, improves fan assembly's reliability in use. And set up the limiting plate between waveguide plate and fan main part for the limiting plate can keep apart waveguide plate and fan main part's flabellum, thereby plays the effect of protection waveguide plate, reduces the flabellum and rotates the risk that leads to waveguide plate to be scratched, has improved fan assembly's reliability in use.

In some embodiments, the limiting plate is provided with a second air inlet, and the second air inlet is communicated with the first air inlet. The arrangement enables air to flow to the first air outlet through the first air inlet and the second air inlet under the driving of the fan blades, the influence of the limiting plate on the air flow is reduced, and the air inlet quantity of the fan assembly is improved.

In some embodiments, the first panel further has a first connection hole, and the fan body has a second connection hole. The fan assembly also includes a first shock absorbing connector. The first shock absorbing connecting piece comprises a first connecting part, a second connecting part and a first buffer part. One end of the first buffer part is connected with the end part of the first connecting part, and the other end of the first buffer part is connected with the end part of the second connecting part. The first connecting portion is used for being embedded into the first connecting hole, and the second connecting portion is used for being embedded into the second connecting hole. The first buffer part is positioned between the first panel and the fan main body along the first direction, so that a first gap is formed between the first panel and the fan main body along the first direction, and at least one part of the limiting plate is positioned in the first gap. So set up for fan main part and first framework can link to each other through first shock attenuation connecting piece, have improved the connection convenience between fan main part and the first framework. And when first connecting portion imbeds in first connecting hole, second connecting portion imbeds in the second connecting hole, first buffer portion can be located along first direction between first panel and the fan main part (for example the fan casing of fan main part) to make first buffer portion can play the effect of absorption and buffering to the vibration of fan casing, also be so that first shock attenuation connecting piece can play the absorbing effect, reduce the influence that the vibration of fan casing led to the fact to first framework, also reduced the influence that the rotation of flabellum led to the fact mechanical hard disk, improve the read-write speed and the read-write accuracy of mechanical hard disk. In addition, at least a portion of the limiting plate may be located within the first gap, that is, at least a portion of the limiting plate may have a spatial overlap between the first buffer portion and the first direction, reducing an occupied space of the limiting plate along the first direction, thereby reducing a thickness of the fan assembly along the first direction, reducing a volume of the fan assembly, and improving a space utilization within the computing device.

In some embodiments, the first panel includes a folded structure that bends and extends away from the limiting plate to enclose the first air inlet. The outer periphery of the waveguide plate is abutted with the inner periphery of the flanging structure so as to be embedded into the first air inlet. So set up for the hem structure can play the effect of holding the waveguide board, is that the effect that makes the hem structure can play the protection to the waveguide board promptly, reduces the waveguide board and is scraped by cable or other foreign matter in the computing equipment and rub, cause the risk of waveguide board damage, improves fan assembly's reliability in use.

In some embodiments, the fan assembly further comprises a first air inlet grille. The first air inlet grille is positioned on one side of the waveguide plate, which is far away from the limiting plate, and is connected with the flanging structure so as to limit the displacement of the waveguide plate in the direction far away from the fan main body. So set up for first air inlet grille can play spacing effect to the displacement that the fan main part direction was kept away from to the waveguide board, reduces the waveguide board to the direction removal of keeping away from the fan main part, leads to the waveguide board to drop from first air intake risk, has improved fan assembly's reliability in use. And, first air inlet grille can also keep apart between waveguide board and the other parts (for example cable) in the computing equipment, plays the effect of protection waveguide board, reduces waveguide board by cable or other foreign matter scratch, causes the risk of waveguide board damage, has prolonged waveguide board's life.

In some embodiments, the fan assembly further comprises an air outlet grille connected to an edge of the first air outlet. By the arrangement, the air outlet grille can isolate the fan structure from other parts (such as cables) in the computing equipment, the risk of scratch between the fan structure and the cables or other foreign matters is reduced, and the use reliability of the fan assembly is improved.

In some embodiments, the surface of the waveguide plate on the side near the limiting plate is flush with the surface of the first panel on the side near the limiting plate; and/or the surface of the waveguide plate, which is far away from the limiting plate, is flush with the surface of the first panel, which is far away from the limiting plate. So set up, can improve the regularity after the waveguide board imbeds in first air intake, be convenient for limiting plate and first framework are connected, have improved fan assembly's installation convenience. And, can also be convenient for first air inlet grille and hem structure keep away from the tip of limiting plate and link to each other, improve the processing convenience of first framework.

In some embodiments, the fan assembly further comprises a fan frame base, the fan frame base encloses a fan frame accommodating cavity, the first frame and the second frame are both located in the fan frame accommodating cavity, and at least one of the first frame and the second frame is detachably connected with the fan frame base. The fan frame base includes the base panel, and the third air intake has been seted up to the base panel, and third air intake and first air intake intercommunication. The flanging structure is embedded in the third air inlet. It can be appreciated that setting up first framework and second framework all in the fan frame holds the intracavity for fan frame base can hold the effect that the fan structure of intracavity was held to first framework, second framework and being located the fan. And, set up fan frame base and be connected with at least one dismantlement in first framework and the second framework, be convenient for maintenance and the change etc. of fan subassembly, improved fan subassembly's use convenience. Through offer the third air intake on base panel to third air intake and first air intake intercommunication make the air can flow to first air outlet via third air intake and first air intake, reduced the base panel and blocked that the air caused, improved fan assembly's intake. The arrangement of the flanging structure can be embedded into the third air inlet, so that space overlapping can exist between the flanging structure and the base panel in the first direction, the occupied space of the base panel along the first direction is reduced, the thickness of the fan assembly along the first direction is reduced, the size of the fan assembly is reduced, and the space utilization rate in the computing equipment is improved.

In some embodiments, the fan frame base includes a base side plate having a first recess in which at least a portion of an edge of the first panel is embedded. So set up for first framework can with fan frame base joint, improved the connection reliability between first framework and the fan frame base.

In some embodiments, the first frame further includes a heat-fusible column, and the heat-fusible column is located on a side of the first panel near the limiting plate and is connected to the first panel. And the limiting plate is provided with a limiting hole, and the hot-melting column is used for penetrating through the limiting hole so as to be matched with the limiting hole after the end part of the hot-melting column, which is far away from the first panel, is hot-melted and solidified, so that the displacement of the limiting plate is limited. So set up for the hot melt post can cooperate with spacing hole, thereby play spacing effect to the displacement of limiting plate, reduce the limiting plate and take place the skew for first panel and drop even risk, improve fan assembly's reliability in use. And, adopt the hot melt post to keep away from the tip hot melt of first panel and solidify the back with spacing hole complex mode, restrict the displacement of limiting plate, need not complicated mechanical structure, simplified the structure of first framework, reduce the cost of first framework.

In some embodiments, the limiting plate is clamped with the first frame body. So set up, can realize the instrument installation of exempting from between limiting plate and the first framework to improve the installation convenience between limiting plate and the first framework.

In some embodiments, the first frame further comprises a first side plate and a second side plate. The first side plate and the second side plate are positioned on the same side of the first panel and are oppositely arranged. The first side plate is connected with one side edge of the first panel, and the second side plate is connected with one side edge of the first panel, which is far away from the first side plate. The first side plate comprises a first clamping part, and the limiting plate comprises a second clamping part, wherein the second clamping part is used for being clamped with the first clamping part. And/or the second side plate comprises a third clamping part, the limiting plate comprises a fourth clamping part, and the fourth clamping part is used for being clamped with the third clamping part. So set up for the limiting plate can link to each other with first framework through the mode of joint, has improved the connection convenience between limiting plate and the first framework.

In some embodiments, the number of fan structures is at least two, the at least two fan structures being arranged along the second direction. The second direction intersects the first direction. The number of the fan structures is at least two, and the air output of the fan assembly can be improved, so that the heat dissipation effect of the fan assembly on the processing chip is improved. And, set up at least two fan structures and arrange along the second direction, can reduce fan assembly and follow the occupation space of first direction to make fan assembly can dispel the heat to the processing chip of different positions department, improve fan assembly's heat dispersion.

In some embodiments, the waveguide plate is provided with a plurality of waveguide holes, the waveguide holes penetrating in a first direction. The arrangement is that the air can pass through the waveguide hole along the first direction under the driving action of the fan structure, so that the waveguide hole can straighten the disordered air flow, the influence of the air flow disturbance on the mechanical hard disk is reduced, and the read-write speed and the read-write accuracy of the mechanical hard disk are improved. In addition, the waveguide aperture can also function as a uniform air flow, thereby reducing noise of the fan assembly.

In another aspect, embodiments of the present application provide a computing device. The computing device includes electronics and a fan assembly as described above, the electronics being located on an air intake side of the fan assembly.

The computing device provided by the embodiment of the application includes the fan assembly as described above, so that all the above beneficial effects are provided, and will not be described herein.

It can be appreciated that the electronic device is arranged on the air inlet side of the fan assembly, so that the distance between the fan assembly and the processing chip on the air outlet side of the fan assembly can be reduced, and the heat dissipation effect of the fan assembly on the processing chip can be improved.

In some embodiments, the electronic device comprises a mechanical hard disk. By the arrangement, the influence of disturbance of the air inlet flow on the mechanical hard disk can be reduced, and the read-write speed and the read-write accuracy of the mechanical hard disk are improved, so that the data processing speed and accuracy of the computing equipment are improved.

Drawings

For a clearer description of the technical solutions in the present application, the drawings that need to be used in some embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only drawings of some embodiments of the present application, and other drawings may be obtained according to these drawings for a person of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. according to the embodiments of the present application.

