CN116007775A - Food temperature measurement method and device, storage medium and electronic equipment - Google Patents
Food temperature measurement method and device, storage medium and electronic equipment Download PDFInfo
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Abstract
The embodiment of the application discloses a food temperature measurement method, device, storage medium and electronic equipment, wherein, the method is applied to food thermometer, food thermometer includes infrared temperature measurement module and thermocouple temperature measurement module, infrared temperature measurement module includes infrared sensor, the method includes: acquiring a first resistance value of the infrared sensor when the infrared sensor measures the ambient temperature; determining a first voltage of a reference end of the thermocouple temperature measuring module according to the first resistance value; acquiring a second voltage of a measuring end of the thermocouple temperature measuring module when the thermocouple temperature measuring module is inserted into food; determining an internal temperature of the food product based on the first voltage and the second voltage. By adopting the embodiment of the application, the temperature compensation can be carried out on the thermocouple reference end through the infrared temperature measurement module, so that the cost of thermocouple temperature measurement is reduced.
Description
Technical Field
The application relates to the field of electronic temperature measurement, in particular to a food temperature measurement method, a food temperature measurement device, a storage medium and electronic equipment.
Background
The temperature is an important and common parameter in the food production process, the measurement and correction of the temperature plays a very important role, and in food generation places such as cake houses, laboratories, barbecue shops and restaurants, the surface temperature of a high-temperature and hard object needs to be measured remotely by an infrared sensor, and the temperature measurement object with inconsistent surface and internal temperature needs to be inserted into the interior of the object by a thermocouple probe to measure the temperature.
When measuring temperature using a thermocouple, the magnitude of the thermoelectric voltage is related not only to the temperature at the measurement end but also to the temperature at the reference end. In the actual measurement process, the temperature of the reference end is difficult to be constant, the reference end is easy to generate temperature measurement errors, and the prior art generally adopts the methods of external equipment such as ice bath, compensation wires, bridge compensation and the like to carry out temperature compensation on the reference end for thermocouple temperature measurement, so that the cost for thermocouple temperature measurement is higher.
Disclosure of Invention
The application provides a food temperature measurement method, a device, a storage medium and electronic equipment, which can carry out temperature compensation on a thermocouple reference end through an infrared temperature measurement module, so that the cost of thermocouple temperature measurement is reduced.
In a first aspect of the present application, a food temperature measurement method is provided, applied to a food temperature measurement meter, the food temperature measurement meter including an infrared temperature measurement module and a thermocouple temperature measurement module, the infrared temperature measurement module including an infrared sensor, the method comprising:
acquiring a first resistance value of the infrared sensor when the infrared sensor measures the ambient temperature;
determining a first voltage of a reference end of the thermocouple temperature measuring module according to the first resistance value;
acquiring a second voltage of a measuring end of the thermocouple temperature measuring module when the thermocouple temperature measuring module is inserted into food;
determining an internal temperature of the food product based on the first voltage and the second voltage.
By adopting the technical scheme, the environment temperature measured by the infrared temperature measuring module is used as the reference end temperature of the thermocouple temperature measurement, so that the temperature compensation is carried out on the thermocouple temperature measuring module, and meanwhile, the infrared temperature measuring module and the thermocouple temperature measuring module are integrated in the food thermometer, so that the temperature compensation method is lower in cost compared with the traditional thermocouple temperature measuring temperature compensation method.
Optionally, the determining, according to the first resistance, the first voltage of the reference end of the thermocouple temperature measurement module includes:
Determining a first temperature corresponding to the first resistance value according to a resistance and temperature relation table of the infrared sensor;
and determining the first voltage of the reference end of the thermocouple temperature measuring module corresponding to the first temperature according to a voltage and temperature relation table of the thermocouple temperature measuring module.
By adopting the technical scheme, the environment temperature measured by the infrared sensor is used as the temperature of the reference end of the thermocouple temperature measuring module, the thermocouple temperature measuring module is subjected to temperature compensation, and compared with the existing temperature compensation method for thermocouple temperature measurement, the temperature compensation method is lower in cost.
Optionally, the determining the internal temperature of the food product according to the first voltage and the second voltage includes:
adding the first voltage and the second voltage to obtain a target voltage;
and determining the internal temperature of the food corresponding to the target voltage according to a voltage and temperature relation table of the thermocouple temperature measuring module.
By adopting the technical scheme, the ambient temperature measured by the infrared sensor is converted into the thermocouple reference terminal voltage, so that the thermocouple temperature measuring module is subjected to temperature compensation, and the accuracy of thermocouple temperature measurement is improved.
Optionally, after determining the internal temperature of the food according to the first voltage and the second voltage, the method further includes:
Calibrating the internal temperature according to the intermediate temperature relation to obtain a calibration voltage;
dividing the calibration voltage by the second voltage to obtain a calibration coefficient;
according to the calibration coefficient, calibrating a voltage and temperature relation table of the thermocouple temperature measurement module;
the intermediate temperature relation is:
U(0，T OBJ )＝U 1 (T STA ，T RN )+U 2 (T RN ，T OBJ )；
wherein U is a calibration voltage; t (T) RN Is ambient temperature; t (T) STA Is the standard test temperature; t (T) OBJ Is the internal temperature; u (U) 1 Is the reference terminal voltage; u (U) 2 For measuring the terminal voltage.
