CN115933817A - Touch control panel module and electronic equipment - Google Patents

Abstract

The invention provides a touch pad module and electronic equipment. The touch control panel module comprises a first touch control layer, a second touch control layer, a transparent cover plate, a circuit board and a fingerprint identification module, wherein the first touch control layer is provided with a first through hole; the second touch layer is a transparent touch layer and is spliced with the first touch layer at the first through hole; the transparent cover plate is arranged above the first touch layer and the second touch layer; the circuit board is arranged below the first touch layer and is provided with a second through hole corresponding to the first through hole; the circuit board is electrically connected with the first touch layer and the second touch layer respectively; the fingerprint identification module is arranged at the position of the second through hole; a detection signal sent by the fingerprint identification module can penetrate through the transparent cover plate and the second touch layer; the detection signal is an optical signal or an ultrasonic signal. Therefore, the continuity of the touch area can be realized on the upper surface of the transparent cover plate, and fingerprints can be identified in the area corresponding to the second touch layer.

Description

Touch control panel module and electronic equipment

Technical Field

The embodiment of the invention relates to the technical field of touch control and identification, in particular to a touch control panel module and electronic equipment.

Background

The touchpad is an important component of a notebook computer and is endowed with more requirements, for example, a pressure sensor is added to realize pressure detection when a finger is pressed, LAR or a piezoelectric actuator is added to have better interactive experience for a user, a capacitive fingerprint identification area is integrated on a traditional notebook touchpad, but the capacitive fingerprint identification area can only realize a fingerprint identification function and cannot realize a touch function, and therefore, the capacitive fingerprint identification area occupies a part of the touch area, and the touch experience is poor. Moreover, the appearance difference between the capacitive fingerprint identification area and the touch area is large, which affects the beauty of the whole machine.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a touch pad module and an electronic device to at least partially solve the above problems.

According to a first aspect of the embodiments of the present invention, a touch panel module is provided, which includes a first touch layer, a second touch layer, a transparent cover plate, a circuit board, and a fingerprint identification module, wherein the first touch layer is provided with a first through hole; the second touch layer is a transparent touch layer, the second touch layer is positioned above the first touch layer and covers the first through hole, and the periphery of the second touch layer is spliced with the first touch layer to form a complete touch area; the transparent cover plate is arranged above the first touch layer and the second touch layer; the circuit board is arranged below the first touch layer and is provided with a second through hole correspondingly communicated with the first through hole; the circuit board is electrically connected with the first touch layer and the second touch layer respectively; the fingerprint identification module is positioned below the second touch layer, arranged at the position of the second through hole and used for transmitting a detection signal capable of passing through the second touch layer and the transparent cover plate, wherein the detection signal is an optical signal or an ultrasonic signal; when the finger is located above the second touch layer, the detection signal is reflected by the fingerprint on the surface of the finger to form a feedback signal, and the feedback signal passes through the transparent cover plate and the second touch layer to reach a signal receiving area of the fingerprint identification module. .

Optionally, the upper surface of the first touch layer has a first conductive exposed area, the lower surface of the second touch layer has a second conductive exposed area, and the second touch layer is overlapped above the first conductive exposed area through the second conductive exposed area; the touch pad module further comprises a first conductive adhesive layer, and the first conductive adhesive layer is arranged between the second conductive exposed area and the first conductive exposed area.

Optionally, the width d1 of the overlapping portion of the second conductive exposed area and the first conductive exposed area is 150 um-200 um.

Optionally, the first conductive exposed area is annular and surrounds the first through hole; the second conductive exposed area is annular and corresponds to the first conductive exposed area.

Optionally, the touch panel module further includes a first structural adhesive, and the first structural adhesive is bonded between the lower surface of the second touch layer and the inner wall of the first through hole.

Optionally, the touch panel module further includes a conductive connecting member and a second conductive adhesive layer, the lower surface of the circuit board has a third conductive exposed area, one end of the conductive connecting member is conductively connected to the second touch layer, the other end of the conductive connecting member is connected to the lower side of the third conductive exposed area in an overlapping manner, and the second conductive adhesive layer is disposed between the conductive connecting member and the first conductive exposed area.

Optionally, the width d2 of the second conductive adhesive layer is greater than or equal to 200um.

Optionally, a first gap exists between the second touch layer and the first touch layer in a radial direction of the first through hole, and a width of the first gap is smaller than or equal to 0.2mm.

Optionally, the touch panel module further includes a second structural adhesive, a second gap exists between the first touch layer and the transparent cover plate, the second gap is communicated with the first gap, and a part of the second structural adhesive is located in the first gap, and another part of the second structural adhesive is located in the second gap.

Optionally, the touch panel module further includes a first double-sided adhesive layer and a second double-sided adhesive layer, the first double-sided adhesive layer is bonded between the first touch layer and the transparent cover plate, and the second double-sided adhesive layer is bonded between the second touch layer and the transparent cover plate; and the first double-sided adhesive layer and the second double-sided adhesive layer are respectively bonded with two sides of the second structural adhesive.

Optionally, the touch panel module further includes a first ink coating and a second ink coating coated on the lower surface of the transparent cover plate; the first ink coating and the second ink coating respectively correspond to the first touch layer and the second touch layer, and the first ink coating and the second ink coating are consistent in appearance; when the fingerprint detection signal is an optical signal, the second ink coating allows the optical signal to pass through.

Optionally, the fingerprint identification module is an optical module, the optical module includes an excitation light source and a barrier, and the barrier is disposed between the excitation light source and the signal receiving area; or the like, or, alternatively,

the fingerprint identification module is the ultrasonic wave module, the seamless laminating of ultrasonic wave module is in the lower surface on second touch-control layer.

