CN115954756A - VCSEL chip packaging structure and manufacturing method thereof - Google Patents
VCSEL chip packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN115954756A CN115954756A CN202310093586.XA CN202310093586A CN115954756A CN 115954756 A CN115954756 A CN 115954756A CN 202310093586 A CN202310093586 A CN 202310093586A CN 115954756 A CN115954756 A CN 115954756A
- Authority
- CN
- China
- Prior art keywords
- packaging layer
- vcsel chip
- layer
- packaging
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 208
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000005538 encapsulation Methods 0.000 claims description 96
- 238000000034 method Methods 0.000 claims description 15
- 238000001746 injection moulding Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses a VCSEL chip packaging structure and a manufacturing method thereof, wherein the VCSEL chip packaging structure comprises a substrate, a VCSEL chip, a first packaging layer and a second packaging layer; the VCSEL chip is positioned on one side of the substrate; the first packaging layer is positioned on one side of the VCSEL chip far away from the substrate and covers the VCSEL chip; the second packaging layer is positioned on one side of the first packaging layer, which is far away from the VCSEL chip, and covers the first packaging layer; when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a convex surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a concave surface, or the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a concave surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a convex surface; the invention can increase the divergence angle of the emergent light beam without using an additional light beam shaper.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a VCSEL chip packaging structure and a manufacturing method thereof.
Background
A VCSEL (Vertical Cavity Surface Emitting Laser) is a new generation of semiconductor Laser, which has wide applications in the fields of machine vision, 3D identification, laser radar, indoor navigation, and the like, and in order to match a sensor (sensor) of a receiving end (RX) and improve energy utilization efficiency, a circular spot with a smaller VCSEL divergence angle generally needs to be shaped into a square spot with a larger divergence angle.
The existing VCSEL module uses a beam expanding sheet (diffuser) to shape light spots, and the manufacturing of the diffuser needs to use technologies such as nanoimprint lithography and the like, so that the cost is high. Molding is a common packaging form in the LED, has the advantages of low cost, mature process and the like, can greatly improve the reliability of the device in a severe environment, and has an optical shaping function. However, since the divergence angle of the VCSEL itself is small, there is a great limitation in applying the molding technique to spot shaping of the VCSEL. Exemplarily, fig. 1 and fig. 2 are a model and a light spot schematic diagram of a VCSEL under conventional molding, the VCSEL light spot has only a small angular deviation, and if the surface slope is increased, total reflection occurs. According to theoretical calculation, the angle of the VCSEL emergent light can only reach about +/-30 degrees at most.
Disclosure of Invention
The invention provides a VCSEL chip packaging structure and a manufacturing method thereof, the VCSEL chip packaging structure is simple in structure, and beam shaping of a VCSEL can be completed without using an expensive beam expanding sheet.
According to an aspect of the present invention, there is provided a VCSEL chip packaging structure including: the chip package structure comprises a substrate, a VCSEL chip, a first packaging layer and a second packaging layer;
the VCSEL chip is positioned on one side of the substrate;
the first packaging layer is positioned on one side, far away from the substrate, of the VCSEL chip and covers the VCSEL chip;
the second packaging layer is positioned on one side of the first packaging layer, which is far away from the VCSEL chip, and covers the first packaging layer;
the refractive index of the first encapsulation layer and the refractive index of the second encapsulation layer are both greater than 1;
when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a convex surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a concave surface, or the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a concave surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a convex surface;
when the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer are both convex surfaces or concave surfaces.
Optionally, a surface of the light exit region of the first package layer, which is away from the VCSEL chip, is a first free-form surface;
the surface of the light emergent area of the second packaging layer, which is far away from the first packaging layer, is a second free-form surface.
Optionally, the refractive index of the first encapsulation layer ranges from 1.4 to 1.6;
the refractive index of the second encapsulation layer ranges from 1.4 to 1.6.
Optionally, the melting point of the first encapsulation layer is greater than the melting point of the second encapsulation layer.
Optionally, the material of the first encapsulation layer includes silicone rubber or resin;
the material of the second packaging layer comprises silicon rubber or resin.