FIG. 1 is a block diagram of a computing device provided in some embodiments of the present application;

FIG. 2A is a block diagram of a waveguide plate provided in some embodiments of the present application;

FIG. 2B is a diagram illustrating a relationship between a waveguide plate and a fan housing according to some embodiments of the present disclosure;

FIG. 2C is a diagram illustrating a relationship between a waveguide plate and a fan frame base according to some embodiments of the present disclosure;

FIG. 3A is a block diagram of a fan assembly provided in some embodiments of the present application;

FIG. 3B is an exploded view of the fan assembly of FIG. 3A;

FIG. 4A is a block diagram of a first frame at a first angle according to some embodiments of the present application;

FIG. 4B is a block diagram of a first frame at a second angle according to some embodiments of the present application;

FIG. 4C is a block diagram of a second frame provided in some embodiments of the present application;

FIG. 5 is a block diagram of a fan structure provided in some embodiments of the present application;

FIG. 6 is a block diagram of a first shock absorbing connector provided in some embodiments of the present application;

fig. 7A is a diagram illustrating a positional relationship between a waveguide plate and a first air inlet according to some embodiments of the present disclosure;

FIG. 7B is a diagram illustrating a relationship between a waveguide plate and a first air inlet according to other embodiments of the present disclosure;

FIG. 7C is a diagram illustrating a relationship between a waveguide plate and a first air inlet according to still other embodiments of the present disclosure;

FIG. 8A is a block diagram of a fan frame base provided in some embodiments of the present application;

FIG. 8B is a diagram of a positional relationship between a fan frame assembly and a first and second frame provided in some embodiments of the present application;

FIG. 8C isbase:Sub>A cross-sectional view of FIG. 3A along the direction A-A;

FIG. 8D is an enlarged view of a portion of region P of FIG. 8C;

fig. 9 is a block diagram of a limiting plate according to some embodiments of the present application.

Detailed Description

The following description of some embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided herein are within the scope of the present application.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "example embodiment", "example", "specific example", or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic related to the embodiment or example is included in at least one embodiment or example of the present application. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

FIG. 1 is a block diagram of a computing device provided in some embodiments of the present application.

As shown in FIG. 1, in some examples, embodiments of the present application provide a computing device 200. It is understood that the computing device 200 may be an electronic device having processing, computing, and communication functions. In some examples, computing device 200 may be a server, a switch, a computer, a repeater, or the like. Embodiments of the present application do not further limit the variety of computing devices 200.

In some examples, as shown in fig. 1, computing device 200 may include a housing 201, a motherboard (not shown), and a plurality of electronic components 210. For example, the housing 201 may enclose an accommodating space, and the motherboard and the plurality of electronic components 210 may be located in the accommodating space. In some examples, the motherboard may include a printed circuit board (english full name: printed Circuit Board, english abbreviation: PCB), and the plurality of electronic components 210 may be electrically connected to the printed circuit board, respectively.

In some examples, as shown in fig. 1, the plurality of electronic components 210 may include an electronic device 202, a memory bank 203, and a processing chip 204. In some examples, the plurality of electronic components 210 may also include a board card or the like (not shown).

By way of example, the electronic device 202 may include a Hard Disk such as a mechanical Hard Disk (Hard Disk Drive, english acronym: HDD), a solid state Disk (Solid State Drives, SSD), a hybrid Hard Disk (Hybrid Hard Drive, HHD), and the like.

It will be appreciated that the hard disk and memory bank 203 may be used to store data, and the processing chip 204 may be used to process and calculate data, etc. In some examples, the processing chip 204 may include a central processing unit (full english: central Processing Unit, abbreviated english: CPU) or a graphics processor (full english: graphics Processing Unit, abbreviated english: GPU) or the like.

It will be appreciated that the electronic device 202 and the memory stick 203 may be electrically connected to the processing chip 204 through a motherboard, respectively, such that data can be transferred not only between the electronic device 202 and the processing chip 204, but also between the memory stick 203 and the processing chip 204.

In some examples, as shown in fig. 1, the number of processing chips 204 may be two, and the two processing chips 204 may be arranged at intervals along the second direction X. The number of the memory banks 203 may be plural, and the plural memory banks 203 may be disposed at intervals and may be located at two sides of the processing chip 204 along the second direction X. The number of electronic devices 202 may be a first or more. For example, as shown in fig. 1, the electronic device 202 may be located on one side of the processing chip 204 and the memory bank 203 along the first direction Y.

For example, the second direction X may intersect the first direction Y. In some examples, the second direction X may be perpendicular or approximately perpendicular to the first direction Y.

It will be appreciated that the processing chip 204 may generate a significant amount of heat during operation. To dissipate heat from the processing chip 204, reducing the risk that the processing chip 204 will not function properly due to excessive temperatures, in some examples, as shown in FIG. 1, the computing device 200 may also include a Fan assembly 100 (English name: fan).

It will be appreciated that the fan assembly 100 may function to drive the flow of air. In some examples, the fan assembly 100 may include a fan housing that may enclose a fan containment cavity and a fan structure that may be mounted within the fan containment cavity such that the fan housing may function to protect the fan structure.

In some examples, the fan structure may include a fan body and blades that may be rotatably coupled to the fan body to drive air through an inlet side of the fan assembly 100 to an outlet side of the fan assembly 100.

By way of example, the air inlet side and the air outlet side of the fan assembly 100 may be disposed opposite to each other along the first direction Y, and the processing chip 204 may be located on the air outlet side of the fan assembly 100, so that the fan blade may drive air to flow toward the processing chip 204, thereby taking away heat emitted by the processing chip 204, implementing heat dissipation of the processing chip 204, reducing the risk that the processing chip 204 cannot work normally due to too high temperature, and improving operational reliability of the processing chip 204.

In some examples, the fan body may include a fan housing and a motor, the motor may be located within the fan housing, and the fan blades may be located within the fan housing and connected to a shaft of the motor such that the fan blades may be rotatably connected to the fan body. It can be appreciated that the rotating shaft of the motor can drive the fan blades to rotate when rotating, so that the fan blades can drive air to flow, and the conversion from electric energy to mechanical energy to wind energy is realized, thereby realizing the heat dissipation of the processing chip 204.

In some examples, the number of fan assemblies 100 may be plural, and the plurality of fan assemblies 100 may be arranged at intervals along the second direction X to improve the fan heat effect on the processing chip 204. It will be appreciated that embodiments of the present application do not further limit the number of fan assemblies 100.

In some examples, a vent hole (not shown in the figure) may be formed in the casing 201 of the computing device 200, and air outside the computing device 200 may flow into a containing space enclosed by the casing 201 through the vent hole under the driving action of the fan assembly 100, and air in the containing space may flow out of the computing device 200 through the vent hole under the driving action of the fan assembly 100, so as to dissipate heat of the processing chip 204.

In some examples, computing device 200 may also include heat sink fins (not shown). The heat emitted by the processing chip 204 can be transferred to the radiating fins, and the radiating fins can exchange heat with air, so that the radiating efficiency of the processing chip 204 is improved, and the risk that the processing chip 204 cannot work normally due to overhigh temperature is reduced.

As can be seen from the above, as shown in fig. 1, the electronic device 202 may be located on one side of the processing chip 204 along the first direction Y. In some examples, as shown in fig. 1, electronics 202 may be located on a side of fan assembly 100 remote from processing chip 204 along first direction Y. That is, in the first direction Y, the processing chip 204 and the electronic device 202 may be located at both sides of the fan assembly 100, respectively. It will be appreciated that because the processing chip 204 needs to be located on the air-out side of the fan assembly 100, in some examples, the electronics 202 may be located on the air-in side of the fan assembly 100.

It can be appreciated that, the electronic device 202 is disposed on the air inlet side of the fan assembly 100, so that the distance between the processing chip 204 located on the air outlet side of the fan assembly 100 and the fan assembly 100 can be reduced, the heat dissipation effect of the fan assembly 100 on the processing chip 204 is improved, the risk that the processing chip 204 cannot work normally due to too high temperature is reduced, and the operational reliability of the computing device 200 is improved.

In other examples, the processing chip 204 and the electronic device 202 may also be located on the same side of the fan assembly 100 along the first direction Y, that is, the processing chip 204 and the electronic device 202 may both be located on the air-out side of the fan assembly 100 along the first direction Y.

It can be appreciated that the processing chip 204 and the electronic device 202 are both disposed on the air outlet side of the fan assembly 100, so that the fan assembly 100 not only can play a role in dissipating heat from the processing chip 204, but also can play a role in dissipating heat from the electronic device 202, so that the risk that the electronic device 202 cannot work normally due to too high temperature is reduced, and the operational reliability of the computing device 200 is improved.

In the embodiment of the present application, the processing chip 204 is located on the air outlet side of the fan assembly 100, the electronic device 202 is a mechanical hard disk, and the mechanical hard disk is located on the air inlet side of the fan assembly 100, which is further illustrated.

In some examples, the mechanical hard disk may include a magnetic head and a disk, and the number of disks may be one or more, as examples. By way of example, the disc may comprise a substrate, the material of which may comprise aluminium or glass or the like, and the substrate may be coated with a ferromagnetic material to form the disc. The magnetic head is contacted with the disk, and the disk can rotate relative to the magnetic head to realize the functions of reading and storing data.

It will be appreciated that the disk will be in a high speed rotation during operation of the computing device 200. At this time, if the mechanical hard disk is disturbed by vibration, etc., the magnetic head vibrates or even deviates relative to the disk, the read-write speed of the mechanical hard disk is affected, and even the read-write error of the mechanical hard disk is caused.

It can be appreciated that, since the mechanical hard disk may be located at the air intake side of the fan assembly 100, when the fan assembly 100 drives air to flow to the air outlet side via the air intake side, the disturbance of the air intake flow will affect the magnetic head of the mechanical hard disk, so that the magnetic head vibrates or even deviates relative to the disk, thereby reducing the number of times per second (english: input/Output Operations Per Second, english: IOPS, i.e. the number of times per second of performing the read/write operations) of the mechanical hard disk, resulting in a reduction in the read/write speed of the mechanical hard disk, and increasing the risk of occurrence of read/write errors in the mechanical hard disk, affecting the read/write performance of the mechanical hard disk, thereby affecting the speed and accuracy of processing data by the computing device 200.