According to a second aspect of the embodiments of the present invention, an electronic device is provided, which includes the above-mentioned touch pad module.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the embodiments of the present invention, and it is also possible for a person skilled in the art to obtain other drawings based on the drawings.

Fig. 1 is a schematic plan view of a touch pad module according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of a second touch layer and a first touch layer of a touch pad module according to an embodiment of the disclosure.

Fig. 3 is a schematic structural diagram of another second touch layer and a first touch layer of a touch pad module according to an embodiment of the disclosure.

Fig. 4 is a schematic structural diagram of a touch pad module according to an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a touch pad module according to an embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of a touch pad module according to an embodiment of the present disclosure.

Fig. 7 shows an electrode layer pattern of the second touch layer according to an embodiment of the disclosure.

Reference numerals are as follows:

10-a reinforced steel plate, 20-a first touch layer, 201-a first conductive exposed area;

30-a second touch layer, 301-a second conductive exposed area, 302-a conductive connecting piece;

40-a transparent cover plate; 51-first ink coat, 52-second ink coat;

61-a first conductive adhesive layer, 62-a second conductive adhesive layer, 63-a first structural adhesive, 64-a second structural adhesive, 65-a first double-sided adhesive layer, 66-a second double-sided adhesive layer;

800-fingerprint identification module, 801-light path layer, 802-sensor chip, 803-barrier and 804-excitation light source; 811-a first circuit board, 812-a first gold wire, 813-a bonding pad, 814-a light-shielding layer, 815-a gold wire protective adhesive, 821-a second circuit board, 822-a light-shielding support,

831-acoustic layer, 832-transmitting layer, 833-receiving layer, 834-third circuit board, 835-connector, 836-second gold wire; 90-circuit board, 901-third conductive bare area.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be described in detail below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the embodiments of the present invention should fall within the scope of protection of the embodiments of the present invention.

It should be understood that the terms "first," "second," and "third," etc. in the claims, description, and drawings of the present disclosure are used to distinguish between different objects and not to describe a particular order. The terms "comprises" and "comprising," when used in the specification and claims of this disclosure, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the disclosure. As used in the specification and claims of this disclosure, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the specification and claims of this disclosure refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

A touch area is arranged on the electronic equipment, and the electronic equipment can be controlled by touching and pressing the touch area. One of the important components for realizing the touch function is a touch layer, which is transparent and non-transparent, the transparent touch layer is expensive, and for an electronic device with a touch area and a display area separated from each other, the non-transparent touch layer is only used for the touch area. In order to realize better control experience, can also set up electric capacity fingerprint identification regional in non-transparent touch-control is regional, can only realize the fingerprint identification function in electric capacity fingerprint identification region, can not realize the touch-control function. Therefore, the touch experience of the electronic equipment is poor, the appearance difference between the touch area and the capacitance fingerprint identification area is large, and the overall attractiveness of the electronic equipment is affected.

In view of the above disadvantages, the present application provides a touch pad module, which can be applied to various electronic devices. Such as portable or mobile computing devices, e.g., laptop computers, gaming devices, and other electronic devices, e.g., electronic databases, automobiles, automated Teller Machines (ATMs), and the like. However, the embodiments of the present application do not limit this.

Referring to fig. 1 and 2, a touch panel module provided in an embodiment of the present invention includes a first touch layer 20, a second touch layer 30, a transparent cover 40, a circuit board 90, and a fingerprint identification module 800, wherein the first touch layer 20 is provided with a first through hole, the second touch layer 30 is a transparent touch layer, the second touch layer 30 is located above the first touch layer 20 and covers the first through hole, and the periphery of the second touch layer 30 is spliced with the first touch layer 20 to form a complete touch area; the transparent cover 40 is disposed above the first touch layer 20 and the second touch layer 30; the circuit board 90 is disposed below the first touch layer 20 and has a second through hole correspondingly connected to the first through hole, and the circuit board 90 is electrically connected to the first touch layer 20 and the second touch layer 30 respectively. The Circuit Board 90 may be a Printed Circuit Board (PCB).

In this way, the first touch layer 20 and the second touch layer 30 are complementary in area, when a human finger touches and presses the upper surface of the transparent cover plate 40, and touches the area corresponding to the first touch layer 20, the first touch layer 20 can generate a corresponding sensing signal, and when touching the area corresponding to the second touch layer 30, the second touch layer 30 can generate a corresponding sensing signal, and the sensing signals of the two parts can be transmitted to the relevant processing unit of the electronic device through the circuit board 90, so that the touch function is realized. Since the second touch layer 30 covers the first through hole and is spliced with the first touch layer 20 to form a complete touch area, uninterrupted continuous touch can be realized in the area of the upper surface of the transparent cover plate 40 corresponding to the first touch layer 20 and the area corresponding to the second touch layer 30, and the use experience is better. The circuit board 90 may be provided with corresponding devices to provide driving power for the first touch layer 20 and the second touch layer 30, and to obtain the sensing signal generated by the first touch layer and the sensing signal generated by the second touch layer. The first touch layer 20 and the second touch layer 30 may be both capacitive touch layers, on which an emitting end for emitting a signal and a receiving end for receiving a signal are disposed to generate an electric field around the touch layers, when a finger touches the transparent cover 40, the finger approaches the electric field to change the original electric field distribution, and the touch layers can generate a corresponding sensing signal.