Optionally, the formula of the first free-form surface is:
wherein,
x 1 is the coordinate value of a point on the first free-form surface in a first direction, y 1 Is a coordinate value of a point on the first free-form surface in a second direction, z 1 The coordinate value of the point on the first free-form surface in the third direction is shown, and the third direction, the first direction and the second direction are mutually vertical; c. C 1 Is the curvature radius of the first free-form surface; k is a radical of 1 Is a first conic constant; a. The 1 、B 1 、C 1 、D 1 、E 1 And F 1 Constant coefficients of the first free-form surface are respectively;
the formula of the second free-form surface is as follows:
wherein,
x 2 is the coordinate value of a point on the second free-form surface in the first direction, y 2 Is a coordinate value of a point on the second free-form surface in a second direction, z 2 Is a coordinate value of a point on the second free-form surface in a third direction; c. C 2 Is the curvature radius of the second free-form surface; k is a radical of 2 Is a second conic constant; a. The 2 、B 2 、C 2 、D 2 、E 2 And F 2 Are respectively constant coefficients of the second free-form surface.
Optionally, the VCSEL chip is connected to the substrate by a lead.
Optionally, the VCSEL chip includes a first pin and a second pin;
the first pin and the second pin are positioned on the surface of the substrate close to the VCSEL chip and are electrically connected with the substrate.
According to another aspect of the present invention, there is provided a method for fabricating a VCSEL chip package, the method comprising:
providing a substrate;
disposing a VCSEL chip to one side of the substrate;
forming a first packaging layer, wherein the first packaging layer is positioned on one side of the VCSEL chip far away from the substrate and covers the VCSEL chip;
forming a second encapsulation layer, wherein the refractive index of the first encapsulation layer and the refractive index of the second encapsulation layer are both greater than 1; the second packaging layer is positioned on one side, away from the VCSEL chip, of the first packaging layer and covers the first packaging layer; when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a convex surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a concave surface, or the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a concave surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a convex surface; when the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, are both convex surfaces or concave surfaces.
Optionally, the forming the first encapsulation layer specifically includes:
forming a first packaging layer by adopting an injection molding process;
the forming of the second encapsulation layer specifically includes:
and forming a second packaging layer by adopting an injection molding process.
The embodiment provides a VCSEL chip packaging structure, which includes a first packaging layer and a second packaging layer, wherein a refractive index of the first packaging layer is different from a refractive index of the second packaging layer, and both the refractive index of the first packaging layer and the refractive index of the second packaging layer are greater than 1. When the refractive index of the first packaging layer is smaller than that of the second packaging layer, one of the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a concave surface, and the other surface is a convex surface, so that the divergence angle of light beams can be increased. When the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer are both concave surfaces or convex surfaces, and the divergence angle of the light beam can also be increased. In summary, the VCSEL chip package structure provided in this embodiment has a simple structure, and the beam shaping of the VCSEL can be completed without using an expensive beam expanding sheet.
It should be understood that the statements in this section are not intended to identify key or critical features of the embodiments of the present invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a conventional VCSEL chip package structure;
FIG. 2 is a schematic diagram of light spots emitted from a prior art VCSEL chip package structure;
fig. 3 is a schematic structural diagram of a VCSEL chip package structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another VCSEL chip package structure provided in accordance with an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another VCSEL chip package structure provided in accordance with an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another VCSEL chip packaging structure provided in accordance with an embodiment of the present invention;
FIG. 7 is a schematic diagram of an emitted light spot of a VCSEL chip package structure provided in accordance with an embodiment of the present invention;
fig. 8 is a schematic structural diagram of another VCSEL chip package structure provided in accordance with an embodiment of the present invention;
fig. 9 is a schematic flow chart illustrating a method for manufacturing a VCSEL chip package according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Figure 3 is a schematic structural diagram of a VCSEL chip package structure provided in accordance with an embodiment of the present invention,
