CN115942643A - Rigid-flex board and manufacturing method and equipment thereof - Google Patents
Rigid-flex board and manufacturing method and equipment thereof Download PDFInfo
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- CN115942643A CN115942643A CN202110902539.6A CN202110902539A CN115942643A CN 115942643 A CN115942643 A CN 115942643A CN 202110902539 A CN202110902539 A CN 202110902539A CN 115942643 A CN115942643 A CN 115942643A
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Abstract
The application relates to the technical field of papermaking, and particularly discloses a rigid-flex board and a manufacturing method and equipment thereof, wherein the manufacturing method of the rigid-flex board comprises the following steps: providing a flexible circuit board; arranging a bonding layer on one side of the flexible circuit board, wherein a hard board embedding area is arranged on the bonding layer; attaching the hard circuit board and the flexible circuit board, wherein part of the hard circuit board is fixed in the hard board embedding area; forming a step through hole on the flexible circuit board and the bonding layer to expose part of the hard circuit board in the hard board embedding area; and at least arranging a soldering material in the step through hole and carrying out curing treatment to realize soldering interconnection of the flexible circuit board and the rigid circuit board so as to obtain the rigid-flexible combined board. Through the mode, the process manufacturing flow can be simplified, the condition that the electrical interconnection is influenced due to the fact that interlayer separation is caused by incomplete drilling dirt removal possibly existing in the prior art is avoided, the product manufacturing difficulty is reduced, the product reliability is higher, and a new soft and hard combined board scheme is obtained.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a rigid-flex board and a manufacturing method and equipment thereof.
Background
The rigid-flex board refers to the combination of the FPC and the PCB, combines the common characteristics of the flexible board and the rigid board, and has the rigidity and the smoothness of the rigid board and the bending resistance of the flexible circuit board. Therefore, the rigid-flex board is widely used in the fields of military industry and aerospace equipment, and is gradually popularized in the fields of electronic products such as medical treatment, automobiles, household appliances and the like at present.
In a long-term research and development process, the inventor finds that the interconnection among different layers of the traditional hard circuit board structure is realized by electroplating copper in holes, but the soft board and the hard board are different in material and physical property, and when the soft board and the hard board are subjected to pressing, drilling stain removal, electroplating and the like, the interlayer separation caused by incomplete drilling stain removal is possible to influence the electrical interconnection.
Disclosure of Invention
Based on this, the application provides a rigid-flex board and a manufacturing method and equipment thereof, so as to solve the problems in the prior art.
In order to solve the technical problem, the application adopts a technical scheme that: a manufacturing method of a rigid-flex board is provided, which comprises the following steps: providing a flexible circuit board; arranging a bonding layer on one side of the flexible circuit board, wherein a hard board embedding area is arranged on the bonding layer; attaching the hard circuit board and the flexible circuit board, wherein part of the hard circuit board is fixed in the hard board embedding area; forming a step through hole on the flexible circuit board and the bonding layer to expose part of the hard circuit board in the hard board embedding area; and at least arranging a soldering material in the step through hole and carrying out curing treatment to realize soldering interconnection of the flexible circuit board and the rigid circuit board so as to obtain the rigid-flexible combined board.
The flexible circuit board comprises a first circuit layer, a flexible dielectric layer and a second circuit layer which are arranged in a stacked mode, and the hard circuit board comprises a third circuit layer and a hard insulating layer which are arranged in a stacked mode.
Wherein, set up the tie coat in flexible circuit board one side, wherein, be provided with the step in hardboard embedding area on the tie coat, include: a bonding layer is arranged on one side, away from the flexible medium layer, of the second circuit layer; and a hard board embedded area is arranged on one side of the bonding layer, which is deviated from the second circuit layer.
Wherein, laminate rigid circuit board and flexible circuit board, wherein, the step in the hard board embedding area is fixed to some rigid circuit board includes: and arranging the hard insulating layer on one side of the bonding layer, which is far away from the second circuit layer, and fixing the third circuit layer in the hard board embedded area.
