CN115926757A - Self-assembly heat-conducting insulating material and preparation method thereof - Google Patents
Self-assembly heat-conducting insulating material and preparation method thereof Download PDFInfo
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- 239000011810 insulating material Substances 0.000 title claims abstract description 41
- 238000001338 self-assembly Methods 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 88
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052582 BN Inorganic materials 0.000 claims abstract description 29
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 16
- 238000005576 amination reaction Methods 0.000 claims abstract description 11
- 230000004048 modification Effects 0.000 claims abstract description 11
- 238000012986 modification Methods 0.000 claims abstract description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- 239000002245 particle Substances 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000706 filtrate Substances 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
- 230000007935 neutral effect Effects 0.000 claims description 7
- 239000002244 precipitate Substances 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000001291 vacuum drying Methods 0.000 claims description 6
- 230000000640 hydroxylating effect Effects 0.000 claims description 5
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000005805 hydroxylation reaction Methods 0.000 abstract description 6
- 230000033444 hydroxylation Effects 0.000 abstract description 5
- 230000003993 interaction Effects 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000011049 filling Methods 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 238000000967 suction filtration Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001027 hydrothermal synthesis Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
The invention relates to a self-assembly heat-conducting insulating material and a preparation method thereof, wherein aluminum nitride is subjected to hydroxylation and amination modification in sequence, and boron nitride is subjected to carboxyl modification, so that the interface compatibility between the aluminum nitride and the boron nitride is improved, the interface thermal resistance is greatly reduced, the interaction force between the aluminum nitride and the boron nitride is enhanced, a three-dimensional network structure can be formed in a self-assembly orientation mode, a heat-conducting passage is constructed, the heat conductivity coefficient of the self-assembly heat-conducting insulating material is improved, and the heat conducting performance of the self-assembly heat-conducting insulating material is enhanced.
Description
Technical Field
The invention relates to the technical field of heat conduction materials, in particular to a self-assembly heat conduction insulating material and a preparation method thereof.
Background
With the development of science and technology, the rapid development of microelectronic integration and assembly technology, the improvement of the integration level and the continuous increase of power density of electrical and electronic equipment, the rapid increase of heat generated in unit volume of the equipment, the continuous accumulation of heat and the temperature rise generated by the continuous accumulation of heat can accelerate the aging failure of the insulating dielectric medium, and the reliability and the service life of the operation of the electrical and electronic equipment are greatly reduced. Therefore, the heat dissipation problem becomes a key issue that restricts the safety and reliability of the device.
The filling type high-thermal-conductivity insulating material is widely concerned due to the advantages of low cost, simple processing, easy realization of industrial mass production and the like, and is widely applied to the fields of motor and charging pile encapsulation, transformer pouring, electric and electronic device encapsulation, high-power circuit board substrates, thermal-conductivity interface materials and the like.
Disclosure of Invention
Based on this, there is a need for a self-assembled thermal conductive insulating material and a method for preparing the same.
The technical scheme for solving the technical problems is as follows: a preparation method of a self-assembly heat-conducting insulating material comprises the following steps:
hydroxylating aluminum nitride to obtain hydroxylated aluminum nitride;
amination is carried out on the hydroxylated aluminum nitride to obtain modified aluminum nitride;
performing carboxyl modification on boron nitride to obtain modified boron nitride;
and mixing and dispersing the modified aluminum nitride and the modified boron nitride into a self-assembly solvent for self-assembly to obtain the self-assembly heat-conducting insulating material.
In one embodiment, the hydroxylating aluminum nitride includes:
and dispersing the aluminum nitride into a sodium hydroxide solution, stirring for 10-15 h under the heating condition of 90-110 ℃, filtering, washing the precipitate for multiple times until the pH value of the filtrate after washing is neutral, and drying to obtain the hydroxylated aluminum nitride.
In one embodiment, amination of the hydroxylated aluminum nitride comprises:
dispersing the hydroxylated aluminum nitride into a toluene solution, then adding KH-550, reacting for 3-9 h under the heating condition of 110-130 ℃, filtering, and carrying out vacuum drying on the precipitate for 20-28 h to obtain the modified aluminum nitride.