However, as the power consumption of the processing chip 204 increases, the fan blades of the fan assembly 100 need to rotate at a high speed to meet the heat dissipation requirements of the processing chip 204. It will be appreciated that the higher the rotational speed of the fan blades, the greater the airflow vibration frequency (i.e., the disturbance of the airflow) on the intake side of the fan assembly 100, and the greater the adverse effect on the mechanical hard disk, the lower the read/write performance of the mechanical hard disk.

Fig. 2A is a block diagram of a waveguide plate according to some embodiments of the present application. Fig. 2B is a diagram illustrating a positional relationship between a waveguide plate and a fan frame according to some embodiments of the present disclosure. Fig. 2C is a diagram illustrating a positional relationship between a waveguide plate and a fan frame base according to some embodiments of the present disclosure.

In some examples, as shown in fig. 2A, the fan assembly 100 may include a Waveguide Plate 140 (english name). It will be appreciated that the waveguide plate 140 may be a square plate-like structure, a hexagonal plate-like structure, an octagonal plate-like structure, or other irregularly shaped plate-like structure, etc. It is understood that the embodiment of the present application does not further limit the shape of the waveguide plate 140.

In some examples, as shown in fig. 2A, the waveguide plate 140 may be provided with a plurality of waveguide holes 141, and the waveguide holes 141 may penetrate in the first direction Y. For example, the first direction Y may be a thickness direction of the waveguide plate 140, that is, the waveguide hole 141 may penetrate in the thickness direction of the waveguide plate 140.

In some examples, as shown in fig. 2A, waveguide aperture 141 may be a cellular (hexagonal or near hexagonal) aperture-like structure. In other examples, waveguide aperture 141 may also be square, circular, or other irregularly shaped aperture-like structures. It is understood that the shape of the plurality of waveguide holes 141 may be the same or different.

It should be appreciated that, since the air inlet side and the air outlet side of the fan assembly 100 may be disposed opposite to each other along the first direction Y, and the blades may drive the air to flow to the air outlet side via the air inlet side of the fan assembly 100, that is, the blades may drive the air to flow along the first direction Y. In this way, the waveguide hole 141 is provided to penetrate in the first direction Y, so that air can pass through the waveguide hole 141 by the driving of the fan blade.

It will be appreciated that the waveguide aperture 141 can act to straighten out the cluttered airflow. In this way, the waveguide plate 140 is disposed between the fan structure and the mechanical hard disk, so as to reduce the influence of the disturbance of the air flow on the mechanical hard disk, and improve the read-write speed and the read-write accuracy of the mechanical hard disk, thereby improving the data processing speed and accuracy of the computing device 200. In addition, the waveguide holes 141 can also function as uniform air flow, thereby reducing noise of the fan assembly 100.

In some examples, a perforated metal thin-walled material may be used for bonding or welding to form waveguide plate 140. In other examples, a plurality of waveguide holes 141 may be formed in the metal plate to form the waveguide plate 140.

The installation position of the waveguide plate 140 is exemplified below with reference to fig. 2B and 2C.

As shown in fig. 2B, the fan assembly 100 may include a fan frame 170, and the fan structure 130 may be installed in a receiving cavity defined by the fan frame 170. In some implementations, as shown in fig. 2B, the waveguide plate 140 may be located on a side of the fan frame 170 remote from the fan structure 130.

For example, as shown in fig. 2B, the waveguide plate 140 may be subjected to a taping process, and a buckle may be provided at the taping. The clamping groove is disposed at the position of the fan frame 170 corresponding to the buckle, so that the waveguide plate 140 can be hung on the side of the fan frame 170 away from the fan structure 130 in a clamping manner.

However, the waveguide plate 140 is hung on the fan frame 170, which increases the thickness of the fan assembly 100 along the first direction Y, reduces the space utilization in the computing device 200, and affects the high-density performance of the computing device 200. In addition, the taping process of the waveguide plate 140 may also increase the cost of the waveguide plate 140, thereby increasing the cost of the fan assembly 100.

Also, as shown in fig. 2B, when the number of the fan structures 130 is plural, the plurality of fan structures 130 share one waveguide plate 140, resulting in a longer length of the waveguide plate 140, reducing the convenience of installation of the waveguide plate 140.

In other implementations, as shown in fig. 2C, the fan assembly 100 may also include a fan frame mount 180. For example, the fan frame base 180 may enclose a fan frame receiving cavity, and the fan frame 170 and the fan structure 130 located within the fan frame 170 may be located within the fan frame receiving cavity.

For example, as shown in fig. 2C, the fan frame base 180 may include a base rear frame 187 and a base front frame 188. The base rear frame 187 may have a waveguide plate accommodating groove, the waveguide plate 140 may be embedded in the waveguide plate accommodating groove, and the base front frame 188 may be covered with the base rear frame 187 by means of a clamping connection, so as to play a limiting role on the waveguide plate 140.

However, the above implementation still corresponds to the hanging of the waveguide plate 140 on one side of the fan frame 170, which may cause the thickness of the fan assembly 100 along the first direction Y to increase, and reduce the space utilization in the computing device 200, which affects the high-density characteristics of the computing device 200.

Fig. 3A is a block diagram of a fan assembly provided in some embodiments of the present application. Fig. 3B is an exploded view of the fan assembly of fig. 3A.

To reduce the thickness of the fan assembly 100 in the first direction Y, thereby reducing the footprint of the fan assembly 100, improving space utilization within the computing device 200, some embodiments of the present application provide a fan assembly 100. The fan assembly 100 provided in the embodiments of the present application is illustrated below.

In some examples, the fan assembly 100 may include a fan housing 170, and the fan structure 130 and waveguide plate 140 may be mounted within a fan receiving cavity defined by the fan housing 170.

In some examples, as shown in fig. 3A and 3B, the fan housing 170 may include a first housing 110 and a second housing 120. That is, in some examples, as shown in fig. 3A and 3B, the fan assembly 100 may include a first housing 110, a second housing 120, a fan structure 130, and a waveguide plate 140. For example, the first frame 110 may be cooperatively connected with the second frame 120 to enclose a fan accommodating cavity, and the fan structure 130 may be installed in the fan accommodating cavity.

As can be appreciated, the fan structure 130 is mounted in the fan accommodating cavity enclosed by the first frame 110 and the second frame 120, which can isolate the fan structure 130 from other components (such as cables) in the computing device 200, reduce the risk of scratch between the fan structure 130 and the cables or other foreign matters, and improve the reliability of the fan assembly 100.

Fig. 4A is a block diagram of a first frame at a first angle according to some embodiments of the present application. Fig. 4B is a block diagram of a first frame at a second angle according to some embodiments of the present application. Fig. 4C is a block diagram of a second frame according to some embodiments of the present disclosure. The structures of the first housing 110 and the second housing 120 are described below with reference to fig. 4A to 4C.

In some examples, as shown in fig. 4A and 4B, the first frame 110 may include a first panel 111, a first side panel 116, and a second side panel 117. The first side plate 116 and the second side plate 117 may be located at the same side of the first panel 111, and the first side plate 116 and the second side plate 117 may be disposed opposite to each other. The first side plate 116 may be connected to a side edge of the first panel 111, and the second side plate 117 may be connected to a side edge of the first panel 111 remote from the first side plate 116. The first panel 111 may be provided with a first air inlet 112.

It will be appreciated that as shown in fig. 4A and 4B, since the first side plate 116 and the second side plate 117 may be located on the same side of the first panel 111 and disposed opposite to each other, the first side plate 116 may be connected to one side edge of the first panel 111, and the second side plate 117 may be connected to one side edge of the first panel 111 remote from the first side plate 116.

In some examples, the first panel 111, the first side panel 116, and the second side panel 117 may be an integrally formed structure to improve reliability of the connection between the first panel 111 and the first and second side panels 116, 117.

In some examples, the first air inlet 112 may penetrate in a first direction Y, which may be a thickness direction of the first panel 111, for example.

In some examples, the first air inlet 112 may be square, hexagonal, octagonal, or other irregular shape, etc.

In some examples, as shown in fig. 4A and 4B, the first frame 110 may further include a first air inlet grill 118, and the first air inlet grill 118 may be connected to an edge of the first air inlet 112.

As can be appreciated, the first air inlet grille 118 can isolate the fan structure 130 from other components (e.g., cables) within the computing device 200, reduce the risk of snagging between the fan structure 130 and the cables or other foreign objects, and improve the reliability of use of the fan assembly 100.

In some examples, as shown in fig. 4A and 4B, the first panel 111 may include a hemming structure 114, and the hemming structure 114 may be bent and extended away from the fan structure 130 to enclose the first air inlet 112. In some examples, the hemming structure 114 may be bent and extend in a first direction Y away from the fan structure 130.

In some examples, the first air inlet grill 118 may be coupled to the hemming structure 114.

In some examples, as shown in fig. 4A and 4B, the first side plate 116 and the second side plate 117 may be provided with a avoidance hole 119, so as to avoid the electronic component 210 on the computing device 200, reduce the space interference generated between the fan assembly 100 and the electronic component 210, and improve the space utilization in the computing device 200.

In some examples, as shown in fig. 4C, the second frame 120 may include a second panel 121, a third side panel 125, and a fourth side panel 126. The third side plate 125 and the fourth side plate 126 may be located at the same side of the second panel 121, and the third side plate 125 and the fourth side plate 126 may be disposed opposite to each other. The third side plate 125 may be connected to one side edge of the second panel 121, and the fourth side plate 126 may be connected to one side edge of the second panel 121 remote from the third side plate 125. The second panel 121 may be provided with a first air outlet 122.

