CN116004226B - Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof - Google Patents
Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof Download PDFInfo
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- CN116004226B CN116004226B CN202111227197.9A CN202111227197A CN116004226B CN 116004226 B CN116004226 B CN 116004226B CN 202111227197 A CN202111227197 A CN 202111227197A CN 116004226 B CN116004226 B CN 116004226B
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- 239000002096 quantum dot Substances 0.000 title claims abstract description 276
- 239000000463 material Substances 0.000 title claims abstract description 70
- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 239000002131 composite material Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 229920000642 polymer Polymers 0.000 claims abstract description 105
- 239000004593 Epoxy Substances 0.000 claims abstract description 53
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 49
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910000077 silane Inorganic materials 0.000 claims abstract description 38
- 239000010410 layer Substances 0.000 claims abstract description 28
- 239000012044 organic layer Substances 0.000 claims abstract description 28
- 125000002091 cationic group Chemical group 0.000 claims abstract description 27
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 14
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 14
- 238000006482 condensation reaction Methods 0.000 claims abstract description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 10
- 239000010936 titanium Substances 0.000 claims abstract description 10
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 230000007062 hydrolysis Effects 0.000 claims abstract description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 4
- -1 halogen anions Chemical class 0.000 claims description 75
- 239000000843 powder Substances 0.000 claims description 65
- 238000000034 method Methods 0.000 claims description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 239000003999 initiator Substances 0.000 claims description 22
- 239000002243 precursor Substances 0.000 claims description 21
- 239000002033 PVDF binder Substances 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 19
- 239000004005 microsphere Substances 0.000 claims description 19
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 239000002904 solvent Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 17
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 14
- 239000003085 diluting agent Substances 0.000 claims description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- 238000000149 argon plasma sintering Methods 0.000 claims description 11
- 239000012752 auxiliary agent Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 10
- 239000003446 ligand Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 9
- 150000007524 organic acids Chemical class 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 7
- 150000001768 cations Chemical class 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 230000003301 hydrolyzing effect Effects 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 6
- GDUZPNKSJOOIDA-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-methylprop-2-enoate Chemical compound C1C(OC(=O)C(=C)C)CCC2OC21 GDUZPNKSJOOIDA-UHFFFAOYSA-N 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 150000004820 halides Chemical class 0.000 claims description 5
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004760 aramid Substances 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 claims description 4
- KPWJBEFBFLRCLH-UHFFFAOYSA-L cadmium bromide Chemical compound Br[Cd]Br KPWJBEFBFLRCLH-UHFFFAOYSA-L 0.000 claims description 4
- OKIIEJOIXGHUKX-UHFFFAOYSA-L cadmium iodide Chemical compound [Cd+2].[I-].[I-] OKIIEJOIXGHUKX-UHFFFAOYSA-L 0.000 claims description 4
- 229920002301 cellulose acetate Polymers 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000013530 defoamer Substances 0.000 claims description 4
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical class C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229920002492 poly(sulfone) Polymers 0.000 claims description 4
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 4
- 239000011118 polyvinyl acetate Substances 0.000 claims description 4
- ZSUXOVNWDZTCFN-UHFFFAOYSA-L tin(ii) bromide Chemical compound Br[Sn]Br ZSUXOVNWDZTCFN-UHFFFAOYSA-L 0.000 claims description 4
- JTDNNCYXCFHBGG-UHFFFAOYSA-L tin(ii) iodide Chemical compound I[Sn]I JTDNNCYXCFHBGG-UHFFFAOYSA-L 0.000 claims description 4
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 claims description 4
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 claims description 4
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 claims description 3
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims description 3
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004417 unsaturated alkyl group Chemical group 0.000 claims description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical class C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 claims description 2
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 claims description 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 2
- BGGIUGXMWNKMCP-UHFFFAOYSA-N 2-methylpropan-2-olate;zirconium(4+) Chemical compound CC(C)(C)O[Zr](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C BGGIUGXMWNKMCP-UHFFFAOYSA-N 0.000 claims description 2
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 claims description 2
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- YFXXJQJIGQHZSG-UHFFFAOYSA-N 4-(prop-1-enoxymethyl)-1,3-dioxolan-2-one Chemical group CC=COCC1COC(=O)O1 YFXXJQJIGQHZSG-UHFFFAOYSA-N 0.000 claims description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 claims description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 2
- 229940075417 cadmium iodide Drugs 0.000 claims description 2
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 claims description 2
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 claims description 2
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 claims description 2
- QCGKUFZYSPBMAY-UHFFFAOYSA-N methyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)OC)CCC2OC21 QCGKUFZYSPBMAY-UHFFFAOYSA-N 0.000 claims description 2
- 239000005543 nano-size silicon particle Substances 0.000 claims description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 claims description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 229940108184 stannous iodide Drugs 0.000 claims description 2
- 125000000446 sulfanediyl group Chemical group *S* 0.000 claims description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 claims description 2
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 claims description 2
- 229940102001 zinc bromide Drugs 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims 3
- 229960000834 vinyl ether Drugs 0.000 claims 2
- ZKJNETINGMOHJG-GGWOSOGESA-N (e)-1-[(e)-prop-1-enoxy]prop-1-ene Chemical compound C\C=C\O\C=C\C ZKJNETINGMOHJG-GGWOSOGESA-N 0.000 claims 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims 1
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 claims 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 claims 1
- ZKJNETINGMOHJG-UHFFFAOYSA-N 1-prop-1-enoxyprop-1-ene Chemical class CC=COC=CC ZKJNETINGMOHJG-UHFFFAOYSA-N 0.000 claims 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 claims 1
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims 1
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 claims 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 claims 1
- UWFHYGTWXNRUDH-UHFFFAOYSA-N 3-ethyl-3-[4-[(3-ethyloxetan-3-yl)methoxy]butoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCOCC1(CC)COC1 UWFHYGTWXNRUDH-UHFFFAOYSA-N 0.000 claims 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 claims 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- PULVCHXDNLGASZ-UHFFFAOYSA-N CN(C)[Zr] Chemical compound CN(C)[Zr] PULVCHXDNLGASZ-UHFFFAOYSA-N 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 150000003973 alkyl amines Chemical group 0.000 claims 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical class C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229920001748 polybutylene Polymers 0.000 claims 1
- 229920005553 polystyrene-acrylate Polymers 0.000 claims 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 claims 1
- INRGAWUQFOBNKL-UHFFFAOYSA-N {4-[(Vinyloxy)methyl]cyclohexyl}methanol Chemical compound OCC1CCC(COC=C)CC1 INRGAWUQFOBNKL-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 20
- 239000011248 coating agent Substances 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 15
- 230000032683 aging Effects 0.000 abstract description 13
- 238000012360 testing method Methods 0.000 description 16
- 238000001723 curing Methods 0.000 description 14
- 238000000231 atomic layer deposition Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000001694 spray drying Methods 0.000 description 4
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 229920006335 epoxy glue Polymers 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000002390 rotary evaporation Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 239000005049 silicon tetrachloride Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229940052303 ethers for general anesthesia Drugs 0.000 description 2
- 238000002189 fluorescence spectrum Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- DQNSRQYYCSXZDF-UHFFFAOYSA-N 1,4-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1CCC(COC=C)CC1 DQNSRQYYCSXZDF-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920002160 Celluloid Polymers 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 241000119250 Sesbania punicea Species 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000090 biomarker Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical group [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Luminescent Compositions (AREA)
Abstract
The invention discloses a composite perovskite quantum dot material, a perovskite quantum dot composition, a preparation method and application thereof, wherein the composite perovskite quantum dot material comprises perovskite quantum dots/polymers and an inorganic-organic layer; the inorganic-organic layer coats perovskite quantum dots/polymers; the inorganic-organic layer includes an inorganic layer and an organic layer; the inorganic layer and the organic layer undergo hydrolysis condensation reaction to obtain the inorganic-organic layer; the organic layer coats the inorganic layer; the composition of the inorganic layer comprises a metal oxide selected from oxides of aluminum, silicon, titanium or zirconium; the composition of the organic layer includes a cycloaliphatic epoxy-containing silane. The perovskite quantum dot containing alicyclic epoxy on the surface of the material has good dispersibility and compatibility in a cationic curing glue system. Meanwhile, the perovskite quantum dots with the organic-inorganic coating structure can effectively improve the aging resistance and the luminous uniformity of the perovskite quantum dots.
Description
Technical Field
The invention relates to a composite perovskite quantum dot material, a perovskite quantum dot composition, a preparation method and application thereof, and belongs to the field of quantum dot materials.
Background
The perovskite quantum dot is used as a novel semiconductor luminescent material, has optical performance equivalent to that of the traditional quantum dot, has very simple preparation process, and can be prepared at room temperature or low temperature. The perovskite quantum dot has the greatest characteristic of improving the display color gamut to more than 100% NTSC. However, the long-term stability of perovskite quantum dots in practical applications has a problem, and water oxygen in the use environment invades, resulting in fluorescence quenching of the quantum dots. Therefore, there is an urgent need to improve perovskite quantum dot material stability.
