CN115927907A - Copper alloy powder and preparation method thereof - Google Patents
Copper alloy powder and preparation method thereof Download PDFInfo
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- CN115927907A CN115927907A CN202211450926.1A CN202211450926A CN115927907A CN 115927907 A CN115927907 A CN 115927907A CN 202211450926 A CN202211450926 A CN 202211450926A CN 115927907 A CN115927907 A CN 115927907A
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 69
- 239000000843 powder Substances 0.000 title claims abstract description 63
- 238000002360 preparation method Methods 0.000 title claims description 9
- 239000000956 alloy Substances 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 43
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 229910017566 Cu-Mn Inorganic materials 0.000 claims abstract description 9
- 229910017758 Cu-Si Inorganic materials 0.000 claims abstract description 9
- 229910002482 Cu–Ni Inorganic materials 0.000 claims abstract description 9
- 229910017871 Cu—Mn Inorganic materials 0.000 claims abstract description 9
- 229910017931 Cu—Si Inorganic materials 0.000 claims abstract description 9
- 238000005266 casting Methods 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000000889 atomisation Methods 0.000 claims description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 7
- 239000011572 manganese Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 2
- 238000010146 3D printing Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 230000000704 physical effect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000654 additive Substances 0.000 description 14
- 230000000996 additive effect Effects 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 8
- 229910006639 Si—Mn Inorganic materials 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000010587 phase diagram Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007873 sieving Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention relates to copper alloy powder, which comprises the following components in percentage by mass: 0.5 to 15.0wt% of Ni, 2.0 to 5.0wt% of Si, 2.0 to 6.0wt% of Mn, not more than 0.5wt% of total metal elements other than Cu, and the balance of Cu. The invention also relates to a method for preparing the copper alloy powder, which comprises the following steps: heating copper; adding the intermediate alloy Cu-Ni, the intermediate alloy Cu-Si and the intermediate alloy Cu-Mn into the heated copper, continuously heating, and then casting into a copper alloy bar; and atomizing the alloy bar to prepare copper alloy powder. The copper alloy material formed by 3D printing can improve the internal microstructure, reduce the internal defects of the material and improve the mechanical/physical properties.
Description
Technical Field
The invention relates to the technical field of spherical powder materials, in particular to copper alloy powder and a preparation method thereof.
Background
The metal material additive manufacturing technology generally adopts high-density energy heat sources such as laser, electron beams or energy-gathered beams to carry out selective melting, can conveniently realize the rapid prototype manufacturing of various refractory, difficult-to-process, high-activity and high-performance metal materials, and has wide application prospect in the fields of high-performance complex parts such as aerospace, war industry, automobiles, medical treatment and the like.
The metal powder is used as a key raw material for metal additive manufacturing, and the good performance and the bad performance of the metal powder are the key of the metal additive manufacturing technology. Spherical metal powder materials are raw materials and consumables for metal additive manufacturing (3D printing) processes. The research and development of high-grade powder materials are the primary conditions of the additive manufacturing (3D printing) process and are also important process links for the design and development of novel alloy materials. The development of the copper alloy material for additive manufacturing is not mature, and meanwhile, the defects of cracks, air holes, impurities, poor interlayer bonding, spheroidizing effect and the like are easily formed in a metal deposition layer under the influence of various forming process factors in the additive manufacturing process. The microstructure defect in the copper alloy material causes the deterioration of mechanical/physical properties of the metal parts manufactured by additive manufacturing, which is the most important technical bottleneck affecting the application and popularization of the additive manufacturing technology in the manufacturing of the metal parts, especially large complex metal components.
Therefore, it is an urgent need of the skilled in the art to develop a copper alloy powder, which can improve the internal microstructure and reduce the internal defects of the material by 3D printing the formed copper alloy material, so as to have high mechanical/physical properties.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide copper alloy powder, and a copper alloy material formed by 3D printing can improve the internal microstructure and reduce the internal defects of the material, so that the copper alloy powder has high mechanical/physical properties.
The first aspect of the invention provides a copper alloy powder, which comprises the following components in percentage by mass: ni content of 0.5-15.0 wt%, si content of 2.0-5.0 wt%, mn content of 2.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
In the invention, the addition of Ni into the copper alloy powder can play a role of solid solution strengthening, and the corrosion resistance of the alloy is improved. Preferably, the content of Ni may be, in mass%, 0.5%, 1%, 3%, 5%, 7%, 9%, 11%, 13%, 15%.
In the present invention, si is added to the copper alloy powder, which can improve the strength of the alloy. Preferably, the content of Ni may be, in mass percent, 2%, 3%, 4%, 5%.
In the invention, mn is added into the copper alloy powder, so that the strength and the corrosion resistance of the alloy can be improved. Preferably, the content of Mn may be, in mass percent, 2%, 3%, 4%, 5%, 6%.