figure 4 is a schematic structural diagram of another VCSEL chip package structure provided in accordance with an embodiment of the present invention,
figure 5 is a schematic structural diagram of another VCSEL chip package structure provided in accordance with an embodiment of the present invention,
fig. 6 is a schematic structural diagram of another VCSEL chip packaging structure provided in accordance with an embodiment of the present invention, and referring to fig. 3 to fig. 6, the VCSEL chip packaging structure provided in this embodiment includes: a substrate 110, a VCSEL chip 120, a first encapsulation layer 130, and a second encapsulation layer 140; the VCSEL chip 120 is located at one side of the substrate 110; the first packaging layer 130 is located on a side of the VCSEL chip 120 away from the substrate 110 and covers the VCSEL chip 120; the second packaging layer 140 is located on a side of the first packaging layer 130 away from the VCSEL chip 120 and covers the first packaging layer 130; the refractive index of the first encapsulation layer 130 and the refractive index of the second encapsulation layer 140 are both greater than 1; when the refractive index of the first encapsulation layer 130 is smaller than the refractive index of the second encapsulation layer 140, referring to fig. 3, the surface of the light emitting region of the first encapsulation layer 130 away from the VCSEL chip 120 is a convex surface, and the surface of the light emitting region of the second encapsulation layer 140 away from the first encapsulation layer 130 is a concave surface, or, referring to fig. 4, the surface of the light emitting region of the first encapsulation layer 130 away from the VCSEL chip 120 is a concave surface, and the surface of the light emitting region of the second encapsulation layer 140 away from the first encapsulation layer 130 is a convex surface; when the refractive index of the first encapsulation layer 130 is greater than the refractive index of the second encapsulation layer 140, both the surface of the light exit region of the first encapsulation layer 130 away from the VCSEL chip 120 and the surface of the light exit region of the second encapsulation layer 140 away from the first encapsulation layer 130 are concave (refer to fig. 5) or convex (refer to fig. 6).
In particular, the first and second encapsulation layers 130 and 140 may protect the VCSEL chip 120 from corrosion and contamination by external air, moisture, and the like. The first encapsulating layer 130 covers the VCSEL chip 120, i.e. there is no cavity between the first encapsulating layer 130 and the VCSEL chip 120, and the laser emitted from the VCSEL chip 120 can be directly incident into the first encapsulating layer 130.
The light emitting area of the first encapsulation layer 130 is a region where laser light emitted from the VCSEL chip 120 passes through the first encapsulation layer 130. The light emitting area of the second encapsulation layer 140 is a region where laser light emitted from the VCSEL chip 120 passes through the second encapsulation layer 140. The vertical projection of the light emitting area of the first encapsulation layer 130 and the light emitting area of the second encapsulation layer 140 on the substrate 110 cover the vertical projection of the VCSEL chip 120 on the substrate 110. The first encapsulation layer 130 and the second encapsulation layer 140 each have optical transparency.
Let the refractive index of the first encapsulation layer 130 be denoted as n1 and the refractive index of the second encapsulation layer 140 be denoted as n2. The stacking direction of the VCSEL chips 120 and the substrate 110 is referred to as a third direction z. The first direction X, the second direction Y and the third direction Z are perpendicular to each other.
When n1 is less than n2, referring to fig. 3, the laser in the first encapsulation layer 130 is refracted after being incident on the second encapsulation layer 140, according to the refractive index formula, the refraction angle of the light in the second encapsulation layer 140 is smaller than the incident angle of the light in the first encapsulation layer 130, and since the light exit area of the first encapsulation layer 130 is a convex surface away from the surface of the VCSEL chip 120, the included angle between the light refracted in the second encapsulation layer 140 and the third direction z is larger than the included angle between the light in the first encapsulation layer 130 and the third direction z. It can be seen that the divergence angle of the light beam will increase after the light exits from the first encapsulation layer 130 to the second encapsulation layer 140. After the light in the second encapsulation layer 140 exits into the air, the light exiting into the air is refracted according to the formula of the refractive index, and the refraction angle is larger than the incident angle. Since the surface of the light emitting area of the second package layer 140, which is far away from the first package layer 130, is a concave surface, an included angle between light refracted in the air and the third direction z is larger than an included angle between light in the second package layer 140 and the third direction z.
