CN115976434B - Carbon tungsten copper composite material, preparation method and application thereof, and electrode - Google Patents
Carbon tungsten copper composite material, preparation method and application thereof, and electrode Download PDFInfo
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- CN115976434B CN115976434B CN202211731509.4A CN202211731509A CN115976434B CN 115976434 B CN115976434 B CN 115976434B CN 202211731509 A CN202211731509 A CN 202211731509A CN 115976434 B CN115976434 B CN 115976434B
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- 239000002131 composite material Substances 0.000 title claims abstract description 79
- QMTOMZUNTQQMCN-UHFFFAOYSA-N [Cu].[C].[W] Chemical compound [Cu].[C].[W] QMTOMZUNTQQMCN-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 75
- 239000004917 carbon fiber Substances 0.000 claims abstract description 75
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000002002 slurry Substances 0.000 claims abstract description 51
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- MEOSMFUUJVIIKB-UHFFFAOYSA-N [W].[C] Chemical compound [W].[C] MEOSMFUUJVIIKB-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000654 additive Substances 0.000 claims abstract description 29
- 230000000996 additive effect Effects 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 11
- 239000005011 phenolic resin Substances 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims description 10
- 239000011733 molybdenum Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 235000021355 Stearic acid Nutrition 0.000 claims description 8
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 8
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 8
- 239000008117 stearic acid Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000012466 permeate Substances 0.000 claims 1
- 238000005470 impregnation Methods 0.000 abstract description 5
- 239000000843 powder Substances 0.000 description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229910052721 tungsten Inorganic materials 0.000 description 9
- 239000010937 tungsten Substances 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 238000009941 weaving Methods 0.000 description 6
- 238000000748 compression moulding Methods 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- 238000005087 graphitization Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The application relates to a carbon tungsten copper composite material, a preparation method and application thereof, and an electrode, wherein the preparation method of the carbon tungsten copper composite material comprises the following steps: mixing tungsten powder, an additive and an adhesive (70-90 wt% (8-20 wt% (0-5 wt)) with a solvent to obtain a first slurry; placing the carbon fiber preform into the first slurry for impregnation to obtain second slurry; drying the second slurry and then pressing to obtain a carbon tungsten green body; and placing the copper green body above the carbon tungsten green body, and sintering to enable the copper green body to be melted and infiltrate into the carbon tungsten green body, so as to obtain the carbon tungsten copper composite material. The carbon tungsten copper composite material prepared by the preparation method of the carbon tungsten copper composite material has good heat conduction performance and electric conduction performance and high strength.
Description
Technical Field
The application relates to the technical field of materials, in particular to a carbon tungsten copper composite material, a preparation method and application thereof, and an electrode.
Background
As microelectronic chip technology advances from device level to system level, ever increasing demands are placed on the purity, integrity, uniformity, and accuracy of processing geometry of semiconductor wafers, and the geometry of chips is increasing while IC chip feature sizes continue to shrink. To reduce peripheral losses to reduce costs, silicon wafers should be grown to large diameters.
The Czochralski method (CZ method for short) is a common method for preparing semiconductor silicon, and comprises the steps of loading a polycrystalline silicon lump material and an additive element into a quartz crucible, placing the quartz crucible into the crucible and rotating the quartz crucible along with a shaft, introducing Ar gas under a reduced pressure condition, heating by a heater to melt the polycrystalline silicon lump material, and simultaneously rotating a thin rod-shaped seed crystal from the top of the furnace in a direction opposite to the rotation direction of the crucible to touch the liquid level of the polycrystalline silicon; while slowly pulling up the seed crystal, single crystal silicon is also grown. The single crystal thermal field equipment is equipment for producing single crystal silicon materials and comprises a compression ring, a heat shield, an upper heat shield, a middle heat shield, a lower heat shield, a (three-petal) graphite crucible, a crucible supporting rod, a crucible tray, an electrode, a heater, a flow guide pipe and a graphite bolt. As silicon wafers move to larger diameters, the size of single crystal thermal field devices is increasing, as are the electrode sizes that match them.