Further, the copper alloy powder comprises, by mass: ni content of 0.5-10.0 wt%, si content of 2.0-5.0 wt%, mn content of 2.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
Further, the copper alloy powder comprises, by mass: ni content of 7.0-15.0 wt%, si content of 2.0-5.0 wt%, mn content of 4.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
In the present invention, the "balance of copper" means the mass percentage of Cu remaining after removing Ni, mn, si, and any other impurities when the mass of the copper alloy powder is 100%.
Further, the particle size distribution of the copper alloy powder is 15-53 μm.
The second aspect of the present invention provides a method for producing the above copper alloy powder, comprising the steps of:
heating copper;
adding intermediate alloy Cu-Ni, intermediate alloy Cu-Si and intermediate alloy Cu-Mn into the heated copper, continuously heating, and casting into a copper alloy bar;
and atomizing the alloy bar to prepare copper alloy powder.
The temperature of the heated copper is 1080 to 1400 ℃, and may be, for example, 1080 ℃, 1100 ℃, 1200 ℃, 1300 ℃, 1400 ℃, preferably 1080 to 1200 ℃.
In the invention, the melting point of copper is 1080 ℃, the heating temperature can be adjusted between 1080 ℃ and 1400 ℃, copper can not be melted below the temperature, and the excessive temperature can cause serious copper burning loss and is not beneficial to quantitative component.
Further, the temperature of the continuous heating is 1200 to 1700 ℃, for example, 1200 ℃, 1300 ℃, 1400 ℃, 1500 ℃, 1600 ℃, 1700 ℃, preferably 1400 to 1500 ℃.
In the present invention, the intermediate alloy is added to the copper liquid, and the intermediate alloy has different components and different melting points, and is preferably 1400 to 1500 ℃, more preferably 1400 ℃ depending on the melting point.
Further, the heating of the copper and the continuing heating are performed under a protective atmosphere, wherein the protective atmosphere is at least one of argon or carbon dioxide. The oxidation of copper, the master alloy Cu-Ni, the master alloy Cu-Si and the master alloy Cu-Mn in the heating process can be avoided under the protective atmosphere.
Further, the atomization process is performed under a vacuum condition, the vacuum condition adopts at least one of nitrogen or carbon dioxide as a protective atmosphere, and the temperature of the atomization process is 600-1100 ℃, for example, 600 ℃, 700 ℃, 800 ℃, 900 ℃, 1000 ℃, 1100 ℃, preferably 800-900 ℃.
In the invention, nitrogen is used as a protective gas in the atomization process. The atomization process is carried out in a vacuum atomization device, and spherical and subsphaeroidal copper alloy powder can be obtained after atomization.
Further, the intermediate alloy Cu-Ni, the intermediate alloy Cu-Si and the intermediate alloy Cu-Mn are respectively prepared by smelting and pouring copper and nickel, copper and silicon, and copper and manganese. Preferably, the mass ratio of copper to nickel is (90-75): 10-25), the mass ratio of copper to silicon is (90-80): 10-20, and the mass ratio of copper to manganese is (90-80): 10-20.
Further, the copper alloy powder provided by the method or the copper alloy powder prepared by the method of the present invention is dried in a vacuum oven and then classified into powder having a particle size distribution of 15 to 63 μm by sieving using a sieving device. And then, drying in a vacuum drying box, then placing into a powder laying cavity of the additive manufacturing printing equipment, filling inert gas to reduce the oxygen content to be below 0.1%, designing a part model to be printed, adding support and slicing to the three-dimensional model, and performing layer-by-layer melting solidification forming on the three-dimensional digital model by using optimized forming parameters through the 3D printing equipment.
Further, layer-by-layer melt solidification shaping includes, but is not limited to, a Selective Laser Melting (SLM) process; the SLM process adopts the following forming parameters: the laser power is 300-500W, the scanning speed is 600-3000mm/s, the scanning interval is 0.05-0.15mm, the thickness of a single layer is 0.03-0.06mm, and the diameter of a laser spot is 60-80 mu m.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides copper alloy powder, and a copper alloy material formed by 3D printing can improve internal microstructure, reduce internal defects of the material, and improve mechanical/physical properties, so that the copper alloy powder has high wear resistance and high corrosion resistance.
2. The preparation method of the copper alloy powder provided by the invention is simple, convenient, efficient, good in safety and easy to implement, the types of the added elements of the 3D printed copper alloy are expanded, and the problems of easy cracking and poor performance of the copper alloy material are solved, so that the deformation and cracking of metal parts in the additive manufacturing process are prevented.