In one embodiment, the aluminum nitride is hexagonal aluminum nitride.
In one embodiment, the aluminum nitride has a particle size of 10 μm to 100 μm.
In one embodiment, the modified boron nitride has a carboxyl content of 3% to 5%.
In one embodiment, the boron nitride is hexagonal boron nitride.
In one embodiment, the boron nitride has a particle size of 10 μm to 100 μm.
In one embodiment, the self-assembling solvent comprises: one or more of water, dichloromethane, 1,2-dichloroethane, chloroform, methanol and ethanol.
The invention also provides a self-assembly heat-conducting insulating material which is prepared based on the preparation method of the self-assembly heat-conducting insulating material in any one of the embodiments.
The invention has the beneficial effects that: according to the preparation method of the self-assembly heat-conducting insulating material, provided by the invention, aluminum nitride is subjected to hydroxylation and amination modification in sequence, and boron nitride is subjected to carboxyl modification, so that the interface compatibility between the aluminum nitride and the boron nitride is improved, the interface thermal resistance is greatly reduced, the interaction force between the aluminum nitride and the boron nitride is enhanced, a three-dimensional network structure can be formed in a self-assembly orientation manner, a heat-conducting passage is constructed, the heat conductivity coefficient of the self-assembly heat-conducting insulating material is improved, and the heat conducting performance of the self-assembly heat-conducting insulating material is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic flow chart of a method for preparing a self-assembled thermal conductive insulating material according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, as shown in fig. 1, a method for preparing a self-assembled thermal conductive insulation material comprises the following steps:
In this embodiment, the hydroxylation of aluminum nitride includes: and dispersing the aluminum nitride into a sodium hydroxide solution, stirring for 10-15 h under the heating condition of 90-110 ℃, filtering, washing the precipitate for multiple times until the pH value of the filtrate after washing is neutral, and drying to obtain the hydroxylated aluminum nitride.
In one embodiment, when aluminum nitride is hydroxylated, 35 to 45 parts of aluminum nitride is dispersed in 5mol/L sodium hydroxide solution to form 5g/L dispersion, and is mechanically stirred for 12 hours under the heating condition of 100 ℃ oil bath to carry out hydrothermal reaction, in the hydrothermal reaction process, the surface of the aluminum nitride and the hydroxyl in the sodium hydroxide are subjected to hydroxylation reaction, so that the surface of the aluminum nitride is grafted with the hydroxyl, the interface compatibility of the aluminum nitride is improved, then filtered precipitates are washed with water, the washing with water and the filtering are repeated until the pH value of the filtrate is neutral, and finally the aluminum nitride is dried.
And 120, performing amination on the hydroxylated aluminum nitride to obtain modified aluminum nitride.
In this embodiment, the amination of the hydroxylated aluminum nitride includes: dispersing the hydroxylated aluminum nitride into a toluene solution, adding KH-550, reacting for 3-9 h under the heating condition of 110-130 ℃, filtering, and vacuum-drying the precipitate for 20-28 h to obtain the modified aluminum nitride.
In one embodiment, when the hydroxylated aluminum nitride is aminated, 35 to 45 parts of hydroxylated aluminum nitride is added into a flask, 275 to 325mL of toluene solution and 20 to 25 parts of KH-550, wherein KH-550 is 3-aminopropyltriethoxysilane which is amino-functional silane are added, reflux is carried out for 6 hours under the heating condition of 120 ℃, hydroxyl on the surface of the aluminum nitride and amino-functional group of KH-550 are subjected to amination reaction, the surface of the hydroxylated aluminum nitride can be functionalized, the interface thermal resistance of the aluminum nitride is reduced, and finally the toluene solution is filtered and dried in a vacuum oven.
In one embodiment, the aluminum nitride is hexagonal aluminum nitride.
In one embodiment, the aluminum nitride has a particle size of 10 μm to 100 μm.
And step 130, performing carboxyl modification on the boron nitride to obtain modified boron nitride.