It will be appreciated that, as shown in fig. 4C, since the third side plate 125 and the fourth side plate 126 may be located on the same side of the second panel 121 and disposed opposite to each other, the third side plate 125 may be connected to one side edge of the second panel 121, and the fourth side plate 126 may be connected to one side edge of the second panel 121 remote from the third side plate 125.

In some examples, the second panel 121, the third side panel 125, and the fourth side panel 126 may be integrally formed to improve the reliability of the connection between the second panel 121 and the third and fourth side panels 125, 126.

In some examples, the first air outlet 122 may penetrate in a first direction Y, which may be a thickness direction of the first panel 111, for example. As can be appreciated, since the first air inlet 112 and the first air outlet 122 can both penetrate along the first direction Y, the fan assembly 100 can drive air to flow along the first direction Y, thereby achieving heat dissipation to the processing chip 204.

In some examples, the first air outlets 122 may be square, hexagonal, octagonal, or other irregular shapes, etc. It is understood that the shapes of the first air inlet 112 and the first air outlet 122 may be the same or different.

In some examples, as shown in fig. 4C, the fan assembly 100 may further include an outlet grill 127, and the outlet grill 127 may be connected to an edge of the first air outlet 122.

It will be appreciated that the air outlet grille 127 can isolate the fan structure 130 from other components (e.g., cables) within the computing device 200, reducing the risk of snagging between the fan structure 130 and the cables or other foreign objects, and improving the reliability of use of the fan assembly 100.

In some examples, the first frame 110 and the second frame 120 may be cooperatively connected by a clamping manner, so as to define a fan accommodating cavity. The manner of the engagement between the first housing 110 and the second housing 120 is illustrated below.

In some examples, as shown in fig. 4A and 4B, the first side plate 116 may include a first side plate connection portion 116a and the second side plate 117 may include a second side plate connection portion 117a. As shown in fig. 4C, the third side plate 125 may include a third side plate connecting portion 125a, and the fourth side plate 126 may include a fourth side plate connecting portion 126a.

For example, the first side plate connecting portion 116a may be clamped to the third side plate connecting portion 125a, and the second side plate connecting portion 117a may be clamped to the fourth side plate connecting portion 126a, so that the first frame 110 and the second frame 120 may be cooperatively connected in a clamping manner to define a fan accommodating cavity.

In some examples, as shown in fig. 4A and 4B, the first side plate connection 116a may be a snap, and as shown in fig. 4C, the third side plate connection 125a may be a snap slot. In other examples, the first side plate connecting portion 116a may be a clip groove and the third side plate connecting portion 125a may be a buckle.

In some examples, as shown in fig. 4A and 4B, the second side plate connection 117a may be a clasp, and as shown in fig. 4C, the fourth side plate connection 126a may be a slot. In other examples, the second side plate connection 117a may be a clip groove and the fourth side plate connection 126a may be a snap.

In some examples, as shown in fig. 4A and 4B, the number of first side plate connecting portions 116a may be two, and the two first side plate connecting portions 116a may be disposed at intervals along the edge of the first side plate 116. It is understood that, as shown in fig. 4C, the number of the third side plate connecting portions 125a may be the same as the number of the first side plate connecting portions 116a, and the arrangement positions of the third side plate connecting portions 125a may correspond to the arrangement positions of the first side plate connecting portions 116 a.

In some examples, as shown in fig. 4A and 4B, the number of the second side plate connecting portions 117a may be two, and two second side plate connecting portions 117a may be disposed at intervals along the edge of the second side plate 117. It is understood that, as shown in fig. 4C, the number of the fourth side plate connecting portions 126a may be the same as the number of the second side plate connecting portions 117a, and the arrangement positions of the fourth side plate connecting portions 126a may correspond to the arrangement positions of the second side plate connecting portions 117 a.

It can be appreciated that the first frame 110 and the second frame 120 are configured to be cooperatively connected in a clamping manner, so as to enclose the fan accommodating cavity, so that the connection convenience between the first frame 110 and the second frame 120 can be improved, the first frame 110 and the second frame 120 can be installed without tools, and the installation convenience of the fan assembly 100 is improved.

In some examples, the lengths of the first side plate 116 and the second side plate 117 in the first direction Y may be the same; the lengths of the third side plate 125 and the fourth side plate 126 in the first direction Y may also be the same to improve structural regularity of the first and second frames 110 and 120.

In other examples, the lengths of the first side plate 116 and the second side plate 117 in the first direction Y may be different; the lengths of the third side plate 125 and the fourth side plate 126 in the first direction Y may be different, thereby improving the flexibility of use of the first and second housings 110 and 120.

As can be appreciated, adjusting the lengths of the first side plate 116 and the second side plate 117 along the first direction Y, and/or adjusting the lengths of the third side plate 125 and the fourth side plate 126 along the first direction Y can adjust the lengths of the fan accommodating chambers along the first direction Y, so that the fan accommodating chambers can accommodate different types of fan structures 130, and compatibility of the fan accommodating chambers is improved, thereby improving applicability of the fan assembly 100.

For example, the fan housing chamber may house a fan structure 130 of a model number of 8038 (i.e., the length of the fan body 131 along the first direction Y is 38cm, in cm), 8056 (i.e., the length of the fan body 131 along the first direction Y is 56 cm), 8080 (i.e., the length of the fan body 131 along the first direction Y is 80 cm), etc., to meet different usage requirements.

In some examples, the number of fan structures 130 may be at least two, and at least two fan structures 130 may be arranged along the second direction X.

It can be appreciated that the number of the fan structures 130 is at least two, so that the air output of the fan assembly 100 can be increased, and the heat dissipation effect of the fan assembly 100 on the processing chip 204 can be improved. In addition, at least two fan structures 130 are arranged along the second direction X, so that the occupied space of the fan assembly 100 along the first direction Y can be reduced, the fan assembly 100 can radiate heat to the processing chips 204 at different positions, and the heat radiation performance of the fan assembly 100 is improved.

In some examples, the number of first frames 110 and second frames 120 may be the same as the number of fan structures 130, and one fan structure 130 may be located in a fan housing cavity defined by one first frame 110 and one second frame 120.

Fig. 5 is a block diagram of a fan structure according to some embodiments of the present application. FIG. 6 is a block diagram of a first shock absorbing connector provided in some embodiments of the present application.

In some examples, as shown in fig. 5, the fan structure 130 may include a fan body 131 and blades (not shown) that may be rotatably coupled to the fan body 131. As can be appreciated, the fan structure 130 can be installed in the fan accommodating cavity enclosed by the first frame 110 and the second frame 120, so that the fan blades can drive the air to flow to the first air outlet 122 via the first air inlet 112, so that the fan assembly 100 can dissipate the heat of the processing chip 204.

In some examples, the fan body 131 may include a fan housing 131a and a motor (not shown) that may be located within the fan housing 131a, and blades may be located within the fan housing 131a, and the blades may be coupled with a rotation shaft of the motor such that the blades may be rotatably coupled with the fan body 131.

In some examples, the fan main body 131 may be connected to the first frame 110 and the second frame 120, so that the fan structure 130 may be installed in a fan accommodating cavity enclosed by the first frame 110 and the second frame 120, which reduces the risk of the fan main body 131 shaking or even shifting relative to the first frame 110 and the second frame 120, and improves the reliability of the fan assembly 100.

Since the fan main body 131 may include the fan housing 131a, in some examples, the fan housing 131a may be connected with the first and second frames 110 and 120. The connection between the fan housing 131a and the first and second housings 110 and 120 is illustrated below.

In some examples, as shown in fig. 5, the fan housing 131a may include a first connection plate 135 and a second connection plate 136 disposed opposite to each other. The first connection plate 135 may be connected to the first panel 111 and the second connection plate 136 may be connected to the second panel 121 such that the fan structure 130 may be installed in the fan receiving cavity.

In some examples, referring again to fig. 4A and 4B, the first panel 111 may be provided with a first connection hole 113, and in some examples, the first connection hole 113 may extend through the first panel 111 in a thickness (i.e., first direction Y) direction of the first panel 111. As shown in fig. 5, the fan main body 131 may be provided with a second connection hole 133. As an example, as shown in fig. 5, the second connection hole 133 may be opened on the first connection plate 135 of the fan housing 131a, and the second connection hole 133 may penetrate the first connection plate 135 in a thickness direction (i.e., the first direction Y) of the first connection plate 135.

For example, the arrangement position of the first connection hole 113 may correspond to the arrangement position of the second connection hole 133. It is understood that the shape of the first connection hole 113 may be the same as or different from the shape of the second connection hole 133.

In some examples, fan assembly 100 may also include a first shock absorbing connector 160.

In some examples, as shown in fig. 6, the first shock absorbing connector 160 may include a first connection portion 161, a second connection portion 162, and a first buffer portion 163. One end of the first buffer part 163 may be connected to an end of the first connection part 161, and the other end of the first buffer part 163 may be connected to an end of the second connection part 162. The first connection portion 161 may be used to be fitted into the first connection hole 113, and the second connection portion 162 may be used to be fitted into the second connection hole 133.

As can be appreciated, since the first connection portion 161 may be used to be inserted into the first connection hole 113, the second connection portion 162 may be used to be inserted into the second connection hole 133, and the first buffer portion 163 may connect the first connection portion 161 and the second connection portion 162, so that the first shock absorbing connector 160 may function to connect the first connection plate 135 and the first panel 111. That is, the fan main body 131 and the first frame 110 may be connected through the first damper connection member 160, improving connection convenience between the fan main body 131 and the first frame 110.

It can be understood that when the blades of the fan structure 130 rotate, the fan housing 131a is driven to vibrate, and the vibration of the fan housing 131a is transmitted to the mechanical hard disk through the fan housing (e.g. the first housing 110), so that the magnetic head of the mechanical hard disk vibrates or even rotates, and the read-write performance of the mechanical hard disk is affected.

