CN115926741A - Organic silicon adhesive for full lamination of display of plastic cover plate and preparation method thereof - Google Patents
Organic silicon adhesive for full lamination of display of plastic cover plate and preparation method thereof Download PDFInfo
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- CN115926741A CN115926741A CN202310056297.2A CN202310056297A CN115926741A CN 115926741 A CN115926741 A CN 115926741A CN 202310056297 A CN202310056297 A CN 202310056297A CN 115926741 A CN115926741 A CN 115926741A
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Abstract
The invention belongs to the technical field of electronic display bonding, and particularly relates to an organic silicon adhesive for full bonding of a display of a plastic cover plate and a preparation method thereof. The organic silicon adhesive provided by the invention comprises the following components in parts by weight: 30-50 parts of 200-5000cps vinyl-terminated polysiloxane; 4-12 parts of amine compounds; 20-40 parts of epoxy resin compounds; 30-44 parts of phenyl hydrogen-containing polysiloxane; 2-4 parts of a plasticizer; 0.003 to 0.007 part of platinum catalyst; 4-5 parts of a curing agent; 0.01 to 0.1 portion of tackifier. The organic silicon adhesive for liquid crystal display bonding provided by the invention can bond PET, PC, PMMA and other plastics, and can still maintain good bonding performance after ultraviolet aging and high and low temperature impact tests.
Description
Technical Field
The invention belongs to the technical field of electronic display bonding, and particularly relates to an organic silicon adhesive for full bonding of a display of a plastic cover plate and a preparation method thereof.
Background
At present, thermosetting full-lamination materials in the market only have good adhesion performance to glass substrates, but have poor adhesion to plastic substrates such as organic glass and the like. However, many high-quality civilian products need to adopt organic glass as a protective cover plate, which greatly limits the application range of the full-lamination technology.
In order to improve the adhesion between the full-laminated material and the plastic substrate, it is generally necessary to prime the substrate in advance or add a tackifier. The primer has the main functions of increasing the adhesion between the organosilicon adhesive and the plastic base material, strengthening the surface of the fragile base material and shielding vulcanization blocking components in the base material. Although the method can enable the organic silicon adhesive to obtain better adhesive property, the production procedures and the production time are increased, and the production efficiency is reduced. Meanwhile, most of the primer is flammable solvent, which is easy to cause transportation danger and environmental pollution.
Disclosure of Invention
The invention aims to provide the organic silicon adhesive for the full bonding of the display of the plastic cover plate, which has the advantages of good bonding performance on various base materials, simple process and high production efficiency, and the preparation method thereof aiming at the defects of the prior art.
The organic silicon adhesive for the adhesion of the plastic cover plate liquid crystal display comprises the following components in parts by weight:
30-50 parts of 200-5000cps vinyl-terminated polysiloxane;
4-12 parts of an amine compound;
20-40 parts of epoxy resin compounds;
30-44 parts of phenyl hydrogen-containing polysiloxane;
2-4 parts of a plasticizer;
0.003 to 0.007 parts of platinum catalyst;
4-5 parts of a curing agent;
0.01 to 0.1 portion of tackifier.
Preferably, the vinyl-terminated polysiloxane is a vinyl-terminated methyl polysiloxane or a vinyl-terminated polymethylsiloxane.
Preferably, the adhesion promoter is a siloxane oligomer containing silylhydride and beta-diketo groups, and the structural formula is as follows:
preferably, the amine compound is one or more of modified fatty amine, polyether amine or modified long-chain heterocyclic amine. The epoxy resin compound and the organosilicon adhesive can well perform addition reaction with the epoxy resin compound, so that the defect of poor heat resistance of the epoxy resin compound is effectively overcome, the original good adhesive property of the cured organosilicon adhesive is kept, and meanwhile, the high temperature resistance of the organosilicon adhesive is greatly improved.
Preferably, the epoxy resin compound is selected from glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, linear aliphatic epoxy resin or alicyclic epoxy resin. Wherein, the glycidyl ether epoxy resin and the glycidyl ester epoxy resin have the following characteristics: the viscosity is low, and the application manufacturability is good; the reaction activity is high; the adhesive force is higher than that of the general epoxy resin, and the mechanical property of a condensate is good; the electrical insulation property is good; the weather resistance is good, the ultra-low temperature resistance is good, and the bonding strength is still higher than that of other types of epoxy resin under the ultra-low temperature condition. The glycidyl amine epoxy resin has excellent adhesion and heat resistance. The alicyclic epoxy resin has the characteristics of higher compression and tensile strength, good mechanical property under the high-temperature condition for a long time, and better arc resistance, ultraviolet light aging resistance and weather resistance.
