CN115996620A - Piezoelectric device - Google Patents

Piezoelectric device Download PDF

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Publication number
CN115996620A
CN115996620A CN202210938146.5A CN202210938146A CN115996620A CN 115996620 A CN115996620 A CN 115996620A CN 202210938146 A CN202210938146 A CN 202210938146A CN 115996620 A CN115996620 A CN 115996620A
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China
Prior art keywords
bonding
substrate
wiring member
main surface
joint
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Pending
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CN202210938146.5A
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Chinese (zh)
Inventor
田村淳
佐佐木拓哉
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TDK Corp
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TDK Corp
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Publication of CN115996620A publication Critical patent/CN115996620A/en
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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

The invention provides a piezoelectric device. In the piezoelectric device (1), when the height from the main surface (2 a) of the substrate (2) to the bonding interface (PA) between the wiring member (4) and the first bonding member (24) is T1, the height from the main surface (2 a) of the substrate (2) to the bonding interface (PB) between the wiring member (4) and the second bonding member (25) is T2, and the height from the main surface (2 a) of the substrate (2) to the bonding interface (PC) between the wiring member (4) and the third bonding member (26) is T3, the relation T2 < T3 < T1 is established.

Description

Piezoelectric device
Technical Field
The present disclosure relates to piezoelectric devices.
Background
Examples of the piezoelectric device including the piezoelectric element include those described in japanese patent application laid-open No. 4-070100. The conventional piezoelectric device includes a piezoelectric element, a vibration member bonded to the piezoelectric element, and a wiring member electrically connected to the piezoelectric element. One end of the wiring member is connected to other circuit members or the like via a connector or the like. The other end of the wiring member is physically connected to the vibration member and is electrically connected to the piezoelectric element.
Disclosure of Invention
The piezoelectric device of japanese patent application laid-open No. 4-070100 is intended to obtain vibration from a piezoelectric element. However, the use of piezoelectric devices is varied. Piezoelectric devices are also used in pressure sensors for obtaining electromotive force from a piezoelectric element based on stress generated by pressing a finger or the like. In such a piezoelectric device, in order to obtain a desired electromotive force corresponding to pressing with high accuracy, it is important to suppress a vibration component caused by the wiring member.
The present disclosure has been made to solve the above-described problems, and an object thereof is to provide a piezoelectric device capable of obtaining a desired electromotive force from a piezoelectric element with high accuracy.
An aspect of the present disclosure provides a piezoelectric device, including: a substrate; a piezoelectric element disposed on a main surface of the substrate; a wiring member extending toward the substrate and the piezoelectric element; a first bonding portion that electrically bonds the piezoelectric element and the wiring member via a conductive first bonding member; a second bonding portion electrically bonding the substrate and the wiring member via a second bonding member having conductivity; and a third bonding portion that physically bonds the substrate and the wiring member by the non-conductive third bonding member, wherein when a height from the main surface of the substrate to the bonding interface between the wiring member and the first bonding member is set to T1, a height from the main surface of the substrate to the bonding interface between the wiring member and the second bonding member is set to T2, and a height from the main surface of the substrate to the bonding interface between the wiring member and the third bonding member is set to T3, a relationship of T2 < T3 < T1 is established.
In the piezoelectric device, the wiring member of the third joint portion is located at a height between the wiring member in the first joint portion and the wiring member in the second joint portion. Therefore, the difference in the height difference of the wiring member is relaxed between the first joint portion and the third joint portion and between the second joint portion and the third joint portion, and even when stress is applied to the wiring member, vibration of the wiring member can be suppressed. Therefore, in this piezoelectric device, a desired electromotive force from the piezoelectric element can be obtained with high accuracy.