The electrode material of the traditional single crystal thermal field device is mainly graphite material or carbon-carbon composite material. However, the traditional graphite electrode has lower strength, larger brittleness and easy damage; the carbon-carbon electrode has higher resistivity, lower strength and lower heat conductivity coefficient, and cannot meet the requirement of a large-size thermal field.
Therefore, the preparation method of the carbon tungsten copper composite material with good heat conduction performance and electric conduction performance and high strength has important significance.
Disclosure of Invention
Based on the carbon tungsten copper composite material, the preparation method and the application thereof, and the electrode are provided.
The technical scheme for solving the technical problems is as follows.
The preparation method of the carbon tungsten copper composite material comprises the following steps:
Mixing tungsten powder, an additive, an adhesive and a solvent to obtain first slurry; the mass ratio of the tungsten powder to the additive to the adhesive is (70-90): (10-20): (0-5);
immersing the carbon fiber preform in the first slurry to obtain a second slurry;
drying the second slurry and then pressing to obtain a carbon tungsten green body;
And placing the copper green body above the carbon tungsten green body, and sintering to enable the copper green body to be melted and infiltrate into the carbon tungsten green body, so as to obtain the carbon tungsten copper composite material.
In some of these embodiments, the additive is selected from at least one of nickel, phenolic resin, and molybdenum.
In some embodiments, the binder is selected from at least one of stearic acid, polypropylene, and paraffin wax.
In some embodiments, in the method for preparing the carbon-tungsten-copper composite material, the mass of the carbon fiber preform accounts for 20% -35% of the mass of the carbon-tungsten-copper composite material.
In some embodiments, the copper green body accounts for 20% -35% of the carbon tungsten copper composite material in the preparation method of the carbon tungsten copper composite material.
In some embodiments, the particle size of the tungsten powder is 20-50 μm in the preparation method of the carbon tungsten copper composite material.
In some of these embodiments, the sintering step is performed under hydrogen conditions at a temperature of 1400 ℃ to 2000 ℃ for a time of 10 hours to 20 hours.
Further, the application provides a carbon tungsten copper composite material, which is prepared by adopting the preparation method of the carbon tungsten copper composite material.
Further, the application provides application of the carbon tungsten copper composite material in preparing an electrode.
Further, the application provides an electrode which comprises the carbon tungsten copper composite material.
Compared with the prior art, the preparation method of the carbon tungsten copper composite material has the following beneficial effects:
The preparation method of the carbon tungsten copper composite material comprises the steps of placing a carbon fiber preform in first slurry containing tungsten powder, an additive and an adhesive for impregnation, drying and pressing obtained second slurry containing the carbon fiber preform and the first slurry to obtain a carbon tungsten green body; placing the copper green body above the carbon tungsten green body, and sintering; the carbon fiber preform is sintered under the wrapping of tungsten and copper to form a material framework, so that the toughness, the heat conductivity, the electric conductivity and the ablation resistance of the carbon-tungsten-copper composite material are effectively improved; because the copper green body is arranged above the carbon tungsten green body, liquid copper is formed in the copper green body to infiltrate into the carbon tungsten green body in the sintering process, part of tungsten element and irregular carbon element on the carbon fiber are compounded to form tungsten carbide, and the other part of tungsten element which does not form tungsten carbide is compounded with copper to form tungsten-copper alloy, so that the conductivity of the carbon tungsten-copper composite material is further improved, and the bending strength, chemical stability, wear resistance and thermal shock resistance of the carbon tungsten-copper composite material are effectively improved.
Detailed Description
The technical scheme of the application is further described in detail below with reference to specific embodiments. The present application may be embodied in many different forms and is not limited to the embodiments described herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The weights of the relevant components mentioned in the description of the embodiments of the present application may refer not only to the specific contents of the components, but also to the proportional relationship between the weights of the components, so long as the contents of the relevant components in the description of the embodiments of the present application are scaled up or down within the scope of the disclosure of the embodiments of the present application. Specifically, the weight described in the specification of the embodiment of the application can be mass units known in the chemical industry field such as mu g, mg, g, kg.