Drawings
FIG. 1 is a morphology diagram of Cu-Ni-Si-Mn alloy powder for SLM additive manufacturing prepared in example 1 of the present invention.
FIG. 2 is an SEM structure diagram of Cu-Ni-Si-Mn alloy powder for SLM additive manufacturing prepared in example 1 of the invention.
FIG. 3 is a graph showing the particle size distribution of the powder of example 1.
FIG. 4 is a graph showing the particle size distribution of the powder of example 2.
FIG. 5 is a graph showing the particle size distribution of the powder of example 3.
FIG. 6 is a vertical architectural phase diagram of Cu-Ni-Si-Mn alloy powder 3D printed into a copper alloy material prepared in example 1.
FIG. 7 is a golden phase diagram of a architectural pattern of Cu-Ni-Si-Mn alloy powder 3D printed into a copper alloy material prepared in example 1.
FIG. 8 is a vertical architectural SEM image of a 3D printed copper alloy material from Cu-Ni-Si-Mn alloy powder prepared in example 1.
FIG. 9 is an SEM image of the architectural orientation of a 3D printed Cu-Ni-Si-Mn alloy powder prepared in example 1 as a copper alloy material.
Detailed Description
In order to facilitate understanding of the present invention, the technical solutions of the present invention are further described below with reference to specific embodiments, but the present invention is not limited thereto. All the technologies realized based on the above-mentioned contents of the present invention are covered in the protection scope of the present invention. Unless otherwise indicated, the starting materials and reagents used in the examples are all commercially available products. Reagents, equipment, or procedures not described herein are routinely determinable by one of ordinary skill in the art.
Example 1
A copper alloy powder (Cu-1 Ni-3Mn-3 Si) comprising, by mass: ni 1%, mn 3%, si 3%, and the balance copper.
The preparation method comprises the following steps:
s1: designing the proportion of each component of matrix copper alloy powder and weighing each raw material, wherein the weight of Cu is 6.5kg, the weight of master alloy Cu-Ni is 0.5kg, the weight of master alloy Cu-Si is 1.5kg, and the weight of master alloy Cu-Mn is 1.5kg, smelting by using a medium-frequency vacuum induction furnace under the protection of argon atmosphere, casting in a rod-shaped die after the solution is completely clarified, and cooling and forming to obtain a copper alloy rod;
s2: machining each copper alloy bar obtained by casting by using a lathe, turning to remove an outer surface oxide skin, machining an internal thread at the central position after one end of the metal bar is turned flat, machining the other end of the metal bar into a cone, putting the metal bar into a vacuum atomization device, and milling under the nitrogen atmosphere;
s3: screening the powder by using an experimental screening machine, and selecting the powder with the particle size of 15-53 mu m.
S4: the powder was observed in SEM before and after sieving, and the particle type and size of the powder were observed and measured. The particle size distribution of the powder was analyzed by a laser particle size analyzer to obtain a distribution diagram, as shown in fig. 3 to 5, in which the particle size of the prepared copper alloy powder was mainly distributed at 15 to 53 μm.
Example 2
A copper alloy powder (Cu-1 Ni-5Mn-3 Si) comprising, in mass percent: ni 1%, mn 5%, si 3%, and the balance copper. Wherein, cu is 5.5kg, the intermediate alloy Cu-Ni is 0.5kg, the intermediate alloy Cu-Si is 1.5kg, and the intermediate alloy Cu-Mn is 2.5kg.
The preparation method is the same as that of example 1.
Example 3
A copper alloy powder (Cu-1 Ni-2Mn-3 Si) is different from that of example 1 or 2 in that the Mn content in the copper alloy is 2%. Wherein, cu is 7kg, the intermediate alloy Cu-Ni is 0.5kg, the intermediate alloy Cu-Si is 1.5kg, and the intermediate alloy Cu-Mn is 1kg.
The preparation method is the same as that of example 1.
Experimental example 1
The copper alloy powders prepared in example 1 were respectively 3D-printed into copper alloy materials. The method comprises the following steps:
and (3) putting the copper alloy powder into a vacuum drying oven to be dried for 4 hours at 80 ℃. Three-dimensional models of the block samples were designed and sliced in layers. A RenAM 500E additive metal 3D printing device is adopted, a square sample is formed by parameters of a preheating temperature of 150 ℃, laser power of 300 500W, a scanning speed of 600 3000mm/s, a scanning interval of 0.05 mm to 0.15mm, a single-layer thickness of 0.03 mm to 0.06mm and a laser spot diameter of 60-80 mu m.
And carrying out metallographic and SEM observation on the internal microstructure of the printed and formed copper alloy material.