Accordingly, the fan main body 131 is disposed to be connected to the first housing 110 by the first damper connection 160, and it is understood that when the first connection portion 161 is fitted into the first connection hole 113 and the second connection portion 162 is fitted into the second connection hole 133, the first buffer portion 163 can be located between the first panel 111 and the fan main body 131 (e.g., the fan housing 131a of the fan main body 131) along the first direction Y so that a first gap is provided between the first panel 111 and the fan main body 131 along the first direction Y.

In this way, the first buffer portion 163 can absorb and buffer the vibration of the fan housing 131a, that is, the first shock absorbing connector 160 can absorb the vibration, so as to reduce the influence of the vibration of the fan housing 131a on the first frame 110, that is, the influence of the rotation of the fan blade on the mechanical hard disk, and improve the speed and accuracy of reading and writing data of the mechanical hard disk.

In some examples, the cross-sectional area of the first buffer portion 163 (the cross-sectional area perpendicular to the extending direction of the first shock absorbing connector 160) may be larger than the cross-sectional area of the first connector 161 and the cross-sectional area of the second connector 162, so as to improve the absorption and buffering effects of the first buffer portion 163 on the vibration, reduce the influence of the vibration of the fan housing 131a on the first frame 110, that is, reduce the influence of the rotation of the fan blade on the mechanical hard disk, and improve the speed and accuracy of reading and writing data of the mechanical hard disk.

In some examples, the material of the first shock absorbing connector 160 may include rubber or silicone, etc. to enhance the shock absorbing effect of the first shock absorbing connector 160.

It is understood that the lengths of the first connection portion 161 and the second connection portion 162 may be the same or different. In some examples, as shown in fig. 6, the length of the first connection portion 161 may be less than the length of the second connection portion 162.

In some examples, the first connection hole 113 may be a circular through hole, and the first connection portion 161 may be a cylindrical or approximately cylindrical structure such that the first connection portion 161 may be embedded in the first connection hole 113.

In some examples, when the first connection portion 161 is embedded in the first connection hole 113, a side of the first connection portion 161 remote from the first buffer portion 163 may be flush with a side of the first panel 111 remote from the fan structure 130.

In some examples, the second connection hole 133 may be a circular through hole, and the second connection part 162 may be a cylindrical or approximately cylindrical structure such that the second connection part 162 may be embedded in the second connection hole 133.

In some examples, when the second connection portion 162 is inserted into the second connection hole 133, a side of the second connection portion 162 remote from the first buffer portion 163 may be flush with a side of the first connection plate 135 remote from the first panel 111.

In some examples, as shown in fig. 4A, the first panel 111 may have a quadrangular plate-like structure, the number of the first connection holes 113 may be four, and the four first connection holes 113 may be respectively adjacent to four vertexes of the first panel 111. The number of the second connection holes 133 may be the same as the number of the first connection holes 113, and the arrangement positions of the second connection holes 133 may correspond to the arrangement positions of the first connection holes 113. The number of the first damper connecting pieces 160 may be four. In this way, the fan main body 131 may be connected to the four vertices of the first panel 111 through the first damper connection member 160, and the connection reliability between the fan main body 131 and the first frame 110 is improved.

In some examples, referring again to fig. 4C, the second panel 121 may be provided with a third connection hole 124, and in some examples, the third connection hole 124 may extend through the second panel 121 in a thickness direction (i.e., the first direction Y) of the second panel 121. As shown in fig. 5, the fan main body 131 may be provided with a fourth connection hole 134. As an example, as shown in fig. 5, the fourth connection hole 134 may be opened on the second connection plate 136 of the fan housing 131a, and the fourth connection hole 134 may penetrate the second connection plate 136 in a thickness direction (i.e., the first direction Y) of the second connection plate 136.

For example, the setting position of the third connection hole 124 may correspond to the setting position of the fourth connection hole 134. It is understood that the shape of the third connecting hole 124 may be the same as or different from the shape of the fourth connecting hole 134.

In some examples, fan assembly 100 may also include a second shock absorbing connector 190 (see fig. 3B).

For example, the second shock absorbing connector 190 may include a third connecting portion, a fourth connecting portion, and a second buffer portion. One end of the second buffer portion may be connected to an end of the third connection portion, and the other end of the second buffer portion may be connected to an end of the fourth connection portion. A third connection portion may be used to fit into the third connection hole 124 and a fourth connection portion may be used to fit into the fourth connection hole 134.

As can be appreciated, since the third connection portion may be used to be inserted into the third connection hole 124, the fourth connection portion may be used to be inserted into the fourth connection hole 134, and the second buffer portion may connect the first connection portion 161 and the second connection portion 162, so that the second shock absorbing connector 190 may function to connect the second connection plate 136 and the second panel 121. That is, the fan main body 131 and the second frame 120 may be connected through the second damper connection member 190, improving the connection convenience between the fan main body 131 and the second frame 120.

In addition, when the third connection portion is fitted into the third connection hole 124 and the fourth connection portion is fitted into the fourth connection hole 134, the second buffer portion is allowed to be located between the second panel 121 and the fan main body 131 (for example, the fan housing 131a of the fan main body 131) in the first direction Y, so that the second panel 121 and the fan main body 131 have a second gap therebetween in the first direction Y.

In this way, the second buffer portion can absorb and buffer the vibration of the fan housing 131a, that is, the second shock absorbing connector 190 can absorb the vibration, so as to reduce the influence of the vibration of the fan housing 131a on the second frame 120, that is, the influence of the rotation of the fan blade on the mechanical hard disk, and improve the speed and accuracy of reading and writing data of the mechanical hard disk.

In some examples, the cross-sectional area of the second buffer portion (the cross-sectional area perpendicular to the extending direction of the second shock absorbing connector 190) may be larger than the cross-sectional area of the third connector and the cross-sectional area of the fourth connector, so as to improve the absorption and the buffering effect of the second buffer portion on the vibration, reduce the influence of the vibration of the fan housing 131a on the second frame 120, that is, reduce the influence of the rotation of the fan blade on the mechanical hard disk, and improve the speed and the accuracy of reading and writing data of the mechanical hard disk.

In some examples, the material of the second shock absorbing connector 190 may include rubber or silicone, etc. to enhance the shock absorbing effect of the second shock absorbing connector 190. It will be appreciated that the material of the second shock absorbing connector 190 may be the same as or different from the material of the first shock absorbing connector 160.

It will be appreciated that the third and fourth connecting portions may be the same or different in length. In some examples, the length of the third connection may be less than the length of the fourth connection.

In some examples, the third connection hole 124 may be a circular through hole, and the third connection portion may be a cylindrical or approximately cylindrical structure such that the third connection portion may be embedded in the third connection hole 124.

In some examples, when the third connection portion is embedded in the third connection hole 124, a side of the third connection portion remote from the second buffer portion may be flush with a side of the second panel 121 remote from the fan structure 130.

In some examples, the fourth connection hole 134 may be a circular through hole, and the fourth connection portion may be a cylindrical or approximately cylindrical structure such that the fourth connection portion may be embedded in the fourth connection hole 134.

In some examples, when the fourth connection portion is embedded in the fourth connection hole 134, a side of the fourth connection portion remote from the second buffer portion may be flush with a side of the second connection plate 136 remote from the second panel 121.

In some examples, as shown in fig. 4C, the second panel 121 may have a quadrangular plate-like structure, the number of the third connection holes 124 may be four, and the four third connection holes 124 may be respectively adjacent to four vertexes of the second panel 121. The number of the fourth connection holes 134 may be the same as the number of the third connection holes 124, and the arrangement positions of the fourth connection holes 134 may correspond to the arrangement positions of the third connection holes 124. The number of the second damper connecting pieces 190 may be four. In this way, the fan main body 131 may be connected to the four vertices of the second panel 121 through the second damper connection member 190, and the connection reliability between the fan main body 131 and the second frame 120 is improved.

Fig. 7A is a diagram illustrating a positional relationship between a waveguide plate and a first air inlet according to some embodiments of the present disclosure. Fig. 7B is a diagram illustrating a positional relationship between a waveguide plate and a first air inlet according to other embodiments of the present disclosure. Fig. 7C is a schematic diagram illustrating a positional relationship between a waveguide plate and a first air inlet according to still other embodiments of the present disclosure.

As can be seen from the above description, the first panel 111 may be provided with the first air inlet 112, and the first air inlet 112 may be penetrated along the first direction Y. In some examples, as shown in fig. 7A-7C, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, that is, the waveguide plate 140 may be embedded in the first air inlet 112 along the penetrating direction of the first air inlet 112.

In some examples, as shown in fig. 7A and 7B, the waveguide plate 140 may be entirely embedded in the first air inlet 112 along the first direction Y. In other examples, as shown in fig. 7C, the waveguide plate 140 may also be partially embedded in the first air inlet 112 along the first direction Y.

As can be seen from the foregoing, the first panel 111 may include a folded structure 114, the folded structure 114 may enclose the first air inlet 112, and the first air inlet grille 118 may be connected to the folded structure 114.

In some examples, as shown in fig. 7A-7C, an outer peripheral side of the waveguide plate 140 may abut an inner peripheral side of the hemming structure 114 to be embedded in the first air inlet 112. For example, the waveguide plate 140 may abut the first air inlet grill 118.

In some examples, the thickness of waveguide plate 140 along first direction Y may range from 3mm (units: millimeters) to 10mm to avoid waveguide plate 140 having too small a thickness (e.g., less than 3 mm) along first direction Y, affecting the effect of waveguide plate 140 on straightening the airflow; and also avoids excessive thickness of the waveguide plate 140 in the first direction Y (e.g., greater than 10 mm), resulting in increased windage of the waveguide plate 140, affecting the intake of the fan assembly 100.

In some examples, the waveguide plate 140 may have a thickness of 3.5mm, 5mm, 7mm, 9mm, or the like in the first direction Y.