By adopting the technical scheme, the internal temperature is calibrated by adopting the intermediate temperature relation to obtain the calibration voltage, so that the calibration coefficient is obtained according to the calibration voltage, and the voltage and temperature relation table of the thermocouple temperature measuring module is calibrated by the calibration coefficient, so that the accuracy of thermocouple temperature measurement is improved.
Optionally, the infrared temperature measurement module further includes a thermopile temperature measurement unit, and the method further includes:
acquiring a second resistance value of the infrared sensor and a third voltage of the thermopile when the infrared temperature measurement module measures the ambient temperature when measuring the surface temperature of food;
substituting the second resistance value into a resistance and temperature relation table of the infrared sensor to obtain a second temperature corresponding to the second resistance;
Substituting the second temperature into a temperature curve offset table of the infrared sensor to obtain a voltage offset value of the second temperature and a standard temperature;
substituting the voltage deviation value and the third voltage into a calibration formula of the infrared temperature measurement module to obtain an infrared calibration voltage; substituting the infrared calibration voltage into a voltage and temperature relation table of the infrared temperature measurement module to obtain the surface temperature of the food; the calibration formula of the infrared temperature measurement module is as follows: u (U) fix ＝(V n -V offset )*A；
In U fix Is a calibration voltage; v (V) n A current third voltage for the thermopile; v (V) offset For voltage deviationA value; a is a calibration coefficient.
By adopting the technical scheme, the temperature measured by the infrared temperature measuring module is calibrated by adopting the calibration formula of the infrared temperature measuring module, so that the accuracy of the infrared temperature measuring module is improved.
Optionally, after substituting the second resistance value into the table of the relationship between the resistance and the temperature of the infrared sensor, the method further includes:
if the resistance value corresponding to the second resistor does not exist in the resistance and temperature relation table of the infrared sensor, a third resistance value and a fourth resistance value which are closest to the resistance value of the second resistor in the resistance and temperature relation table are obtained, wherein the third resistance value is smaller than the second resistance value, and the fourth resistance value is larger than the second resistance value;
Substituting the third resistance value and the fourth resistance value into a temperature formula of the infrared sensor to obtain the second temperature corresponding to the second resistance;
the temperature formula is as follows:
wherein R2 is a second resistance corresponding to the second resistor; r3 is a third resistance value; r4 is a fourth resistance value; t2 is a second temperature; t3 is the temperature corresponding to a third resistance value in the resistance and temperature relation table of the infrared sensor; t4 is the temperature corresponding to the fourth resistance value in the relation table of the resistance and the temperature of the infrared sensor.
By adopting the technical scheme, when the resistance corresponding to the second resistance does not exist in the temperature relation table, the second temperature corresponding to the second resistance is calculated by combining the resistance with the two resistors closest to the second resistance in the temperature relation table and the temperature formula, so that the accuracy of temperature measurement of the infrared temperature measurement module is improved.
Optionally, the collecting the current ambient temperature by the infrared temperature measurement module, and before obtaining the current second resistance value of the infrared sensor and the current third voltage of the thermopile, further includes:
after the food thermometer is placed in a standard temperature environment for a preset time, the infrared sensor measures the experimental voltage of the blackbody; substituting the experimental voltage into a voltage and temperature relation table of the infrared sensor to obtain an experimental temperature corresponding to the experimental voltage; dividing the experimental temperature by the calibration temperature of the black body to obtain a calibration coefficient in a calibration formula of the infrared temperature measurement module.
By adopting the technical scheme, the thermopile in the infrared temperature measuring module is calibrated before the temperature measurement of the infrared temperature measuring module, so that the accuracy of the infrared temperature measuring module is improved.
In a second aspect of the present application there is provided a food product temperature measuring device, the device comprising:
the first resistance value acquisition module is used for acquiring a first resistance value of the infrared sensor when the infrared sensor measures the ambient temperature;
the first voltage determining module is used for determining a first voltage of a reference end of the thermocouple temperature measuring module according to the first resistance value;
the second voltage acquisition module is used for acquiring a second voltage of a measuring end of the thermocouple temperature measurement module when the thermocouple temperature measurement module is inserted into food;
and the internal temperature determining module is used for determining the internal temperature of the food according to the first voltage and the second voltage.
In a third aspect the present application provides a computer readable storage medium storing a plurality of instructions adapted to be loaded by a processor and to perform the above-described method steps.
In a fourth aspect of the present application, there is provided an electronic device comprising: a processor, a memory; wherein the memory stores a computer program adapted to be loaded by the processor and to perform the above-mentioned method steps.
In summary, the present application includes at least one of the following beneficial effects:
1. by adopting the technical scheme, the environment temperature measured by the infrared temperature measuring module is used as the reference end temperature of the thermocouple temperature measurement, so that the temperature compensation is performed on the thermocouple temperature measuring module, meanwhile, the infrared temperature measuring module and the thermocouple temperature measuring module are integrated in the food thermometer, and compared with the existing thermocouple temperature measuring temperature compensation method, the cost is lower.
