CN115980415A - Manufacturing method of conduction test module and conduction test module - Google Patents
Manufacturing method of conduction test module and conduction test module Download PDFInfo
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- CN115980415A CN115980415A CN202211627273.XA CN202211627273A CN115980415A CN 115980415 A CN115980415 A CN 115980415A CN 202211627273 A CN202211627273 A CN 202211627273A CN 115980415 A CN115980415 A CN 115980415A
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Abstract
The invention relates to a manufacturing method of a conduction test module and the conduction test module. The bulge is used for correspondingly fixing the welding pad of the PCB to be tested. Based on this, through the pad of the fixed PCB board that awaits measuring of arch, be favorable to the test of the various PCB boards of adaptation, avoid breaking and touch isotructure problem, improve the convenience and the accuracy of electric conduction test.
Description
Technical Field
The present invention relates to the field of electroplating technologies, and in particular, to a method for manufacturing a conduction test module and a conduction test module.
Background
PCB (Printed Circuit Board), which is called Printed Circuit Board in chinese, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. The application of the PCB greatly improves the automation level and the production labor rate of the electronic circuit.
When the PCB is shipped from a factory, various tests are usually performed to ensure the reliability of the product, especially the electrical performance conduction test, which directly relates to the working performance of the PCB. Meanwhile, in order to improve the testing efficiency, the testing can be assisted by various testing tools in the actual operation process, and the testing efficiency and accuracy are improved. The test tool in the electrical performance conduction test can assist in testing the conduction performance of a PAD (PAD) of the PCB. However, because the structure types of the pads of the PCB are various, the testing tool in the electrical performance conduction test cannot perfectly adapt to various pads, and the problems of disconnection and contact due to the structure mismatch and the like easily occur, which affect the convenience and accuracy of the test.
Disclosure of Invention
Therefore, it is necessary to provide a method for manufacturing a conduction test module and a conduction test module for the defects of the test tool in the conventional electrical performance conduction test.
A manufacturing method of a conduction test module comprises the following steps:
manufacturing a base plate layer of the test module;
determining a machining area on the base plate layer;
manufacturing a bulge in the processing area; the bulges are used for correspondingly fixing the welding pads of the PCB to be tested;
and after the bumps are manufactured, the subsequent circuit manufacturing is completed to obtain the conduction testing module.
According to the manufacturing method of the conduction test module, after the basic plate layer of the test module is manufactured, the machining area is determined on the basic plate layer, the bulge is manufactured in the machining area, and finally after the bulge is manufactured, the subsequent circuit manufacturing is completed, and the conduction test module is obtained. The bulge is used for correspondingly fixing the welding pad of the PCB to be tested. Based on this, through the pad of the fixed PCB board that awaits measuring of arch, be favorable to the test of the various PCB boards of adaptation, avoid breaking and touch isotructure problem, improve the convenience and the accuracy of electric conduction test.
In one embodiment, the process of making the base plate layer of the test module includes the steps of:
manufacturing an inner layer circuit to obtain an inner layer;
pressing the outer layer based on the inner layer to obtain a multilayer board;
drilling to communicate the inner layer and the outer layer;
and electroplating holes communicating the inner layer and the outer layer to conduct the electrical properties of the inner layer and the outer layer.
In one embodiment, the process of determining a machining area on the base ply includes the steps of:
and windowing the basic board layer by using the dry film, and taking a windowing region as a processing region.
In one embodiment, the process of making the protrusions in the processing area comprises the steps of:
and electroplating metal on the processing area to manufacture the bump.
In one embodiment, the metal comprises copper.
In one embodiment, after the bump is fabricated, the subsequent circuit fabrication is completed to obtain a process of a conduction test module, including the steps of:
and etching an outer layer circuit on the outer layer, and manufacturing a solder mask on the outer layer circuit.
In one embodiment, the method further comprises the following steps:
and gold is plated on the bumps.
In one embodiment, the protrusions have a height of 3-5 mils and a diameter of 4-8 mils.
In one embodiment, the dry film has a thickness of 3-4 mils.
A conduction testing module is manufactured by adopting the manufacturing method of the conduction testing module in any embodiment.
According to the conduction test module, after the basic plate layer of the test module is manufactured, the machining area is determined on the basic plate layer, the bulge is manufactured in the machining area, and finally after the bulge is manufactured, the subsequent circuit manufacturing is completed, so that the conduction test module is obtained. The bulge is used for correspondingly fixing the welding pad of the PCB to be tested. Based on this, through the pad of the fixed PCB board that awaits measuring of arch, be favorable to the test of the various PCB boards of adaptation, avoid breaking and touch isotructure problem, improve the convenience and the accuracy of electric conduction test.
Drawings
FIG. 1 is a flowchart illustrating a method for fabricating a conduction test module according to an embodiment;
fig. 2 is a flowchart illustrating a method for manufacturing a conduction test module according to another embodiment.
Detailed Description
For better understanding of the objects, technical solutions and effects of the present invention, the present invention will be further explained with reference to the accompanying drawings and examples. Meanwhile, the following described examples are only for explaining the present invention, and are not intended to limit the present invention.
The embodiment of the invention provides a manufacturing method of a conduction testing module.
Fig. 1 is a flowchart illustrating a method for manufacturing a conduction test module according to an embodiment, and as shown in fig. 1, the method for manufacturing a conduction test module according to an embodiment includes steps S100 to S103:
s100, manufacturing a basic board layer of the test module;
s101, determining a processing area on the basic slab layer;
s102, manufacturing a bulge in the processing area; the bulges are used for correspondingly fixing the welding pads of the PCB to be tested;
s103, after the bulge is manufactured, the subsequent circuit manufacturing is finished, and the conduction testing module is obtained.
Wherein, the basic slab layer is manufactured by selecting a slab and cutting the slab. The manufactured basic board layer is provided with a circuit for conducting the foundation. The basic board layer comprises a single-layer board, a double-layer board or a multi-layer board, and the corresponding type of basic board layer is manufactured according to the requirement of the electrical conduction test.
In one embodiment, fig. 2 is a flowchart of a method for manufacturing a conduction test module according to another embodiment, and as shown in fig. 2, the process of manufacturing the base board layer of the test module in step S100 includes steps S200 to S203:
s200, manufacturing an inner layer circuit to obtain an inner layer;
s201, pressing an outer layer to obtain a multilayer board based on the inner layer;
s202, drilling to communicate the inner layer and the outer layer;
s203, electroplating holes communicating the inner layer and the outer layer to communicate the electrical properties of the inner layer and the outer layer.
Wherein, the inner layer is determined and the inner layer circuit is manufactured in the inner layer through the manufacture of the plate layer after cutting. And pressing the inner layer, and pressing the multiple material layers to form a multilayer structure to obtain the multilayer board. Further, the inner layer and the outer layer are communicated by drilling the multilayer board. And communicating the inner layer and the outer layer through electroplating to conduct the electrical properties of the inner layer and the outer layer.
In one embodiment, the electrical properties of the inner layer and the outer layer are conducted by electroplating a conductive metal. Wherein the conductive metal comprises copper or silver. As a preferred embodiment, the holes are plated by PTH (plated through hole) plating to ensure stability of electrical communication.
In one embodiment, as shown in fig. 2, the process of determining the machining area on the base ply in step S101 includes step S300:
and S300, windowing the basic board layer by using the dry film, and taking a windowing region as a processing region.
Wherein, the windowing forms a window as a processing area. As a preferred embodiment, the outer layer of dry film is formed by laminating multiple layers of dry films to form a dry film having a thickness of 3-4 mils, preferably 3.2 mils.
The manufacturing mode of the bulge comprises welding or electroplating and the like, and the bulge is manufactured in the processing area and used for correspondingly fixing the welding pad of the PCB to be tested. For example, when the conduction test module is used, the conductive adhesive is covered on the conduction test module, and the protrusion is used for propping the conductive adhesive to be in contact with a PAD of a PCB for conduction, so that the electrical conduction performance test is completed.
In one embodiment, as shown in fig. 2, the process of making the protrusion on the processing region in step S102 includes step S400:
s400, electroplating metal on the processing area to manufacture the bump.
The metal includes a conductive metal such as silver or copper, and copper is preferable.
As a preferred embodiment, the metal is electroplated on the processing area through the current density of 1.5ASF, and the electroplating time is 8-10 hours, so that the stability of the bump is ensured. Taking 8 hours of electroplating as an example, at 1, 2, 3 and 4 hours of the electroplating process, every 1 hour, a plated plate is taken out from a plating tank, and is observed by magnifying the plated plate to 20-50 times by a metallographic CCD (charge coupled device), and the thickness and height of the copper-plated bump are checked to have no deviation.