In some examples, as shown in fig. 7A, the thickness of the waveguide plate 140 along the first direction Y may be the same as the thickness of the first panel 111 along the first direction Y, such that the waveguide plate 140 may be entirely embedded in the first air inlet 112. For example, a surface of the waveguide plate 140 on a side remote from the first air inlet grill 118 may be flush with a surface of the first panel 111 on a side remote from the first air inlet grill 118.

In other examples, as shown in fig. 7B, the thickness of the waveguide plate 140 along the first direction Y may be smaller than the thickness of the first panel 111 along the first direction Y, so that the waveguide plate 140 may be entirely embedded in the first air inlet 112. For example, in the first direction Y, a distance between a surface of the waveguide plate 140 on a side away from the first air inlet grill 118 and the first air inlet grill 118 may be smaller than a distance between a surface of the first panel 111 on a side away from the first air inlet grill 118 and the first air inlet grill 118.

In still other examples, as shown in fig. 7C, the thickness of the waveguide plate 140 along the first direction Y may be greater than the thickness of the first panel 111 along the first direction Y, such that a portion of the waveguide plate 140 may be embedded in the first air intake 112. For example, in the first direction Y, a distance between a surface of the waveguide plate 140 on a side away from the first air inlet grill 118 and the first air inlet grill 118 may be greater than a distance between a surface of the first panel 111 on a side away from the first air inlet grill 118 and the first air inlet grill 118. That is, the surface of the waveguide plate 140 on the side away from the first air inlet grill 118 may protrude from the surface of the first panel 111 on the side away from the first air inlet grill 118.

It will be appreciated that the thickness of the first panel 111 along the first direction Y may be the thickness of the first panel 111 along the first direction Y at the location of the hemming structure 114. In some examples, the thickness of the first panel 111 in the first direction Y may range from 2mm to 3mm, and illustratively, the thickness of the first panel 111 in the first direction Y may range from 2.2mm, 2.5mm, 2.8mm, or the like.

As can be appreciated, the first air inlet 112 is surrounded by the hemming structure 114, and the outer peripheral side of the waveguide plate 140 abuts against the inner peripheral side of the hemming structure 114, so that the hemming structure 114 can play a role of accommodating the waveguide plate 140, that is, the hemming structure 114 can play a role of protecting the waveguide plate 140, so that the risk that the waveguide plate 140 is scratched by cables or other foreign matters in the computing device 200 and damage to the waveguide plate 140 is reduced, and the use reliability of the fan assembly 100 is improved.

It may be appreciated that, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, so that the fan structure 130 can drive air to pass through the waveguide plate 140 and flow to the first air outlet 122, so that the waveguide plate 140 can straighten the disordered air inlet airflow, reduce the disturbance of the air inlet side airflow of the fan assembly 100, reduce the influence of the disturbance of the air inlet airflow on the mechanical hard disk, and improve the read-write speed and the read-write accuracy of the mechanical hard disk, thereby improving the data processing speed and accuracy of the computing device 200. In addition, the waveguide plate 140 can also function as a uniform air flow, so that noise of the fan assembly 100 can be reduced.

In addition, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, so that the waveguide plate 140 can be integrated with the first frame 110, and the waveguide plate 140 does not need to be hung on a side of the fan frame (for example, the first frame 110) away from the fan structure 130. That is, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, and there may be a spatial overlap between the waveguide plate 140 and the first panel 111 in the first direction Y, so as to reduce the occupied space of the waveguide plate 140 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization in the computing device 200.

In addition, the waveguide plate 140 can be embedded in the first air inlet 112, and the waveguide plate 140 does not need to be subjected to edge wrapping and other treatments, so that the cost of the waveguide plate 140 is reduced, and the cost of the fan assembly 100 is reduced.

In addition, the waveguide plate 140 can be embedded in the first air inlet 112, so that one fan structure 130 can correspond to one waveguide plate 140, the length of the waveguide plate 140 along the second direction X is reduced, and the installation convenience of the waveguide plate 140 is improved.

Fig. 8A is a block diagram of a fan frame base provided in some embodiments of the present application. Fig. 8B is a diagram illustrating a positional relationship between a fan frame assembly and a first frame and a second frame according to some embodiments of the present disclosure. Fig. 8C isbase:Sub>A cross-sectional view of fig. 3A alongbase:Sub>A-base:Sub>A. Fig. 8D is a partial enlarged view of the P region in fig. 8C.

In some examples, as shown in fig. 8A and 8B, the fan assembly 100 may further include a fan frame base 180. The fan frame base 180 may enclose a fan frame accommodating cavity, the first frame 110 and the second frame 120 may be located in the fan frame accommodating cavity, and at least one of the first frame 110 and the second frame 120 may be detachably connected to the fan frame base 180.

It is understood that the first frame 110 and the second frame 120 may be located in the fan frame accommodating cavity, and the fan structure 130 may be located in the fan accommodating cavity defined by the first frame 110 and the second frame 120, that is, the first frame 110, the second frame 120 and the fan structure 130 may be located in the fan frame accommodating cavity.

As can be seen from the above description, the number of the fan structures 130 may be at least two, and one fan structure 130 may be located in a fan accommodating cavity defined by the first frame 110 and the second frame 120. In some examples, the fan frame base 180 may enclose at least two fan frame receiving cavities, and one fan structure 130 may be located within one fan frame receiving cavity.

It can be appreciated that the first frame 110 and the second frame 120 are disposed in the fan frame accommodating cavity, so that the fan frame base 180 can protect the first frame 110, the second frame 120, and the fan structure 130 disposed in the fan accommodating cavity. In addition, the fan frame base 180 is detachably connected with at least one of the first frame 110 and the second frame 120, so that the fan assembly 100 is convenient to maintain, replace and the like, and the use convenience of the fan assembly 100 is improved.

In some examples, the first frame 110 may include a fifth clamping portion, and the fan frame base 180 may include a sixth clamping portion, which may be used to clamp with the fifth clamping portion. And/or, the second frame 120 may include a seventh clamping portion, and the fan frame base 180 may include an eighth clamping portion, which may be used to clamp with the seventh clamping portion.

It can be appreciated that the fifth clamping portion and the sixth clamping portion are configured to be clamped to the first frame 110 and the fan frame base 180, so that tool-free installation between the first frame 110 and the fan frame base 180 is achieved, and installation convenience of the fan assembly 100 is improved.

In some examples, the fifth clamping portion may be a buckle and the sixth clamping portion may be a clamping groove. In other examples, the fifth clamping portion may be a clamping groove, and the sixth clamping portion may be a buckle.

It can be appreciated that the seventh clamping portion is clamped with the eighth clamping portion, so that the second frame 120 can be clamped with the fan frame base 180, and tool-free installation between the second frame 120 and the fan frame base 180 is realized, thereby improving installation convenience of the fan assembly 100.

In some examples, the seventh detent may be a catch and the eighth detent may be a slot. In other examples, the seventh clip portion may be a clip groove and the eighth clip portion may be a clip.

In some examples, as shown in fig. 8A and 8B, the fan frame base 180 may include a base side plate 183. As shown in fig. 8C and 8D, the base side plate 183 may have a first groove 184, and at least a portion of the edge of the first panel 111 may be embedded in the first groove 184.

At least a portion of the edge of the first panel 111 may be embedded in the first groove 184, that is, all of the edge of the first panel 111 may be embedded in the first groove 184, or a portion of the edge of the first panel 111 may be embedded in the first groove 184.

As can be appreciated, the first groove 184 is formed on the base side plate 183, so that at least a portion of the edge of the first panel 111 can be embedded in the first groove 184, so that the first frame 110 can be clamped with the fan frame base 180, and the connection reliability between the first frame 110 and the fan frame base 180 is improved.

In some examples, the fan frame mount 180 can be snapped with the housing 201 of the computing device 200 such that the fan assembly 100 can be connected with the housing 201. By way of example, by changing the snap-fit on the fan frame base 180, the fan frame base 180 can be snapped to different models of computing devices 200, improving the applicability of the fan assembly 100.

In some examples, as shown in fig. 8A, the fan frame base 180 may include a base panel 181, and the base panel 181 may be provided with a third air inlet 182, where the third air inlet 182 communicates with the first air inlet 112. As shown in fig. 8C and 8D, the hemming structure 114 may be embedded within the third air inlet 182.

As can be appreciated, by providing the third air inlet 182 on the base panel 181, and the third air inlet 182 is communicated with the first air inlet 112, air can flow to the first air outlet 122 via the third air inlet 182 and the first air inlet 112, so that the blocking of air caused by the base panel 181 is reduced, and the air intake of the fan assembly 100 is improved.

In some examples, an outer peripheral side of the hem structure 114 may abut an inner peripheral side of the third air scoop 182, such that the hem structure 114 may be embedded within the third air scoop 182.

It will be appreciated that the hemming structure 114 may be embedded in the third air inlet 182, so that there may be a spatial overlap between the hemming structure 114 and the base panel 181 in the first direction Y, which reduces the occupied space of the base panel 181 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization in the computing device 200.

In some examples, as shown in fig. 8A and 8B, the fan frame base 180 may further include an air deflector 185, the air deflector 185 being located on a side of the base panel 181 remote from the first frame 110.

It can be appreciated that, the air deflector 185 is disposed on the side of the base panel 181 away from the first frame 110, which can play a role in guiding air flow, and increase the air intake of the fan assembly 100, so as to improve the heat dissipation effect of the fan assembly 100 on the processing chip 204.

In some examples, as shown in fig. 8A and 8B, the fan frame base 180 further includes a sound absorbing cotton receiving groove 186, the sound absorbing cotton receiving groove 186 being located on a side of the base panel 181 remote from the first frame 110.

By way of example, the sound absorbing cotton receiving groove 186 may be used to receive sound absorbing cotton, which may function to absorb noise, thereby reducing noise of the fan assembly 100 and improving the performance of the fan assembly 100.