In this embodiment, boron nitride is carboxylated, so that a carboxyl group is grafted on the surface of the boron nitride, and a carboxyl group-modified hexagonal boron nitride is obtained, wherein the molecular formula is hBN-COOH, the interfacial compatibility of the boron nitride can be improved, and the content of the carboxyl group in the modified boron nitride is 3% -5%.
In one embodiment, the boron nitride is hexagonal boron nitride.
In one embodiment, the boron nitride has a particle size of 10 μm to 100 μm.
And 140, mixing and dispersing the modified aluminum nitride and the modified boron nitride into a self-assembly solvent for self-assembly to obtain the self-assembly heat-conducting insulating material.
In the embodiment, 40 to 70 parts of modified aluminum nitride and 10 to 30 parts of modified boron nitride are added into a flask, then 500mL of self-assembly solvent is added, and the mixture is fully dispersed and mixed for 24h, because hydroxyl exists on the surface of the modified aluminum nitride and carboxyl exists on the modified boron nitride, the hydroxyl of the modified aluminum nitride and the carboxyl on the modified boron nitride are subjected to phase transition when the modified aluminum nitride and the modified boron nitride are fully dispersed and mixed, the hydroxyl of the modified aluminum nitride and the carboxyl on the modified boron nitride generate the interaction force of hydrogen bonds, the self-assembly heat-conducting insulating material with a three-dimensional structure can be formed through self-assembly, a continuous heat-conducting phase is formed among heat-conducting particles, a heat-conducting path is provided for heat conduction, and finally, the self-assembly solvent is filtered and then dried for 24 hours in vacuum.
In one embodiment, the self-assembling solvent comprises: one or more of water, dichloromethane, 1,2-dichloroethane, chloroform, methanol and ethanol.
According to the preparation method of the self-assembly heat-conducting insulating material, provided by the invention, aluminum nitride is subjected to hydroxylation and amination modification in sequence, and boron nitride is subjected to carboxyl modification, so that the interface compatibility between the aluminum nitride and the boron nitride is improved, the interface thermal resistance is greatly reduced, the interaction force between the aluminum nitride and the boron nitride is enhanced, a three-dimensional network structure can be formed in a self-assembly orientation manner, a heat-conducting passage is constructed, the heat conductivity coefficient of the self-assembly heat-conducting insulating material is improved, and the heat conducting performance of the self-assembly heat-conducting insulating material is enhanced.
The invention also provides a self-assembly heat-conducting insulating material which is prepared based on the preparation method of the self-assembly heat-conducting insulating material in any one of the embodiments. Specifically, the self-assembly heat-conducting insulating material prepared by the preparation method of the self-assembly heat-conducting insulating material has good heat conductivity coefficient and insulating property.
The invention is further described below with reference to specific examples.
Example 1
Firstly, 41.0g of hexagonal aluminum nitride with the particle size of 50 mu m is dissolved in 5mol/L sodium hydroxide solution to form 5g/L dispersion, the dispersion is mechanically stirred for 12 hours under the oil bath heating condition of 100 ℃, the obtained mixture is washed by water for 5 times until the filtrate is neutral, and the hydroxylated aluminum nitride is obtained after drying.
Then, the hydroxylated aluminum nitride obtained above was charged into a flask, 300mL of toluene and 22.1g of KH550 were added, the mixture was refluxed at 120 ℃ for 6 hours, and the toluene was filtered and vacuum-dried for 24 hours to obtain modified aluminum nitride.
And finally, adding 25.0g of modified boron nitride with the particle size of 100 microns into the obtained modified aluminum nitride, adding 500mL of ethanol, dispersing and standing for 24 hours, carrying out suction filtration on the ethanol, and carrying out vacuum drying for 24 hours to obtain the self-assembly heat-conducting insulating material.
Example 2
Firstly, 41.0g of hexagonal aluminum nitride with the particle size of 50 mu m is dissolved in 5mol/L sodium hydroxide solution to form 5g/L dispersion, the dispersion is mechanically stirred for 12 hours under the oil bath heating condition of 100 ℃, the obtained mixture is washed by water for 5 times until the filtrate is neutral, and the hydroxylated aluminum nitride is obtained after drying.