Meanwhile, the fingerprint identification module 800 is located below the second touch layer 30 and placed at the position of the second through hole, and is used for transmitting a detection signal which can pass through the second touch layer 30 and the transparent cover plate 40, wherein the detection signal is an optical signal or an ultrasonic signal. Thus, when the fingerprint is located above the second touch layer 30, the detection signal can be returned by the fingerprint to form a feedback signal, and the feedback signal can pass through the transparent cover 40 and the second touch layer 30 to enter the first through hole and the second through hole, and then reaches the signal receiving area of the fingerprint identification module 800. Like this, just can correspond the region with first through-hole at transparent cover 40, utilize fingerprint identification module 800 to realize the recognition function, in other words, second touch-control layer 30 can allow fingerprint identification module 800 to carry out the discernment of fingerprint when realizing touch-control function to can carry out touch-control in succession on transparent cover 40 upper surface, can also correspond the region with fingerprint identification module 800 and carry out fingerprint identification. In this application, the signal reception area of fingerprint identification module 800 is the upper surface that is located first through-hole department of fingerprint identification module 800.

That is, the whole area corresponding to the transparent cover 40 may be used as the touch area of the touch pad module, and the touch area of the touch pad module is partially designed to be transparent, so that the touch function can be realized in the transparent touch area, and thus the touch area on the upper surface of the transparent cover 40 is continuous, and the fingerprint identification can also be realized in the transparent touch area. If the fingerprint recognition module 800 is an optical recognition module, the detection signal is an optical signal and can pass through the transparent touch area. Certainly, the fingerprint identification module 800 may also be an ultrasonic module, and the detection signal is an ultrasonic signal, and the transparent touch area allows the ultrasonic signal to pass through. The feedback signal contains the relevant features of the fingerprint for identification.

For example, referring to fig. 4, the fingerprint is a fingerprint of a human finger, the fingerprint identification module 800 is an optical module, the optical module includes an excitation light source 804 disposed in the second through hole, when the finger presses the fingerprint detection area corresponding to the transparent cover 40, detection light (i.e., a detection signal) emitted by the excitation light source 804 toward the human finger is reflected by the fingerprint on the surface of the finger, wherein the reflection light of the ridge and the valley of the finger fingerprint is different, the reflection light is a feedback signal, the reflection light can pass through the transparent cover 40 and the second touch layer 30 to reach the signal receiving area of the optical module, and the optical module can convert the received reflection light signal into a corresponding electrical signal; fingerprint image data can be obtained based on the electric signals, and fingerprint matching verification can be further carried out, so that an optical fingerprint identification function is realized on the electronic equipment.

It should be clear that, in the present application, "up and down" is defined based on two opposite sides of the transparent cover 40, a side of the transparent cover 40 facing the user is an upper side, and a side facing away from the user is a lower side, so that the first touch layer 20 and the second touch layer 30 are both located on the lower side of the transparent cover 40. The first touch layer 20 and the second touch layer 30 can be bonded to the lower surface of the transparent cover plate 40, so that when the upper surface of the transparent cover plate 40 is touched, the first touch layer 20 and the second touch layer 30 can sense fingers sensitively, and thus sensing signals can be generated. When the first ink coating 51 and the second ink coating 52 are disposed on the lower surface of the transparent cover 40, the first touch layer 20 may be adhered to the first ink coating 51 by a first double-sided adhesive layer 65, and the second touch layer 30 may be adhered to the second ink coating 52 by a second double-sided adhesive layer 66. In other words, when viewed from the upper surface of the transparent cover 40, the first ink coating 51 can block the first touch layer 20 under the transparent cover 40, and the second ink coating 52 blocks the second touch layer 30 under the transparent cover 40, so that the appearance of the touch panel module can be more beautiful by setting the colors of the two coatings to be the same.

Optionally, the first touch layer 20 may be a capacitive touch layer, and the second touch layer 30 may be a transparent capacitive touch layer.

Optionally, the electrode layer of the second touch layer 30 may be a transparent multi-component alloy conductive film. For example, the second touch layer 30 may be a transparent Indium Tin Oxide (ITO) touch layer. The first touch layer 20 may be transparent or non-transparent.

The second touch layer 30 includes an electrode layer, the electrode layer is provided with a driving electrode and a sensing electrode, the driving electrode is used as a transmitting end, the sensing electrode is used as a receiving end, and a transparent insulating film is provided on an outer surface of the second touch layer 30 to protect the electrodes on the second touch layer 30. An insulating film is also provided on the outer surface of the first touch layer 20 to protect the electrodes on the first touch layer 20. When it is necessary to electrically connect the electrode layer to the outside, the insulating film may be windowed, and the electrode exposed at the windowed portion forms a conductive exposed region, which may be electrically connected to the outside.

The first touch layer 20 may include one electrode layer or two electrode layers; when the electrode layer is included, a driving electrode and an induction electrode are arranged on the electrode layer, the driving electrode is used as a transmitting end, and the induction electrode is used as a receiving end; when the two electrode layers are included, one electrode layer is provided with a driving electrode, and the other electrode layer is provided with an induction electrode; an insulating film is disposed on an outer surface of the first touch layer 20 to protect the electrodes. Then, when it is necessary to electrically connect the electrode layer to the outside, the insulating film may be windowed, and the electrode exposed at the windowed portion forms a conductive exposed region, which may be electrically connected to the outside. The first touch layer 20 is disposed above the circuit board 90, and when the first touch layer 20 includes two electrode layers, the two electrode layers can be electrically connected to the circuit board 90 below through via holes located inside the first touch layer 20 by using a via hole process, that is, the receiving end and the transmitting end are electrically connected to the circuit board 90 through internal via holes, the first touch layer 20 can obtain electric energy from the circuit board 90, and the generated sensing signal can be transmitted to the circuit board 90.

Fig. 7 shows a pattern of an electrode layer when the receiving end and the transmitting end of the second touch layer 30 are located on the same electrode layer. When the receiving end and the emitting end of the first touch layer 20 are located on the same electrode layer, the pattern thereof may be the same as or different from the pattern shown in fig. 7.