Wherein, form the step perforating hole on flexible circuit board and tie coat to the step of the partial hard circuit board in the hard board embedding area is buried to the naked exposure, includes: drilling a first step through hole with the diameter of H1 and the depth reaching the surface of the flexible medium layer on one side of the first circuit layer by adopting a laser drilling process, drilling a second step through hole with the diameter of H2 and the depth reaching the surface of the second circuit layer on one side of the flexible medium layer, drilling a third step through hole with the diameter of H3 and the depth reaching the surface of the bonding layer on one side of the second circuit layer, and drilling a fourth step through hole with the diameter of H4 and the depth reaching the surface of the third circuit layer on one side of the bonding layer to form a step through hole; wherein H1 is more than H2 and more than H3, and H3 is more than or equal to H4.
Wherein, set up the soldering tin material at least and carry out solidification treatment in the via hole to realize the step of flexible circuit board and rigid circuit board soldering tin interconnection, include: and arranging a soldering material on the first circuit layer and in the step through hole and carrying out curing treatment, wherein the soldering material is connected with the second bonding pad and the first bonding pad.
In order to solve the technical problem, the application adopts a technical scheme that: a rigid-flex board is provided, comprising: the flexible circuit board comprises a first circuit layer, a flexible dielectric layer and a second circuit layer which are arranged in a stacked mode; the bonding layer is arranged on one side of the flexible circuit board, and a hard board embedded area is arranged on the bonding layer; the hard circuit board comprises a third circuit layer and a hard insulating layer which are arranged in a stacked mode, the hard insulating layer is arranged on one side, away from the flexible circuit board, of the bonding layer, and the third circuit layer is fixed in the hard board embedding area; step through holes are formed in the flexible circuit board and the bonding layer, soldering materials are filled in the step through holes, and the soldering materials are connected with the first circuit layer and the third circuit layer.
The diameter of the first step through hole penetrating through the first circuit layer is larger than that of the second step through hole penetrating through the flexible dielectric layer, and the diameter of the second step through hole penetrating through the flexible dielectric layer is larger than that of the third step through hole penetrating through the second circuit layer and the bonding layer.
Wherein the minimum diameter of the step through hole is 50-300 μm; the thickness of the flexible medium layer is less than or equal to 75 mu m; the thickness of the adhesive layer is 10-75 μm.
In order to solve the technical problem, the application adopts a technical scheme that: the utility model provides an equipment, includes the body, locates the inside mainboard of body and as aforementioned soft or hard combination board, soft or hard combination board locates inside the body to be connected with the mainboard electricity.
Be different from the vacuum couch roll that prior art adopted, in this application flexible circuit board with form the step perforating hole on the tie coat, with the naked part in the hardboard buries the district hard circuit board, the rethread sets up soldering tin material, realizes flexible circuit board with hard circuit board soldering tin interconnection can simplify the technology manufacturing procedure, has avoidd that probably exists among the prior art because of removing the drill dirt thoroughly and cause the interbedded separation, influences the circumstances of electrical interconnection for the product preparation degree of difficulty reduces, and the product reliability is higher, obtains a new soft and hard combination board scheme.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
fig. 1 is a schematic flow chart illustrating a manufacturing method of a rigid-flex board according to a first embodiment of the present application;
fig. 2 is a schematic flow chart illustrating a manufacturing method of a rigid-flex board according to a second embodiment of the present application;
fig. 3 is a schematic flow chart illustrating a manufacturing method of a rigid-flex board according to a third embodiment of the present application;
fig. 4 is a schematic flow chart illustrating a manufacturing method of a rigid-flex board according to a fourth embodiment of the present application;
fig. 5 is a schematic flow chart illustrating a manufacturing method of a rigid-flex board according to a fifth embodiment of the present application;
fig. 6 is a schematic structural diagram illustrating a rigid-flex board provided in a sixth embodiment of the present application;
fig. 7 is a schematic structural diagram of a double-layer circuit board of the rigid-flex circuit board provided by the present application;
fig. 8 shows a schematic structural diagram of a dual-layer rigid circuit board of the rigid-flex circuit board provided by the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The technical solution of the present application will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
As shown in fig. 1, the method for manufacturing a rigid-flex board provided by the present application includes the following steps:
s10: a flexible circuit board is provided.