2. The food thermometer in the application adopts two-in-one of the infrared temperature measuring module and the thermocouple temperature measuring module, so that the surface temperature of food can be measured, the internal temperature of the food can be measured, the cost of the food thermometer is low, and the cost performance is higher;
3. the temperature calibration method and device for the thermocouple temperature measurement module and the infrared temperature measurement module are used for carrying out temperature calibration on the thermocouple temperature measurement module and the infrared temperature measurement module in various calibration modes, and accuracy of temperature measurement is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a portion of a circuit of a food thermometer according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an information processing module according to an embodiment of the present disclosure;
FIG. 3 is a schematic flow chart of a method for measuring temperature of food according to an embodiment of the present disclosure;
FIG. 4 is a schematic flow chart of another method for measuring temperature of food according to an embodiment of the present application;
FIG. 5 is a schematic illustration of a product usage flow provided in an embodiment of the present application;
FIG. 6 is a schematic block diagram of a food temperature measurement device according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Reference numerals illustrate: 1. a food temperature measuring device; 11. a first resistance value acquisition module; 12. a first voltage determination module; 13. a second voltage acquisition module; 14. an internal temperature determination module.
Detailed Description
In order to make the technical solutions in the present specification better understood by those skilled in the art, the technical solutions in the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments.
In the description of embodiments of the present application, words such as "exemplary," "such as" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "illustrative," "such as" or "for example" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "illustratively," "such as" or "for example," etc., is intended to present related concepts in a concrete fashion.
In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a alone, B alone, and both A and B. In addition, unless otherwise indicated, the term "plurality" means two or more. For example, a plurality of systems means two or more systems, and a plurality of screen terminals means two or more screen terminals. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating an indicated technical feature. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
In places such as cake houses, barbecue shops and restaurants where temperature measurement is needed, not only is the infrared sensor needed to measure the surface temperature of food, but also for objects with different surfaces and interiors, the temperature measurement is needed to be carried out by inserting a thermocouple probe into the thermocouple thermometer, the thermocouple thermometer is manufactured according to the seebeck effect, when the thermocouple is adopted for temperature measurement, the magnitude of the thermoelectric force of the thermocouple is related to the temperature of a measuring end and the temperature of a reference end, and for the selected thermocouple, when the reference temperature is constant, the total thermoelectric force becomes a single-value function of the temperature of the measuring end, namely a certain thermoelectric force corresponds to a certain temperature, and in a thermocouple graduation table, the temperature of the reference end is zero. However, in the application field, the temperature of the reference terminal is quite different, and the temperature cannot be constant at zero degree, so that an error of the reference terminal is generated, and a method for eliminating the error is generally to perform temperature compensation on the reference terminal, and generally includes an ice bath method, a compensation wire method, a compensation bridge method and other potential compensation methods.
The ice bath method is usually used in a laboratory, namely, the temperature of a reference end is kept at zero degrees, and a measurement result can be obtained by directly looking up a table, but the equipment manufactured by the ice bath method has large volume and high price.
The compensation lead method is the most commonly used method, wherein a thermocouple is lengthened, a reference end is led to a place with stable and controllable temperature, and the temperature of the reference end is adjusted manually, namely, the zero point of the instrument is adjusted to room temperature, or automatic compensation is performed by an internal circuit of the instrument. For noble metal thermocouples, they are expensive and clearly impractical to use. If base metals with similar thermoelectric characteristics are used as compensation wires, the intermediate temperature law applies the theoretical basis of the compensation wires, but the compensation wires cannot automatically change along with the change of the temperature of the reference end of the compensation thermocouple, and only the reference end of the thermocouple is led to a place with stable temperature, the compensation method is performed manually and simultaneously with an instrument, and is inconvenient for certain specific places.
The principle of the bridge compensation method is to correct the thermoelectric voltage at the reference end of the thermocouple, but the bridge compensation method is less to use independently, the potential generated by the unbalanced bridge is used for compensating the thermoelectric voltage change value caused by the temperature change of the cold end of the thermocouple, and the compensation bridge has independent products, but the algorithm is complex and the cost is high.
In order to solve the problem that above-mentioned thermocouple temperature measurement reference end temperature compensation brought, this application provides a food thermoscope, is provided with infrared temperature measurement module and thermocouple temperature measurement module in it, when carrying out the thermocouple temperature measurement, compensates thermocouple temperature measurement module's reference end through infrared temperature measurement module, reduces manufacturing cost, and it is more convenient to use simultaneously.
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings of the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments.
Referring to fig. 1, a circuit diagram of a temperature measuring part of a food thermometer provided in an embodiment of the present application is shown, which includes an infrared temperature measuring module and a thermocouple temperature measuring module, wherein AI0 is a thermopile input angle of the infrared temperature measuring module, AI1 is a thermocouple input angle of the thermocouple module, AI2 is an infrared sensor NTC input angle of the infrared temperature measuring module, AI0, AI1, AI2 input temperature information acquired in real time to an IC singlechip for signal processing, and finally obtain a final measured temperature through calculation.
Referring to fig. 2, a schematic diagram of an information processing module provided in an embodiment of the present application is shown, in which a highly integrated IC SD8005B single chip microcomputer is adopted in the embodiment of the present application, a 24-bit analog-to-digital converter is integrated, four analog input ports AI0 to AI3 are provided, and a PGIA adjustable gain is built in, and a 16K OTP memory is built in, so as to meet the requirements of the present product. The working principle is that signals acquired by an infrared sensor NTC, a thermopile and a thermocouple are input through AI 0-AI 2 in a channel switching mode, the signals are sent to a PGIA module for amplification, corresponding gains are adjusted through software programming respectively, the amplified signals are sent to an analog-to-digital converter ADC, and after being processed, temperature values are driven by an LCD Driver to display liquid crystals.