Referring to fig. 2, in order to electrically connect the second touch layer 30 to the circuit board 90, when the first touch layer 20 includes one electrode layer, that is, when the receiving end and the transmitting end are located on the same electrode layer, the upper surface of the first touch layer 20 may have a first conductive exposed area 201, the lower surface of the second touch layer 30 has a second conductive exposed area 301, and the first conductive exposed area 201 and the second conductive exposed area 301 are electrically connected, so that the first touch layer 30 and the second touch layer 20 are electrically connected, and the sensing signal of the second touch layer 30 may be transmitted to the circuit board 90 through the first touch layer 20. That is, when the second touch layer 30 senses a finger touch to generate a sensing signal, the sensing signal may be transmitted to the first conductive exposed area 201 through the second conductive exposed area 301, and then transmitted to the circuit board 90 through the first touch layer 20. Here, it should be noted that when the first conductive exposed area 201 and the second conductive exposed area 301 are electrically connected, the receiving end of the first touch layer 20 is required to be in butt joint with the receiving end of the second touch layer 30, and the emitting end of the first touch layer 20 is required to be in butt joint with the emitting end of the second touch layer 30.

Referring to fig. 2, in some embodiments of the present application, the second touch layer 30 is overlapped on the first conductive exposed area 201 through the second conductive exposed area 301. Thus, the first touch layer 20 can support the second touch layer 30 upwards, which is beneficial to stably disposing the second touch layer 30 on the lower surface of the transparent cover 40 and keeping the structural stability of the second touch layer 30.

Optionally, the first conductive exposed area 201 is disposed at a side close to the first through hole, so as to be connected to the second conductive exposed area 301 on the second touch layer 30.

Optionally, the second conductive exposed area 301 may be disposed at an edge of the second touch layer 30 so as to be connected to the first conductive exposed area 201 on the first touch layer 20.

Optionally, the area of the second conductive exposed region 301 may be smaller than the area of the first conductive exposed region 201, or the width of the second conductive exposed region 301 may be smaller than the width of the first conductive exposed region 201. The area of the first conductive exposed area 201 is larger, so that the difficulty of placing the second touch layer 30 on the first touch layer 20 and overlapping the second conductive exposed area 301 on the first conductive exposed area 201 can be reduced. In addition, since the first conductive exposed area 201 is located on the upper surface of the first touch layer 20, and the first touch layer 20 and the second touch layer 30 are respectively disposed on the lower surface of the transparent cover 40, the first conductive exposed area 201 is enclosed between the first touch layer 20, the second touch layer 30 and the transparent cover 40, that is, the first conductive exposed area 201 is located in an enclosed space, and even if the width of the first conductive exposed area 201 is greater than that of the second conductive exposed area 301, a part of the first conductive exposed area 201 and the second conductive exposed area 301 are still exposed in the enclosed space after being connected in an overlapping manner, the security of the entire touch pad module is not affected.

In one possible embodiment, the touch pad module further includes a first conductive adhesive layer 61, and the first conductive adhesive layer 61 is disposed between the second conductive exposed area 301 and the first conductive exposed area 201. The first conductive adhesive layer 61 can not only electrically connect the second conductive exposed area 301 with the first conductive exposed area 201, but also bond the first touch layer 20 and the second touch layer 30 together, which is beneficial to keeping the relative positions of the first touch layer 20 and the second touch layer 30 stable. Specifically, the first Conductive adhesive layer 61 may be an Anisotropic Conductive Film (ACF), and the Anisotropic Conductive adhesive Film is laminated between the second Conductive exposed area 301 and the first Conductive exposed area 201 by a laminating process, so that the Anisotropic Conductive adhesive Film can conduct electricity and perform an adhesive function.

Optionally, referring to fig. 2, the width d1 of the overlapping portion of the second conductive exposed area 301 and the first conductive exposed area 201 may be 150um to 200um, in other words, the width of the first conductive adhesive layer 61 between the first conductive exposed area 201 and the second conductive exposed area 301 may be 150um to 200um. Therefore, the connecting part of the first touch layer 20 and the second touch layer 30 has a wider conductive channel, which is beneficial for the induction signal of the second touch layer 30 to be quickly and completely transmitted to the first touch layer 20, and ensures the touch sensitivity; and the first touch layer 20 and the second touch layer 30 are firmly adhered.

Optionally, the first conductive exposed area 201 is annular and surrounds the first through hole; the second conductive exposed area 301 is annular and corresponds to the first conductive exposed area 201. That is, the periphery of the second touch layer 30 is overlapped on the first touch layer 20 and covers the first through hole. A first conductive adhesive layer 61 is arranged between the first conductive exposed area 201 and the second conductive exposed area 301, so that the first touch layer and the second touch layer 30 are connected more firmly, and the structural stability is good.

In addition, referring to fig. 2, the touch pad module further includes a first structural adhesive 63, and the first structural adhesive 63 is adhered between the lower surface of the second touch layer 30 and the inner wall of the first through hole. That is, when the second touch layer 30 is overlapped on the first touch layer, the first structural adhesive 63 may be located in the first through hole, one side of which is connected to the inner wall of the first through hole, and the other side of which is connected to the lower surface of the second touch layer 30. The first structural adhesive 63 not only connects the first touch layer and the second touch layer 30, but also can support the second touch layer 30, thereby enhancing the structural stability.

