CN116008300A - Method for determining reasons of abnormal image display, verification test platform and storage medium - Google Patents
Method for determining reasons of abnormal image display, verification test platform and storage medium Download PDFInfo
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- CN116008300A CN116008300A CN202111230743.4A CN202111230743A CN116008300A CN 116008300 A CN116008300 A CN 116008300A CN 202111230743 A CN202111230743 A CN 202111230743A CN 116008300 A CN116008300 A CN 116008300A
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Abstract
The invention discloses a method for determining the cause of image display abnormality, a verification test platform and a storage medium, which are used for solving the technical problem that the cause of the image display abnormality in a flat panel detector cannot be determined rapidly in the prior art, and the method comprises the following steps: acquiring a first key parameter of a flat panel detector and a second key parameter of an image transmission part of a verification test platform during the period that the flat panel detector panel generates detection image data; and when the image display corresponding to the detected image data is abnormal, determining a reason for causing the image display abnormality according to whether the first key parameter and the second key parameter are in the respective corresponding normal ranges.
Description
Technical Field
The present invention relates to the field of detection, and in particular, to a method for determining a cause of an abnormal image display, a verification test platform, and a storage medium.
Background
In the detection field, the X-ray panel is widely used in the industries of medical diagnosis, industrial flaw detection, security inspection, and the like due to the penetration effect, differential absorption, photosensitive effect, and fluorescent effect of the X-rays.
The panel of the X-ray flat panel detector mainly comprises a scintillating material or fluorescent material layer, an amorphous silicon layer with a photodiode and a thin film transistor (Thin Film Transistor, TFT) array structure, wherein the photosensitive imaging principle of the X-ray flat panel detector is that the scintillating material or fluorescent material layer converts X-ray photons into visible light after X-ray exposure, and then the visible light is converted into image electric signals by the amorphous silicon layer with the photodiode to output corresponding image data.
In the prior art, the batch shipment process of the X-ray flat panel detector panels needs to carry out shipment detection on each X-ray flat panel detector panel, mainly an X-ray verification platform is used for testing whether the characteristics of leakage current, residual image and the like of the X-ray flat panel detector panels meet the requirements of clients, but the reasons for the occurrence of image abnormality of the X-ray flat panel detector panels in the testing process cannot be determined, so that testers need to check the reasons for the image abnormality one by one, and the workload of the testers is greatly increased.
In view of this, how to quickly determine the cause of the image abnormality of the X-ray flat panel detector panel during the testing process is a technical problem to be solved.
Disclosure of Invention
The invention provides a method for determining the reason of abnormal image display, a verification test platform and a storage medium, which are used for solving the technical problems in the prior art.
In order to solve the above technical problems, the method for determining abnormal image display provided by the embodiment of the present invention is applied to a verification test platform of a flat panel detector panel, and detected image data collected by the flat panel detector panel is transmitted through an image transmission part of the verification test platform, where the technical scheme of the method is as follows:
acquiring a first key parameter of the flat panel detector panel and a second key parameter of an image transmission part of the verification test platform during the period that the flat panel detector panel generates detection image data;
and when the image display corresponding to the detected image data is abnormal, determining a reason for causing the image display abnormality according to whether the first key parameter and the second key parameter are in the respective corresponding normal ranges.
A possible implementation manner, collecting a first key parameter of the flat panel detector panel and a second key parameter of an image transmission part of the verification test platform, includes:
collecting relevant parameters of each reading chip from the flat panel detector panel and exposure parameters of X rays corresponding to the detected image data; determining the related parameter and the exposure parameter as the first key parameter;
and acquiring the working state of the image transmission part to obtain the second key parameter.
A possible embodiment, determining a cause of the abnormal image display according to whether the first key parameter and the second key parameter are within respective corresponding normal ranges, includes:
judging whether each parameter in the first key parameters is in a corresponding normal range or not;
if any one of the first key parameters is not in the corresponding normal range, determining that the reason for causing the abnormal image display comprises the panel fault of the flat panel detector;
judging whether the second key parameters are consistent with a preset working state or not;
and if the second key parameter is inconsistent with the preset working state, determining that the reason for causing the image abnormality comprises program abnormality of the verification test platform.
A possible implementation, the related parameters include:
the actual operating voltage of the read chip, the actual operating current of the read chip, and the actual operating temperature of the read chip.