In one embodiment, please refer to fig. 3, a method for measuring temperature of food is specifically provided, which can be implemented by a computer program, can be implemented by a single chip microcomputer, and can also be operated on a food temperature measuring device based on von neumann system. The computer program may be integrated in the application or may run as a stand-alone tool class application.
Step 101: a first resistance of the infrared sensor is obtained when the infrared sensor measures the ambient temperature.
When the internal temperature of food needs to be measured, the thermocouple temperature measuring module of the food thermometer provided by the embodiment of the application can be used for measuring the temperature, the reference end needs to be subjected to temperature compensation when the thermocouple temperature measuring module is used, the infrared temperature measuring module of the food thermometer is used for temperature compensation, namely, the infrared sensor in the infrared temperature measuring module is used for measuring the temperature of the environment where the food is located, and the temperature of the reference end of the thermocouple temperature measuring module is used as the temperature of the reference end of the thermocouple temperature measuring module, wherein the temperature of the infrared sensor can be obtained through the built-in resistance of the infrared sensor, and the resistance of the infrared sensor resistor in the environment measurement is defined as a first resistance.
Step 102: and determining the first voltage of the reference end of the thermocouple temperature measuring module according to the first resistance.
The food thermometer comprises two temperature measuring modules, namely an infrared temperature measuring module and a thermocouple temperature measuring module, wherein the infrared temperature measuring module comprises an infrared sensor and a thermopile temperature measuring unit, and before the food thermometer is put into practical use, a plurality of relational tables, namely a relational table of the resistance and the temperature of the infrared sensor, a relational table of the voltage and the temperature of the thermopile temperature measuring unit and a relational table of the voltage and the temperature of the thermocouple temperature measuring module, are required to be stored in the built-in IC singlechip. The relation conversion among the resistance, the voltage and the temperature can be realized according to the relation table.
Further, the step of determining the first voltage at the reference end of the thermocouple temperature measuring module according to the first resistance value may be divided into the following two sub-steps:
and 1, determining a first temperature corresponding to the first resistance value according to a relation table of the resistance and the temperature of the infrared sensor.
For example, after determining that the infrared sensor is at the first temperature of the current environment, a pre-stored relationship table of resistance and temperature of the infrared sensor may be called, and the corresponding first temperature may be found according to the first resistance value, where the first temperature may be used as the compensation temperature of the reference end of the thermocouple sensor.
And 2, determining a first voltage of a reference end of the thermocouple temperature measuring module corresponding to the first temperature according to a voltage and temperature relation table of the thermocouple temperature measuring module.
For example, since the temperature finally measured by the thermocouple temperature measuring module needs to be obtained by converting the total potential of the thermocouple temperature measuring module, a voltage-temperature relation table of the thermocouple temperature measuring module needs to be called, a corresponding first voltage is found according to the first temperature, and the first voltage is used as the thermoelectric potential of the thermocouple reference end.
Step 103: and acquiring a second voltage of the measuring end of the thermocouple temperature measuring module when the thermocouple temperature measuring module is inserted into the food.
For example, after determining the thermoelectric voltage at the reference end of the thermocouple temperature measuring module, the thermoelectric voltage at the measuring end of the thermocouple temperature measuring module needs to be determined, and at this time, when the thermocouple temperature measuring module is inserted into the object to be measured, the thermoelectric voltage at the measuring end of the thermocouple temperature measuring module is read, which is defined as the second voltage in the embodiment of the present application.
Step 104: based on the first voltage and the second voltage, an internal temperature of the food product is determined.
Illustratively, the total thermal potential is obtained from the first voltage at the reference end of the thermocouple temperature measurement module and the second voltage at the measurement end, and the internal temperature of the food product is determined from the total thermal potential.
Further, the step of determining the internal temperature of the food product based on the first voltage and the second voltage may be divided into the following two sub-steps:
sub-step 1: and adding the first voltage and the second voltage to obtain a target voltage.
Illustratively, the first voltage is added to the second voltage to obtain a total thermal potential of the thermocouple temperature measurement module and define it as the target voltage.
Sub-step 2: and determining the internal temperature of the food corresponding to the target voltage according to the voltage and temperature relation table of the thermocouple temperature measuring module.
The temperature of the thermocouple temperature measuring module is defined as the target temperature, and the target temperature is the internal temperature of the target test object.
On the basis of the above embodiment, as an alternative embodiment, after determining the internal temperature of the food product, in order to improve the accuracy of the subsequent temperature measurement, the voltage-temperature relationship table of the thermocouple temperature measurement module may be calibrated, and the calibration process may specifically include the following substeps:
sub-step 1: and calibrating the internal temperature according to the intermediate temperature relation to obtain a calibration voltage.
Sub-step 2: dividing the calibration voltage by the second voltage to obtain a calibration coefficient.
Sub-step 3: and calibrating the voltage and temperature relation table of the thermocouple temperature measuring module according to the calibration coefficient.
For example, two reference temperatures need to be determined as reference endpoints of the intermediate temperature relation before calibration, in this embodiment of the present application, the test may be performed selectively at an alcohol tank with 0 degrees to obtain the voltage of the first reference endpoint as v1, and the test may be performed selectively at an oil tank with 100 degrees to obtain the second reference endpoint as v2. In the embodiment of the present application, the intermediate temperature relational expression is set as a relational expression between thermoelectric voltages, expressed as: u (0, T) OBJ )＝U 1 (T STA ，T RN )+U 2 (T RN ，T OBJ ) The method comprises the steps of carrying out a first treatment on the surface of the Wherein U is a calibration voltage; t (T) RN Is ambient temperature; t (T) STA Is the standard test temperature; t (T) OBJ Is the internal temperature; u (U) 1 Is the reference terminal voltage; u (U) 2 For measuring the terminal voltage.