When the first touch layer 20 includes two electrode layers, that is, the receiving end and the transmitting end are located on different electrode layers, the receiving end and the transmitting end can be electrically connected to the circuit board 90 below through the via hole located in the first touch layer 20 by a via hole process. Correspondingly, referring to fig. 3, the touch panel module may further include a conductive connecting member 302, the lower surface of the circuit board 90 has a third conductive exposed area 901, one end of the conductive connecting member 302 is electrically connected to the second touch layer 30, and the other end is overlapped under the third conductive exposed area 901. That is, the second touch layer 30 and the first touch layer 20 are connected to the circuit board 90 in parallel, and the sensing signal of the second touch layer 30 is directly transmitted to the circuit board 90 through the conductive connecting member 302. An insulating film is disposed on the lower surface of the circuit board 90 to protect the circuit board 90, a window may be formed on the insulating film, and the printed circuit exposed at the window forms a third conductive exposed region 901. The electrode layer and the conductive connecting member 302 can be conductively connected by opening a window on the lower surface of the second touch layer 30. Of course, when the first touch layer 20 includes one electrode layer, one end of the conductive connecting member 30 may be electrically connected to the second touch layer 30, and the other end of the conductive connecting member is overlapped under the third conductive exposed area 901, so that the first touch layer 20 and the second touch layer 30 are connected to the circuit board 90 in parallel.

In one possible embodiment, the touch pad module further includes a second conductive adhesive layer 62, and the second conductive adhesive layer 62 is disposed between the conductive connecting member 302 and the third conductive exposed area. The second conductive adhesive layer 62 can electrically connect the conductive connecting member 302 with the third conductive exposed area, and can bond the conductive connecting member 302 and the first touch layer 20 together, which is favorable for ensuring the connection firmness of the conductive connecting member 302. Specifically, the second Conductive adhesive layer 62 may be an Anisotropic Conductive Film (ACF), and the Anisotropic Conductive adhesive Film is pressed between the third Conductive exposed area and the Conductive connecting member 302 by a pressing process, so that the Anisotropic Conductive adhesive Film can conduct electricity and perform a bonding function.

Alternatively, referring to fig. 3, the conductive connection member 302 may include an upper connection portion 3021 and a lower bonding portion 3022 connected in an L shape, the upper connection portion 3021 is located in the first through hole and is electrically connected to the second touch layer 30, and the lower bonding portion 3022 is bonded below the third conductive exposed area. A gap C may exist between the upper connection portion 3021 and the inner wall of the first through hole to reduce the probability that the upper connection portion 3021 is electrically connected to the first conductive bare region 201. The upper connecting portion 3021 may be electrically connected to an end of the second touch layer 30 and connected to the second touch layer 30 in an L-shape, and the lower connecting portion 3022 extends to a position below the third conductive exposed area 901 along a direction substantially parallel to the second touch layer 30, so that a space occupied by the conductive connecting member 302 in the first through hole may be reduced, and a large portion of the space in the first through hole may be used to transmit the detection signal and the feedback signal.

Optionally, the width d2 of the second conductive adhesive layer 62 may be greater than or equal to 200um. Therefore, a wider conductive channel is formed between the circuit board and the conductive connecting piece 302, which is beneficial for the sensing signal of the second touch layer 30 to be quickly and completely transmitted to the circuit board, and ensures the touch sensitivity; but also makes the circuit board and the conductive connector 302 firmly bonded.

Optionally, referring to fig. 3, the width d2 of the second conductive adhesive layer 62 may be greater than the width of the first conductive exposed area 201, so as to completely cover the first conductive exposed area 201, and reduce the risk of electric leakage of the first conductive exposed area 201 when the first conductive exposed area 201 is located on the lower surface of the first touch layer 20. In addition, the lower surface of the first touch layer 20 may be provided with an insulating film in other areas except the first conductive exposed area 201, and a part of the second conductive adhesive layer 62 may be adhered to the insulating film.

In a possible implementation manner, referring to fig. 3, in a radial direction of the first through hole, a first gap a may exist between the second touch layer 30 and the first touch layer 20, and a width of the first gap a is less than 0.2mm. When touch control is performed, in the process of sliding touch from the corresponding area of the first touch layer 20 to the corresponding area of the first through hole, the width of the first gap a is smaller than 0.2mm, so that it can be ensured that a user cannot perceive that the touch area is disconnected, and the experience of touch control continuity is guaranteed. Therefore, the existence of the first gap a smaller than 0.2mm can reduce the positioning difficulty between the second touch layer 30 and the first touch layer 20 while ensuring the use feeling, so that the assembly of the second touch layer 30 is easier.

Optionally, the touch panel module further includes a second structural adhesive 64, a second gap B exists between the first touch layer 20 and the transparent cover 40, the second gap B is communicated with the first gap a, and a part of the second structural adhesive 64 is located in the first gap a, and another part is located in the second gap B. At this time, the second structural adhesive 64 can simultaneously bond the first touch layer 20, the second touch layer 30 and the transparent cover plate 40, so that the three layers are integrated, thereby improving structural strength and stability. It should be noted that, referring to fig. 3, when the first ink coating 51 is disposed on the lower surface of the transparent cover plate 40, and the first touch layer 20 is adhered to the lower surface of the transparent cover plate 40 through the first double-sided adhesive layer 65, the second gap B only exists between the first ink coating 51 and the first touch layer 20, and the second structural adhesive 64 may be adhered to the first touch layer 20, the first ink coating 51, the first double-sided adhesive layer 65, and the second touch layer 30 at the same time.

Optionally, the touch panel module further includes a first double-sided adhesive layer 65 and a second double-sided adhesive layer 66, the first double-sided adhesive layer 65 is adhered between the first touch layer 20 and the transparent cover plate 40, and the second double-sided adhesive layer 66 is adhered between the second touch layer 30 and the transparent cover plate 40; the first double-sided adhesive layer 65 and the second double-sided adhesive layer 66 are respectively bonded to both sides of the second structural adhesive 64. In this way, the first double-sided adhesive layer 65, the second double-sided adhesive layer 66 and the second structural adhesive 64 are bonded together, so that the first touch layer 20 and the second touch layer 30 are firmly bonded to the lower surface of the transparent cover plate 40, and the structural strength is higher.