In the prior art, UV curing glue is mostly used as a packaging barrier material of quantum dots, for example, in chinese patent zl201711434422.X, it is proposed to mix a perovskite quantum dot precursor with an acrylic monomer, and then add an acrylic oligomer to obtain a sol, and the sol can be directly used for coating and UV curing after adding a UV curing agent to form a material with a required shape by directly forming a film. The Chinese patent application publication CN109251717A adopts one or more of polybutadiene chain segment modified polyurethane acrylate, polyisoprene chain segment modified polyurethane acrylate and polyisobutylene chain segment modified polyurethane acrylate as an oligomer, and is matched with a monofunctional acrylate monomer and a polyfunctional acrylate monomer to form the glue composition. The glue composition has good compatibility with the quantum dots, the quantum dot composition has good water blocking performance after being cured, and the formed quantum dot composite material has excellent aging stability. Chinese patent ZL201710865772.5 synthesizes an organosilicon modified hyperbranched acrylic resin, and functional groups such as radiation curable groups, high heat resistance and the like are connected to the molecular terminal to be used as a main material of the quantum dot sealant composition. The water-oxygen permeability is effectively reduced, the bonding strength is higher, the compatibility to the quantum dot material is good, the influence on the luminous efficiency of the quantum dot is small, the weather resistance is excellent, the water-oxygen barrier property is excellent, and the quantum dot material can be effectively protected.
The prior art uses free radical photo-curing system glue, but under the aerobic condition, the free radical photo-curing can cause the problem of low crosslinking density due to oxygen polymerization inhibition, so that the sealing performance is poor, and the luminous stability of the quantum dots is further affected. In addition, the free radical photo-curing has the problem of large volume shrinkage, the intermolecular acting force is changed from Van der Waals force before polymerization into a covalent bond form, the degree of tightness of the arrangement between atoms before and after polymerization is changed, and the internal stress caused by the volume shrinkage can cause defects such as poor adhesive force, microcrack generation and the like.
Disclosure of Invention
The invention provides a composite perovskite quantum dot material, which aims to solve the problems of poor compatibility and poor curing of perovskite quantum dots in a cation curing system. Firstly, coating an inorganic layer on the surface of a perovskite quantum dot by an atomic layer deposition technology, then, reacting vinyl-terminated silane, vinyl-containing alicyclic epoxy and hydrogen-containing double-end socket to obtain alicyclic epoxy-containing silane, and finally, carrying out condensation reaction on alicyclic epoxy-modified silane and free hydroxyl on the surface of the quantum dot inorganic coating layer to obtain the perovskite quantum dot material with the alicyclic epoxy on the surface. (1) The organic-inorganic coating structure can effectively improve the ageing resistance and the luminous uniformity of the perovskite quantum dots. (2) The alicyclic epoxy modified silane structure is prepared, and the alicyclic epoxy modified silane structure and the isolated hydroxyl on the surface of the inorganic coating layer are subjected to condensation reaction, so that the quantum dot can have good dispersibility and compatibility in a cationic curing glue system. (3) The cationic curing glue is used for packaging perovskite quantum dots, so that the problem of poor adhesive force caused by shrinkage when the free radical photo-curing glue is cured is avoided.
In one aspect, a composite perovskite quantum dot material is provided, the composite perovskite quantum dot material comprising perovskite quantum dots/polymers, inorganic-organic layers; the inorganic-organic layer coats perovskite quantum dots/polymers; the inorganic-organic layer includes an inorganic layer and an organic layer; the inorganic layer and the organic layer undergo hydrolysis condensation reaction to obtain the inorganic-organic layer; the organic layer coats the inorganic layer; the composition of the inorganic layer comprises a metal oxide selected from oxides of aluminum, silicon, titanium or zirconium; the composition of the organic layer comprises silane containing alicyclic epoxy; the chemical structure of the alicyclic epoxy-containing silane is shown as a formula I:
i is a kind of
Wherein:
R 1 :-CH 2 -
R 2 selected from the group consisting of
R 3 Selected from-CH 3 Or (b)
R 4 Selected from-CH 2 -or
R 5 Selected from the group consisting of-O-CH 3 or-O-CH 2 -CH 3
R 6 Selected from the group consisting of-O-CH 3 or-O-CH 2 -CH 3 or-CH 3
p is more than or equal to 0; q is more than or equal to O; n=0 or 1
The inorganic layer is an inorganic coating layer of one or more of an aluminum source, a silicon source, a titanium source and a zirconium source, which is prepared on the surface of the perovskite quantum dot by an atomic layer deposition method; the organic layer is prepared by reacting the inorganic layer with silane containing alicyclic epoxy, and the surface of the organic layer contains the alicyclic epoxy.
The perovskite quantum dots/polymers include perovskite quantum dots and polymers in which the perovskite quantum dots are embedded. Preferably the perovskite quantum dot/polymer powder is prepared by a spray drying process.
The mass ratio of the alicyclic epoxy-containing silane to the inorganic coated perovskite quantum dot/polymer powder is (5-20): (3-8).
The mass ratio of the metal oxide of the inorganic layer is not particularly limited, and the inorganic layers with different thicknesses on the surface of the coated perovskite quantum dot/polymer can be obtained through cyclic coating times according to specific requirements in the preparation process.
Preferably, the metal oxide is selected from at least one of aluminum oxide, silicon dioxide, titanium dioxide, zirconium dioxide, and the like.
Preferably, the thickness of the inorganic layer is 5nm to 100nm; the thickness of the inorganic-organic layer is 10 nm-300 nm.
Preferably, the metal oxide is selected from at least one of aluminum oxide, silicon dioxide, titanium dioxide or zirconium dioxide.
A perovskite quantum dot/polymer composite powder material, wherein the particle size of the powder material is 0.1-200 mu m.
Alternatively, the particle size of the powder material is independently selected from any value or range of values between any two of 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 120 μm, 150 μm, 170 μm, 190 μm, 200 μm.
Optionally, in the perovskite quantum dot/polymer composite powder material, the perovskite quantum dot has a size of 2 to 50nm in at least one dimension.
Alternatively, the perovskite quantum dots have a size in at least one dimension independently selected from any of 2nm, 5nm, 10nm, 12nm, 15nm, 20nm, 25nm, 30nm, 40nm, 50nm or a range of values between any two.
Preferably, in the perovskite quantum dot/polymer, the perovskite quantum dot has a size of 2-50 nm in at least one dimension; the perovskite quantum dot has a structural AMX 3 、A 3 M 2 X 9 、A 2 MX 6 、Q 2 A m-1 M m X 3m+1 At least one of (a) and (b); wherein A is NH 2 CHNH 2 + 、CH 3 NH 3 + 、Cs + At least one of (a) and (b); m is Pb 2+ 、Cd 2+ 、Mn 2+ 、Zn 2+ 、Sn 2+ 、Ge 2+ 、Bi 3+ At least one of (a) and (b); x is at least one of halogen anions; q is an aromatic group or an alkyl organic amine cation having not less than 3 carbon atoms; m is any number between 1 and 100.
In the present application, the halogen anion is F - 、Cl - 、Br - Or I - 。
Alternatively, the aromatic group is benzene, naphthalene, anthracene, phenanthrene, and homologs thereof.
Alternatively, the alkyl organoamine cation has a carbon number of from 4 to 25.
Preferably, the polymer is at least one selected from polyvinylidene fluoride, polyvinylidene fluoride and trifluoroethylene copolymer, polyacrylonitrile, polyvinyl acetate, cellulose acetate, cyanocellulose, polysulfone, aromatic polyamide, polyimide, polycarbonate, polystyrene, polymethyl methacrylate.
Preferably, in the perovskite quantum dot/polymer, the mass ratio of the perovskite quantum dot to the polymer is 1:1 to 500.
Optionally, in the perovskite quantum dot/polymer composite powder material, the mass ratio of perovskite quantum dot to polymer matrix is independently selected from any value or range between any two values of 1:1, 1:2, 1:5, 1:8, 1:10, 1:12, 1:15, 1:20, 1:30, 1:50, 1:100, 1:150, 1:200, 1:250, 1:300, 1:400, 1:500.
The application also provides a method for preparing the perovskite quantum dot/polymer composite powder material in situ. The preparation method solves the preparation problem of the perovskite quantum dot/polymer composite material ultrafine powder with high luminous performance and high stability, and the whole process can be carried out in an anhydrous and anaerobic environment, and the stability of the perovskite quantum dot/polymer composite material is enhanced by the anhydrous and anaerobic preparation process.
A method for preparing perovskite quantum dot/polymer composite powder material in situ, atomize perovskite quantum dot precursor solution into small liquid drops, then dry the atomized small liquid drops, produce perovskite quantum dot/polymer composite powder material.
Optionally, the perovskite quantum dot precursor solution includes a solvent, a perovskite quantum dot raw material, and a polymer matrix.
Optionally, the solvent is at least one selected from N, N-dimethylformamide, dimethyl sulfoxide, trimethyl phosphate, triethyl phosphate, N-methylpyrrolidone and dimethylacetamide.
In the present application, the solvent may dissolve the perovskite quantum dot raw material and the polymer matrix.
Optionally, the perovskite quantum dot feedstock comprises AX, QX and MX t The method comprises the steps of carrying out a first treatment on the surface of the Wherein A is selected from NH2CHNH 2 + (FA)、CH 3 NH 3 + (MA)、C s + At least one of (a) and (b);
m is selected from Pb 2+ 、Cd 2+ 、Mn 2+ 、Zn 2+ 、Sn 2+ 、Ge 2+ 、Bi 3+ At least one of (a) and (b);
q is selected from aryl or alkyl organic amine cation with carbon number not less than 3;
x is selected from at least one of halogen anions; t=2 or 3.
In the present application, the mass of perovskite quantum dot raw material includes the mass of all raw materials.
In the actual application process, the corresponding perovskite quantum dot raw materials can be selected according to actual needs. It is pointed out that the preparation method of the application can be amplified and has good industrial practical application value.
Optionally, the polymer matrix is selected from at least one of polyvinylidene fluoride, polyvinylidene fluoride and trifluoroethylene copolymer, polyacrylonitrile, polyvinyl acetate, cellulose acetate, cyanocellulose, polysulfone, aromatic polyamide, polyimide, polycarbonate, polystyrene, polymethyl methacrylate.