The results are shown in FIGS. 6-9. The channel formed after solidification of the molten pool scanned by the laser beam can be seen, and the rotation angle of the channel between different layers can be seen to be 67 deg.. Printing a gold phase diagram of the formed copper alloy material in the building direction to present melt channels distributed in a fish scale shape, wherein the melt channels are distributed uniformly, the good overlapping rate of a molten pool is presented, and the depth of the molten pool can penetrate through 2-3 layers, so that good metallurgical bonding is formed between the adjacent molten pool layers of the copper alloy and the adjacent layers.
Experimental example 2
The copper alloy powders prepared in example 1, example 2 and example 3 were respectively 3D-printed into copper alloy materials. The procedure was as in example 1.
Mechanical/physical property tests were performed on the print-formed copper alloy materials, and the copper alloy powders prepared in example 1, example 2 and example 3 were 3D printed to obtain copper alloy materials with brinell hardness of 79hb,88hb and 89hb.
Experimental example 3
The copper alloy powders prepared in example 1, example 2 and example 3 were respectively 3D-printed into copper alloy materials. The procedure was as in example 1.
The thermal conductivity of the printed and formed copper alloy materials is tested, and the thermal conductivity of the examples 1-3 at room temperature is respectively 17w/m.k, 19w/m.k and 22w/m.k, and the thermal conductivity at 600 ℃ is respectively 66w/m.k, 70w/m.k and 72w/m.k.
The thermal conductivity of the three examples is between 17 and 22w/m.k at room temperature and between 66 and 72w/m.k at 600 ℃, and the thermal conductivity is good for the copper-nickel alloy.
While the invention has been described with reference to specific preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A copper alloy powder, characterized by comprising, in mass percent: ni content of 0.5-15.0 wt%, si content of 2.0-5.0 wt%, mn content of 2.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
2. The copper alloy powder according to claim 1, comprising, in mass percent: ni content of 0.5-10.0 wt%, si content of 2.0-5.0 wt%, mn content of 2.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
3. The copper alloy powder according to claim 1, comprising, in mass percent: ni content of 7.0-15.0 wt%, si content of 2.0-5.0 wt%, mn content of 4.0-6.0 wt%, total content of metal elements not listed except Cu not exceeding 0.5wt%, and the balance of Cu.
4. Copper alloy powder according to claims 1-3, characterized in that the particle size distribution of the copper alloy powder is 15-53 μm.
5. A method for preparing the copper alloy powder according to claims 1 to 4, comprising the steps of:
heating copper;
adding an intermediate alloy Cu-Ni, an intermediate alloy Cu-Si and an intermediate alloy Cu-Mn into the heated copper, continuously heating, and then casting into a copper alloy bar;
and atomizing the alloy bar to prepare copper alloy powder.
6. The method according to claim 5, wherein the temperature of the heated copper is 800 to 1400 ℃.
7. The method according to claim 5 or 6, wherein the temperature of the continuous heating is 1200 to 1700 ℃.
8. The method of claim 5 or 6, wherein the heating the copper and the continuing heating are performed under a protective atmosphere, the protective atmosphere being at least one of argon or carbon dioxide.
9. The preparation method according to claim 5 or 6, wherein the atomization process is performed under a vacuum condition, the vacuum condition adopts at least one of nitrogen or carbon dioxide as a protective atmosphere, and the temperature of the atomization process is 600-1100 ℃.
10. The preparation method according to claim 4, wherein the master alloy Cu-Ni, the master alloy Cu-Si and the master alloy Cu-Mn are respectively prepared by smelting and pouring copper and nickel, copper and silicon and copper and manganese.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001026856A (en) * | 1999-07-09 | 2001-01-30 | Taiho Kogyo Co Ltd | Production of copper - aluminum composite material |
| JP2011012300A (en) * | 2009-07-01 | 2011-01-20 | Hitachi Cable Ltd | Copper alloy and method for producing copper alloy |
| CN110872658A (en) * | 2018-08-31 | 2020-03-10 | 中南大学 | High-performance copper alloy and powder preparation method thereof |
| CN114277282A (en) * | 2021-12-28 | 2022-04-05 | 内蒙古工业大学 | Copper-based composite material and preparation method thereof |
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- 2022-11-18 CN CN202211450926.1A patent/CN115927907A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001026856A (en) * | 1999-07-09 | 2001-01-30 | Taiho Kogyo Co Ltd | Production of copper - aluminum composite material |
| JP2011012300A (en) * | 2009-07-01 | 2011-01-20 | Hitachi Cable Ltd | Copper alloy and method for producing copper alloy |
| CN110872658A (en) * | 2018-08-31 | 2020-03-10 | 中南大学 | High-performance copper alloy and powder preparation method thereof |
| CN114277282A (en) * | 2021-12-28 | 2022-04-05 | 内蒙古工业大学 | Copper-based composite material and preparation method thereof |
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