The flexible circuit board can be a single-layer board, a double-layer board and a multi-layer board. Fig. 7 is a schematic structural diagram of a double-layer flexible circuit board. The double-layer flexible circuit board comprises a first cover film 701, a first flexible printed circuit board conducting layer 702, a flexible printed circuit board insulating layer 703, a second flexible printed circuit board conducting layer 704 and a second cover film 705 from top to bottom in sequence. The conduction between the first flexible printed circuit board 702 and the second flexible printed circuit board 704 can be realized by a conductive step through hole or a conductive blind hole. The conductive step through hole and the conductive blind hole can conduct electricity because a layer of copper film is formed on the inner walls of the step through hole and the blind hole and the opening edge positions of the step through hole and the blind hole by a chemical copper deposition or electrochemical copper plating method.
In addition, taking a double-layer flexible circuit board as an example, the forming process can be as follows:
firstly, processing a flexible circuit board substrate into a flexible circuit board substrate with a preset size. The flexible circuit board substrate is a thin sheet of Polyimide (PI) with copper covered on both sides. That is, the first flexible printed circuit board 702 and the second flexible printed circuit board 704 may be made of copper, and the flexible printed circuit board 703 may be made of polyimide.
Then, a conductive step through hole or a conductive blind hole is formed by processing a conductive step through hole and plating copper on a flexible circuit board substrate with a preset size, so that conduction between the first flexible board conductive layer 702 and the second flexible board conductive layer 704 is realized.
Thirdly, a required circuit pattern is manufactured on the surface of the flexible circuit board substrate with preset size (namely on the first flexible printed circuit board conductive layer 702 and the second flexible printed circuit board conductive layer 704) through a patterning process. The processing of the circuit pattern can be formed by etching.
Finally, a cover film or a copper cover film is laminated on the surface of the flexible printed circuit board substrate (i.e. the surfaces of the first flexible printed circuit board conductive layer 702 and the second flexible printed circuit board conductive layer 704) on which the circuit pattern is formed, so as to form a complete flexible printed circuit board.
In addition, it should be noted that the above process is a manufacturing process of a double-layer flexible circuit board, and for a manufacturing process of a multi-layer flexible circuit board, the manufacturing process may refer to the above method, but the manufacturing process of the multi-layer flexible circuit board additionally requires that a manufactured single-layer or double-layer flexible circuit board is pressed to realize a multi-layer structure.
S20: a bonding layer is arranged on one side of the flexible circuit board, wherein a hard board embedding area is arranged on the bonding layer.
S30: and attaching the hard circuit board and the flexible circuit board, wherein part of the hard circuit board is fixed in the hard board embedding area.
The hard circuit board can be a single-layer board, a double-layer board and a multi-layer board (wherein, the number of the central conducting layers of the hard circuit board is not counted). Fig. 8 is a schematic structural diagram of a dual-layer rigid circuit board. The double-layer hard circuit board sequentially comprises a first hard board conducting layer 801, a first hard board insulating layer 802, a central conducting layer 803, a second hard board insulating layer 804 and a second hard board conducting layer 805 from top to bottom. The conduction among the first hard board conductive layer 801, the central conductive layer 803 and the second hard board conductive layer 805 can be realized through a conductive step through hole or a conductive blind hole.
In addition, the forming process for the rigid circuit board may be as follows:
first, the base material of the central conductive layer is processed to a predetermined size.
