CN115938408A - disk device - Google Patents

disk device Download PDF

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Publication number
CN115938408A
CN115938408A CN202211012212.2A CN202211012212A CN115938408A CN 115938408 A CN115938408 A CN 115938408A CN 202211012212 A CN202211012212 A CN 202211012212A CN 115938408 A CN115938408 A CN 115938408A
Authority
CN
China
Prior art keywords
hole
layer
circuit board
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211012212.2A
Other languages
Chinese (zh)
Inventor
冈野太一
石崎圣和
山本展大
德田孝太
山口隼人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2022122931A external-priority patent/JP2023033148A/en
Application filed by Toshiba Corp, Toshiba Electronic Devices and Storage Corp filed Critical Toshiba Corp
Publication of CN115938408A publication Critical patent/CN115938408A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601—Interfaces specially adapted for storage systems
    • G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
    • G06F3/0671—In-line storage system
    • G06F3/0673—Single storage device
    • G06F3/0674—Disk device
    • G06F3/0676—Magnetic disk device
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/022—Cases
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
    • G11B2220/2508—Magnetic discs
    • G11B2220/2516—Hard disks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention provides a disk device capable of suppressing contamination. A disk device according to one embodiment includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has a rigidity higher than that of the flexible printed circuit board and is mounted on the flexible printed circuit board. The flexible printed circuit board has a 1 st surface facing the electronic component with a gap therebetween, and a 2 nd surface located opposite to the 1 st surface and facing the wall, and the flexible printed circuit board is provided with a 1 st through hole, the 1 st through hole being open in the 1 st surface and the 2 nd surface and communicating with the gap. The wall is provided with a 2 nd through hole, and the 2 nd through hole penetrates through the wall and communicates with the 1 st through hole.

Description

Disk device
The present application enjoys priority of application based on Japanese patent applications 2021-138140 (application date: 8/26/2021), 2022-122931 (application date: 8/01/2022). The present application includes the entire contents of the base application by reference to the base application.
Technical Field
Embodiments of the present invention relate to a disk device.
Background
A disk device such as a hard disk drive reads and writes information from and to a magnetic disk by a magnetic head. The disk device has, for example, a flexible printed circuit board that electrically connects a controller and a magnetic head. Various electronic components are provided on the flexible printed circuit board.
The disk device is cleaned to remove substances such as flux that may contaminate the disk device. However, if there is a gap between the flexible printed circuit board and the electronic component, substances that may contaminate the disk device may remain in the gap.
Disclosure of Invention
The invention provides a disk device capable of suppressing contamination.
A disk device according to one embodiment includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The magnetic head is configured to read and write information with respect to the magnetic disk. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has a rigidity higher than that of the flexible printed circuit board, and is mounted on the flexible printed circuit board. The flexible printed circuit board has a 1 st surface facing the electronic component with a gap therebetween and a 2 nd surface located opposite to the 1 st surface and facing the wall, and the flexible printed circuit board is provided with a 1 st through hole, the 1 st through hole being open in the 1 st surface and the 2 nd surface and communicating with the gap. The wall is provided with a 2 nd through hole, and the 2 nd through hole penetrates through the wall and is communicated with the 1 st through hole.
Drawings
Fig. 1 is an exemplary perspective view showing an HDD according to embodiment 1 in an exploded manner.
Fig. 2 is an exemplary plan view schematically showing the FPC of embodiment 1.
Fig. 3 is an exemplary plan view showing a part of the 2 nd connecting part in the vicinity of the sensor of embodiment 1.
Fig. 4 is an exemplary cross-sectional view of a portion of the 2 nd connecting portion of embodiment 1 taken along line F4-F4 of fig. 3.
Fig. 5 is an exemplary plan view showing a part of the 2 nd connecting part in the vicinity of the relay connector of embodiment 1.
Fig. 6 is an exemplary cross-sectional view of a portion of the 2 nd connecting portion of embodiment 1 taken along line F6-F6 of fig. 5.
Fig. 7 is an exemplary cross-sectional view showing a part of the 2 nd connecting portion in the vicinity of the sensor of embodiment 2.
Fig. 8 is an exemplary plan view showing a part of the 2 nd connection part in the vicinity of the relay connector of embodiment 3.
Fig. 9 is an exemplary cross-sectional view of a portion of the 2 nd connecting portion of embodiment 3 taken along line F9-F9 of fig. 8.
Fig. 10 is a bottom view showing an example of the relay connector according to embodiment 3.
Detailed Description
(embodiment 1)
Hereinafter, embodiment 1 will be described with reference to fig. 1 to 6. In the present specification, the constituent elements of the embodiments and descriptions of the elements may be described by various expressions. The constituent elements and their description are examples, and are not limited by the expression of the present specification. The constituent elements can also be identified by names different from those in the present specification. Further, the constituent elements can be described by expressions different from those of the present specification.
Fig. 1 is an exemplary perspective view showing a Hard Disk Drive (HDD) 10 according to embodiment 1 in an exploded manner. The HDD10 is an example of a disk device, and may also be referred to as an electronic apparatus, a storage device, an external storage device, or a magnetic disk device. The disk device is not limited to the HDD10.
The HDD10 has a housing 11, a plurality of magnetic disks 12, a spindle motor 13, a plurality of magnetic heads 14, an actuator assembly 15, a Voice Coil Motor (VCM) 16, a ramp loading mechanism 17, a flexible printed circuit board (FPC) 18, and a Printed Circuit Board (PCB) 19.
The housing 11 has a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container made of a metal material such as an aluminum alloy, for example, and has a bottom wall 25 and a side wall 26. The bottom wall 25 is formed in a substantially rectangular (quadrangular) plate shape. The side wall 26 protrudes from the edge of the bottom wall 25. The bottom wall 25 is formed integrally with the side wall 26.
The inner cover 22 and the outer cover 23 are made of a metal material such as an aluminum alloy, for example. The inner cover 22 is mounted to the end of the side wall 26, for example, by screws. The outer cover 23 covers the inner cover 22 and is fixed hermetically to the end of the side wall 26, for example, by welding.
The interior of the housing 11 is sealed. Inside the casing 11, a magnetic disk 12, a spindle motor 13, a magnetic head 14, an actuator module 15, a VCM16, a ramp loading mechanism 17, and an FPC18 are arranged.
The inner cover 22 is provided with an air vent 22a. Further, the cover 23 is provided with an air vent 23a. After the members are attached to the inside of the base 21 and the inner cover 22 and the outer cover 23 are attached to the base 21, the air inside the housing 11 is drawn out through the air vents 22a and 23a. Further, the interior of the housing 11 is filled with a gas different from air.
The gas filled in the case 11 is, for example, a low-density gas having a density lower than that of air, an inert gas having a low reactivity, or the like. For example, the inside of the casing 11 is filled with helium gas. In addition, the inside of the housing 11 may be filled with another fluid. Further, the inside of the housing 11 may be kept at a vacuum, a low pressure close to the vacuum, or a negative pressure lower than the atmospheric pressure.
The vent opening 23a of the cover 23 is blocked by the seal 28. The seal 28 hermetically seals the vent hole 23a, and prevents the fluid filled in the housing 11 from leaking from the vent hole 23a. The inside and the outside of the housing 11 may communicate with each other.
The magnetic disk 12 is, for example, a disk having magnetic recording layers provided on the upper surface and the lower surface. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but is not limited to this example. The plurality of magnetic disks 12 are stacked at intervals.
The spindle motor 13 supports and rotates the stacked magnetic disks 12. The plurality of magnetic disks 12 are held on a boss of the spindle motor 13 by, for example, a circlip.
The magnetic head 14 records and reproduces information on and from the recording layer of the magnetic disk 12. In other words, the magnetic head 14 reads and writes information with respect to the magnetic disk 12. The magnetic head 14 is mounted on an actuator assembly 15.
The actuator unit 15 is rotatably supported by a support shaft 31, and the support shaft 31 is disposed at a position separated from the magnetic disk 12. The VCM16 rotates the actuator assembly 15 and is arranged at a desired position. The ramp loading mechanism 17 holds the magnetic head 14 at an unloading position separated from the magnetic disk 12 when the magnetic head 14 moves to the outermost circumference of the magnetic disk 12.
The actuator assembly 15 has an actuator block 35, a plurality of arms 36, and a plurality of head suspension assemblies 37. Hereinafter, the head suspension assembly 37 will be referred to as a suspension 37. The suspension 37 can also be referred to as a Head Gimbal Assembly (HGA).
The actuator block 35 is rotatably supported by the support shaft 31 via a bearing, for example. The plurality of arms 36 project from the actuator block 35 in a direction substantially orthogonal to the support shaft 31. Alternatively, the actuator assembly 15 may be divided so that the arms 36 protrude from the actuator blocks 35.
The plurality of arms 36 are arranged at intervals in the direction in which the support shaft 31 extends. The arms 36 are each formed in a plate shape that can enter between adjacent magnetic disks 12. The plurality of arms 36 extend substantially in parallel.