As can be seen from the above description, in some examples, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y. In some examples, the outer peripheral side of the waveguide plate 140 may be connected to the inner peripheral side of the first air inlet 112 (i.e., the inner peripheral side of the hemming structure 114) by an adhesive, which plays a role in limiting the waveguide plate 140, reducing the risk of the waveguide plate 140 falling off from the first air inlet 112, and improving the reliability of the fan assembly 100 in use.

In other examples, the fan assembly 100 may also include a limiting component to limit displacement of the waveguide plate 140 toward the fan structure 130 and away from the fan structure 130, reducing the risk of the waveguide plate 140 falling out of the first air intake 112. The spacing components of the fan assembly 100 are illustrated below.

In some examples, as shown in fig. 8C and 8D, the fan assembly 100 may further include a limiting plate 150, and the limiting plate 150 may be located between the waveguide plate 140 and the fan body 131. The limiting plate 150 may be coupled to the first frame 110 to limit displacement of the waveguide plate 140 in a direction approaching the fan main body 131.

For example, the limiting plate 150 may have a flat plate-like structure to perform a limiting function. In some examples, the limiting plate 150 may be located between the waveguide plate 140 and the fan housing 131a of the fan main body 131 and connected to the first frame 110 such that the limiting plate 150 limits displacement of the waveguide plate 140 in a direction approaching the fan main body 131, reduces the risk of the waveguide plate 140 moving in a direction approaching the fan main body 131, causing the waveguide plate 140 to fall off from the first air inlet 112, and improves the reliability of use of the fan assembly 100.

And, set up limiting plate 150 between waveguide plate 140 and fan main part 131 for limiting plate 150 can keep apart between waveguide plate 140 and the flabellum of fan main part 131, thereby plays the effect of protection waveguide plate 140, reduces the flabellum and rotates the risk that leads to waveguide plate 140 to be scratched, has improved the operational reliability of fan assembly 100.

In some examples, as shown in fig. 8D, the limit plate 150 may be located between the first panel 111 and the fan main body 131. As can be appreciated, since the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, the limiting plate 150 may be located between the waveguide plate 140 and the fan main body 131.

In some examples, as shown in fig. 8D, the hemming structure 114 may be bent and extended away from the limiting plate 150 to enclose the first air inlet 112. The first air inlet grill 118 may be located at a side of the waveguide plate 140 remote from the limiting plate 150 and connected to the hemming structure 114 to limit displacement of the waveguide plate 140 in a direction away from the fan main body 131.

As can be appreciated, the first air inlet grille 118 is disposed on one side of the waveguide plate 140 away from the limiting plate 150 and is connected with the end portion of the hemming structure 114 away from the limiting plate 150, so that the first air inlet grille 118 can limit the displacement of the waveguide plate 140 away from the fan main body 131, thereby reducing the risk of the waveguide plate 140 moving away from the fan main body 131 and causing the waveguide plate 140 to fall off from the first air inlet 112, and improving the reliability of the fan assembly 100.

In addition, the first air inlet grille 118 can also isolate the waveguide plate 140 from other components (such as cables) in the computing device 200, so as to protect the waveguide plate 140, reduce the risk of the waveguide plate 140 being scratched by the cables or other foreign matters and causing damage to the waveguide plate 140, and prolong the service life of the waveguide plate 140.

It is understood that the limiting plate 150 may be disposed between the waveguide plate 140 and the fan main body 131 and connected to the first frame 110 to limit displacement of the waveguide plate 140 in a direction approaching the fan main body 131; the first air inlet grill 118 may be disposed at a side of the waveguide plate 140 away from the limiting plate 150 and connected to the hemming structure 114 to limit displacement of the waveguide plate 140 in a direction away from the fan main body 131.

That is, by setting the limiting plate 150 and the first air inlet grille 118, the waveguide plate 140 can be located between the limiting plate 150 and the first air inlet grille 118, so that the displacement of the waveguide plate 140 in the direction close to the fan main body 131 and the displacement of the waveguide plate 140 in the direction far away from the fan main body 131 are limited, the risk that the waveguide plate 140 falls off from the first air inlet 112 is reduced, and the use reliability of the fan assembly 100 is improved.

In some examples, the limiting plate 150 may be fixedly connected to the first frame 110 or may be detachably connected to the first frame. In some examples, the limiting plate 150 may be connected to the first panel 111 of the first housing 110, or may be connected to the first side plate 116 or the second side plate 117 of the first housing 110.

Fig. 9 is a block diagram of a limiting plate according to some embodiments of the present application.

In some examples, as shown in fig. 9, the limiting plate 150 may be provided with a second air inlet 154, and the second air inlet 154 may be in communication with the first air inlet 112.

It can be appreciated that the second air inlet 154 may penetrate the limiting plate 150 along the thickness direction (i.e., the first direction Y) of the limiting plate 150, and the second air inlet 154 is communicated with the first air inlet 112, so that the fan blades can drive the air to flow to the first air outlet 122 via the first air inlet 112 and the second air inlet 154, thereby reducing the influence of the limiting plate 150 on the air flow and improving the air intake of the fan assembly 100.

In some examples, as shown in fig. 9, the restrictor plate 150 may also include a second air inlet grille 155. For example, the second air inlet grill 155 may be coupled to an edge of the second air inlet 154 to improve mechanical strength of the limiting plate 150. In addition, the second air inlet grille 155 can also play a role in protecting the waveguide plate 140, so that the risk of scratch of the waveguide plate 140 caused by rotation of the blades of the fan main body 131 is reduced, and the use reliability of the fan assembly 100 is improved.

In some examples, the material of the limiting plate 150 may include metal to increase the mechanical strength of the limiting plate 150, reduce the risk of the fan blades vibrating the limiting plate 150 during rotation, thereby causing the limiting plate 150 to fracture, and increase the reliability of the fan assembly 100.

As can be seen from the above, the first frame 110 may be connected to the fan structure 130 by the first damper connection member 160, and when the first connection portion 161 is inserted into the first connection hole 113 and the second connection portion 162 is inserted into the second connection hole 133, the first buffer portion 163 may be located between the first panel 111 and the fan body 131 (e.g., the fan housing 131a of the fan body 131) along the first direction Y, so that a first gap is provided between the first panel 111 and the fan body 131 along the first direction Y. In some examples, as shown in fig. 8C and 8D, at least a portion of the limiting plate 150 is located within the first gap Q. That is, at least a portion of the stopper plate 150 is located between both end portions of the first buffer portion 163 in the first direction Y.

It is understood that the limiting plate 150 may be located entirely or partially within the first gap Q in the first direction Y.

It is understood that at least a portion of the positioning limiting plate 150 may be positioned within the first gap Q such that the limiting plate 150 can utilize the space of the first buffer 163 in the first direction Y. That is, in the first direction Y, at least a portion of the limiting plate 150 may spatially overlap the first buffer 163, reducing an occupied space of the limiting plate 150 along the first direction Y, thereby reducing a thickness of the fan assembly 100 along the first direction Y, reducing a volume of the fan assembly 100, and improving a space utilization within the computing device 200.

In some examples, as shown in fig. 9, the limiting plate 150 may be of an octagonal or nearly octagonal configuration to avoid the first shock absorbing connector 160 such that at least a portion of the limiting plate 150 can be located within the first gap Q. In other examples, the limiting plate 150 may also be provided with a through hole, and the through hole may penetrate through the limiting plate 150 along the thickness direction (i.e., the first direction Y) of the limiting plate 150. The first connection portion 161 may be inserted into the first connection hole 113 through the through hole such that at least a portion of the limiting plate 150 can be positioned in the first gap Q.

As can be seen from the above description, the limiting plate 150 may be connected to the first frame 110. In some examples, the limiting plate 150 may be snapped with the first frame 110.

It can be appreciated that the limiting plate 150 is clamped with the first frame 110, so that tool-free installation between the limiting plate 150 and the first frame 110 can be realized, and thus, the installation convenience between the limiting plate 150 and the first frame 110 is improved.

In some examples, the first side plate 116 may include a first snap-in portion, as shown in fig. 9, and the stop plate 150 may include a second snap-in portion 152, which second snap-in portion 152 may be configured to snap-in with the first snap-in portion.

As can be appreciated, by providing the first clamping portion and the second clamping portion 152, the limiting plate 150 can be clamped with the first frame 110, so as to improve the connection convenience between the limiting plate 150 and the first frame 110.

In some examples, the first clamping portion may be a clamping groove, as shown in fig. 9, and the second clamping portion 152 may be a clasp. In other examples, the first clamping portion may be a buckle and the second clamping portion 152 may be a slot.

In some examples, the second side plate 117 includes a third clamping portion and the limiting plate 150 includes a fourth clamping portion 153, which fourth clamping portion 153 may be configured to clamp with the third clamping portion.

As can be appreciated, by providing the third clamping portion and the fourth clamping portion 153, the limiting plate 150 can be clamped with the first frame 110, so that the connection convenience between the limiting plate 150 and the first frame 110 is improved.

In some examples, the third clamping portion may be a clamping groove, as shown in fig. 9, and the fourth clamping portion 153 may be a buckle. In other examples, the third clamping portion may be a buckle, and the fourth clamping portion 153 may be a slot.

In some examples, the first frame 110 may further include a heat stake 115 (see fig. 4A), and the heat stake 115 may be located on a side of the first panel 111 adjacent to the spacing plate 150 and connected to the first panel 111.

It will be appreciated that the end of the heat stake 115 remote from the first panel 111 will melt as the temperature increases and the end of the heat stake 115 remote from the first panel 111 will solidify as the temperature decreases.

In some examples, the first panel 111 and the heat stake 115 may be an integrally formed structure to improve the reliability of the connection between the first panel 111 and the heat stake 115.