It should be noted that when the fingerprint detection signal is an optical signal, the second double-sided adhesive layer 66 allows the optical signal to pass through. Optionally, the second double-sided Adhesive layer 66 may be an optical Adhesive (OCA), and has the characteristics of being colorless and transparent, having a light transmittance of more than 90%, having good Adhesive strength, being curable at room temperature or at intermediate temperature, and having a small curing shrinkage. In addition, the first double-sided adhesive layer 65 may also be OCA optical adhesive. The first structural adhesive 63 and the second structural adhesive 64 may also be OCA optical adhesives, or may be other adhesive adhesives. The first double-sided adhesive layer 65 and the second double-sided adhesive layer 66 are adhered between the two overlapped surfaces, so that the first double-sided adhesive layer and the second double-sided adhesive layer have strong adhesion performance, but the first structural adhesive 63 and the second structural adhesive 64 are adhered between the first touch layer 20 and the second touch layer 30, and need not only have adhesion performance but also strong structural strength so as to stably maintain structural stability between the first touch layer 20 and the second touch layer 30.

Since the second touch layer 30 and the first touch layer 20 have different appearances, and the transparent cover 40 is transparent, when the appearance of the touch pad module is observed, the appearance of the region of the transparent cover 40 corresponding to the second touch layer 30 is obviously different from the appearance of the region corresponding to the first touch layer 20.

To solve the appearance problem, in one possible embodiment, referring to fig. 2 and 3, a first ink coating 51 and a second ink coating 52 are applied on the lower surface of the transparent cover plate 40; the first ink coating 51 and the second ink coating 52 correspond to the first touch layer 20 and the second touch layer 30, respectively, and the first ink coating 51 and the second ink coating 52 have the same appearance. In other words, the first ink coating 51 covers the first touch layer 20, the second ink coating 52 covers the second touch layer 30, and the edge of the first ink coating 51 and the edge of the second ink coating 52 are connected without a gap. Here, the first ink coating 51 and the second ink coating 52 are identical in appearance, which means that the two ink coatings have the same color when viewed through the transparent cover plate 40. Then, the appearance of the region of the transparent cover 40 corresponding to the second touch layer 30 can be consistent with the appearance of the region corresponding to the first touch layer 20, and the two regions are visually integrated, so that the touch experience can be further improved.

It should be noted that when the detection signal is an optical signal, the second ink coating 52 allows the optical signal to pass through. The optical signal may be infrared light.

Optionally, referring to fig. 1, after the appearances of the first ink coating 51 and the second ink coating 52 are made to be consistent, a graphic mark may be disposed at a position of the transparent cover plate 40 corresponding to the signal receiving area, the position of the transparent cover plate 10 corresponding to the signal receiving area is a detection area, and the detection area may be conveniently and quickly found by using the graphic mark.

In a possible implementation manner, referring to fig. 4 and 5, the fingerprint identification module 800 is an optical module, and an air gap exists between the optical module and the lower surface of the second touch layer 30; the optical module includes an excitation light source 804 and a baffle 803, the baffle 803 being disposed between the excitation light source 804 and the signal receiving area. The excitation light source 804 is capable of providing an optical signal for fingerprint detection. For example, the fingerprint is a finger fingerprint, when a finger presses the fingerprint detection area corresponding to the transparent cover plate 40, the light emitted by the excitation light source 804 is reflected at the fingerprint on the surface of the finger and forms reflected light, wherein the reflected light of the ridge and the valley of the finger fingerprint is different, and the reflected light passes through the transparent cover plate 40, the second ink coating 52 and the second double-sided adhesive layer 66, is received by the signal receiving area of the optical module, and is converted into a corresponding electrical signal; fingerprint image data can be obtained based on the electric signal, and fingerprint matching verification can be further carried out, so that the optical fingerprint identification function is realized on the electronic equipment. The barrier 803 can block the light emitted by the excitation light source 804 from directly entering the space where the signal receiving area of the optical module is located, that is, the light emitted by the excitation light source 804 is prevented from being directly received by the signal receiving area of the optical module, so that the non-fingerprint reflected light received by the signal receiving area is reduced.

Optionally, the excitation light source 804 may be an LED light source, the excitation light source 804 may be specifically an infrared light source or a light source of non-visible light with a specific wavelength, the type of the light source matches the light allowed to pass through by the first ink coating 51, for example, the second ink coating 52 allows infrared light of 850nm to 1300nm to pass through, and then the excitation light source 804 is an infrared light source. Specifically, the ink material used for the second ink coating 52 may be adjusted to match the light allowed to pass by the second ink coating 52 to the light emitted by the excitation light source 804.

In one possible embodiment, the optical module includes an optical path layer 801, a sensor chip 802, the optical path layer 801 disposed above the sensor chip 802; the optical path layer 801 and the excitation light source 804 are respectively located on both sides of the barrier 803, and the optical path layer 801 receives the feedback signal and guides the feedback signal to the sensor chip 802. In other words, the optical path layer 801 is a signal receiving area, the optical path layer 801 guides the feedback signal to the sensor chip 802, and the sensor chip 802 is used for receiving the feedback signal returned by the human finger above the transparent cover plate 40 and guided through the optical path layer 801. The optical path layer 801 may include a lens layer and an optical path guiding layer, the lens layer is configured to converge the optical signal returned by the human finger to the optical path guiding layer, and the optical path guiding layer guides the optical signal converged by the lens layer to the sensor chip 802.

In addition, as shown in fig. 4 to 6, the touch panel module may further include a reinforced steel plate 10, and the fingerprint identification module 800 is fixed on the upper surface of the reinforced steel plate 10. The reinforced steel plate 10 can provide support for the fingerprint identification module 800.