Optionally, the mass ratio of polymer matrix to solvent is 1:2 to 200.
Optionally, the mass ratio of polymer matrix to solvent is 1:5 to 50.
Alternatively, the mass ratio of polymer matrix to solvent is independently selected from any value or range between any two of 1:2, 1:5, 1:10, 1:15, 1:20, 1:50, 1:80, 1:100, 1:120, 1:150, 1:180, 1:200.
Optionally, the mass ratio of perovskite quantum dot raw material to polymer matrix is 1:1 to 500.
Optionally, the mass ratio of perovskite quantum dot raw material to polymer matrix is 1:5 to 100.
Optionally, the mass ratio of perovskite quantum dot starting material to polymer matrix is independently selected from any value or range of values between any two of 1:1, 1:2, 1:5, 1:8, 1:10, 1:12, 1:15, 1:20, 1:30, 1:50, 1:100, 1:150, 1:200, 1:250, 1:300, 1:400, 1:500.
Optionally, the perovskite quantum dot precursor solution further comprises additives and/or surface ligands.
Optionally, the additive is at least one selected from zinc bromide, zinc iodide, stannous bromide, stannous iodide, cadmium bromide, cadmium iodide, hypophosphorous acid.
Optionally, the mass ratio of the additive to the perovskite quantum dot raw material is 1:1 to 500.
Optionally, the mass ratio of the additive to the perovskite quantum dot raw material is 1:4 to 100.
Optionally, the mass ratio of additive to perovskite quantum dot feedstock is independently selected from any value or range of values between any two of 1:1, 1:2, 1:4, 1:5, 1:10, 1:15, 1:20, 1:30, 1:50, 1:70, 1:80, 1:90, 1:100, 1:150, 1:200, 1:250, 1:300, 1:350, 1:400, 1:450, 1:500.
Optionally, the surface ligand comprises at least one of an organic acid, an organic acid halide, a long chain organic amine, a halide of a long chain organic amine.
Alternatively, the organic acid includes a saturated or unsaturated alkyl acid having at least 3 carbon atoms.
Optionally, the organic acid includes a saturated alkyl acid or an unsaturated alkyl acid having 4 to 24 carbon atoms.
Alternatively, the long chain organic amine is an alkylamine amine or an aromatic amine of 4 to 24 carbon atoms.
Optionally, the halide of the organic acid or long-chain organic amine is the halide corresponding to the organic acid or long-chain organic amine.
Optionally, the mass ratio of the surface ligand to the perovskite quantum dot raw material is 1:1 to 50.
Optionally, the mass ratio of the surface ligand to the perovskite quantum dot raw material is 1:2 to 20.
Optionally, the mass ratio of perovskite quantum dot starting material to surface ligand is independently selected from any value or range of values between any two of 1:1, 1:2, 1:5, 1:10, 1:15, 1:20, 1:25, 1:30, 1:35, 1:40, 1:45, 1:50.
Optionally, the feed flow of the perovskite quantum dot precursor solution is 1 mL/min-5000 mL/min;
the temperature of the inlet air is 40-200 ℃.
Alternatively, the atomized droplets become perovskite quantum dot/polymer composite powder material and solvent vapor after drying, and the solvent is recovered by separation.
Optionally, an inert gas is used as the recycle gas.
Optionally, the inactive gas is at least one selected from nitrogen and helium. The inactive gas is used as the circulating gas, so that the whole preparation process further maintains an oxygen-free and water-free state, and is used as the protective gas, and is sensitive to water and oxygen in the production process 2 、CHNH 2 Raw materials such as NH HX (X is halogen) and the like can also be produced, and the obtained product has better performance and higher stability.
In the application, the property of the perovskite quantum dot/polymer composite material ultrafine powder prepared in situ by a spray drying method is mainly determined by the composition of a perovskite quantum dot precursor solution and the production process. The production process mainly adjusts the air inlet temperature, the material concentration, the rotating speed of the atomizer and the feeding flow.
Optionally, the air inlet temperature is 40-200 ℃.
Optionally, the rotation speed of the atomizer is 5000-70000 r/min.
Optionally, the feeding flow is 1 mL/min-5000 mL/min.
Alternatively, the material concentration (polymer to solvent mass ratio) is 1:2 to 200.
Alternatively, the polymer to solvent mass ratio is independently selected from any value or range of values between any two of 1:2, 1:5, 1:10, 1:15, 1:20, 1:50, 1:80, 1:100, 1:120, 1:150, 1:180, 1:200.
On the other hand, the invention also provides a preparation method of the composite perovskite quantum dot material, which comprises the following steps:
(1) Obtaining perovskite quantum dot/polymer powder;
(2) Depositing a metal source on the surface of the perovskite quantum dot/polymer powder by an atomic deposition (ALD) method, and hydrolyzing to obtain a perovskite quantum dot/polymer coated with metal oxide;
(3) Obtaining silane containing alicyclic epoxy;
(4) And (3) carrying out hydrolysis condensation reaction on the alicyclic epoxy-containing silane and the perovskite quantum dot/polymer coated by the metal oxide to obtain the composite perovskite quantum dot material.
As a preferred technical scheme, in the step (2), the metal source is at least one selected from an aluminum source, a silicon source, a titanium source and a zirconium source; the aluminum source is at least one selected from trimethylaluminum, triethylaluminum and aluminum trichloride; the silicon source is at least one selected from methyl orthosilicate or ethyl orthosilicate; the titanium source is at least one of tetrabutyl titanate, isopropyl titanate and tetraethyl titanate; the zirconium source is at least one selected from zirconium dimethylamino, tetrabutyl zirconate, zirconium n-butoxide, zirconium tert-butoxide and zirconium isopropoxide.
The metal oxide is formed on the surface of the perovskite quantum dot/polymer by an atomic deposition (ALD), and the deposition temperature of the step (2) is preferably 80-100 ℃ by setting the technological parameters of the ALD; the time is 5 s-90 s; the vacuum degree is 100-1000 Pa, the time of introducing steam is 3-20 s, the cycle number is 10-500, the required deposition thickness is obtained, and the inorganic layer coating is completed. According to specific needs, the inorganic layers with different thicknesses are obtained through cyclic coating times in the preparation process.
Preferably, in the step (3), the alicyclic epoxy-containing silane is prepared by adding vinyl-terminated silane, vinyl-terminated alicyclic epoxy and double-terminated hydrosilane through hydrosilylation under the action of a platinum-series catalyst; the mol ratio of the vinyl-terminated silane to the vinyl-terminated alicyclic epoxy compound to the double-terminated hydrosilane is 1-1.02: 1 to 1.1:1, a step of; the platinum catalyst accounts for 0.001 to 0.5 percent of the sum of the masses of vinyl-terminated silane, vinyl-terminated alicyclic epoxy and bi-terminal hydrosilane, and is preferably 0.02 to 0.5 percent; the reaction temperature is 110-130 ℃.
Optionally, the molar ratio of the vinyl-terminated silane, the vinyl-terminated cycloaliphatic epoxy compound, the bis-terminal hydrosilane is any value or range between any two values independently selected from 1:1.05:1, 1:1.1:1, 1:1.07:1, 1:1.02:1, 1.02:1.02:1.
Alternatively, the platinum-based catalyst is used in an amount that is a ratio of the sum of the mass of the terminal vinylsilane, the alicyclic epoxy of the terminal vinyl group, and the bis-terminal hydrosilane, and is independently selected from any value or range of values between any two of 0.001%, 0.005%, 0.009%, 0.011%, 0.019%, 0.02%, 0.1%, 0.2%, 0.5%.
Alternatively, the reaction temperature of the hydrosilylation reaction is independently selected from any value or range of values between any two of 110 ℃, 120 ℃, 130 ℃.
Preferably, the vinyl-terminated silane is at least one selected from the group consisting of vinylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, methacryloxymethyltriethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, and methacryloxypropylmethyldimethoxysilane.
Preferably, the vinyl-terminated alicyclic epoxy is preferably at least one of 1, 2-epoxy-4-vinylcyclohexane, 3, 4-epoxycyclohexyl methacrylate or 3, 4-epoxycyclohexyl methacrylate.
Preferably, the double-terminal hydrosilane is at least one selected from tetramethyl dihydro disiloxane, tetramethyl diphenyl dihydro trisiloxane, double-terminal hydrogen polydimethyl siloxane and tetraisopropyl dihydro disiloxane; preferably the double-ended hydrogen polydimethylsiloxane is dodecamethyldihydrohexasiloxane.
Preferably, the platinum-group catalyst is at least one selected from chloroplatinic acid, complexes of platinum and vinyl siloxane, and platinum-olefin complexes.
Preferably, in the step (4), the mass ratio of the alicyclic epoxy modified silane to the perovskite quantum dot/polymer coated by the metal oxide is 5-20: 3 to 8; the conditions of the hydrolytic condensation reaction are that the temperature is 25-60 ℃ and the time is 0.5-30 h.
Optionally, in step (4), the mass ratio of the cycloaliphatic epoxy modified silane and the metal oxide coated perovskite quantum dot/polymer is independently selected from any value or range of values between any two of 0.6, 1, 2, 2.62, 3, 3.26, 4, 4.11, 5, 6, 6.7.