When n1 < n2, referring to fig. 4, if the surface of the light-emitting region of the first encapsulation layer 130 away from the VCSEL chip 120 is a concave surface, light in the first encapsulation layer 130 enters the second encapsulation layer 140 and then converges, that is, the deflection direction of light in the second encapsulation layer 140 is opposite to the deflection direction of light in the first encapsulation layer 130, and exemplarily, if the light in the first encapsulation layer 130 is deflected to the left, the light in the second encapsulation layer 140 will be deflected to the right. After the light in the second encapsulation layer 140 exits into the air, the light is refracted, and since the surface of the light exit area of the second encapsulation layer 140, which is far away from the first encapsulation layer 130, is a convex surface, the light entering the air converges again, and an included angle between the light entering the air and the third direction z is larger than an included angle between the light entering the second encapsulation layer 140 and the third direction z.
When n1 > n2, referring to fig. 5, the laser in the first encapsulation layer 130 is refracted after being incident on the second encapsulation layer 140, according to the refractive index formula, the refraction angle of the light in the second encapsulation layer 140 is larger than the incident angle of the light in the first encapsulation layer 130, and since the light exit area of the first encapsulation layer 130 is a concave surface away from the surface of the VCSEL chip 120, the included angle between the light refracted in the second encapsulation layer 140 and the third direction z is larger than the included angle between the light in the first encapsulation layer 130 and the third direction z, and therefore, the divergence angle of the light beam will increase after the light exits from the first encapsulation layer 130 to the second encapsulation layer 140. After the light in the second encapsulation layer 140 exits into the air, the light exiting into the air is refracted according to the formula of the refractive index, and the refraction angle is larger than the incident angle. Since the surface of the light emitting area of the second package layer 140, which is far away from the VCSEL chip 120, is a concave surface, an included angle between light refracted in the air and the third direction z is larger than an included angle between light in the second package layer 140 and the third direction z.
When n1 > n2, referring to fig. 6, if the surface of the light exit region of the first encapsulation layer 130 away from the VCSEL chip 120 is a convex surface, light in the first encapsulation layer 130 enters the second encapsulation layer 140 and then converges, that is, the deflection direction of light in the second encapsulation layer 140 is opposite to the deflection direction of light in the first encapsulation layer 130, and exemplarily, if the light in the first encapsulation layer 130 is deflected to the left, the light in the second encapsulation layer 140 will be deflected to the right. After the light in the second package layer 140 exits into the air, the light is refracted, and since the surface of the light exit area of the second package layer 140, which is away from the VCSEL chip 120, is a convex surface, the light entering the air converges again, and an included angle between the light entering the air and the third direction z is larger than an included angle between the light entering the second package layer 140 and the third direction z.
Fig. 7 is a schematic diagram of a light spot emitted by a VCSEL chip packaging structure according to an embodiment of the present invention, referring to fig. 7, an abscissa in fig. 7 represents a divergence angle of the light spot in a first direction X, and an ordinate in fig. 7 represents a divergence angle of the light spot in a second direction Y, where the divergence angle of the light spot in fig. 7 can reach ± 45 °.
The embodiment provides a VCSEL chip packaging structure, which includes a first packaging layer and a second packaging layer, wherein a refractive index of the first packaging layer is different from a refractive index of the second packaging layer, and both the refractive index of the first packaging layer and the refractive index of the second packaging layer are greater than 1. When the refractive index of the first packaging layer is smaller than that of the second packaging layer, one of the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a concave surface, and the other surface is a convex surface, so that the divergence angle of light beams can be increased. When the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light outgoing area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light outgoing area of the second packaging layer, which is far away from the first packaging layer are both concave surfaces or convex surfaces, and the divergence angle of the light beam can also be increased. In summary, the VCSEL chip package structure provided in this embodiment has a simple structure, and the beam shaping of the VCSEL can be completed without using an expensive beam expanding sheet.
Optionally, the surface of the light emitting region of the first packaging layer, which is far away from the VCSEL chip, is a first free-form surface; the surface of the light outgoing area of the second packaging layer, which is far away from the first packaging layer, is a second free-form surface.
Specifically, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, are both set as free-form surfaces, so that the surface of the first packaging layer, which is far away from the VCSEL chip, has different curvatures in different regions, and the surface of the second packaging layer, which is far away from the first packaging layer, has different curvatures in different regions, thereby increasing the optical functions of the first packaging layer and the second packaging layer. The first free-form surface may not include a surface rotationally symmetric about the optical axis, and the second free-form surface may not include a surface rotationally symmetric about the optical axis.