The wiring member may be inclined so that the height from the main surface of the substrate gradually decreases from the first bonding portion to the third bonding portion. In this way, by setting the inclination of the wiring member to be uniform, vibration of the wiring member when stress is applied to the wiring member can be more effectively suppressed.
The wiring member may be inclined so that the height from the main surface of the substrate becomes gradually higher from the second joint portion to the third joint portion. In this way, by setting the inclination of the wiring member to be uniform, vibration of the wiring member when stress is applied to the wiring member can be more effectively suppressed.
The wiring member may be branched into a first end portion connected to the first joint portion by the first joint member and a second end portion connected to the second joint portion by the second joint member. According to this structure, compared with a case where a portion of the wiring member bonded to the piezoelectric element by the first bonding portion and a portion bonded to the substrate by the second bonding portion are continuous, stress generated in a direction connecting the first bonding portion and the second bonding portion can be relaxed. Therefore, vibration of the wiring member can be suppressed more effectively.
The third joint portion may be located closer to the base end side of the wiring member than the first joint portion and the second joint portion. By physically connecting the substrate to the wiring member on the base end side of the first bonding portion and the second bonding portion, vibration of the wiring member can be suppressed more reliably.
The bonding area between the substrate and the wiring member by the third bonding member may be larger than the bonding area between the piezoelectric element and the wiring member by the first bonding member. By physically connecting the substrate and the wiring member with a sufficient area, vibration of the wiring member can be suppressed more reliably.
The bonding area between the substrate and the wiring member by the third bonding member may be larger than the bonding area between the substrate and the wiring member by the second bonding member. By physically connecting the substrate and the wiring member with a sufficient area, vibration of the wiring member can be suppressed more reliably.
The first bonding portion and the third bonding portion may have regions overlapping each other in a normal direction of the main surface of the substrate when viewed from the extending direction of the wiring member. Thus, the shape of the wiring member is simplified, and vibration of the wiring member can be suppressed more reliably.
The second bonding portion and the third bonding portion may have regions overlapping each other in a normal direction of the main surface of the substrate when viewed from the extending direction of the wiring member. Thus, the shape of the wiring member is simplified, and vibration of the wiring member can be suppressed more reliably.
Drawings
Fig. 1 is a perspective view showing the overall structure of a piezoelectric device according to an embodiment of the present disclosure.
Fig. 2 is a sectional view taken along line II-II of fig. 1.
Fig. 3 is a sectional view taken along line III-III of fig. 1.
Fig. 4 is a side view of the piezoelectric device shown in fig. 1 as viewed from the Y direction.
Fig. 5 is a plan view of the piezoelectric device shown in fig. 1 as viewed from the Z direction.
Detailed Description
Hereinafter, preferred embodiments of the piezoelectric device according to an aspect of the present disclosure will be described in detail with reference to the accompanying drawings.
Fig. 1 is a perspective view showing the overall structure of a piezoelectric device according to an embodiment of the present disclosure. As shown in fig. 1, the piezoelectric device 1 includes a substrate 2, a piezoelectric element 3 disposed on the main surface 2a side of the substrate 2, and a wiring member 4 extending to the substrate 2 and the piezoelectric element 3. The piezoelectric device 1 has a purpose as a pressing sensor, for example. In the piezoelectric device 1, the electromotive force from the piezoelectric element 3 is obtained based on stress (deformation of the substrate 2) generated by, for example, pressing by a finger or the like. The electromotive force from the piezoelectric element 3 is output to the outside via the wiring member 4.
In the following description, the extending direction of the wiring member 4 is referred to as the X direction, the direction orthogonal to the X direction in the in-plane direction of the main surface 2a of the substrate 2 is referred to as the Y direction, and the normal direction of the main surface 2a of the substrate 2 is referred to as the Z direction.
The substrate 2 is formed in a rectangular shape by, for example, a conductive metal material. The substrate 2 has a pair of main surfaces 2a and 2b facing each other. The main surface 2a serves as a surface on which the piezoelectric element 3 is mounted. The main surface 2b is a surface to which a touch panel or the like is fixed when the piezoelectric device 1 is used as a pressing sensor, for example. The planar shape of the substrate 2 is, for example, square. Examples of the constituent material of the substrate 2 include a ni—fe alloy, ni, brass, and stainless steel.