If the target temperature is 0 degree, U (0, 0) =U according to the intermediate temperature relation 1 (0，T RN ) According to the relation table of the voltage and the temperature of the thermocouple temperature measuring module, the reference end is 0 degree, the measuring end is 0 degree, the voltage is divided by the obtained voltage to obtain a calibration coefficient, and the calibration coefficient is multiplied by the voltage of the thermocouple temperature measuring module and the temperature in the relation table to calibrate the relation table, so that the subsequent measurement is more accurate.
Similarly, if the measured temperature is below 0 degrees or above 0 degrees, the calibration coefficient can be calculated according to the method, so as to calibrate the voltage and temperature relation table of the thermocouple temperature measuring module, and redundant description is omitted here.
Referring to fig. 4, as an alternative embodiment, the food thermometer provided by the embodiment of the present application may further measure the surface temperature of the target, which specifically includes the following steps:
step 201: when the surface temperature of the food is measured, the second resistance value of the infrared sensor and the third voltage of the thermopile temperature measuring unit are obtained when the infrared temperature measuring module measures the ambient temperature.
When the infrared temperature measuring module is used for measuring the surface temperature of the food, the temperature is measured mainly through the infrared sensor in the infrared temperature measuring module and the thermopile temperature measuring unit, the resistance value of the infrared sensor in the infrared temperature measuring module is obtained and defined as a second resistance value, and the voltage value of the thermopile temperature measuring unit in the infrared temperature measuring module is obtained and defined as a third voltage.
Step 202: substituting the second resistance value into a relation table of the resistance and the temperature of the infrared sensor to obtain a second temperature corresponding to the second resistance.
Illustratively, after determining the second resistance value, a table of the relationship between the resistance and the temperature of the infrared sensor is called, and the corresponding temperature is determined according to the second resistance value and defined as the second temperature.
In a possible implementation manner, if the resistance value corresponding to the second resistance does not exist in the resistance and temperature relation table of the infrared sensor, two resistances closest to the resistance value of the second resistance in the resistance and temperature relation table are obtained, the resistance value smaller than the second resistance is defined as a third resistance value, and the resistance value larger than the second resistance is defined as a fourth resistance value.
Substituting the third resistance value and the fourth resistance value into a temperature formula of the infrared sensor for calculation, wherein the obtained temperature is the second temperature corresponding to the second resistance value.
The temperature formula is:
wherein R2 is a second resistance corresponding to the second resistor; r3 is a third resistance value; r4 is a fourth resistance value; t2 is a second temperature; t3 is the temperature corresponding to a third resistance value in the resistance and temperature relation table of the infrared sensor; t4 is the temperature corresponding to the fourth resistance value in the relation table of the resistance and the temperature of the infrared sensor.
Step 203: substituting the second temperature into a temperature curve offset table of the infrared sensor to obtain a voltage offset value of the second temperature and the standard temperature.
As an example, according to the infrared radiation theory, the voltage-temperature relationship table curve of the infrared sensor under different temperature environments is a series of parallel curves, and in the above embodiment, the voltage-temperature relationship table under the standard temperature, the offset of the voltage-temperature relationship table curve under other temperature environments, and the temperature curve offset table are stored in the food thermometer before temperature measurement, after the second temperature is obtained, the temperature curve offset table can be called, the voltage-temperature relationship table corresponding to the second temperature is calculated, and the voltage-temperature relationship table under the standard temperature is subtracted from the voltage-temperature relationship table under the standard temperature, so as to obtain the voltage offset value of the second temperature and the standard temperature.
Step 204: substituting the voltage deviation value and the third voltage into a calibration formula of the infrared temperature measurement module to obtain infrared calibration voltage.
For example, the third voltage measured by the thermopile may be calibrated by using the voltage deviation value to obtain an infrared calibration voltage, where a calibration formula of the infrared temperature measurement module is as follows: u (U) fix ＝(V n -V offset ) A; in U fix Is a calibration voltage; v (V) n A current third voltage for the thermopile; v (V) offset Is a voltage deviation value; a is a calibration coefficient.
Step 205: substituting the infrared calibration voltage into a voltage and temperature relation table of the infrared temperature measurement module to obtain the surface temperature of the food.
The temperature obtained at this time can be used as the surface temperature of the food by calling a voltage-temperature relationship table of the infrared temperature measurement module after determining the calibration voltage and determining the corresponding temperature according to the infrared calibration voltage.
In one possible embodiment, the following steps may also be performed before the surface temperature of the food product is measured by the infrared thermometry module:
after the food thermometer is placed in a standard temperature environment for a preset time, the infrared sensor measures the experimental voltage of the blackbody, the experimental voltage is substituted into a voltage and temperature relation table of the infrared sensor, the experimental temperature corresponding to the experimental voltage is obtained, the experimental temperature is divided by the calibrated temperature of the blackbody, the calibration coefficient in the calibration formula of the infrared temperature measurement module is obtained, the output voltage obtained in actual measurement is multiplied by the calibration coefficient to obtain an accurate voltage value, and the accuracy of the infrared temperature measurement module can be further improved.