Optionally, the refractive index of the first encapsulation layer ranges from 1.4 to 1.6; the refractive index of the second encapsulation layer ranges from 1.4 to 1.6.
Specifically, the refractive index of the first encapsulating layer and the refractive index of the second encapsulating layer are set to be in the range of 1.4 to 1.6, so that the divergence angle of the light beam can be increased.
Optionally, the melting point of the first encapsulation layer is greater than the melting point of the second encapsulation layer.
Specifically, the first packaging layer and the second packaging layer can be manufactured by adopting an injection molding process. The first packaging layer manufactured by adopting the injection molding process can be tightly connected with the VCSEL chip and the substrate, so that the problem that the first packaging layer falls off in the use process of the VCSEL chip packaging structure is solved. Similarly, the second packaging layer manufactured by adopting the injection molding process can be tightly connected with the first packaging layer and the substrate, so that the problem that the second packaging layer falls off in the use process of the VCSEL chip packaging structure is solved. When the injection molding process is adopted, the process is carried out in a high-temperature and high-pressure environment, the melting point of the first packaging layer is set to be larger than that of the second packaging layer, and the problem that the first packaging layer is melted and deformed when the second packaging layer is manufactured can be solved.
Optionally, the material of the first encapsulation layer includes silicone rubber or resin; the material of the second encapsulation layer includes silicone rubber or resin.
Specifically, the silicon rubber and the resin have the characteristics of low cost, easiness in obtaining, high temperature resistance, low temperature resistance and the like, so that the first packaging layer and the second packaging layer which are made of the silicon rubber or the resin can reduce the manufacturing cost of the VCSEL chip packaging structure and can also improve the reliability of the VCSEL chip packaging structure.
Optionally, the formula of the first free-form surface is:
wherein,
x 1 is a coordinate value, y, of a point on the first free-form surface in a first direction 1 Is a point second square on the first free-form surfaceCoordinate value of direction, z 1 The coordinate value of the point on the first free-form surface in the third direction is shown, and the third direction, the first direction and the second direction are mutually vertical; c. C 1 Is the curvature radius of the first free-form surface; k is a radical of 1 Is a first conic constant; a. The 1 、B 1 、C 1 、D 1 、E 1 And F 1 Constant coefficients of the first free-form surface are respectively;
the formula of the second free-form surface is:
wherein,
x 2 is the coordinate value of a point on the second free-form surface in the first direction, y 2 Is a coordinate value of a point on the second free-form surface in a second direction, z 2 A coordinate value of a point on the second free-form surface in a third direction; c. C 2 Is the curvature radius of the second free-form surface; k is a radical of 2 Is a second conic constant; a. The 2 、B 2 、C 2 、D 2 、E 2 And F 2 Respectively, constant coefficients of the second free-form surface.
Specifically, for the first free-form surface, c can be adjusted 1 、k 1 、A 1 、B 1 、C 1 、D 1 、E 1 And F 1 For the second free-form surface, c can be 2 、k 2 、A 2 、B 2 、C 2 、D 2 、E 2 And F 2 Changes the divergence angle of the light beam.
Alternatively, referring to any one of fig. 3 to 6, the VCSEL chip 120 is electrically connected to the substrate 110 through a wire 121.
Specifically, the lead 121 has conductivity, and the material of the lead 121 may be gold. The VCSEL chip 120 is electrically connected to the substrate 110 through a wire 121, thereby achieving information interaction.
Alternatively, fig. 8 is a schematic structural diagram of another VCSEL chip packaging structure provided in accordance with an embodiment of the present invention, and referring to fig. 8, the VCSEL chip 120 includes a first lead 122 and a second lead 123; the first pin 122 and the second pin 123 are located on the surface of the substrate 110 near the VCSEL chip 120 and are electrically connected to the substrate 110.
Specifically, the first pin 122 and the second pin 123 in the VCSEL chip 120 are directly electrically connected to the substrate 110, so that information interaction between the VCSEL chip 120 and the substrate 110 is realized. The first pin 122 and the second pin 123 of the VCSEL chip 120 are directly electrically connected with the substrate 110, and are not electrically connected with the substrate 110 through leads, so that the VCSEL chip 120 is electrically connected with the substrate 110 without a routing process, the manufacturing steps of the VCSEL chip packaging structure are simplified, and the manufacturing cost is reduced.
