CN115975323A - Organic carrier for conductive paste and preparation method thereof - Google Patents
Organic carrier for conductive paste and preparation method thereof Download PDFInfo
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- CN115975323A CN115975323A CN202211539659.5A CN202211539659A CN115975323A CN 115975323 A CN115975323 A CN 115975323A CN 202211539659 A CN202211539659 A CN 202211539659A CN 115975323 A CN115975323 A CN 115975323A
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000004094 surface-active agent Substances 0.000 claims abstract description 17
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims description 27
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 21
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 21
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 21
- 239000002270 dispersing agent Substances 0.000 claims description 18
- 239000003085 diluting agent Substances 0.000 claims description 12
- LHDWRKCOQQHAMP-UHFFFAOYSA-N n-butyl 3-hydroxybutyrate Natural products CCCCOC(=O)CC(C)O LHDWRKCOQQHAMP-UHFFFAOYSA-N 0.000 claims description 12
- 239000002562 thickening agent Substances 0.000 claims description 12
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 11
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 9
- 239000000194 fatty acid Substances 0.000 claims description 9
- 229930195729 fatty acid Natural products 0.000 claims description 9
- 150000004665 fatty acids Chemical class 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 7
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 7
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 claims description 7
- 229920001817 Agar Polymers 0.000 claims description 7
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 claims description 7
- 239000001856 Ethyl cellulose Substances 0.000 claims description 7
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 7
- 239000008272 agar Substances 0.000 claims description 7
- 235000010419 agar Nutrition 0.000 claims description 7
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 7
- 229920001249 ethyl cellulose Polymers 0.000 claims description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 7
- 239000000230 xanthan gum Substances 0.000 claims description 7
- 229920001285 xanthan gum Polymers 0.000 claims description 7
- 235000010493 xanthan gum Nutrition 0.000 claims description 7
- 229940082509 xanthan gum Drugs 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 229920000136 polysorbate Polymers 0.000 claims description 6
- 229950008882 polysorbate Drugs 0.000 claims description 6
- -1 alcohol ester Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 150000004668 long chain fatty acids Chemical class 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 2
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002907 Guar gum Polymers 0.000 claims description 2
- 229920000161 Locust bean gum Polymers 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 2
- 150000004676 glycans Chemical group 0.000 claims description 2
- 239000000665 guar gum Substances 0.000 claims description 2
- 235000010417 guar gum Nutrition 0.000 claims description 2
- 229960002154 guar gum Drugs 0.000 claims description 2
- 239000000711 locust bean gum Substances 0.000 claims description 2
- 235000010420 locust bean gum Nutrition 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920001282 polysaccharide Polymers 0.000 claims description 2
- 239000005017 polysaccharide Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 230000008719 thickening Effects 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 238000011049 filling Methods 0.000 description 4
- 150000002191 fatty alcohols Chemical class 0.000 description 2
- 235000019553 satiation Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Conductive Materials (AREA)
Abstract
The invention belongs to the field of solar cells, and discloses an organic carrier for conductive paste and a preparation method thereof. The organic carrier of the invention comprises: 80 to 90 weight percent of organic carrier A, 5 to 15 weight percent of organic carrier B, 0.01 to 3 weight percent of surfactant and 0.1 to 4 weight percent of thixotropic agent; the organic carrier A is a more oil-soluble organic carrier, and the organic carrier B is a more water-soluble organic carrier. The organic carrier is applied to the conductive slurry, so that the linear plumpness and the smoothness can be improved, the line resistance is reduced, and the efficiency is improved.
Description
Technical Field
The invention belongs to the field of solar cells, and relates to conductive paste for solar cells, in particular to an organic carrier for the conductive paste and a preparation method thereof.