Preferably, the phenyl hydrogen polysiloxane comprises one or more phenyl hydrogen polysiloxane with hydrogen content of 0.01-0.5%.
Preferably, the plasticizer is one or more of dioctyl phthalate, diisodecyl phthalate, dibutyl phthalate, dioctyl azelate, dioctyl sebacate, epoxidized soybean oil, tricresyl phosphate, triphenyl phosphate or trioctyl phosphate.
Preferably, the platinum catalyst is one of a chloro-platanic tetramethyl divinyl disilane complex, a chloro-platanic diphenyl divinyl tetrachlorodisilane complex and a chloro-platanic tetraethyl divinyl disilane complex.
Preferably, the curing agent is one or more than two of m-phenylenediamine, triethanolamine, spiro amine and N- (3-methyl) -N, N-dimethyl urea.
The invention also provides a preparation method of the organic silicon adhesive for full lamination of the display of the plastic cover plate, which comprises the following specific steps:
weighing the following components in parts by weight: 30-50 parts of 200-5000cps vinyl-terminated polysiloxane, 4-12 parts of amine compound, 20-40 parts of epoxy resin compound, 30-44 parts of phenyl hydrogen-containing polysiloxane, 2-4 parts of plasticizer and 0.003-0.007 part of platinum catalyst, and adding 4-5 parts of curing agent and 0.01-0.1 part of tackifier after uniformly stirring and mixing; heating to 40-60 ℃, and continuously stirring for 20-30 minutes; then cooling to room temperature to obtain colorless transparent liquid, and removing bubbles under reduced pressure; and heating the mixture for curing at the temperature of between 40 and 80 ℃ for 20 to 40 minutes to obtain the organic silicon adhesive for bonding the liquid crystal display.
Compared with the prior art, the organic silicon adhesive provided by the invention has the advantages that the epoxy resin compound in the formula contains polar groups such as hydroxyl and epoxy groups, so that a larger adsorption force is generated between molecules of the epoxy resin compound and the surfaces of adjacent objects, and the adhesive of the epoxy resin compound has high strength; in addition, the tackifier is added, and in the vulcanization process, the bonding groups can interact with active groups on the surface of the base material, so that the organosilicon adhesive has good bonding performance. The adhesive can be used for bonding plastics such as PET, PC, PMMA and the like, and can still keep good bonding performance after ultraviolet aging and high and low temperature impact tests. The preparation method is simple to operate, easy to control and wide in development prospect.
Detailed Description
The silicone adhesive for full-lamination of a display of a plastic cover plate according to the present invention is further illustrated by the following examples (in each of the following examples, each raw material is 1 g by mass).
Example 1
Weighing 38 parts of 500cps vinyl-terminated methyl polysiloxane, 6 parts of amine compound polyether amine, 25 parts of epoxy resin compound alkene bisphenol F type epoxy resin, 32 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.02%, 3 parts of plasticizer dioctyl phthalate, 0.004 part of platinum catalyst diphenyl divinyl tetrachloro disilane complex, stirring, adding 4.6 parts of curing agent m-phenylenediamine and 0.01 part of tackifier siloxane oligomer containing hydrosil and beta-diketone. Heating to 40 ℃, continuing stirring for 20 minutes, cooling to room temperature to obtain colorless transparent liquid, decompressing to remove bubbles, heating, curing and heating at 50 ℃ for 30 minutes to obtain the organic silicon adhesive.
Example 2
Weighing 42 parts of 800cps end vinyl methyl polysiloxane, 9 parts of amine compound modified fatty amine, 35 parts of epoxy resin compound phenol type epoxy resin, 35 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.08%, 2 parts of plasticizer diisodecyl phthalate and 0.005 part of platinum catalyst chloro-platinic acid tetraethyl divinyl disilane complex, stirring, adding 4.5 parts of curing agent m-phenylenediamine and 0.03 part of tackifier siloxane oligomer containing silicon hydrogen group and beta-diketone group. Heating to 45 ℃, continuing stirring for 25 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating for curing at 60 ℃ and heating for 30 minutes to obtain the organic silicon adhesive.
Example 3
Weighing 40 parts of 5000cps end vinyl methyl polysiloxane, 12 parts of amine compound modified long-chain heterocyclic amine, 29 parts of epoxy resin compound tetraphenolethane type epoxy resin, 42 parts of phenyl hydrogen polysiloxane with the hydrogen content of 0.35%, 4 parts of plasticizer dioctyl azelate and 0.005 part of platinum catalyst chloroplatinic acid diphenyl divinyl tetrachloro disilane complex, stirring, adding 4.2 parts of curing agent m-phenylenediamine and 0.08 part of tackifier siloxane oligomer containing hydrosil and beta-diketone. Heating to 50 ℃, continuing stirring for 30 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating for curing at 70 ℃ and heating for 30 minutes to obtain the organic silicon adhesive.