Then, the hydroxylated aluminum nitride obtained above was charged into a flask, 300mL of toluene and 22.1g of KH550 were added, the mixture was refluxed at 120 ℃ for 6 hours, and the toluene was filtered and vacuum-dried for 24 hours to obtain modified aluminum nitride.
And finally, adding 12.5g of modified boron nitride with the particle size of 100 microns into the obtained modified aluminum nitride, adding 500mL of ethanol, dispersing and standing for 24 hours, carrying out suction filtration on the ethanol, and carrying out vacuum drying for 24 hours to obtain the self-assembly heat-conducting insulating material.
Example 3
Firstly, 41.0g of hexagonal aluminum nitride with the particle size of 100 mu m is dissolved in 5mol/L sodium hydroxide solution to form 5g/L dispersion, the dispersion is mechanically stirred for 12 hours under the condition of oil bath heating at 100 ℃, the obtained mixture is washed by water for 5 times until the filtrate is neutral, and the hydroxylated aluminum nitride is obtained after drying.
Then, the hydroxylated aluminum nitride obtained above was charged into a flask, 300mL of toluene and 22.1g of KH550 were added, the mixture was refluxed at 120 ℃ for 6 hours, and the toluene was filtered and vacuum-dried for 24 hours to obtain modified aluminum nitride.
And finally, adding 25.0g of modified boron nitride with the particle size of 50 microns into the obtained modified aluminum nitride, adding 500mL of ethanol, dispersing and standing for 24 hours, carrying out suction filtration on the ethanol, and carrying out vacuum drying for 24 hours to obtain the self-assembly heat-conducting insulating material.
Testing the heat conducting property and the insulating property: the heat conductivity is represented by a heat conductivity coefficient, the insulation performance is represented by a volume resistivity, the self-assembled heat-conducting and insulation materials prepared in the embodiments 1-3 are added into epoxy resin E44 according to the mass ratio of 10%, 20% and 30%, the heat conductivity coefficient is measured according to the standard of ASTMD5470-2017 after curing, and the volume resistivity is measured according to the standard of ASTMD 257-2014.
Comparative example 1
The thermal conductivity of an equivalent mass of epoxy resin E44 as a carrier was tested in accordance with the ASTM D5470-2017 standard and the volume resistivity was tested in accordance with the ASTM D257-2014 standard.
Comparative example 2
Adding aluminum nitride with the particle size of 50 mu m into the epoxy resin E44 according to the mass ratio of 10 percent, 20 percent and 30 percent, and after curing, measuring the thermal conductivity according to the standard of ASTM D5470-2017 and measuring the volume resistivity according to the standard of ASTM D257-2014.
Comparative example 3
Adding aluminum nitride with the particle size of 100 mu m into the epoxy resin E44 according to the mass ratio of 10 percent, 20 percent and 30 percent, and measuring the thermal conductivity coefficient according to the standard of ASTM D5470-2017 after curing.
Comparative example 4
Adding boron nitride with the particle size of 50 mu m into the epoxy resin E44 according to the mass ratio of 10 percent, 20 percent and 30 percent, and after curing, measuring the thermal conductivity according to the standard of ASTM D5470-2017 and measuring the volume resistivity according to the standard of ASTM D257-2014.
Comparative example 5
Adding boron nitride with the particle size of 100 mu m into the epoxy resin E44 according to the mass ratio of 10 percent, 20 percent and 30 percent, and after curing, measuring the thermal conductivity according to the standard of ASTM D5470-2017 and measuring the volume resistivity according to the standard of ASTM D257-2014.
Comparative example 6
41.0g of aluminum nitride with the grain diameter of 100 mu m and 25.0g of boron nitride with the grain diameter of 50 mu m are mixed and added into the epoxy resin E44 according to the mass ratio of 10 percent, 20 percent and 30 percent, and after curing, the thermal conductivity coefficient is measured according to the standard of ASTM D5470-2017 and the volume resistivity is measured according to the standard of ASTM D257-2014.