An embodiment of the application provides a preparation method of a carbon tungsten copper composite material, which comprises the following steps of S10-S40:
Step S10: mixing tungsten powder, an additive, an adhesive and a solvent to obtain first slurry; wherein the mass ratio of the tungsten powder to the additive to the adhesive is (70-90)/(10-20)/(0-5).
It is understood that when the mass part of the tungsten powder is 70 to 90 parts, the mass part of the additive may be 10 to 20 parts, and the mass part of the adhesive may be 0.5 to 5 parts; it is further understood that the mass parts of tungsten powder include, but are not limited to, 70 parts, 72 parts, 74 parts, 75 parts, 76 parts, 78 parts, 80 parts, 82 parts, 84 parts, 85 parts, 86 parts, 88 parts, 90 parts; the mass parts of the additive include, but are not limited to, 10 parts, 12 parts, 14 parts, 15 parts, 16 parts, 18 parts, 20 parts; the mass parts of the adhesive include, but are not limited to, 0 part, 0.5 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts; it is also understood that the mass ratio of tungsten powder, additive to binder includes, but is not limited to, 70:10:0.5, 72:14:1, 80:15:5, 85:13:2, 90:8:2.
In some examples, in step S10, the mass ratio of tungsten powder, additive and adhesive is (80-90): 8-15): 2-5.
In some examples, in step S10, the additive is selected from at least one of nickel, phenolic resin, and molybdenum.
Wherein, nickel and molybdenum elements are uniformly distributed in the carbon tungsten copper composite material to form element crystals which are regularly arranged, thereby further improving the mechanical strength of the carbon tungsten copper composite material; the carbon element in the phenolic resin can be combined with the carbon element in the carbon fiber or react with the tungsten element to generate tungsten carbide, and the rest elements on the phenolic resin can be left in the material, so that the compactness of the carbon-tungsten-copper composite material can be further improved, and the performance of the carbon-tungsten-copper composite material is enhanced.
Further, the additive is selected from the group consisting of nickel, phenolic resin and molybdenum.
In some examples, in step S10, the binder is selected from at least one of stearic acid, polypropylene, and paraffin wax.
It can be understood that the bonding agent enables the carbon tungsten green body formed in the pressing step to be bonded more firmly, so that the mechanical strength of the carbon tungsten copper composite material is further improved; and the binder reacts with hydrogen to release heat during the sintering step.
In some examples, in step S10, the solvent is water.
Further, the solvent is deionized water.
In some examples, in step S10, the particle size of the tungsten powder is 20 μm to 50 μm.
It is understood that the particle size of tungsten powder includes, but is not limited to, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 45 μm, 50 μm.
Step S20: and (3) placing the carbon fiber preform into the first slurry for impregnation to obtain a second slurry.
It is understood that the second slurry is a mixed slurry obtained by immersing the carbon fiber preform in the first slurry, and includes the immersed carbon fiber preform and the remaining first slurry; it is further understood that after the carbon fiber preform is impregnated with the first slurry, a portion of the first slurry may be filled in the pores of the carbon fiber preform.
In some of these examples, in step S20, the impregnation is performed under vacuum.
It will be appreciated that impregnation under vacuum conditions allows the pores in the carbon fibre preform to be maximally filled with the slurry.
In some of these examples, in step S20, a carbon fiber preform is prepared by 2D braiding and needling.
It can be appreciated that the carbon fiber preform has a good degree of bulk.
Step S30: and drying the second slurry and pressing to obtain the carbon tungsten green compact.
It will be appreciated that after the second slurry is dried, the tungsten powder, additives and binder in the second slurry will form a powder, one part of which fills the voids of the carbon fiber preform, and the other part of which forms the powder alone; and simultaneously pressing the carbon fiber preform filled with the powder and the separately formed powder to obtain a carbon tungsten green body.