Referring to fig. 5, a product usage flow chart is provided in an embodiment of the present application.
After a battery is arranged for the food thermometer, the LCD display screen is turned off after full display, when a SCAN key is pressed, the infrared temperature measuring mode is entered, the temperature is measured once, after the temperature measurement is finished, HOLD locking is displayed through the LCD display screen, when the SCAN is pressed again, the temperature measurement is carried out through the infrared temperature measuring mode, when the key is pressed, the target indicator lamp is on, and long-time SCAN enters the real-time temperature measuring mode. In the infrared temperature measurement process, the function can be switched by pressing the MODE, the corresponding function can be switched according to the requirement, and the thermocouple temperature measurement function is closed in the MODE.
When the probe is pressed down, the thermocouple is switched to a thermocouple temperature measuring mode, and the thermocouple is used for measuring temperature in the mode, and the temperature is stabilized for 4 minutes and 30 seconds and is shut down. In this mode the infrared temperature measurement is turned off.
Referring to fig. 6, in order to provide a food temperature measuring device according to an embodiment of the present application, the food temperature measuring device 1 may include: a first resistance value acquisition module 11, a first voltage determination module 12, a second voltage acquisition module 13, and an internal temperature determination module 14, wherein:
a first resistance value obtaining module 11, configured to obtain a first resistance value of an infrared sensor when the infrared sensor measures an ambient temperature; the first voltage determining module 12 is configured to determine a first voltage at a reference end of the thermocouple temperature measuring module according to the first resistance value; a second voltage obtaining module 13, configured to obtain a second voltage of a measurement end of the thermocouple temperature measuring module when the thermocouple temperature measuring module is inserted into the food;
an internal temperature determination module 14 for determining an internal temperature of the food product based on the first voltage and the second voltage.
On the basis of the above-described embodiments, as an alternative embodiment, the first voltage determining module 12 further includes a first temperature determining unit and a first voltage determining unit, wherein:
A first temperature determining unit, configured to determine a first temperature corresponding to the first resistance according to a relationship table of resistance and temperature of the infrared sensor;
and the first voltage determining unit is used for determining the first voltage of the reference end of the thermocouple temperature measuring module corresponding to the first temperature according to the voltage and temperature relation table of the thermocouple temperature measuring module.
Based on the above embodiments, as an alternative embodiment, the internal temperature determining module 14 includes: a target voltage determination unit and an internal temperature determination unit, wherein:
a target voltage determining unit, configured to add the first voltage and the second voltage to obtain a target voltage;
and the internal temperature determining unit is used for determining the internal temperature of the food corresponding to the target voltage according to the voltage and temperature relation table of the thermocouple temperature measuring module.
On the basis of the above-described embodiments, as an alternative embodiment, the food temperature measuring device 1 further includes: the system comprises a calibration voltage determining module, a calibration coefficient determining module and a relation table calibrating module, wherein:
and the calibration voltage determining module is used for calibrating the internal temperature according to the intermediate temperature relation to obtain the calibration voltage.
And the calibration coefficient determining module is used for dividing the calibration voltage by the second voltage to obtain a calibration coefficient.
And the relation table calibration module is used for calibrating the relation table of the voltage and the temperature of the temperature measurement module according to the calibration coefficient.
On the basis of the above-described embodiments, as an alternative embodiment, the food temperature measuring device 1 further includes: a third voltage determination module, a second temperature determination module, a voltage deviation value determination module, an infrared calibration voltage determination module, and a surface temperature determination module, wherein:
the third voltage determining module is used for acquiring a second resistance value of the infrared sensor and a third voltage of the thermopile when the infrared temperature measuring module measures the ambient temperature when the surface temperature of the food is measured;
the second temperature determining module is used for substituting the second resistance value into a resistance and temperature relation table of the infrared sensor to obtain a second temperature corresponding to the second resistance;
the voltage deviation value determining module is used for substituting the second temperature into a temperature curve deviation table of the infrared sensor to obtain a voltage deviation value of the second temperature and a standard temperature;
the infrared calibration voltage determining module is used for substituting the voltage deviation value and the third voltage into a calibration formula of the infrared temperature measuring module to obtain infrared calibration voltage;
And the surface temperature determining module is used for substituting the infrared calibration voltage into a voltage and temperature relation table of the infrared temperature measuring module to obtain the surface temperature of the food.
On the basis of the above-described embodiments, as an alternative embodiment, the food temperature measuring device 1 further includes: the third resistance determining module and the second temperature measuring calculating module, wherein:
a third resistance determining module, configured to obtain a third resistance and a fourth resistance in the resistance-temperature relationship table, where the third resistance is smaller than the second resistance, and the fourth resistance is larger than the second resistance, if the resistance corresponding to the second resistance does not exist in the resistance-temperature relationship table;
and the second temperature measurement calculation module is used for substituting the third resistance value and the fourth resistance value into a temperature formula of the infrared sensor to obtain the second temperature corresponding to the second resistance.
On the basis of the above-described embodiments, as an alternative embodiment, the food temperature measuring device 1 further includes:
the experiment voltage determining module is used for obtaining the experiment voltage of the black body measured by the infrared sensor after the food thermometer is placed in the standard temperature environment for a preset time;
The experimental temperature determining module is used for substituting the experimental voltage into a voltage and temperature relation table of the infrared sensor to obtain an experimental temperature corresponding to the experimental voltage;
and the calibration coefficient determining module is used for dividing the experimental temperature by the calibration temperature of the black body to obtain the calibration coefficient in the calibration formula of the infrared temperature measuring module.