Statistically, the results of the test of the thermal conductivity of examples 1 to 3 and comparative examples 1 to 6 are shown in Table 1.
TABLE 1 statistical results of the thermal conductivity test (unit: W/(m.K))
As shown in table 1, the thermal conductivity of examples 1 to 3 and comparative examples 1 to 6 increases with the increase of the filling ratio of the thermal conductive filler, the thermal conductivity of aluminum nitride increases with the increase of the particle size within a certain range of the filling ratio of the thermal conductive filler, the thermal conductivity of aluminum nitride decreases with the increase of the particle size, the thermal conductivity of examples 1 to 3 is greater than that of comparative example 6, and the self-assembled thermal conductive insulating materials of examples 1 to 3 have better thermal conductivity and better thermal conductivity. Among them, the test result of example 3 is the best, that is, the thermal conductivity of the self-assembled thermal conductive and insulating material is the best by selecting aluminum nitride with larger particle size for hydroxylation and amination and selecting boron nitride with smaller particle size for carboxyl modification.
Statistically, the results of the insulation performance tests of examples 1 to 3 and comparative examples 1 to 6 are shown in Table 2.
TABLE 2 statistical results of volume resistivity test (unit: Ω. Cm)
As shown in Table 2, the volume resistivity of the self-assembled thermal conductive insulating materials of examples 1-3 and comparative examples 1-6 has good insulating property at a larger filling ratio of the thermal conductive filler, that is, the components of the self-assembled thermal conductive insulating materials of examples 1-3 have larger volume resistivity after being modified and recombined, and have better insulating property.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above embodiments only express a few embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A preparation method of a self-assembly heat-conducting insulating material is characterized by comprising the following steps:
hydroxylating aluminum nitride to obtain hydroxylated aluminum nitride;
amination is carried out on the hydroxylated aluminum nitride to obtain modified aluminum nitride;
performing carboxyl modification on boron nitride to obtain modified boron nitride;
and mixing and dispersing the modified aluminum nitride and the modified boron nitride into a self-assembly solvent for self-assembly to obtain the self-assembly heat-conducting insulating material.
2. The method for preparing the self-assembled heat-conducting insulating material according to claim 1, wherein the hydroxylating aluminum nitride comprises:
and dispersing the aluminum nitride into a sodium hydroxide solution, stirring for 10-15 h under the heating condition of 90-110 ℃, filtering, washing the precipitate for multiple times until the pH value of the filtrate after washing is neutral, and drying to obtain the hydroxylated aluminum nitride.
3. The method for preparing the self-assembled heat-conducting insulating material as claimed in claim 2, wherein the amination of the hydroxylated aluminum nitride comprises:
dispersing the hydroxylated aluminum nitride into a toluene solution, adding KH-550, reacting for 3-9 h under the heating condition of 110-130 ℃, filtering, and vacuum-drying the precipitate for 20-28 h to obtain the modified aluminum nitride.
4. The method according to claim 3, wherein the aluminum nitride is hexagonal aluminum nitride.
5. The method according to claim 4, wherein the aluminum nitride has a particle size of 10 μm to 100 μm.
6. The preparation method of the self-assembled heat-conducting insulating material as claimed in claim 1, wherein the carboxyl content in the modified boron nitride is 3% -5%.
7. The method according to claim 6, wherein the boron nitride is hexagonal boron nitride.
8. The method for preparing a self-assembled heat-conducting insulating material according to claim 7, wherein the particle size of the boron nitride is 10 μm to 100 μm.
9. The method for preparing the self-assembled heat-conducting insulating material according to claim 1, wherein the self-assembling solvent comprises: one or more of water, dichloromethane, 1,2-dichloroethane, chloroform, methanol and ethanol.
10. A self-assembled heat-conducting insulating material, which is prepared by the preparation method of the self-assembled heat-conducting insulating material according to any one of claims 1 to 9.
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