Background
Solar energy is a green energy, and is more and more concerned by people due to the advantages of no pollution, inexhaustibility, no regional resource limitation and the like, so that the solar cell is applied. The solar cell is a semiconductor device which converts solar energy into electric energy, and the solar cell can generate current under the illumination condition, collect the electric energy through grid lines and electrodes and transmit the electric energy. The existing conductive slurry for the silicon-based solar cell mainly comprises conductive metal powder, glass powder and an organic carrier. Wherein the organic carrier plays a very important role in the printing performance of the paste and can influence the linear plumpness of the printed sintered paste.
The conventional organic carrier system is applied to conductive paste, and has the problems of line type collapse, more line edge scattering points and the like, and line type collapse and unevenness cause large line resistance and poor filling, so that short current is low, line resistance is large, filling is poor and efficiency is low. In view of the above problems, there is an urgent need for an organic vehicle for conductive paste that improves linear satiation.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an organic carrier for conductive paste and a preparation method thereof, wherein the organic carrier can improve the linear satiation property.
In order to realize the purpose of the invention, the invention adopts the following technical scheme:
an organic vehicle for electroconductive paste, comprising: 80 to 90 weight percent of organic carrier A, 5 to 15 weight percent of organic carrier B, 0.01 to 3 weight percent of surfactant and 0.1 to 4 weight percent of thixotropic agent; the organic carrier A is a more oil-soluble organic carrier, and the organic carrier B is a more water-soluble organic carrier.
In some embodiments, the organic vehicle a comprises the following components: 1 to 20 weight percent of thickening agent A, 80 to 95 weight percent of diluting agent A and 0.1 to 5 weight percent of dispersing agent A.
Wherein the thickener A is a thickening and oiliness-biasing thermoplastic polymer substance.
In some embodiments, the thickener a is selected from at least one of polyvinyl butyral, ethyl cellulose, acrylic resin, cellulose acetate butyrate ester resin.
Preferably, the diluent A is selected from at least one of alcohol ethers, alcohol esters or esters.
In some embodiments, the diluent a is selected from at least one of butyl carbitol, diethylene glycol butyl ether acetate, DBE, diethylene glycol dibutyl ether, butyl 3-hydroxybutyrate, dimethyl adipate, dibutyl sebacate, dioctyl phthalate.
In some embodiments, the dispersant a is at least one of a long chain fatty acid, a fatty alcohol polyoxyethylene ether, a polyether fatty acid.
In the organic vehicle for conductive paste of the present invention, the organic vehicle B includes the following components: 1 to 15 weight percent of thickening agent B, 80 to 98 weight percent of diluting agent B and 0.1 to 5 weight percent of dispersing agent B.
Wherein the thickener B is a polysaccharide polymer with hydrophilicity.
Further, in some embodiments, the thickener B is selected from at least one of xanthan gum, agar, locust bean gum, guar gum.
The diluent B in the organic carrier B is selected from polyalcohol substances.
Further, in some embodiments, the diluent B is selected from at least one of glycerol, propylene glycol, ethylene glycol, diethylene glycol.
In the organic carrier for the conductive paste, the dispersant B is at least one of long-chain fatty acid, fatty alcohol-polyoxyethylene ether and polyether fatty acid.
Further, in the organic vehicle for conductive paste according to the present invention, the surfactant is an organic surfactant having an amphoteric group.
In some embodiments, the surfactant is selected from polysorbate or fatty alcohol polyoxyethylene ether organic surfactants.
Furthermore, in the organic vehicle for conductive paste, the thixotropic agent is polyamide wax and/or polyethylene wax powder, and the melting point is more than 100 ℃.
The invention also provides a preparation method of the organic carrier for the conductive paste, which comprises the steps of dispersing and uniformly mixing the organic carrier A and the organic carrier B through a surfactant, adding a thixotropic agent, and heating, shearing and activating at a high speed to obtain the organic carrier.
Further, in the preparation method, the heating temperature is 50-80 ℃.
Further, the stirring speed of the high-speed shearing activation in the preparation method is 1500-3000r/min.
The invention also provides conductive paste which contains 5-15 wt% of the organic carrier for the conductive paste.
Furthermore, the conductive paste also comprises 3-10 wt% of glass powder and 80-90 wt% of conductive powder.
The organic carrier, the glass powder and the conductive powder are stirred and then uniformly mixed by a three-roll mill to form the conductive paste, and the printed and sintered conductive paste has a full and flat line shape, so that the filling efficiency can be improved.
According to the technical scheme, the invention provides the organic carrier for the conductive paste and the preparation method thereof. The organic carrier of the invention comprises: 80 to 90 weight percent of organic carrier A, 5 to 15 weight percent of organic carrier B, 0.01 to 3 weight percent of surfactant and 0.1 to 4 weight percent of thixotropic agent; the organic carrier A is a more oil-soluble organic carrier, and the organic carrier B is a more water-soluble organic carrier. The organic carrier is applied to the conductive slurry, so that the linear plumpness and the smoothness can be improved, the line resistance is reduced, and the efficiency is improved.
Detailed Description
The organic carrier for the conductive slurry is divided into an organic carrier A and an organic carrier B, the organic carrier A is used as a main carrier, the organic carrier B is used as an auxiliary carrier, and the organic carrier A with partial oil solubility and the organic carrier B with partial water solubility are uniformly mixed through a surfactant. The mixed system is applied to conductive paste, a capillary network structure of liquid bridges can be formed among particles, the yield stress of the paste is increased, the printed line type has excellent fullness and smoothness, the line resistance can be reduced, the filling is improved, and the efficiency is improved. And the organic carrier B has stronger viscous force, and the addition of a small amount of the organic carrier B can obviously improve the scattered points at the line edge after the printing and sintering of the slurry.
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below, and it should be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
The following detailed description of the disclosed embodiments. The percentages are by weight unless otherwise specified.
Example 1:
as an example of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 90% of organic carrier A, 5% of organic carrier B, 4% of polyamide wax as thixotropic agent and 1% of polysorbate as surfactant. Wherein the organic carrier A consists of 40 percent of butyl carbitol, 16 percent of diethylene glycol butyl ether acetate, 12 percent of dimethyl adipate, 10 percent of diethylene glycol dibutyl ether, 10 percent of 3-hydroxybutyric acid butyl ester, 3 percent of ethyl cellulose, 8 percent of polyvinyl butyral and 1 percent of polyether fatty acid dispersant; the organic carrier B consists of 45% of glycerol, 25% of propylene glycol, 20% of diethylene glycol, 7% of xanthan gum, 2% of agar and 1% of fatty alcohol-polyoxyethylene ether dispersing agent.
As an embodiment of the fine gate silver paste of the present invention, the fine gate silver paste comprises the following components in percentage by weight: 9 percent of organic carrier, 4 percent of glass powder and 87 percent of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Example 2:
as an embodiment of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 90% of organic carrier A, 5% of organic carrier B, 4% of polyamide wax as thixotropic agent and 1% of polysorbate as surfactant. Wherein the organic carrier A consists of 38 percent of butyl carbitol, 14 percent of diethylene glycol butyl ether acetate, 10 percent of dimethyl adipate, 8 percent of diethylene glycol dibutyl ether, 9 percent of 3-hydroxybutyric acid butyl ester, 3 percent of ethyl cellulose, 17 percent of polyvinyl butyral and 1 percent of polyether fatty acid dispersant; the organic carrier B consists of 45% of glycerol, 25% of propylene glycol, 20% of diethylene glycol, 7% of xanthan gum, 2% of agar and 1% of fatty alcohol-polyoxyethylene ether dispersing agent.
As an embodiment of the fine grid silver paste of the present invention, the fine grid silver paste comprises the following components in percentage by weight: 9% of organic carrier, 4% of glass powder and 87% of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Example 3:
as an embodiment of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 90% of organic carrier A, 5% of organic carrier B, 4% of polyamide wax as thixotropic agent and 1% of polysorbate as surfactant. Wherein the organic carrier A consists of 42 percent of butyl carbitol, 18 percent of diethylene glycol butyl ether acetate, 14 percent of dimethyl adipate, 12 percent of diethylene glycol dibutyl ether, 12 percent of 3-hydroxybutyric acid butyl ester, 0.5 percent of ethyl cellulose, 0.5 percent of polyvinyl butyral and 1 percent of polyether fatty acid dispersing agent; the organic carrier B consists of 45% of glycerol, 25% of propylene glycol, 20% of diethylene glycol, 7% of xanthan gum, 2% of agar and 1% of fatty alcohol-polyoxyethylene ether dispersing agent.
As an embodiment of the fine grid silver paste of the present invention, the fine grid silver paste comprises the following components in percentage by weight: 9 percent of organic carrier, 4 percent of glass powder and 87 percent of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Example 4:
as an example of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 80% of organic carrier A, 15% of organic carrier B, 4% of polyamide wax as a thixotropic agent and 1% of polysorbate as a surfactant. Wherein the organic carrier A consists of 40 percent of butyl carbitol, 16 percent of diethylene glycol butyl ether acetate, 12 percent of dimethyl adipate, 10 percent of diethylene glycol dibutyl ether, 10 percent of 3-hydroxybutyric acid butyl ester, 3 percent of ethyl cellulose, 8 percent of polyvinyl butyral and 1 percent of polyether fatty acid dispersant; the organic carrier B consists of 45% of glycerol, 25% of propylene glycol, 20% of diethylene glycol, 7% of xanthan gum, 2% of agar and 1% of fatty alcohol-polyoxyethylene ether dispersing agent.
As an embodiment of the fine gate silver paste of the present invention, the fine gate silver paste comprises the following components in percentage by weight: 9 percent of organic carrier, 4 percent of glass powder and 87 percent of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Comparative example 1:
as an example of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 40% of butyl carbitol, 14% of diethylene glycol butyl ether acetate, 10% of dimethyl adipate, 10% of diethylene glycol dibutyl ether, 10% of butyl 3-hydroxybutyrate, 3% of ethyl cellulose, 8% of polyvinyl butyral, 1% of polyether fatty acid dispersant and 4% of polyamide wax thixotropic agent.
As an embodiment of the fine gate silver paste of the present invention, the fine gate silver paste comprises the following components in percentage by weight: 9 percent of organic carrier, 4 percent of glass powder and 87 percent of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Comparative example 2:
as an embodiment of the organic vehicle of the present invention, the organic vehicle comprises the following components in percentage by weight: 44% of glycerol, 24% of propylene glycol, 18% of diethylene glycol, 7% of xanthan gum, 2% of agar, 1% of fatty alcohol-polyoxyethylene ether dispersing agent and 4% of polyamide wax thixotropic agent.
As an embodiment of the fine gate silver paste of the present invention, the fine gate silver paste comprises the following components in percentage by weight: 9 percent of organic carrier, 4 percent of glass powder and 87 percent of conductive powder, wherein the conductive powder is silver powder with the particle size D50 of 2.5 mu m.
Experimental example:
the fine gate silver pastes prepared in examples 1 to 4 and comparative examples 1 to 2 were tested, and the results are shown in table 1. Wherein, the yield stress is determined by an Anton Paar rheometer by adopting an amplitude scanning test method; measuring the line width by using a 3D tester; measuring the line resistance by using a multimeter; fill factor and efficiency were measured using an IV tester.