Then, a first hard sheet insulating layer 802 and a second hard sheet insulating layer 804 are laid on both surfaces of a central conductive layer base material of a preset size, respectively. Specifically, for example, prepregs may be respectively laminated on two surfaces of a central conductive layer substrate with a preset size, that is, the first hard board insulation layer 802 and the second hard board insulation layer 804 may both be composed of prepregs.
And thirdly, respectively paving conductive layers on the surfaces of the first hard board insulating layer 802 and the second hard board insulating layer 804 to form a first hard board conductive layer 801 and a second hard board conductive layer 805, thus obtaining the preprocessed hard circuit board. Specifically, for example, copper may be covered on the surfaces of the first hard board insulation layer 802 and the second hard board insulation layer 804, respectively, that is, the first hard board conductive layer 801 and the second hard board conductive layer 805 may both be made of copper.
And thirdly, processing a conductive step through hole or a conductive blind hole on the preprocessed hard circuit board so as to realize the conduction among the first hard board conductive layer 801, the central conductive layer 803 and the second hard board conductive layer 805.
Finally, a required circuit pattern is made on the surface of the preprocessed hard circuit board (i.e. on the first hard board conductive layer 801 and the second hard board conductive layer 805) through a patterning process, so as to obtain the hard circuit board which needs to be embedded into the hard board embedding region on the flexible circuit board. The processing of the circuit pattern may be formed by etching.
In addition, it should be noted that the above process is implemented by the manufacturing process of the double-layer rigid circuit board, and for the manufacturing process of the multi-layer rigid circuit board, the manufacturing process may also refer to the above method, but the manufacturing process of the multi-layer rigid circuit board additionally requires that the manufactured single-layer or double-layer rigid circuit board is pressed to implement a multi-layer structure.
S40: a step through hole is formed in the flexible circuit board and the adhesive layer to expose a portion of the rigid circuit board in the hard board embedding region.
S50: and at least arranging a soldering material in the step through hole and carrying out curing treatment to realize soldering interconnection of the flexible circuit board and the rigid circuit board so as to obtain the rigid-flexible combined board.
In one embodiment, the flexible circuit board comprises a first circuit layer, a flexible dielectric layer and a second circuit layer which are arranged in a stacked mode, and the rigid circuit board comprises a third circuit layer and a rigid insulating layer which are arranged in a stacked mode.
Specifically, the flexible dielectric layer may be made of polyimide or Polyethylene terephthalate (PET), so as to dispose the copper foil circuit on the flexible dielectric layer, and the flexible dielectric layer can provide an insulating environment for the copper foil circuit. Preferably, the thickness of the flexible dielectric layer may be 75 μm or less. It should be noted that the flexible dielectric layer is flexible, which facilitates the flexible circuit board to deform, and further facilitates the rigid-flexible board to connect to the external device.
The hard insulating layer is made of polyethylene and has insulating property, so that the third circuit layer can be etched on the hard insulating layer. The rigidity of the hard insulating layer is utilized, so that the strength of the rigid-flexible printed circuit board is increased, and the rigid-flexible printed circuit board is not easy to bend. The third circuit layer can be formed by etching copper foil. The third circuit layer can be provided with signal traces or grounding traces.
In some embodiments of the present application, the first circuit layer and the flexible dielectric layer, and the flexible dielectric layer and the second circuit layer in the flexible circuit board may be bonded, for example, by an adhesive, and the first circuit layer or the second circuit layer may be divided into a ground layer or a non-ground layer. The binder may be, for example, a prepreg, a nonconductive adhesive, a resin, or a parylene, or other binder.
In some embodiments of the present application, the hard insulating layer in the hard circuit board and the third circuit layer may be bonded by an adhesive, for example, the third circuit layer may be a geoelectrical layer or a non-geoelectrical layer, wherein the adhesive may be a prepreg, a non-conductive adhesive, a resin, or a poly-p-phthalic plastic or other adhesive, for example.