In some examples, in step S30, the drying temperature is 100-120 ℃ and the drying time is 6-10 h.
In some of these examples, the pressing pressure is 1T to 5T in step S30.
It is understood that the pressing pressures include, but are not limited to, 1T, 2T, 3T, 4T, 5T.
Step S40: and placing the copper green body above the carbon tungsten green body, and sintering to enable the copper green body to be melted and infiltrate into the carbon tungsten green body, so as to obtain the carbon tungsten copper composite material.
In some of these examples, in step S40, the sintering step is performed under hydrogen.
In some of these examples, in step S40, the sintering temperature is 1400 ℃ to 2000 ℃.
It is understood that the sintering temperature includes, but is not limited to 1400 ℃, 1500 ℃, 1600 ℃, 1700 ℃, 1800 ℃, 1820 ℃, 1850 ℃, 1880 ℃, 1900 ℃, 1920 ℃, 1950 ℃, 1980 ℃, 2000 ℃.
In some examples, in step S40, the sintering time is 10h to 20h.
It is understood that the sintering time includes, but is not limited to, 10h, 10.5h, 11h, 12h, 14h, 15h, 16h, 18h, 19h, 20h.
Furthermore, argon is introduced into the cooling section of the induction furnace, so that the oxidation of the carbon tungsten green body is avoided.
In some examples, in step S40, the method of preparing a copper green body includes the steps of:
the copper powder is pressed.
In some examples, the copper green body is prepared by a process in which the copper powder has a particle size of 30 μm to 100 μm.
It is understood that the particle size of the copper powder includes, but is not limited to, 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 45 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm.
In some of these examples, the copper green body is prepared by pressing at a pressure of 1T to 5T.
It is understood that the pressing pressures include, but are not limited to, 1T, 2T, 3T, 4T, 5T.
In some examples, the carbon-tungsten-copper composite material comprises 20% -35% of the carbon-tungsten-copper composite material by mass of the carbon fiber preform.
In some examples, the copper green body comprises 20% -35% of the carbon tungsten copper composite material by mass.
It is understood that the mass of the carbon fiber preform comprises, but is not limited to, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 31.37%, 31.5%, 31.7%, 31.8%, 32%, 32.37%, 33%, 34%, 35% of the mass of the carbon tungsten copper composite; the mass of the copper green body comprises, but is not limited to, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31.37%, 31.5%, 31.7%, 31.8%, 32%, 32.37%, 33%, 34%, 35% of the mass of the carbon tungsten copper composite. It is further understood that the mass of the carbon tungsten copper composite includes the total mass of the carbon fiber preform, tungsten powder, additives, and copper green body.
The preparation method of the carbon tungsten copper composite material comprises the steps of immersing a carbon fiber preform in slurry containing tungsten powder, an additive and an adhesive, drying the obtained second slurry containing the carbon fiber preform and the first slurry, and pressing the dried second slurry to obtain a carbon tungsten green body; placing the copper green body above the carbon tungsten green body, and sintering; the carbon fiber preform is sintered under the wrapping of tungsten and copper to form a material framework, so that the toughness, the heat conductivity, the electric conductivity and the ablation resistance of the carbon-tungsten-copper composite material are effectively improved; because the copper green body is arranged above the carbon tungsten green body, liquid copper is formed in the copper green body to infiltrate into the carbon tungsten green body in the sintering process, part of tungsten element and irregular carbon element on the carbon fiber are compounded to form tungsten carbide, and the other part of tungsten element which does not form tungsten carbide is compounded with copper to form tungsten-copper alloy, so that the conductivity of the carbon tungsten-copper composite material is further improved, and the bending strength, chemical stability, wear resistance and thermal shock resistance of the carbon tungsten-copper composite material are effectively improved.
The application provides a carbon tungsten copper composite material, which is prepared by adopting the preparation method of the carbon tungsten copper composite material.
The application provides an application of the carbon tungsten copper composite material in preparing an electrode. In another embodiment of the present application, an electrode is provided, which comprises the carbon-tungsten-copper composite material.