TABLE 1 data of the test experiments of the examples and comparative examples
| Experimental group | Yield stress/Pa | Line width/mum | Line resistance/omega | Fill factor/% | Efficiency/%) |
| Example 1 | 581.6 | 22.3 | 0.459 | 81.48 | 24.18 |
| Example 2 | 606.3 | 22.1 | 0.463 | 81.43 | 24.15 |
| Example 3 | 543.1 | 23.0 | 0.479 | 81.32 | 24.10 |
| Example 4 | 619.2 | 22.0 | 0.468 | 81.41 | 24.14 |
| Comparative example 1 | 520.6 | 24.0 | 0.491 | 81.23 | 24.07 |
| Comparative example 2 | 698.4 | 21.9 | 0.825 | 81.02 | 23.92 |
As can be seen from the results in Table 1, compared with comparative example 1, the slurry of examples 1-4 has increased yield stress, reduced line width, full line shape, reduced line resistance, improved fill factor and efficiency; examples 1-4 have reduced paste yield, reduced line resistance, and improved fill factor and efficiency compared to comparative example 2.
The organic carrier is applied to the conductive slurry, so that the linear plumpness and the smoothness can be improved, the line resistance is reduced, and the efficiency is improved.
The organic vehicle for conductive paste and the preparation method thereof provided by the present invention are described in detail above, and the principle and the implementation manner of the present invention are illustrated herein by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. An organic vehicle for electroconductive paste, comprising: 80-90 wt% of organic carrier A, 5-15 wt% of organic carrier B, 0.01-3 wt% of surfactant and 0.1-4 wt% of thixotropic agent; the organic carrier A is a more oil-soluble organic carrier, and the organic carrier B is a more water-soluble organic carrier.
2. The organic vehicle for conductive paste according to claim 1, wherein the organic vehicle A comprises the following components: 1-20 wt% of thickening agent A, 80-95 wt% of diluting agent A and 0.1-5 wt% of dispersing agent A;
the thickening agent A is a thickening oily thermoplastic high molecular substance; the diluent A is selected from at least one of alcohol ether, alcohol ester or ester.
3. The organic vehicle for conductive paste according to claim 2, wherein the thickener a is at least one selected from the group consisting of polyvinyl butyral, ethyl cellulose, acrylic resin, cellulose acetate butyrate ester resin; the diluent A is selected from at least one of butyl carbitol, diethylene glycol butyl ether acetate, DBE, diethylene glycol dibutyl ether, 3-hydroxybutyric acid butyl ester, dimethyl adipate, dibutyl sebacate and dioctyl phthalate; the dispersing agent A is at least one of long-chain fatty acid, fatty alcohol-polyoxyethylene ether and polyether fatty acid.
4. The organic vehicle for conductive paste according to claim 1, wherein the organic vehicle B comprises the following components: 1-15 wt% of thickening agent B, 80-98 wt% of diluting agent B and 0.1-5 wt% of dispersing agent B;
the thickening agent B is a polysaccharide polymer with hydrophilicity; the diluent B is selected from polyalcohol substances.
5. The organic vehicle for conductive paste according to claim 4, wherein the thickener B is at least one selected from xanthan gum, agar, locust bean gum, guar gum; the diluent B is at least one selected from glycerol, propylene glycol, ethylene glycol and diethylene glycol; the dispersant B is at least one of long-chain fatty acid, fatty alcohol-polyoxyethylene ether and polyether fatty acid.
6. The organic vehicle for conductive paste according to claim 1, wherein the surfactant is selected from organic surfactants of polysorbate type or fatty alcohol-polyoxyethylene ether type; the thixotropic agent is polyamide wax and/or polyethylene wax powder, and the melting point is more than 100 ℃.
7. The method for preparing an organic vehicle for conductive paste according to any one of claims 1 to 6, wherein the organic vehicle A and the organic vehicle B are uniformly dispersed and mixed by a surfactant, and a thixotropic agent is added to the mixture, and the mixture is heated and subjected to high-speed shear activation to prepare the conductive paste.
8. The method of claim 7, wherein the heating temperature is 50-80 ℃; the stirring speed of the high-speed shearing activation is 1500-3000r/min.
9. An electroconductive paste characterized by containing 5 to 15wt% of the organic vehicle for electroconductive paste according to any one of claims 1 to 6.
10. The conductive paste according to claim 9, further comprising 3 to 10wt% of glass frit and 80 to 90wt% of conductive powder.
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