The piezoelectric element 3 includes a piezoelectric element body 5 and a pair of external electrodes 6A and 6B. The piezoelectric element 5 is formed in a rectangular parallelepiped shape flattened in the Z direction. The rectangular parallelepiped shape also includes a shape in which corners and ridge portions are chamfered and a shape in which corners and ridge portions are rounded. The planar shape of the piezoelectric element 5 is, for example, a square shape having one side with a smaller length than the substrate 2. The thickness of the piezoelectric element 5 is, for example, larger than the thickness of the substrate 2. On the main surface 2a of the substrate 2, the center of the piezoelectric element 5 coincides with the center of the substrate 2.
The piezoelectric element 5 has no internal electrode and is composed of a single piezoelectric layer 7. The piezoelectric layer 7 is made of a piezoelectric material. In the present embodiment, the piezoelectric layer 7 is made of a piezoelectric ceramic material. Examples of the piezoelectric ceramic material include PZT [ Pb (Zr, ti) O ] 3 ]、PT(PbTiO 3 )、PLZT[(Pb，La)(Zr，Ti)O 3 ]Barium titanate, and the like. The piezoelectric layer 7 is made of, for example, a sintered body of a ceramic green sheet containing the piezoelectric ceramic material described above.
The external electrodes 6A and 6B are formed in a rectangular parallelepiped shape flattened in the Z direction. The rectangular parallelepiped shape also includes a shape in which corners and ridge portions are chamfered and a shape in which corners and ridge portions are rounded. The thicknesses of the external electrodes 6A and 6B are the same as each other, and are very small compared with the thickness of the piezoelectric element 5. The external electrodes 6A and 6B are made of a conductive material. Examples of the conductive material include Ag, pd, and ag—pd alloy. The external electrodes 6A and 6B are formed of, for example, a sintered body of an electroconductive paste containing the electroconductive material described above.
The external electrode 6A is disposed on a main surface 5a (see fig. 2) of the piezoelectric element 5 on the substrate 2 side. The external electrode 6A is provided over the entire surface of the main surface 5 a. The external electrode 6A is bonded to the main surface 2a of the substrate 2 by, for example, an adhesive 8. As the adhesive material 8, for example, an ultraviolet-curable adhesive, an anaerobic-curable adhesive, a thermosetting adhesive, or the like can be used. The adhesive material 8 may be wound between the external electrode 6A and the main surface 2a, but at least a partial region of the external electrode 6A is in contact with the main surface 2 a. Thereby, the external electrode 6A and the substrate 2 are electrically connected to each other.
The external electrode 6B is disposed on the main surface 5B of the piezoelectric element 5 opposite to the substrate 2. The planar shape of the external electrode 6B is a square shape smaller than the main surface 5B by one turn. The center of the external electrode 6B coincides with the center of the main surface 5B. When viewed from the Z direction, the four sides of the external electrode 6B are positioned further inward than the four sides of the main surface 5B. In the piezoelectric element 5, a region located between the external electrode 6A and the external electrode 6B becomes a piezoelectrically active region.
The wiring member 4 is constituted by, for example, a flexible circuit board (FPC). The wiring member 4 has a structure in which the conductor 9 is covered with a cover 10, and has a main body 11 extending in the X direction on the main surface 2a side of the substrate 2. The conductor 9 is formed of a material having excellent conductivity, such as copper. The cover 10 is formed of a nonconductive resin such as polyimide resin.
One end portion (hereinafter, base end portion 12) of the wiring member 4 can be electrically connected to a control portion or the like to be an output target of electromotive force via a connection member such as a connector. The other end portion (hereinafter, the distal end portion 13) of the wiring member 4 extends from the one corner portion 2c side of the substrate 2 to the main surface 2 a. The front end portion 13 branches into a first end portion 13A and a second end portion 13B. The first end portion 13A has: a first portion 14a extending from the main body 11 along the edge of the substrate 2 in the Y direction; and a second portion 14b extending in the X direction from the front end of the first portion 14 a. The second end portion 13B extends along the edge portion of the substrate 2 in the X direction so as to be on the extension line of the main body portion 11.