In some embodiments of the present application, as shown in fig. 4, the optical module may be an ultra-thin integrated module, and further includes a first circuit board 811, wherein the sensor chip 802 is electrically connected to the first circuit board 811, and the first circuit board 811 is used for transmitting signals. Specifically, the sensor chip 802 may enable electrical interconnection and signal transmission with peripheral circuitry or other components of the electronic device through the first circuit board 811. For example, the sensor chip 802 may receive a control signal of a processing unit of the electronic device through the first circuit board 811, and may also output a feedback signal (e.g., a fingerprint image) to the processing unit or the control unit of the electronic device, or the like, through the first circuit board 811. The first Circuit board 811 may be a Flexible Printed Circuit (FPC).

Alternatively, as shown in fig. 4, the ultra-thin integrated module further includes a first gold wire 812 and a first pad 813, both the sensor chip 802 and the first circuit board 811 can be directly fixed on the reinforced steel plate 10, the sensor chip 802 is electrically connected to the first pad 813 through the first gold wire 812, the first pad 813 is fixed on the first circuit board 813 and is electrically connected to the first circuit board 811, and the optical circuit layer 801 is directly fixed on the upper surface of the sensor chip 802.

As shown in fig. 4, the ultra-thin integrated module may further include a light shielding layer 814, where the light shielding layer 814 extends from above the first circuit board 811 to above the sensor chip 802, and a gap is formed between the light shielding layer 814 and the optical circuit layer 801. The light shielding layer 814 is used to shield light signals incident from other positions than the incident surface of the sensor chip 802. The light shielding layer 814 is configured to extend from above the first circuit board 811 to above the sensor chip 802, and it is also possible to fix the light shielding layer 814 as closely to the sensor chip 802 as possible. A gap is formed between the light shielding layer 814 and the light path layer 801, so that the image acquisition area of the fingerprint detection device can be prevented from being reduced due to the fact that the light shielding layer 814 covers the light path layer 801.

Optionally, the light-shielding layer 814 is a shielding adhesive layer, and the arc height position of the first gold wire 812 is covered by the shielding adhesive layer. Thus, not only can the optical signal incident from the non-incident surface of the sensor chip 802 be effectively shielded, but also the gold wire protective adhesive 815 using the first gold wire 812 can support the shielding adhesive layer.

Optionally, the touch panel module may further include a third double-sided adhesive layer 67, and the third double-sided adhesive layer 67 is disposed between the lower surface of the circuit board 90 and the light shielding layer 814, so as to bond the circuit board 90 and the ultra-thin integrated module. The third two-sided Adhesive layer 67 may be an Optical Clear Adhesive (OCA).

In other embodiments of the present disclosure, as shown in fig. 5, the optical module may be a lens module, and further includes a light shielding bracket 822 and a second circuit board 821, the optical path layer 801 is fixed on the light shielding bracket 822, the light shielding bracket 822 is fixed on the second circuit board 821, and the sensor chip 802 may be aligned with the optical path layer 801 and fixed on the second circuit board 821. The second circuit board 821 is used for transmitting signals, and in particular, the sensor chip 802 can realize electrical interconnection and signal transmission with peripheral circuits or other elements of the electronic device through the second circuit board 821. For example, the sensor chip 802 may receive a control signal of a processing unit of the electronic device through the second circuit board 821, and may also output a feedback signal (e.g., a fingerprint image) to the processing unit or the control unit of the electronic device, or the like, through the second circuit board 821. The second Circuit board 821 may be a Flexible Printed Circuit (FPC).

Optionally, the touch pad module may further include a fourth double-sided adhesive layer 68, and the fourth double-sided adhesive layer 68 is disposed between the lower surface of the circuit board 90 and the second circuit board 821, so as to bond the circuit board 90 and the lens module. Fourth two-sided Adhesive layer 68 may be an Optical Clear Adhesive (OCA).

Alternatively, the sensing chip 802 may be fixed on the upper surface of the second circuit board 821 by a die attach adhesive, and electrically connected to the second circuit board 8821 by gold wires. Alternatively, the sensor chip 802 may be soldered to the upper surface of the second circuit board 821.

In one possible implementation manner, as shown in fig. 6, the fingerprint identification module 800 may be an ultrasonic module, and the ultrasonic module is seamlessly attached to the lower surface of the second touch layer 30. The seamless fit can facilitate stable transmission of ultrasonic waves. The ultrasonic wave module can be to second touch-control layer 30 transmission ultrasonic wave, and the ultrasonic wave signal after human finger reflection is received by the signal reception district of ultrasonic wave module to can discern the fingerprint. The fingerprint identification principle of ultrasonic wave module is similar with optical module, all is based on there is ridge and millet and leads to the reflection different in the fingerprint surface of finger, and this application portion is repeated repeatedly.

Optionally, the ultrasonic wave module can include acoustic layer 831, transmitting layer 832 and receiving layer 833, and transmitting layer 832 can send the ultrasonic wave, and acoustic layer 831 seamless laminating is at second touch-control layer 30 lower surface to can transmit the ultrasonic wave, the ultrasonic wave is reflected back by the finger after passing through transparent cover 40, and receiving layer 833 receives the ultrasonic wave back that the finger reflected back, can carry out fingerprint identification. The ultrasonic module may be fixed to the upper surface of the reinforcing steel plate 10. For example, the receiving layer 833 may be bonded to the upper surface of the reinforced steel plate 10.

The ultrasonic module may further include a third circuit board 834 and a connector 835, the receiving layer 833 is electrically connected to the third circuit board 834 through a second gold wire 836, the third circuit board 834 is electrically connected to the connector 835, and the connector 835 is used for electrical interconnection and signal transmission with a peripheral circuit or other elements of the electronic device. In particular, the receiving layer 833 may enable electrical interconnection and signal transmission with peripheral circuits or other elements of the electronic device through the third circuit board 834 and the connector 835. For example, the receiving layer 833 may receive a control signal of a processing unit of the electronic device through the third circuit board 834 and the connector 835, and may also output a feedback signal (e.g., a fingerprint image) to the processing unit or the control unit of the electronic device through the third circuit board 834 and the connector 835, or the like. The third Circuit board 834 may be a Flexible Printed Circuit (FPC).