As shown in fig. 2, in one embodiment, step S20 includes the following steps:
s21: and a bonding layer is arranged on one side of the second circuit layer, which is deviated from the flexible medium layer.
S22: and a hard board embedding area is arranged on one side of the bonding layer, which is deviated from the second circuit layer.
Specifically, a laser cutting technique or a die punching technique may be used to remove a predetermined region of the adhesive layer, thereby forming a hard plate buried region.
As shown in fig. 3, in one embodiment, step S30 includes the following steps:
s31: and arranging the hard insulating layer on one side of the bonding layer, which is far away from the second circuit layer, and fixing the third circuit layer in the hard board embedded area.
As shown in fig. 4, in one embodiment, step S40 includes the following steps:
s41: and removing part of the first circuit layer, part of the flexible dielectric layer, part of the second circuit layer and part of the bonding layer at the hard board embedded region by laser to form a step through hole.
Specifically, a laser drilling process is adopted for drilling, a first step through hole with the diameter of H1 and the depth reaching the surface of the flexible dielectric layer is drilled at one side of the first circuit layer, a second step through hole with the diameter of H2 and the depth reaching the surface of the second circuit layer is drilled at one side of the flexible dielectric layer, a third step through hole with the diameter of H3 and the depth reaching the surface of the bonding layer is drilled at one side of the second circuit layer, and a fourth step through hole with the diameter of H4 and the depth reaching the surface of the third circuit layer is drilled at one side of the bonding layer, so that a step through hole is formed. Wherein H1 is more than H2 and more than H3, and H3 is more than or equal to H4.
Therefore, the laser drilling process is adopted, so that the following technical effects are achieved:
1. the precision of the step through hole can be improved to be within +/-50 mu m;
2. the thickness of the plate is not limited, and a step through hole can be formed on the rigid circuit board with the thickness of less than 0.3 mm;
3. metal can be reserved at the bottom of the step through hole, so that better heat dissipation performance and the like can be provided;
4. the cost is low and the realization is easy.
As shown in fig. 5, in one embodiment, step S50 includes the following steps:
s51: and arranging a soldering tin material on the first circuit layer and in the step through hole, and curing the soldering tin material, wherein the soldering tin material is connected with the second bonding pad and the first bonding pad.
As shown in fig. 6, the present application proposes a rigid-flex board 10, where the rigid-flex board 10 includes: a flexible circuit board 11, an adhesive layer 12, and a rigid circuit board 13.
The flexible circuit board 11 includes a first circuit layer 111, a flexible dielectric layer 112, and a second circuit layer 113 stacked together.
Specifically, the flexible dielectric layer 112 may be made of polyimide (polyimide) or Polyethylene terephthalate (PET), so as to dispose a copper foil circuit on the flexible dielectric layer 112, and the flexible dielectric layer 112 can provide an insulating environment for the copper foil circuit. Preferably, the thickness of the flexible dielectric layer 112 may be 75 μm or less. It should be noted that the flexible dielectric layer 112 is flexible, which facilitates the flexible circuit board 11 to deform, and further facilitates the rigid-flex board 10 to connect to an external device.
In some embodiments of the present application, the first circuit layer 111 or the second circuit layer 113 in the flexible circuit board 11 may be divided into a ground layer or a non-ground layer by bonding between the first circuit layer 111 and the flexible dielectric layer 112, and between the flexible dielectric layer 112 and the second circuit layer 113, for example, by using an adhesive. The binder may be, for example, a prepreg, a nonconductive adhesive, a resin, or a parylene or other binder.
Wherein, tie coat 12 is set up in flexible circuit board 11 one side, is provided with hardboard embedding area 120 on tie coat 12.
Specifically, the adhesive layer 12 is a prepreg, a nonconductive adhesive, a resin, or a parylene.
The hard circuit board 13 includes a third circuit layer 131 and a hard insulating layer 132 stacked together.