In one embodiment, the protrusions have a height of 3-5 mils and a diameter of 4-8 mils.
In one embodiment, as shown in fig. 2, after the bump is fabricated in step S103, the subsequent circuit fabrication is completed to obtain a conduction test module, which includes step S500:
and S500, etching an outer layer circuit on the outer layer, and manufacturing a solder mask on the outer layer circuit.
Wherein the short-circuit function is performed through the solder resist layer.
In one embodiment, as shown in fig. 2, the method for manufacturing a conduction testing module according to another embodiment further includes step S600:
s600, gold is plated on the bumps.
A protective layer is formed on the bumps by gold melting, so that the durability and stability of the bumps are improved.
In the method for manufacturing the conduction testing module according to any of the embodiments, after the base plate layer of the testing module is manufactured, the processing area is determined on the base plate layer, the bump is manufactured in the processing area, and finally, after the bump is manufactured, the subsequent circuit manufacturing is completed, so that the conduction testing module is obtained. The bulge is used for correspondingly fixing the welding pad of the PCB to be tested. Based on this, fix the pad of the PCB board that awaits measuring through the arch, be favorable to the test of the various PCB boards of adaptation, avoid breaking and touch isotructure problem, improve the convenience and the accuracy of electric conduction test.
Meanwhile, practical test shows that the conduction test module of any one of the embodiments has good applicability, convenient test and stable effect in the high interconnection, high test arrangement density and small BGA (Ball Grid Array) diameter PCB.
The embodiment of the invention also provides a conduction test module which is manufactured by adopting the manufacturing method of the conduction test module in any one of the embodiments.
According to the conduction test module, after the basic plate layer of the test module is manufactured, the machining area is determined on the basic plate layer, the bulge is manufactured in the machining area, and finally after the bulge is manufactured, the subsequent circuit manufacturing is completed, so that the conduction test module is obtained. The bulge is used for correspondingly fixing the welding pad of the PCB to be tested. Based on this, through the pad of the fixed PCB board that awaits measuring of arch, be favorable to the test of the various PCB boards of adaptation, avoid breaking and touch isotructure problem, improve the convenience and the accuracy of electric conduction test.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of a conduction testing module is characterized by comprising the following steps:
manufacturing a base plate layer of the test module;
determining a machining area on the base plate layer;
manufacturing a bulge in the processing area; the bulges are used for correspondingly fixing the welding pads of the PCB to be tested;
and after the bulge is manufactured, the subsequent circuit manufacturing is finished to obtain the conduction testing module.
2. The method for manufacturing the conduction testing module according to claim 1, wherein the step of manufacturing the base board layer of the testing module comprises the steps of:
manufacturing an inner layer circuit to obtain an inner layer;
pressing the outer layer based on the inner layer to obtain a multilayer board;
drilling to communicate the inner layer and the outer layer;
and electroplating holes communicating the inner layer and the outer layer to conduct the electrical properties of the inner layer and the outer layer.
3. The method for manufacturing a conduction testing module according to claim 1, wherein the step of determining the processing area on the base board layer comprises the steps of:
and windowing the basic board layer by using the dry film, and taking a windowing region as a processing region.
4. The method for manufacturing a conduction testing module according to claim 1, wherein the step of manufacturing bumps in the processing region comprises the steps of:
and electroplating metal on the processing area to manufacture the bump.
5. The method as claimed in claim 4, wherein the metal comprises copper.
6. The method for manufacturing a conduction testing module according to claim 2, wherein the step of completing the subsequent circuit manufacturing after completing the bump manufacturing to obtain the conduction testing module comprises the steps of:
and etching an outer layer circuit on the outer layer, and manufacturing a solder mask on the outer layer circuit.
7. The method for manufacturing a conduction testing module according to claim 1, further comprising the steps of:
and gold is plated on the bumps.
8. The method as claimed in claim 1, wherein the bumps have a height of 3-5mil and a diameter of 4-8mil.
9. The method according to claim 3, wherein the thickness of the dry film is 3-4mil.
10. A conduction test module manufactured by the method of any one of claims 1 to 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211262284 | 2022-10-14 | ||
| CN2022112622842 | 2022-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115980415A true CN115980415A (en) | 2023-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211627273.XA Pending CN115980415A (en) | 2022-10-14 | 2022-12-16 | Manufacturing method of conduction test module and conduction test module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115980415A (en) |
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2022
- 2022-12-16 CN CN202211627273.XA patent/CN115980415A/en active Pending
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