The application further provides an electronic device, which comprises the touch pad module, continuous touch can be achieved in a touch area, fingerprint identification can be achieved in the touch area, and user experience is improved.

It should be noted that the above detailed description of the preferred embodiments of the present application with reference to the drawings, however, the present application is not limited to the details of the above embodiments, and various simple modifications can be made to the technical solution of the present application within the technical concept of the present application, and the simple modifications belong to the protection scope of the present application. For example, the various features described in the foregoing detailed description may be combined in any suitable manner without contradiction, and various combinations that may be possible are not described in this application in order to avoid unnecessary repetition. For example, various embodiments of the present application may be arbitrarily combined with each other, and the same shall be considered as the disclosure of the present application as long as the concept of the present application is not violated.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk, and various media capable of storing program codes.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (13)

1. A touch pad module, comprising:

the touch screen comprises a first touch layer (20), wherein the first touch layer (20) is provided with a first through hole;

the second touch layer (30) is a transparent touch layer, the second touch layer (30) is positioned above the first touch layer (20) and covers the first through hole, and the periphery of the second touch layer (30) is spliced with the first touch layer (20) to form a complete touch area;

a transparent cover sheet (40), the transparent cover sheet (40) being disposed over the first touch layer (20) and the second touch layer (30);

the circuit board (90) is arranged below the first touch layer (20) and is provided with a second through hole correspondingly communicated with the first through hole; the circuit board (90) is electrically connected with the first touch layer (20) and the second touch layer (30) respectively;

the fingerprint identification module (800) is positioned below the second touch layer (30), arranged at the position of the second through hole, and used for transmitting a detection signal capable of passing through the second touch layer (30) and the transparent cover plate (40), wherein the detection signal is an optical signal or an ultrasonic signal;

when a finger is positioned above the second touch layer (30), the detection signal is reflected by the fingerprint on the surface of the finger to form a feedback signal, and the feedback signal passes through the transparent cover plate (40) and the second touch layer (30) to reach a signal receiving area of the fingerprint identification module (800).

2. The touchpad module as claimed in claim 1, wherein the upper surface of the first touch layer (20) has a first conductive exposed area (201), the lower surface of the second touch layer (30) has a second conductive exposed area (301), and the second touch layer (30) is overlapped above the first conductive exposed area (201) through the second conductive exposed area (301);

the touch pad module further comprises a first conductive adhesive layer (61), wherein the first conductive adhesive layer (61) is arranged between the second conductive exposed area (301) and the first conductive exposed area (201).

3. The touchpad module as claimed in claim 2, wherein the width d1 of the overlapping portion of the second conductive exposed area (301) and the first conductive exposed area (201) is 150um to 200um.

4. The touchpad module as claimed in claim 2, wherein the first conductive exposed area (201) is annular and surrounds the first via; the second conductive exposed area (301) is annular and corresponds to the first conductive exposed area (201).

5. The touch pad module of claim 2, further comprising a first structural adhesive (63), wherein the first structural adhesive (63) is adhered between the lower surface of the second touch layer (30) and the inner wall of the first through hole.

6. The touch panel module of claim 1, further comprising a conductive connecting member (302) and a second conductive adhesive layer (62), wherein the lower surface of the circuit board (90) has a third conductive exposed area, one end of the conductive connecting member (302) is electrically connected to the second touch layer (30), and the other end thereof is overlapped with the third conductive exposed area (201),

the second conductive glue layer (62) is arranged between the conductive connecting piece (302) and the first conductive exposed area (201).

7. The touch panel module of claim 6, wherein the width d2 of the second conductive adhesive layer (62) is greater than or equal to 200um.

8. The touchpad module as claimed in any of claims 1-7, wherein a first gap (A) exists between the second touch layer (30) and the first touch layer (20) in a radial direction of the first through hole, and a width of the first gap (A) is less than or equal to 0.2mm.

9. The touch panel module of claim 8, further comprising a second structural adhesive (64), wherein a second gap (B) exists between the first touch layer (20) and the transparent cover (40), the second gap (B) is in communication with the first gap (a), and a portion of the second structural adhesive (64) is located in the first gap (a) and another portion is located in the second gap (B).

10. The touchpad module of claim 9, further comprising a first layer of double-sided adhesive (65) and a second layer of double-sided adhesive (66), the first layer of double-sided adhesive (65) being bonded between the first touch layer (20) and the transparent cover (40), the second layer of double-sided adhesive (66) being bonded between the second touch layer (30) and the transparent cover (40); and the first double-sided adhesive layer (65) and the second double-sided adhesive layer (66) are respectively bonded with two sides of the second structural adhesive (64).

11. The touch pad module of any of claims 1-7, further comprising a first ink coating (51) and a second ink coating (52) applied to the lower surface of the transparent cover sheet (40); the first ink coating (51) and the second ink coating (52) respectively correspond to the first touch control layer (20) and the second touch control layer (30), and the first ink coating (51) and the second ink coating (52) are consistent in appearance; when the fingerprint detection signal is an optical signal, the second ink coating (52) allows the optical signal to pass through.

12. The touchpad module of any of claims 1-7, wherein the fingerprint recognition module (800) is an optical module comprising an excitation light source (804) and a barrier (803), the barrier (803) being disposed between the excitation light source (804) and the signal receiving area; or the like, or, alternatively,

fingerprint identification module (800) are the ultrasonic wave module, the seamless laminating of ultrasonic wave module is in the lower surface of second touch-control layer (30).

13. An electronic device comprising the touch pad module of any one of claims 1-12.

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