The embodiment of the present application further provides a computer storage medium, where the computer storage medium may store a plurality of instructions, where the instructions are adapted to be loaded by a processor and execute the method for measuring temperature of food according to the embodiment shown in fig. 4 to 5, and the specific execution process may be referred to the specific description of the embodiment shown in fig. 4 to 5, which is not repeated herein.
Referring to fig. 7, a schematic structural diagram of an electronic device is provided in an embodiment of the present application. As shown in fig. 7, the electronic device 1000 may include: at least one processor 1001, at least one network interface 1004, a user interface 1003, a memory 1005, at least one communication bus 1002.
Wherein the communication bus 1002 is used to enable connected communication between these components.
The user interface 1003 may include a Display screen (Display) and a Camera (Camera), and the optional user interface 1003 may further include a standard wired interface and a wireless interface.
The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface), among others.
Wherein the processor 1001 may include one or more processing cores. The processor 1001 connects various parts within the overall electronic device 1000 using various interfaces and lines, performs various functions of the electronic device 1000 and processes data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 1005, and invoking data stored in the memory 1005. Alternatively, the processor 1001 may be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), programmable logic array (Programmable Logic Array, PLA). The processor 1001 may integrate one or a combination of several of a central processing unit (Central Processing Unit, CPU), an image processor (Graphics Processing Unit, GPU), and a modem, etc. The CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing the content required to be displayed by the display screen; the modem is used to handle wireless communications. It will be appreciated that the modem may not be integrated into the processor 1001 and may be implemented by a single chip.
The Memory 1005 may include a random access Memory (Random Access Memory, RAM) or a Read-Only Memory (Read-Only Memory). Optionally, the memory 1005 includes a non-transitory computer readable medium (non-transitory computer-readable storage medium). The memory 1005 may be used to store instructions, programs, code, sets of codes, or sets of instructions. The memory 1005 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the above-described respective method embodiments, etc.; the storage data area may store data or the like referred to in the above respective method embodiments. The memory 1005 may also optionally be at least one storage device located remotely from the processor 1001. As shown in fig. 7, an operating system, a network communication module, a user interface module, and an application program of a food temperature measuring method may be included in a memory 1005 as a computer storage medium.
It should be noted that: in the device provided in the above embodiment, when implementing the functions thereof, only the division of the above functional modules is used as an example, in practical application, the above functional allocation may be implemented by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules, so as to implement all or part of the functions described above. In addition, the embodiments of the apparatus and the method provided in the foregoing embodiments belong to the same concept, and specific implementation processes of the embodiments of the method are detailed in the method embodiments, which are not repeated herein.
In the electronic device 1000 shown in fig. 7, the user interface 1003 is mainly used for providing an input interface for a user, and acquiring data input by the user; and processor 1001 may be used to invoke an application in memory 1005 that stores a method of food product thermometry methods, which when executed by one or more processors, causes the electronic device to perform the method as described in one or more of the above embodiments.
An electronic device readable storage medium storing instructions. When executed by one or more processors, cause an electronic device to perform the method as described in one or more of the embodiments above.
It will be clear to a person skilled in the art that the solution of the present application may be implemented by means of software and/or hardware. "Unit" and "module" in this specification refer to software and/or hardware capable of performing a specific function, either alone or in combination with other components, such as Field programmable gate arrays (Field-ProgrammaBLE Gate Array, FPGAs), integrated circuits (Integrated Circuit, ICs), etc.
It should be noted that, for simplicity of description, the foregoing method embodiments are all expressed as a series of action combinations, but it should be understood by those skilled in the art that the present application is not limited by the order of actions described, as some steps may be performed in other order or simultaneously in accordance with the present application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required in the present application.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, such as the division of the units, merely a logical function division, and there may be additional manners of dividing the actual implementation, such as multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some service interface, device or unit indirect coupling or communication connection, electrical or otherwise.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable memory. Based on such understanding, the technical solution of the present application may be embodied in essence or a part contributing to the prior art or all or part of the technical solution in the form of a software product stored in a memory, including several instructions for causing a computer device (which may be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in the embodiments of the present application. And the aforementioned memory includes: a U-disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Those of ordinary skill in the art will appreciate that all or a portion of the steps in the various methods of the above embodiments may be implemented by a program that instructs associated hardware, and the program may be stored in a computer readable memory, which may include: flash disk, read-Only Memory (ROM), random-access Memory (Random Access Memory, RAM), magnetic or optical disk, and the like.
The foregoing is merely exemplary embodiments of the present disclosure and is not intended to limit the scope of the present disclosure. That is, equivalent changes and modifications are contemplated by the teachings of this disclosure, which fall within the scope of the present disclosure. Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains.
Claims (10)
1. A method of measuring temperature of a food product, the method being applied to a food product thermometer, the food product thermometer comprising an infrared temperature measurement module and a thermocouple temperature measurement module, the infrared temperature measurement module comprising an infrared sensor, the method comprising:
Acquiring a first resistance value of the infrared sensor when the infrared sensor measures the ambient temperature;
determining a first voltage of a reference end of the thermocouple temperature measuring module according to the first resistance value;
acquiring a second voltage of a measuring end of the thermocouple temperature measuring module when the thermocouple temperature measuring module is inserted into food;
determining an internal temperature of the food product based on the first voltage and the second voltage.