As a preferred technical scheme, in the step (1), the method for obtaining the perovskite quantum dot/polymer powder comprises the steps of atomizing a perovskite quantum dot precursor solution into small droplets, and then drying the atomized small droplets to generate the perovskite quantum dot/polymer powder; the perovskite quantum dot precursor solution comprises a solvent, a perovskite quantum dot raw material and a polymer matrix;
the particle size of the perovskite quantum dot/polymer powder is 0.1-200 mu m;
preferably, the solvent is at least one selected from N, N-dimethylformamide, dimethyl sulfoxide, trimethyl phosphate, triethyl phosphate, N-methylpyrrolidone and dimethylacetamide;
On the other hand, the invention also provides a perovskite quantum dot composition, which comprises the following components in parts by weight: 2 to 21 parts of complex perovskite quantum dot material, 40 to 260 parts of epoxy resin, 20 to 180 parts of reactive diluent, 0.1 to 18 parts of cationic initiator, 5 to 35 parts of light scattering particles and 0.5 to 10 parts of auxiliary agent;
the perovskite quantum dot material is at least one of any one of the composite perovskite quantum dot materials or the composite perovskite quantum dot material prepared by any one of the preparation methods.
Optionally, the perovskite quantum dot composition comprises the following components in parts by weight: 11 to 20.5 parts of perovskite quantum dot material, 170 to 200 parts of epoxy resin, 40 to 130 parts of reactive diluent, 0.5 to 14 parts of cationic initiator, 20 to 30 parts of light scattering particles and 1 to 6 parts of auxiliary agent;
alternatively, the parts by weight of the perovskite quantum dot material are independently selected from any value or range of values between any two of 2 parts, 5 parts, 10 parts, 11 parts, 11.9 parts, 12 parts, 12.6 parts, 15.1 parts, 16.9 parts, 17 parts, 20.5 parts, 21 parts.
Optionally, the parts by weight of the epoxy resin are independently selected from: 40 parts, 60 parts, 80 parts, 100 parts, 150 parts, 179.5 parts, 196.7 parts, 232.1 parts, 246 parts, 250 parts, 257 parts, 260 parts, or a range of values therebetween.
Optionally, the reactive diluents are independently selected from the group consisting of: any value or range of values between any two of 20 parts, 40 parts, 41.7 parts, 50 parts, 72.5 parts, 82.9 parts, 100 parts, 120 parts, 129.5 parts, 130 parts, 150 parts, 170.3 parts, 180 parts.
Optionally, the parts by weight of the cationic initiator are independently selected from: any value or range of values between any two of 0.1 part, 0.5 part, 1 part, 5 parts, 10 parts, 10.44 parts, 14.9 parts, 15 parts.
Optionally, the parts by weight of the light scattering particles are independently selected from: any value or range of values between any of 5 parts, 10 parts, 20 parts, 20.5 parts, 25.3 parts, 29.1 parts, 30 parts, 31.3 parts, 35 parts.
Optionally, the weight parts of the auxiliary agent are independently selected from: any value or range of values between any two of 0.5 parts, 1 part, 1.8 parts, 2.5 parts, 4.4 parts, 5 parts, 5.9 parts, 6.8 parts, 6.9 parts, 10 parts, 15 parts, 17.8 parts, 18 parts.
The epoxy, reactive diluent, cationic initiator, light scattering particles and auxiliary agent combination is referred to as a cationically cured glue or epoxy glue or glue.
The perovskite quantum dot material is any one of the composite perovskite quantum dot materials or the composite perovskite quantum dot material prepared according to any one of the preparation methods.
The epoxy resin is at least one selected from alicyclic epoxy resins and glycidyl type epoxy resins.
Preferably, the alicyclic epoxy resin comprises at least one of bis (di (3, 4-epoxycyclohexyl) methyl) adipic acid, poly [ (2-epoxyethyl) -1, 2-cyclohexanediol ] 2-ethyl-2- (hydroxymethyl) -1, 3-propanediol ether (3:1), 1, 4-bis (3, 4-epoxycyclohexyl-1-methoxy) methylbenzene, 1, 4-bis (3, 4-epoxycyclohexyl-1-methoxy) butane, epoxypolybutadiene (japanese celluloid epolate PB series), dicyclopentadiene dioxide, methyl 3, 4-epoxycyclohexane carboxylate.
Preferably, the glycidyl type epoxy resin is at least one selected from hydrogenated bisphenol A type diglycidyl ether, hydrogenated bisphenol F type diglycidyl ether, hydrogenated bisphenol E type diglycidyl ether, hydrogenated bisphenol S type diglycidyl ether, polyethylene glycol glycidyl ether, polypropylene glycol glycidyl ether, polytetramethylene glycol glycidyl ether;
the reactive diluent is at least one selected from ethyl (propyl) alkenyl ethers, oxygen heterocycle reactive diluents and glycidyl ether ethers.
The cationic initiator is selected from a photo cationic initiator and/or a thermal cationic initiator.
The photo cation initiator is selected from sulfonium salts such as 4-phenylsulfanylphenyl diphenylsulfonium salt, tris [4- [ (4-acetylphenyl) thio ] -hexafluorophosphate, tris (4-methoxyphenyl) sulfonium hexafluorophosphate, diphenyl-4-phenylsulfanylphenyl sulfonium hexafluoroantimonate, diphenyl-4-phenylsulfanylphenyl sulfonium hexafluorophosphate, 4-dodecylphenyldiphenylsulfonium hexafluorophosphate, 4' -bis (diphenylsulfonium) phenylsulfide-bis-hexafluoroantimonate, 4' -bis [ bis (. Beta. -hydroxyethoxy) phenylsulfonium ] phenylsulfide-bis-hexafluoroantimonate, 4- [4' - (benzoyl) phenylthio ] phenyl-bis- (4-fluorophenyl) sulfonium hexafluoroantimonate, 4- (2-chloro-4-benzoylphenylthio) phenylbis (4-fluorophenyl) sulfonium hexafluoroantimonate; iodonium salts such as at least one of diphenyliodohexafluoroantimonate, bis (4-methylphenyl) iodohexafluorophosphate, bis (4-tert-butylphenyl) iodohexafluorophosphate, tolyltetra (pentafluorophenyl) borate diaryliodonium salts, and arylferrocenium salts such as [ cyclopentadiene-iron-isopropylbenzene ] hexafluorophosphate;
The thermal cation initiator is selected from anhydride compounds such as methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride and tetrahydrophthalic anhydride; imidazole derivatives such as N- (2- (2-methyl-1-imidazolyl) ethyl) urea, N' - (2-methyl-1-imidazolylethyl) adipamide, 2-phenyl-4, 5-dimethylol imidazole, hycat TM At least one of AO-4 (DTCS, U.S.), CXC-1612 (King's chemical, U.S.);
the light scattering particles are selected from inorganic light dispersing agents or organic light dispersing agents; the light scattering particles are dispersed into the glue to form micron-sized concave-convex surfaces, and the concave-convex surfaces can enable incident light to be scattered, so that the effect of improving light diffusion uniformity and brightness is achieved. Selected from inorganic light diffusion agents and organic light diffusion.
Preferably, the inorganic light dispersing agent is at least one of nano barium sulfate, nano zinc oxide and nano silicon dioxide;
preferably, the organic light diffusion is at least one selected from PMMA microspheres, organosilicon microspheres, polytetrafluoroethylene wax, polypropylene wax, polyethylene wax microspheres, polyamide wax microspheres and amide modified polyethylene wax;
the auxiliary agent is at least one selected from flatting agent, defoamer and antioxidant.
In still another aspect, the invention further provides a preparation method of the perovskite quantum dot composition, the perovskite quantum dot composition is obtained by mixing the perovskite quantum dot material with epoxy resin, reactive diluent, cationic initiator, light scattering particles and auxiliary agent according to the proportion, and dispersing under vacuum condition.
On the other hand, the invention also provides the composite perovskite quantum dot material prepared by any one of the preparation methods, the perovskite quantum dot composition prepared by any one of the preparation methods and the application of the perovskite quantum dot composition prepared by any one of the preparation methods in the semiconductor luminescent material.
As a preferred technical solution, for light emitting diodes, light conversion devices, display devices, photovoltaic devices, lighting devices, uv detection, sensors, hybrid composites, biomarkers, inkjet printing inks, etc.; the display device is preferably a liquid crystal display or an imaging sensor; the photovoltaic device is preferably a solar cell; the sensor is preferably a biosensor; the light emitting diode is preferably an electroluminescent diode or an organic light emitting diode.
The invention has the beneficial effects that:
1. in the prior art, the inorganic coated perovskite quantum dots and the organic phase are not combined by chemical bonds, so that the quantum dots are easy to agglomerate and difficult to disperse in polymer matrix resin. According to the invention, the inorganic coated quantum dots are further modified by adopting an epoxy-containing organic structure, so that the inorganic coated quantum dots have a structure similar to that of an epoxy glue system, thus the inorganic coated quantum dots have good compatibility and dispersibility in the glue system, are not easy to generate sedimentation, and the coated or printed quantum dot film emits light more uniformly.
2. The silane containing alicyclic epoxy is grafted on the surface of the perovskite quantum dot, after the quantum dot with the epoxy introduced on the surface is subjected to photo/thermal curing, the quantum dot can be polymerized in a molecular chain main body, and the phenomenon of migration and precipitation in the aging process is avoided, so that the water and oxygen are difficult to damage, and the perovskite quantum dot has excellent aging resistance.
3. In the prior art, free radical UV curing is mostly adopted, and the problem of low crosslinking density caused by oxygen polymerization inhibition can be caused when curing under the aerobic condition, and even the product performance is affected seriously. The surface of the coating layer is alicyclic epoxy, and cation curing occurs under the condition of photo/thermal initiation, so that the problem of low curing degree caused by oxygen polymerization inhibition is avoided. In addition, the problem of poor adhesive force caused by the shrinkage of the free radical curing volume is avoided.
Drawings
FIG. 1 example 1 schematic diagram of the preparation of inorganic-organic perovskite quantum dot compositions
And 2, a morphology electron microscope SEM image of perovskite quantum dot/polymer green powder microsphere MAPbBr 3/PVDF.