In one possible implementation manner, determining whether each parameter of the first key parameters is within a corresponding normal range includes:
when the parameters in the first key parameters are related parameters of the reading chip, judging whether the actual working voltage is larger than the maximum value of the rated voltage of the reading chip, whether the actual working current is larger than the maximum value of the rated current of the reading chip and whether the actual working temperature is larger than the maximum working temperature of the reading chip;
if the actual working voltage is larger than the maximum value of the rated current, determining that the reading chip is short-circuited, wherein the fault of the panel of the flat panel detector comprises abnormal connection of the flip chip film in the panel of the flat panel detector;
if the actual working voltage is greater than the maximum value of the rated current, determining that the reading chip is short-circuited, wherein the fault of the panel of the flat panel detector comprises abnormality of a pin binding area corresponding to the reading chip in the panel of the flat panel detector;
and if the actual working temperature is greater than the maximum working temperature, determining that the working mode of the reading chip is abnormal.
In one possible implementation manner, after determining whether the actual operating voltage is greater than the maximum value of the rated voltage of the reading chip, the method further includes:
after determining that the rated voltage of each reading chip is smaller than or equal to the maximum value of the rated voltage, calculating the voltage difference of the actual working voltages of any two reading chips in the flat panel detector panel;
judging whether the voltage difference is smaller than a set threshold value or not;
if not, correcting the working voltage of each reading chip until the voltage difference is smaller than the set threshold.
A possible implementation, the exposure parameters include:
the time difference between the start of exposure of the X-rays and the start of acquisition of the detected image data.
In one possible implementation manner, determining whether each parameter of the first key parameters is within a corresponding normal range includes:
when the parameters in the first key parameters are exposure parameters of the reading chip, starting timing from the exposure starting time until stopping timing when the detection image data is acquired, and obtaining the time difference;
judging whether the time difference is in a setting range corresponding to the X-ray preset polishing dose or not;
and if the time difference is out of the set range, determining that the actual polishing dose of the X-rays is inconsistent with the preset polishing dose, wherein the fault of the panel of the flat panel detector comprises deflection of the X-ray polishing position.
In a second aspect, an embodiment of the present invention provides a verification test platform for a flat panel detector panel, including:
a data acquisition section for acquiring a first key parameter of a flat panel detector panel during generation of detection image data by the flat panel detector panel;
the image transmission part is used for acquiring the detection image data, the first key parameters and the second key parameters from the flat panel detector panel and transmitting the detection image data to an upper computer; wherein the second key parameter is used for representing the working state of the image transmission part;
the upper computer performs the method as described in the first aspect.
A possible embodiment, the data acquisition portion includes:
the voltage sensor is used for collecting the actual working voltage of the reading chip in the panel of the flat panel detector;
the current sensor is used for collecting the actual working current of the reading chip;
the temperature sensor is arranged on the surface of the reading chip and used for collecting the actual working temperature of the reading chip.
A possible implementation manner, the data acquisition part further includes:
and the X-ray sensor is used for detecting the X-rays, and is arranged at one side, close to the flat panel detector panel, of the two ends of the X plate and the Y plate in the rear-end image transmission part and used for determining exposure parameters of the flat panel detector panel.
In a third aspect, an embodiment of the present invention further provides a readable storage medium, including:
the memory device is used for storing the data,
the memory is configured to store instructions that, when executed by the processor, cause an apparatus comprising the readable storage medium to perform the method as described in the first aspect above.
Drawings
FIG. 1 is a flowchart of a method for determining the cause of an abnormal image display according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a verification test platform for a flat panel detector panel according to an embodiment of the present invention;
FIG. 3 is a schematic diagram showing the relative positions of a read chip, a current sensor and a voltage sensor according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing connection between a current sensor and a voltage sensor according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a position of a temperature sensor according to an embodiment of the present invention;
FIG. 6 is a graph showing a relationship between voltage offset and operating temperature of a read chip according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating a position of an X-ray sensor according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a program interface in a host computer according to an embodiment of the present invention;
fig. 9 is a schematic diagram of actual gray value differences of images corresponding to different reading chips in a flat panel detector according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another verification test platform for a flat panel detector panel according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a method for determining the reason of abnormal image display, a verification test platform and a storage medium, so as to solve the technical problems in the prior art.
In order to better understand the above technical solutions, the following detailed description of the technical solutions of the present invention is made by using the accompanying drawings and specific embodiments, and it should be understood that the specific features of the embodiments and the embodiments of the present invention are detailed descriptions of the technical solutions of the present invention, and not limiting the technical solutions of the present invention, and the technical features of the embodiments and the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, an embodiment of the present invention provides a method for determining a cause of an abnormal image display, which is applied to a verification test platform for verifying and testing a flat panel detector panel, wherein detected image data collected by the flat panel detector panel is transmitted through an image transmission portion of the verification test platform, and a processing procedure of the detection method is as follows.
Step 101: acquiring a first key parameter of the flat panel detector panel and a second key parameter of an image transmission part of the verification test platform during the generation of the detection image data by the flat panel detector panel;
step 102: when the image corresponding to the image data is abnormal in display, determining the reason for causing the abnormal image display according to whether the first key parameter and the second key parameter are in the respective corresponding normal ranges.
Fig. 2 is a schematic structural diagram of a verification test system for a flat panel detector panel according to an embodiment of the present invention.
The verification test system of the flat panel detector panel comprises a data acquisition part (not shown in fig. 2), an image transmission part and an upper computer, when the flat panel detector panel is subjected to shipment detection, the flat panel detector panel transmits the generated detection image data to the upper computer through the data transmission part, and simultaneously the data acquisition part synchronously transmits first key parameters and second key parameters acquired in the process of generating the detection image data by the flat panel detector panel to the upper computer for analysis, so that the upper computer executes step 101 and step 102.
The panel of the flat panel detector comprises a panel (namely an X-ray detection area), a gate circuit chip and a reading chip.
The panel in the panel of the flat panel detector consists of a scintillating material or fluorescent material layer, an amorphous silicon layer with a photodiode and a TFT array structure, and the photosensitive imaging principle is that the scintillator or fluorescent material layer converts X-ray photons into visible light after X-ray exposure, and then the amorphous silicon layer with the photodiode converts the visible light into image charge numbers.
The read chip (Read Out Integrated Circuit, ROIC) converts the image charge signal output from the panel into a digital signal (i.e., image data, referred to herein as sensed image data).
A Gate chip (Gate IC) for controlling the charge amount output of each row of pixels in the panel.
The data transmission part in the verification test platform comprises an X plate, a Y plate and a transmission line.
And the Y plate is used for binding an interface of the reading chip and transmitting a control signal received from the X plate to the reading chip, so that the control of each row of pixels in the panel of the flat panel detector is realized.
And the X plate is used for controlling the reading chip and the gate circuit chip and transmitting the detection image data acquired from the reading chip to the upper computer for display.
For example, when the X-ray flat panel detector panel receives an instruction from the host computer and starts exposure during shipment detection, the panel in the X-ray flat panel detector panel performs image acquisition (that is, pixels in the control panel convert optical signals into charge signals line by line, and a reading chip converts the charge signals into detection image data), and in the process of performing image acquisition (that is, during the period of generating the detection image data), the data acquisition part in the verification test platform also needs to acquire the first key parameter of the X-ray detector panel and the second key parameter of the image transmission part at the same time, so that the host computer obtains the detection image data acquired by the flat panel detector panel at the same time, and the first key parameter and the second key parameter.
After the upper computer obtains the first key parameter and the second key parameter, when the image display corresponding to the detected image data is abnormal, whether the reason for causing the abnormal image display is caused by the factors of the panel of the flat panel detector or not can be determined according to whether the first key parameter and the second key parameter are in the normal range corresponding to each other or not, so that the quick searching and finding of problems by detection personnel and maintenance personnel are facilitated, and the detection maintenance cost of the panel of the flat panel detector is reduced.
In the above step 101, the acquisition of the first key parameter of the flat panel detector panel and the second key parameter of the image transmission part of the verification test platform may be achieved by:
collecting relevant parameters of each reading chip from a panel of the flat panel detector, and detecting exposure parameters of X rays corresponding to image data; determining the relevant parameters and the exposure parameters as first key parameters; and acquiring the working state of the image transmission part to obtain a second key parameter.
The relevant parameters of the reading chip include the actual working voltage of the reading chip, the actual working current of the reading chip and the actual working temperature of the reading chip. The exposure parameter is the time difference between the beginning of the exposure of the X-ray in the panel of the flat panel detector and the beginning of the acquisition of the image data by the reading chip.
For example, taking fig. 2 as an example, during generation of the detection image data, the actual operating voltage, the actual operating current, and the actual operating temperature of the read chip may be acquired by a voltage sensor, a current sensor, and a temperature sensor provided on the read chip.
The voltage sensor is usually arranged between a reference voltage (Vref) and a ground voltage (V) GND ) The voltage sensor is a common voltage sensor, the voltage range is selected according to the signal range of the reading chip, and if the signal range of the reading chip is 0.5-4.5V, the voltage range of the voltage sensor is +/-5V.
The current sensor is usually arranged on a high-power integrated power supply pin (AVDDI) and a common pin (such as AVDDI) 2 、AVSSI 2 ) The current sensor can be a common current sensor, the current range of the current sensor can be selected according to related data in the technical specification of the reading chip, for example, the current requirement of an AVDDI pin of the reading chip is smaller than 80mA, and the measuring range of the current sensor is set at a mA level. If the current sensor has a maximum measurable range, but a part of the maximum measurable range of the current sensor is selected in practical use, the selected part of the maximum measurable range is the measurement range of the current sensor, for example, the maximum measurable range of the current sensor is ±5a, and the current requirement of the AVDDI pin in the reading chip is less than 80mA, in order to measure such small current, the measurement accuracy of the LTC3991 may be set to 1.223mA, so that the actual measurement range is 0-313 mA, that is, the measurement range of the current of the AVDDI pin in the reading chip measured by the current sensor is selected by the current sensor.
Fig. 3 is a schematic diagram showing relative positions of a read chip, a current sensor, and a voltage sensor according to an embodiment of the present invention. The current sensor and the voltage sensor are illustrated in fig. 3 as one graph, but it should not be understood that they are the same sensor, in fact they are different sensors. Fig. 4 is a schematic diagram showing connection between a current sensor and a voltage sensor according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a position of a temperature sensor according to an embodiment of the invention. In fig. 5, the reading chip is disposed on a corresponding board card in the panel of the flat panel detector, and the temperature sensor is disposed on the surface of the reading chip and belongs to the data acquisition part of the verification test flat panel, where the measurement range of the temperature sensor may be selected according to the highest operating temperature of the reading chip, for example, the highest operating temperature of the reading chip is 70 ℃, and the measurement range of the temperature sensor may be selected to be 0-120 ℃. The temperature sensor may be a thermistor sensor.
As shown in fig. 6, which is a graph of the relationship between the voltage offset and the operating temperature of the reading chip provided by the embodiment of the invention, in fig. 6, the horizontal axis is the operating temperature (corresponding to the range of 0 to 120 ℃), the vertical axis is the offset voltage (corresponding to the range of-250 to 1250 uV), and the operating temperature range of the reading chip is assumed to be 0 to 70 ℃, it can be seen from fig. 6 that when the reading chip exceeds the maximum operating temperature, the excessively high temperature has a larger influence on the voltage offset of the reading chip, thereby affecting the output result and the service life of the chip, so that the abnormal image display caused by the fact can be found in time by detecting the actual operating temperature of the reading chip.
The sensor can acquire the actual working temperature, the actual working current and the actual working voltage of the reading chip, and obtain the data of the relevant parameters of the reading chip.
Fig. 7 is a schematic diagram of a position of an X-ray sensor according to an embodiment of the invention. In order to detect when the X-ray starts exposure, an X-ray sensor is required to be arranged on the X-plate and the Y-plate, specifically, the X-ray sensor can be arranged at the positions, close to the panel of the flat panel detector, of the two ends of the X-plate/Y-plate, and the exposure parameters can be obtained by acquiring the time difference between the time of starting to acquire the detection image data and the time of starting to expose the X-ray, so that the exposure parameters and the related parameters of the reading chip are used as first key parameters.
The voltage sensor, the current sensor, the temperature sensor and the X-ray sensor form a data acquisition part of the verification test platform.