The carbon tungsten copper composite material is used for preparing electrodes, and can endow the electrodes with good heat conduction performance and electric conduction performance and high strength.
In some embodiments, the electrode may be made of the above-mentioned carbon tungsten copper composite material, i.e. the electrode is directly prepared from the above-mentioned carbon tungsten copper composite material. In other embodiments, the electrode material may include other materials in addition to the carbon tungsten copper composite material described above.
An embodiment of the present application provides a heating device including a heater and the above-described electrode.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
The following examples of the carbon-tungsten-copper composite material, the preparation method and the application thereof, and the electrode according to the present application, it is to be understood that the carbon-tungsten-copper composite material, the preparation method and the application thereof, and the electrode according to the present application are not limited to the following examples.
Example 1
(1) Preparing a carbon fiber preform by 2D weaving and needling;
(2) Mixing tungsten powder, an additive (nickel, phenolic resin and molybdenum in a mass ratio of 1:1:1) and adhesive stearic acid with deionized water in a mass ratio of 90:8:2 to obtain slurry;
(3) Placing the carbon fiber preform into slurry according to the mass ratio of the carbon fiber preform to the tungsten powder of 1:1, soaking the carbon fiber preform in the slurry for 24 hours under vacuum, and drying the carbon fiber preform and the rest slurry at 100 ℃ for 8 hours at the same time until the moisture is removed; obtaining a first powder and a carbon fiber preform filled with a second powder;
(5) Simultaneously placing the first powder and the carbon fiber preform filled with the second powder into a mold, and performing compression molding under the pressure of 2T to obtain a carbon tungsten green body;
(6) According to the mass ratio of the carbon fiber preform to the copper powder being 1:1, pressing and forming the copper powder at 2T to obtain a copper green body;
(7) And placing the copper green body above the carbon tungsten green body, and sintering for 10 hours at 1800 ℃ under the hydrogen condition to obtain the carbon tungsten copper composite material.
In the carbon tungsten copper composite material prepared in example 1, the mass of the carbon fiber preform accounts for the percentage of the mass of the carbon tungsten copper composite material=the mass of the carbon fiber preform/(the mass of the tungsten powder+the mass of the additive+the mass of the carbon fiber preform+the mass of the copper powder) =90/(90+8+90+90) =32.37%;
The mass of the copper green body accounts for the percentage of the mass of the carbon tungsten copper composite material=the mass of the copper powder/(the mass of the tungsten powder+the mass of the additive+the mass of the carbon fiber preform+the mass of the copper powder) =90/(90+8+90+90) =32.37%.
Example 2
Substantially the same as in example 1, except that in step (2), the mass ratio of tungsten powder, additive and binder was 85:13:2.
The mass of the carbon fiber preform accounts for 31.7% of the mass of the carbon tungsten copper composite material, and the mass of the copper green compact accounts for 31.7% of the mass of the carbon tungsten copper composite material.
Example 3
Substantially the same as in example 1, except that in step (2), the mass ratio of tungsten powder, additive and binder was 80:15:5.
The mass of the carbon fiber preform accounts for 31.37% of the mass of the carbon tungsten copper composite material, and the mass of the copper green body accounts for 31.37% of the mass of the carbon tungsten copper composite material.
Example 4
Substantially the same as in example 1, except that the pressing pressure in step (6) was different, specifically as follows:
(1) Preparing a carbon fiber preform by 2D weaving and needling;
(2) Mixing tungsten powder, an additive (nickel, phenolic resin and molybdenum in a mass ratio of 1:1:1) and adhesive stearic acid with deionized water in a mass ratio of 90:8:2 to obtain slurry;
(3) Placing the carbon fiber preform into the slurry according to the mass ratio of the carbon fiber preform to the tungsten powder of 1:1, soaking the carbon fiber preform in the slurry for 24 hours under vacuum, and drying the carbon fiber preform and the rest of the slurry for 8 hours at the same time until the moisture is removed; obtaining a first powder and a carbon fiber preform filled with a second powder;
(5) Simultaneously placing the first powder and the carbon fiber preform filled with the second powder into a mold, and performing compression molding under 5T pressure to obtain a carbon tungsten green body;
(6) According to the mass ratio of the carbon fiber preform to the copper powder being 1:1, pressing and forming the copper powder at 5T to obtain a copper green body;
(7) And placing the copper green body above the carbon tungsten green body, and sintering for 10 hours at 1800 ℃ under the hydrogen condition to obtain the carbon tungsten copper composite material.
Example 5
Substantially the same as in example 1, except that in step (7), the sintering time was prolonged to 15 hours.
Example 6
Substantially the same as in example 1, except that in step (7), the sintering time was prolonged to 20 hours.
Comparative example 1
The carbon-carbon composite material is derived from Hunan Jin Bo carbon stock company, a carbon fiber preform is prepared by 2D weaving and needling of carbon fibers, and graphitization treatment and machining are performed after carbon deposition is performed on the carbon fiber preform by chemical vapor deposition.
Comparative example 2
Substantially the same as in example 1, except that the first powder was not added when the carbon-tungsten green compact was pressed in step (5), the following was concrete:
(1) Preparing a carbon fiber preform by 2D weaving and needling;
(2) Mixing tungsten powder, an additive (nickel, phenolic resin and molybdenum in a mass ratio of 1:1:1) and adhesive stearic acid with deionized water in a mass ratio of 90:8:2 to obtain slurry;
(3) Placing the carbon fiber preform into the slurry according to the mass ratio of the carbon fiber preform to the tungsten powder of 1:1, soaking the carbon fiber preform in the slurry for 24 hours under vacuum, and drying the carbon fiber preform and the rest of the slurry for 8 hours at the same time until the moisture is removed; obtaining a first powder and a carbon fiber preform filled with a second powder;
(5) Placing the carbon fiber preform filled with the second powder into a die, and performing compression molding under 2T pressure to obtain a carbon tungsten green body;
(6) According to the mass ratio of the carbon fiber preform to the copper powder being 1:1, pressing and forming the copper powder at 2T to obtain a copper green body;
(7) And placing the copper green body above the carbon tungsten green body, and sintering for 10 hours at 1800 ℃ under the hydrogen condition to obtain the carbon tungsten copper composite material.
Comparative example 3
(1) Preparing a carbon fiber preform by 2D weaving and needling;
(2) Mixing tungsten powder, additives (nickel, phenolic resin and molybdenum in a mass ratio of 1:1:1), bonding agent stearic acid and copper powder with deionized water according to a mass ratio of 90:8:2:90 to obtain slurry;
(3) Placing the carbon fiber preform into the slurry according to the mass ratio of the carbon fiber preform to the tungsten powder of 1:1, soaking the carbon fiber preform in the slurry for 24 hours under vacuum, and drying the carbon fiber preform and the rest of the slurry for 8 hours at the same time until the moisture is removed; obtaining a first powder and a carbon fiber preform filled with a second powder;
(5) Placing the carbon fiber preform filled with the second powder into a die, and performing compression molding under 2T pressure to obtain a carbon tungsten copper green body;
(6) And sintering the carbon tungsten copper green body for 10 hours at 1800 ℃ under the hydrogen condition to obtain the carbon tungsten copper composite material.
Comparative example 4
(1) Preparing a carbon fiber preform by 2D weaving and needling;
(2) Mixing copper powder, additives (nickel, phenolic resin and molybdenum in a mass ratio of 1:1:1) and adhesive stearic acid with deionized water in a mass ratio of 90:8:2 to obtain slurry;
(3) Placing the carbon fiber preform into the slurry according to the mass ratio of the carbon fiber preform to the tungsten powder of 1:1, soaking the carbon fiber preform in the slurry for 24 hours under vacuum, and drying the carbon fiber preform and the rest of the slurry for 8 hours at the same time until the moisture is removed; obtaining a first powder and a carbon fiber preform filled with a second powder;
(5) Simultaneously placing the first powder and the carbon fiber preform filled with the second powder into a mold, and performing compression molding under the pressure of 2T;
(6) According to the mass ratio of the carbon fiber preform to the tungsten powder being 1:1, pressing and forming the tungsten powder at 2T to obtain a tungsten green body;
(7) And placing the tungsten green body above the carbon copper green body, and sintering for 10 hours at 1800 ℃ under the hydrogen condition to obtain the carbon tungsten copper composite material.
In comparative example 4, copper powder and carbon fiber preform were difficult to form a green body during pressing, and tungsten powder was not melted and infiltrated into the green body during sintering.
The composites prepared in each example and comparative example were subjected to performance testing as follows: the density JB/T6646-2007, bending strength JB/T6646-2007, resistivity JB/T6646-2007, high temperature coefficient of thermal conductivity GB/T3651-2008 are shown in Table 1.
TABLE 1
As can be seen from table 1, compared with the comparative example, the carbon tungsten copper composite material prepared in the example has lower resistivity and higher thermal conductivity, which indicates that the carbon tungsten copper composite material prepared in the example has better conductivity and higher bending strength; and is significantly better than the electrical and thermal conductivity and strength of the conventional carbon-carbon electrode of comparative example 1.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which facilitate a specific and detailed understanding of the technical solutions of the present application, but are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. It should be understood that, based on the technical solutions provided by the present application, those skilled in the art may obtain technical solutions through logical analysis, reasoning or limited experiments, which are all within the scope of protection of the appended claims. The scope of the patent of the application should therefore be determined with reference to the appended claims, which are to be construed as in accordance with the doctrines of claim interpretation.
Claims (5)
1. The preparation method of the carbon tungsten copper composite material is characterized by comprising the following steps of:
Mixing tungsten powder, an additive, an adhesive and a solvent to obtain first slurry; the mass ratio of the tungsten powder to the additive to the adhesive is (80-90): (8-15): (2-5); the additive is at least one selected from nickel, phenolic resin and molybdenum; the adhesive is at least one selected from stearic acid, polypropylene and paraffin;
Immersing the carbon fiber preform in the first slurry to obtain a second slurry; the mass of the carbon fiber preform accounts for 20% -35% of the mass of the carbon tungsten copper composite material;
drying the second slurry and then pressing to obtain a carbon tungsten green body;
Placing a copper green body above the carbon tungsten green body, and sintering to enable the copper green body to be melted and permeate into the carbon tungsten green body to obtain a carbon tungsten copper composite material; the mass of the copper green compact accounts for 20% -35% of the mass of the carbon tungsten copper composite material; the sintering temperature is 1400-2000 ℃ and the sintering time is 10-20 hours.
2. The method for preparing a carbon-tungsten-copper composite material according to claim 1, wherein the particle size of the tungsten powder is 20 μm to 50 μm.
3. The carbon tungsten copper composite material is characterized by being prepared by adopting the preparation method of the carbon tungsten copper composite material according to any one of claims 1-2.
4. Use of a carbon tungsten copper composite material according to claim 3 for the preparation of an electrode.
5. An electrode comprising the carbon tungsten copper composite of claim 3.
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| CN1946655A (en) * | 2004-04-23 | 2007-04-11 | 丰田自动车株式会社 | Composite carbon material having metal carbide particles dispersed therein and method for preparation thereof |
| CN103981389A (en) * | 2014-05-15 | 2014-08-13 | 厦门理工学院 | Method for preparing tungsten-copper alloy by low-temperature sintering of tungsten skeleton |
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| CN1946655A (en) * | 2004-04-23 | 2007-04-11 | 丰田自动车株式会社 | Composite carbon material having metal carbide particles dispersed therein and method for preparation thereof |
| CN103981389A (en) * | 2014-05-15 | 2014-08-13 | 厦门理工学院 | Method for preparing tungsten-copper alloy by low-temperature sintering of tungsten skeleton |
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