Example 4
Weighing 47 parts of 4000cps terminal vinyl methyl polysiloxane, 12 parts of amine compound polyether amine, 40 parts of epoxy resin compound epoxidized polybutadiene resin, 42 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.5%, 3 parts of plasticizer tricresyl phosphate, 0.006 part of platinum catalyst chloroplatinic acid tetramethyl divinyl disilane complex, stirring, adding 4.8 parts of curing agent m-phenylenediamine and 0.06 part of tackifier siloxane oligomer with hydrosilicon group and beta-diketone group. Heating to 50 ℃, continuing stirring for 20 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating at 60 ℃ for curing and heating for 30 minutes to obtain the organic silicon adhesive.
Example 5
Weighing 45 parts of 2000cps end vinyl methyl polysiloxane, 8 parts of amine compound polyether amine, 25 parts of epoxy resin compound bisphenol A type epoxy resin, 32 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.25%, 4 parts of plasticizer triphenyl phosphate and 0.004 part of platinum catalyst triethylene tetramine, stirring, adding 4.1 parts of curing agent m-phenylenediamine and 0.01 part of tackifier siloxane oligomer with hydrosilicyl and beta-diketone groups. Heating to 60 ℃, continuing stirring for 30 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating for curing at 50 ℃ and heating for 30 minutes to obtain the organic silicon adhesive.
Comparative example 1 (without tackifier)
Weighing 38 parts of 500cps end vinyl methyl polysiloxane, 6 parts of amine compound polyether amine, 25 parts of epoxy resin compound alkene bisphenol F type epoxy resin, 32 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.02%, 3 parts of plasticizer dioctyl phthalate and 0.004 part of platinum catalyst diphenyl divinyl tetrachloro disilane complex, and adding 4.6 parts of curing agent m-phenylenediamine after stirring. Heating to 40 ℃, continuing stirring for 20 minutes, cooling to room temperature to obtain colorless transparent liquid, decompressing to remove bubbles, heating, curing and heating at 50 ℃ for 30 minutes to obtain the organic silicon adhesive.
Comparative example 2 (0.2 part of tackifier)
Weighing 42 parts of 800cps end vinyl methyl polysiloxane, 9 parts of amine compound modified fatty amine, 35 parts of epoxy resin compound phenyl diphenol epoxy resin, 35 parts of phenyl hydrogenpolysiloxane with the hydrogen content of 0.08%, 2 parts of plasticizer phthalic acid diisodecyl ester and 0.005 part of platinum catalyst chloro-platinic acid tetraethyl divinyl disilane complex, stirring, adding 4.5 parts of curing agent m-phenylenediamine and 0.2 part of tackifier siloxane oligomer containing silylhydride and beta-diketone. Heating to 45 ℃, continuing stirring for 25 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating at 60 ℃ for curing and heating for 30 minutes to obtain the organic silicon adhesive.
Comparative example 3 (0.005 part of tackifier)
Weighing 40 parts of 5000cps end vinyl methyl polysiloxane, 12 parts of amine compound modified long-chain heterocyclic amine, 29 parts of epoxy resin compound tetraphenylethane type epoxy resin, 42 parts of phenyl hydrogen-containing polysiloxane with the hydrogen content of 0.35%, 4 parts of plasticizer dioctyl azelate and 0.005 part of platinum catalyst diphenyl divinyl tetrachloro disilane complex, stirring, adding 4.2 parts of curing agent m-phenylenediamine and 0.005 part of tackifier siloxane oligomer containing hydrosil and beta-diketone. Heating to 50 ℃, continuing stirring for 30 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating at 70 ℃ for curing and heating for 30 minutes to obtain the organic silicon adhesive.
Comparative example 4 (addition of tackifier KH 570)
Weighing 40 parts of 5000cps end vinyl methyl polysiloxane, 12 parts of amine compound modified long-chain heterocyclic amine, 29 parts of epoxy resin compound tetraphenylethane epoxy resin, 42 parts of phenyl hydrogen polysiloxane with the hydrogen content of 0.35%, 4 parts of plasticizer dioctyl azelate and 0.005 part of platinum catalyst chloroplatinic acid diphenyl divinyl tetrachloro disilane complex, stirring, and adding 4.2 parts of curing agent m-phenylenediamine and 570.005 parts of tackifier KH. Heating to 50 ℃, continuing stirring for 30 minutes, cooling to room temperature to obtain colorless transparent liquid, removing bubbles under reduced pressure, heating at 70 ℃ for curing and heating for 30 minutes to obtain the organic silicon adhesive.
The test results of example 1, example 2, example 3, example 4, example 5, comparative example 1, comparative example 2, comparative example 3 and comparative example 4 were as shown in Table 2, and were measured according to the criteria of Table 1.