The first portion 14a of the first end portion 13A is spaced apart from the second end portion 13B at a certain interval in the Y direction. The position of the front end portion of the first portion 14a in the first end portion 13A and the position of the front end portion of the second end portion 13B coincide in the X direction. In the front end portion of the first portion 14a and the front end portion of the second portion 13B of the first end portion 13A, the conductor 9 is exposed from the cover 10 in order to electrically connect the substrate 2 and the piezoelectric element 3 (see fig. 4).
Next, the bonding structure of the substrate 2, the piezoelectric element 3, and the wiring member 4 will be described in more detail with reference to fig. 2 to 5.
Fig. 2 is a sectional view taken along line II-II of fig. 1, and fig. 3 is a sectional view taken along line III-III of fig. 1. Fig. 4 is a side view of the piezoelectric device shown in fig. 1 as viewed from the Y direction. Fig. 5 is a plan view of the piezoelectric device shown in fig. 1 as viewed from the Z direction.
As shown in fig. 2 to 5, the piezoelectric device 1 includes: a first bonding portion 21 for electrically bonding the piezoelectric element 3 and the wiring member 4 by the first bonding member 24 having conductivity; a second bonding portion 22 for electrically bonding the substrate 2 and the wiring member 4 via a conductive second bonding member 25; and a third bonding portion 23 for physically bonding the substrate 2 and the wiring member 4 by the non-conductive third bonding member 26.
The first bonding portion 21 is provided on the external electrode 6B in the piezoelectric element 3. The first joint portion 21 is located on the one corner portion 2c side of the substrate 2 on the external electrode 6B so as not to overlap with the center of the substrate 2 and the center of the piezoelectric element 3 when viewed from the Z direction. At the first joint 21, the conductor 9 exposed at the tip end portion of the first portion 14a in the first end portion 13A is joined to the external electrode 6B via the first joint member 24. Thereby, the external electrode 6B and the wiring member 4 are electrically connected to each other. As the first bonding member 24, for example, solder, an electroconductive paste/sheet, an anisotropic electroconductive paste/sheet, or the like can be used.
The second joint 22 is provided on the main surface 2a of the substrate 2. The second joint 22 is provided offset in the Y direction with respect to the first joint 21 according to the distance separating the first portion 14a of the first end portion 13A and the second end portion 13B in the Y direction in the wiring member 4. The second joint 22 is disposed in proximity to the side along the X direction of the two sides constituting the corner 2c of the main surface 2a of the substrate 2.
At the second joint 22, the conductor 9 exposed at the tip end portion of the second end portion 13B is joined to the external electrode 6B via the first joint member 24. Thereby, the substrate 2 and the wiring member 4 are electrically connected to each other. As described above, the external electrode 6A and the substrate 2 are electrically connected to each other. Therefore, the external electrode 6A is electrically connected to the wiring member 4 via the substrate 2. As the second bonding member 25, for example, solder, an electroconductive paste/sheet, an anisotropic electroconductive paste/sheet, or the like can be used.
The third joint 23 is provided on the main surface 2a of the substrate 2. The third joint 23 is located closer to the base end side of the wiring member 4 than the first joint 21 and the second joint 22. Specifically, the third joint 23 is disposed in proximity to one of the two sides of the main surface 2a of the substrate 2, which form the corner 2c, along the Y direction.
At the third bonding portion 23, the first portion 14a of the first end portion 13A and the base end portion 13Ba of the second end portion 13B connected to the first portion 14a in the wiring member 4 are bonded to the substrate 2 via the third bonding member 26. At the position of the third joint 23, the conductor 9 in the wiring member 4 is encased in the cover 10, and the cover 10 is joined to the main surface 2a of the substrate 2 via the third joint member 26. As a result, the wiring member 4 is physically connected to the substrate 2 at a portion closer to the base end side than the first bonding portion 21 and the second bonding portion 22. As the third joining member 26, for example, a nonconductive hot melt resin containing a reactive phenolic resin and a nitrile rubber as main components can be used.
As shown in fig. 2 and 3, the first bonding portion 21 is located on the external electrode 6B of the piezoelectric element 3, and the second bonding portion 22 and the third bonding portion 23 are located on the main surface 2a of the substrate 2. As shown in fig. 3, the thickness of the third bonding member 26 constituting the third bonding portion 23 in the Z direction is smaller than the thickness of the piezoelectric element 3 (including the external electrodes 6A and 6B) in the Z direction and is larger than the thickness of the second bonding member 25 constituting the second bonding portion 22 in the Z direction.
Therefore, in the piezoelectric device 1, when the height from the main surface 2a of the substrate 2 to the bonding interface PA between the wiring member 4 (conductor 9) and the first bonding member 24 is T1, the height from the main surface 2a of the substrate 2 to the bonding interface PB between the wiring member 4 (conductor 9) and the second bonding member 25 is T2, and the height from the main surface 2a of the substrate 2 to the bonding interface PC between the wiring member 4 and the third bonding member 26 is T3, the relationship of T2 < T3 < T1 is established.
In the present embodiment, the difference (=t3—t1) between T1 and T3 is larger than the difference (=t3—t2) between T3 and T2. However, the difference between T1 and T3 and the difference between T3 and T2 are not particularly limited. The difference between T1 and T3 and the difference between T3 and T2 may be increased according to the thickness of the piezoelectric element 3 in the Z direction or the thickness of each of the first, second, and third bonding members 24, 25, and 26 in the Z direction.
In the present embodiment, as shown in fig. 3, the first joint portion 21 and the third joint portion 23 have regions overlapping each other in the normal direction (Z direction) of the main surface 2a of the substrate 2 when viewed from the extending direction (X direction) of the wiring member 4. Similarly, the second joint portion 22 and the third joint portion 23 have regions overlapping each other in the normal direction (Z direction) of the main surface 2a of the substrate 2 when viewed from the extending direction (X direction) of the wiring member 4.
In the example of fig. 3, the entire Y-direction existence region W1 of the first joining member 24 overlaps the Y-direction existence region W3 of the third joining member 26 in the Z-direction when viewed from the X-direction. When viewed from the X direction, the entire Y-direction existence region W2 of the second joint member 25 overlaps the Y-direction existence region W3 of the third joint member 26 in the Z direction.
The entire Y-directional existence region W1 of the first joining member 24 may not overlap with the Y-directional existence region W3 of the third joining member 26 in the Z-direction, and a part of the existence region W1 may be exposed in the Y-direction with respect to the existence region W3. Similarly, the entire Y-directional existence region W2 of the second joining member 25 may not overlap with the Y-directional existence region W3 of the third joining member 26 in the Z-direction, and a part of the existence region W2 may be exposed in the Y-direction with respect to the existence region W3.
As shown in fig. 4, the wiring member 4 is inclined so that the height from the main surface 2a of the substrate 2 gradually decreases from the first joint portion 21 to the third joint portion 23. The wiring member 4 is inclined so that the height from the main surface 2a of the substrate 2 gradually increases from the second joint 22 to the third joint 23. In the present embodiment, the height of the wiring member 4 is uniformly changed between the first joint portion 21 and the third joint portion 23 without including a step or the like. Also, the height of the wiring member 4 is uniformly changed without including a step or the like between the second bonding portion 22 and the third bonding portion 23.
In the present embodiment, as described above, the difference between T1 and T3 is larger than the difference between T3 and T2. Therefore, the inclination angle θ1 of the wiring member 4 between the first bonding portion 21 and the third bonding portion 23 with respect to the main surface 2a of the substrate 2 is larger than the inclination angle θ2 of the wiring member 4 between the second bonding portion 22 and the third bonding portion 23 with respect to the main surface 2a of the substrate 2. The magnitude relation of the inclination angles θ1, θ2 can be increased according to the difference between T1 and T3 and the difference between T3 and T2.
As shown in fig. 5, the bonding area S3 between the substrate 2 and the wiring member 4 by the third bonding member 26 is larger than the bonding area S1 between the piezoelectric element 3 and the wiring member 4 by the first bonding member 24. The bonding area S3 between the substrate 2 and the wiring member 4 by the third bonding member 26 is larger than the bonding area S2 between the substrate 2 and the wiring member 4 by the second bonding member 25.
Each of the bonding areas S1 to S3 can be defined by, for example, the contour lines of the first bonding member 24 to the third bonding member 26 when viewed from the Z direction. The bonding area S3 is, for example, about 2 to 4 times the bonding areas S1 and S2. In the present embodiment, the bonding areas S1 and S2 are equal to each other. The bonding areas S1, S2 may also be different from each other.
As described above, in the piezoelectric device 1, the wiring member 4 in the third joint portion 23 is located at a height between the wiring member 4 in the first joint portion 21 and the wiring member 4 in the second joint portion 22. Therefore, the difference in the height difference of the wiring member 4 is relaxed between the first joint portion 21 and the third joint portion 23 and between the second joint portion 22 and the third joint portion 23, and even when stress is applied to the wiring member 4, vibration of the wiring member 4 can be suppressed. Therefore, in the piezoelectric device 1, a desired electromotive force from the piezoelectric element 3 can be obtained with high accuracy. In the case of using the piezoelectric device 1 as a pressing sensor, an improvement in the detection accuracy of pressing can be achieved.
In the present embodiment, the wiring member 4 is inclined so that the height from the main surface 2a of the substrate 2 gradually decreases from the first bonding portion 21 to the third bonding portion 23. The wiring member 4 is inclined so that the height from the main surface 2a of the substrate 2 gradually increases from the second joint 22 to the third joint 23. In this way, by making the inclination of the wiring member 4 uniform, vibration of the wiring member 4 when stress is applied to the wiring member 4 can be more effectively suppressed.
In the present embodiment, the wiring member 4 is branched into a first end portion 2A connected to the first joint portion 21 by the first joint member 24 and a second end portion 13B connected to the second joint portion 22 by the second joint member 25. According to this structure, compared with a case where a portion of the wiring member 4 bonded to the piezoelectric element 3 by the first bonding portion 21 and a portion bonded to the substrate 2 by the second bonding portion 22 are continuous, a stress generated in a direction connecting the first bonding portion 21 and the second bonding portion 22 can be relaxed. Therefore, vibration of the wiring member 4 can be suppressed more effectively.
In the present embodiment, the third joint portion 23 is located closer to the base end side of the wiring member 4 than the first joint portion 21 and the second joint portion 22. By physically connecting the substrate 2 and the wiring member 4 on the base end side of the first bonding portion 21 and the second bonding portion 22, vibration of the wiring member 4 can be suppressed more reliably.
In the present embodiment, the bonding area between the substrate 2 and the wiring member 4 by the third bonding member 26 is larger than the bonding area between the piezoelectric element 3 and the wiring member 4 by the first bonding member 24. In addition, the bonding area between the substrate 2 and the wiring member 4 by the third bonding member 26 is larger than the bonding area between the substrate 2 and the wiring member 4 by the second bonding member 25. In this way, by physically connecting the substrate 2 and the wiring member 4 with a sufficient area, vibration of the wiring member 4 can be more reliably suppressed.
In the present embodiment, the first joint portion 21 and the third joint portion 23 have regions overlapping each other in the normal direction (Z direction) of the main surface 2a of the substrate 2 when viewed from the extending direction (X direction) of the wiring member 4. In addition, the second joint portion 22 and the third joint portion 23 have regions overlapping each other in the normal direction (Z direction) of the main surface 2a of the substrate 2 when viewed from the extending direction (X direction) of the wiring member 4. According to this structure, the second portion 14B of the first end portion 13A and the second end portion 13B are linear, and therefore, the shape of the wiring member 4 is simplified. Therefore, vibration of the wiring member 4 can be suppressed more reliably.
In the present embodiment, each of the first joint portion 21, the second joint portion 22, and the third joint portion 23 is provided offset from the center of the substrate 2. Therefore, the restraining force generated by the wiring member 4 can be suppressed from directly reaching the center of the substrate 2. In this way, for example, when the piezoelectric device 1 is used as a pressing sensor, it is possible to suppress deformation of the substrate 2 caused by pressing by a finger or the like from being hindered by the restraining force generated by the wiring member 4.
The present disclosure is not limited to the above embodiments. For example, in the above embodiment, the planar shapes of the substrate 2 and the piezoelectric element 3 are square, but the planar shapes may be other rectangular shapes such as rectangular shapes, or may be other shapes such as circular shapes, elliptical shapes, and triangular shapes.
In the above-described embodiment, the wiring member 4 is branched into the first end portion 13A and the second end portion 13B, but the wiring member 4 may not necessarily have such a branching portion. For example, the following structure is also possible: the branch is made into a conductor 9 facing the first joint part 21 and a conductor 9 facing the second joint part 22, and the cover 10 integrally covers these conductors 9, 9. In the above embodiment, the first joint portion 21 is provided offset from the center of the substrate 2 when viewed from the Z direction, but at least a part of the first joint portion 21 may overlap with the center of the substrate 2.

Claims (9)

1. A piezoelectric device is provided with:
a substrate;
a piezoelectric element disposed on a main surface of the substrate;
a wiring member extending toward the substrate and the piezoelectric element;
a first bonding portion that electrically bonds the piezoelectric element and the wiring member via a conductive first bonding member;
a second bonding portion that electrically bonds the substrate and the wiring member via a second bonding member that is electrically conductive; and
a third bonding portion physically bonding the substrate and the wiring member by a non-conductive third bonding member,
when the height from the main surface of the substrate to the bonding interface between the wiring member and the first bonding member is T1, the height from the main surface of the substrate to the bonding interface between the wiring member and the second bonding member is T2, and the height from the main surface of the substrate to the bonding interface between the wiring member and the third bonding member is T3, the relationship of T2 < T3 < T1 is satisfied.
2. The piezoelectric device of claim 1, wherein,
the wiring member is inclined so that a height from the main surface of the substrate gradually decreases from the first bonding portion to the third bonding portion.
3. The piezoelectric device according to claim 1 or 2, wherein,
the wiring member is inclined so that a height from the main surface of the substrate gradually increases from the second joint portion to the third joint portion.
4. The piezoelectric device according to any one of claims 1 to 3, wherein,
the wiring member branches into: a first end portion connected to the first joint portion by the first joint member; and a second end portion connected to the second joint portion by the second joint member.
5. The piezoelectric device according to any one of claims 1 to 4, wherein,
the third joint portion is located closer to a base end side of the wiring member than the first joint portion and the second joint portion.
6. The piezoelectric device according to any one of claims 1 to 5, wherein,
the bonding area between the substrate and the wiring member by the third bonding member is larger than the bonding area between the piezoelectric element and the wiring member by the first bonding member.
7. The piezoelectric device according to any one of claims 1 to 6, wherein,
the bonding area of the substrate and the wiring member by the third bonding member is larger than the bonding area of the substrate and the wiring member by the second bonding member.
8. The piezoelectric device according to any one of claims 1 to 7, wherein,
the first bonding portion and the third bonding portion have regions overlapping each other in a normal direction of the main surface of the substrate when viewed from an extending direction of the wiring member.
9. The piezoelectric device according to any one of claims 1 to 8, wherein,
the second bonding portion and the third bonding portion have regions overlapping each other in a normal direction of the main surface of the substrate when viewed from an extending direction of the wiring member.
CN202210938146.5A 2021-10-15 2022-08-05 Piezoelectric device Pending CN115996620A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021169703A JP2023059604A (en) 2021-10-15 2021-10-15 piezoelectric device
JP2021-169703 2021-10-15

Publications (1)

Publication Number Publication Date
CN115996620A true CN115996620A (en) 2023-04-21

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Family Applications (1)

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CN202210938146.5A Pending CN115996620A (en) 2021-10-15 2022-08-05 Piezoelectric device

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CN (1) CN115996620A (en)

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