Specifically, the hard insulating layer 132 is made of polyethylene, and the hard insulating layer 132 has insulating properties so that the third wiring layer 131 is etched in the hard insulating layer 132. The rigidity of the hard insulating layer 132 increases the strength of the rigid-flex board 10, so that the rigid-flex board 10 is not easily bent. The third circuit layer 131 may be a copper foil formed by an etching process. The third circuit layer 131 may be provided with a signal trace or a ground trace.
The hard insulating layer 132 is disposed on a side of the adhesive layer 12 facing away from the flexible circuit board 11, and the third circuit layer 131 is fixed in the hard board embedded region 120.
Specifically, the rigid circuit board 13 is fixed to the flexible circuit board 11 by the adhesive layer 12, so that the rigidity of the flexible circuit board 11 is improved, and the electronic components are fixed to the rigid circuit board 13 and the rigidity of the rigid circuit board 13 is utilized, so that the flexible circuit board 11 is conveniently assembled in the device.
The flexible printed circuit 11 and the adhesive layer 12 have stepped through holes, and the stepped through holes are filled with solder material, which connects the first circuit layer 111 and the third circuit layer 131.
The solder material can flow to the back of the rigid circuit board 13 through the step through hole, so that the solder material is not easy to fall off from the rigid circuit board 13, and the use reliability of the product is improved. Preferably, the step through hole is formed by laser processing, which has advantages of high processing speed and high precision.
In one embodiment, the first step through hole penetrating the first circuit layer 111 has a larger diameter than the second step through hole penetrating the flexible dielectric layer 112, and the second step through hole penetrating the flexible dielectric layer 112 has a larger diameter than the third step through hole penetrating the second circuit layer 113 and the adhesive layer 12.
Specifically, a laser drilling process is used to drill a first step through hole with a diameter of H1 and a depth reaching the surface of the flexible dielectric layer 112 on the side of the first wiring layer 111, a second step through hole with a diameter of H2 and a depth reaching the surface of the second wiring layer 113 on the side of the flexible dielectric layer 112, a third step through hole with a diameter of H3 and a depth reaching the surface of the adhesive layer 12 on the side of the second wiring layer 113, and a fourth step through hole with a diameter of H4 and a depth reaching the surface of the third wiring layer 131 on the side of the adhesive layer 12, thereby forming a step through hole. Wherein H1 is more than H2 and more than H3, and H3 is more than or equal to H4.
Wherein the minimum diameter of the step through hole is 50-300 μm. The thickness of the flexible dielectric layer 112 is 75 μm or less. The thickness of the adhesive layer 12 is 10 μm to 75 μm.
The application provides an equipment, including the body, locate the inside mainboard of body and as aforementioned soft or hard combination board, the soft or hard combination board is located inside the body to be connected with the mainboard electricity. The device can be a device in the fields of household appliances, consumer electronics, automobiles, industrial products, electric power, medical treatment, aerospace, communication networks, military industry and the like.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (10)
1. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
providing a flexible circuit board;
arranging a bonding layer on one side of the flexible circuit board, wherein a hard board embedding area is arranged on the bonding layer;
attaching a hard circuit board to the flexible circuit board, wherein part of the hard circuit board is fixed in the hard board embedding area;
forming step through holes on the flexible circuit board and the bonding layer to expose part of the hard circuit board in the hard board embedding area;
and at least arranging a soldering tin material in the step through hole and carrying out curing treatment to realize soldering tin interconnection between the flexible circuit board and the rigid circuit board so as to obtain the rigid-flexible combined board.
2. The method of claim 1, wherein the flexible circuit board comprises a first circuit layer, a flexible dielectric layer and a second circuit layer which are arranged in a stacked manner, and the rigid circuit board comprises a third circuit layer and a rigid insulating layer which are arranged in a stacked manner.