In some examples, as shown in fig. 9, the limiting plate 150 may be provided with a limiting hole 151, and the heat-fusible link 115 is used to pass through the limiting hole 151, so as to cooperate with the limiting hole 151 to limit the displacement of the limiting plate 150 after the end of the heat-fusible link 115 away from the first panel 111 is heat-fused and solidified.

It is understood that the limiting hole 151 may penetrate the limiting plate 150 along a penetrating direction (i.e., the first direction Y) of the limiting plate 150, so that the hot melt pillar 115 may penetrate the limiting hole 151.

In some examples, the spacing holes 151 may be circular through holes and the heat stake 115 may be cylindrical or approximately cylindrical in configuration such that the heat stake 115 may pass through the spacing holes 151.

As can be appreciated, after the limiting plate 150 is clamped to the first frame 110, the heat stake 115 can pass through the limiting hole 151. As can be appreciated, the end of the heat stake 115 remote from the first panel 111 can protrude beyond the spacing plate 150 as the heat stake 115 passes through the spacing aperture 151.

In this way, after the end portion of the heat-melting column 115 far away from the first panel 111 is melted and solidified, the heat-melting column can be matched with the limiting hole 151, so that the displacement of the limiting plate 150 is limited, the risk that the limiting plate 150 is deviated relative to the first frame 110 and even falls off relative to the first frame 110 is reduced, the connection reliability between the limiting plate 150 and the first frame 110 is improved, and the limiting reliability of the limiting plate 150 to the waveguide plate 140 is improved.

And, the displacement of the limiting plate 150 is limited by adopting a mode that the end part of the hot-melt column 115 far away from the first panel 111 is matched with the limiting hole 151 after hot-melt and solidification, and a complex mechanical structure is not needed, so that the structure of the first frame 110 is simplified, and the cost of the first frame 110 is reduced.

In some examples, as shown in fig. 9, the number of limiting holes 151 may be two. The number of the hot-melt columns 115 and the number of the limiting holes 151 may be the same, and one hot-melt column 115 may pass through one limiting hole 151, so as to improve the limiting effect of the hot-melt column 115 on the limiting plate 150, and reduce the risk that the limiting plate 150 is offset or even falls off relative to the first panel 111.

In some examples, after the limiting plate 150 is clamped with the first frame 110 and the heat-melting column 115 passes through the limiting hole 151, the end portion, far away from the first panel 111, of the heat-melting column 115 may be melted and cured, so that the heat-melting column 115 can be matched with the limiting hole 151, and the limiting plate 150 is limited.

In some examples, as shown in fig. 8D, a surface of the waveguide plate 140 on a side close to the limiting plate 150 (i.e., a surface of the waveguide plate 140 on a side away from the first air inlet grill 118) is flush with a surface of the first panel 111 on a side close to the limiting plate 150 (i.e., a surface of the first panel 111 on a side away from the first air inlet grill 118); and/or, the surface of the waveguide plate 140 on the side away from the limiting plate 150 (i.e., the surface of the waveguide plate 140 on the side close to the first air inlet grille 118) is flush with the surface of the first panel 111 on the side away from the limiting plate 150 (i.e., the surface of the first panel 111 on the side close to the first air inlet grille 118).

It can be appreciated that, the side surface of the waveguide plate 140 near the limiting plate 150 is flush with the side surface of the first panel 111 near the limiting plate 150, so that the structural regularity of the waveguide plate 140 embedded in the first air inlet 112 can be improved, the limiting plate 150 is convenient to be connected with the first frame 110, and the installation convenience of the fan assembly 100 is improved.

It can be appreciated that, the surface of the waveguide plate 140 far away from the side of the limiting plate 150 is flush with the surface of the first panel 111 far away from the side of the limiting plate 150, so that the structural regularity of the waveguide plate 140 embedded in the first air inlet 112 can be improved, the first air inlet grille 118 and the end portion of the hemming structure 114 far away from the limiting plate 150 can be conveniently connected, and the processing convenience of the first frame 110 can be improved.

In summary, the embodiments of the present application have at least the following beneficial effects:

in the embodiment of the application, the fan structure 130 is installed in the fan accommodating cavity enclosed by the first frame body 110 and the second frame body 120, so that the fan structure 130 and other components (such as cables) in the computing device 200 can be isolated, the risk of scratch between the fan structure 130 and the cables or other foreign matters is reduced, and the use reliability of the fan assembly 100 is improved.

In addition, the fan blades are rotatably connected with the fan main body 131, so that the fan blades can drive air to flow to the first air outlet 122 through the first air inlet 112, and therefore the fan assembly 100 can realize heat dissipation of the processing chip 204, for example. In addition, the fan main body 131 is connected with the first frame 110 and the second frame 120, so that the risk of shaking or even shifting of the fan main body 131 relative to the first frame 110 and the second frame 120 is reduced, and the use reliability of the fan assembly 100 is improved.

It may be appreciated that, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, so that the fan structure 130 can drive air to pass through the waveguide plate 140 and flow to the first air outlet 122, so that the waveguide plate 140 can straighten the disordered air inlet airflow, reduce the disturbance of the air inlet side airflow of the fan assembly 100, reduce the influence of the disturbance of the air inlet airflow on the mechanical hard disk, and improve the read-write speed and the read-write accuracy of the mechanical hard disk, thereby improving the data processing speed and accuracy of the computing device 200.

In addition, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, so that the waveguide plate 140 can be integrated with the first frame 110, and the waveguide plate 140 does not need to be hung on a side of the fan frame (for example, the first frame 110) away from the fan structure 130. That is, the waveguide plate 140 may be embedded in the first air inlet 112 along the first direction Y, and there may be a spatial overlap between the waveguide plate 140 and the first panel 111 in the first direction Y, so as to reduce the occupied space of the waveguide plate 140 along the first direction Y, thereby reducing the thickness of the fan assembly 100 along the first direction Y, reducing the volume of the fan assembly 100, and improving the space utilization in the computing device 200.

In addition, the waveguide plate 140 can be embedded in the first air inlet 112, and the waveguide plate 140 does not need to be subjected to edge wrapping and other treatments, so that the cost of the waveguide plate 140 is reduced, and the cost of the fan assembly 100 is reduced.

In addition, the waveguide plate 140 may be embedded in the first air inlet 112, so that one fan structure 130 may correspond to one waveguide plate 140, thereby reducing the length of the waveguide plate 140 along the second direction X (the direction intersecting the first direction Y) and improving the installation convenience of the waveguide plate 140.

The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A fan assembly comprising a first housing, a fan structure, a second housing, and a waveguide plate;

the first frame body is connected with the second frame body in a matched manner so as to enclose a fan accommodating cavity; the fan structure is arranged in the fan accommodating cavity; the fan structure comprises a fan main body and fan blades, wherein the fan blades are rotationally connected with the fan main body, and the fan main body is connected with the first frame body and the second frame body;

The first frame body comprises a first panel, and a first air inlet is formed in the first panel; the second frame body comprises a second panel, and a first air outlet is formed in the second panel; the fan blades are used for driving air to flow to the first air outlet through the first air inlet;

the first air inlet is communicated in the first direction, and the waveguide plate is embedded in the first air inlet in the first direction.

2. The fan assembly of claim 1, further comprising:

the limiting plate is positioned between the waveguide plate and the fan main body; the limiting plate is connected with the first frame body so as to limit the displacement of the waveguide plate in the direction approaching to the fan main body.

3. The fan assembly of claim 2, wherein the first panel is further provided with a first connection hole, and the fan body is provided with a second connection hole; the fan assembly further includes:

the first shock absorption connecting piece comprises a first connecting part, a second connecting part and a first buffer part; one end of the first buffer part is connected with the end part of the first connecting part, and the other end of the first buffer part is connected with the end part of the second connecting part; the first connecting part is used for being embedded into the first connecting hole, and the second connecting part is used for being embedded into the second connecting hole;

The first buffer part is positioned between the first panel and the fan main body along the first direction so as to enable a first gap to be formed between the first panel and the fan main body along the first direction; at least a portion of the limiting plate is located in the first gap.

4. A fan assembly as claimed in claim 2 or claim 3, wherein the first panel includes a folded structure which is folded and extended away from the limiting plate to define a first air inlet; the outer peripheral side of the waveguide plate is abutted with the inner peripheral side of the flanging structure so as to be embedded into the first air inlet.

5. The fan assembly of claim 4, further comprising:

the first air inlet grille is positioned on one side, far away from the limiting plate, of the waveguide plate and is connected with the flanging structure so as to limit the displacement of the waveguide plate in the direction far away from the fan main body.

6. The fan assembly of any of claims 2-5 wherein a surface of the waveguide plate on a side adjacent the restrictor plate is flush with a surface of the first panel on a side adjacent the restrictor plate; and/or the number of the groups of groups,

The surface of the waveguide plate far away from one side of the limiting plate is flush with the surface of the first panel far away from one side of the limiting plate.

7. The fan assembly of claim 4 or 5, further comprising:

the fan frame base is provided with a fan frame accommodating cavity in a surrounding mode, the first frame body and the second frame body are both positioned in the fan frame accommodating cavity, and at least one of the first frame body and the second frame body is detachably connected with the fan frame base;

the fan frame base comprises a base panel, a third air inlet is formed in the base panel, and the third air inlet is communicated with the first air inlet; the edge folding structure is embedded in the third air inlet.

8. The fan assembly of any of claims 2-7 wherein the limiting plate is snap-fit with the first frame.

9. The fan assembly of any of claims 1-8 wherein the number of fan structures is at least two, at least two of the fan structures being arranged in a second direction; the second direction intersects the first direction.

10. The fan assembly according to any one of claims 1 to 9, wherein the waveguide plate is provided with a plurality of waveguide holes, the waveguide holes penetrating in the first direction.

11. A computing device, comprising:

an electronic device;

a fan assembly according to any of claims 1 to 10, the electronics being located on the air intake side of the fan assembly.

12. The computing device of claim 11, wherein the electronic device comprises a mechanical hard disk.

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