TABLE 1 test contents
| Item | Test method |
| Appearance of the product | Visualization of |
| Shear force | GB/T 7124-2008 |
。
TABLE 2 test results
As can be seen from the comparative test examples of the above properties: in comparative example 1, the shear force values of the adhesive, whether to PET, PC or PMMA, were very low when no tackifier was added, indicating that the silicone adhesive had very low visco-dynamic forces to PET, PC and PMMA. In examples 1 to 6, the shear force was greatly increased by adding the tackifier. An excessive increase in tackifier may lead to clouding due to poor compatibility. In comparative example 2, a high content of tackifier, although also achieving an increase in adhesion to the plastic substrate, is not so good in transparency that the tackifying performance is improved but transparency is lost; when KH570 is used as the tackifier, the adhesiveness of the adhesive to PET, PC and PMMA is not affected, and the transparency is reduced after the adhesive is added. In the embodiment, the tackifier is added, so that the tackifier and the PET, PC and PMMA can be tackified mainly because Si-H in the structure can participate in the hydrosilylation reaction, and meanwhile, carbonyl groups in molecules can be compatible with the main molecular structures of the PET, PC and PMMA, so that the organosilicon adhesive and the PET, PC and PMMA are bonded.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.
Claims (10)
1. The organic silicon adhesive for attaching the plastic cover plate display is characterized by comprising the following specific components in parts by weight:
30-50 parts of 200-5000cps vinyl-terminated polysiloxane;
4-12 parts of amine compounds;
20-40 parts of epoxy resin compounds;
30-44 parts of phenyl hydrogen-containing polysiloxane;
2-4 parts of a plasticizer;
0.003 to 0.007 part of platinum catalyst;
4-5 parts of a curing agent;
0.01 to 0.1 portion of tackifier.
2. The silicone adhesive of claim 1, wherein the adhesion promoter is a silylhydride-and β -diketonate-containing siloxane oligomer having the following structural formula:
3. the silicone adhesive of claim 1, wherein the vinyl-terminated polysiloxane is vinyl-terminated methyl polysiloxane or vinyl-terminated polymethylsiloxane.
4. The silicone adhesive according to claim 1, wherein the amine compound is one or more of modified aliphatic amine, polyether amine or modified long-chain heterocyclic amine.
5. The silicone adhesive of claim 1, wherein the epoxy resin compound is selected from the group consisting of glycidyl ether epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, linear aliphatic epoxy resins, and alicyclic epoxy resins.
6. The silicone adhesive according to claim 1, wherein the phenyl hydrogen polysiloxane comprises one or more phenyl hydrogen polysiloxanes with hydrogen content of 0.01-0.5%.
7. The silicone adhesive of claim 1, wherein the plasticizer is one or more of dioctyl phthalate, diisodecyl phthalate, dibutyl phthalate, dioctyl azelate, dioctyl sebacate, epoxidized soybean oil, tricresyl phosphate, triphenyl phosphate, or trioctyl phosphate.
8. The silicone adhesive of claim 1, wherein the platinum catalyst is one of a chloroplatinic acid tetramethyl divinyl disilane complex, a chloroplatinic acid diphenyl divinyl tetrachlorodisilane complex, and a chloroplatinic acid tetraethyl divinyl disilane complex.
9. The silicone adhesive according to claim 1, wherein the curing agent is one or more than two of m-phenylenediamine, triethanolamine, spirocyclic amine, and N- (3-methyl) -N, N-dimethylurea.
10. A method for preparing the silicone adhesive according to any one of claims 1 to 9, comprising the following steps:
weighing the following components in parts by weight: 30-50 parts of 200-5000cps vinyl-terminated polysiloxane, 4-12 parts of amine compound, 20-40 parts of epoxy resin compound, 30-44 parts of phenyl hydrogen-containing polysiloxane, 2-4 parts of plasticizer and 0.003-0.007 part of platinum catalyst, and stirring and mixing uniformly; adding 4-5 parts of curing agent and 0.01-0.1 part of tackifier; heating to 40-60 ℃, and continuously stirring for 20-30 minutes; then cooling to room temperature to obtain colorless transparent liquid, and removing bubbles under reduced pressure; and heating the mixture for curing at the temperature of between 40 and 80 ℃ for 20 to 40 minutes to obtain the organic silicon adhesive for bonding the liquid crystal display.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116769438A (en) * | 2023-07-31 | 2023-09-19 | 苏州添易朗科技有限公司 | Preparation method and application of organic silicon glue |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116769438A (en) * | 2023-07-31 | 2023-09-19 | 苏州添易朗科技有限公司 | Preparation method and application of organic silicon glue |
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