Fig. 9 is a schematic flowchart of a manufacturing method of a VCSEL chip package structure according to an embodiment of the present invention, and referring to fig. 9, the manufacturing method provided in this embodiment includes the following steps:
s110, providing a substrate.
And S120, arranging the VCSEL chip on one side of the substrate.
And S130, forming a first packaging layer, wherein the first packaging layer is positioned on one side of the VCSEL chip far away from the substrate and covers the VCSEL chip.
S140, forming a second packaging layer, wherein the second packaging layer is positioned on one side of the first packaging layer, which is far away from the VCSEL chip, and covers the first packaging layer; the refractive index of the first packaging layer and the refractive index of the second packaging layer are both greater than 1; when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a convex surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a concave surface, or the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, is a concave surface, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, is a convex surface; when the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, are both convex surfaces or concave surfaces.
Optionally, the forming of the first encapsulation layer specifically includes: forming a first packaging layer by adopting an injection molding process; forming the second encapsulation layer specifically includes: and forming a second packaging layer by adopting an injection molding process.
The manufacturing method of the VCSEL chip packaging structure provided in this embodiment and the VCSEL chip packaging structure provided in any embodiment of the present invention have corresponding advantages, and detailed technical details are not described in this embodiment, but refer to the VCSEL chip packaging structure provided in any embodiment of the present invention.
It should be understood that various forms of the flows shown above, reordering, adding or deleting steps, may be used. For example, the steps described in the present invention may be executed in parallel, sequentially, or in different orders, and are not limited herein as long as the desired result of the technical solution of the present invention can be achieved.
The above-described embodiments should not be construed as limiting the scope of the invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made, depending on design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A VCSEL chip package, comprising: the chip package structure comprises a substrate, a VCSEL chip, a first packaging layer and a second packaging layer;
the VCSEL chip is positioned on one side of the substrate;
the first packaging layer is positioned on one side, away from the substrate, of the VCSEL chip and covers the VCSEL chip;
the second packaging layer is positioned on one side, away from the VCSEL chip, of the first packaging layer and covers the first packaging layer;
the refractive index of the first packaging layer and the refractive index of the second packaging layer are both larger than 1;
when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a convex surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a concave surface, or the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a concave surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a convex surface;
when the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, are both convex surfaces or concave surfaces.
2. The package structure of claim 1, wherein a surface of the light exit region of the first package layer away from the VCSEL chip is a first free-form surface;
the surface of the light emergent area of the second packaging layer, which is far away from the first packaging layer, is a second free-form surface.
3. The package structure of claim 1, wherein the first encapsulation layer has a refractive index in a range from 1.4 to 1.6;
the refractive index of the second encapsulation layer ranges from 1.4 to 1.6.
4. The package structure of claim 1, wherein the first encapsulation layer has a melting point greater than a melting point of the second encapsulation layer.
5. The package structure of claim 1, wherein the material of the first encapsulation layer comprises silicone rubber or resin;
the material of the second packaging layer comprises silicon rubber or resin.
6. The package structure of claim 2, wherein the formula of the first free-form surface is:
wherein,
x 1 is the coordinate value of a point on the first free-form surface in a first direction, y 1 Is a coordinate value of a point on the first free-form surface in a second direction, z 1 The coordinate value of the point on the first free-form surface in the third direction is shown, and the third direction, the first direction and the second direction are mutually vertical; c. C 1 Is the curvature radius of the first free-form surface; k is a radical of 1 Is a first conic constant; a. The 1 、B 1 、C 1 、D 1 、E 1 And F 1 Constant coefficients of the first free-form surface are respectively;
the formula of the second free-form surface is as follows:
wherein,
x 2 is the coordinate value of a point on the second free-form surface in the first direction, y 2 Is a coordinate value of a point on the second free-form surface in a second direction, z 2 A coordinate value of a point on the second free-form surface in a third direction; c. C 2 Is the curvature radius of the second free-form surface; k is a radical of 2 Is a second conic constant; a. The 2 、B 2 、C 2 、D 2 、E 2 And F 2 Respectively, constant coefficients of the second free-form surface.