FIG. 3 is an SEM image of an inorganic-organic coated perovskite quantum dot/polymer prepared according to example 1.
FIG. 4 is a SEM image of an inorganic-organic coated perovskite quantum dot/polymer prepared according to example 1.
FIG. 5 is a schematic diagram of the structure of the inorganic-organic coated perovskite quantum dots prepared in example 1;
FIG. 6 is MAPbBr 3 and/PVDF composite material superfine powder fluorescence emission spectrum.
Detailed Description
The present application is described in detail below with reference to examples, but the present application is not limited to these examples.
Unless otherwise indicated, all starting materials in the examples of the present application were purchased commercially.
Instrument name and model
(1) Spray drying: closed-circuit nitrogen circulation spray dryer, safety grinding instrument and AYAN-BL-5L
(2) ALD coating: internal and external cavity atomic deposition system, xiamen Mao technology, G10
(3) Morphology of the sample: scanning Electron Microscope (SEM) test analysis, sigma 500 field emission scanning electron microscope.
Preparation of perovskite Quantum dots/Polymer
Firstly, coating an inorganic layer on the surface of a perovskite quantum dot by an atomic layer deposition technology, then, reacting vinyl-terminated silane, vinyl-containing alicyclic epoxy and bi-terminal hydrosilane to obtain alicyclic epoxy-containing silane, and finally, performing condensation reaction on the alicyclic epoxy-containing silane and free hydroxyl on the surface of the quantum dot inorganic coating layer to obtain the perovskite quantum dot/polymer with the organic-inorganic coating structure. The perovskite quantum dot with the alicyclic epoxy on the surface has good dispersibility and compatibility in a cationic curing glue system. Meanwhile, the perovskite quantum dots with the organic-inorganic coating structure can effectively improve the aging resistance and the luminous uniformity of the perovskite quantum dots. The method comprises the following specific steps:
a. And (3) blending the quantum dot material precursor, the polymer matrix, the organic solvent and the ligand, and dissolving and drying to prepare the perovskite quantum dot/polymer green powder microsphere. b. And (3) depositing an oxide film on the surface of the perovskite quantum dot/polymer powder by an atomic layer deposition technology to obtain the inorganic matter coated perovskite quantum dot with hydroxyl on the surface.
c. The alicyclic epoxy silane is obtained through hydrosilylation of vinyl-terminated silane and vinyl-terminated alicyclic epoxy and hydrogen-containing double seal heads under the action of a platinum catalyst.
d. Adding the inorganic coated perovskite quantum dot into silane containing alicyclic epoxy, and obtaining the perovskite quantum dot material with the surface containing alicyclic epoxy groups through hydrolytic condensation reaction.
e. Uniformly mixing the perovskite quantum dot material with the surface containing the alicyclic epoxy group with epoxy resin, an active diluent, a cationic initiator and an auxiliary agent according to a certain proportion to obtain the perovskite quantum dot composition.
The perovskite quantum dot/polymer green powder microspheres used in the embodiment of the application are MAPbBr prepared by adopting a spray drying method 3 The PVDF composite material ultrafine powder is prepared by the following steps:
MA refers to an amine ion and PVDF refers to polyvinylidene fluoride. MABr mass 1g.
MABr:PbBr 2 Mass ratio = 1:1.2.
(MABr+PbBr 2 ): dodecylamine mass ratio = 3:1.
(MABr+PbBr 2 ): PVDF mass ratio = 1:10.
PVDF: n, N-dimethylformamide mass ratio = 1:10.
all the raw materials are mixed and mechanically stirred for 3 hours to fully dissolve the raw materials to obtain a precursor solution. The precursor solution is poured into a precursor tank, the feeding flow is 50mL/min, the rotating speed of an atomizer is 20000r/min, and the air inlet temperature is 80 ℃. The obtained perovskite quantum dot/polymer green powder emitting green fluorescence.
MAPbBr 3 The fluorescence emission spectrum of the ultra-fine powder of the PVDF composite material is shown in FIG. 6, and the emission peak is 537nm; SEM is shown in FIG. 2, and it can be seen that the uncoated perovskite quantum dots/polymers are ellipsoidal with particle sizes of 1-10 μm, and have smooth and uniform surfaces.
Example 1
MAPbBr 3 PVDF perovskite quantum dot/polymer green powder is put into ALD equipment, and trimethylaluminum precursor is fully contacted with the quantum dot/polymer green powder by pulse argon under 500Pa and 80 ℃. And then introducing water vapor for 5s to hydrolyze trimethyl aluminum adsorbed on the surface of the quantum dot into aluminum oxide, repeating the process for 100 times, and obtaining the perovskite quantum dot/polymer green powder coated by aluminum oxide with the thickness of 20 nm.
13.4g of tetramethyl dihydro disiloxane, 26.2g of methacryloxymethyl triethoxysilane and 0.006g of chloroplatinic acid (5% by weight in isopropanol) were reacted at 120℃for 1 hour, then 13.04g of 1, 2-epoxy-4-vinylcyclohexane was added and the reaction was continued for 1 hour, and after no Si-H bond was contained in the test system, the reaction was stopped to give a cycloaliphatic epoxy-containing silane:
10g of aluminum oxide coated perovskite quantum dot green powder, 26.2g of alicyclic epoxy-containing silane and 120mL of ethanol solution are stirred for 10 hours at 40 ℃ and then ethanol is removed by a rotary evaporation method, so that inorganic-organic coated perovskite quantum dot green powder is obtained.
Fig. 3 is an SEM image of the inorganic-organic coated perovskite quantum dot green powder/polymer prepared in example 1, and it can be seen from the image that the particle size of the inorganic-organic coated perovskite quantum dot/polymer is not significantly changed, there is no cross-linked hardening between the particles, and the surface of the perovskite quantum dot/polymer presents a rough shape, which indicates that the inorganic-organic coating layer is formed on the surface of the perovskite quantum dot/polymer.
FIG. 4 is a cross-sectional SEM image of the inorganic-organic coated perovskite quantum dot/polymer prepared in example 1, wherein the coated perovskite quantum dot/polymer is coated by a dense shell layer on the surface, and the thickness of the inorganic-organic shell layer is 130-190 nm.
12.6g of inorganic-organic coated perovskite quantum dot green powder, 179.5g of 3, 4-epoxycyclohexylformic acid-3 ',4' -epoxycyclohexylmethyl ester, 72.5g of triethylene glycol divinyl ether, 15.7g of 4-phenylsulfanylphenyl diphenylsulfonium salt and 0.5g of Hycat are added in sequence TM AO-4 thermally initiated cationic initiator (DTCS Co., USA), 4.4g antioxidant 1010, 5.5g polyamide wax microsphere and 15.5g nano hydrophobic silica. Under the vacuum condition, inorganic-organic coated perovskite quantum dot/polymer composition is obtained after non-intrusive dispersion for 3min by a homogenizer, and is marked as No. 1.
Example 2
After reacting 38.7 g of dodecamethyldihydrohexasiloxane, 17.1g of vinyltriethoxysilane and 0.014g of chloroplatinic acid (5 wt% in isopropanol) at 120℃for 1 hour, 20.0g of 3, 4-epoxycyclohexylmethacrylate was added and the reaction was continued for 1 hour, and the reaction was stopped after no Si-H bond was contained in the test system to give a cycloaliphatic epoxy-containing silane:
10g of the alumina-coated perovskite quantum dot green powder prepared in the embodiment 1 is added into 41.1g of silane containing alicyclic epoxy and 170ml of ethanol solution, and the mixture is stirred for 10 hours at 40 ℃ and then removed by a rotary evaporation method to obtain the inorganic-organic-coated perovskite quantum dot green powder.
11.9g of inorganic-organic coated perovskite quantum dot green powder, 196.7g of 3, 4-epoxycyclohexylcarboxylic acid-3 ',4' -epoxycyclohexylmethyl ester, 41.7g of 3-ethyl-3-hydroxymethyl oxetane, 14.9g of 4,4' -bis [ bis (. Beta. -hydroxyethoxy) phenyl sulfonium ] phenyl sulfide-bis-hexafluoroantimonate, 1.8g of antioxidant 1076, 5g of polyamide wax microsphere and 24.1g of organosilicon microsphere are added in sequence. Under the vacuum condition, inorganic-organic coated perovskite quantum dot/polymer composition is obtained after non-intrusive dispersion for 3min by a homogenizer, and is marked as No. 2.
Example 3
After 23.2g of tetramethyl diphenyl dihydrotrisiloxane, 13.3g of vinyltriethoxysilane and 0.009g of chloroplatinic acid (5 wt% in isopropanol) were reacted at 120℃for 1 hour, 9.3g of 1, 2-epoxy-4-vinylcyclohexane was added and the reaction was continued for 1 hour, and after the test system had no Si-H bond, the reaction was stopped to give a cycloaliphatic epoxy-containing silane:
10g of the perovskite quantum dot green powder coated with aluminum oxide prepared in the embodiment 1 is added into 32.6g of silane containing alicyclic epoxy and 142mL of ethanol solution, and the mixture is stirred for 10 hours at 40 ℃ and then removed by a rotary evaporation method to obtain the inorganic-organic coated perovskite quantum dot green powder.
16.9g of inorganic-organic coated perovskite quantum dot green powder, 232.1g of 3, 4-epoxycyclohexylcarboxylic acid-3 ',4' -epoxycyclohexylmethyl ester, 129.5g of n-butyl glycidyl ether, 5.44g of bis (4-tert-butylphenyl) iodohexafluorophosphate, 5g of methyltetrahydrofuran, 5.9g of antioxidant 168 and 25.3g of amide modified polyethylene wax are added in sequence. And (3) carrying out non-invasive dispersion for 3min by a homogenizer under a vacuum condition to obtain the inorganic-organic coated perovskite quantum dot/polymer composition, which is marked as No. 3.
Example 4
The inorganic-organic coated perovskite quantum dot green powder was consistent with example 1. 15.1g of inorganic-organic coated perovskite quantum dot green powder, 245.8g of 1, 4-bis (3, 4-epoxycyclohexyl-1-methoxy) methylbenzene, 82.9g of glycerol carbonate propenyl ether, 3.5g of diphenyl-4-thiophenylphenyl sulfonium hexafluoroantimonate, 0.5g of CXC-1612 heat-initiated cationic initiator (U.S. gold's chemical), 5.1g of defoamer TEGO Rad 2010, 1.8g of antioxidant 264 and 18.8g of organosilicon microspheres, and 12.5g of polytetrafluoroethylene wax are added in sequence. Under the vacuum condition, inorganic-organic coated perovskite quantum dot composition is obtained after non-intrusive dispersion for 5min by a homogenizer, and is marked as No. 4.
Example 5
The inorganic-organic coated perovskite quantum dot green powder was consistent with example 1. 20.5g of the inorganic-organic coated perovskite quantum dot green powder 1# prepared in example 1, 257.0g of epoxidized polybutadiene, 170.3gl, 4-cyclohexanedimethanol divinyl ether, 10.2g of diphenyliodohexafluoroantimonate, 7.6g of methyl hexahydrophthalic anhydride, 4.3g of defoamer TEGO Rad 2010,2.5g of antioxidant 626 and 41.4g of polypropylene wax were added sequentially. Under the vacuum condition, inorganic-organic coated perovskite quantum dot composition is obtained after non-intrusive dispersion for 5min by a homogenizer, and is marked as No. 5.
Example 6
And (3) replacing the precursor trimethylaluminum of the inorganic layer for ALD coating with zirconium tetrachloride to obtain the perovskite quantum dot green powder coated with zirconium dioxide.
Otherwise, in accordance with example 1, an inorganic-organic coated perovskite quantum dot composition was obtained, designated 6#.
Example 7
And (3) changing precursor trimethylaluminum of the ALD coating inorganic layer into silicon tetrachloride to obtain the perovskite quantum dot green powder coated with silicon dioxide. Otherwise in accordance with example 1, the inorganic-organic coated perovskite quantum dot composition was designated 7#.
Comparative example 1
Sequentially adding 10g of uncoated perovskite quantum dot/polymer green powder microsphere and MAPbBr 3 The same proportion of cationic curing glue as in example 1 was compounded to give an uncoated perovskite quantum dot/polymer composition, designated 8#. The cationically curable glue of example 1 comprises 179.5g of 3, 4-epoxycyclohexylcarboxylic acid-3 ',4' -epoxycyclohexylmethyl ester, 72.5g of triethylene glycol divinyl ether, 15.7g of 4-phenylsulfanylphenyl diphenylsulfonium salt, 0.5g of Hycat TM AO-4 thermally initiated cationic initiator (DTCS Co., USA), 4.4g antioxidant 1010, 5.5g polyamide wax microsphere and 15.5gNano hydrophobic silica.
Comparative example 2
Titanium ore quantum dot/polymer green powder microsphere, MAPbBr 3 And (3) placing the PVDF composite material ultrafine powder into ALD equipment, and fully contacting the zirconium tetrachloride precursor with the quantum dot/polymer green powder by pulse argon at 500Pa and 85 ℃. And then introducing water vapor for 5s to hydrolyze zirconium tetrachloride adsorbed on the surface of the quantum dot into zirconium dioxide, repeating the process for 200 times, and obtaining the perovskite quantum dot/polymer coated with zirconium dioxide with the thickness of 10 nm.
The zirconium dioxide coated perovskite quantum dot/polymer green powder was compounded with the same proportion of cationic curing glue as in example 1 to obtain an inorganic coated perovskite quantum dot/polymer, designated 9#.
Comparative example 3
Titanium ore quantum dot/polymer green powder microsphere, MAPbBr 3 And (3) placing the ultrafine powder of the PVDF composite material into an ALD device, and fully contacting the silicon tetrachloride precursor with the quantum dot/polymer green powder by pulse argon at 50KPa and 70 ℃. And introducing water vapor for 5s to hydrolyze silicon tetrachloride adsorbed on the surface of the quantum dot into silicon dioxide, repeating the process for 100 times, and obtaining the perovskite quantum dot/polymer green powder coated with the silicon dioxide with the thickness of 10 nm.
The same proportion of cationic curing glue is compounded with the perovskite quantum dot/polymer coated by silicon dioxide as in the embodiment 1 to obtain the perovskite quantum dot/polymer coated by inorganic, which is marked as 10#.
Examples 1-7 and comparative examples 1-3 above are applicable to perovskite quantum dot yellow powders, red powders, pink powders, and other colored powders.
The quantum dot compositions of examples 1 to 7 and comparative examples 1 to 3 were coated on the PET surface of the barrier film with a diffusion layer by means of slit coating, and were converted into solid films after irradiation with a UV light source having a main wavelength of 365 nm. And then the film is bonded and packaged with another barrier film coated with OCR optical adhesive.
Wherein the water vapor transmission rate of the barrier film is 10 -1 g/m 2 Permeability of oxygen of 10g/m per 24h 2 And/24 h, wherein the coating thickness is 40 mu m, and the curing energy of the UV light source is 900-3000 mJ/cm 2 . After cutting the packaged quantum dot film into 50mm 60mm samples, the following tests were performed:
the quantum dot light-emitting efficiency, pce= (red quantum dot absorption peak area+green quantum dot absorption peak area)/(blue backlight peak area-blue peak area not absorbed through the quantum dot film) ×100%.
Reliability detection: exposing the sample to a. High temperature blue light (40 ℃ +90% RH+38W/m) 2 Blue light irradiation), b. aging for 1000 hours under high temperature and high humidity (60 ℃ +90%RH), detecting brightness decay before and after aging, x color point drift and y color point drift, repeating the three groups of tests and taking average values.
Failure edge test: the sample wafer is subjected to 40 ℃ +90%RH+38W/m 2 And (3) aging for 1000 hours under the blue light irradiation condition, testing the non-luminous width of the edge of the membrane by using a film ruler, taking the maximum width of four sides as the numerical value of the failure side, and repeating three groups of tests to obtain the average value.
Compatibility test: the inorganic-organic coated perovskite quantum dot composition is placed under the condition of 23 ℃ plus 50% RH for 500 hours, and the luminescent state of the quantum dot and the sedimentation condition in glue are observed.
Tensile properties: preparing a dumbbell-shaped spline from the inorganic-organic coated perovskite quantum dot composition, wherein the specification of the test part is 5cm x 2cm, and placing the spline at 70 ℃ plus 38W/m 2 After 240 hours of blue light storage, the elongation at break of the film was measured by a universal tester at a stretching rate of 30mm/min under a test environment of 23 ℃ and 50% RH, and the average value was obtained by repeating three sets of tests.
Adhesion test: the evaluation was carried out using ASTM grades based on GB/T9286-98 hundred methods.
The PCE of No. 1-No. 7 reaches 80-90%, and the difference between the PCE and No. 9 and No. 10 is not great, which shows that the luminous efficiency is not reduced although the thickness of the double-layer coated quantum dot is increased. The PCE of 8# was only 55%, indicating that the uncoated quantum dots were not resistant to uv irradiation.
The inorganic coated quantum dots are further modified by adopting an epoxy-containing organic structure, so that the inorganic coated quantum dots have a structure similar to an epoxy glue system, and therefore have good compatibility and dispersibility in the glue system. Sedimentation and quenching phenomena occur in 8# due to poor compatibility with cationic glues.
after aging for 1000 hours under ab conditions, the luminance decay of 1# to 7# is <10%, and the color point drift is < 10%o. The luminance decay of 8# is >30% and the color point drift is > 20%. The brightness attenuation of 9# and 10# is more than 10%, and the y color point drift is more than 10%o, which indicates that the organic-inorganic coated perovskite quantum dot/polymer has more stable aging resistance. The failure sides of # 1 to # 7 are within 1.7mm, while the failure sides of # 8 to # 10 are all >2mm. The film edges of 1# to 7# are provided with good performances of resisting water vapor, oxygen and blue light, so that the whole light is more uniform.
The sample wafer is subjected to 70 ℃ plus 38W/m 2 After the blue light is stored for 240 hours, the elongation at break of 1# -7# is greater than 8# -10#, which indicates that the composition 1-7 has good tensile property, and is mainly derived from the fact that after photo/thermal curing, the quantum dots with the alicyclic epoxy on the surface can be uniformly dispersed in a system and polymerized onto a molecular chain main body, and the quantum dots cannot migrate and separate out in the aging process, and no phase separation exists. The 8# -11# has poor compatibility in the system, phase separation exists between inorganic and organic, and the quantum dots precipitated in the aging process easily generate stress in the cured film, so that the elongation at break is low. The adhesion test result shows that the adhesion of the quantum dot composition using the cationic curing system to the barrier film can reach 4B, the falling area is less than 5%, and the quantum dot composition has good adhesion effect.
Table 1 comparison of test data
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, or the like, which are within the spirit and principles of the present invention, are intended to be included within the scope of the present invention, such as, for example, free radical-cationic dual cure compositions, moisture-cationic dual cure compositions, and the like.
Claims (43)
1. The composite perovskite quantum dot material is characterized by comprising perovskite quantum dots/polymers and an inorganic-organic layer; the inorganic-organic layer coats perovskite quantum dots/polymers;
the inorganic-organic layer includes an inorganic layer and an organic layer; the inorganic layer and the organic layer undergo hydrolysis condensation reaction to obtain the inorganic-organic layer; the organic layer coats the inorganic layer;
the composition of the inorganic layer comprises a metal oxide selected from oxides of aluminum, silicon, titanium or zirconium;
the composition of the organic layer comprises silane containing alicyclic epoxy; the chemical structure of the alicyclic epoxy-containing silane is shown as a formula I:
Wherein:
R 1 :-CH 2 -
R 2 selected from the group consisting ofor-CH 2 -CH 2 -
R 3 Selected from-CH 3 Or (b)
R 4 Selected from-CH 2 -or
R 5 Selected from the group consisting of-O-CH 3 or-O-CH 2 -CH 3
R 6 Selected from the group consisting of-O-CH 3 or-O-CH 2 -CH 3 or-CH 3
p is more than or equal to 0; q is more than or equal to 0; n=0 or 1.
2. The composite perovskite quantum dot material according to claim 1, wherein the mass ratio of the alicyclic epoxy-containing silane to the inorganic coated perovskite quantum dot/polymer powder is 5-20:3-8.
3. The composite perovskite quantum dot material according to claim 1, wherein the thickness of the inorganic layer is 5nm to 100nm; the thickness of the inorganic-organic layer is 10 nm-300 nm.
4. The composite perovskite quantum dot material of claim 1, wherein the metal oxide is selected from at least one of aluminum oxide, silicon dioxide, titanium dioxide, or zirconium dioxide.
5. The composite perovskite quantum dot material according to claim 1, wherein in the perovskite quantum dot/polymer, the perovskite quantum dot has a size of 2 to 50nm in at least one dimension; the perovskite quantum dot has a structural AMX 3 、A 3 M 2 X 9 、A 2 MX 6 、Q 2 A m-1 M m X 3m+1 At least one of (a) and (b); wherein A is NH 2 CHNH 2 + 、CH 3 NH 3 + 、Cs + At least one of (a) and (b); m is Pb 2+ 、Cd 2+ 、Mn 2+ 、Zn 2+ 、Sn 2+ 、Ge 2+ 、Bi 3+ At least one of (a) and (b); x is at least one of halogen anions; q is an aromatic group or an alkyl organic amine cation having not less than 3 carbon atoms; m is any number between 1 and 100.
6. The composite perovskite quantum dot material according to claim 1, wherein the polymer is selected from at least one of polyvinylidene fluoride, polyvinylidene fluoride and trifluoroethylene copolymer, polyacrylonitrile, polyvinyl acetate, cellulose acetate, cyanocellulose, polysulfone, aromatic polyamide, polyimide, polycarbonate, polystyrene, polymethyl methacrylate.
7. The composite perovskite quantum dot material according to claim 1, wherein the mass ratio of perovskite quantum dot to polymer in the perovskite quantum dot/polymer is 1:1 to 500.
8. The preparation method of the composite perovskite quantum dot material is characterized by comprising the following steps of:
(1) Obtaining perovskite quantum dot/polymer powder;
(2) Depositing a metal source on the surface of perovskite quantum dots/polymer powder by an atomic deposition method, and hydrolyzing to obtain inorganic coated perovskite quantum dots/polymer;
(3) Obtaining silane containing alicyclic epoxy;
(4) Carrying out hydrolytic condensation reaction on silane containing alicyclic epoxy and perovskite quantum dot/polymer coated by metal oxide to obtain the composite perovskite quantum dot material;
in the step (2), the metal source is selected from at least one of an aluminum source, a silicon source, a titanium source and a zirconium source; the aluminum source is at least one selected from trimethylaluminum, triethylaluminum and aluminum trichloride; the silicon source is at least one selected from methyl orthosilicate or ethyl orthosilicate; the titanium source is at least one of tetrabutyl titanate, isopropyl titanate and tetraethyl titanate; the zirconium source is at least one selected from dimethylaminozirconium, tetrabutyl zirconate, zirconium n-butoxide, zirconium tert-butoxide and zirconium isopropoxide;
In the step (3), the alicyclic epoxy-containing silane is prepared by adding vinyl-terminated silane and vinyl-terminated alicyclic epoxy and double-terminated hydrosilane through hydrosilylation under the action of a platinum catalyst; the mol ratio of the vinyl-terminated silane to the vinyl-terminated alicyclic epoxy to the double-terminal hydrosilane is 1-1.02: 1 to 1.1:1 to 1.02; the dosage of the platinum-based catalyst accounts for 0.001 to 0.5 percent of the sum of the masses of vinyl-terminated silane, vinyl-terminated alicyclic epoxy and double-terminated hydrosilane; the reaction temperature is 110-130 ℃.
9. The method according to claim 8, wherein in the step (2), the deposition temperature is 80 to 100 ℃; the time is 5 s-90 s; the vacuum degree is 100-1000 Pa, the time of introducing steam is 3-20 s, and the cycle number is 10-500.
10. The method according to claim 8, wherein the vinyl-terminated silane is at least one selected from the group consisting of vinylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, methacryloxymethyltriethoxysilane, methacryloxymethyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, and methacryloxypropylmethyldimethoxysilane.
11. The method according to claim 8, wherein the vinyl-terminated alicyclic epoxy is at least one selected from the group consisting of 1, 2-epoxy-4-vinylcyclohexane, 3, 4-epoxycyclohexylmethacrylate and 3, 4-epoxycyclohexylmethacrylate.
12. The method according to claim 8, wherein the double-terminal hydrosilane is at least one selected from the group consisting of tetramethyl disiloxane, tetramethyl diphenyl dihydrotrisiloxane, double-terminal hydrosilyl polydimethylsiloxane and tetraisopropyl dihydrodisiloxane.
13. The method according to claim 8, wherein the platinum-group catalyst is at least one selected from the group consisting of chloroplatinic acid, a complex of platinum and vinyl siloxane, and a platinum-olefin complex.
14. The method of claim 8, wherein in step (4), the mass ratio of the alicyclic epoxy-modified silane to the metal oxide coated perovskite quantum dot/polymer is 5 to 20:3 to 8; the conditions of the hydrolytic condensation reaction are that the temperature is 25-60 ℃; the time is 0.5 h-30 h.
15. The method according to claim 8, wherein,
In the step (1), the method for obtaining the perovskite quantum dot/polymer powder comprises the steps of atomizing a perovskite quantum dot precursor solution into small liquid drops, and then drying the atomized small liquid drops to generate the perovskite quantum dot/polymer powder; the perovskite quantum dot precursor solution comprises a solvent, a perovskite quantum dot raw material and a polymer matrix;
the particle size of the perovskite quantum dot/polymer powder is 0.1-200 mu m.
16. The method according to claim 15, wherein the solvent is at least one selected from the group consisting of N, N-dimethylformamide, dimethylsulfoxide, trimethylphosphate, triethylphosphate, N-methylpyrrolidone, dimethylacetamide.
17. The method of claim 15, wherein the perovskite quantum dot material comprises AX, QX, and MX t The method comprises the steps of carrying out a first treatment on the surface of the Wherein A is NH 2 CHNH 2 + 、CH 3 NH 3 + 、Cs + At least one of (a) and (b); m is Pb 2+ 、Cd 2+ 、Mn 2+ 、Zn 2+ 、Sn 2+ 、Ge 2+ 、Bi 3 + At least one of (a) and (b);
q is an aromatic group or an alkyl organic amine cation having not less than 3 carbon atoms;
x is at least one of halogen anions; t=2 or 3.
18. The method of claim 15, wherein the polymer matrix is at least one selected from the group consisting of polyvinylidene fluoride, polyvinylidene fluoride and trifluoroethylene copolymers, polyacrylonitrile, polyvinyl acetate, cellulose acetate, cyanocellulose, polysulfone, aromatic polyamide, polyimide, polycarbonate, polystyrene, and polymethyl methacrylate.
19. The method of claim 15, wherein the mass ratio of polymer matrix to solvent is 1:2 to 200.
20. The method of claim 19, wherein the mass ratio of polymer matrix to solvent is 1:5 to 50.
21. The method of claim 15, wherein the mass ratio of perovskite quantum dot material to polymer matrix is 1:1 to 500.
22. The method of claim 21, wherein the mass ratio of perovskite quantum dot material to polymer matrix is 1:5 to 100.
23. The method of preparing according to claim 15, wherein the perovskite quantum dot precursor solution further comprises additives and/or surface ligands.
24. The method of claim 23, wherein the additive is at least one selected from the group consisting of zinc bromide, zinc iodide, stannous bromide, stannous iodide, cadmium bromide, cadmium iodide, and hypophosphorous acid.
25. The preparation method according to claim 15, wherein the mass ratio of the additive to the perovskite quantum dot raw material is 1:1 to 500.
26. The method of claim 25, wherein the mass ratio of the additive to the perovskite quantum dot material is 1:4 to 100.
27. The method of claim 23, wherein the surface ligand comprises at least one of an organic acid, an organic acid halide, a long-chain organic amine halide; the organic acid comprises a saturated or unsaturated alkyl acid having at least 3 carbon atoms; the long-chain organic amine is alkyl amine or aromatic amine with 4-24 carbon atoms; the halide of the organic acid or the long-chain organic amine is the halide corresponding to the organic acid or the long-chain organic amine.
28. The method of claim 27, wherein the mass ratio of surface ligand to perovskite quantum dot material is 1:1 to 50.
29. The method of claim 28, wherein the mass ratio of surface ligand to perovskite quantum dot material is 1:2 to 20.
30. The method of claim 15, wherein the perovskite quantum dot precursor solution is fed at a flow rate of 1mL/min to 5000mL/min; the temperature of the inlet air is 40-200 ℃.
31. The method of claim 15, wherein the atomized droplets are dried to form perovskite quantum dot/polymer powder and solvent vapor, and the solvent is recovered by separation.
32. The method according to claim 15, wherein the inert gas is used as the circulating gas.
33. The method according to claim 32, wherein the inert gas is at least one selected from nitrogen and helium.
34. The perovskite quantum dot composition is characterized by comprising the following components in parts by weight:
2 to 21 parts of perovskite quantum dot material, 40 to 260 parts of epoxy resin, 20 to 180 parts of reactive diluent, 0.1 to 18 parts of cationic initiator, 5 to 45 parts of light scattering particles and 0.5 to 10 parts of auxiliary agent;
the perovskite quantum dot material is at least one of the composite perovskite quantum dot material according to any one of claims 1 to 7 and the composite perovskite quantum dot material prepared by the preparation method according to any one of claims 8 to 33.
35. The perovskite quantum dot composition as claimed in claim 34, wherein,
the composition comprises the following components in parts by weight: 11 to 20.5 parts of perovskite quantum dot material, 170 to 200 parts of epoxy resin, 40 to 130 parts of reactive diluent, 0.5 to 14 parts of cationic initiator, 20 to 30 parts of light scattering particles and 1 to 6 parts of auxiliary agent;
the epoxy resin is at least one selected from alicyclic epoxy resins and glycidyl type epoxy resins.
36. The perovskite quantum dot composition of claim 35, wherein the perovskite quantum dot composition is,
the alicyclic epoxy resin is at least one selected from bis (di (3, 4-epoxycyclohexyl) methyl) adipic acid, poly [ (2-epoxyethane group) -1, 2-cyclohexanediol ] 2-ethyl-2- (hydroxymethyl) -1, 3-propanediol ether (3:1), 1, 4-bis (3, 4-epoxycyclohexyl-1-methoxy) methylbenzene, 1, 4-bis (3, 4-epoxycyclohexyl-1-methoxy) butane, epoxypolybutadiene, dicyclopentadiene dioxide and 3, 4-epoxycyclohexane carboxylic acid methyl ester.
37. The perovskite quantum dot composition of claim 35, wherein the perovskite quantum dot composition is,
the glycidyl type epoxy resin comprises at least one of hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, polyethylene glycol glycidyl ether, polypropylene glycol glycidyl ether and polybutylene glycol glycidyl ether;
the reactive diluent is at least one selected from vinyl ethers, propenyl ethers, oxygen heterocyclic reactive diluents and glycidyl ethers.
38. The perovskite quantum dot composition as claimed in claim 37, wherein,
The vinyl ether is at least one selected from 4-hydroxybutyl vinyl ether, triethylene glycol divinyl ether, l, 4-cyclohexyl dimethanol divinyl ether, dodecyl vinyl ether and 1, 4-cyclohexane dimethanol vinyl ether; the propenyl ether is selected from glycerol carbonate propenyl ether.
39. The perovskite quantum dot composition as claimed in claim 37, wherein,
the oxygen heterocyclic reactive diluent is at least one selected from 3-ethyl-3-hydroxymethyl oxetane, 3-ethyl-3-phenoxymethyl oxetane, 3' - (oxybis methylene) -bis- (3-ethyl) oxetane, 1, 2-bis [ (3-ethyl-3-oxetanylmethoxy) methyl ] ethane, 1, 4-bis [3- (ethyl-3-oxymethylene oxetane) methyl ] benzene and bis (3-ethyl-3-oxethyl) ether.
40. The perovskite quantum dot composition as claimed in claim 37, wherein,
the glycidyl ether is at least one selected from n-butyl glycidyl ether, benzyl glycidyl ether, ethylene glycol diglycidyl ether, 1, 4-cyclohexanedimethanol diglycidyl ether and tert-butyl phenol glycidyl ether;
the cationic initiator is selected from a photo cationic initiator and/or a thermal cationic initiator;
The photo cation initiator is selected from sulfonium salts such as 4-phenylsulfanylphenyl diphenylsulfonium salt, tris [4- [ (4-acetylphenyl) thio ] -hexafluorophosphate, tris (4-methoxyphenyl) sulfonium hexafluorophosphate, diphenyl-4-phenylsulfanylphenyl sulfonium hexafluoroantimonate, diphenyl-4-phenylsulfanylphenyl sulfonium hexafluorophosphate, 4-dodecylphenyldiphenylsulfonium hexafluorophosphate, 4' -bis (diphenylsulfonium) phenylsulfide-bis-hexafluoroantimonate, 4' -bis [ bis (. Beta. -hydroxyethoxy) phenylsulfonium ] phenylsulfide-bis-hexafluoroantimonate, 4- [4' - (benzoyl) phenylthio ] phenyl-bis- (4-fluorophenyl) sulfonium hexafluoroantimonate, 4- (2-chloro-4-benzoylphenylthio) phenylbis (4-fluorophenyl) sulfonium hexafluoroantimonate; iodonium salts such as at least one of diphenyliodohexafluoroantimonate, bis (4-methylphenyl) iodohexafluorophosphate, bis (4-tert-butylphenyl) iodohexafluorophosphate, tolyltetra (pentafluorophenyl) borate diaryliodonium salts, and arylferrocenium salts such as [ cyclopentadiene-iron-isopropylbenzene ] hexafluorophosphate;
the thermal cation initiator is selected from anhydride compounds such as methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride and tetrahydrophthalic anhydride; imidazole derivatives such as N- (2- (2-methyl-1-imidazolyl) ethyl) urea, N' - (2-methyl-1-imidazolylethyl) adipamide, 2-phenyl-4, 5-dimethylol imidazole, hycat TM At least one of AO-4 and CXC-1612;
the light scattering particles are selected from inorganic light dispersing agents or organic light dispersing agents; the inorganic light dispersing agent is at least one selected from nano barium sulfate, nano zinc oxide and nano silicon dioxide; the organic light diffusion is at least one selected from PMMA microsphere, organosilicon microsphere, polytetrafluoroethylene wax, polypropylene wax, polyethylene wax microsphere, polyamide wax microsphere and amide modified polyethylene wax;
the auxiliary agent is at least one selected from flatting agent, defoamer and antioxidant.
41. The method for preparing a perovskite quantum dot composition according to any one of claims 34 to 40, wherein the perovskite quantum dot composition is obtained by mixing the perovskite quantum dot material with epoxy resin, reactive diluent, cationic initiator, light scattering particles and auxiliary agent in proportion and dispersing under vacuum condition.
42. Use of a composite perovskite quantum dot material according to any one of claims 1 to 7, a composite perovskite quantum dot material prepared by a preparation method according to any one of claims 8 to 33, a perovskite quantum dot composition according to any one of claims 34 to 40 in a semiconductor luminescent material.
43. The use according to claim 42 for a display device.
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4694029A (en) * | 1985-04-09 | 1987-09-15 | Cook Paint And Varnish Company | Hybrid photocure system |
WO2016070713A1 (en) * | 2014-11-04 | 2016-05-12 | 北京理工大学 | Perovskite quantum dot material and preparation method therefor |
WO2016180364A1 (en) * | 2015-05-14 | 2016-11-17 | 北京理工大学 | Perovskite/polymer composite luminescent material, preparation method and application |
CN107955199A (en) * | 2017-11-09 | 2018-04-24 | 合肥乐凯科技产业有限公司 | Perovskite quantum dot film, quantum dot diffusion composite membrane and preparation method thereof |
CN110707219A (en) * | 2019-10-14 | 2020-01-17 | 合肥乐凯科技产业有限公司 | Organic-inorganic perovskite quantum dot film and preparation method thereof |
CN112029494A (en) * | 2019-06-04 | 2020-12-04 | 致晶科技(北京)有限公司 | Perovskite nano material, composite luminescent material containing perovskite nano material, and preparation method and application of perovskite nano material |
WO2020244046A1 (en) * | 2019-06-04 | 2020-12-10 | 致晶科技(北京)有限公司 | Composite luminescent material, preparation method therefor and use thereof |
-
2021
- 2021-10-21 CN CN202111227197.9A patent/CN116004226B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4694029A (en) * | 1985-04-09 | 1987-09-15 | Cook Paint And Varnish Company | Hybrid photocure system |
WO2016070713A1 (en) * | 2014-11-04 | 2016-05-12 | 北京理工大学 | Perovskite quantum dot material and preparation method therefor |
WO2016180364A1 (en) * | 2015-05-14 | 2016-11-17 | 北京理工大学 | Perovskite/polymer composite luminescent material, preparation method and application |
CN107955199A (en) * | 2017-11-09 | 2018-04-24 | 合肥乐凯科技产业有限公司 | Perovskite quantum dot film, quantum dot diffusion composite membrane and preparation method thereof |
CN112029494A (en) * | 2019-06-04 | 2020-12-04 | 致晶科技(北京)有限公司 | Perovskite nano material, composite luminescent material containing perovskite nano material, and preparation method and application of perovskite nano material |
WO2020244047A1 (en) * | 2019-06-04 | 2020-12-10 | 致晶科技(北京)有限公司 | Perovskite nanomaterial, composite light-emitting material containing same and preparation method therefor and application thereof |
WO2020244046A1 (en) * | 2019-06-04 | 2020-12-10 | 致晶科技(北京)有限公司 | Composite luminescent material, preparation method therefor and use thereof |
CN110707219A (en) * | 2019-10-14 | 2020-01-17 | 合肥乐凯科技产业有限公司 | Organic-inorganic perovskite quantum dot film and preparation method thereof |
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