The actuator block 35 and the plurality of arms 36 are integrally formed of, for example, aluminum. The materials of the actuator block 35 and the arm 36 are not limited to this example.
A voice coil of the VCM16 is provided on a projection projecting from the actuator block 35 to the opposite side of the arm 36. The VCM16 has a pair of yokes, a voice coil disposed between the yokes, and a magnet provided in the yoke.
As described above, VCM16 rotates actuator assembly 15. In other words, the VCM16 integrally rotates (moves) the actuator block 35, the arm 36, and the suspension 37.
The suspensions 37 are mounted to the front end portions of the corresponding arms 36, and protrude from the arms 36. Thus, the plurality of suspensions 37 are arranged at intervals in the direction in which the support shaft 31 extends.
Each of the suspensions 37 includes a base plate 41, a load beam 42, and a flexure 43. Further, the magnetic head 14 is mounted on the front end portion of the suspension 37.
The base plate 41 and the load beam 42 are made of, for example, stainless steel. The materials of the substrate 41 and the load beam 42 are not limited to this example. The base plate 41 is formed in a plate shape and attached to the tip end portion of the arm 36. The load beam 42 is formed in a plate shape thinner than the substrate 41. The load beam 42 is attached to a front end portion of the base plate 41 and protrudes from the base plate 41.
The flexure 43 is formed in an elongated band shape. The shape of the flexure 43 is not limited to this example. The flexible member 43 is a laminated plate having a metal plate (backing layer) of stainless steel or the like, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting a plurality of wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.
A gimbal portion (elastic support portion) that is located on the load beam 42 and is displaceable is provided at one end portion of the flexure 43. The gimbal portion is provided at the front end of the suspension 37 and mounts the magnetic head 14. The other end of the flexure 43 is connected to the FPC18. Thus, the FPC18 is electrically connected to the magnetic head 14 via the wiring of the flexure 43.
The PCB19 is a rigid substrate such as a glass epoxy substrate, and is a multilayer substrate, a laminate substrate, or the like. The PCB19 is disposed outside the housing 11 and attached to the bottom wall 25 of the base 21. The PCB19 is mounted to the bottom wall 25, for example by a plurality of screws.
An interface (I/F) connector 51, a controller 52, and a relay connector 53 are mounted on the PCB19, for example. Further, other members may be mounted on the PCB 19.
The I/F connector 51 is a connector conforming to an interface standard such as Serial ATA (SATA), and is connected to an I/F connector of a host computer. The HDD10 receives power supply from a host computer via the I/F connector 51, and transmits and receives various data to and from the host computer.
The controller 52 is, for example, a system on chip (SoC) having a read/write channel (RWC), a Hard Disk Controller (HDC), and a processor. Additionally, the RWC, the HDC, and the processor may be separate components.
The processor of the controller 52 is, for example, a CPU (Central Processing Unit). The processor controls the entire HDD10, for example, according to firmware stored in the ROM in advance. For example, the processor loads the firmware of the ROM into the RAM, and performs control of the head 14, RWC, HDC, and other parts in accordance with the loaded firmware.
The relay connector 53 is electrically connected to various members disposed inside the housing 11, for example, by a connector provided on the bottom wall 25. Thus, the PCB19 is electrically connected to the spindle motor 13, the magnetic head 14, the actuator module 15, the VCM16, and the FPC18 disposed inside the housing 11.
Fig. 2 is an exemplary plan view schematically showing the FPC18 of embodiment 1. As shown in fig. 2, the FPC18 is formed into a substantially L-shaped band shape in a natural state detached from other members and no external force is applied. The shape of the FPC18 is not limited to this example. The FPC18 has a 1 st connection portion 61, a 2 nd connection portion 62, and an intermediate portion 63.
The 1 st connection portion 61 is provided at one end portion of the FPC18 in the direction in which the FPC18 extends, for example. The 1 st connecting portion 61 is attached to the actuator block 35 by, for example, a screw. The 1 st connection portion 61 is electrically connected to the VCM16 and the flexure 43.
The 2 nd connecting portion 62 is provided, for example, at the other end portion of the FPC18 in the direction in which the FPC18 extends. The 2 nd connecting portion 62 is attached to the bottom wall 25 by, for example, a screw. The 2 nd connecting portion 62 is electrically connected to the PCB19, for example, by a connector provided on the bottom wall 25.
The intermediate portion 63 is disposed between the 1 st connecting portion 61 and the 2 nd connecting portion 62. The intermediate portion 63 extends in a band shape and flexes between the 1 st connecting portion 61 and the 2 nd connecting portion 62 in accordance with the rotation of the actuator block 35.
As shown in the drawings, in the present specification, the X axis, the Y axis, and the Z axis are defined for convenience. The X, Y and Z axes are mutually orthogonal. The X-axis is provided along the width of the intermediate portion 63 in the natural state. The Y-axis is provided along the length of the intermediate portion 63 in the natural state. The Z-axis is provided along the thickness of the FPC18 in the natural state.
In the present specification, the X direction, the Y direction, and the Z direction are defined. The X direction is a direction along the X axis, and includes a + X direction indicated by an arrow on the X axis and a-X direction opposite to the arrow on the X axis. The Y direction is a direction along the Y axis, and includes a + Y direction indicated by an arrow on the Y axis and a-Y direction opposite to the arrow on the Y axis. The Z direction is a direction along the Z axis, and includes a + Z direction indicated by an arrow on the Z axis and a-Z direction opposite to the arrow on the Z axis.
The 1 st connecting portion 61 is connected to an end portion of the intermediate portion 63 in the + Y direction, and extends from the end portion in the + Y direction. The 2 nd connecting portion 62 is connected to an end portion of the intermediate portion 63 in the-Y direction and extends from the end portion in the + X direction. The 1 st connection portion 61 and the 2 nd connection portion 62 are not limited to this example.
HDD10 also has a plurality of preamplifiers 65, relay connectors 66, sensors 67, and a plurality of reinforcing plates 68. The relay connector 66 and the sensor 67 are examples of electronic components. The reinforcing plate 68 is an example of a wall.
Preamplifier 65 is mounted on connection 1 st portion 61. The preamplifier 65 is electrically connected to the flexure 43 via, for example, the wiring and the pad of the FPC18. The preamplifier 65 is electrically connected to the magnetic head 14 via the flexure 43. The preamplifier 65 amplifies the write signal to transmit to the magnetic head 14, and amplifies the read signal received from the magnetic head 14.
The relay connector 66 and the sensor 67 are mounted on the 2 nd connecting portion 62. The relay connector 66 is electrically connected to the relay connector 53 of the PCB19, for example, by a connector provided on the bottom wall 25. Thereby, the 2 nd connecting portion 62 is connected to the PCB 19. The relay connector 66 may be directly connected to the relay connector 53 of the PCB 19. The sensor 67 detects, for example, humidity or air pressure inside the housing 11. The sensor 67 is not limited to this example.
The reinforcing plate 68 is made of metal such as aluminum or synthetic resin, and is formed in a plate shape. The reinforcing plate 68 is not limited to this example. The plurality of reinforcing plates 68 are attached to the 1 st connecting part 61 and the 2 nd connecting part 62.
The stiffener 68 has higher rigidity than the FPC18. Therefore, the reinforcing plate 68 improves the rigidity of the 1 st connecting portion 61 and the 2 nd connecting portion 62. The intermediate portion 63 is not attached to the reinforcing plate 68 but can be flexed.
Fig. 3 is an exemplary plan view showing a part of the 2 nd connecting part 62 in the vicinity of the sensor 67 of embodiment 1. Fig. 4 is an exemplary cross-sectional view of a portion of the 2 nd connecting portion 62 of embodiment 1, taken along line F4-F4 of fig. 3.
As shown in fig. 4, the FPC18 has a mounting surface 71 and a back surface 72. The back surface 72 is an example of the 2 nd surface. The mounting surface 71 is one surface of the FPC18. The preamplifier 65, the relay connector 66, and the sensor 67 are mounted on the mounting surface 71. Therefore, the mounting surface 71 faces the preamplifier 65, the relay connector 66, and the sensor 67. The back surface 72 is located opposite to the mounting surface 71. The back 72 faces the stiffener plate 68.
The FPC18 has a base layer 75, a conductive layer 76, and a cover layer 77. The base layer 75 is an example of the 1 st layer. The conductive layer 76 is an example of the layer 3. The cover layer 77 is an example of the 2 nd layer.
The base layer 75 is made of an insulating material such as polyimide, for example, and has insulating properties. In the case where the FPC18 is a multilayer FPC, the base layer 75 may have a plurality of insulating layers and a plurality of conductive layers.
The base layer 75 has an upper surface 75a and a lower surface 75b. Note that the upper and lower portions in this specification are for convenience of description with reference to the vertical direction in fig. 4, and the direction, position, and other conditions are not limited. The upper surface 75a is an example of the 1 st surface. The lower surface 75b is an example of the 2 nd surface.
The upper surface 75a is the surface of the base layer 75 facing the + Z direction. Lower surface 75b is located opposite upper surface 75a and is the surface of base layer 75 that faces in the-Z direction. The back 72 of the FPC18 includes a lower surface 75b.
The conductive layer 76 is made of a conductive material such as copper, and has conductivity. The conductive layer 76 is disposed on the upper surface 75a of the base layer 75. An adhesive layer may be provided between conductive layer 76 and upper surface 75a.
As shown in fig. 3, the conductive layer 76 has a plurality of pads 81 and a plurality of wirings 82. The pad 81 is an example of the 1 st terminal, and may be referred to as a land or an electrode. The pads 81 and the wirings 82 are provided on the upper surface 75a of the base layer 75.
The sensor 67 is electrically connected to the pad 81. The wiring 82 extends from the pad 81, and electrically connects the pad 81 to the relay connector 66, for example. The wiring 82 may be connected to another wiring, a via hole, a ground, or another conductor.
The capping layer 77 covers at least a portion of the upper surface 75a of the base layer 75 and at least a portion of the conductive layer 76. Thus, the conductive layer 76 is located between the base layer 75 and the capping layer 77. For example, the cover layer 77 covers a part of the pad 81 and the wiring 82. As shown in fig. 4, the cover layer 77 has a lower surface 77a and an upper surface 77b. The upper surface 77b is an example of the 3 rd surface.
The lower surface 77a is the surface of the cover layer 77 facing in the-Z direction. The lower surface 77a faces the upper surface 75a of the base layer 75. The upper surface 77b is located on the opposite side of the lower surface 77a, and is the surface of the cover layer 77 facing the + Z direction. The upper surface 77b forms a surface of the FPC18. Therefore, the mounting surface 71 of the FPC18 includes the upper surface 77b of the coverlay 77.
The cover layer 77 includes a cover film 85 and an adhesive 86. The cover film 85 is made of an insulating material such as polyimide. The adhesive 86 is made of, for example, an insulating adhesive. Therefore, the cover layer 77 has insulation properties. In other words, the resistance of the base layer 75 and the resistance of the cap layer 77 are higher than the resistance of the conductive layer 76.
The adhesive 86 is interposed between the cover film 85 and the upper surface 75a of the base layer 75 and the conductive layer 76. Adhesive 86 bonds cover film 85 to upper surface 75a of base layer 75 and conductive layer 76.
The cover layer 77 is provided with an exposure hole 87. The exposure hole 87 is an example of the 3 rd through hole and the exposure hole. The exposure hole 87 penetrates the cover layer 77 substantially in the Z direction, and is opened in the lower surface 77a and the upper surface 77b. As shown in fig. 3, the exposure hole 87 has an exposure portion 87a and a plurality of extension portions 87b.
The exposed portion 87a has a shape corresponding to the shape of the sensor 67. In the present embodiment, the exposed portion 87a is a substantially rectangular hole. The exposed portion 87a exposes a part of the upper surface 75a of the base layer 75 and a part of the plurality of pads 81. Therefore, the exposed upper surface 75a forms the surface of the FPC18 and is included in the mounting surface 71 of the FPC18.
The plurality of protruding portions 87b extend radially from the exposed portion 87a, for example. The extension 87b exposes a part of the upper surface 75a of the base layer 75. On the other hand, the protruding portion 87b is separated from the conductive layer 76. That is, the conductive layer 76 is not exposed through the extension 87b.
As shown in fig. 4, the cover layer 77 also has an inner surface 77c that exposes the holes 87. Inner surface 77c extends between lower surface 77a and upper surface 77b of cover layer 77. The lower surface 77a is adhered to the upper surface 75a of the base layer 75, and thus the inner surface 77c extends between the upper surface 75a of the base layer 75 and the upper surface 77b of the cover layer 77.
The inner surface 77c has a 1 st edge 77d and a 2 nd edge 77e. The 1 st edge 77d is an edge of the inner surface 77c connected to the lower surface 77 a. The 1 st edge 77d is also an edge of the lower surface 77a connected to the inner surface 77c. Lower surface 77a is adhered to upper surface 75a of base layer 75 such that 1 st edge 77d is connected to upper surface 75a of base layer 75. The 2 nd edge 77e is an edge of the inner surface 77c connected to the upper surface 77b. The 2 nd edge 77e is also an edge of the upper surface 77b connected to the inner surface 77c.
At least a portion of the exposure holes 87 become tapered toward the upper surface 75a of the base layer 75. Thus, the 2 nd edge 77e is larger than the 1 st edge 77d. At least a portion of inner surface 77c extends between 1 st edge 77d and 2 nd edge 77e, for example, obliquely with respect to upper surface 75a of base layer 75. In addition, a portion of the inner surface 77c may extend substantially perpendicularly with respect to the upper surface 75a.
The exposure hole 87 is formed by punching the cover film 85, for example. The shape of the inner surface 77c can be easily controlled by punching. Therefore, the exposure hole 87 extending obliquely with respect to the upper surface 75a can be easily formed.
In the FPC18 described above, the mounting surface 71 has the surface region 91 and the concave region 92. The surface region 91 is an example of the 1 st region. The concave region 92 exemplifies the 2 nd region. In the example of fig. 3 and 4, the surface region 91 has the upper surface 77b of the cover layer 77. Thus, the exposure hole 87 is opened in the surface region 91.
Recessed region 92 is recessed from surface region 91. In the example of fig. 3 and 4, the concave region 92 has the upper surface 75a of the base layer 75 exposed through the exposure hole 87 and the inner surface 77c of the cover layer 77. Therefore, the pad 81 is disposed in the concave region 92. Further, the 2 nd edge 77e of the inner surface 77c is also an edge of the surface region 91 connected to the inner surface 77c of the concave region 92.
The FPC18 is provided with a through hole 95. The through hole 95 is an example of the 1 st through hole. The through hole 95 penetrates the base layer 75 substantially in the Z direction, and opens in the upper surface 75a and the lower surface 75b. In the example of fig. 3, the through-hole 95 has a circular cross section. The cross-sectional shape of the through-hole 95 is not limited to this example, and may be a square or other shape.
As shown in fig. 4, the through hole 95 is provided in a portion of the upper surface 75a exposed through the exposure hole 87. Therefore, the through hole 95 is exposed through the exposure hole 87 and provided in the concave region 92. In other words, the through hole 95 communicates with the exposed hole 87.
The stiffener 68 is attached to the FPC18 so as to cover the lower surface 75b of the base layer 75. Thus, the base layer 75 is located between the cover layer 77 and the stiffener plate 68. The reinforcing plate 68 is provided with a through hole 101. The through hole 101 is an example of the 2 nd through hole.
The through hole 101 penetrates the reinforcing plate 68 substantially in the Z direction. The through-hole 101 has substantially the same shape as the through-hole 95 of the FPC18. The through hole 101 overlaps the through hole 95 in the Z direction and communicates with the through hole 95. The shape of the through-hole 101 may be different from the shape of the through-hole 95.
An adhesive layer 110 is provided between the FPC18 and the stiffener 68. The adhesive layer 110 adheres the FPC18 and the stiffener 68 to each other. The adhesive layer 110 is provided with a through hole 111. The through-hole 111 has substantially the same shape as the through- holes 95 and 101, and the through-hole 95 and the through-hole 101 communicate with each other.
The sensor 67 is, for example, a Land Grid Array (LGA). The sensor 67 is not limited to this example. Sensor 67 has a package 121 and a plurality of lands 122. The package 12 is an example of a housing. The land 122 is an example of the 2 nd terminal.
The package 121 includes, for example, a circuit board on which a plurality of elements are mounted, and a mold resin covering the circuit board and the elements. The case is a member forming an outer surface of the electronic component, and may also serve as a component provided with a circuit, such as a circuit board.
The package 121 has a lower surface 121a. The lower surface 121a faces the upper surface 75a of the foundation layer 75 exposed from the exposure hole 87 through the space S1. In other words, the upper surface 75a of the base layer 75 faces the package 121 of the sensor 67 through the space S1. The space S1 is an example of a gap.
Lands 122 are provided on lower surface 121a of package 121. The land 122 is electrically connected to the pad 81 of the FPC18 via solder 125. Thereby, the sensor 67 is mounted on the concave region 92 of the mounting surface 71 of the FPC18.
The through hole 95 of the FPC18 communicates with a space S1 provided between the upper surface 75a of the base layer 75 and the package 121. The through hole 95 communicates with the space S1 at substantially the center of the space S1 in a direction (X-Y plane) along the upper surface 75a. The position of the through hole 95 is not limited to this example. The space S1 communicates with the outside of the FPC18 through the through holes 95, 101, and 111.
The through holes 95, 101, 111 are smaller than the exposure holes 87, respectively, in the direction along the upper surface 75a. Further, the through holes 95, 101, 111 are smaller than the package 121 in the direction along the upper surface 75a, respectively.
The edge of the upper surface 77b (2 nd edge 77 e) connected to the inner surface 77c is larger than the package 121 of the sensor 67 in the direction along the upper surface 75a. Package 121 is located inside 2 nd edge 77e in a direction along upper surface 75a.
In a direction along the upper surface 75a, the 2 nd edge 77e is separated from the package 121. To put it another way, the edge of surface area 91 that is connected to inner surface 77c of concave area 92 (2 nd edge 77 e) is separated from package 121 in a direction along surface area 91. Further, the 1 st edge 77d is also separated from the package 121 in a direction along the upper surface 75a.
A gap G1 is provided between the package 121 and the 2 nd edge 77e. The gap G1 communicates with the space S1 and the outside of the FPC18. In other words, the space S1 communicates with the outside of the FPC18 through the gap G1.
At least a portion of the protruding portion 87b exposing the hole 87 is separated from the package 121 in a direction along the upper surface 75a. Therefore, the protruding portion 87b communicates with the space S1 and the outside of the FPC18. In other words, the space S1 communicates with the outside of the FPC18 through the protruding portion 87b.
Fig. 5 is an exemplary plan view showing a part of the 2 nd connection part 62 in the vicinity of the relay connector 66 according to embodiment 1. Fig. 6 is an exemplary cross-sectional view of a portion of the 2 nd connecting portion 62 of embodiment 1, taken along line F6-F6 of fig. 5.
As shown in fig. 5, the conductive layer 76 has a plurality of pads 131 and a plurality of wirings 132. The pad 131 is an example of the 1 st terminal, and may be referred to as a land or an electrode. The pads 131 and the wirings 132 are provided on the upper surface 75a of the base layer 75.
The relay connector 66 is electrically connected to the pad 131. The wiring 132 extends from the pad 131, and electrically connects the pad 131 to the preamplifier 65 or the sensor 67, for example. The wiring 132 may be connected to another wiring, a via hole, a ground, or another conductor.
The cover layer 77 covers a part of the pad 131 and the wiring 132. The cover layer 77 is provided with a plurality of exposure holes 135. As shown in fig. 6, the exposure hole 135 penetrates the cover layer 77 in the substantially Z direction, and is opened in the lower surface 77a and the upper surface 77b. The exposure hole 135 exposes a part of the upper surface 75a of the base layer 75 and a part of the plurality of pads 131.
The FPC18 is provided with a plurality of through holes 141. The through hole 141 is an example of the 1 st through hole. The through holes 141 penetrate the base layer 75 and the cover layer 77 in the substantially Z direction, and are opened in the upper surface 77b of the mounting surface 71 and the lower surface 75b of the rear surface 72.
In the example of fig. 5, the through-hole 141 has a circular cross section. The cross-sectional shape of the through-hole 141 is not limited to this example, and may be a square or other shape. The shapes of the through holes 141 may be different from each other.
As shown in fig. 6, the reinforcing plate 68 is provided with a plurality of through holes 142. The through hole 142 is an example of the 2 nd through hole. The through hole 142 penetrates the reinforcing plate 68 substantially in the Z direction. The through-hole 142 has substantially the same shape as the through-hole 141 of the FPC18. The through hole 142 overlaps the through hole 141 in the Z direction and communicates with the through hole 141. The shape of the through-hole 142 may be different from the shape of the through-hole 141.
The adhesive layer 110 is provided with a plurality of through holes 143. The through hole 143 has substantially the same shape as the through holes 141 and 142, and the through hole 141 and the through hole 142 communicate with each other. The shape of the through-hole 143 may be different from the shapes of the through- holes 141 and 142.
The relay connector 66 has a housing 151 and a plurality of wires 152. The lead wire 152 is an example of the 2 nd terminal. The housing 151 is a portion of the relay connector 66 formed of an insulator such as a synthetic resin, for example. An electrical conductor including a lead 152 is mounted on the housing 151.
The housing 151 has a lower surface 151a and a side surface 151b. The lower surface 151a faces the upper surface 77b of the cover layer 77 via the space S2. In other words, the upper surface 77b of the cover layer 77 faces the housing 151 of the relay connector 66 through the space S2. The space S2 is an example of a gap. The side surface 151b faces a direction intersecting the direction in which the lower surface 151a faces.
The wires 152 are disposed on the side 151b of the housing 151. The conductive line 152 is electrically connected to the pad 131 of the FPC18 via solder 155. Thereby, the relay connector 66 is mounted on the FPC18.
The through hole 141 of the FPC18 communicates with a space S2 provided between the upper surface 77b of the coverlay 77 and the housing 151. One of the through holes 141 communicates with the space S2 at substantially the center of the space S2 in a direction (X-Y plane) along the upper surface 77b. The position of the through hole 141 is not limited to this example. The space S2 communicates with the outside of the FPC18 through the through holes 141, 142, and 143.
Hereinafter, a part of a method of mounting the relay connector 66 and the sensor 67 to the FPC18 will be described as an example. The method of mounting the relay connector 66 and the sensor 67 to the FPC18 is not limited to the following method, and other methods may be used. First, solder paste (solder 125, 155) is supplied to the pads 81, 131 by, for example, printing or coating.
Next, the sensor 67 is mounted on the pad 81. Further, the relay connector 66 is mounted on the pad 131. The FPC18 is located between the sensor 67 and the stiffener 68, and between the relay connector 66 and the stiffener 68. Therefore, the stiffener 68 can suppress deformation of the FPC18 at the time of mounting.
Subsequently, the FPC18 is heated in a reflow furnace to melt the solder paste. Thereby, the land 122 of the sensor 67 is bonded to the pad 81, and the wire 152 of the relay connector 66 is bonded to the pad 131. At this time, the flux mixed in the solders 125 and 155 or separately supplied may flow out of the solders 125 and 155.
Subsequently, the FPC18 is cleaned by, for example, ultrasonic cleaning. For example, the FPC18 is put into a tank filled with the cleaning liquid C. As shown by arrows in fig. 4, the cleaning liquid C flows into the space S1 through the through holes 95, 101, and 111. The cleaning liquid C can be discharged from the space S1 to the outside of the FPC18 through the through holes 95, 101, and 111.
The cleaning liquid C flows into the space S1 through the gap G1. Further, the cleaning liquid C flows into the space S1 through the extension 87b of the exposure hole 87. The cleaning liquid C can be discharged from the space S1 to the outside of the FPC18 through the gap G1 and the protruding portion 87b.
The cleaning liquid C flows into the space S1 and is discharged from the space S1. That is, the cleaning liquid C flows through the space S1. This enables the cleaning liquid C to remove substances such as flux that may contaminate the HDD10 from the space S1.
As shown in fig. 6, the cleaning liquid C flows into the space S2 through the through holes 141, 142, and 143. The cleaning liquid C can be discharged from the space S2 to the outside of the FPC18 through the through holes 141, 142, and 143. Further, the cleaning liquid C can pass through the gap G2 between the housing 151 and the FPC18.
The cleaning liquid C flows into the space S2 and is discharged from the space S2. That is, the cleaning liquid C flows through the space S2. Thereby, the cleaning liquid C can remove substances that may contaminate the HDD10 existing in the space S2.
When the ultrasonic cleaning is completed, the FPC18 is taken out from the cleaning liquid C. At this time, the cleaning liquid C in the space S1 is discharged through at least one of the through holes 95, 101, 111, the gap G1, and the protruding portion 87b. The cleaning liquid C in the space S2 is discharged through at least one of the through holes 141, 142, and 143 and the gap G2.
For example, the cleaning liquid C flowing into the spaces S1 and S2 transmits ultrasonic waves. The ultrasonic waves cause the solder existing in the spaces S1 and S2 to float from the FPC18. Thereafter, the cleaning liquid C is discharged from the spaces S1 and S2 together with the flux as described above. With the above, the mounting of the member to the FPC18 is completed.
In the HDD10 according to embodiment 1 described above, the FPC18 has the upper surface 75a facing the sensor 67 through the space S1, and the lower surface 75b located on the opposite side of the upper surface 75a and facing the reinforcing plate 68. The FPC18 is provided with a through hole 95 that opens to the upper surface 75a and the lower surface 75b and communicates with the space S1. The reinforcing plate 68 is provided with a through hole 101 penetrating the reinforcing plate 68 and communicating with the through hole 95. That is, the space S1 between the sensor 67 and the upper surface 75a communicates with the outside through the through holes 95 and 101. This allows the cleaning liquid C for cleaning the space S1 to flow through the through holes 95 and 101, and thus prevents substances that may contaminate the HDD10, such as flux, from remaining in the space S1. Therefore, the HDD10 according to the present embodiment can suppress contamination of the HDD10, and can suppress a problem that a substance that may contaminate the HDD10 causes a head crash.
The FPC18 has a pad 81. The sensor 67 includes a package 121, and a land 122 provided on the package 121 and electrically connected to the pad 81 via solder 125. The space S1 is provided between the upper surface 75a and the package 121. That is, the through holes 95 and 101 can introduce the cleaning liquid C into the large space S1 between the package 121 and the upper surface 75a. Therefore, the HDD10 of the present embodiment can easily clean the large space S1 between the package 121 and the upper surface 75a, in which substances that may easily contaminate the HDD10 remain, with the cleaning liquid C.
The FPC18 has a base layer 75 including an upper surface 75a, and a coverlay 77 covering the upper surface 75a. The cover layer 77 is provided with an exposure hole 87 that penetrates the cover layer 77 to expose the upper surface 75a, the through hole 95, and the pad 81. The cover layer 77 has an upper surface 77b where the exposure hole 87 is opened, and an inner surface 77c where the hole 87 is exposed, which extends between the upper surface 75a and the upper surface 77b. An edge (2 nd edge 77 e) of the upper surface 77b connected to the inner surface 77c is separated from the package 121 in a direction along the upper surface 75a. Therefore, a gap G1 communicating with the space S1 is provided between the 2 nd edge 77e and the package 121. The gap G1 allows the cleaning liquid C for cleaning the space S1 to flow therethrough, and can suppress the flux remaining in the space S1, which may contaminate the HDD10. Further, the space S1 communicates with the outside through two or more paths, and therefore the cleaning liquid C can be suppressed from staying in the space S1.
The inner surface 77c has a 1 st edge 77d connected to the upper surface 75a, and a 2 nd edge 77e connected to the upper surface 77b and larger than the 1 st edge 77d. At least a portion of the inner surface 77c extends obliquely relative to the upper surface 75a between the 1 st edge 77d and the 2 nd edge 77e. Thereby, the cover layer 77 can enlarge the gap G1 and can cover a larger range of the upper surface 75a than in the case where the inner surface 77c extends perpendicularly with respect to the upper surface 75a. Therefore, in HDD10 according to this embodiment, conductive layer 76 provided on upper surface 75a is prevented from being exposed to a greater extent, and corrosion of conductive layer 76 can be prevented.
The FPC18 has a base layer 75, a cover layer 77, and a conductive layer 76. The conductive layer 76 is located between the base layer 75 and the cover layer 77 and includes a pad 81. The cover layer 77 is provided with an exposure hole 87 penetrating the cover layer 77. The exposure hole 87 has: an exposed portion 87a exposing the upper surface 75a, the through hole 95, and the pad 81; and an extension 87b extending from the exposed portion 87a to expose the upper surface 75a and separated from the conductive layer 76. At least a portion of the protruding portion 87b is separated from the package 121 in a direction along the upper surface 75a. Therefore, the protruding portion 87b communicates the space S1 with the outside. The extension 87b allows the cleaning liquid C for cleaning the space S1 to flow therethrough, and can suppress the flux remaining in the space S1 and other substances that may contaminate the HDD10. Further, the space S1 communicates with the outside through two or more paths, and therefore the cleaning liquid C can be suppressed from staying in the space S1. Further, since the protruding portion 87b is separated from the conductive layer 76, the conductive layer 76 is not exposed. Thus, the HDD10 according to the present embodiment can suppress corrosion of the conductive layer 76.
The sensor 67 is an LGA. Therefore, the space S1 becomes small, and the cleaning liquid C is difficult to flow. However, the HDD10 of the present embodiment communicates the space S1 with the outside through the through holes 95 and 101. This enables the cleaning liquid C to clean the space S1, and thus prevents flux from remaining in the space S1, which may contaminate the HDD10.
The FPC18 has a mounting surface 71 and a pad 81 provided on the mounting surface 71. Sensor 67 includes a package 121, and a land 122 provided on package 121 and electrically connected to pad 81 via a solder 125. The mounting surface 71 has a surface region 91, and a concave region 92 that is recessed from the surface region 91 and is provided with the pad 81. In the direction along the surface area 91, the edge (2 nd edge 77 e) of the surface area 91 connected to the concave area 92 is separated from the package 121. Therefore, a gap G1 communicating with the space S1 between the mounting surface 71 and the package 121 is provided between the 2 nd edge 77e and the package 121. The gap G1 allows the cleaning liquid C for cleaning the space S1 to flow therethrough, and can suppress the flux remaining in the space S1 from contaminating the HDD10. Therefore, the HDD10 according to the present embodiment can suppress contamination of the HDD10, and can suppress a problem that a substance that may contaminate the HDD10 causes a head crash.
The FPC18 has a base layer 75 provided with a pad 81, and a cover layer 77 covering the base layer 75. The cover layer 77 has a surface area 91. The cover layer 77 is provided with an exposure hole 87, and the exposure hole 87 penetrates the cover layer 77, opens in the surface region 91, and exposes the base layer 75 and the pad 81. Recessed region 92 has an inner surface 77c that exposes aperture 87. The edge (2 nd edge 77 e) of the surface area 91 connected to the inner surface 77c is separated from the package 121 in the direction along the surface area 91. That is, by forming the exposure hole 87 in the cover layer 77, the gap G1 between the 2 nd edge 77e and the package 121 is formed. Therefore, the HDD10 according to the present embodiment can easily form the gap G1 through which the cleaning liquid C can flow.
(embodiment 2)
Hereinafter, embodiment 2 will be described with reference to fig. 7. In the following description of the embodiments, components having the same functions as those of the already described components are sometimes given the same reference numerals as those of the already described components, and further description thereof is omitted. Note that a plurality of constituent elements to which the same reference numeral is given are not limited to all common functions and properties, and may have different functions and properties according to the respective embodiments.
Fig. 7 is an exemplary cross-sectional view showing a part of the 2 nd connecting part 62 in the vicinity of the sensor 67 of embodiment 2. As shown in fig. 7, HDD10 according to embodiment 2 includes an adhesive layer 200 instead of adhesive layer 110. The adhesive layer 200 is the same as the adhesive layer 110 of embodiment 1 except for the following.
The adhesive layer 200 is provided with a through-hole 201 instead of the through-hole 111. The through-hole 201 is an example of the 4 th through-hole and the through-hole. The through-hole 201 penetrates the adhesive layer 200 substantially in the Z direction.
In the direction along the upper surface 75a (X-Y plane), the through hole 201 is larger than the package 121 and larger than the exposed portion 87a of the exposed hole 87. The package 121 and the exposed portion 87a of the exposure hole 87 are located inside the edge 201a of the through hole 201 in the direction along the upper surface 75a.
In the direction along upper surface 75a, edge 201a of through-hole 201 is separated from package 121 and from exposed portion 87a of exposed hole 87. The size of the through-hole 201 is not limited to this example.
The HDD10 according to embodiment 2 includes an FPC218 instead of the FPC18. The FPC218 is the same as the FPC18 of embodiment 1 except for the following. The FPC218 has a 1 st portion 218a and a 2 nd portion 218b.
Portion 1a is a portion of FPC218 that is adhered to stiffener 68 by adhesive layer 200. The 2 nd portion 218b is a portion of the FPC218 overlapping the through hole 201 in the Z direction. The 1 st part 218a and the 2 nd part 218b have a base layer 75, a conductive layer 76, and a cover layer 77, respectively.
The 1 st portion 218a expands substantially flat along the reinforcement plate 68. The 1 st part 218a has a surface area 91 of the mounting face 71. Surface region 91 has an upper surface 77b of cover layer 77. The 1 st portion 218a may have irregularities or may be curved.
The 2 nd portion 218b is bent so as to contact the reinforcing plate 68 through the through hole 201. Thus, the lower surface 75b of the base layer 75 of the 2 nd portion 218b is in contact with the stiffener plate 68. The 2 nd portion 218b is recessed from the upper surface 77b of the cap layer 77 of the 1 st portion 218a. Thus, the 2 nd portion 218b has a recessed area 92 of the mounting surface 71.
In the 2 nd portion 218b, an exposure hole 87 is provided in the cover layer 77. The recessed area 92 of the 2 nd portion 218b has an upper surface 75a facing the base layer 75 of the package 121, and the pads 131 are provided on the upper surface 75a. Further, the 2 nd portion 218b is provided with a through hole 95 opened on the upper surface 75a.
The through hole 95 directly communicates with the through hole 101 of the reinforcing plate 68. Therefore, the space S3 provided between the upper surface 75a of embodiment 2 and the package 121 communicates with the outside of the FPC218 through the through holes 95 and 101. The through hole 95 may communicate with the through hole 101 through another hole or space.
In the 2 nd portion 218b, the base layer 75, the conductive layer 76, and the cover layer 77 are all bent so as to be recessed from the 1 st portion 218a. Therefore, the concave region 92 of embodiment 2 includes not only the upper surface 75a of the base layer 75 and the inner surface 77c of the cover layer 77, but also the upper surface 77b of the cover layer 77.
In embodiment 2, an edge 91a of the surface region 91 connected to the concave region 92 is provided on the upper surface 77b of the cover layer 77. In the direction along the surface area 91 (X-Y plane), the edge 91a of the surface area 91 connected to the concave area 92 is separated from the package 121.
In embodiment 2, land 122 is electrically connected to pad 81 of FPC218 via solder 225 instead of solder 125. In the Z direction, the length (height) of the solder 225 of embodiment 2 is longer than the length (height) of the solder 125 of embodiment 1. The solder 225 is supplied to the pad 81 by printing using a metal mask, for example. The metal mask is generally formed substantially flat. Thus, the metal mask is separated from the recessed 2 nd portion 218b when it is placed on the 1 st portion 218a of the FPC218. Accordingly, the aperture of the metal mask is substantially elongated according to the depth of the recess of the 2 nd portion 218b.
The amount of solder 225 supplied into the holes of the metal mask increases according to the depth of the recess of the 2 nd portion 218b. Therefore, the height of the solder 225 exceeds the height of the solder 125 of embodiment 1. The solder 225 is not limited to this example.
Since the height of the solder 225 is increased, the distance between the upper surface 75a of the base layer 75 and the package 121 in embodiment 2 is longer than that in embodiment 1. Therefore, the space S3 provided between the upper surface 75a and the package 121 is larger than the space S1 of embodiment 1.
When the FPC218 of embodiment 2 is cleaned, the cleaning liquid C flows into the space S3 through the through holes 95 and 101. The cleaning liquid C can be discharged from the space S3 to the outside of the FPC218 through the through holes 95 and 101.
The cleaning liquid C flows into the space S3 through the gap G3 between the edge 91a of the surface area 91 connected to the concave area 92 and the package 121. Further, the cleaning liquid C can be discharged from the space S3 to the outside of the FPC218 through the gap G3.
In the HDD10 according to embodiment 2 described above, the adhesive layer 200 adheres the FPC218 and the stiffener 68 to each other. The adhesive layer 200 is provided with a through-hole 201 penetrating the adhesive layer 200. The FPC218 has a 1 st portion 218a adhered to the reinforcing plate 68 through the adhesive layer 200, and a 2 nd portion 218b bent so as to contact the reinforcing plate 68 through the through hole 201. That is, the 2 nd portion 218b is bent in a manner of being recessed from the 1 st portion 218a. The 2 nd portion 218b has an upper surface 75a, and is provided with a through hole 95 and a pad 81. For example, the solder 225 for connecting the pad 81 and the land 122 is formed by printing using a metal mask. A metal mask is placed over the non-recessed 1 st portion 218a of the FPC218. Therefore, the amount of solder 225 printed on the land 81 of the recessed 2 nd portion 218b is larger than that in the case where the 2 nd portion 218b is not recessed. Since a large amount of solder 225 is provided between pad 81 and land 122, space S3 between upper surface 75a and package 121 becomes large (becomes high). Therefore, in HDD10 of the present embodiment, cleaning liquid C can easily flow into space S3 between upper surface 75a and package 121 from the side, and it is possible to suppress a substance that may contaminate HDD10, such as flux, remaining in space S3. Further, the space S3 communicates with the outside through two or more paths, and therefore the cleaning liquid C can be suppressed from staying in the space S3.
The stiffener 68 has higher rigidity than the FPC218, and is attached to the FPC218. The adhesive layer 200 adheres the FPC218 and the stiffener 68 to each other. The adhesive layer 200 is provided with a through hole 201 penetrating the adhesive layer 200. The FPC218 has a 1 st portion 218a adhered to the reinforcing plate 68 through the adhesive layer 200, and a 2 nd portion 218b bent so as to contact the reinforcing plate 68 through the through hole 201. The 1 st portion 218a has a surface area 91. The 2 nd portion 218b has a concave region 92. That is, by providing through hole 201 in adhesive layer 200 and forming bent 2 nd portion 218b on FPC218, gap G3 between edge 91a of surface area 91 connected to recessed area 92 and package 121 is formed. Thus, the HDD10 of the present embodiment can easily form the gap G3 between the edge 91a of the surface area 91 connected to the concave area 92 and the package 121.
(embodiment 3)
Hereinafter, embodiment 3 will be described with reference to fig. 8 to 10. Fig. 8 is an exemplary plan view showing a part of the 2 nd connecting part 301 in the vicinity of the relay connector 302 according to embodiment 3. Fig. 9 is an exemplary cross-sectional view illustrating a portion of the 2 nd connecting part 301 according to embodiment 3 along a line F9-F9 of fig. 8.
As shown in fig. 8, the HDD10 according to embodiment 3 includes a 2 nd connector 301 in place of the 2 nd connector 62, and a relay connector 302 in place of the relay connector 66. Except for the points described below, the 2 nd connection unit 301 is the same as the 2 nd connection unit 62, and the relay connector 302 is the same as the relay connector 66.
In the 2 nd connecting portion 301, the FPC18 also has a plurality of pads 311. The plurality of pads 311 are arranged in two columns in the X direction together with the plurality of pads 131. The pads 311 are located at both ends of a column including the plurality of pads 131, 311. The pad 311 is not limited to this example.
Pad 311 is included in conductive layer 76. Therefore, the plurality of pads 311 are provided on the upper surface 75a of the base layer 75. The upper surface 75a is an example of the surface of the layer 1. The pad 311 may or may not be electrically connected to another pad, an electronic component, or an electrical connection via a wiring.
Each of the pads 131 and 311 is formed in a substantially rectangular shape extending in the Y direction. Therefore, the length of the pad 311 in the Y direction is longer than the length of the pad 311 in the X direction. The shape of the pads 131 and 311 is not limited to this example.
Each of the pads 311 has four edges 311a, 311b, 311c, and 311d. The edge 311a is an example of an end portion of the pad in the 1 st direction. The edge 311b is an example of an end portion of the pad in the 2 nd direction.
The edge 311a is an end of the pad 311 in a direction toward the center of the relay connector 302 (hereinafter, referred to as an inner direction) in the Y direction. The inner direction is a direction along the upper surface 75a, and is an example of the 1 st direction. For the pad 311 shown in fig. 9, the + Y direction is the inner direction.
The end edge 311b is an end portion of the pad 311 in a direction opposite to the inner direction (hereinafter referred to as an outer direction). The outward direction is a direction along the upper surface 75a, and is an example of the 2 nd direction. For the pad 311 shown in fig. 9, the-Y direction is the outer direction. As shown in fig. 8, the edges 311a and 311b extend in the substantially X direction.
The end edge 311c is an end portion of the pad 311 in the + X direction. The edge 311d is an end of the pad 311 in the-X direction. The edges 311c and 311d extend in the substantially Y direction between the edge 311a and the edge 311 b.
In the 2 nd connection portion 301, a plurality of exposure holes 320 are provided in the cover layer 77. The exposure hole 320 is an example of an exposure hole and a 5 th through hole. As shown in fig. 9, the exposure hole 320 penetrates the cover layer 77 substantially in the Z direction, and is opened in the lower surface 77a and the upper surface 77b.
The number of the plurality of exposing holes 320 is equal to the number of the plurality of pads 311. The plurality of exposure holes 320 partially expose the upper surface 75a of the base layer 75 and a corresponding one of the plurality of pads 311, respectively. The exposure hole 320 is not limited to this example.
The cover layer 77 also has an inner surface 321 that exposes the holes 320. Inner surface 321 extends between lower surface 77a and upper surface 77b of cover layer 77. The lower surface 77a is adhered to the upper surface 75a of the base layer 75, and thus the inner surface 321 extends between the upper surface 75a of the base layer 75a and the upper surface 77b of the cover layer 77.
The exposure hole 320 exposes the edge 311a, a part of the edge 311c, and a part of the edge 311d of the pad 311 without covering them. In other words, the inner surface 321 of the exposure hole 320 is separated from the end edge 311 a.
The cover layer 77 covers the edge 311b of the pad 311, the other portion of the edge 311c, and the other portion of the edge 311d. The edges 311a, 311b, and 311c may be exposed through the exposure hole 320, for example.
As shown in fig. 8, the side 151b of the case 151 includes two sides 331 and two sides 332. The two side surfaces 331 are provided at both ends of the housing 151 in the Y direction. The conductive line 152 is disposed on the side 331. The two side surfaces 332 are provided at both ends of the housing 151 in the X direction.
Fig. 10 is a bottom view showing an example of the relay connector 302 according to embodiment 3. As shown in fig. 10, a plurality of cutouts 335 are provided in the housing 151. The plurality of cutouts 335 are opened on a corresponding one of the two side surfaces 332, a corresponding one of the two side surfaces 331, and the lower surface 151a, respectively.
Housing 151 also has a bottom surface 335a and an inner side surface 335b of cutout 335. The bottom surface 335a faces generally in the-Z direction. The inner side surface 335b faces a direction intersecting the direction in which the bottom surface 335a faces.
The housing 151 also has a plurality of retaining projections 336, 337. The holding projection 336 projects from the bottom surface 335a in the substantially-Z direction at a position separated from the inner side surface 335b. The holding projection 337 projects from the inner side surface 335b at a position separated from the bottom surface 335a in the-Z direction.
As shown in fig. 8, the relay connector 302 also has a plurality of wires 340. The wire 340 is an example of a metal member. The wires 152, 340 of the trunk connector 302 are made of metal.
The lead 152 electrically connects the pad 131 to the connector provided on the bottom wall 25 or the relay connector 53 of the PCB 19. The conductive line 340 may also electrically connect the pad 311 with other members. Further, the lead wire 340 may be a reinforcing pin that is not electrically connected to a member to which the relay connector 302 is connected.
As shown in fig. 10, the plurality of wires 340 are fitted into the notches 335 of the housing 151 and attached to the housing 151. In addition, a part of the lead 340 may be embedded in the case 151. A portion of the plurality of wires 340 protrudes from the side 331 of the housing 151. In other words, the plurality of conductive lines 340 are disposed on the side surface 331. Each of the plurality of leads 340 has a bonding portion 341, a separation portion 342, and an intermediate portion 343. The engaging portion 341, the separating portion 342, and the intermediate portion 343 are integrally formed.
As shown in fig. 9, the engaging portion 341 extends in the substantially Y direction. At least a portion of the engagement portion 341 is located outside the cutout 335. The bonding portion 341 is bonded to the pad 311 of the FPC18 via solder 345.
The separating portion 342 is accommodated in the cutout 335 and attached to the housing 151. Thus, the separation portion 342 is provided between the engagement portion 341 and the housing 151. The separating portion 342 may be located outside the notch 335.
The separation portion 342 is separated from the engagement portion 341 in the inward direction in the direction along the upper surface 75a. Further, the separation portion 342 is farther from the upper surface 75a than the engagement portion 341 in the Z direction. The Z direction is a direction orthogonal to the upper surface 75a.
The intermediate portion 343 is disposed between the engaging portion 341 and the separating portion 342. The intermediate portion 343 extends obliquely with respect to the upper surface 75a between an end portion of the engaging portion 341 in the inward direction and an end portion of the separating portion 342 in the outward direction. The intermediate portion 343 extends away from the upper surface 75a as approaching the separating portion 342 from the engaging portion 341.
The inner surface 321 of the exposure hole 320 is separated from the end of the intermediate portion 343 in the inner direction. For example, the inner surface 321 has an end edge 321a. The end edge 321a is provided at an end portion of the inner surface 321 in the inner direction, for example, and extends along the substantially X direction. An end edge 321a of the inner surface 321 faces an end edge 311a of the pad 311.
An end 321a of inner surface 321 is spaced inward from end 311a of pad 311. Further, the end edge 321a is separated from the intermediate portion 343 in the Y direction toward the inside. The separation portion 342 covers at least a part of the end edge 321a. In other words, in the Y direction, the end edge 321a is located between both ends of the separating portion 342 in the Y direction. The intermediate portion 343 may cover a part of the end edge 321a. At least a part of the end edge 321a of the inner surface 321 is covered by the case 151. In other words, at least a portion of the end edge 321a is located between the upper surface 75a and the housing 151.
As shown in fig. 10, a part of the engaging portion 341, a part of the separating portion 342, and the intermediate portion 343 are located between the inner side surface 335b of the cutout 335 and the holding projection 336. Further, the separation portion 342 is located between the bottom surface 335a of the cutout 335 and the holding projection 337. Thereby, the holding projections 336, 337 hold the lead 340.
As shown in fig. 9, a space S4 is provided between the separation portion 342 and the upper surface 77b of the cover layer 77. The space S4 is a part of the cutout 335, and opens to the side surface 332 of the housing 151. Further, a space S5 is provided between the separation portion 342 and the intermediate portion 343, and the upper surface 75a of the foundation layer 75 exposed from the exposure hole 320.
The space S4 communicates with the spaces S2, S5. Therefore, the space S5 communicates with the space S2 and the through holes 141, 142, and 143 via the space S4. Further, the space S5 communicates with the side surface 332 of the housing 151 via the space S4.
A part of a method of mounting the relay connector 302 to the FPC18 is illustrated below. The method of mounting the relay connector 302 to the FPC18 is not limited to the following method, and other methods may be used. First, solder paste (solder 155, 345) is supplied to the pads 131, 311 by, for example, printing or coating.
Next, the relay connector 302 is mounted on the pads 131, 311. Then, the FPC18 is heated in a reflow furnace to melt the solder paste. Thereby, the wires 152, 340 of the relay connector 302 are bonded to the pads 131, 311. At this time, the flux mixed in the solder 155, 345 or separately supplied may flow out of the solder 155, 345.
Subsequently, the FPC18 is cleaned by, for example, ultrasonic cleaning. For example, the FPC18 is put into a tank filled with the cleaning liquid C. The cleaning liquid C flows into the space S5 through the through holes 141, 142, and 143, the space S2, and the space S4. The cleaning liquid C may flow into the space S5 through the space S4 opened in the side surface 332. The cleaning liquid C can be discharged from the space S5 to the outside of the FPC18 through the space S4.
The cleaning liquid C flows into the spaces S4 and S5, and is discharged from the spaces S4 and S5. That is, the cleaning liquid C flows through the spaces S4 and S5. This enables the cleaning liquid C to remove substances that may contaminate the HDD10 present in the spaces S4 and S5.
As shown in fig. 10, a blocking portion DE is provided between the FPC18 and the relay connector 302. The blocking portion DE includes a portion of the space S4 and a space S5. The blocking portion DE is surrounded by the FPC18, the inner surface 335b of the cutout 335, the holding projection 336, the holding projection 337, the engaging portion 341, the separating portion 342, and the intermediate portion 343, and is open only in the substantially inward direction. Therefore, the cleaning liquid C sometimes hardly flows into the stopper DE and hardly flows out from the stopper DE.
In the present embodiment, inner surface 321 of exposure hole 320 is separated from end edge 311a of pad 311. Therefore, the exposure hole 320 is set to be large in the barrier portion DE, and further, the region exposed through the exposure hole 320 in the upper surface 75a of the base layer 75 is set to be large.
By setting the exposure hole 320 to be large in the blocking portion DE, the size of the blocking portion DE in the Z direction, for example, becomes large. Specifically, the distance between the separated portion 342 and the intermediate portion 343 and the FPC18 becomes long. Therefore, the cleaning liquid C easily flows into the stopper DE and easily flows out from the stopper DE.
When the ultrasonic cleaning is completed, the FPC18 is taken out from the cleaning liquid C. At this time, the cleaning liquid C in the space S5 is discharged through the space S4 together with the flux. As described above, the mounting of the relay connector 302 to the FPC18 is completed.
In the HDD10 of embodiment 3 described above, the FPC18 has the base layer 75 including the upper surface 75a, the coverlay covering the upper surface 75a, and the pads 311 provided on the upper surface 75a. The relay connector 302 has a housing 151 and a conductive wire 340 provided to the housing 151. The cover layer 77 is provided with an exposure hole 320 that penetrates the cover layer 77 to expose the upper surface 75a and the pad 311. The cover layer 77 has an upper surface 77b that opens to expose the hole 320, and an inner surface 321 that exposes the hole 320 and extends between the upper surface 75a and the upper surface 77b. The wire 340 has a bonding portion 341 and a separation portion 342. The soldering portion 341 is bonded to the pad 311 via solder 345. The separation portion is provided between the engagement portion 341 and the housing 151, separates from the engagement portion 341 in the direction along the upper surface 75a toward the inner direction along the upper surface 75a, and is farther from the upper surface 75a than the engagement portion 341 in the Z direction orthogonal to the upper surface 75a. The inner surface 321 is separated from the end edge 311a of the pad 311 in the inner direction. That is, the upper surface 75a is exposed between the edge 311a of the pad 311 and the inner surface 321 in the inner direction without being covered by the cover layer 77. Therefore, a space S5 through which the cleaning liquid C can flow can be formed between the end edge 311a of the pad 311 and the inner surface 321 in the inner direction and between the separation portion 342 and the upper surface 75a. In other words, the spaces S4 and S5 between the separating portion 342 and the FPC18 are set to be large, and the cleaning liquid C can easily flow through the spaces S4 and S5. Therefore, the HDD10 according to the present embodiment can suppress substances that may contaminate the HDD10, such as flux remaining in the spaces S4 and S5 between the separating portion 342 and the FPC18, and can suppress a problem that the substances that may contaminate the HDD10 cause a head crash.
The wire 340 is disposed between the engaging portion 341 and the separating portion 342, and has an intermediate portion 343 extending obliquely with respect to the upper surface 75a. The inner surface 321 is separated from an end of the middle portion 343 in the inner direction. This sets the spaces S4 and S5 between the intermediate portion 343 and the FPC18 to be large, and the cleaning liquid C can easily flow through the spaces S4 and S5. Therefore, the HDD10 according to the present embodiment can suppress the substances that may contaminate the HDD10 from remaining in the spaces S4 and S5 between the intermediate portion 343 and the FPC18, and can suppress the substances that may contaminate the HDD10 from causing a head crash.
At least a part of an end edge 321a of the inner surface 321 in the inner direction is located between the upper surface 75a and the case 151. In other words, at least a part of the end edge 321a of the exposure hole 320 in the inner direction is covered by the case 151. That is, the inner direction is a direction from the engaging portion 341 toward the inner side of the relay connector 302 in the direction along the upper surface 75a. Spaces S4 and S5 between the separating portion 342 and the FPC18 are provided between the housing 151 and the FPC18. In the HDD10 of the present embodiment, the spaces S4 and S5 between the case 151 and the FPC18 can be set large, and it is possible to suppress the substances that may contaminate the HDD10 from remaining in the spaces S4 and S5 between the separating portion 342 and the FPC18.
An end edge 311b of the pad 311 in the outer direction opposite to the inner direction is covered with the cover layer 77. Thus, for example, when the end edge 311b of the pad 311 in the outer direction is connected to the wiring, solder can be prevented from adhering to the wiring.
In the above description, suppression is defined, for example, as preventing the occurrence of a phenomenon, action, or influence, or reducing the degree of a phenomenon, action, or influence. In the above description, the restriction is defined, for example, as preventing movement or rotation, or allowing movement or rotation within a prescribed range and preventing movement or rotation beyond the prescribed range.
Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the scope equivalent thereto.

Claims (18)

1. A disk device is provided with:
a magnetic disk;
a magnetic head configured to read and write information from and to the magnetic disk;
a flexible printed circuit board electrically connected to the magnetic head;
an electronic component mounted on the flexible printed circuit board; and
a wall having higher rigidity than the flexible printed circuit board and mounted on the flexible printed circuit board,
the flexible printed circuit board has a 1 st surface facing the electronic component with a gap therebetween, and a 2 nd surface located opposite to the 1 st surface and facing the wall, the flexible printed circuit board being provided with a 1 st through hole, the 1 st through hole being open at the 1 st surface and the 2 nd surface and communicating with the gap,
the wall is provided with a 2 nd through hole, and the 2 nd through hole penetrates through the wall and is communicated with the 1 st through hole.
2. The disk apparatus of claim 1, wherein,
the above-mentioned flexible printed circuit board has a 1 st terminal,
the electronic component includes a housing and a 2 nd terminal provided in the housing and electrically connected to the 1 st terminal through solder,
the gap is provided between the 1 st surface and the housing.
3. The disk apparatus according to claim 2,
the flexible printed circuit board has a 1 st layer including the 1 st surface and a 2 nd layer covering the 1 st surface,
the 2 nd layer is provided with a 3 rd through hole, the 3 rd through hole penetrates the 2 nd layer to expose the 1 st surface, the 1 st through hole and the 1 st terminal, the 2 nd layer has a 3 rd surface where the 3 rd through hole is opened and an inner surface of the 3 rd through hole extending between the 1 st surface and the 3 rd surface,
an edge of the 3 rd surface connected to the inner surface is separated from the case in a direction along the 1 st surface.
4. The disk apparatus of claim 3, wherein,
the inner surface has a 1 st edge connected to the 1 st surface and a 2 nd edge connected to the 3 rd surface and larger than the 1 st edge,
at least a portion of the inner surface extends obliquely to the 1 st surface between the 1 st edge and the 2 nd edge.
5. The disk apparatus of claim 2, wherein,
the flexible printed circuit board has a 1 st layer including the 1 st surface, a 2 nd layer covering the 1 st surface, and a conductive 3 rd layer located between the 1 st layer and the 2 nd layer and including the 1 st terminal,
the 2 nd layer is provided with a 3 rd through hole penetrating the 2 nd layer,
the 3 rd through hole includes: an exposure portion exposing the 1 st surface, the 1 st through hole, and the 1 st terminal; and an extension portion extending from the exposure portion to expose the 1 st surface and separate the 1 st surface from the 3 rd layer,
at least a part of the protruding portion is separated from the housing in a direction along the 1 st surface.
6. The disk apparatus according to any one of claims 2 to 5,
further comprises an adhesive layer for bonding the flexible printed circuit board and the wall to each other,
the adhesive layer is provided with a 4 th through hole penetrating the adhesive layer,
the flexible printed circuit board has a 1 st portion adhered to the wall by the adhesive layer and a 2 nd portion bent to contact the wall through the 4 th through hole,
the 2 nd portion has the 1 st surface, and the 1 st through hole and the 1 st terminal are provided in the 2 nd portion.
7. The disk apparatus according to any one of claims 1 to 5,
the electronic component is a land grid array.
8. The disk apparatus of claim 1, wherein,
the flexible printed circuit board comprises a 1 st layer including the 1 st surface, a 2 nd layer covering the 1 st surface, and a pad provided on the 1 st surface,
the electronic component comprises a shell and a metal part arranged on the shell,
a 5 th through hole is formed in the 2 nd layer, the 5 th through hole penetrating the 2 nd layer to expose the 1 st surface and the pad, the 2 nd layer has a 3 rd surface where the 5 th through hole is opened and an inner surface of the 5 th through hole extending between the 1 st surface and the 3 rd surface,
the metal member includes: a bonding portion bonded to the pad via solder; and a separating portion provided between the joining portion and the housing, separated from the joining portion in a 1 st direction along the 1 st surface in a direction along the 1 st surface, and further separated from the 1 st surface than the joining portion in a direction orthogonal to the 1 st surface,
the inner surface is separated from an end of the pad in the 1 st direction.
9. The disk apparatus according to claim 8,
the metal member has an intermediate portion that is provided between the joining portion and the separating portion and extends obliquely with respect to the 1 st surface,
the inner surface is separated from an end portion of the intermediate portion in the 1 st direction.
10. The disk apparatus according to claim 8 or 9,
at least a part of an end of the inner surface in the 1 st direction is located between the 1 st surface and the housing.
11. The disk apparatus according to claim 8,
an end portion of the pad in a 2 nd direction opposite to the 1 st direction is covered with the 2 nd layer.
12. A disk device includes:
a magnetic disk;
a magnetic head configured to read and write information from and to the magnetic disk;
a flexible printed circuit board electrically connected to the magnetic head, having a mounting surface and a 1 st terminal provided on the mounting surface; and
an electronic component mounted on the flexible printed circuit board, including a housing and a 2 nd terminal provided in the housing and electrically connected to the 1 st terminal via solder,
the mounting surface has a 1 st region and a 2 nd region recessed from the 1 st region and provided with the 1 st terminal,
an edge of the 1 st region connected to the 2 nd region is separated from the case in a direction along the 1 st region.
13. The disk apparatus of claim 12, wherein,
the flexible printed circuit board has a 1 st layer provided with the 1 st terminal and a 2 nd layer covering the 1 st layer,
the 2 nd layer has the 1 st region, and the 2 nd layer is provided with an exposure hole which penetrates the 2 nd layer to open in the 1 st region and expose the 1 st layer and the 1 st terminal,
the 2 nd region has an inner surface of the exposure hole,
an edge of the 1 st region connected to the inner surface is separated from the case in a direction along the 1 st region.
14. The disk device according to claim 12, further comprising:
a wall having higher rigidity than the flexible printed circuit board and mounted on the flexible printed circuit board; and
an adhesive layer adhering the flexible printed circuit board and the wall to each other,
the adhesive layer is provided with a through hole penetrating through the adhesive layer,
the flexible printed circuit board has a 1 st portion adhered to the wall by the adhesive layer and a 2 nd portion bent so as to contact the wall through the through hole,
the above-mentioned 1 st portion has the above-mentioned 1 st region,
the 2 nd portion has the 2 nd region.
15. A disk device is provided with:
a magnetic disk;
a magnetic head configured to read and write information from and to the magnetic disk;
a flexible printed circuit board having a 1 st layer, a land provided on a surface of the 1 st layer, and a 2 nd layer covering the surface, the flexible printed circuit board being provided with an exposure hole which penetrates the 2 nd layer to expose the surface and the land, the flexible printed circuit board being electrically connected to the magnetic head;
an electronic component having a housing and a metal member provided on the housing, the electronic component being mounted on the flexible printed circuit board,
the metal member includes: a bonding portion bonded to the pad via solder; and a separating portion provided between the engaging portion and the housing, separated from the engaging portion in a 1 st direction along the surface in a direction along the surface, and further separated from the surface than the engaging portion in a direction orthogonal to the surface,
the inner surface of the exposure hole is separated from the end of the pad in the 1 st direction.
16. The disk apparatus according to claim 15,
the metal member has an intermediate portion that is provided between the engaging portion and the separating portion and extends obliquely with respect to the surface,
the inner surface is separated from an end portion of the intermediate portion in the 1 st direction.
17. The disk apparatus according to claim 15 or 16,
at least a part of an end of the inner surface in the 1 st direction is located between the surface and the housing.
18. The disk apparatus according to claim 15,
an end portion of the pad in a 2 nd direction opposite to the 1 st direction is covered with the 2 nd layer.
CN202211012212.2A 2021-08-26 2022-08-23 disk device Pending CN115938408A (en)

Applications Claiming Priority (4)

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JP2021-138140 2021-08-26
JP2021138140 2021-08-26
JP2022-122931 2022-08-01
JP2022122931A JP2023033148A (en) 2021-08-26 2022-08-01 disk device

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