7. The package structure of claim 1, wherein the VCSEL chip is connected to the substrate by a wire.
8. The package structure of claim 1, wherein the VCSEL chip includes a first lead and a second lead;
the first pin and the second pin are positioned on the surface of the substrate close to the VCSEL chip and are electrically connected with the substrate.
9. A method for manufacturing a VCSEL chip packaging structure is characterized by comprising the following steps:
providing a substrate;
disposing a VCSEL chip to one side of the substrate;
forming a first packaging layer, wherein the first packaging layer is positioned on one side of the VCSEL chip far away from the substrate and covers the VCSEL chip;
forming a second encapsulation layer, wherein the refractive index of the first encapsulation layer and the refractive index of the second encapsulation layer are both greater than 1; the second packaging layer is positioned on one side of the first packaging layer, which is far away from the VCSEL chip, and covers the first packaging layer; when the refractive index of the first packaging layer is smaller than that of the second packaging layer, the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a convex surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a concave surface, or the surface, away from the VCSEL chip, of the light emitting area of the first packaging layer is a concave surface, and the surface, away from the first packaging layer, of the light emitting area of the second packaging layer is a convex surface; when the refractive index of the first packaging layer is larger than that of the second packaging layer, the surface of the light emitting area of the first packaging layer, which is far away from the VCSEL chip, and the surface of the light emitting area of the second packaging layer, which is far away from the first packaging layer, are both convex surfaces or concave surfaces.
10. The method according to claim 9, wherein the forming the first encapsulation layer specifically comprises:
forming a first packaging layer by adopting an injection molding process;
the forming of the second encapsulation layer specifically includes:
and forming a second packaging layer by adopting an injection molding process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310093586.XA CN115954756A (en) | 2023-02-09 | 2023-02-09 | VCSEL chip packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310093586.XA CN115954756A (en) | 2023-02-09 | 2023-02-09 | VCSEL chip packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115954756A true CN115954756A (en) | 2023-04-11 |
Family
ID=87297936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310093586.XA Pending CN115954756A (en) | 2023-02-09 | 2023-02-09 | VCSEL chip packaging structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115954756A (en) |
-
2023
- 2023-02-09 CN CN202310093586.XA patent/CN115954756A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6860621B2 (en) | LED module and methods for producing and using the module | |
| US9581772B2 (en) | Optical electrical module used for optical communication | |
| CN102692684B (en) | Photoelectric module | |
| US20110211790A1 (en) | Optical coupler and producing method thereof | |
| US20050263784A1 (en) | Collimating light from an LED device | |
| KR20070070241A (en) | High brightness led package | |
| WO2023025223A1 (en) | Grating coupler and optical device | |
| JPH0918058A (en) | Semiconductor light-emitting device | |
| JP3532456B2 (en) | Semiconductor device having optical signal input / output mechanism | |
| CN104134742B (en) | Light emitting device package and lighting device | |
| CN107367802A (en) | Optical module | |
| CN104466675B (en) | Narrow angle of divergence ridge waveguide semiconductor laser | |
| JPH06151972A (en) | Lens-on-chip luminescent device and manufacture thereof | |
| CN115954756A (en) | VCSEL chip packaging structure and manufacturing method thereof | |
| CN217823696U (en) | Square facula laser module | |
| CN104282830A (en) | Light-emitting diode module | |
| US10847503B2 (en) | Optoelectronic component and method for producing an optoelectronic component | |
| JP5001854B2 (en) | LENS, LASER DEVICE, AND LASER DEVICE MANUFACTURING METHOD | |
| TW201904093A (en) | Light emitting diode package structure, method for making the same, and flat panel light source having the same | |
| CN221406205U (en) | Cylindrical lens group for efficiently shaping elliptical light spots and laser system | |
| CN112817099B (en) | Silicon photon packaging structure | |
| CN219389492U (en) | Lens and light-emitting device thereof | |
| CN115241735A (en) | Square light spot laser module and parameter determination method thereof | |
| US9385286B2 (en) | Optoelectronic component | |
| CN219917900U (en) | Vertical optical cavity surface emitting laser with wafer-level integrated optical micro lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |