CN115960463A - Preparation process of low-viscosity low-modulus high-thermal-conductivity single-component gel - Google Patents
Preparation process of low-viscosity low-modulus high-thermal-conductivity single-component gel Download PDFInfo
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- CN115960463A CN115960463A CN202211150718.XA CN202211150718A CN115960463A CN 115960463 A CN115960463 A CN 115960463A CN 202211150718 A CN202211150718 A CN 202211150718A CN 115960463 A CN115960463 A CN 115960463A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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Abstract
The invention discloses a preparation process of a low-viscosity low-modulus high-thermal conductivity single-component gel, which comprises the following components in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler. The heat-conducting gel prepared by the invention has low viscosity and moderate thixotropy, is more suitable for being operated in a continuous dispensing mode, saves labor and improves the production efficiency; the use amount of the filler can be reduced, so that the heat-conducting gel is endowed with better flexibility; compared with the existing products in the market, the product has better extrusion performance, higher heat conductivity coefficient, better cohesion, higher bearing temperature and more excellent storage condition.
Description
Technical Field
The invention relates to the technical field of heat-conducting interface materials, in particular to a preparation process of a low-viscosity low-modulus high-heat-conducting single-component gel.
Background
Along with the development of rapid manufacturing technology and the popularization of 5G technology, the electronic components, circuit modules, integrated circuits and other fields develop towards three major trends of high performance, miniaturization and integration, the electronic heat dissipation problem is more and more prominent, because the untimely derivation of heat can reduce the service life and the reliability of electronic devices, and the safety performance of equipment can be influenced. Effective thermal management is therefore critical to ensure its high performance and reliability. However, thermal management of many electronic devices still relies on basic passive cooling systems: internal heat sink and external natural convection. Relying on passive cooling techniques for high power, high density electronic devices cannot guarantee the internal temperature required for their proper operation.
The heat conducting interface material is a material commonly used for IC packaging and electronic heat dissipation, and is mainly used for filling up micro-gaps and holes with uneven surfaces generated when two materials are jointed or contacted, reducing heat transfer contact resistance and improving the heat dissipation performance of devices. The air thermal conductivity is 0.024W/mK, a poor conductor of heat, and heat conduction is seriously hindered. The TIM with high thermal conductivity fills the gap, removes air, establishes an effective heat transmission channel, greatly reduces thermal resistance, and fully plays the role of a radiator. Therefore, thermally conductive interface materials are essential in electronic packaging. The heat conducting interface material mainly comprises heat conducting grease, heat conducting gel, a heat conducting gasket and a phase change material. The heat-conducting gel is widely applied to heat-conducting interface materials by virtue of the characteristics of high heat conductivity coefficient, strong material cohesion, shape restorability, difficult oil bleeding, long-term storage stability and the like. At present, the traditional heat-conducting silica gel has the problems of poor heat-conducting performance, no high temperature resistance, rise in heat resistance of the heat-conducting gel after a long time, harsh storage conditions and the like, so research on the traditional heat-conducting silica gel is needed.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a preparation process of a low-viscosity low-modulus high-thermal conductivity single-component gel.
In order to achieve the purpose, the invention adopts the following technical scheme:
a preparation process of a low-viscosity low-modulus high-thermal conductivity single-component gel comprises the following components in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler.
As a further embodiment of the invention, the hydrogen-containing silicone oil has a viscosity of 300 to 500 mPas and a hydrogen content of 0.1 to 0.3 percent, and is selected from one or more of side chain hydrogen-containing silicone oil, double-end hydrogen-containing silicone oil, single-end hydrogen-containing silicone oil or end-side mixed hydrogen-containing silicone oil.
As a further embodiment of the present invention, the vinyl silicone oil has a viscosity of 50 to 100mPa · s and a vinyl content of 0.8 to 2.5%, and is selected from one or more of polyvinyl silicone oil, divinyl silicone oil, or monovinyl silicone oil.
As a further aspect of the present invention, the thermally conductive filler includes at least one of a metal filler, a carbon material, and inorganic thermally conductive particles.
As a further aspect of the present invention, the metal filler includes at least one of gold particles, silver particles, copper particles, aluminum particles, iron particles, zinc particles, nickel particles, and liquid alloy;
the carbon filler comprises at least one of diamond, graphite, carbon black, carbon fiber, carbon nano tube, graphene and graphite alkyne;
the inorganic heat-conducting particles comprise at least two of aluminum oxide, aluminum nitride, silicon nitride, boron nitride, silicon nitride, aluminum hydroxide, silicon carbide, magnesium oxide, zinc oxide and silicon dioxide;
the heat-conducting filler is spherical or spheroidal heat-conducting particles with the particle size of 0.3-0.8 micron, wherein the spherical or spheroidal heat-conducting particles with the particle size of 0.3-3 micron account for 12-30% of the total amount, the spherical or spheroidal heat-conducting particles with the particle size of 10-30 micron account for 15-30% of the total amount, and the spherical or spheroidal heat-conducting particles with the particle size of 70-150 micron account for 22-50% of the total amount.
As a further scheme of the invention, the silane coupling agent is a long-chain alkyl silane coupling agent, and the silane coupling agent comprises an octyl trimethoxy silane coupling agent, a decyl trimethoxy silane coupling agent, a dodecyl triethoxy silane coupling agent, a hexadecyl trimethoxy silane coupling agent and a hexadecyl triethoxy silane coupling agent;
the preparation method of the silane coupling agent modified heat-conducting filler comprises the following steps: adding a heat-conducting filler into ethanol, water or an ethanol/water solution of a silane coupling agent for surface treatment, stirring in the reaction process, and after complete reaction, washing with alcohol and drying in vacuum to obtain the silane coupling agent modified heat-conducting filler; more preferably, the reaction temperature is 45-85 ℃, the reaction time is 2-3h, and the mass of the silane coupling agent is 0.1-3% of that of the heat-conducting filler.
As a further aspect of the invention, the treatment agent comprises long chain alkane trimethoxy siloxane, vinyl trimethoxy siloxane, titanate, OR a novel treatment agent of the formula CnH2n +1 (SiMe 2O) mSi (OR) 3.
As a further aspect of the present invention, the hydrosilylation reaction catalyst is a hydrosilylation reaction catalyst capable of initiating hydrosilylation reactions of the components (a) and (B), the hydrosilylation reaction catalyst being selected from at least one of platinum black, rhodium, ruthenium, palladium, platinum metal compounds and organic complexes thereof, rhodium metal compounds and organic complexes thereof, ruthenium metal compounds and organic complexes thereof, palladium metal compounds and organic complexes thereof;
the hydrosilylation reaction catalyst is at least one of platinum black, platinum metal compounds and organic compounds thereof, wherein the platinum metal compounds comprise platinum dichloride, platinum tetrachloride and chloroplatinic acid, and the platinum metal compound organic compounds comprise compounds of the chloroplatinic acid, olefin and vinyl siloxane.
As a further scheme of the invention, the method comprises the following steps:
s1: weighing the following raw materials in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler for later use;
s2: adding the hydrogen-containing silicone oil, the vinyl silicone oil, the silane coupling agent and the treating agent weighed in the step S1 into a planetary mixer, stirring for 2-3 hours at room temperature, uniformly mixing for later use to obtain a mixture, and stirring at the speed of 1500-2000r/min;
s3: adding a heat-conducting filler into the mixture obtained in the step S2, uniformly stirring the mixture in a planetary mixer for the second time in a vacuum state, and keeping the vacuum state to remove bubbles generated in the stirring process of the heat-conducting gel;
s4: and after stirring and mixing are finished, taking out and placing the mixture, cooling the mixture to room temperature, adding a hydrosilylation reaction catalyst, and uniformly stirring the mixture in a planetary mixer for three times to obtain the low-viscosity low-modulus high-heat-conductivity single-component gel.
The invention has the beneficial effects that:
1. according to the invention, hydrogen-containing silicone oil, vinyl silicone oil, a silane coupling agent, a treating agent, a hydrosilylation reaction catalyst and a heat-conducting filler are blended, and the metal fillers with different particle sizes are optimally compounded, so that the system is compactly stacked, a heat-conducting passage is optimized, and the heat-conducting property of the heat-conducting gel is improved; in addition, after the powder is optimally stacked, the addition amount of the heat-conducting filler can be reduced, so that the viscosity of the heat-conducting gel component is reduced, and the bulk strength and the toughness of the heat-conducting gel are also obviously improved.
2. The optimization of the mass part ratio of the terminal hydrogen-containing phase to the side hydrogen-containing phase in the hydrogen-containing silicone oil can improve the extrusion performance of the heat-conducting gel and the cohesion of the heat-conducting gel; finally, compared with the filler modified by the common treating agent, the heat-conducting filler modified by the treating agent has lower viscosity and lower oil absorption value, so that the powder is easier to fill and disperse, and the heat-conducting gel is difficult to separate oil in the long-term storage process and is difficult to crack in the high-temperature aging process.
3. The gel is free of inhibitor, so that the gel is crosslinked during mixing, and can be stored for a long time at room temperature. In conclusion, the heat-conducting gel prepared by the invention has low viscosity and moderate thixotropy, is more suitable for being operated in a continuous dispensing mode, saves labor and improves the production efficiency; the use amount of the filler can be reduced, so that the heat-conducting gel is endowed with better flexibility; compared with the existing products in the market, the product has better extrusion performance, higher heat conductivity coefficient, better cohesion, higher bearing temperature and more excellent storage condition.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
Examples
A preparation process of a low-viscosity low-modulus high-thermal conductivity single-component gel comprises the following components in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler.
In the present embodiment, the hydrogen-containing silicone oil has a viscosity of 300 to 500mPa · s and a hydrogen content of 0.1 to 0.3%, and is selected from one or more of side chain hydrogen-containing silicone oil, both-end hydrogen-containing silicone oil, single-end hydrogen-containing silicone oil, and end-side mixed hydrogen-containing silicone oil.
In the embodiment, the viscosity of the vinyl silicone oil is 50 to 100 mPas, the vinyl content is 0.8 to 2.5 percent, and the vinyl silicone oil is selected from one or more of polyvinyl silicone oil, divinyl silicone oil and monovinyl silicone oil.
In the present embodiment, the thermally conductive filler includes at least one of a metal filler, a carbon material, and inorganic thermally conductive particles.
In the present embodiment, the metal filler includes at least one of gold particles, silver particles, copper particles, aluminum particles, iron particles, zinc particles, nickel particles, and liquid alloy;
the carbon filler comprises at least one of diamond, graphite, carbon black, carbon fiber, carbon nanotube, graphene and graphite alkyne;
the inorganic heat conducting particles comprise at least two of aluminum oxide, aluminum nitride, silicon nitride, boron nitride, silicon nitride, aluminum hydroxide, silicon carbide, magnesium oxide, zinc oxide and silicon dioxide;
the heat-conducting filler is spherical or sphere-like heat-conducting particles with the particle size of 0.3-0.8 micron, wherein the spherical or sphere-like heat-conducting particles with the particle size of 0.3-3 micron account for 12-30% of the total amount, the spherical or sphere-like heat-conducting particles with the particle size of 10-30 micron account for 15-30% of the total amount, and the spherical or sphere-like heat-conducting particles with the particle size of 70-150 micron account for 22-50% of the total amount.
In this embodiment, the silane coupling agent is a long-chain alkyl silane coupling agent, and the silane coupling agent includes octyl trimethoxy silane coupling agent, decyl trimethoxy silane coupling agent, dodecyl triethoxy silane coupling agent, hexadecyl trimethoxy silane coupling agent, and hexadecyl triethoxy silane coupling agent;
the preparation method of the silane coupling agent modified heat-conducting filler comprises the following steps: adding the heat-conducting filler into ethanol, water or ethanol/water solution of silane coupling agent for surface treatment, stirring in the reaction process, and after complete reaction, washing with alcohol and drying in vacuum to obtain silane coupling agent modified heat-conducting filler; more preferably, the reaction temperature is 45-85 ℃, the reaction time is 2-3h, and the mass of the silane coupling agent is 0.1-3% of that of the heat-conducting filler.
In this example, the treatment agent comprises long chain alkane trimethoxy siloxane, vinyl trimethoxy siloxane, titanate, OR a novel treatment agent having the formula CnH2n +1 (SiMe 2O) mSi (OR) 3.
In this embodiment, the hydrosilylation reaction catalyst is a hydrosilylation reaction catalyst capable of initiating the hydrosilylation reaction of components (a) and (B), and the hydrosilylation reaction catalyst is at least one selected from platinum black, rhodium, ruthenium, palladium, platinum metal compounds and organic compounds thereof, rhodium metal compounds and organic compounds thereof, ruthenium metal compounds and organic compounds thereof, palladium metal compounds and organic compounds thereof;
the hydrosilylation catalyst is at least one of platinum black, platinum metal compounds and organic compounds thereof, the platinum metal compounds comprise platinum dichloride, platinum tetrachloride and chloroplatinic acid, and the platinum metal compound organic compounds comprise compounds of the chloroplatinic acid, olefin and vinyl siloxane.
In this embodiment, the method includes the following steps:
s1: weighing the following raw materials in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler for later use;
s2: adding the hydrogen-containing silicone oil, the vinyl silicone oil, the silane coupling agent and the treating agent weighed in the step S1 into a planetary mixer, stirring for 2-3 hours at room temperature, uniformly mixing for later use to obtain a mixture, and stirring at the speed of 1500-2000r/min;
s3: adding a heat-conducting filler into the mixture obtained in the step S2, uniformly stirring the mixture in a planetary mixer for the second time in a vacuum state, and keeping the vacuum state to remove bubbles generated in the stirring process of the heat-conducting gel;
s4: and after stirring and mixing are finished, taking out and placing, cooling to room temperature, adding a hydrosilylation reaction catalyst, and uniformly stirring in a planetary mixer for three times to obtain the low-viscosity low-modulus high-heat-conductivity single-component gel.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: according to the invention, hydrogen-containing silicone oil, vinyl silicone oil, a silane coupling agent, a treating agent, a hydrosilylation reaction catalyst and a heat-conducting filler are blended, and the metal fillers with different particle sizes are optimally compounded, so that the system is compactly stacked, a heat-conducting passage is optimized, and the heat-conducting property of the heat-conducting gel is improved; in addition, after the powder is optimally stacked, the addition amount of the heat-conducting filler can be reduced, so that the viscosity of the heat-conducting gel component is reduced, and the body strength and toughness of the heat-conducting gel are also obviously improved;
the optimization of the mass part ratio of the terminal hydrogen-containing phase to the side hydrogen-containing phase in the hydrogen-containing silicone oil can improve the extrusion performance of the heat-conducting gel and the cohesion of the heat-conducting gel; finally, compared with the filler modified by the common treating agent, the heat-conducting filler modified by the treating agent has lower viscosity and lower oil absorption value, so that the powder is easier to fill and disperse, and the heat-conducting gel is difficult to separate oil in the long-term storage process and is difficult to crack in the high-temperature aging process.
In addition, the gel is free of an inhibitor, so that the gel is crosslinked during mixing, thereby enabling long-term storage at room temperature. In conclusion, the heat-conducting gel prepared by the invention has low viscosity and moderate thixotropy, is more suitable for being operated in a continuous dispensing mode, saves labor and improves the production efficiency; the using amount of the filler can be reduced, so that the heat-conducting gel is endowed with better flexibility; compared with the existing products in the market, the product has better extrusion performance, higher heat conductivity coefficient, better cohesion, higher bearing temperature and more excellent storage condition.
For ease of description, spatially relative terms such as "over … …", "over … …", "over … …", "over", etc. may be used herein to describe the spatial positional relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that, for example, the embodiments of the application described herein may be performed in an order other than those described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The low-viscosity low-modulus high-thermal conductivity single-component gel is characterized by comprising the following components in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler.
2. The low-viscosity low-modulus high-thermal-conductivity mono-component gel as claimed in claim 1, wherein the hydrogen-containing silicone oil has a viscosity of 300-500mPa · s and a hydrogen content of 0.1-0.3%, and is selected from one or more of side chain hydrogen-containing silicone oil, double-end-capped hydrogen-containing silicone oil, single-end-capped hydrogen-containing silicone oil or end-side mixed hydrogen-containing silicone oil.
3. The low viscosity low modulus high thermal conductivity one-component gel of claim 1, wherein the vinyl silicone oil has a viscosity of 50 to 100 mPa-s and a vinyl content of 0.8 to 2.5% and is selected from one or more of polyvinyl silicone oil, divinyl silicone oil or monovinyl silicone oil.
4. The low viscosity, low modulus, high thermal conductivity, single component gel of claim 1, wherein said thermally conductive filler comprises at least one of a metallic filler, a carbon material, and inorganic thermally conductive particles.
5. The low viscosity, low modulus, high thermal conductivity, single component gel of claim 4, wherein said metallic filler comprises at least one of gold particles, silver particles, copper particles, aluminum particles, iron particles, zinc particles, nickel particles, and liquid alloy;
the carbon filler comprises at least one of diamond, graphite, carbon black, carbon fiber, carbon nanotube, graphene and graphite alkyne;
the inorganic heat conducting particles comprise at least two of aluminum oxide, aluminum nitride, silicon nitride, boron nitride, silicon nitride, aluminum hydroxide, silicon carbide, magnesium oxide, zinc oxide and silicon dioxide;
the heat-conducting filler is spherical or sphere-like heat-conducting particles with the particle size of 0.3-0.8 micrometer, wherein the spherical or sphere-like heat-conducting particles with the particle size of 0.3-3 micrometer account for 12-30% of the total amount, the spherical or sphere-like heat-conducting particles with the particle size of 10-30 micrometer account for 15-30% of the total amount, and the spherical or sphere-like heat-conducting particles with the particle size of 70-150 micrometer account for 22-50% of the total amount.
6. The low viscosity low modulus high thermal conductivity single component gel as claimed in claim 1, wherein said silane coupling agent is long chain alkyl silane coupling agent, said silane coupling agent comprises octyl trimethoxy silane coupling agent, decyl trimethoxy silane coupling agent, dodecyl triethoxy silane coupling agent, hexadecyl trimethoxy silane coupling agent, hexadecyl triethoxy silane coupling agent;
the preparation method of the silane coupling agent modified heat-conducting filler comprises the following steps: adding a heat-conducting filler into ethanol, water or an ethanol/water solution of a silane coupling agent for surface treatment, stirring in the reaction process, and after complete reaction, washing with alcohol and drying in vacuum to obtain the silane coupling agent modified heat-conducting filler; more preferably, the reaction temperature is 45-85 ℃, the reaction time is 2-3h, and the mass of the silane coupling agent is 0.1-3% of that of the heat-conducting filler.
7. The low viscosity, low modulus, high thermal conductivity, single component gel of claim 1, wherein the treatment comprises long chain alkane trimethoxy siloxane, vinyltrimethoxy siloxane, titanate, OR a novel treatment of the formula CnH2n +1 (SiMe 2O) mSi (OR) 3.
8. The low viscosity, low modulus, high thermal conductivity single-component gel of claim 1, wherein the hydrosilylation reaction catalyst is a hydrosilylation reaction catalyst capable of initiating the hydrosilylation reaction of components (a) and (B), and the hydrosilylation reaction catalyst is at least one selected from the group consisting of platinum black, rhodium, ruthenium, palladium, platinum metal compounds and organic complexes thereof, rhodium metal compounds and organic complexes thereof, ruthenium metal compounds and organic complexes thereof, palladium metal compounds and organic complexes thereof;
the hydrosilylation reaction catalyst is at least one of platinum black, platinum metal compounds and organic compounds thereof, wherein the platinum metal compounds comprise platinum dichloride, platinum tetrachloride and chloroplatinic acid, and the platinum metal compound organic compounds comprise compounds of the chloroplatinic acid, olefin and vinyl siloxane.
9. The preparation process of the low-viscosity low-modulus high-thermal conductivity single-component gel as claimed in claim 1, wherein the preparation process comprises the following steps:
s1: weighing the following raw materials in parts by weight: 5-30 parts of hydrogen-containing silicone oil, 9-15 parts of vinyl silicone oil, 3-7 parts of a silane coupling agent, 8-10 parts of a treating agent, 1-2 parts of a hydrosilylation catalyst and 60-80 parts of a heat-conducting filler for later use;
s2: adding the hydrogen-containing silicone oil, the vinyl silicone oil, the silane coupling agent and the treating agent weighed in the step S1 into a planetary mixer, stirring for 2-3 hours at room temperature, uniformly mixing for later use to obtain a mixture, and stirring at the speed of 1500-2000r/min;
s3: adding a heat-conducting filler into the mixture obtained in the step S2, uniformly stirring the mixture in a planetary mixer for the second time in a vacuum state, and keeping the vacuum state to remove bubbles generated in the stirring process of the heat-conducting gel;
s4: and after stirring and mixing are finished, taking out and placing the mixture, cooling the mixture to room temperature, adding a hydrosilylation reaction catalyst, and uniformly stirring the mixture in a planetary mixer for three times to obtain the low-viscosity low-modulus high-heat-conductivity single-component gel.
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| CN112500705A (en) * | 2020-11-16 | 2021-03-16 | 深圳德邦界面材料有限公司 | Low-viscosity low-modulus high-thermal-conductivity single-component gel and preparation method thereof |
| CN112852165A (en) * | 2020-12-28 | 2021-05-28 | 上海回天新材料有限公司 | Single-component addition type high-temperature-resistant high-heat-conductivity silicone gel and preparation method thereof |
| CN113248931A (en) * | 2021-05-31 | 2021-08-13 | 广东恒大新材料科技有限公司 | Heat-conducting gel with high heat conductivity and high extrusion rate and preparation method thereof |
| CN114958002A (en) * | 2022-06-27 | 2022-08-30 | 韦尔通(厦门)科技股份有限公司 | Heat-conducting silica gel and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112500705A (en) * | 2020-11-16 | 2021-03-16 | 深圳德邦界面材料有限公司 | Low-viscosity low-modulus high-thermal-conductivity single-component gel and preparation method thereof |
| CN112852165A (en) * | 2020-12-28 | 2021-05-28 | 上海回天新材料有限公司 | Single-component addition type high-temperature-resistant high-heat-conductivity silicone gel and preparation method thereof |
| CN113248931A (en) * | 2021-05-31 | 2021-08-13 | 广东恒大新材料科技有限公司 | Heat-conducting gel with high heat conductivity and high extrusion rate and preparation method thereof |
| CN114958002A (en) * | 2022-06-27 | 2022-08-30 | 韦尔通(厦门)科技股份有限公司 | Heat-conducting silica gel and preparation method thereof |
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