3. The method of claim 2, wherein providing an adhesive layer on a side of the flexible circuit board, wherein providing a hard plate embedding region on the adhesive layer comprises:
arranging the bonding layer on one side of the second circuit layer, which is far away from the flexible medium layer;
and arranging a hard board embedding area on one side of the bonding layer, which is deviated from the second circuit layer.
4. The method of claim 2, wherein the step of attaching the rigid circuit board to the flexible circuit board, wherein the step of fixing a portion of the rigid circuit board in the embedded region of the rigid circuit board comprises:
and arranging the hard insulating layer on one side of the bonding layer, which is far away from the second circuit layer, and fixing the third circuit layer in the hard board embedding area.
5. The method of claim 2, wherein the step of forming a step through hole on the flexible circuit board and the adhesive layer to expose a portion of the rigid circuit board in the rigid board embedding region comprises:
drilling holes by adopting a laser drilling process, drilling a first step through hole with the diameter of H1 and the depth reaching the surface of the flexible medium layer on one side of the first circuit layer, drilling a second step through hole with the diameter of H2 and the depth reaching the surface of the second circuit layer on one side of the flexible medium layer, drilling a third step through hole with the diameter of H3 and the depth reaching the surface of the bonding layer on one side of the second circuit layer, and drilling a fourth step through hole with the diameter of H4 and the depth reaching the surface of the third circuit layer on one side of the bonding layer to form the step through hole;
wherein H1 is more than H2 and more than H3, and H3 is more than or equal to H4.
6. The method as claimed in claim 2, wherein the step of disposing at least solder material in the via hole and curing the solder material to solder interconnect the flexible circuit board and the rigid circuit board comprises:
and arranging the soldering tin material on the first circuit layer and in the step through hole, and curing the soldering tin material, wherein the soldering tin material is connected with the second bonding pad and the first bonding pad.
7. A rigid-flex board, comprising:
the flexible circuit board comprises a first circuit layer, a flexible dielectric layer and a second circuit layer which are arranged in a stacked mode;
the bonding layer is arranged on one side of the flexible circuit board, and a hard board embedding area is arranged on the bonding layer;
the hard circuit board comprises a third circuit layer and a hard insulating layer which are arranged in a stacked mode, the hard insulating layer is arranged on one side, away from the flexible circuit board, of the bonding layer, and the third circuit layer is fixed in the hard board embedding area;
step through holes are formed in the flexible circuit board and the bonding layer, solder materials are filled in the step through holes, and the solder materials are connected with the first circuit layer and the third circuit layer.
8. The rigid-flex board according to claim 7,
the diameter of the first step through hole penetrating through the first circuit layer is larger than that of the second step through hole penetrating through the flexible dielectric layer, and the diameter of the second step through hole penetrating through the flexible dielectric layer is larger than that of the third step through hole penetrating through the second circuit layer and the bonding layer.
9. The rigid-flex board according to claim 7,
the minimum diameter of the step through hole is 50-300 mu m;
the thickness of the flexible dielectric layer is less than or equal to 75 micrometers;
the thickness of the bonding layer is 10-75 μm.
10. An apparatus, comprising a main body, a main board disposed inside the main body, and the rigid-flex board according to any one of claims 7 to 9, wherein the rigid-flex board is disposed inside the main body and electrically connected to the main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110902539.6A CN115942643A (en) | 2021-08-06 | 2021-08-06 | Rigid-flex board and manufacturing method and equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110902539.6A CN115942643A (en) | 2021-08-06 | 2021-08-06 | Rigid-flex board and manufacturing method and equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115942643A true CN115942643A (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110902539.6A Pending CN115942643A (en) | 2021-08-06 | 2021-08-06 | Rigid-flex board and manufacturing method and equipment thereof |
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| Country | Link |
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| CN (1) | CN115942643A (en) |
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2021
- 2021-08-06 CN CN202110902539.6A patent/CN115942643A/en active Pending
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