Fig. 8 is a schematic diagram of a program interface in a host computer according to an embodiment of the invention. The related settings of the first key parameter and the second key parameter can be completed in the program interface, and the image corresponding to the detected image data, the first key parameter and the second key parameter are displayed. The program interface shown in fig. 8 is divided into three parts, the left side is an upper computer acquisition instruction area, the specification of the acquired image is selected, and the connection condition of the circuit board is explained; the middle part is a display area, and the acquired image is reduced to a software block diagram area in an equal ratio mode, so that the preview of a tester is facilitated; the right is a panel state monitoring area, and relevant parameters of each reading chip corresponding to the panel and the working mode are checked, so that the testing personnel can conveniently check the problems. The working state of the program in the upper computer can be divided into an idle state, an acquisition state and a window event (window_time), the states can be judged according to the data transmission state, and the problem caused by program abnormality can be eliminated by detecting and analyzing the working state of the program in the upper computer. According to the data transmission state, the working state (namely, the second key parameter) of the image transmission part can be determined, if the working state (the preset working state) set in the upper computer is inconsistent with the working state of the image transmission part, the program is determined to be abnormal, and the program abnormality can cause abnormal image display.
After the first key parameter and the second key parameter are obtained, the upper computer determines the reason for causing the abnormal image display according to whether the first key parameter and the second key parameter are in the respective corresponding normal range, and the method can be realized by the following steps:
judging whether each parameter in the first key parameters is in a corresponding normal range; if any one of the first key parameters is not in the corresponding normal range, determining that the reasons for causing abnormal image display comprise panel faults of the flat panel detector; judging whether the second key parameter is consistent with a preset working state or not; if the second key parameter is inconsistent with the preset working state, determining the reason for causing the image abnormality comprises verifying the program abnormality of the test platform.
For example, taking the actual working temperature in the first key parameter as an example, assuming that the acquired actual working temperature is 80 ℃ and the normal working temperature range of the reading chip is 0-70 ℃, it can be determined that the actual working temperature is not in the corresponding normal range, so that the reasons for causing the image abnormality can be determined to include panel faults of the flat panel detector; further judging whether the second key parameter (namely the working state of the image transmission part) is consistent with a preset working state (namely the working state set by the upper computer), and if the second key parameter is inconsistent, determining that the reason for causing the abnormal image display also comprises program abnormality of the verification test platform; if the second key parameter is consistent with the preset working state, determining that the reason for causing the image abnormality only comprises the panel fault of the flat panel detector.
In one possible implementation manner, the determining whether each parameter in the first key parameters is within the corresponding normal range may be implemented by the following manner:
when the parameters in the first key parameters are related parameters of the reading chip, judging whether the actual working voltage is larger than the maximum value of the rated voltage of the reading chip, whether the actual working current is larger than the maximum value of the rated current of the reading chip and whether the actual working temperature is larger than the maximum working temperature of the reading chip; if the actual working voltage is greater than the maximum value of rated current, determining that the read Chip is short-circuited, wherein the panel fault of the flat panel detector comprises abnormal connection of a Chip On Film (COF) in the panel of the flat panel detector; if the actual working voltage is greater than the maximum value of rated current, determining that the reading chip is short-circuited, wherein the fault of the panel of the flat panel detector comprises abnormality of a pin binding area corresponding to the reading chip in the panel of the flat panel detector; if the actual working temperature is greater than the maximum working temperature, determining that the working mode of the reading chip is abnormal.
For example, the actual working voltage of the reading chip is 6V, the maximum value of the rated working voltage is 5V, it can be determined that the actual working voltage is greater than the maximum value of the rated working voltage, and further it is determined that the reading chip is shorted, and the panel fault of the flat panel detector includes abnormality of the pin binding area corresponding to the reading chip in the panel of the flat panel detector.
And if the actual working current of the reading chip is 1A and the maximum value of the rated working current is 80mA, the fact that the actual working current is larger than the maximum value of the rated working current can be determined, and further the short circuit of the reading chip is determined, and the panel fault of the flat panel detector comprises abnormal COF connection in the panel of the flat panel detector.
For another example, if the actual working temperature of the reading chip is 100 ℃, and the normal working temperature range of the reading chip is 0-70 ℃, it is obvious that the actual working temperature of the reading chip is greater than the maximum working temperature, so that the abnormal working mode of the reading chip can be determined.
In other words, according to whether each parameter in the related parameters of the reading chip is in the corresponding normal range, the detailed reason causing the abnormal image display can be further determined, so that the detection personnel and the maintenance personnel can quickly and accurately find faults according to the detailed reason, and the time for detecting and maintaining the panel of the flat panel detector is reduced.
Further, after judging whether the actual working voltage is greater than the maximum value of the rated voltage of the reading chip, the method further comprises:
after determining that the rated voltage of each reading chip is smaller than or equal to the maximum value of the rated voltage, calculating the voltage difference of the actual working voltages of any two reading chips in the panel of the flat panel detector; judging whether the voltage difference is smaller than a set threshold value or not; if not, correcting the working voltage of each reading chip until the voltage difference is smaller than the set threshold value.
Generally speaking, the read chips used in the flat panel detector panel are all of the same regular type, after determining that the rated voltage of each read chip in the flat panel detector panel is smaller than the maximum value of the rated operating voltage, the voltage difference between any two read chips in the flat panel detector panel (i.e. the difference value of the corresponding actual operating voltages) can be further reduced, if the voltage difference is smaller than the set threshold (e.g. 0.01V), it is indicated that the actual operating voltages of the two read chips are almost the same; if the voltage difference between the two reading chips is greater than or equal to the set threshold, it is indicated that the actual working voltage difference between the two reading chips is large, and correction is needed until the voltage difference is smaller than the set threshold. Because the number of the read chips in the flat panel detector panel is large, when the voltage difference of the actual working voltages of any two read chips is greater than or equal to the set threshold value, the working voltages of all the read chips need to be corrected until all the voltage differences are smaller than the set threshold value.
It is assumed that the reference voltage (Vref) of the read chip may range from 0.5V to 4.5V, the maximum gray scale range at full scale is from 0 to 65535, and the theoretical gray scale value varies by about 163 for a voltage variation of 0.01V, as known from the technical specifications of the read chip. However, in practical applications, the relationship between the voltage variation and the gray value variation between the read chips with different actual operating voltages is not a linear variation relationship as described above due to environmental influences (such as ambient light) and different setting parameters, as shown in fig. 9, which is a schematic diagram of actual gray value differences of corresponding images of different read chips in the flat panel detector provided by the embodiment of the present invention. Assuming that there are 8 read chips in the flat panel detector, they are shown as 8 histograms in fig. 9 for the displayed image, the leftmost 3 histograms correspond to the read chips 1 to 3 in turn, taking the read chip 2 and the read chip 3 as examples, the average gray value of the image corresponding to the read chip 2 can be determined to be 7972.257 by practical measurement, the average gray value of the image corresponding to the read chip 3 is 8039.102, therefore, the average gray values of the two read chips differ by 67, and although the mean square error of the detected image data corresponding to the image between the respective read chips is about 5, the mean square error of the whole image corresponding to the different read chips is 22 due to the difference of the average gray values of the respective read chips, which affects the uniformity of the detected image data corresponding to the image output by the flat panel detector.
By the method provided by the invention, whether the voltage difference of the actual working voltages of any two reading chips in the flat panel detector panel is smaller than the set threshold value is determined, and then the actual working voltages of the reading chips in the flat panel detector panel are corrected when the voltage difference of the actual working voltages of any two reading chips is smaller than the set threshold value, so that the situation that the actual working voltages of different reading chips are large in difference can be found out in time, the voltage difference is corrected in time, the influence of the actual working voltages of the reading chips on gray scales in detected image data is eliminated, and the uniformity of images corresponding to the detected image data is improved.
Further, when the parameter in the first key parameter is the exposure parameter of the read chip, determining whether each parameter in the first key parameter is in the corresponding normal range may be implemented by the following manner:
timing from the time of exposure start until the timing is stopped when the acquisition of the detection image data is started, and obtaining a time difference; judging whether the time difference is in a set range corresponding to the X-ray preset polishing dose; if the time difference is out of the set range, determining that the actual polishing dose of the X-rays is inconsistent with the preset polishing dose, wherein the fault of the panel of the flat panel detector comprises deflection of the X-ray polishing position.
For example, a timer is started to start counting when the X-rays in the flat panel detector panel start exposure, and the timer is stopped to count until the reading chip starts collecting image data, so that a time difference from the start of exposure to the start of collecting image data can be obtained. Assuming that the polishing dose of the X-ray is set as a by the upper computer, according to the polishing dose a, the normal time difference range (namely the setting range) from the start of exposure of the X-ray to the start of acquisition of the detection image data can be determined, whether the time difference is in the setting range or not is further judged, if not, the fact that the actual polishing dose of the X-ray is inconsistent with the preset polishing dose is determined, and the panel fault of the flat panel detector comprises the deflection of the X-ray polishing position.
In the embodiment provided by the invention, whether the image display abnormality is caused by the deflection of the X-ray lighting position can be determined by judging whether the time difference from the start of the exposure of the X-ray to the start of the acquisition of the detection image data is within the setting range corresponding to the X-ray preset lighting dose, so that the efficiency of determining the reason for the image display abnormality is further improved, the image display abnormality caused by different gray scales of the displayed image caused by different doses of the X-ray is avoided, the detection personnel and the maintenance personnel can quickly position the fault position, and the detection and maintenance efficiency is improved.
Based on the same inventive concept, an embodiment of the present invention provides a verification test platform for a flat panel detector panel, please refer to fig. 10, the verification test platform includes:
a data acquisition section 1001 for acquiring a first key parameter of a flat panel detector panel during generation of detected image data by the flat panel detector panel;
an image transmission part 1002, configured to acquire the detected image data and the corresponding first key parameter and second key parameter from the flat panel detector panel, and transmit the detected image data and the corresponding first key parameter and second key parameter to the host computer 1003; wherein the second key parameter is used for representing the working state of the image transmission part;
the host computer 1003 executes a method of determining the cause of the image display abnormality as described above. The specific implementation of the detection method can be referred to the description of the method embodiment, and the repetition is not repeated.
A possible implementation manner, the data acquisition portion 1001 includes:
the voltage sensor is used for collecting the actual working voltage of the reading chip in the panel of the flat panel detector;
the current sensor is used for collecting the actual working current of the reading chip;
the temperature sensor is arranged on the surface of the reading chip and used for collecting the actual working temperature of the reading chip.
In one possible implementation, the data acquisition portion 1001 further includes:
and the X-ray sensor is used for detecting the X-rays, and is arranged at one side, close to the flat panel detector panel, of the two ends of the X plate and the Y plate in the rear-end image transmission part and used for determining exposure parameters of the flat panel detector panel.
Based on the same inventive concept, an embodiment of the present invention also provides a readable storage medium, including:
the memory device is used for storing the data,
the memory is configured to store instructions that, when executed by the processor, cause an apparatus comprising the readable storage medium to perform the method of determining a cause of an image display abnormality as described above.
The readable storage medium may be any available medium or data storage device that can be accessed by a processor, including volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. By way of example, and not limitation, nonvolatile Memory can include Read-Only Memory (ROM), programmable ROM (Programmable Read-Only Memory, PROM), electrically programmable ROM (Erasable Programmable Read-Only Memory, EPROM), electrically erasable programmable ROM (Electrically Erasable Programmable Read Only Memory, EEPROM) or flash Memory, solid State Disk (Solid State Disk or Solid State Drive, SSD), magnetic Memory (e.g., floppy Disk, hard Disk, magnetic tape, magneto-Optical Disk (MO), etc.), optical Memory (e.g., CD, DVD, BD, HVD, etc.). Volatile memory can include random access memory (Random Access Memory, RAM), which can act as external cache memory. By way of example, and not limitation, RAM is available in a variety of forms, such as dynamic RAM (Dynamic Random Access Memory, DRAM), synchronous DRAM (Synchronous Dynamic Random-Access Memory, SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (EnhancedSynchronousDRAM, ESDRAM), synchronous Link DRAM (SLDRAM). The storage devices of the disclosed aspects are intended to comprise, without being limited to, these and other suitable types of memory.
It will be appreciated by those skilled in the art that embodiments of the invention may be provided as a method, system, or program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Moreover, embodiments of the invention may take the form of a computer program product embodied on one or more readable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer/processor-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These program instructions may also be stored in a readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer/processor implemented process such that the instructions which execute on the computer/processor or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (12)
1. A method for determining the cause of an image display abnormality, applied to a verification test platform for verifying a flat panel detector panel, wherein detected image data collected by the flat panel detector panel is transmitted through an image transmission part of the verification test platform, comprising:
acquiring a first key parameter of the flat panel detector panel and a second key parameter of an image transmission part of the verification test platform during the period that the flat panel detector panel generates detection image data;
and when the image display corresponding to the detected image data is abnormal, determining a reason for causing the image display abnormality according to whether the first key parameter and the second key parameter are in the respective corresponding normal ranges.
2. The method of claim 1, wherein acquiring the first key parameter of the flat panel detector panel and the second key parameter of the image transmission portion of the verification test platform comprises:
collecting relevant parameters of each reading chip from the flat panel detector panel and exposure parameters of X rays corresponding to the detected image data; determining the related parameter and the exposure parameter as the first key parameter;
and acquiring the working state of the image transmission part to obtain the second key parameter.
3. The method of claim 2, wherein determining a cause of the image display abnormality based on whether the first key parameter and the second key parameter are within respective corresponding normal ranges comprises:
judging whether each parameter in the first key parameters is in a corresponding normal range or not;
if any one of the first key parameters is not in the corresponding normal range, determining that the reason for causing the abnormal image display comprises the panel fault of the flat panel detector;
judging whether the second key parameters are consistent with a preset working state or not;
and if the second key parameter is inconsistent with the preset working state, determining that the reason for causing the image abnormality comprises program abnormality of the verification test platform.
4. A method according to claim 3, wherein the relevant parameters include:
the actual operating voltage of the read chip, the actual operating current of the read chip, and the actual operating temperature of the read chip.
5. The method of claim 4, wherein determining whether each of the first key parameters is within a corresponding normal range comprises:
when the parameters in the first key parameters are related parameters of the reading chip, judging whether the actual working voltage is larger than the maximum value of the rated voltage of the reading chip, whether the actual working current is larger than the maximum value of the rated current of the reading chip and whether the actual working temperature is larger than the maximum working temperature of the reading chip;
if the actual working voltage is larger than the maximum value of the rated current, determining that the reading chip is short-circuited, wherein the fault of the panel of the flat panel detector comprises abnormal connection of the flip chip film in the panel of the flat panel detector;
if the actual working voltage is greater than the maximum value of the rated current, determining that the reading chip is short-circuited, wherein the fault of the panel of the flat panel detector comprises abnormality of a pin binding area corresponding to the reading chip in the panel of the flat panel detector;
and if the actual working temperature is greater than the maximum working temperature, determining that the working mode of the reading chip is abnormal.
6. The method of claim 5, wherein after determining whether the actual operating voltage is greater than a maximum value of the nominal voltage of the read chip, further comprising:
after determining that the rated voltage of each reading chip is smaller than or equal to the maximum value of the rated voltage, calculating the voltage difference of the actual working voltages of any two reading chips in the flat panel detector panel;
judging whether the voltage difference is smaller than a set threshold value or not;
if not, correcting the working voltage of each reading chip until the voltage difference is smaller than the set threshold.
7. A method according to claim 3, wherein the exposure parameters include:
the time difference between the start of exposure of the X-rays and the start of acquisition of the detected image data.
8. The method of claim 6, wherein determining whether each of the first key parameters is within a corresponding normal range comprises:
when the parameters in the first key parameters are exposure parameters of the reading chip, starting timing from the exposure starting time until stopping timing when the detection image data is acquired, and obtaining the time difference;
judging whether the time difference is in a setting range corresponding to the X-ray preset polishing dose or not;
and if the time difference is out of the set range, determining that the actual polishing dose of the X-rays is inconsistent with the preset polishing dose, wherein the fault of the panel of the flat panel detector comprises deflection of the X-ray polishing position.
9. A flat panel detector panel verification test platform, comprising:
a data acquisition section for acquiring a first key parameter of a flat panel detector panel during generation of detection image data by the flat panel detector panel;
the image transmission part is used for acquiring the detection image data, the first key parameters and the second key parameters from the flat panel detector panel and transmitting the detection image data to an upper computer; wherein the second key parameter is used for representing the working state of the image transmission part;
the upper computer performs the method of any of claims 1-8.
10. The verification test platform of claim 9, wherein the data acquisition portion comprises:
the voltage sensor is used for collecting the actual working voltage of the reading chip in the panel of the flat panel detector;
the current sensor is used for collecting the actual working current of the reading chip;
the temperature sensor is arranged on the surface of the reading chip and used for collecting the actual working temperature of the reading chip.
11. The verification test platform of claim 10, wherein the data acquisition portion further comprises:
and an X-ray sensor for detecting the X-rays, wherein the X-ray sensor is arranged at one side of the rear-end image transmission part, which is close to the flat panel detector, of the two ends of the X-plate and the Y-plate, and is used for determining the exposure parameters of the flat panel detector panel.
12. A readable storage medium comprising a memory,
the memory is configured to store instructions that, when executed by a processor, cause an apparatus comprising the readable storage medium to perform the method of any of claims 1-8.
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