2. The method of claim 1, wherein determining the first voltage at the reference terminal of the thermocouple temperature measurement module based on the first resistance value comprises:
determining a first temperature corresponding to the first resistance value according to a resistance and temperature relation table of the infrared sensor;
and determining the first voltage of the reference end of the thermocouple temperature measuring module corresponding to the first temperature according to a voltage and temperature relation table of the thermocouple temperature measuring module.
3. The method of claim 1, wherein determining the internal temperature of the food product based on the first voltage and the second voltage comprises:
adding the first voltage and the second voltage to obtain a target voltage;
And determining the internal temperature of the food corresponding to the target voltage according to a voltage and temperature relation table of the thermocouple temperature measuring module.
4. The method of claim 1, wherein after determining the internal temperature of the food product based on the first voltage and the second voltage, further comprising:
calibrating the internal temperature according to the intermediate temperature relation to obtain a calibration voltage;
dividing the calibration voltage by the second voltage to obtain a calibration coefficient;
according to the calibration coefficient, calibrating a voltage and temperature relation table of the thermocouple temperature measurement module;
the intermediate temperature relation is:
U(0，T OBJ )＝U 1 (T STA ，T RN )+U 2 (T RN ，T OBJ )；
wherein U is a calibration voltage; t (T) RN Is ambient temperature; t (T) STA Is the standard test temperature; t (T) OBJ Is the internal temperature; u (U) 1 Is the reference terminal voltage; u (U) 2 For measuring the terminal voltage.
5. The food temperature measurement method of claim 1, wherein the infrared temperature measurement module further comprises a thermopile temperature measurement unit, the method further comprising:
when the surface temperature of the food is measured, acquiring a second resistance value of the infrared sensor and a third voltage of the thermopile temperature measuring unit when the infrared temperature measuring module measures the ambient temperature;
Substituting the second resistance value into a resistance and temperature relation table of the infrared sensor to obtain a second temperature corresponding to the second resistance;
substituting the second temperature into a temperature curve offset table of the infrared sensor to obtain a voltage offset value of the second temperature and a standard temperature;
substituting the voltage deviation value and the third voltage into a calibration formula of the infrared temperature measurement module to obtain an infrared calibration voltage; substituting the infrared calibration voltage into a voltage and temperature relation table of the infrared temperature measurement module to obtain the surface temperature of the food; the calibration formula of the infrared temperature measurement module is as follows: u (U) fix ＝(V n -V offset )*A；
In U fix Is a calibration voltage; v (V) n A current third voltage for the thermopile; v (V) offset Is a voltage deviation value; a is a calibration coefficient.
6. The method of claim 5, wherein said substituting said second resistance value into said resistance versus temperature table of said infrared sensor further comprises:
if the resistance value corresponding to the second resistor does not exist in the resistance and temperature relation table of the infrared sensor, a third resistance value and a fourth resistance value which are closest to the resistance value of the second resistor in the resistance and temperature relation table are obtained, wherein the third resistance value is smaller than the second resistance value, and the fourth resistance value is larger than the second resistance value;
Substituting the third resistance value and the fourth resistance value into a temperature formula of the infrared sensor to obtain the second temperature corresponding to the second resistance;
the temperature formula is as follows:
wherein R2 is a second resistance corresponding to the second resistor; r3 is a third resistance value; r4 is a fourth resistance value; t2 is a second temperature; t3 is the temperature corresponding to a third resistance value in the resistance and temperature relation table of the infrared sensor; t4 is the temperature corresponding to the fourth resistance value in the relation table of the resistance and the temperature of the infrared sensor.
7. The method of claim 5, wherein the acquiring the second resistance of the infrared sensor and the third voltage of the thermopile temperature measurement unit before the infrared temperature measurement module measures the ambient temperature when measuring the surface temperature of the food, further comprises:
after the food thermometer is placed in a standard temperature environment for a preset time, the infrared sensor measures the experimental voltage of the blackbody; substituting the experimental voltage into a voltage and temperature relation table of the infrared sensor to obtain an experimental temperature corresponding to the experimental voltage; dividing the experimental temperature by the calibration temperature of the black body to obtain a calibration coefficient in a calibration formula of the infrared temperature measurement module.
8. A food temperature measurement device, comprising:
a first resistance value acquisition module (11) for acquiring a first resistance value of the infrared sensor when the infrared sensor measures the ambient temperature;
the first voltage determining module (12) is used for determining a first voltage of a reference end of the thermocouple temperature measuring module according to the first resistance value;
the second voltage acquisition module (13) is used for acquiring a second voltage of the measuring end of the thermocouple temperature measurement module when the thermocouple temperature measurement module is inserted into food;
an internal temperature determination module (14) for determining an internal temperature of the food product based on the first voltage and the second voltage.
9. A computer readable storage medium storing a plurality of instructions adapted to be loaded by a processor and to perform the method of any one of claims 1 to 7.
10. An electronic device comprising a processor, a memory for storing instructions, and a transceiver for communicating with other devices, the processor for executing instructions stored in the memory to cause the electronic device to perform the method of any one of claims 1-7.
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| CN202310085953.1A CN116007775A (en) | 2023-01-16 | 2023-01-16 | Food temperature measurement method and device, storage medium and electronic equipment |
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